U.S. patent application number 12/071327 was filed with the patent office on 2008-08-28 for multi-wavelength led construction & manufacturing proces.
This patent application is currently assigned to Taiwan Oasis Technology Co., Ltd.. Invention is credited to Chang-Wei Ho, Ming-Shun Lee.
Application Number | 20080207078 12/071327 |
Document ID | / |
Family ID | 37717048 |
Filed Date | 2008-08-28 |
United States Patent
Application |
20080207078 |
Kind Code |
A1 |
Lee; Ming-Shun ; et
al. |
August 28, 2008 |
Multi-wavelength LED construction & manufacturing proces
Abstract
A multi-wavelength LED construction and its manufacturing
process having respectively coated on the base layer and the
position above the peripheral of the light emitting chip a
fluorescent material of a specific wavelength to be excited to
provide higher light emitting efficiency and expected light color
without mutual interference when the chip is conducted so to
facilitate quality control of the multi-wavelength LED.
Inventors: |
Lee; Ming-Shun; (Taipei,
TW) ; Ho; Chang-Wei; (Taipei, TW) |
Correspondence
Address: |
TROXELL LAW OFFICE PLLC
SUITE 1404, 5205 LEESBURG PIKE
FALLS CHURCH
VA
22041
US
|
Assignee: |
Taiwan Oasis Technology Co.,
Ltd.
|
Family ID: |
37717048 |
Appl. No.: |
12/071327 |
Filed: |
February 20, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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11196431 |
Aug 4, 2005 |
|
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12071327 |
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Current U.S.
Class: |
445/50 |
Current CPC
Class: |
H01L 2924/181 20130101;
H01L 2924/181 20130101; H01L 2224/73265 20130101; H01L 2924/00012
20130101; H01L 2924/00014 20130101; H01L 2224/48257 20130101; H01L
2224/8592 20130101; H01L 2224/48091 20130101; H01L 33/504 20130101;
H01L 2224/48091 20130101; H01L 2224/48247 20130101 |
Class at
Publication: |
445/50 |
International
Class: |
H01J 9/02 20060101
H01J009/02 |
Claims
1-2. (canceled)
3. A manufacturing process of the multi-wavelength LED includes the
following steps: a. The first type of fluorescent material of
comparatively longer wavelength is mixed with a gel to become a
chip mounting gel to be coated in a carrier of the light-emitting
chip; b. The light-emitting chip is fixed in the chip mounting get
and baked in positions; c. The light-emitting chip and multiple
electrodes are joined; d. The second type of fluorescent material
of comparatively shorter wavelength is mixed with the gel to become
a fluorescent gel to be poured into the position above the
peripheral of the light-emitting chip; and e. Finally, the
fluorescent gel is baked in the oven.
4-6. (canceled)
7. A manufacturing process of the multi-wavelength LED includes the
following steps: a. The first type of fluorescent material of
comparatively longer wavelength is mixed with a gel to become a
chip mounting gel to be coated in a carrier of the light-emitting
chip; b. The light-emitting chip is fixed in the chip mounting gel
and baked in position; c. The light-emitting chip and multiple
electrodes are joined; d. The second and the third type of
fluorescent materials each of comparatively shorter wavelength are
mixed with the gel to become a fluorescent gel to be poured into
the position above the peripheral of the light-emitting chip; and
e. Finally, the fluorescent gel is baked in the oven.
8-10. (canceled)
11. A manufacturing process of the multi-wavelength LED includes
the following steps: a. The first and the second types of
fluorescent materials each of comparatively longer wavelength are
respectively mixed with a gel to produce separate gel cakes; b.
Both gel cakes are placed into the carrier of the light-emitting
chip in sequence, followed with the placement of the light-emitting
chip to be baked in position; c. The light-emitting chip and
multiple electrodes are joined; d. The third type of fluorescent
material of comparatively shorter wavelength is mixed with the gel
to become a fluorescent gel to be poured into the position above
the peripheral of the light-emitting chip; and e. Finally, the
fluorescent gel is baked in position.
12. A manufacturing process of the multi-wavelength LED includes
the following steps: a. The first and the second types of
fluorescent materials each of comparatively longer wavelength are
respectively mixed with a gel to produce separate gel cakes; b.
Both gel cakes respectively made of the first and the second types
of fluorescent materials are baked into position with the chip to
become a semi-product; c. The semi-product is placed into the
carrier of the light-emitting chip and baked in position; d. The
light-emitting chip and multiple electrodes are joined; e. The
third type of fluorescent material of comparatively shorter
wavelength is mixed with the gel to become a fluorescent gel to be
poured into the position above the peripheral of the light-emitting
chip; and f. Finally, the fluorescent gel is baked in the oven.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the Invention
[0002] The present invention is related to an art of presenting LED
light emitting efficiency and light color, and more particularly,
to a multi-wavelength LED construction and its manufacturing
process that produce highly light emitting efficiency and accurate
gloss.
[0003] (b) Description of the Prior Art
[0004] As illustrated in FIG. 1 for a schematic view of a basic
construction of a multi-wavelength LED of the prior art, a chip
mounting gel 40 is used to place a light-emitting chip 10 in a bowl
shaped carrier 20; a golden plated wire 30 constitutes the
connection between the blue light emitting chip 10 and two
electrodes 21; and a fluorescent gel 50 containing fluorescent
powders is applied to cover up the light-emitting chip 10. When the
light-emitting chip 10 is conducted, the fluorescent powders in the
fluorescent gel 50 are excited by the light source from the
light-emitting chip 10 to emit the light in an expected color.
[0005] Generally, a blue chip is used in the multi-wavelength LED
to excite yellow fluorescent powders 51 mixed in the fluorescent
gel 50 to produce pseudo-white light that looks light white light.
However, the prior art relies upon only fluorescent powders in a
straight color as the complementary light excited by the
light-emitting chip, the resultant pseudo-white gloss is poor and
blamed for yellow halo phenomenon. To correct, two types of
fluorescent powders in different colors are mixed in the
fluorescent gel for the multi-wavelength LED. Usually, a blue chip
is used to excite red fluorescent powders 52 and green fluorescent
53 mixed in the fluorescent gel 50 for the red light and the green
light to incorporated with the blue light of the light-emitting
chip 10 for obtaining RGB mixing results to produce the light color
that is with higher color development properties and closer to the
white light. However, the amount and proportion of the fluorescent
powders in different colors prevent easy control for effective
control of the quality of the finished product; and interference
exists due to that different colors of fluorescent powders are
excited at the same position at the same time by the light source
from the light-emitting chip. That is, the energy for the
fluorescent powder of shorter wavelength will be absorbed by that
of longer wavelength to prevent estimate of their consumption
ratio, and thus to fail the expected color deflection for
presenting the accurate expected light color. Furthermore, the
fluorescent powder of shorter wavelength emits light of slightly
longer wavelength which in turn excites the fluorescent powder to
emit light of even longer wavelength thus to compromise the light
emitting efficiency to produce light at lower luminance.
SUMMARY OF THE INVENTION
[0006] The primary purpose of the present invention is to provide a
construction of a multi-wavelength LED and its manufacturing
process to provide higher light emitting efficiency and expected
light color without mutual interference when the chip is conducted
so to facilitate quality control of the multi-wavelength LED. To
achieve the purpose, the present invention has respectively coated
on the base layer and the position above the peripheral of the
light emitting chip a fluorescent material of a specific wavelength
to be excited allowing easy control of the amount and ratio of the
fluorescent powders at different positions.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a schematic view showing a construction of a
multi-wavelength LED of the prior art.
[0008] FIG. 2 is a schematic view showing a construction of a
multi-wavelength LED of another prior art.
[0009] FIG. 3 is a schematic view showing a construction of a
multi-wavelength LED of a first preferred embodiment of the present
invention.
[0010] FIG. 4 is a schematic view showing a construction of a
multi-wavelength LED of a second preferred embodiment of the
present invention.
[0011] FIG. 5 is a schematic view showing a construction of a
multi-wavelength LED of a third preferred embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] Referring to FIG. 3, a first preferred embodiment of the
present invention, a construction of a multi-wavelength LED has a
chip mounting gel 40 to place a light-emitting chip 10 in a carrier
20; a golden plated wire 30 constitutes the connection between the
blue light emitting chip 10 and two electrodes 21; and a
fluorescent gel 50 containing fluorescent powders is applied to
cover up the light-emitting chip 10. When the light-emitting chip
10 is conducted, the fluorescent powders in the fluorescent gel 50
are excited by the light source from the light-emitting chip 10 to
emit the light in an expected color.
[0013] Wherein, the base layer and the peripheral of the
light-emitting chip 10 are respectively coated with one or a
plurality of fluorescent material of a given wavelength. When the
light-emitting chip is conducted, the fluorescent materials are
respectively excited to emit the light with expected color without
mutual interference. The process not only achieves the higher light
emitting efficiency and correct color of light emitted, but also
allows easy control of the amount and proportion of the fluorescent
materials at different positions to facilitate the quality control
of the multi-wavelength LED and significantly increase its
production capacity.
[0014] FIGS. 3, 4 and 5 show three constructional types of the
present invention. As illustrated in FIG. 3, a first preferred
embodiment of the present invention has at the base layer of the
light-emitting chip 10 (the position of the chip mounting gel 40 as
illustrated) is covered up with a first fluorescent material 61 of
comparatively longer wavelength, and the position above the
peripheral of the light-emitting chip 10 (the position of the
fluorescent gel 50 as illustrated) is covered up with a second type
of the fluorescent material 62 of comparatively shorter wavelength.
In practice, the light-emitting chip 10 relates to a blue chip and
its base layer is covered up with red fluorescent material while
the position above the peripheral of the light-emitting chi 10 is
covered up with green fluorescent material to constitute a
light-emitting diode of white light. The manufacturing process of
the first preferred embodiment has the first fluorescent material
of comparatively longer wavelength mixed with the gel to become the
chip mounting gel. The fluorescent get is then coated on the
carrier of the light-emitting chip. The light-emitting chip is
secured in the chip mounting gel and baked in position. The golden
plated wire connects the light-emitting chip and the electrodes.
The second type of fluorescent material of the comparatively
shorter wavelength is also mixed with the gel to become a
fluorescent gel. The gel is poured into the position above the
peripheral of the light-emitting chip and baked in the oven.
[0015] As illustrated in FIG. 4, a second preferred embodiment of
the present invention has the base layer of the light-emitting chip
10 (the position of the chip mounting gel 40 as illustrated)
covered with the first type of fluorescent material 61 of a
comparatively longer wavelength, and the position above the
peripheral of the. light-emitting chip 10 (the position of the
fluorescent gel 50 as illustrated) is covered with a second and a
third types of fluorescent materials 62, 63 each of a comparatively
shorter wavelength. Wherein, the wavelength of the third type of
fluorescent material 63 is shorter than that of the first type and
longer than that of the second type of fluorescent materials 61,62.
In practice, the light-emitting chip 10 relates to a blue chip. The
base layer of the light-emitting chip is covered with red
fluorescent material, and the position above the peripheral of the
light-emitting chip is covered with green and yellow fluorescent
materials to constitute a white light-emitting diode. In the
manufacturing process of the second preferred embodiment of the
present invention, the first type of the fluorescent material of
comparatively longer wavelength is mixed with the gel to become the
chip mounting gel to be coated in the carrier of the light-emitting
chip. The golden plated wire connects the light-emitting chip and
the electrodes. The second and the third types of fluorescent
materials each of the comparatively shorter wavelength are also
mixed with the gel to become a fluorescent gel. The gel is poured
into the position above the peripheral of the light-emitting chip
and baked in the oven.
[0016] A third preferred embodiment of the present invention as
illustrated in FIG. 5 has the base layer of the light-emitting chip
10 (the position of the chip mounting gel 40 as illustrated)
covered with the first and the second types of fluorescent material
61, 62 each of a comparatively longer wavelength, and the position
above the peripheral of the light-emitting chip 10 (the position of
the fluorescent gel 50 as illustrated) is covered with a third type
of fluorescent material 63 of comparatively shorter wavelength.
Wherein, the wavelength of the third type of fluorescent material
63 is shorter than that of the first type 61 and longer than that
of the second type of fluorescent material 62. In practice, the
light-emitting chip 10 relates to a blue chip. The base layer of
the light-emitting chip is covered with red and yellow fluorescent
materials, and the position above the peripheral of the
light-emitting chip is covered with green fluorescent material to
constitute a white light-emitting diode. In the manufacturing
process of the third preferred embodiment of the present invention,
the first and the second types of the fluorescent materials each of
comparatively longer wavelength are mixed with the gel to become
the chip mounting gel to be coated in the carrier of the
light-emitting chip. The golden plated wire connects the
light-emitting chip and the electrodes. The third type of
fluorescent material of the comparatively shorter wavelength is
also mixed with the gel to become a fluorescent gel. The gel is
poured into the position above the peripheral of the light-emitting
chip and baked in the oven.
[0017] Alternatively, the first and the second fluorescent
materials each of longer wavelength are respectively mixed with the
gel to produce separate gel cakes. Both gel cakes are then
respectively baked in the oven with the chip to produce separate
semi-products. Both semi-products are then placed in the carrier of
the light-emitting chip and baked in sequence. The golden plated
wire connects the light-emitting chip and the electrodes. The third
type of fluorescent material of the comparatively shorter
wavelength is also mixed with the gel to become a fluorescent gel.
The gel is poured into the position above the peripheral of the
light-emitting chip and finally baked in the oven.
[0018] The prevent invention provides an improved construction of a
multi-wavelength LED and its manufacturing process, and this
application is duly filed accordingly. However, it is to be noted
that that the preferred embodiments disclosed in the specification
and the accompanying drawings are not limiting the present
invention; and that any construction, installation, or
characteristics that is same or similar to that of the present
invention should fall within the scope of the purposes and claims
of the present invention.
* * * * *