U.S. patent application number 12/149852 was filed with the patent office on 2008-09-11 for structure of ac light-emitting diode dies.
This patent application is currently assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. Invention is credited to Fei-Chang Hwang, Chia-Tai Kuo, Ming-Te Lin.
Application Number | 20080218093 12/149852 |
Document ID | / |
Family ID | 35745778 |
Filed Date | 2008-09-11 |
United States Patent
Application |
20080218093 |
Kind Code |
A1 |
Lin; Ming-Te ; et
al. |
September 11, 2008 |
Structure of AC light-emitting diode dies
Abstract
A structure of light-emitting diode (LED) dies having an AC loop
(a structure of AC LED dies), which is formed with at least one
unit of AC LED micro-dies disposed on a chip. The unit of AC LED
micro-dies comprises two LED micro-dies arranged in mutually
reverse orientations and connected with each other in parallel, to
which an AC power supply may be applied so that the LED unit may
continuously emit light in response to a positive-half wave voltage
and a negative-half wave voltage in the AC power supply. Since each
AC LED micro-die is operated forwardly, the structure of AC LED
dies also provides protection from electrical static charge (ESD)
and may operate under a high voltage.
Inventors: |
Lin; Ming-Te; (Hsinchu,
TW) ; Hwang; Fei-Chang; (Hsinchu, TW) ; Kuo;
Chia-Tai; (Hsinchu, TW) |
Correspondence
Address: |
RABIN & Berdo, PC
1101 14TH STREET, NW, SUITE 500
WASHINGTON
DC
20005
US
|
Assignee: |
INDUSTRIAL TECHNOLOGY RESEARCH
INSTITUTE
Hsinchu
TW
|
Family ID: |
35745778 |
Appl. No.: |
12/149852 |
Filed: |
May 9, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10994361 |
Nov 23, 2004 |
|
|
|
12149852 |
|
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Current U.S.
Class: |
315/192 ;
257/E25.02; 315/250 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/00 20130101; H01L 25/0753 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
315/192 ;
315/250 |
International
Class: |
H05B 37/02 20060101
H05B037/02; H05B 41/24 20060101 H05B041/24 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 31, 2004 |
TW |
93126201 |
Claims
1. A structure of AC light-emitting diode (LED) dies, comprising a
unit of AC LED micro-dies formed on a chip, the unit of AC LED
micro-dies having two LED micro-dies arranged in mutually reverse
orientations and connected by a conductive bridge in parallel, and
the unit of AC LED micro-dies emitting continuously a light when an
AC power supply being applied thereon.
2. The structure as recited in claim 1, wherein the two LED
micro-dies correspond to a same wavelength.
3. The structure as recited in claim 1, wherein the two LED
micro-dies correspond to different wavelengths.
4. The structure as recited in claim 1, wherein the unit of AC LED
micro-dies further comprises another LED micro-die.
5. A structure of AC light-emitting diode (LED) dies, comprising a
plurality of units of AC LED micro-dies formed on a chip, the
plurality of units of AC LED micro-dies connected in series having
two LED micro-dies arranged in mutually reverse orientations and
connected by a conductive bridge in parallel and the connected
plurality of units of AC LED micro-dies jointly emit continuously a
light when an AC power supply being applied thereon.
6. The structure as recited in claim 5, wherein the plurality of
units of AC LED micro-dies are connected in series.
7. The structure as recited in claim 5, wherein the plurality of
units of AC LED micro-dies are connected in parallel.
8. The structure as recited in claim 5, wherein the plurality of
units of LED micro-dies are connected in a combination of an
in-series connection and an in-parallel connection.
9. The structure as recited in claim 5, wherein the two LED
micro-dies correspond to a same wavelength.
10. The structure as recited in claim 5, wherein the two LED
micro-dies correspond to different wavelengths.
11. A structure of AC light-emitting diode (LED) dies, comprising a
unit of AC LED micro-dies formed on a chip, the unit of AC LED
micro-dies comprising at least two in-parallel paths each having a
plurality of LED micro-dies in series, the two in-parallel paths
connected by a conductive bridge with each other in parallel, each
of the plurality of LED micro-dies in series in one of the two
in-parallel paths is arranged in mutually reverse orientations and
connected in parallel with each of the plurality of LED micro-dies
in series in the other of the two in-parallel paths and the unit of
AC LED micro-dies emitting continuously a light when an AC power
supply being applied thereon.
12. The structure as recited in claim 11, wherein each of the LED
micro-dies in the unit of AC LED micro-dies correspond to a same
wavelength as those the other LED micro-dies in the unit of AC LED
micro-dies correspond.
13. The structure as recited in claim 11, wherein at least one of
the LED micro-dies in the unit of AC LED micro-dies corresponds to
a different wavelength with those the other LED micro-dies in the
unit of AC LED micro-die correspond.
14. The structure as recited in claim 11, wherein the unit of AC
LED micro-dies further comprises an in-parallel path comprising a
plurality of LED micro-dies in series.
15-24. (canceled)
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of Invention
[0002] The invention relates to a structure of light-emitting
diodes (LED), and particularly to a structure of LED dies with an
alternating current (AC) loop (a structure of AC LED dies).
[0003] 2. Related Art
[0004] A light-emitting diode (LED) emits light based on its
semi-conductive characteristics, in contrast to the heating
light-emitting principle of a fluorescent lamp, and is thus called
a cold light. The LED provides a number of advantages such as high
endurance, long lifetime, compactness, low power consumption and so
forth. Furthermore, no pernicious material such as mercury is
contained in the LED. Therefore, there are high expectations with
respect to the LEDs for being a light source in daily life in the
current lighting market.
[0005] However, prior LEDs are generally limited in their
acceptable power levels. Most LEDs may be fed with only low DC
voltages and may be damaged if high voltages or AC voltages are
applied thereon. Because of this, a DC voltage conversion circuit
is generally used to transform the external power supply used by
such LEDs. In operating an LED by use of a low DC voltage, the LED
has its characteristic curve of the current-voltage relation, as
shown in FIG. 1A. As shown, when the voltage is forwardly applied,
the LED is conducted and light is emitted there from. On the other
hand, if a reverse voltage is applied, the LED breaks down and no
light is emitted. Further, in practical usage the LED is often
connected in series or parallel with several such LEDs, such as
those used in traffic light apparatuses such as stop light
apparatuses. As shown in FIG. 2, the externally supplied AC voltage
11 is first reduced in its level by means of a conversion circuit
12 and then converted into a DC voltage corresponding thereto. Then
the converted DC voltage is fed into a plurality of LEDs connected
with one another in series or in parallel as mentioned above, in
which LEDs cannot be used when reverse power is supplied.
[0006] However, once a single LED arranged among the plurality of
LEDs is damaged, the set of LEDs in which the damaged LED resides
is also likely to become damaged and the whole of the loop formed
with the damaged LED included is badly affected. To reduce this
occurrence, the number of LEDs connected in series is generally
reduced as much as possible. Unfortunately, the total amount of
wires used for these LEDs in a specific application is unavoidably
increased and the power consumption increases correspondingly.
Furthermore, the voltage at an end of one of the wires is
insufficient and thus causes uneven luminance of the LEDs.
[0007] There is another serious problem with a low DC voltage
operated ALInGaN LED. When such a LED is assembled and processed,
electrical static discharge (ESD) is apt to occur. When this
occurs, an instantaneous high reverse voltage is burst forth and
the LED is damaged.
[0008] To resolve the above-mentioned shortcomings, circuit
assembly and die manufacturing are two generally adopted
solutions.
[0009] The circuit assembly scheme may be seen in U.S. Pat. No.
6,547,249. This patent discloses an additional diode arranged in a
reverse orientation and connected in parallel to protect an
LED-based circuit to prevent sudden ESD or an exceptional current
or voltage attack. In another U.S. Pat. No. 5,936,599, LEDs in an
LED based circuit are arranged in a reverse orientation and
connected in parallel, and inductors and capacitors are introduced
in the circuit. In this case, an AC voltage and a high voltage may
be used by the LEDs. However, although the problem of high power
consumption may be overcome by such circuit assembly schemes, the
corresponding large volume of the LED based circuit considerably
limits its actual applicable range. In US publication patent
2004/0075399, the circuit is arranged in the submount and formed
dies/die array thereon. However, the pitch between conductors for
connecting dies and the submount is about 0.1 mm to 0.12 mm. There
are only 12*2 diodes in 1 mm*1 mm die. The volume of the die is
also great to operate with higher voltage, and the illuminating
area is decreased due to the pitch requirement.
[0010] An example of the die manufacturing scheme may be seen in
U.S. Pat. No. 6,547,249, in which LED dies are manufactured as a
matrix form and connections of the LED dies are arranged in the
same orientation in series and in parallel. Although such LEDs may
be operated with a high voltage, they may still not be applied with
an AC voltage. In this patent, an arrangement for protection of
breakdown of the LEDs is also provided by connecting a diode with
the LEDs in a variety of combinations where the LEDs may also be
arranged in mutually reverse orientations and connected with each
other but should be disposed over a submount and then connected
with the LED matrix in parallel. According to this patent, the LED
die 91 has a structure shown in FIG. 1B, and has an equivalent
circuit shown in FIG. 1C, in which the LED 91 is connected in
parallel with two mutually oriented Zener diodes 92 and 93, or a
connection may be provided to form a loop as shown in FIG. 1D. The
current-voltage relation curves corresponding to the equivalent
circuits in FIG. 1C and FIG. 1D are shown in FIG. 1E and FIG. 1F
respectively.
[0011] Also referring to U.S. Pat. No. 5,635,902, the LED dies are
also manufactured as a matrix form while the LEDs are oriented the
same and connected in series. Although the LEDs may be operated
with a high voltage, they also have the problem of not being
capable of operation with AC voltage.
SUMMARY OF THE INVENTION
[0012] An object of the invention is therefore to provide a
structure of light-emitting diode (LED) dies having an alternating
current (AC) loop abbreviated as a structure of AC LED dies, on
which an AC power supply may be applied directly to considerably
broaden applicable range.
[0013] To achieve the above object, the structure of AC LED dies
according to the invention is formed with at least one unit of AC
LED micro-dies disposed on a chip. The unit of AC LED micro-dies
comprises two LED micro-dies arranged in mutually reverse
orientations and connected by a conductive bridge with each other
in parallel, to which an AC power supply may be applied so that the
unit of AC LED micro-dies continuously emits light in response to a
positive-half wave voltage and a negative-half wave voltage in the
AC power supply respectively. Since each AC LED micro-die is
operated forwardly, the structure of the AC LED dies also provides
protection from electric static charge (ESD) and may operate under
a high voltage. The pitch is decreased by the conductive bridge to
0.015 mm, 0.012 mm, and 1.010 mm or even to lower than 0.06 mm.
Hence, when the size of the die is 1 mm or 0.6 mm, there would have
47*2 diodes and operate with 158 bi-directional voltages.
[0014] In practical usage, the structure of the AC LED dies may be
provided in a flipped form or a faced-up form. Also, each of the
LED dies in the structure of the AC LED dies may correspond to the
same wavelength or different wavelengths with those of the other
LEDs in the unit of AC LED dies. Thus the structure of AC LED dies
may be used in a wider applicable range.
[0015] The objects, constructions, features and functions of the
invention may be better understood through the following detailed
description with respect to the preferred embodiments thereof in
connection with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1A is a characteristic curve diagram of a prior
light-emitting diode (LED) die;
[0017] FIGS. 1B-1D are schematic illustrations of a prior LED die
produced by Lumileds;
[0018] FIGS. 1E-1F are characteristic curve diagrams of the LED die
shown in FIGS. 1B-1D;
[0019] FIG. 2 is an illustration of the prior LED in use;
[0020] FIG. 3 is a schematic diagram of a structure of LED dies
having an alternating current (AC) loop (a structure of AC LED die)
according to the invention;
[0021] FIG. 4A is an equivalent circuit diagram of the structure of
AC LED dies shown in FIG. 3;
[0022] FIG. 4B is a characteristic curve diagram of the structure
of AC LED dies shown in FIG. 3.
[0023] FIG. 5 is a schematic diagram describing a manufacturing of
the structure of AC LED dies;
[0024] FIG. 6 is a schematic diagram illustrating a package of the
structure of AC LED dies shown in FIG. 3;
[0025] FIGS. 7A and 7B are a schematic diagram illustrating a
flip-chip structure of the AC LED dies shown in FIG. 3;
[0026] FIG. 8 is a variant of the equivalent circuit shown in FIG.
4A;
[0027] FIG. 9A is the structure of AC LED dies according to another
embodiment of the invention;
[0028] FIG. 9B is a variant of the structure of AC LED dies shown
in FIG. 9A;
[0029] FIGS. 10A and 10B are illustrations of a plurality of
structures of AC LED dies connected in a matrix form according to
the invention;
[0030] FIG. 11 is an equivalent circuit diagram of the
matrix-formed plurality of structures of AC LED dies shown in FIGS.
10A and 10B; and
[0031] FIGS. 12A-12F are illustrations of a process flow of the
manufacturing of the structure of AC LED dies according to the
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0032] A structure of light-emitting diode (LED) dies having an
alternating current (AC) loop, which may be fed with a direct AC
power supply, is disclosed in the invention (abbreviated as a
structure of AC LED dies). The structure of AC LED dies comprises
at least a unit of AC LED micro-dies 50, which will be described in
the following. Referring to FIG. 3, the unit of AC LED micro-dies
comprises a first LED micro-die and a second LED micro-die 21 and
22 arranged in mutually reverse orientations and connected in
parallel. The unit of AD LED micro-dies has an equivalent circuit
as shown in FIG. 4A. Since the first and second LED micro-dies 21
and 22 are oriented reversely and connected by a conductive bridge
53 in parallel, the first LED micro-die 21 emits light when a
positive-half wave voltage in the AC power supply is applied, while
the second LED micro-die 22 emits light when a negative-half wave
voltage in the AC power supply is applied. Therefore, the unit of
LED micro-dies may emit light continuously whenever a proper AC
power supply is provided. For this reason, the above-mentioned
terms "AC loop", "AC LED dies" and "AC LED micro-dies" are used.
Hence, the structure would solve the bigger-volume problem that
manufactured by the structure described in the U.S. Pat. No.
6,547,249 and US publication patent 2004/0075399.
[0033] Furthermore, the characteristic curve associated with the
current-voltage relation of the unit of AC LED micro-dies is
provided in FIG. 4b. Since each LED micro-die in the unit is
operated forwardly, the structure of AC LED dies also provides
protection from electric static charge (ESD) without the need of an
additional circuit, as in the prior art, or a diode fixed on a
sub-mount and connected with the LEDs, as in U.S. Pat. No.
6,547,249. Therefore, the purpose of cost saving may be
achieved.
[0034] FIG. 5 illustrates the manufacturing of the structure of AC
LED dies. First, two unconnected n-type light-emitting layers 62a
and 62b, such as a n-InGaN layer, are first formed on a substrate
made of Al.sub.2O.sub.3, GaAs, GaP or SiC, etc. Next, two p-type
light-emitting layers 63a and 63b, such as an p-InGaN layer, are
formed on portions of the n-type light-emitting layers 62a and 62b
respectively. Next, n-type pads 67a and 67b are formed on other
portions of the n-type light-emitting layers 62a and 62b
respectively. Then, p-type pads 66a and 66b are formed on the
p-type light-emitting layers 63a and 63b respectively. Then a
conductive bridge 65 is formed to connect the n-type pad 67a and
the p-type pads 66b, and an insulating layer 64 is formed to avoid
short-circuiting between the n-type pad 67a, the p-type pad 66b and
the conductive bridge 65. Finally, the p-type pad 67b is connected
to the n-type pad 66a.
[0035] Specifically, the manufacturing of the structure of AC LED
dies is illustrated as follows with reference to FIGS. 12A-12F.
First, a substrate 61 is provided. On the substrate 61, n-type
light-emitting layers 62a and 62b and p-type light-emitting layers
63a and 63b are provided (from bottom to top), as shown in FIG.
12A. Next, an etching operation is performed upon a portion of each
of the p-type light-emitting layers 63a and 63b, and a
corresponding portion of each of the n-type light-emitting layers
62a and 62b is thus exposed, as shown in FIG. 12B. Next, an
insulating layer 64 is formed, as shown in FIG. 12C. The insulating
layer 64 may be an oxide layer, for example. Thereafter, specific
portions defined for formation of pads in the n-type light-emitting
layers 62a and 62b and p-type light-emitting layers 63a and 63b are
etched, as shown in FIG. 12D. Then, n-type pads 67a and 67b and
p-type pads 66a and 66b are formed at their defined regions as
mentioned, as shown in FIG. 12E. Finally, a conductive bridge 65 is
formed and connected between the n-type pad 67a and p-type pad 66b,
as shown in FIG. 12F.
[0036] In addition, the structure of AC LED dies may be covered by
a glue as a packaged structure and fixed on a sub-mount 69, wherein
the glue may be a heatsink glue and the sub-mount 69 may be formed
with a surface that acts as a reflective layer to reflect light.
Alternatively, bumps 72 may be formed over the sub-mount 69. Trace
71 are used to connect the n-type pad 67a with the p-type pad 66b,
and the n-type pad 67b and the p-type pad 66a are also electrically
connected with each other (not shown in the figure) as shown in
FIG. 7A. As shown in FIG. 7B, another embodiment would solve the
bigger-volume problem that manufactured by the structure described
in the U.S. Pat. No. 6,547,249 and US publication patent
2004/0075399. The bump 72 forms in the submount 68 with flip-chip
structure. However, only the p-type pad 66a and N-type pad 67b
connect thereon. The P-type pad 67a and N-type pad 66b connect by
the conductive bridge 65. Then the leading wire 71a and 71b connect
to the outer AC power source. Hence, the structure also forms
oriented reversely circuit in parallel and solves the bigger-volume
problem.
[0037] In addition, the structure of AC LED dies may be connected
with a third LED micro-die 23 in parallel as shown in FIG. 8, and
an asymmetric structure of AC LED dies is thus formed.
[0038] FIG. 9A illustrates another embodiment of the structure of
AC LED dies. In this embodiment, a first LED micro-die 21 is
connected with a third LED micro-die 23 and a second LED micro-die
22 is connected with a fourth LED micro-die 24, and the same result
as provided by the above mentioned embodiment of the structure of
AC LED dies is obtained. Alternatively, the structure of AC LED
dies may be further connected with a fifth LED micro-die 25 and a
sixth LED micro-die 26 in parallel, similar to that shown in FIG.
8, as shown in FIG. 9B. In the above embodiments, each of the LED
micro-dies may emit light with a single wavelength or multiple
wavelengths when a power supply is supplied, such as wavelengths
corresponding to red, green and blue lights.
[0039] In practical usage, a first pad 41 and a second pad 42 are
formed on a substrate 40, and a plurality of units of AC LED dies
50 are coupled therebetween, as shown in FIGS. 10A and 10B. Each
unit of AC LED dies 50 comprises a first LED micro-die 51 and a
second LED micro-die 52, as shown in FIG. 3, and has an equivalent
circuit shown in FIG. 11. Seen from FIG. 11, it may be readily
known that the first and second LED micro-dies 51 and 52 are
arranged in mutually reverse orientations and connected in
parallel, and a plurality of thus formed units 50 is connected in
series. Similar to the description in FIG. 3, the first LED
micro-die 51 in the unit 50 emits light when a positive-half wave
voltage is in the AC power supply, while the second LED micro-die
52 in the unit 50 emits light when a negative-half wave voltage is
in the AC power supply (see FIG. 10B). Since the voltage of the AC
power supply is varied between a positive peak and a negative peak
with a high frequency, light emitted alternatively from the LEDs 51
and 52 is continuous. Generally, AC voltage has a large swing or a
large amplitude. Even if the voltage on such a unit 50 connected at
the downstream of a wire connecting a plurality of units is
slightly dropped, the range of reduction is relatively small,
unlike the prior art (only several volts is provided) in which
slight changes over the voltage fed into the LED cause a remarkable
difference of luminance of the LED. Since the LED has a fast
response speed, the AC power supply may have a frequency up to
50-60 kHz. In addition, any waveform of the AC power supply may be
used, provided that the waveform is symmetrical.
[0040] While the preferred embodiments of the invention have been
set forth for the purpose of disclosure, modifications of the
disclosed embodiments of the invention as well as other embodiments
thereof may occur to those skilled in the art. Accordingly, the
appended claims are intended to cover all embodiments which do not
depart from the spirit and scope of the invention.
* * * * *