U.S. patent application number 12/124594 was filed with the patent office on 2008-09-11 for polishing pad having surface texture.
This patent application is currently assigned to SANG FANG CHEMICAL INDUSTRY CO., LTD.. Invention is credited to Chen-Hsiang CHAO, Chung-Chih FENG, Kun-Cheng SUNG, I-Peng YAO.
Application Number | 20080220702 12/124594 |
Document ID | / |
Family ID | 39742118 |
Filed Date | 2008-09-11 |
United States Patent
Application |
20080220702 |
Kind Code |
A1 |
FENG; Chung-Chih ; et
al. |
September 11, 2008 |
POLISHING PAD HAVING SURFACE TEXTURE
Abstract
The present invention relates to a polishing pad having a
surface texture. The surface texture is disposed on the polishing
surface of the polishing pad. The surface texture comprises at
least one first groove, at least one second groove, and a plurality
of holes. The second groove extends from a central portion of the
polishing pad to the edge of the polishing pad, and the first
groove(s) is intersected with the second groove(s) to form a
plurality of intersection points. The holes are disposed at the
intersection points, and the depth of the holes is larger than that
of the first groove. Thus, the second groove(s) enables impurities
suspended in the polishing slurry to be quickly removed from the
polishing pad, and the holes can store the polishing slurry to
delay the polishing particles in the polishing slurry from
departing from the polishing pad.
Inventors: |
FENG; Chung-Chih;
(Kaohsiung, TW) ; YAO; I-Peng; (Kaohsiung, TW)
; CHAO; Chen-Hsiang; (Kaohsiung, TW) ; SUNG;
Kun-Cheng; (Kaohsiung, TW) |
Correspondence
Address: |
VOLENTINE & WHITT PLLC
ONE FREEDOM SQUARE, 11951 FREEDOM DRIVE SUITE 1260
RESTON
VA
20190
US
|
Assignee: |
SANG FANG CHEMICAL INDUSTRY CO.,
LTD.
Kaohsiung
TW
|
Family ID: |
39742118 |
Appl. No.: |
12/124594 |
Filed: |
May 21, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11478605 |
Jul 3, 2006 |
|
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12124594 |
|
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Current U.S.
Class: |
451/527 |
Current CPC
Class: |
B24B 37/26 20130101 |
Class at
Publication: |
451/527 |
International
Class: |
B24D 11/00 20060101
B24D011/00 |
Claims
1. A polishing pad having a surface texture, comprising: a surface
texture, comprising: at least one first groove; at least one second
groove extending from a central portion of the polishing pad to an
edge of the polishing pad, wherein the first groove(s) is
intersected with the second groove(s) to form a plurality of
intersection points; and a plurality of holes disposed at the
intersection points, wherein the holes are blind holes, the depth
of the holes is larger than that of the first groove, the diameter
of the hole is larger than the width of the first groove and the
second groove, and the first groove, the second groove and the
holes are on the same surface.
2. The polishing pad as claimed in claim 1, wherein the first
groove comprises a plurality of circular grooves with different
radii from the top view and the circular grooves are concentric
grooves.
3. The polishing pad as claimed in claim 1, wherein the first
groove comprises a plurality of rectangular grooves with different
side lengths and the rectangular grooves are concentric
grooves.
4. The polishing pad as claimed in claim 1, wherein the first
groove is a spiral groove from the top view.
5. The polishing pad as claimed in claim 1, wherein the second
groove comprises a plurality of radial grooves from the top
view.
6. The polishing pad as claimed in claim 5, wherein each of the
second grooves is a linear groove.
7. The polishing pad as claimed in claim 5, wherein each of the
second grooves is an arced groove.
8. A polishing pad having a surface texture, comprising: a surface
texture, comprising: a plurality of circular grooves with different
radii, the circular grooves being concentric grooves; a plurality
of radial grooves, extending from a central portion of the
polishing pad to an edge of the polishing pad, wherein the circular
grooves are intersected with the radial grooves to form a plurality
of intersection points; and a plurality of the first holes,
disposed at the intersection points, wherein the first holes are
blind holes, the depth of the first holes is larger than that of
the circular grooves, the diameter of the first hole is larger than
the width of the circular grooves and the radial grooves, and the
circular grooves, the radial grooves and the first holes are on the
same surface.
9. The polishing pad as claimed in claim 8, wherein each of the
radial grooves is a linear groove.
10. The polishing pad as claimed in claim 8, wherein each of the
radial grooves is an arced groove.
11. The polishing pad as claimed in claim 8, further comprising a
plurality of the second holes disposed on the circular grooves.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a polishing pad having a
surface texture, and more particularly, to a polishing pad with
holes to store polishing slurry.
[0003] 2. Description of the Related Art
[0004] Polishing generally refers to a wear control for a
preliminary coarse surface in the process of chemical mechanical
polishing (CMP), which makes the slurry containing fine particles
evenly dispersed on the upper surface of a polishing pad, and at
the same time places a polishing workpiece against the polishing
pad and then rubs the workpiece repeatedly with a regular motion.
The polishing workpiece may be objects such as a semiconductor, a
storage medium substrate, an integrated circuit, an LCD flat-panel
glass, an optical glass and a photoelectric panel. In order to
maintain the distribution and flow of the polishing slurry and the
planarization and polishing efficiency after the chemical
mechanical polishing, the upper surface of the polishing pad is
usually cut with a plurality of grooves or formed with a surface
texture. Therefore, the polishing effect of the polishing pad on
the workpiece to be polished is easily affected by the grooves and
the surface texture.
[0005] Referring to FIG. 1, a top view of a polishing pad having a
surface texture disclosed in the ROC (Taiwan) Patent Publication
No. 504,429 is shown. The surface texture of the polishing pad 1
comprises a plurality of concentric circular grooves 11, wherein
the depth and the width of the circular grooves 11 are designed in
accordance with the requirement. However, the polishing pad 1 has
the disadvantage that the impurities produced during the polishing
process cannot be quickly removed from the polishing pad 1, thus
negatively affecting the polishing precision and the service life
of the polishing pad 1.
[0006] Referring to FIG. 2, a top view of a polishing pad having a
surface texture disclosed in the ROC (Taiwan) Patent Publication
No. 562,716 is shown. The surface texture of the polishing pad 2
comprises a plurality of radial grooves 21, wherein the radial
grooves 21 are connected to the center 22 of the polishing pad 2
and the edge 23 of the polishing pad 2. The advantage of the
polishing pad 2 is that the impurities produced during the
polishing process can be quickly removed from the polishing pad 2.
However, the polishing pad 2 has the disadvantage that the
polishing particles in the polishing slurry are also quickly
removed from the polishing pad 2, thus negatively affecting the
polishing precision and the service life of the polishing pad
2.
[0007] Consequently, there is an existing need for a polishing pad
having a surface texture to solve the above-mentioned problems.
SUMMARY OF THE INVENTION
[0008] The objective of the present invention is to provide a
polishing pad having a surface texture. The polishing pad comprises
a surface texture disposed on a polishing surface of the polishing
pad. The surface texture comprises at least one first groove, at
least one second groove, and a plurality of holes. The second
groove is connected to the edge of the polishing pad, and the first
groove(s) is intersected with the second groove(s) to form a
plurality of intersection points. The holes are disposed at the
intersection points, and the depth of the holes is larger than that
of the first groove.
[0009] Thus, the second groove(s) enables the impurities suspended
in the polishing slurry to be quickly removed, and the holes then
store the polishing slurry to delay the polishing particles in the
polishing slurry from departing from the polishing pad.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a top view of a polishing pad having a surface
texture disclosed in the ROC (Taiwan) Patent Publication No.
504,429;
[0011] FIG. 2 is a top view of a polishing pad having a surface
texture disclosed in the ROC (Taiwan) Patent Publication No.
562,716;
[0012] FIG. 3 is a top view of the polishing pad according to the
first embodiment of the present invention;
[0013] FIG. 4 is a top view of the polishing pad according to the
second embodiment of the present invention;
[0014] FIG. 5 is a top view of the polishing pad according to the
third embodiment of the present invention;
[0015] FIG. 6 is a top view of the polishing pad according to the
fourth embodiment of the present invention;
[0016] FIG. 7 is a top view of the polishing pad according to the
fifth embodiment of the present invention; and
[0017] FIG. 8 is a top view of the polishing pad according to the
sixth embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0018] The present invention provides a polishing pad having a
surface texture. The polishing pad is suitable for polishing an
object to be polished in the chemical mechanical polishing (CMP)
process. The object to be polished comprises, but is not limited
to, objects such as semiconductors, storage medium substrates,
integrated circuits, LCD flat glass, optical glass, and
photoelectric panels.
[0019] According to the present invention, the polishing pad
comprises a surface texture disposed on a polishing surface of the
polishing pad. The surface texture comprises at least one first
groove, at least one second groove, and a plurality of holes. That
is, the first groove, the second groove and the holes are on the
same surface (polishing surface). In a preferred embodiment, the
first grooves are a plurality of circular grooves with different
radii from the top view and the circular grooves are concentric
grooves. However, the first grooves can also be a plurality of
rectangular grooves with different side lengths and the rectangular
grooves are concentric grooves. Alternatively, the first groove(s)
may be a spiral groove, or grooves of other shapes.
[0020] The second groove(s) extends from a central portion of the
polishing pad to an edge of the polishing pad, and the first
groove(s) is intersected with the second groove(s) to form a
plurality of intersection points. Preferably, the second groove(s)
is a plurality of radial grooves from the top view, each of which
is a linear or arced groove. The holes are disposed at the
intersection points. The holes are blind holes. The diameter of the
hole is larger than the width of the first groove(s) and the second
groove(s). The depth of the holes is larger than that of the first
groove(s) and the second groove(s). Thus, the second groove enables
the impurities suspended in the polishing slurry to be quickly
removed, and the holes then store the polishing slurry to delay the
polishing particles in the polishing slurry from departing from the
polishing pad.
[0021] The present invention will be described in detail with the
following examples, but it does not mean that the present invention
is limited to the content disclosed by the examples.
EXAMPLE 1
[0022] Referring to FIG. 3, a top view of the polishing pad
according to the first embodiment of the present invention is
shown. The surface texture of the polishing pad 3 of the present
embodiment comprises a plurality of the first grooves 31, a
plurality of the second grooves 32, and a plurality of holes 33.
The first grooves 31 are a plurality of concentric circular
grooves, the first grooves are a plurality of circular grooves with
different radii from the top view. The second grooves 32 are a
plurality of radial grooves, and each of the second grooves 32 is a
linear groove extending from a central portion of the polishing pad
3 to the edge 34 of the polishing pad 3. The first grooves 31 are
intersected with the second grooves 32 to form a plurality of
intersection points. The holes 33 are disposed at the intersection
points, and the depth of the holes 33 is larger than that of the
first grooves 31 and the second grooves 32. The diameter of the
hole 33 is larger than the width of the first grooves 31 and the
second grooves 32.
EXAMPLE 2
[0023] Referring to FIG. 4, a top view of the polishing pad
according to the second embodiment of the present invention is
shown. The surface texture of the polishing pad 4 of the present
embodiment comprises a plurality of the first grooves 41, a
plurality of the second grooves 42, and a plurality of holes 43.
The first grooves 41 are a plurality of concentric circular
grooves. The second grooves 42 are a plurality of radial grooves,
and each of the second grooves 42 is a linear groove extending from
a central portion of the polishing pad 4 to the edge 44 of the
polishing pad 4. The first grooves 41 are intersected with the
second grooves 42 to form a plurality of intersection points. The
holes 43 are disposed at the intersection points, and the depth of
the holes 43 is larger than that of the first grooves 41 and the
second grooves 42. The diameter of the hole 43 is larger than the
width of the first grooves 41 and the second grooves 42. The
difference between the surface texture of the polishing pad 4 of
the present embodiment and that of the polishing pad 3 of the first
embodiment is that the first groove 411 at the innermost circle of
the polishing pad 4 are not intersected with the second grooves
42.
EXAMPLE 3
[0024] Referring to FIG. 5, a top view of the polishing pad
according to the third embodiment of the present invention is
shown. The surface texture of the polishing pad 5 of the present
embodiment comprises a plurality of the first grooves 51, a
plurality of the second grooves 52, a plurality of the first holes
53, and a plurality of the second holes 55. The first grooves 51
are a plurality of concentric circular grooves. The second grooves
52 are a plurality of radial grooves, and each of the second
grooves 52 is a linear groove extending from a central portion of
the polishing pad 5 to the edge 54 of the polishing pad 5. The
first grooves 51 are intersected with the second grooves 52 to form
a plurality of intersection points. The first holes 53 are disposed
at the intersection points, and the depth of the first holes 53 is
larger than that of the first grooves 51 and the second grooves 52.
The second holes 55 are disposed on the second grooves 52 except
for the intersection points, and the depth of the second holes 55
is the same as that of the first holes 53. The diameters of the
first hole 53 and the second holes 55 are larger than the widths of
the first grooves 51 and the second grooves 52.
EXAMPLE 4
[0025] Referring to FIG. 6, a top view of the polishing pad
according to the fourth embodiment of the present invention is
shown. The surface texture of the polishing pad 6 of the present
embodiment comprises a plurality of the first grooves 61, a
plurality of the second grooves 62, and a plurality of holes 63.
The first grooves 61 are a plurality of concentric rectangular
grooves from the top view, and the first grooves 61 are a plurality
of rectangular grooves with different side lengths. The second
grooves 62 are a plurality of radial grooves, and each of the
second grooves 62 is a linear groove extending from a central
portion of the polishing pad 6 to the edge 64 of the polishing pad
6. The first grooves 61 are intersected with the second grooves 62
to form a plurality of intersection points. The holes 63 are
disposed at the intersection points, and the depth of the holes 63
is larger than that of the first grooves 61 and the second grooves
62.
EXAMPLE 5
[0026] Referring to FIG. 7, a top view of the polishing pad
according to the fifth embodiment of the present invention is
shown. The surface texture of the polishing pad 7 of the present
embodiment comprises a first groove 71, a plurality of the second
grooves 72, and a plurality of holes 73. The first groove 71 is a
spiral groove from the top view. The second grooves 72 are a
plurality of radial grooves, and each of the second grooves 72 is a
linear groove extending from a central portion of the polishing pad
7 to the edge 74 of the polishing pad 7. The first groove 71 is
intersected with the second grooves 72 to form a plurality of
intersection points. The holes 73 are disposed at the intersection
points, and the depth of the holes 73 is larger than that of the
first groove 71 and the second grooves 72. The diameter of the hole
73 is larger than the widths of the first grooves 71 and the second
grooves 72.
EXAMPLE 6
[0027] Referring to FIG. 8, a top view of the polishing pad
according to the sixth embodiment of the present invention is
shown. The surface texture of the polishing pad 8 of the present
embodiment comprises a plurality of the first grooves 81, a
plurality of the second grooves 82, and a plurality of holes 83.
The first grooves 81 are a plurality of concentric circular
grooves. The second grooves 82 are a plurality of radial grooves,
and each of the second grooves 82 is an arced groove extending from
a central portion of the polishing pad 8 to the edge 84 of the
polishing pad 8. The first grooves 81 are intersected with the
second grooves 82 to form a plurality of intersection points. The
holes 83 are disposed at the intersection points and the depth of
the holes 83 is larger than that of the first grooves 81 and the
second grooves 82. The diameter of the hole 83 is larger than the
widths of the first grooves 81 and the second grooves 82.
[0028] While several embodiments of the present invention have been
illustrated and described, various modifications and improvements
can be made by those skilled in the art. The embodiments of the
present invention are therefore described in an illustrative but
not restrictive sense. It is intended that the present invention
may not be limited to the particular forms as illustrated, and that
all modifications which maintain the spirit and scope of the
present invention are within the scope as defined in the appended
claims.
* * * * *