U.S. patent application number 12/027911 was filed with the patent office on 2008-09-04 for processing method for glass substrate, processed glass product and stress applying apparatus.
This patent application is currently assigned to OLYMPUS CORPORATION. Invention is credited to Takeshi HIDAKA, Masamichi HIJINO, Hiroaki KASAI, Akihiro KOYAMA, Hirotaka KOYO, Junji KURACHI, Yasushi NAKAMURA, Shinya OKAMOTO, Yasuhiro SAITO, Keiji TSUNETOMO.
Application Number | 20080209950 12/027911 |
Document ID | / |
Family ID | 32958693 |
Filed Date | 2008-09-04 |
United States Patent
Application |
20080209950 |
Kind Code |
A1 |
HIDAKA; Takeshi ; et
al. |
September 4, 2008 |
Processing Method for Glass Substrate, Processed Glass Product and
Stress Applying Apparatus
Abstract
A processing method for glass substrate of the present invention
includes: applying heat and external force to a glass substrate and
then cooling it down to thereby form a compression stressed part
having a different etching rate from that of other parts with
respect to an etching reagent to be used, on the surface of the
glass substrate and in the vicinity thereof; and performing
chemical etching using the etching reagent on the glass substrate
having the compression stressed part formed thereon, so as to form
a relief on the surface of the glass substrate.
Inventors: |
HIDAKA; Takeshi; (Tokyo,
JP) ; KASAI; Hiroaki; (Tokyo, JP) ; HIJINO;
Masamichi; (Kitatsuru-gun, JP) ; NAKAMURA;
Yasushi; (Kitatsuru-gun, JP) ; KOYAMA; Akihiro;
(Takarazuka-shi, JP) ; TSUNETOMO; Keiji;
(Amagasaki-shi, JP) ; KURACHI; Junji;
(Takarazuka-shi, JP) ; KOYO; Hirotaka;
(Takarazuka-shi, JP) ; OKAMOTO; Shinya; (Osaka,
JP) ; SAITO; Yasuhiro; (Takatsuki-shi, JP) |
Correspondence
Address: |
HOGAN & HARTSON L.L.P.
1999 AVENUE OF THE STARS, SUITE 1400
LOS ANGELES
CA
90067
US
|
Assignee: |
OLYMPUS CORPORATION
Tokyo
JP
NIPPON SHEET GLASS CO., LTD.
Tokyo
JP
|
Family ID: |
32958693 |
Appl. No.: |
12/027911 |
Filed: |
February 7, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10993422 |
Nov 19, 2004 |
7354526 |
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12027911 |
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PCT/JP2004/001997 |
Feb 20, 2004 |
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10993422 |
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Current U.S.
Class: |
65/319 ;
G9B/5.299 |
Current CPC
Class: |
C03C 15/00 20130101;
C03C 19/00 20130101; C03C 17/22 20130101; C03C 23/007 20130101;
C03C 2218/31 20130101; C03C 2218/32 20130101; Y10T 428/24355
20150115; C03C 17/3411 20130101; Y10T 428/218 20150115; G11B
5/73921 20190501; G11B 5/8404 20130101 |
Class at
Publication: |
65/319 |
International
Class: |
C03B 11/12 20060101
C03B011/12 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 3, 2003 |
JP |
2003-056263 |
Claims
1-25. (canceled)
26. A stress applying apparatus comprising: an indenter which
applies an external force by pressing, or by pressing and sweeping
a surface of a glass substrate or a film formed on said glass
substrate so as to form a compression stressed part of a desired
shape; a heat source which heats said indenter; a driving device
which moves at least one of said indenter and said glass substrate;
and a controller which controls said driving device and said heat
source.
27. The stress applying apparatus according to claim 26, wherein an
end of said indenter is in the shape of a part of a sphere.
28. The stress applying apparatus according to claim 26, wherein an
end of said indenter is in a knife edge shape.
29. The stress applying apparatus according to claim 26, wherein
said indenter is multiply shaped.
30. The stress applying apparatus according to claim 26, wherein
the material of said indenter is harder than the material of the
surface of said glass substrate or the material of said film formed
on said glass substrate, to which said external force is
applied.
31. A stress applying apparatus comprising: a mold which applies an
external force by pressing a surface of a glass substrate or a film
formed on said glass substrate so as to form a compression stressed
part of a desired shape; a heat source which heats said mold; a
driving device which moves at least one of said mold and said glass
substrate; and a controller which controls said driving device and
said heat source.
32. The stress applying apparatus according to claim 31, wherein
the material of said mold is harder than the material of the
surface of said glass substrate or the material of said film formed
on said glass substrate, to which said external force is
applied.
33. A stress applying apparatus comprising: a particle ejecting
device which ejects particles a surface of a glass substrate or a
film formed on said glass substrate so as to form a compression
stressed part of a desired shape; a heat source which heats said
particles; a driving device which moves at least one of said
particle ejecting device and said glass substrate; and a controller
which controls said driving device and said heat source.
34. The stress applying apparatus according to claim 33, wherein
the material of said particles is harder than the material of the
surface of said glass substrate or the material of said film formed
on said glass substrate, to which said external force is
applied.
35. The stress applying apparatus according to any one of claims
26, 31, and 33, further comprising a gas supply device which
supplies an inert gas into a chamber accommodating said glass
substrate.
Description
[0001] This application is a Continued-In-Part application of
International Patent Application No. PCT/JP2004/001997, filed on
Feb. 20, 2004, which claims priority from Japanese Patent
Application No. 2003-056263, filed on Mar. 3, 2003.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a processing method for
glass substrate for forming a relief on the surface of glass
substrate, a processed glass product obtained by the processing
method, and a stress applying apparatus which applies stress to the
surface of glass substrate.
[0004] 2. Description of Related Art
[0005] Conventionally, there have been various processing methods
for glass substrate for forming a relief on the surface of the
glass substrate. As an example, a method has been proposed wherein,
in order to deal with the recent demand for even higher
densification of disks in the field of HDDs (hard disk drives),
with the object of forming surface projections having an even
height in desired positions on amorphous material (glass), a
predetermined pressure force is applied to parts of the surface of
the amorphous material to form a densified compressed layer. Then
the outer layer is removed using processing agents with different
removal capability depending on this compressed layer and other
non-compressed layers, so that the compressed layer can be
processed into a projecting shape (see Japanese Laid-open Paten
Publication JP-2002-160943-A).
[0006] Incidentally, similarly to the processing method proposed in
the above patent document, in a processing method wherein an
external force is applied onto a glass substrate, to form the
compressed layer so that a relief is formed on the surface of the
glass substrate utilizing the difference in etching rate between
the compressed layer and non-compressed layer, the condition is
required such that the glass substrate is not cracked when forming
the compressed layer.
SUMMARY OF THE INVENTION
[0007] A first aspect of a processing method for glass substrate
according to the present invention includes: applying heat and
external force to a glass substrate and then cooling it down to
thereby form a compression stressed part having a different etching
rate from that of other parts with respect to an etching reagent to
be used, on the surface of the glass substrate and in the vicinity
thereof, and performing chemical etching using the etching reagent
on the glass substrate having the compression stressed part formed
thereon, so as to form a relief on the surface of the glass
substrate.
[0008] A second aspect of a processing method for glass substrate
according to the present invention includes: forming a film
composed of one or more layers of inorganic material on a glass
substrate; applying heat and external force to the film and then
cooling it down to thereby form a compression stressed part having
a different etching rate from that of other parts with respect to
an etching reagent to be used, on the surface of the film and in
the vicinity thereof; and performing chemical etching using the
etching reagent on the film having the compression stressed part
formed thereon, so as to form a relief on the surface of the
film.
[0009] The second aspect of a processing method for glass substrate
according to the present invention may further include: performing
etching on the glass substrate having the film with the relief
formed on the surface, formed thereon, so as to form a relief on
the surface of the glass substrate.
[0010] In this case, a projection formed on the surface of the
glass substrate may be composed of the glass substrate, or the
glass substrate and the film.
[0011] In this case, a material having a higher etching rate than
that of the film may be used for the glass substrate.
[0012] At the first or second aspect of a processing method for
glass substrate according to the present invention, the external
force may be applied by pressing a mold having a desired shape.
[0013] In this case, heat and external force may be applied by
pressing the mold which has been heated.
[0014] The material of the mold may be harder than the material of
a part of the glass substrate or the material of the film formed on
the glass substrate, to which the heat and external force are
applied.
[0015] At the first or second aspect of a processing method for
glass substrate according to the present invention, the external
force may be applied by pressing an indenter.
[0016] In this case, heat and external force may be applied by
pressing the indenter which has been heated.
[0017] The external force may be applied by pressing and sweeping
the indenter.
[0018] A point of the indenter may be in the shape of a part of a
sphere.
[0019] A point of the indenter may be in a knife edge shape.
[0020] The indenter may be multiply provided.
[0021] The material of the indenter may be harder than the material
of a part of the glass substrate or the material of film formed on
the glass substrate, to which the heat and external force are
applied.
[0022] At the first or second aspect of a processing method for
glass substrate according to the present invention, external force
may be applied by making particles collide.
[0023] In this case, heat and external force may be applied by
making the particles which have been heated collide.
[0024] The particles may be controlled to collide so as to make the
compression stressed part into a desired shape.
[0025] The material of the particle may be harder than the material
of a part of the glass substrate or the material of film formed on
the glass substrate, to which the heat and external force are
applied.
[0026] A glass product according to the present invention may
include a relief formed on the surface thereof by the processing
method according to the first aspect or the second aspect.
[0027] The processed glass product may be a chip member for a
microchemical system.
[0028] A first aspect of a stress applying apparatus according to
the present invention includes: an indenter which applies an
external force by pressing or pressing and sweeping onto the
surface of a glass substrate or a film formed on the glass
substrate so as to form a compression stressed part of a desired
shape; a heat source which heats at least one of the surface of the
glass substrate or the surface of the film and the indenter; a
driving device which moves at least one of the indenter and the
glass substrate; and a controller which controls the driving device
and the heat source.
[0029] A second aspect of a stress applying apparatus according to
the present invention includes: a mold which applies an external
force by pressing onto the surface of a glass substrate or a film
formed on the glass substrate so as to form a compression stressed
part of a desired shape; a heat source which heats at least one of
the surface of the glass substrate or the surface of the film, and
the mold; a driving device which moves at least one of the mold and
the glass substrate; and a controller which controls the driving
device and the heat source.
[0030] A third aspect of a stress applying apparatus according to
the present invention includes: a particle ejecting device which
ejects particles onto the surface of a glass substrate or a film
formed on the glass substrate so as to form a compression stressed
part of a desired shape; a heat source which heats at least one of
the surface of the glass substrate or the surface of the film and
the particles; a driving device which moves at least one of the
particle ejecting device and the glass substrate; and a controller
which controls the driving device and the heat source.
[0031] One of the first, the second, the third aspects may includes
a gas supply device which supplies an inert gas into a chamber
accommodating the glass substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, FIG. 1E, and FIG. 1F are
explanatory diagrams of an example of a process for forming a
relief on the surface of a glass substrate, according to a first
embodiment of the present invention.
[0033] FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, and FIG. 2E are
explanatory diagrams of an example of a process for forming a
relief on the surface of a glass substrate, according to a second
embodiment of the present invention.
[0034] FIG. 3 is a schematic diagram showing an entire stress
applying apparatus according to a third embodiment of the present
invention.
[0035] FIG. 4 is a plan view showing the point of an indenter used
for the stress applying apparatus in FIG. 3.
[0036] FIG. 5 is a perspective view showing the surface of a glass'
substrate having an indenter being swept thereon, used in the
stress applying apparatus in FIG. 3.
[0037] FIG. 6 is a perspective view showing a processed glass
product formed by a third embodiment of the present invention.
[0038] FIG. 7 is a plan view showing other examples of the shape of
the indenter used for the first, second, and third embodiments of
the present invention.
[0039] FIG. 8 is a perspective view showing the glass substrate
having the indenter being pressed thereon, in the first, second,
and third embodiments of the present invention.
[0040] FIG. 9 is a perspective view showing an example of a
processed glass product formed by pressing a mold onto the glass
substrate in the first, second, and third embodiments of the
present invention.
[0041] FIG. 10 is a side view showing the glass substrate having
particles colliding thereon, in the first, second, and third
embodiments of the present invention.
[0042] FIG. 11 shows an example of an apparatus which forms a
compression stressed part on the surface of a film layer formed on
a quartz substrate, and in the vicinity thereof.
[0043] FIG. 12A and FIG. 12B are perspective views of an example
when applying the first, second, and third embodiments of the
present invention to a chip member for a microchemical system.
[0044] FIG. 13 is a perspective view showing a modified example of
passages of the chip member for the microchemical system in FIG.
12A.
DETAILED DESCRIPTION OF THE INVENTION
[0045] Hereunder is a description of embodiments of the present
invention with reference to the drawings.
[0046] FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, FIG. 1E, and FIG. 1F are
explanatory diagrams of an example of a process for forming a
relief on the surface of a glass substrate according to a first
embodiment of the present invention.
[0047] In the present embodiment, as a glass substrate being a
processing object, a glass parent material is used containing
SiO.sub.2 and 1 mole % of Al.sub.2O.sub.3 or more wherein the
SiO.sub.2 content--Al.sub.2O.sub.3 content is from 40 to 67 mole %,
which is beneficial for effectively forming a relief on the surface
by chemical etching using an acidic medium (etching reagent). This
glass parent material is a multi-component glass, containing
SiO.sub.2 as the main component and 1 mole % of Al.sub.2O.sub.3 or
more. Using such glass parent material, since Al.sub.2O.sub.3 is
easily leached into the acidic medium, the etching is promoted.
Moreover, as the difference in the molar concentration between
SiO.sub.2 and Al.sub.2O.sub.3 (SiO.sub.2--Al.sub.2O.sub.3)
contained in the glass parent material is reduced (Al.sub.2O.sub.3
having a lower acid resisting property is relatively increased),
the leaching is further promoted, increasing the etching rate
rapidly.
[0048] In the process according to the present embodiment, firstly
as shown in FIG. 1A, heat is applied onto a glass substrate 1
having such a composition, so as to raise the temperature of the
glass substrate 1. The heat is applied until the temperature is
raised at least to a degree so as not to generate cracks when an
indenter 2 is pressed to apply an external force.
[0049] When the temperature of the glass substrate 1 is raised,
subsequently as shown in FIG. 1B, the indenter 2 is lowered as
shown by the arrow A to press the indenter 2 onto the glass
substrate 1. Accordingly, a compression stressed part 3 having the
temperature raised is formed on the surface of the glass substrate
1 and in the vicinity thereof. Actually at this time, a dent is
formed on the surface of the glass substrate 1 by pressing the
indenter 2, however it is omitted in FIG. 1B (same in FIG. 1C).
[0050] Subsequently, the glass substrate 1 is cooled down while
pressing the indenter 2 onto the glass substrate 1. Then the
indenter 2 is raised as shown by arrow B in FIG. 1C. Accordingly, a
compression stressed part 4 is formed on the surface of the glass
substrate 1 and in the vicinity thereof.
[0051] The compression stressed part 4 formed in this manner shows
different chemical properties from the other parts (normal parts),
causing a different etching rate when chemical etching is performed
using an acidic medium. In more detail, the etching rate is lower
in the compression stressed part 4, compared to the other parts
(the etching speed is decreased). Although the mechanism has not
yet been completely clarified, it is considered that; due to the
glass structure change, the phase transformation, the raised
density and the like in the compression stressed part 4, the
compacted siloxane network prevents other components from being
leached, while Al.sub.2O.sub.3 is selectively etched by the acidic
medium in the other parts.
[0052] Subsequently, as shown in FIG. 1D to FIG. 1F, the chemical
etching is performed using the acidic medium on the glass substrate
1 having the compression stressed part 4 formed thereon. As a
result, as shown in FIG. 1D and FIG. 1E, it becomes more difficult
to etch the compression stressed part 4 having the lower etching
rate than that of the other parts, so that the compression stressed
part 4 remains as a projection. Then, by further chemical etching
using the acidic medium, a projection having a cone-shaped section
is formed as shown in FIG. 1F.
[0053] In this manner, according to the step of the present
embodiment, since the relatively small external force is applied to
the glass substrate 1 while being heated to raise the temperature,
there is no concern of cracking the glass substrate 1 when applying
the external force and it is possible to prevent cracking when
forming the compression stressed part 4, with higher
probability.
[0054] Moreover, since the external force is applied to the glass
substrate 1 while being heated to raise the temperature, a large
load is not necessary but only a small load is enough to form the
compression stressed part.
[0055] Moreover, since a relatively small external force is applied
to the glass substrate 1 while being heated to raise the
temperature, there is no concern of cracking regardless of the
shape of the indenter 2 (the shape of the part pressed onto the
glass substrate 1). For example, even in the case where an indenter
having a relatively large bottom area, being the part in contact
with the glass substrate 1 is used, there is no concern of cracking
the glass substrate 1.
[0056] In the step according to the present embodiment, the
SiO.sub.2 content--Al.sub.2O.sub.3 content of the glass substrate 1
is preferably 40 mole % or more from the viewpoint of forming a
glass substrate wherein the water resisting property is not
deteriorated. Furthermore, it is preferably 47 mole % or more from
the viewpoint of forming a glass substrate wherein a high
projection can be effectively obtained with respect to the etching
amount. On the other hand, the SiO.sub.2 content--Al.sub.2O.sub.3
content of the glass substrate 1 is preferably 67 mole % or less
from the viewpoint of forming a glass substrate wherein the acid
resisting property is kept from reducing due to the addition of the
large amount of Al.sub.2O.sub.3 into the glass substrate, the
melting temperature is kept from increasing, and the composition
homogeneity is high at a relatively low melting temperature.
Furthermore, it is preferably 57 mole % or less from the viewpoint
of forming a glass substrate wherein a high projection can be
effectively obtained with respect to the etching amount.
[0057] Moreover, the SiO.sub.2 content is preferably 40 mole % or
more, while the Al.sub.2O.sub.3 content is essentially 1 mole % or
more, but preferably 15 mole % or less as the upper limit.
SiO.sub.2 is the basic component of the glass substrate 1, and is
preferably 40 mole % or more from the point of adding chemical
resisting properties and projection forming properties.
Al.sub.2O.sub.3 is preferably 15 mole % or less from the point of
ensuring the dissolubility of the glass substrate to form a
homogeneous glass substrate, and thereby reduce irregularities
dependent on the projection forming location.
[0058] In this manner, the glass substrate 1 is not specifically
limited and may be any material as long as; it contains SiO.sub.2
and Al.sub.2O.sub.3 in the abovementioned ratio, the compression
stressed part having the low etching rate can be easily formed by
applying heat and an external force, and then cooling it down, and
the projection can be formed by etching thereafter. Examples of the
type of such glass substrate include aluminosilicate glass,
aluminoborosilicate glass, borosilicate glass, and the like, any of
which may be selected. B.sub.2O.sub.3 contained in the borosilicate
glass and the like, is considered to show a similar action to
Al.sub.2O.sub.3 in the glass substrate, and presents no obstacle
even it is contained in the glass substrate 1.
[0059] Furthermore, in the process according to the present
embodiment, the acidic medium used as the etching reagent is needed
to selectively leach components other than SiO.sub.2 from the glass
substrate 1. Furthermore, it is required that the aforementioned
selective leaching amounts by the chemical etching using the
etching reagent are different between the compression stressed part
and the other normal part. Therefore, the etching reagent is
preferably an aqueous solution having pH 5 or less. Since
components having the lower acid resisting property such as
Al.sub.2O.sub.3 are selectively leached from the glass substrate by
etching, the etching reagent is required to be slightly acidic. For
such etching reagent, an acidic solution containing fluoride ions,
for example hydrofluoric acid solution may be used. Moreover, for
the acidic etching reagent, a solution to which is added at least
any one type selected from; sulfuric acid, hydrochloric acid,
nitric acid, phosphoric acid, sulfamic acid, oxalic acid, tartaric
acid, malic acid, and citric acid, may be used.
[0060] In the process according to the present embodiment, the
arrangement is such that one indenter 2 is pressed onto the glass
substrate so as to apply the external force. However it may be such
that a plurality of indenters 2 are pressed to apply the external
force. In this manner, a plurality of projections may be formed on
the surface of the glass substrate 1 by one pressing operation.
[0061] Next is a description of a second embodiment of the present
invention.
[0062] This embodiment is suitable in the case where the glass
substrate being the processing object is a material for which it is
difficult to perform press-molding. Such glass substrate includes a
crystallized glass or a quartz glass, an a thermal glass and the
like, having low thermal expansion and high transparency. The
press-molding of glass means a method wherein glass is heated and
softened, and then a mold processed into a desired shape is pressed
onto the glass to transfer the shape, after which the glass is
cooled down to solidify the glass so as to obtain the glass in the
desired form. Therefore, the material for which it is difficult to
perform press-molding includes a material for which it is difficult
to form the compression stressed part by applying heat and external
force, and then cooling it down as described above.
[0063] FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, and FIG. 2E are
explanatory diagrams of an example of a process for forming a
relief on the surface of a glass substrate according to the present
embodiment.
[0064] In the present embodiment, a crystallized glass is used for
the glass substrate on which a relief is finally formed on the
surface.
[0065] In order to form relief on the surface of such crystallized
glass, firstly, as shown in FIG. 2A, a stress applying film 12
which is a film composed of inorganic material being the processing
layer, is formed on the crystallized glass 11. This stress applying
film 12 is capable of forming the compression stressed part having
a different etching rate from that of the other parts, by applying
heat and external force to the film and then cooling it down as
described above, and is for example, the glass substrate 1 or the
like being the processing object in the first embodiment.
[0066] Subsequently, as shown in FIG. 2B, the crystallized glass 11
having the stress applying film 12 formed thereon is mounted on a
female mold 13 and heat is applied so as to raise the temperature
of the stress applying film 12. The heat is applied until the
temperature of the stress applying film 12 is raised at least to a
degree where cracks are not generated when a mold 14 is pressed to
apply the external force.
[0067] When the temperature of the stress applying film 12 is
raised, consequently, the mold 14 is lowered to press the mold 14
onto the stress applying film 12. Accordingly, a compression
stressed part having the temperature raised, and corresponding to
the shape of the mold 14, is formed on the surface of the stress
applying film 12 and in the vicinity thereof.
[0068] Subsequently, the stress applying film 12 is cooled down
while pressing the mold 14 onto the stress applying film 12 and
then the mold 14 is raised. Accordingly, a compression stressed
part is formed on the surface of the stress applying film 12 and in
the vicinity thereof.
[0069] Subsequently, chemical etching is performed using the acidic
medium on the stress applying film 12 having the compression
stressed part formed thereon in this manner. Accordingly, it
becomes more difficult to etch the compression stressed part having
the lower etching rate than that of the other parts, so that the
compression stressed part remains as a projection. Then, as shown
in FIG. 2C, a relief is formed on the surface of the stress
applying film 12.
[0070] Subsequently, as shown in FIG. 2D, ion etching is performed
on the crystallized glass 11 on which is formed the stress applying
film 12 on which the relief is formed on the surface in the above
manner. This ion etching is superior in reproducibility and
uniformity, and is effective for etching an inactive material
(material which is difficult to etch by chemical etching using an
acidic medium), and is also effective for etching a composite
material. Therefore, by performing ion etching on the crystallized
glass 11 on which is formed the stress applying film 12 on which
the relief is formed on the surface, as shown in FIG. 2E, the
relief formed on the surface of the stress applying film 12 is
reflected as is onto the crystallized glass 11 thus forming the
relief on the surface of the crystallized glass 11.
[0071] In this manner, according to the process of the present
embodiment, even on the crystallized glass 11 on which it is
difficult to form the compression stressed part having the
different etching rate from that of the other parts, it becomes
possible to form a relief on the surface. Moreover, in the present
process, since a relatively small external force is applied to the
stress applying film 12 while being heated to raise the
temperature, there is no concern of cracking the stress applying
film 12 when applying the external force. Hence it is possible to
prevent cracking when forming the compression stressed part, with
higher probability, and it is possible to accurately form the
compression stressed part corresponding to the shape of the mold
14.
[0072] In the process according to the present embodiment, the
arrangement is such that the stress applying film 12 is all removed
by ion etching so as to reflect the relief formed on the surface of
the stress applying film 12 as is onto the crystallized glass 11.
However it may be such that the stress applying film 12 partially
remains as necessary.
[0073] In the process according to the present embodiment, the
arrangement may be such that the heat and the external force are
applied to the stress applying film 12 by pressing the heated mold
14 onto the stress applying film 12. In this case, for example,
after heating the stress applying film 12 by contacting with the
heated mold 14, it may be pressed. Accordingly, the heat and the
external force may be applied with a simpler construction.
[0074] In the process according to the present embodiment, the
arrangement is such that the external force is applied using the
heated mold 14. However it may be such that one or a plurality of
indenters 2 corresponding to the relief finally formed on the
surface of the crystallized glass 11, are used to apply the
external force. In this case, it may also be such that the heat and
the external force are applied to the stress applying film 12 by
pressing the indenters which have been heated hereon.
[0075] Next is a description of a third embodiment of the present
invention.
[0076] A stress applying apparatus 30 according to this embodiment,
as shown, in FIG. 3, includes; an indenter 2 which applies an
external force to the surface of the glass substrate 1 by pressing
or pressing and sweeping so as to form the compression stressed
part in a desired shape, a substrate heating device (heat source)
32 which contacts with the back face of the glass substrate to heat
the glass substrate 1, and a movable stage (driving device) 33
which moves the substrate heating device 32 having the glass
substrate 1 mounted thereon, inside a chamber 31, and a control
unit (controller) 34.
[0077] An indenter heating device 35 which heats the indenter 2,
and an indenter driving mechanism (driving device) 36 connected to
the indenter heating device 35 are provided for the indenter 2. As
shown in FIG. 4, the shape of the point of the indenter 2 is a part
of a sphere, having a radius of 0.25 mm for example.
[0078] The indenter 2, the substrate heating device 32, the movable
stage 33, the indenter heating device 35, and the indenter driving
mechanism 36 are connected to the control unit 34. The movable
stage 33 can move the substrate heating device 32 in the X and Y
axis direction, enabling forming of the compression stressed part 3
in a desired shape. The indenter driving mechanism 36 can move the
indenter in the Z axis direction, enabling adjustment of the
external force applied to the glass substrate 1. That is,
processing may be easily preformed under the desired processing
conditions by respectively controlling the abovementioned
devices.
[0079] Moreover, on the sidewall of the chamber 31 is provided an
inert gas inlet 37a which supplies inert gas to the chamber 31 from
a gas supply device (gas supply means) 37.
[0080] Next is a description of a method for processing the glass
substrate by the stress applying apparatus 30 of the present
embodiment including the above construction.
[0081] Firstly, an inert gas is introduced into the chamber 31 by a
gas supply device 37. Then, by means of the control unit 34, the
substrate heating device 32 and the indenter heating device 35 are
heated to 300.degree. C., and the indenter driving mechanism 36 is
moved in the Z axis direction so that the point of the indenter 2
is pushed into the surface of the glass substrate 1 for 1 .mu.m.
While pushing the indenter 2 in, the movable stage 33 is moved in
the X and Y axis directions by the control unit 34 to form the
desired shape. Consequently, as shown in FIG. 5, the indenter 2 is
swept on the surface of the glass substrate 1 to form the
compression stressed part 3. After forming the compression stressed
part 3, the indenter 2 is raised by means of the control unit 34.
Similarly to the first embodiment, by chemical etching, a ridge
projection 1a having the cone-shaped section as shown in FIG. 6 is
formed. In FIG. 5, the compression stressed part 3 is a straight
line for simplification.
[0082] According to the stress applying apparatus 30 according to
the present embodiment described above, since the surface of the
glass substrate 1 is heated by the substrate heating device 32 and
the indenter is heated by the indenter heating device 35, an
excellent compression stressed part 3 can be formed. Moreover, by
applying the external force to the glass substrate 1 in the inert
gas atmosphere, the indenter 2 can be kept from being oxidized so
that a more excellent compression stressed part 3 can be
formed.
[0083] Furthermore, in the stress applying apparatus 30 according
to the present embodiment, the compression stressed part 3 is
formed on the surface of the glass substrate 1. However a film may
be formed on the glass substrate 1 to form the compression stressed
part 3 thereon. Furthermore, the surface of the glass substrate 1
and the indenter 2 are heated, however a similar effect may be
obtained if the either one of them is heated. In the case where
only the indenter is heated, the arrangement may be such that the
indenter is contacted with the glass substrate to heat the glass
substrate to raise the temperature, and it is pressed
thereafter.
[0084] In the respective embodiments mentioned above, any one of an
indenter, a mold, or particles may be used for applying the
external force to the glass substrate 1. Moreover, in addition to
the spherical shape as shown in FIG. 4, the shape of the point of
the indenter 2 may be a knife edge shape as shown in FIG. 7. If the
glass substrate 1 is pressed using an indenter 2 having a partial
spherical shape at the point with a radius of 0.25 mm, then as
shown in FIG. 8, the indenter 2 is pressed into the glass substrate
1 so as to push the point of the indenter 2 in for 1 .mu.m. Then,
the indenter 2 is raised to release the pressing onto the glass
substrate 1. The indenter 2 is then moved to a predetermined
position so that the indenter is pressed again into the glass
substrate 1 so as to push the point of the indenter in for 1 .mu.m.
By repeating this, it becomes possible to form compression stressed
parts 3 in an array shape having predetermined intervals. In the
respective embodiments mentioned above, the depth of the pushed-in
indenter is controlled by position control. However it may be
controlled by pressure control.
[0085] In the processes according to the respective embodiments
mentioned above, a mold having a shape corresponding to the desired
shape may be used instead of the indenter 2. For example, as shown
FIG. 9, by pressing a mold having a toric pressing faces, toric
projections 1b can be formed on the surface of the glass substrate
1 so that a glass substrate having a desired shape formed thereon
can be obtained. Furthermore, particles 40 controlled for forming
the desired shape may be used instead of the indenter 2 or the
mold. In this case, as shown in FIG. 10, by making particles
collide onto the surface of the glass substrate 1 by a sandblasting
nozzle 41 as a particle ejecting device, a relief having a desired
shape can be formed.
[0086] Particularly, according to the present process, since the
indenter or the mold is pressed or the particles are made to
collide by the relatively small external force while the glass
substrate is heated to raise the temperature, there is no concern
of cracking and it becomes possible to easily form the compression
stressed part in a three-dimensional shape, which is suitable to
obtain a desired three-dimensional object.
[0087] Moreover, in the processes according to the respective
embodiments mentioned above, the arrangement may be such that other
methods are jointly used to further form a part having a different
etching rate from that of the other parts. For example, such other
method may be a method for forming a compression stressed part by
sweeping while pressing an indenter having a sharp point, a cutter
knife, or the like (pressing and sweeping) onto the surface of the
glass substrate. Accordingly, a similar effect may be obtained as
in the case where the indenter 2 is pressed onto the glass
substrate 1.
[0088] Furthermore, other methods also include a method of
irradiating a laser beam onto the surface of the glass substrate to
form a low density part where the so called network structure of
the glass substrate is changed to a looser condition on the surface
of the glass substrate and in the vicinity thereof. The chemical
etching is easily performed on this low density part (having a high
etching rate) so that it becomes possible to form depressions on
the surface of the glass substrate by chemical etching using the
acidic medium as mentioned above. By jointly using such other
methods, it becomes possible to form a relief having a more complex
shape on the surface of the glass substrate.
[0089] Furthermore, in the processes according to the respective
embodiments mentioned above, the heat is firstly applied to the
glass substrate 1. However the arrangement may be such that the
heat and the external force are applied to the glass substrate 1 by
pressing the heated indenter 2 or the mold 14 onto the glass
substrate 1. In this case, for example, after heating the glass
substrate 1 by contacting with the heated indenter 2 or the mold
14, it may be pressed. Accordingly, the heat and the external force
may be applied with a simpler construction. Moreover, the
arrangement may be such that the heat and the external force are
applied to the glass substrate 1 by making heated particles collide
onto the glass substrate 1. In this case, the relief can be
randomly formed on the surface of the glass substrate 1.
Furthermore, it becomes possible to increase the degree of freedom
of processing by selecting the type of particles.
[0090] Moreover, the material of the mold, the indenter, or the
particles mentioned above is preferably harder than the material of
the glass substrate 1 on which the compression stressed part 3 is
formed or the material of the film formed on the glass substrate 1.
Accordingly, since the compression stressed part can be formed with
a relatively small load, it becomes possible to prevent cracking,
with higher probability. Furthermore, it becomes possible to
suppress wear out or damage of the mold or the indenter.
[0091] Next is a specific description of when a relief is actually
formed on the surface of the glass substrate, according to the
processes according to the respective embodiments mentioned
above.
[0092] In the present example, a quartz substrate was used for the
glass substrate on which a relief is finally formed on the surface.
A film (inorganic film) being the processing layer for this quartz
substrate was formed by a reactive sputtering wherein an
appropriate amount of Al plate is arranged on the Si target and RF
sputtering was performed while appropriately introducing oxygen.
The conditions were such that two sheet of 20 mm.times.40 mm Al
plates were arranged on the Si target making the area ratio between
Si and Al approximately 1:1, the amount of Ar gas introduced was 20
cm.sup.3/min, the amount of oxygen gas introduced was 6
cr.sup.3/min, the sputtering pressure was 0.2 Pa, and RF power was
1 kW, to form a film for 120 minutes.
[0093] The film formed in such a manner was analyzed to find out
that the film thickness was 2600 nm and the atomic ratio between Si
and Al was Si:Al=54:46.
[0094] The next process was for forming the compression stressed
part on the film layer formed on the quartz substrate. The process
for forming the compression stressed part on this film layer so as
to form relief on the surface of the film layer by chemical etching
using an etching reagent was in accordance with the process
according to the first embodiment.
[0095] FIG. 11 shows an example of an apparatus for forming the
compression stressed part on the surface of the film layer formed
on the quartz substrate, and in the vicinity thereof.
[0096] In the apparatus shown in FIG. 11, the arrangement is such
that a forming chamber constituted by silica tubes 21 or the like,
is made a nitrogen atmosphere, a quartz substrate 23 having a film
layer 22 formed thereon is mounted on a female mold 24, and the
temperature in the forming chamber is increased or decreased by a
lamp heater 25 so as to heat or cool the film layer 22. Moreover,
the pressing face of an indenter 26 has a toric shape having a 2.0
mm outer diameter and a 1.95 mm inner diameter.
[0097] Using such apparatus, firstly the film layer 22 formed on
the quartz substrate 23 was heated to 350.degree. C. in the
nitrogen atmosphere. Then, the indenter 26 was lowered onto the
film layer 22 to apply a load of 294 N (pressure 1.89 GPa) for 300
sec. Then, while applying the load of 294 N, the film layer 22 was
cooled down to 200.degree. C. and the indenter 26 was raised to
release the load. The quartz substrate 23 having the film layer 22
formed thereon was taken out to measure the surface, to find out
that a compression stressed part having a 400 nm dent was formed on
the surface of the film layer 22 and in the vicinity thereof.
[0098] Subsequently, 2 .mu.m of chemical etching was performed by
soaking the quartz substrate on which the film layer formed with
the compression stressed part was formed into hydrogen fluoride.
The surface of the film layer formed on the quartz substrate
obtained in this way was measured by a step meter, to find out that
a 800 nm height of a caldera-shaped projection having a cone-shaped
section was formed along the part having the compression stressed
part formed on the surface.
[0099] Subsequently, ion etching by ion milling was performed on
the quartz substrate on which the film layer having such a
projection was formed. The conditions were such that the quartz
substrate formed with the film layer was set in a vacuum chamber,
the pressure was decreased to 4.0.times.10.sup.-5 Pa, and then ion
beams were irradiated to perform the ion etching, where the
acceleration voltage was made 600 V, the acceleration current was
made 120 mA, and the deceleration voltage was made -200 V. The ion
incidence angle at this time was 30 degrees and the processing face
was controlled to face downwards, and the etching was performed for
60 minutes. By such ion etching, a 1150 nm height of caldera-shaped
projection was formed on the quartz substrate. In the present
example, since the etching rate of the quartz substrate was as high
as 49 nm/min compared to 33 nm/min for the etching rate of the film
layer, the height of the projection formed on the surface of the
quartz substrate after ion etching became higher compared to the
height of the projection formed on the surface of the film layer
before ion etching. Similarly, in the case where a high aspect
ratio shaped projection is formed on the surface of crystallized
glass substrate formed with the film layer, glass having a high
etching rate is preferably used as the crystallized glass.
[0100] In the present example, the film was formed by the method
described above. However, DC sputtering, ion beam sputtering may of
course be applied. In addition, an evaporation method, a CVD method
(chemical vapor deposition method), or the like may be also
applied. Moreover, regarding the film forming material, in addition
to the abovementioned materials, it is possible for example to
arrange a Si wafer on an Al target, or make a mixed target of Si
and Al, or use an oxidized substance for the film forming material
instead of using reactive deposition method. Furthermore, regarding
the control method of the composition ratio, in addition to the
abovementioned control method by area ratio, a control method by
the mixing ratio of the film forming material, or a control method
by the input power after preparing the target, the evaporation
source, the power source, and the ion gun separately for Si and Al,
may be applied.
[0101] In the present example, the ion etching was performed by the
method described above. However it is also possible to perform ion
etching by applying various methods such as RIE (reactive ion
etching); and the like. Moreover, by controlling the etching time
according to the purpose of use, it is also possible to form a
projection composed of the film layer and the quartz substrate.
[0102] Moreover, since the above processes have a characteristic to
form the compression stressed part by applying heat and external
force and then cooling it down, it is possible to form not only
small compression stressed parts but also relatively large
compression stressed part. Accordingly the optical element obtained
is not only limited to of a minute size, but also relatively large
one. The shape of the surface of the glass substrate may be not
only planar but also curved as long as an external force can be
applied thereon.
[0103] Furthermore, using the process for forming a relief on the
surface of the glass substrate, a microchemical chip (chip member
for a microchemical system) can also be obtained. As shown in FIG.
12A, a microchemical chip 50 is a device on which dents and ditches
are formed for enabling various chemical operations on the
substrate, and is made by a method such as photolithography. A
ditch 51 having a minute pattern is extremely thin so that an
amount of solution flowing in this ditch 51 is extremely small.
Accordingly, surface tension or the like have an affect to increase
the passage resistance, obstructing the flow. Therefore, minute
projections 52 are distributedly formed on the bottom of the ditch
51 in order to solve this problem. For this purpose, the relief
forming method according to the method of the present invention may
be preferably employed.
[0104] For example, a resist is used for forming the dent and the
ditch. As shown in FIG. 12B, an inorganic film 54 composed of a
chemically stable material is provided on a substrate 53 and an
indenter 56 is pressed onto the desired region for forming the dent
and the ditch, so as to form the compression stressed part 57.
Then, a resist 55 is provided to open the desired region for
forming the dent and the ditch. The etching is performed
thereafter. Accordingly, the opening is etched so that the ditch 51
is formed and the projections 52 are formed in locations
corresponding to the compression stressed parts 57 inside the
opening, which contribute to reduce the passage resistance. That
is, this method becomes a hybrid method combined with the
conventional photolithography. In this manner, using the above
processing method, compared to the conventional press processing,
it is only needed to raise the temperature to a degree so as not to
generate cracks on the surface of the glass substrate, so that it
becomes unnecessary to raise the temperature for processing.
Accordingly, the mold, the indenter, and the like may be kept from
being deteriorated by heat. As the method for forming the passage
pattern the indenter 2 may be swept to form into a desired shape.
The passage in this case becomes the bank shape as shown in FIG.
13.
[0105] In conclusion, as described in detail, according to the
present invention, since the compression stressed part is formed by
applying the relatively small external force to the glass substrate
while being heated to raise the temperature and then cooling it
down, it is possible to prevent cracking when forming the
compression stressed part, with higher probability. Moreover, the
processed glass product obtained by the processing method according
to the present invention is not only limited to minute optical
elements, but also relatively large ones.
[0106] Furthermore, while the processing method for glass
substrate, of the present invention and the processed glass product
obtained by the processing method thereof have been described in
detail, the present invention is not to be considered as being
limited by the forgoing embodiments. Various modifications and
alternation can be made without departing from the spirit or scope
of the present invention.
[0107] As explained above, by forming a desired relief on the
surface of a glass substrate, the present invention is suitable for
making for example; a spacer, a high aspect ratio optical
component, an R surface DOE (Diffractive Optical Element), a
three-dimensional shaped object, a microlens array, a photonic
crystal, a microprism, a grating, a microchemical chip, and the
like.
[0108] As explained above, the present inventors have earnestly
carried out research, resulting in the finding such that the
cracking of glass substrate can be prevented with high probability
if a compression stressed part having a different etching rate from
that of the other parts with respect to the etching reagent to be
used, is formed on the surface of glass substrate and in the
vicinity thereof by applying heat and a relatively small external
force to the glass substrate and then cooling it down. A further
finding is that, regarding the application of heat and external
force, there is a preferable range of temperature and external
force wherein the cracking of glass substrate can be prevented with
higher probability. The present invention has been completed based
on such findings.
[0109] A first aspect of the present invention includes: applying
heat and external force to a glass substrate and then cooling it
down to thereby form a compression stressed part having a different
etching rate from that of other parts with respect to an etching
reagent to be used, on the surface of the glass substrate and in
the vicinity thereof; and performing chemical etching using the
etching reagent on the glass substrate having the compression
stressed part formed thereon, so as to form a relief on the surface
of the glass substrate.
[0110] According to this invention, since the compression stressed
part is formed by applying a relatively small external force to the
glass substrate while being heated to raise the temperature, and
then cooling it down, there is no concern of cracking when applying
the external force and it is possible to prevent cracking when
forming the compression stressed part, with higher probability.
[0111] A second aspect of the present invention includes: forming a
film composed of one or more layers of inorganic material on a
glass substrate; applying heat and external force to the film and
then cooling it down to thereby form a compression stressed part
having a different etching rate from that of other parts with
respect to an etching reagent to be used, on the surface of the
film and in the vicinity thereof; and performing chemical etching
using the etching reagent on the film having the compression
stressed part formed thereon, so as to form a relief on the surface
of the film.
[0112] According to this invention, since the compression stressed
part is formed by applying a relatively small external force to the
film composed of inorganic material while being heated to raise the
temperature, and then cooling it down, there is no concern of
cracking when applying the external force, and it is possible to
prevent cracking when forming the compression stressed part, with
higher probability.
[0113] A third aspect of the present invention includes, in the
second aspect, performing etching on the glass substrate having the
film with the relief formed on the surface, formed thereon, so as
to form a relief on the surface of the glass substrate.
[0114] According to this invention, by performing etching such as
ion etching which is superior in reproducibility and uniformity,
the relief formed on the surface of the film can be reflected as is
onto the surface of the glass substrate. Therefore, by forming the
compression stressed part on the film while taking into
consideration the relief to be formed on the surface of the glass
substrate, it becomes possible to form the desired relief on the
surface of the glass substrate. The present aspect is effective for
example in the case where the glass substrate is a material for
which it is difficult to form the compression stressed part.
[0115] A fourth aspect of the present invention is characterized in
that, in the third aspect, a projection formed on the surface of
the glass substrate is composed of the glass substrate, or the
glass substrate and the film.
[0116] According to this invention, the projection composed of only
glass substrate or the projection composed of the glass substrate
and the film are formed on the surface of the glass substrate.
[0117] A fifth aspect of the present invention is characterized in
that, in the fourth aspect, a material having a higher etching rate
than that of the film is used for the glass substrate.
[0118] According to this invention, since the glass substrate is
etched more rapidly than the film, then for example a projection
having a high aspect ratio shape can be formed on the surface of
the glass substrate.
[0119] A sixth aspect of the present invention is characterized in
that, in any one of the first through fifth aspects, the external
force is applied by pressing a mold having a desired shape.
[0120] According to this invention, since a three-dimensional
compression stressed part corresponding to the shape of the mold
can be formed, it is possible to obtain a three-dimensional object
as a processed glass substrate.
[0121] A seventh aspect of the present invention is characterized
in that, in the sixth aspect, the heat and external force are
applied by pressing the mold which has been heated.
[0122] According to this invention, it becomes possible to apply
heat and external force to the film formed on the glass substrate
or the glass substrate, with a simpler construction.
[0123] An eighth aspect of the present invention is characterized
in that, in either one of the sixth and the seventh aspects, the
material of the mold is harder than the material of a part of the
glass substrate or the material of film formed on the glass
substrate, to which the heat and external force are applied.
[0124] According to this invention, when the heat and the external
force are applied to the glass substrate or the film, the hardness
of the glass substrate or the film which forms the compression
stressed part is reduced below the hardness at room temperature.
Since at this time the compression stressed part can be formed with
a relatively small load by forming the compression stressed part on
the surface of the glass substrate or the surface of the film by
the mold of a material having a higher hardness than that of the
glass substrate or the film, it is becomes possible to prevent
cracking, with higher probability. Moreover, it becomes possible to
suppress wear out or damage of the mold.
[0125] A ninth aspect of the present invention is characterized in
that, in any one of the first through fifth aspects, the external
force is applied by pressing an indenter.
[0126] According to this invention; since the compression stressed
part is formed on the part where the indenter was pressed, it is
possible to obtain a desired shaped object as a processed glass
substrate.
[0127] A tenth aspect of the present invention is characterized in
that, in the ninth aspect, the heat and external force are applied
by pressing the indenter which has been heated.
[0128] According to this invention, it becomes possible to apply
the heat and the external force to the glass substrate with a
simpler construction.
[0129] An eleventh aspect of the present invention is characterized
in that, in either one of the ninth and tenth aspects, the external
force is applied by pressing and sweeping the indenter.
[0130] According to this invention, since the external force is
applied by pressing and sweeping the indenter, it becomes possible
to prevent cracking when forming the compression stressed part,
with higher probability, and to form the desired shaped compression
stressed part easily.
[0131] A twelfth aspect of the present invention is characterized
in that, in any one of the ninth through eleventh aspects, a point
of the indenter is in the shape of part of a sphere.
[0132] According to this invention, since the point of the indenter
is in the shape of part of a sphere, when pressing the indenter
onto the surface of the glass substrate or the surface of the film,
it becomes possible to ensure the contact area of the indenter with
the surface of glass substrate or the surface of the film, so that
the pressure applied to the surface of glass substrate or the
surface of the film can be easily controlled.
[0133] A thirteenth aspect of the present invention is
characterized in that, in any one of the ninth through eleventh
aspects, a point of the indenter is in a knife edge shape.
[0134] According to this invention, since the point of the indenter
is in a knife edge shape, the indenter can be easily swept in a
fixed direction.
[0135] A fourteenth aspect of the present invention is
characterized in that, in any one of the ninth through thirteenth
aspects, the indenter is multiply provided.
[0136] According to this invention, a plurality of projections can
be formed on the surface of the glass substrate or the surface of
the film by one pressing operation.
[0137] A fifteenth aspect of the present invention is characterized
in that in any one of the ninth through fourteenth aspects, the
material of the indenter is harder than the material of a part of
the glass substrate or the material of film formed on the glass
substrate, to which the heat and external force are applied.
[0138] According to this invention, since the compression stressed
part can be formed with a relatively small load by forming the
compression stressed part on the surface of the glass substrate or
the surface of the film by the indenter of a material having a
higher hardness than that of the glass substrate or the film, when
the heat and the external force are applied to the glass substrate
or the film, it becomes possible to prevent cracking, with higher
probability. Moreover, it becomes possible to suppress wear out or
the damage of the indenter.
[0139] A sixteenth aspect of the present invention is characterized
in that, in any one of the first through fifth aspects, the
external force is applied by making particles collide.
[0140] According to this invention, by selecting particles having
different diameters or material, it becomes possible to form the
compression stressed part corresponding to the characteristics of
the particle.
[0141] A seventeenth aspect of the present invention is
characterized in that, in the sixteenth aspect, the heat and
external force are applied by making the particles which have been
heated collide.
[0142] According to this invention, it becomes possible to apply
the heat and the external force to the glass substrate with a
simpler construction.
[0143] An eighteenth aspect of the present invention is
characterized in that, in either one of the sixteenth and
seventeenth aspects, the particles are controlled to collide so as
to make the compression stressed part into a desired shape.
[0144] According to this invention; by selectively making the
particles collide on the surface of glass substrate or the surface
of the film, it becomes possible to form the compression stressed
part in a desired shape.
[0145] A nineteenth aspect of the present invention is
characterized in that, in any one of the sixteenth through
eighteenth aspects, the material of the particle is harder than the
material of a part of the glass substrate or the material of film
formed on the glass substrate, to which the heat and external force
are applied.
[0146] According to this invention, since the compression stressed
part can be formed with a relatively small load by forming the
compression stressed part on the surface of glass substrate or the
surface of the film by the particles of a material having a higher
hardness than that of the glass substrate or the film, when the
heat and the external force are applied to the glass substrate or
the film, it is becomes possible to prevent cracking, with higher
probability.
[0147] A twentieth aspect of the present invention is a processed
glass product wherein a relief is formed on the surface by the
processing method of any one of the first through nineteenth
aspects.
[0148] A twenty-first aspect of the present invention is
characterized in that, in the twentieth aspect, the processed glass
product is a chip member for a microchemical system.
[0149] According to the twentieth and twenty-first aspects of the
invention, it is possible to provide a processed glass product such
as a chip member for a microchemical system, wherein no cracking is
found in the processed part and the properties of the unprocessed
part are not changed.
[0150] A twenty-second aspect of the present invention includes: an
indenter which applies an external force by pressing or pressing
and sweeping onto the surface of a glass substrate or a film formed
on the glass substrate so as to form a compression stressed part of
a desired shape, a heat source which heats at least one of the
surface of the glass substrate or the surface of the film, and the
indenter; a driving device which moves at least one of the indenter
and the glass substrate; and a controller which controls the
driving device and the heat source.
[0151] According to this invention, the driving device is
controlled by the controller to relatively move the indenter and
the glass substrate and to press or press and sweep the indenter so
that the external force is applied onto the glass substrate or the
film so as to form a desired shape. At this time, since at least
one of the surface of the glass substrate or the surface of the
film, and the indenter is heated, it becomes possible to form an
excellent compression stressed part.
[0152] A twenty-third aspect of the present invention includes: a
mold which applies an external force by pressing onto the surface
of a glass substrate or a film formed on the glass substrate so as
to form a compression stressed part of a desired shape; a heat
source which heats at least one of the surface of the glass
substrate or the surface of the film, and the mold; a driving
device which moves at least one of the mold and the glass
substrate; and a controller which controls the driving device and
the heat source.
[0153] According to this invention, the driving device is
controlled by the controller to relatively move the mold and the
glass substrate and to press the mold so that the external force is
applied onto the glass substrate or the film so as to form a
desired shape. At this time, since at least one of the surface of
the glass substrate or the surface of the film, and the mold is
heated, it becomes possible to form an excellent compression
stressed part.
[0154] A twenty-fourth aspect of the present invention includes: a
particle ejecting device which ejects particles onto the surface of
a glass substrate or a film formed on the glass substrate so as to
form a compression stressed part of a desired shape; a heat source
which heats at least one of the surface of the glass substrate or
the surface of the film and the particles; a driving device which
moves at least one of the particle ejecting device and the glass
substrate; and a controller which controls the driving device and
the heat source.
[0155] According to this invention, the driving device is
controlled by the controller to relatively move the particle
ejecting device and the glass substrate and to eject particles from
the particle ejecting device, to thereby apply an external force
onto the glass substrate or the film so as to form a desired shape.
At this time, since at least one of the surface of the glass
substrate or the surface of the film, and the particles is heated,
it becomes possible to form an excellent compression stressed
part.
[0156] A twenty-fifth aspect of the present invention is
characterized in that in any one of the twenty-second through
twenty-fourth aspects, there is provided a gas supply device which
supplies an inert gas into a chamber accommodating the glass
substrate.
[0157] According to this invention, by applying the external force
to the glass substrate in an inert gas atmosphere, the indenter, me
mold, the particle ejecting device, and other members constituting
the stress applying apparatus can be kept from being oxidized, so
that a more excellent compression stressed part can be formed.
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