U.S. patent application number 11/815364 was filed with the patent office on 2008-08-07 for flat plate-type heat pipe.
Invention is credited to Chang Auck Choi, Gunn Hwang, Sung Weon Kang, Sang Choon Ko, Seok Hwan Moon.
Application Number | 20080185128 11/815364 |
Document ID | / |
Family ID | 37115274 |
Filed Date | 2008-08-07 |
United States Patent
Application |
20080185128 |
Kind Code |
A1 |
Moon; Seok Hwan ; et
al. |
August 7, 2008 |
Flat Plate-Type Heat Pipe
Abstract
Provided is a flat plate-type heat pipe formed of a flat pipe
having a predetermined through-hole formed therein and a plurality
of grooves extending from an inner surface of the through-hole in a
longitudinal direction so that, while the interior of the heat pipe
is in a vacuum state, heat in the heat pipe is discharged to the
exterior due to a phase change of between liquid and gaseous states
of working fluid and the working fluid flows by a capillary force
produced from the plurality of grooves, whereby it is possible to
obtain a strong capillary force and an excellent cooling effect
while it is manufactured through a simple process.
Inventors: |
Moon; Seok Hwan; (Daejeon,
KR) ; Hwang; Gunn; (Seoul, KR) ; Ko; Sang
Choon; (Daejeon, KR) ; Kang; Sung Weon;
(Daejeon, KR) ; Choi; Chang Auck; (Daejeon,
KR) |
Correspondence
Address: |
LADAS & PARRY LLP
224 SOUTH MICHIGAN AVENUE, SUITE 1600
CHICAGO
IL
60604
US
|
Family ID: |
37115274 |
Appl. No.: |
11/815364 |
Filed: |
January 10, 2006 |
PCT Filed: |
January 10, 2006 |
PCT NO: |
PCT/KR06/00087 |
371 Date: |
August 2, 2007 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/046 20130101;
F28F 1/022 20130101; F28D 15/0233 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/02 20060101
F28D015/02 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 19, 2005 |
KR |
10-2005-0032212 |
Claims
1. A flat plate-type heat pipe including: a flat pipe having a
predetermined through-hole formed therein; and a plurality of
grooves extending from an inner surface of the through-hole in a
longitudinal direction, wherein, while the interior of the heat
pipe is in a vacuum state, heat in the heat pipe is discharged to
the exterior due to a phase change of between liquid and gaseous
states of working fluid, and the working fluid flows by a capillary
force produced from the plurality of grooves.
2. The flat plate-type heat pipe according to claim 1, further
comprising a separation layer for forming a plurality of flow paths
in the through-hole.
3. The flat plate-type heat pipe according to claim 1, wherein each
of the plurality of grooves has at least one corner from which the
capillary force is produced.
Description
TECHNICAL FIELD
[0001] The present invention relates to a flat plate-type heat pipe
and, more particularly, to a fine structure of flat plate-type heat
pipe which is formed of a flat pipe having a predetermined
through-hole formed therein and a plurality of grooves having at
least one corner formed at an inner surface of the through-hole
such that a liquid working fluid flows by a capillary force
produced in the corners, whereby it is possible to improve thermal
performance, to increase productivity by manufacturing the heat
pipe using a simple process, and to employ to a compact and thin
electronic device.
BACKGROUND ART
[0002] In general, chips and systems packaged in an electronic
device have been highly integrated and miniaturized as
semiconductor manufacturing technology is developed. According to
the tendency, since heat density of components included in the
electronic device is remarkably increased, it is required to employ
a cooling system capable of effectively dissipating the heat
density. Specially, since the electronic device is thinned together
with the miniaturization thereof, the cooling system should be also
miniaturized.
[0003] Conventional cooling systems such as a heat sink, fan,
compact heat pipe of a circular cross-section having a diameter
larger than 3mm, and so on are applicable to the miniaturized
electronic device.
[0004] The heat sink has been widely used as a basic structure of a
cooling means since it can be freely manufactured regardless of its
size and thickness. However, when it is required for the heat sink
to have a very small size, heat dissipation may be relatively
decreased due to a reduction of a heat transfer area.
[0005] It is difficult for the fan to be manufactured in a small
size, and therefore, reliability of the fan may be decreased.
[0006] The miniaturized heat pipe of a circular cross-section
having a diameter larger than 3mm may be used to be adapted to a
thin layer structure. However, since the miniaturized heat pipe is
designed to have a circular cross-section, when it is pressed to be
adapted to the miniaturized and thin electronic device, the heat
transfer performance may be largely decreased due to a structure
change of wick, and so on.
[0007] Therefore, a fine heat pipe having a diameter smaller than
3mm is required to be adapted to the miniaturized and thin
electronic device.
DISCLOSURE OF INVENTION
TECHNICAL PROBLEM
[0008] The present invention is directed to a flat plate-type heat
pipe formed of a flat pipe having a predetermined through-hole
formed therein and a plurality of grooves having at least one
corner formed at an inner surface of the through-hole so that a
liquid working fluid flows by a capillary force produced in the
corners, whereby it is possible to improve thermal performance, to
increase productivity by manufacturing the heat pipe using a simple
process, and to be adapted to a compact and thin electronic
device.
TECHNICAL SOLUTION
[0009] One aspect of the present invention is to provide a fine
structure of flat plate-type heat pipe formed of a flat pipe having
a predetermined through-hole formed therein and a plurality of
grooves extending from an inner surface of the through-hole in a
longitudinal direction so that, while the interior of the heat pipe
is in a vacuum state, heat in the heat pipe is discharged to the
exterior due to a phase change of between liquid and gaseous states
of working fluid, and the working fluid flows by a capillary force
produced from the plurality of grooves.
[0010] In this process, preferably, the heat pipe further includes
a separation layer for forming a plurality of flow paths in the
through-hole.
[0011] Preferably, each of the plurality of grooves has at least
one corner from which the capillary force is produced.
ADVANTAGEOUS EFFECTS
[0012] As can be seen from the foregoing, the flat plate-type heat
pipe in accordance with the present invention is formed of a flat
pipe having a predetermined through-hole formed therein and a
plurality of grooves having at least one corner formed at an inner
surface of the through-hole so that a liquid working fluid is
flowed by a capillary force produced from the corner, whereby it is
possible to obtain a strong capillary force through structural
modification of the heat pipe itself, without installing a separate
wick for flowing the liquid working fluid in the heat pipe, and to
improve thermal performance, to increase productivity by
manufacturing the heat pipe using a simple process, and to be
adapted to a compact and thin electronic device.
[0013] In addition, in accordance with the present invention, it is
possible to form a plurality of flow paths in one flat plate-type
heat pipe by forming a plurality of separation layers in the flat
plate-type heat pipe.
[0014] Further, in accordance with the present invention, it is
very advantageous to more obtain an inner vapor flow space to
improve heat transfer performance in comparison with the
conventional heat pipe having the same thickness.
[0015] Although the present invention has been described with
reference to certain exemplary embodiments thereof, it will be
understood by those skilled in the art that a variety of
modifications and variations may be made to the present invention
without departing from the spirit or scope of the present invention
defined in the appended claims, and their equivalents.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a first exemplary embodiment of the
present invention;
[0017] FIG. 2 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a second exemplary embodiment of the
present invention;
[0018] FIG. 3 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a third exemplary embodiment of the
present invention;
[0019] FIG. 4 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a fourth exemplary embodiment of the
present invention; and
[0020] FIG. 5 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a fifth exemplary embodiment of the
present invention.
MODE FOR THE INVENTION
[0021] The present invention will now be described more fully
hereinafter with reference to the accompanying drawings, in which
preferred embodiments of the invention are shown. This invention
may, however, be embodied in different forms and should not be
construed as limited to the embodiments set forth herein. Rather,
these embodiments are provided so that this disclosure will be
thorough and complete, and will fully convey the scope of the
invention to those skilled in the art. In the drawings, the
thickness of layers and regions are exaggerated for clarity. Like
reference numerals designate like elements throughout the
specification.
[0022] FIG. 1 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a first exemplary embodiment of the
present invention.
[0023] Referring to FIG. 1, the flat plate-type heat pipe in
accordance with the first embodiment of the present invention is
formed of a body 100 having a flat plate shape.
[0024] Preferably, the flat body 100 is made of a metal pipe
manufactured using an extrusion process.
[0025] In addition, the body 100 has a predetermined through-hole
105 through which a working fluid introduced from the exterior
flows.
[0026] A plurality of grooves 110 having a rectangular section and
extending in a longitudinal direction of the through-hole 105 are
formed in an inner surface of the through-hole 105.
[0027] Corners 115 are formed at lower sides of the rectangular
section grooves 110 to produce a capillary force such that the
liquid working fluid flows.
[0028] Additionally, a plurality of separation layers 120 may be
formed in the through-hole 105 to form a plurality of flow
paths.
[0029] As described above, the flat plate-type heat pipe in
accordance with the first embodiment of the present invention is
capable of flowing the liquid working fluid using the capillary
force produced at the corners 115 of the respective rectangular
section grooves 110, without using the conventional wick
functioning as a passageway allowing the liquid working fluid to be
flowed (returned) from a condenser section to an evaporation
section. That is, the corners 115 of the rectangular section
grooves 110 can function as the conventional wick.
[0030] In addition, the flat plate-type heat pipe in accordance
with the first embodiment of the present invention is capable of
discharging inner heat to the exterior using a phase change between
liquid and gaseous states of the liquid working fluid injected into
the heat pipe in the state that the heat pipe is in a vacuum
state.
[0031] FIG. 2 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a second exemplary embodiment of the
present invention.
[0032] Referring to FIG. 2, the flat plate-type heat pipe in
accordance with the second embodiment of the present invention is
formed of a body 200 having a flat pipe shape, similar to that of
the first embodiment.
[0033] The body 200 has a predetermined through-hole 205 through
which a working fluid introduced from the exterior flows, and a
plurality of grooves 210 having a V-shaped cross-section and
extending in a longitudinal direction of the through-hole 205 are
formed in an inner surface of the through-hole 205.
[0034] Corners 215 are formed at lower sides of the V-shaped
grooves 210 to produce a capillary force such that the liquid
working fluid flows.
[0035] Additionally, a plurality of separation layers 220 may be
formed in the through-hole 205 to form a plurality of flow
paths.
[0036] Meanwhile, since the flat plate-type heat pipe in accordance
with the second embodiment of the present invention has the same
function and effect as the first embodiment of the present
invention, the description of the second embodiment will not be
repeated.
[0037] FIG. 3 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a third exemplary embodiment of the
present invention.
[0038] Referring to FIG. 3, the flat plate-type heat pipe in
accordance with a third exemplary embodiment of the present
invention is formed of a body 300 having a flat pipe shape, similar
to that of the first embodiment of the present invention.
[0039] The body 300 has a predetermined through-hole 305 through
which a working fluid introduced from the exterior flows, and a
plurality of grooves 310 having a trapezoid or dovetail
cross-section () with an upper width smaller than a lower width and
extending in a longitudinal direction of the through-hole 305 are
formed in an inner surface of the through-hole 305.
[0040] Corners 315 are formed at lower sides of the trapezoid or
dovetail grooves 310 to produce a capillary force such that the
liquid working fluid flows.
[0041] Additionally, a plurality of separation layers 320 may be
formed in the through-hole 305 to form a plurality of flow
paths.
[0042] Meanwhile, since the flat plate-type heat pipe in accordance
with the third embodiment of the present invention has the same
function and effect as the first embodiment of the present
invention, the description of the third embodiment will not be
repeated.
[0043] FIG. 4 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a fourth exemplary embodiment of the
present invention.
[0044] Referring to FIG. 4, the flat plate-type heat pipe in
accordance with the fourth embodiment of the present invention is
formed of a body 400 having a flat pipe shape, similar to that of
the first embodiment of the present invention.
[0045] The body 400 has a predetermined through-hole 405 through
which a working fluid introduced from the exterior flows, and a
plurality of grooves 410 having a ""-shaped cross-section and
extending in a longitudinal direction of the through-hole 405 are
formed in an inner surface of the through-hole 405.
[0046] Sharp corners 415 are formed at lower sides of the ""-shaped
grooves 410 to produce a capillary force such that the liquid
working fluid flows.
[0047] Additionally, a plurality of separation layers 420 may be
formed in the through-hole 405 to form a plurality of flow
paths.
[0048] Meanwhile, since the flat plate-type heat pipe in accordance
with the fourth embodiment of the present invention has the same
function and effect as the first embodiment of the present
invention, the description of the fourth embodiment will not be
repeated.
[0049] FIG. 5 is an enlarged perspective view of a flat plate-type
heat pipe in accordance with a fifth exemplary embodiment of the
present invention.
[0050] Referring to FIG. 5, the flat plate-type heat pipe in
accordance with the fifth embodiment of the present invention is
formed of a body 500 having a flat pipe shape, similar to that of
the first embodiment of the present invention.
[0051] The body 500 has a predetermined through-hole 505 through
which a working fluid introduced from the exterior flows, and a
plurality of grooves 510 having a ""-shaped cross-section and
extending in a longitudinal direction of the through-hole 505 are
formed in an inner surface of the through-hole 505.
[0052] Sharp corners 515 are formed at lower sides of the ""-shaped
grooves 510 to produce a capillary force such that the liquid
working fluid flows.
[0053] Additionally, a plurality of separation layers 520 may be
formed in the through-hole 505 to form a plurality of flow
paths.
[0054] Meanwhile, since the flat plate-type heat pipe in accordance
with the fifth embodiment of the present invention has the same
function and effect as the first embodiment of the present
invention, the description of the fifth embodiment will not be
repeated.
[0055] As described above, since the flat plate-type heat pipe in
accordance with the first to fifth embodiments of the present
invention having a diameter smaller than 3mm has excellent heat
dissipation and heat transfer performance, it can be effectively
used as a cooling means for the small and thin electronic
device.
[0056] While the grooves 110 to 510 adapted to the first to fifth
embodiments of the present invention have the rectangular,
V-shaped, trapezoid (), "" and "" cross-sections, but not limited
thereto, the grooves may be variously modified to have at least one
corner.
* * * * *