U.S. patent application number 11/817192 was filed with the patent office on 2008-08-14 for test handler having size-changeable test site.
This patent application is currently assigned to TECHWING CO., LTD.. Invention is credited to In Gu Jeon, Yun Sung Na, Jae Gyun Shim.
Application Number | 20080191687 11/817192 |
Document ID | / |
Family ID | 36927845 |
Filed Date | 2008-08-14 |
United States Patent
Application |
20080191687 |
Kind Code |
A1 |
Shim; Jae Gyun ; et
al. |
August 14, 2008 |
Test Handler Having Size-Changeable Test Site
Abstract
A test handler (122) of the present invention includes a main
body, a window (142) formed on a surface of the main body and
having a size corresponding to a Hi-Fix board of M.times.N array
(where M and N represent an integer greater than a value of =), a
cover (170) detachably fixed to the main body t close a part of the
window and convert the window into the test site having a size
corresponding to a [M-A).times.(n-B)] Hi-Fix board (where A is an
integer equal to ot greater than 0 but smaller than M, and B is an
integer having a value other than 0). In the test handler, the size
of window is easily modified to adapt that of the Hi-Fix board of
M.times.N array by closing or opening a part of the window using
the cover. Therefore, the test handler is capable of applying
Hi-Fix boards having different sizes.
Inventors: |
Shim; Jae Gyun;
(Gyeonggi-do, KR) ; Na; Yun Sung;
(Chungcheongnam-do, KR) ; Jeon; In Gu;
(Gyeonggi-do, KR) |
Correspondence
Address: |
ANDERSON, KILL & OLICK, P.C.
1251 AVENUE OF THE AMERICAS
NEW YORK,
NY
10020-1182
US
|
Assignee: |
TECHWING CO., LTD.
Gyeonggi-do
KR
|
Family ID: |
36927845 |
Appl. No.: |
11/817192 |
Filed: |
February 27, 2006 |
PCT Filed: |
February 27, 2006 |
PCT NO: |
PCT/KR2006/000669 |
371 Date: |
August 27, 2007 |
Current U.S.
Class: |
324/757.01 |
Current CPC
Class: |
G01R 31/2893
20130101 |
Class at
Publication: |
324/158.1 |
International
Class: |
G01R 31/26 20060101
G01R031/26 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 28, 2005 |
KR |
20-2005-0005351 |
May 23, 2005 |
KR |
10-2005-0042857 |
Dec 7, 2005 |
KR |
10-2005-0118487 |
Claims
1. A test handler comprising: a main body; a window formed on a
surface of the main body and having a size corresponding to a
Hi-Fix board of M.times.N array (where M and N represent an integer
greater than a value of 0); and a cover detachably fixed to the
main body to close a part of the window and convert the window into
a test site having a size corresponding to a [(M-A).times.(N-B)]
Hi-Fix board (where A is an integer equal to or greater than 0 but
smaller than M, and B is an integer equal to or greater than 0 but
smaller than N, and where at least one of A and B is an integer
having a value other than 0).
2-3. (canceled)
4. The test handler of claim 1 wherein the window is converted into
a test site corresponding to the M.times.N Hi-Fix board by
separating the cover from the main body.
5. The test handler of claim 1, wherein M, N, A and B have a value
of 8, 20, 0 and 4, respectively.
6. The test handler of claim 5, further comprising an 8.times.20
test tray installed in the window.
7. The test handler of claim 6, wherein 128 inserts in a matrix of
8 rows and 16 columns are arranged on the entire area of the
8.times.20 test tray except on the first three columns of the test
tray from the cover and on the first column from the opposite side,
and all of the 128 inserts are exposed through the test site.
8. The test handler of claim 6, wherein 160 inserts in a matrix of
8 rows and 20 columns are arranged on the entire area of the
8.times.20 test tray.
9. The test handler of claim 8, wherein at least 128 inserts among
the 160 inserts are exposed through the test site, and the rest 32
inserts are at least partially closed by the cover.
10. The test handler of claim 8, wherein all of the 160 inserts are
exposed through the window if the cover is removed.
11. A test handler comprising: a main body; a plurality of windows
formed on a surface of the main body, each of which has a size
corresponding to a Hi-Fix board of M.times.N array (where M and N
represent an integer greater than a value of 0) and corresponds to
a test tray; and a cover detachably fixed to the main body to close
parts of the windows and convert each of the windows into a test
site having a size corresponding to a [(M-A).times.(N-B)] Hi-Fix
board (where A is an integer equal to or greater than 0 but smaller
than M, and B is an integer equal to or greater than 0 but smaller
than N, and where at least one of A and B is an integer having a
value other than 0), the cover supporting the [(M-A).times.(N-B)]
Hi-Fix boards.
12. The test handler of claim 11, wherein the cover is a plate
member having a central opening.
13. The test handler of claim 11, wherein the cover is a
rectangular plate member.
14. The test handler of claim 11, wherein each of the windows is
converted into a test site corresponding to the M.times.N Hi-Fix
board by separating the cover from the main body.
15. The test handler of claim 11, wherein a test tray used in
testing semiconductor devices with the M.times.N Hi-Fix board has
the same outer size as a test tray used in testing semiconductor
devices with the [(M-A).times.(N-B)] Hi-Fix board.
16. The test handler of claim 15, wherein the test tray used in
testing semiconductor devices with the [(M-A).times.(N-B)] Hi-Fix
board has inserts at portions corresponding to the
[(M-A).times.(N-B)] Hi-Fix board.
17. The test handler of claim 15, wherein the test tray used in
testing semiconductor devices with the M.times.N Hi-Fix board is
the same as the test tray used in testing semiconductor devices
with the [(M-A).times.(N-B)] Hi-Fix board.
18. A method for testing semiconductor devices by using a test
handler having a plurality of windows, the method comprising:
converting each of the windows from a test site corresponding to a
Hi-Fix board of M.times.N array (where M and N represent an integer
greater than a value of 0) into a test site corresponding to a
[(M-A).times.(N-B)] Hi-Fix board (where A is an integer equal to or
greater than 0 but smaller than M, and B is an integer equal to or
greater than 0 but smaller than N, and where at least one of A and
B is an integer having a value other than 0) or vice versa; and
testing semiconductor devices with the M.times.N Hi-Fix board or
the [(M-A).times.(N-B)] Hi-Fix board.
19. The method of claim 18, wherein a test tray used in testing
semiconductor devices with the M.times.N Hi-Fix board has the same
outer size as a test tray used in testing semiconductor devices
with the [(M-A).times.(N-B)] Hi-Fix board.
20. The method of claim 19, wherein the test tray used in testing
semiconductor devices with the [(M-A).times.(N-B)] Hi-Fix board has
inserts at portions corresponding to the [(M-A).times.(N-B)] Hi-Fix
board.
21. The method of claim 19, wherein the test tray used in testing
semiconductor devices with the M.times.N Hi-Fix board is the same
as the test tray used in testing semiconductor devices with the
[(M-A).times.(N-B)] Hi-Fix board.
22. A semiconductor device subjected to a test by using the test
handler described in claim 1.
Description
TECHNICAL FIELD
[0001] The present invention relates to a test handler for
transferring semiconductor devices and carrying out sorting thereof
by being connected to semiconductor test equipment for testing the
semiconductor devices or a package thereof; and, more particularly,
to a test handler having a size-changeable test site.
BACKGROUND ART
[0002] In order to reduce manufacturing costs for semiconductor
devices, a cost for testing them needs to be reduced by shortening
the test time. To this purpose, if a test equipment having a higher
processing speed is developed, a handler offering a greater
throughput unit per hour is also required to fully utilize the
improved capability of the test equipment.
[0003] Most of semiconductor test equipments carry out test of
semiconductor devices by using a Hi-Fix board having m.times.n
sockets. That is, after aligning the Hi-Fix board of the test
equipment with a test site of a handler, semiconductor devices
loaded in inserts on a test tray are brought into contact with the
sockets on the Hi-Fix board, so that m.times.n semiconductor
devices can be tested at the same time. Accordingly, the sizes of
the test site and the test tray are generally determined based on
the size of the Hi-Fix board. In particular, the size of the test
site is an important factor that determines the maximum throughput
of the test handler.
[0004] FIG. 1 illustrates a schematic plan view of a Hi-Fix board
10 having 128 sockets arranged in an array of 8 rows and 16
columns; and FIG. 2 sets forth a schematic front view of a main
body 22, a first and a second test site 24 and 26 of a conventional
vertical test handler 20 that is otherwise called a side-docking
test handler, wherein each of the test sites 24 and 26 is designed
to correspond to the Hi-Fix board 10 in FIG. 1.
[0005] Each of the first and the second test site 24 and 26 is of a
window type formed on any one side of the main body 22, and a
single test tray 28 can be placed in each of the test sites 24 and
26. The test tray 28 is accommodated in a certain section of the
handler 20, and after being performed a designated internal
transfer process and/or a heating/cooling process, the test tray 28
is placed in each of the first and the second test site 24 and 26
or selectively in only one of them. Disposed behind the test tray
28 is a work press (not shown) for supporting the test tray 28. The
test tray 28 includes inserts 32 corresponding to the sockets 12 of
the Hi-Fix board 10. The inserts 32 are arranged in an 8.times.16
matrix pattern, which is identical to the array of the sockets 12
on the Hi-Fix board 10. One or two semiconductor devices or
packages to be tested (not shown) are loaded in each insert 32.
[0006] If the work press behind the test tray 28 moves the test
tray 28 forward while the Hi-Fix board 10 of the semiconductor test
equipment (not shown) is aligned with, e.g., the first test site 24
of the test handler 20, the semiconductor devices loaded in the
inserts 32 of the test tray 28 are brought into contact with the
sockets 12 of the Hi-Fix board 10, whereby tests of the
semiconductor devices are carried out.
[0007] The Hi-Fix board 10 of the test equipment and the test tray
28 of the test handler 20 need to be configured to correspond to
each other, and the Hi-Fix board 10 and the test sites 24, 26 of
the test handler 20 should be matched with each other. Therefore,
the sizes of the test sites 24, 26 and the test tray 28 are
determined depending on the size of the Hi-Fix board. Here, given
that the size of the Hi-Fix board 10 is determined by the number of
the sockets 12 installed thereon, which is in turn determined by
the processing speed of the test equipment and the type of test to
be performed, the sizes of the test sites 24, 26 and the test tray
28 of the test handler 20 are regarded to be dependent upon the
processing speed of the test equipment and the type of test as
well.
[0008] For example, in case the test equipment has a maximum
processing speed capable of processing 128 semiconductor devices at
one time for a certain test, the Hi-Fix board 10 with the 128
sockets in the 8.times.16 array as shown in FIG. 1 is generally
utilized. If the Hi-Fix board 10 has an external size of 404
mm.times.344 mm to accommodate the 8.times.16 sockets thereon, each
of the test sites 24 and 26 of the test handler 10 is formed to
have the same size as that of the Hi-Fix board 10 or slightly
bigger than that. Also, the size and the pitch of the inserts 32 on
the test tray 28 should be identical to those of the sockets 12 on
the Hi-Fix board 10 to enable the tests of the semiconductor
devices.
[0009] Conventionally, the test handler 20 is fabricated with the
size of the test sites 24 and 26 and the test tray 28 permanently
fixed. Thus, the test handler 20 can only be dedicated to a
specific test equipment (or a test equipment having the same
processing speed as that of the test equipment employed) and its
exclusive Hi-Fix board 10 according to which the aforementioned
size is determined. Further, the test handler 20 cannot be used for
any other higher-performance test equipment or any other
larger-size Hi-Fix board. More specifically, the conventional test
handler 20 designed for the test equipment capable of testing 128
semiconductor devices at one time and the 8.times.16 Hi-Fix board
10 for use therein can only be applied to them but cannot be used
for a new test equipment with a faster processing speed and a
larger-size Hi-Fix board in an array of, e.g., an 8.times.20
matrix. This limitation in the compatibility of the conventional
test handler 20 results from the fixed sizes of each test site and
the test tray and also from its thereby delimited throughput (UPH:
Units Per Hour).
[0010] That is to say, even if a new test equipment provides an
improved capability for inspecting 160 semiconductor devices at one
time for a certain test, the performance of the test equipment
would not be fully manifested if the test sites and the test tray
of the conventional test handler cannot be matched with a Hi-Fix
board with 160 sockets (e.g., 8.times.20 Hi-Fix board). With regard
to the conventional structure of the test handler, however, it is
almost impossible to modify the test sites which were already
formed. Therefore, to use the new test equipment of a higher
performance, a new test handler compatible therewith must be
purchased for the purpose of reducing the test time.
DISCLOSURE OF INVENTION
[0011] Technical Problem
[0012] It is, therefore, an object of the present invention to
provide a high-compatibility test handler having a size-changeable
test site.
[0013] Technical Solution
[0014] In accordance with the present invention, there is provided
a test handler, which includes: a main body; a window formed on a
surface of the main body and having a size corresponding to a
Hi-Fix board of M.times.N array (where M and N represent an integer
greater than a value of 0); a cover detachably fixed to the main
body to close a part of the window and convert the window into a
test site having a size corresponding to a [(M-a).times.(N-b)]
Hi-Fix board (where A is an integer equal to or greater than 0 but
smaller than M, and B is an integer equal to or greater than 0 but
smaller than N, and where at least one of A and B is an integer
having a value other than 0).
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The above and other objects and features of the present
invention will become apparent from the following description of
preferred embodiments given in conjunction with the accompanying
drawings, in which:
[0016] FIG. 1 is a schematic plan view of an 8.times.16 Hi-Fix
board having 128 sockets;
[0017] FIG. 2 sets forth a schematic front view to show a main body
and a first and a second test site of a conventional vertical test
handler having a size corresponding to the Hi-Fix board of FIG.
1;
[0018] FIG. 3 presents a schematic perspective view of a test
handler in accordance with a preferred embodiment of the present
invention;
[0019] FIG. 4 offers a detailed perspective view to illustrate test
sites of the test handler of FIG. 3;
[0020] FIG. 5 provides a front view of the test handler of FIG. 3
in which two test trays are shown to be respectively exposed
through the first and the second test site in case M, N, A and B of
a [(M-A).times.(N-B)] Hi-Fix board are set to have a value of 8, 2,
0 and 4, respectively;
[0021] FIG. 6 is an enlarged plan view of the first test site shown
in FIG. 5 and the test tray exposed therethrough;
[0022] FIG. 7 depicts a front view of the test handler of FIG. 5
from which a cover is removed;
[0023] FIG. 8 shows an enlarged plan view of either one of the test
sites shown in FIG. 7;
[0024] FIG. 9 schematically shows one surface of a test handler
having a cover in accordance with a modification of the preferred
embodiment of the present invention; and
[0025] FIG. 10 schematically shows one surface of a test handler
having a cover in accordance with another modification of the
preferred embodiment of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0026] Referring now to FIGS. 3 and 4, there are provided a
schematic perspective view of a test handler in accordance with a
preferred embodiment of the present invention and a detailed
perspective view to illustrate test sites of the test handler.
[0027] The test handler 122 includes a window 142 formed in any one
side of a handler main body 122. Hi-Fix board supports 150 and 152
are installed in the window 142 such that they are extended inward.
The Hi-Fix board supports 150 and 152 in general are made of a
resin and are coupled to the handler main body 122 via bolts (not
shown) or the like. The window 142 is divided into an upper window
142a and a lower window 142b by the Hi-Fix board support 152, which
is horizontally arranged. Each of the upper and the lower window
142a and 142b has an external size corresponding to an M.times.N
Hi-Fix board (not shown) (for example, M=8, N=20).
[0028] On the right and left side of the window 142, first and
second locking devices 160 and 162 are connected to the handler
main body 122 via bolts (not shown) or the like. The first and the
second locking devices 160 and 162 are used to fix a Hi-Fix board
(as shown in FIG. 1) in the window 142. As clearly shown in FIG. 4,
the first locking device 160 includes a first locking cylinder
160a, a first locking clamp 160b and a first clamp guide block
160c, while the second locking device 162 includes a second locking
cylinder 162a, a second locking clamp 162b and a second clamp guide
block 160c. In the preferred embodiment of the present invention,
the first and the second locking cylinders 160a and 162a are
substantially same components, and the second locking clamps 162b
and the second clamp guide blocks 162c are elongated in a
horizontal direction longer than the first locking clamps 160a and
the first clamp guide blocks 160c, i.e., the lengths of the second
locking clamps 162b and the second clamp guide blocks 162c are
configured to be longer than those of the first locking clamps 160b
and the first clamp guide blocks 160c, to support a cover 170 and
so forth. However, it should be noted that the test handler 122 in
accordance with the present invention is not limited to this
configuration.
[0029] Some area of the window 142 is closed by a vertically
elongated rectangular cover 170. Accordingly, the widths of the
upper and the lower window 142a and 142b are reduced by the
presence of the cover 170. The upper and the lower window 142a and
142b having the reduced widths define a first and a second test
site 124 and 125, respectively. Each of the first and the second
test site 124 and 125 has a size corresponding to a
[(M-A).times.(N-B)] Hi-Fix board (for example, M=8, N=20, A=0,
B=4).
[0030] The cover 170 includes a support portion 172 and an
extension portion 174 (see, FIG. 5), wherein the support portion
172 is made of a metal similar or identical to that forming the
handler main body 122 while the extension portion 174 is made of an
insulating resin material similar or identical to that forming the
Hi-Fix board supports 150 and 152. Further, the support portion 172
of the cover 170 is fixed on the handler main body 122 by means of
the second clamp guide blocks 162c of the second locking devices
162; however, the present invention is not limited thereto. For
example, the support portion 172 can be fastened to the handler
main body 122 directly by using bolts or the like.
[0031] The extension portion 174 of the cover 170 has the same
function as those of the Hi-Fix board supports 150 and 152. That
is, when matching each of the test sites 124 and 125 with a Hi-Fix
board, the extension portion 174 of the cover 170 and the Hi-Fix
board supports 150 and 152 jointly support the edge portion of the
Hi-Fix board.
[0032] If the cover 170 is detached from the test handler 120
configured as described above, the upper and the lower window 142a
and 142b corresponding to the external size of the M.times.N Hi-Fix
board are exposed, so that it is possible to use the upper and the
lower window 142a and 142b as test sites for the M.times.N Hi-Fix
board.
[0033] In accordance with the present invention, in case of
attaching the cover 170 to the handler main body 122, the first and
the second test site 124 and 126 corresponding to the
[(M-A).times.(N-B)] Hi-Fix board (A=0) can be obtained, so that it
is possible to use the test handler 120 for the [(M-A).times.(N-B)]
Hi-Fix board (A=0). On the other hand, if the cover 170 is removed
from the handler main body 122, the upper and the lower window 142a
and 142b each corresponding to the M.times.N Hi-Fix board are
exposed, so that it is possible to use the test handler 120 for the
M.times.N Hi-Fix board. That is, the test handler 120 can be used
for both the [(M-A).times.(N-B)] Hi-Fix board (A=0) and the
M.times.N Hi-Fix board. Here, if there is a likelihood that the
M.times.N Hi-Fix board may be interfered by such components as the
second locking devices 162 when the test handler 120 is applied to
the M.times.N Hi-Fix board, those components need to be removed or
replaced.
[0034] FIG. 5 is a front view showing a state where test trays 128
and 130 are exposed through the first and the second test site 124
and 126 of the test handler 120 shown in FIG. 3 when M, N, A and B
are set to have a value of 8, 20, 0 and 4, respectively. FIG. 6
presents an enlarged plan view of the first test site 123 and the
test tray 28 exposed outside therethrough. In FIG. 6, the areas
marked by `.largecircle.` are where inserts 132 are installed to be
used for test, whereas the areas marked by `x` do not accommodate
inserts thereon or will not be used for test even though inserts
are installed thereon.
[0035] The test tray 128 shown in FIGS. 5 and 6 has 8.times.16
inserts on appropriate locations thereon to be applied to an
8.times.16 Hi-Fix board. However, this tray 128 can also be applied
to an 8.times.20 Hi-Fix board simply by installing additional
inserts thereon. Specifically, in case of applying the test tray
128 to the 8.times.16 Hi-Fix board, inserts are installed on the
entire area of the test tray 128 except on the area in the first to
the third columns from the cover 170 (i.e., the first three columns
from the left side of FIG. 6) and on the area in the first column
from the opposite side (i.e., the rightmost column in FIG. 6). On
the other hand, in case of applying the test tray 128 to the
8.times.20 Hi-Fix board, inserts are installed on the entire area
of the test tray 128. Though it is possible to apply such a test
tray 128 to the 8.times.16 Hi-Fix board, it is more preferable to
use the test tray 128 by changing the number of inserts installed
thereon because the inserts are of a high price. That is to say, in
accordance with the present invention, the test tray 128 can be
used for both the 8.times.16 Hi-Fix board and the 8.times.20 Hi-Fix
board. Therefore, component sharing is possible, thus resulting in
a reduction of manufacturing costs.
[0036] FIG. 7 is a front view showing a test handler 120 from which
its cover 170 is removed to be applied to an 8.times.20 Hi-Fix
board, and FIG. 8 sets forth an enlarged plan view of one of the
two test sites of the test handler 120. Second locking devices 180
in FIG. 7 can be the same components as first locking devices 160
or they can be configured by removing some parts such as the second
clamps 162a and the second clamp guide blocks 162c from the second
locking devices 162 shown in FIG. 4 or replacing them by other
elements.
[0037] As illustrated in FIG. 7, if the cover 170 shown in FIG. 5
is removed, the entire area of the window 142 is exposed, whereby
it becomes possible to use the upper and the lower window 142a and
142b, each having a width larger than those of the first and the
second test sites 124 and 126 in FIG. 5, as a new first and a new
second test site each corresponding to the 8.times.20 Hi-Fix board.
In this case, inserts 132 are installed on the entire area of the
test tray 128 as shown in FIG. 8, wherein the inserts 132 match
with sockets of the 8.times.20 Hi-Fix board in one-to-one
correspondence in terms of their sizes and pitches.
[0038] Though the preferred embodiments have been described for the
case of using the vertically elongated rectangular cover 170, the
cover can be of various shapes. Below, various modifications of the
cover will be described in detail.
[0039] FIG. 9 provides a schematic view illustrating another
modification of a cover attached to any one surface of a test
handler.
[0040] In a test handler 120, a window 142 is closed by a cover
170a. The cover 170a is provided with a central opening through
which an upper and a lower window 142a and 142b are partially
exposed. Other than the areas exposed through the central opening
of the cover 170a, rest areas 180 (as indicated by shaded portions)
of the upper and the lower window 142a and 142b are closed by the
cover 170a. Accordingly, a horizontal and/or a vertical width of
the upper and the lower window 142a and 142b are reduced by the
presence of the cover 170a. In this example shown in FIG. 9, some
upper rows of the upper window 142a and some lower rows of the
lower window 142b can be closed by the cover 170a at the same
time.
[0041] The upper and the lower window 142a and 142b having reduced
areas by the cover 170a form a first test site 124a and a second
test site 126a, respectively. Each of the first and the second test
site 124a and 126a has a size corresponding to a
[(M-A).times.(N-B)] Hi-Fix board (for example, M=8, N=20, A=4,
B=0).
[0042] Test trays mounted in the upper and the lower window 142a
and 142b are connected to respective [(M-A).times.(N-B)] Hi-Fix
boards (for example, M=8, N=20, A=4, B=0), so that semiconductor
devices loaded in inserts of the test trays can be inspected.
[0043] The cover 170a is a rectangular plate member having a
central opening. The first and the second test site 124a and 126a
are exposed outside through the central opening of the cover 170a.
The cover 170a is made of a metal material similar or identical to
that forming the handler 122 or a resin material similar or
identical to that forming the Hi-Fix board supports 150 and 152.
Further, though the cover 170a is fastened to the Hi-Fix board
support 150 via bolts 190 in the example shown in FIG. 9, other
connection or fastening mechanism can be employed instead. For
example, the cover 170a can be connected to the handler main body
122 by using the first and the second locking device 160 and 162
described above in accordance with the preferred embodiment of the
present invention.
[0044] If the cover 170a is removed from the test handler 120, the
upper and the lower window 142a and 142b each corresponding to a
M.times.N Hi-Fix board are exposed, so that it is possible to use
each of the upper and the lower window 142a and 142b as a test site
for the M.times.N Hi-Fix board.
[0045] That is, if the cover 170a is attached to the handler main
body 122, the first and the second test site 124a and 126a each
corresponding to the [(M-A).times.(N-B)] Hi-Fix board (for example,
M=8, N=20, A=4, B=0) are obtained. Therefore, the test handler 120
in accordance with the present invention can be applied to the
[(M-A).times.(N-B)] Hi-Fix board. On the other hand, if the cover
170a is separated from the handler main body 122, the upper window
142a and the lower window 142b each corresponding to the external
size of the M.times.N Hi-Fix board are exposed to be used as test
sites themselves. Accordingly, it becomes also possible to apply
the test handler 120 to the M.times.N Hi-Fix board.
[0046] FIG. 10 presents a schematic view illustrating further
another modification of a cover attached to any one surface of a
test handler.
[0047] Though the cover 170a in FIG. 9 is configured to close some
rows of the upper and the lower window 142a and 142b, a cover 170b
in this example has a one-side opened rectangular shape and closes
some rows and some columns of the upper and the lower window 142a
and 142b at the same time (shaded portions 195 in the figure
represent the areas closed by the cover 170b).
[0048] Accordingly, when the cover 170b is applied, the upper and
the lower window 142a and 142b are respectively converted into a
first and a second test site 124a and 126b each corresponding to a
[(M-A).times.(N-B)] Hi-Fix board (for example, M=8, N=20, A=4,
B=4).
[0049] The mechanism for attaching or detaching the cover 170b to
or from the handler main body 122 and the function of the cover
170a are identical to those described in the foregoing example
using the cover 170a.
[0050] In the example shown in FIG. 10, though the cover 170b has
the one-side opened rectangular shape to convert the upper and the
lower window 142a and 142b into the first and the second test site
124b and 126b each corresponding to the [(M-A).times.(N-B)] Hi-Fix
board (for example, M=8, N=20, A=4, B=4), the cover 170b can also
be fabricated as a plate member having a left half-bracket shape, a
right half-bracket shape, a rectangular shape with an opening or a
combination of a left- and a right-bracket shape. In each of the
cases, the upper and the lower window 142a and 142b can be
converted into a first and a second test site 124a and 124b each
corresponding to a [(M-A).times.(N-B)] Hi-Fix board, though not
shown in the drawing.
[0051] As can be seen from FIGS. 3 to 10, the test handler 120 in
accordance with the preferred embodiments of the present invention
or the modifications thereof can be applied to two types of Hi-Fix
boards having different external sizes (for example, an 8.times.16
Hi-Fix board and an 8.times.20 Hi-Fix board). Accordingly, in case
an old-model test equipment is replaced by a new test equipment
featuring a higher processing speed, by using the test handler 120
in accordance with the present invention, it is possible to
increase the maximum throughput unit per time of the test handler
120 without having to replace the test handler 120 with a new one.
Moreover, even in case the new higher-performance test equipment is
purchased, the old-model equipment is usually utilized together. In
such as case, the test handler in accordance with the present
invention can be applied to both of the new and the old-model test
equipment. Therefore, the test handler in accordance with the
present invention has many advantages when it is applied to the
manufacture of semiconductors.
[0052] While the invention has been shown and described with
respect to the preferred embodiments, it will be understood by
those skilled in the art that various changes and modifications may
be made without departing from the spirit and scope of the
invention as defined in the following claims.
* * * * *