U.S. patent application number 11/701293 was filed with the patent office on 2008-07-31 for liquid cooled heat sink.
This patent application is currently assigned to Man Zai Industrial Co., Ltd.. Invention is credited to Jen-Lu Hu, Hao-Hui Lin, Tsung-Ching Sun.
Application Number | 20080179045 11/701293 |
Document ID | / |
Family ID | 39643227 |
Filed Date | 2008-07-31 |
United States Patent
Application |
20080179045 |
Kind Code |
A1 |
Hu; Jen-Lu ; et al. |
July 31, 2008 |
LIQUID COOLED HEAT SINK
Abstract
A liquid cooled heat sink includes: a casing defining an inner
space and provided with a partitioning wall dividing the inner
space into upper and lower chambers and formed with a fluid passage
in fluid communication with the upper and lower chambers, the
casing being formed with a fluid inlet in fluid communication with
the upper chamber and adapted to be connected to an external
cooling device; a fin unit provided in the lower chamber; and a
pump mounted on the casing and having a suction end disposed in the
upper chamber, extending through the partitioning wall, and in
fluid communication with the lower chamber, and a discharging end
disposed in the upper chamber and adapted to be connected to an
external cooling device.
Inventors: |
Hu; Jen-Lu; (Tainan City,
TW) ; Lin; Hao-Hui; (Taitung City, TW) ; Sun;
Tsung-Ching; (Tainan City, TW) |
Correspondence
Address: |
DLA PIPER US LLP
2000 UNIVERSITY AVENUE
E. PALO ALTO
CA
94303-2248
US
|
Assignee: |
Man Zai Industrial Co.,
Ltd.
|
Family ID: |
39643227 |
Appl. No.: |
11/701293 |
Filed: |
January 31, 2007 |
Current U.S.
Class: |
165/80.4 ;
165/104.33; 257/E23.098; 361/699 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/473 20130101; H01L 2924/00 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/80.4 ;
165/104.33; 361/699 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A liquid cooled heat sink adapted to be attached to an
electronic component, said liquid cooled heat sink comprising: a
casing defining an inner space and provided with a partitioning
wall that divides said inner space into upper and lower chambers,
said partitioning wall being formed with a fluid passage in fluid
communication with said upper and lower chambers, said casing being
formed with a fluid inlet that is in fluid communication with said
upper chamber and that is adapted to be connected to an external
cooling device; a fin unit provided in said lower chamber; and a
pump mounted on said casing and having a suction end disposed in
said upper chamber, extending through said partitioning wall, and
in fluid communication with said lower chamber for withdrawing
fluid from said lower chamber, and a discharging end disposed in
said upper chamber and adapted to be connected to a connecting pipe
for discharging the fluid from said lower chamber into the external
cooling device so as to circulate the fluid through said upper and
lower chambers and the external cooling device.
2. The liquid cooled heat sink as claim in claim 1, wherein said
casing has a top wall and a bottom wall that is formed with an
attaching protrusion adapted to be attached to the electronic
component, said top wall being formed with a recess defined by a
recess-defining wall, said pump being mounted on said top wall and
extending into said recess, said suction end of said pump extending
through said recess-defining wall.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates to a liquid cooled heat sink, more
particularly to a liquid cooled heat sink including a casing and a
pump mounted directly on the casing and in fluid communication with
a lower chamber in the casing.
[0003] 2. Description of the Related Art
[0004] As shown in FIG. 1, a conventional heat dissipating device
generally includes a radiator 2 having a fluid inlet 22 and a fluid
outlet 21, a heat sink 11 having a coolant inlet 111 and a coolant
outlet 112, an inlet conduit 12, an outlet conduit 13, and a pump
14. The heat sink 11 is adapted to be connected to a heat source
(not shown), such as a CPU or a heat-generating electronic
component of a display. The outlet conduit 13 interconnects the
coolant outlet 112 of the heat sink 11 and the fluid inlet 22 of
the radiator 2. The pump 14 is mounted on the inlet conduit 12, and
the inlet conduit 12 has a first conduit section 121
interconnecting the coolant inlet 111 of the heat sink 11 and the
pump 14, and a second conduit section 122 interconnecting the pump
14 and the fluid outlet 21 of the radiator 2.
[0005] When the pump 14 is operated, a coolant is driven to
circulate through the heat sink 11, the outlet conduit 13, the
radiator 2, and the inlet conduit 12, and carries heat absorbed by
the heat sink 11 to the radiator 2 so as to dissipate heat
thereat.
[0006] Although the conventional heat dissipating device has the
heat dissipating effect, there are still some disadvantages:
[0007] 1) An undesired high coolant vaporizing rate due to
connection between the pump 14 and the first and second conduit
sections 121, 122 of the inlet conduit 12 occurs.
[0008] 2) A larger space is required to accommodate the pump 14 and
the first and second conduit sections 121, 122 of the inlet conduit
12.
[0009] 3) Assembly of the pump 14 and the first and second conduit
sections 121, 122 of the inlet conduit 12 is inconvenient when the
space for accommodating the heat dissipating device is small.
SUMMARY OF THE INVENTION
[0010] Therefore, the object of the present invention is to provide
a liquid cooled heat sink that can overcome the aforesaid
disadvantages associated with the prior art.
[0011] Accordingly, a liquid cooled heat sink of the present
invention is adapted to be attached to an electronic component and
comprises: a casing defining an inner space and provided with a
partitioning wall that divides the inner space into upper and lower
chambers, the partitioning wall being formed with a fluid passage
in fluid communication with the upper and lower chambers, the
casing being formed with a fluid inlet that is in fluid
communication with the upper chamber and that is adapted to be
connected to an external cooling device; a fin unit provided in the
lower chamber; and a pump mounted on the casing and having a
suction end disposed in the upper chamber, extending through the
partitioning wall, and in fluid communication with the lower
chamber for withdrawing fluid from the lower chamber, and a
discharging end disposed in the upper chamber and adapted to be
connected to a connecting pipe for discharging the fluid from the
lower chamber into the external cooling device so as to circulate
the fluid through the upper and lower chambers and the external
cooling device.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Other features and advantages of the present invention will
become apparent in the following detailed description of the
preferred embodiment with reference to the accompanying drawings,
of which:
[0013] FIG. 1 is a schematic view of a conventional heat
dissipating device;
[0014] FIG. 2 is a fragmentary perspective view of the preferred
embodiment of a heat dissipating assembly according to the present
invention; and
[0015] FIG. 3 is a fragmentary sectional view of a heat sink of the
preferred embodiment.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0016] Referring to FIGS. 2 and 3, the preferred embodiment of a
heat dissipating assembly according to the present invention is
shown to includes a liquid cooled heat sink and an external cooling
device 3 connected to the liquid cooled heat sink.
[0017] The liquid cooled heat sink is adapted to be attached to an
electronic component 9, and includes: a casing 5 defining an inner
space and provided with a partitioning wall 43 that divides the
inner space into upper and lower chambers 52, 53, the partitioning
wall 43 being formed with a fluid passage 46 in fluid communication
with the upper and lower chambers 52, 53, the casing 5 being formed
with a fluid inlet 513 that is in fluid communication with the
upper chamber 52 and that is adapted to be connected to the
external cooling device 3 through a first conduit 8; a fin unit 42
provided in the lower chamber 53; and a pump 6 mounted directly on
the casing 5 and having a suction end 611 disposed in the upper
chamber 52, extending through the partitioning wall 43, and in
fluid communication with the lower chamber 53 for withdrawing a
coolant from the lower chamber 53, and a discharging end 612
disposed in the upper chamber 52 and adapted to be connected to the
external cooling device 3 through a second conduit 7 for
discharging the coolant from the lower chamber 53 into the external
cooling device 3 so as to circulate the coolant through the upper
and lower chambers 52, 53 and the external cooling device 3.
[0018] In this embodiment, the casing 5 has a top wall 512 and a
bottom wall that is formed with an attaching protrusion 41 adapted
to be attached to the electronic component 9. The top wall 512 is
formed with a recess 517 defined by a recess-defining wall 514. The
pump 6 is mounted on the top wall 512, and extends into the recess
517. The suction end 611 of the pump 6 extends through the
recess-defining wall 514 into the upper chamber 52.
[0019] The external cooling device 3 is in the form of a radiator
that is made from metal and that includes first and second side
tanks 31, 32 adapted to store the coolant therein, a plurality of
connecting conduits 36 interconnecting and in fluid communication
with the first and second side tanks 31, 32, and a fin structure 33
connected to the connecting conduits 36 and the first and second
side tanks 31, 32. The first side tank 31 has a coolant outlet 34
that is connected to the fluid inlet 513 of the heat sink through
the first conduit 8. The second side tank 32 has a coolant inlet 35
that is connected to the discharging end 612 of the pump 6 through
the second conduit 7.
[0020] The casing 5 is made from a metal material with good heat
conducting property, and further includes a plurality of dividing
walls 44 extending between the partitioning wall 43 and the bottom
wall of the casing 5 so as to form the lower chamber 53 into a
tortuous fluid path 47 for flowing of the coolant therethrough
before entering into the pump 6.
[0021] Before use, the coolant is filled in the first and second
side tanks 31, 32, the connecting conduits 36, the first and second
conduits 8, 7, and the upper and lower chambers 52, 53 in the
casing. In use, the pump 6 is started so that the coolant in the
external cooling device 3 is pumped through the first conduit 8
into the upper chamber 52 in the casing 5 of the heat sink for heat
exchange with the electronic component 9. Thereafter, the heated
coolant flows in sequence through the second conduit 7, the second
side tank 32, the connecting conduits 36, and the first side tank
31. As the coolant flows through the connecting conduits 36, the
fin structure 33 absorbs and dissipates heat thereat so that the
coolant is cooled down before flowing into the first side tank
31.
[0022] By mounting the pump 6 directly on the casing 5 of the
liquid cooled heat sink of this invention, the aforesaid drawbacks
associated with the prior art can be eliminated.
[0023] While the present invention has been described in connection
with what is considered the most practical and preferred
embodiment, it is understood that this invention is not limited to
the disclosed embodiment but is intended to cover various
arrangements included within the spirit and scope of the broadest
interpretation so as to encompass all such modifications and
equivalent arrangements.
* * * * *