U.S. patent application number 12/052625 was filed with the patent office on 2008-07-10 for backing, transducer array and method for thermal survival.
Invention is credited to Gregg W. Frey.
Application Number | 20080163972 12/052625 |
Document ID | / |
Family ID | 36035061 |
Filed Date | 2008-07-10 |
United States Patent
Application |
20080163972 |
Kind Code |
A1 |
Frey; Gregg W. |
July 10, 2008 |
BACKING, TRANSDUCER ARRAY AND METHOD FOR THERMAL SURVIVAL
Abstract
Backing blocks, transducer arrays and methods are provided for
thermal cycle survivability. By decoupling a portion of the backing
block from a case used to contain the transducer stack, the greater
thermal expansion properties of most backing blocks may be
minimized. For example, a rim is formed on the backing block
material. The rim is bonded to the case structure while other
portions of the backing block remain free of bonding to the case
structure. During thermal cycling or other temperature changes, the
backing block may be less likely to expand or bulge and crack,
delaminate or damage transducer elements or other transducer
materials.
Inventors: |
Frey; Gregg W.; (Issaquah,
WA) |
Correspondence
Address: |
SIEMENS CORPORATION;INTELLECTUAL PROPERTY DEPARTMENT
170 WOOD AVENUE SOUTH
ISELIN
NJ
08830
US
|
Family ID: |
36035061 |
Appl. No.: |
12/052625 |
Filed: |
March 20, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10921565 |
Aug 19, 2004 |
7358645 |
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12052625 |
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Current U.S.
Class: |
156/60 |
Current CPC
Class: |
G10K 11/004 20130101;
Y10T 156/10 20150115; B06B 1/0681 20130101 |
Class at
Publication: |
156/60 |
International
Class: |
B29C 65/48 20060101
B29C065/48 |
Claims
1-9. (canceled)
10. A method for connecting transducer components for thermal
survival, the method comprising: (a) bonding transducer material to
a backing block; (b) positioning the backing block at least
partially within a case; and (c) bonding less than 50 percent of a
surface area of the backing block to the case.
11. The method of claim 10 wherein (b) comprises surrounding sides
of the backing block with the case.
12. The method of claim 10 wherein (b) comprises placing a rim on
the backing block in contact with the case, portions of the backing
block other than the rim being free of contact with the case, and
wherein (c) comprises bonding the rim to the case.
13. The method of claim 12 wherein (b) comprises placing the rim,
the rim surrounding a top surface of the backing block, the rim and
the top surface being a full aperture size of the transducer
material, the backing block having a region spaced from the top
with a lesser area in cross section parallel to the top than the
full aperture size.
14. The method of claim 10 wherein (c) comprises bonding less than
30 percent of the backing block to the case.
15. The method of claim 10 further comprising: (d) covering a
portion of the backing block prior to (c), the covering preventing
bonding of the portion to the case.
16. The method of claim 10 wherein (c) comprises providing an air
gap between the backing block and the case for at least 50 percent
of a surface area of sides of the backing block.
17-20. (canceled)
Description
BACKGROUND
[0001] The present invention relates to backing blocks, transducer
arrays and methods for survivability. In particular, a shaped
backing block may avoid thermal tension damage to a transducer
array during manufacturing, testing or use.
[0002] As part of development or manufacturing, transducer arrays
are temperature stress tested. As part of use, similar temperature
stresses are placed on a transducer array. For example, the
transducer arrays are subjected to thermal variation. Due to usage,
storage or shipping, the transducer may be exposed to a range of
temperatures. Tests typically span a -30.degree. to +60.degree.
Celsius temperature range. Other temperature ranges may be used.
The transducer array is subjected to this range of temperatures
over a number of cycles, such as 60 cycles. During use or shipping,
the transducer may be subjected to various temperatures any number
of times.
[0003] Differences in a thermal coefficient of expansion between
different materials within a transducer stack may result in damage
to the array from temperature changes. For example, piezoelectric
ceramic material is very strong in compression but very weak in
tension. Soft or semi-rigid backing material connected with the
piezoelectric ceramic has very high thermal expansion relative to
the other materials in the array. The backing block material may
heave or bulge due to heat to a greater extent than the ceramic
material, causing damage to the transducer array. Due to the large
thermal expansion of the backing block, the piezoelectric ceramic
may crack. Cracked elements have weak or less desirable acoustic
response.
BRIEF SUMMARY
[0004] By way of introduction, the preferred embodiments described
below include backing blocks, transducer arrays and methods for
thermal survivability. By decoupling a portion of the backing block
from a case used to contain the transducer stack, the greater
thermal expansion properties of most backing blocks may be
minimized. For example, a rim is formed on the backing block
material. The rim is bonded to a case structure while other
portions of the backing block remain free of bonding to the case
structure. During thermal cycling or other temperature changes, the
backing block may be less likely to expand or bulge and crack,
delaminate or damage transducer elements or other transducer
materials.
[0005] In a first aspect, an ultrasound transducer is provided for
thermal survival. Transducer material is connected with a case. A
backing block has a top, bottom and sides. The top connects with
the transducer material. Less than 50% of the sides of the backing
block connect with the case or other structure.
[0006] In a second aspect, a method is provided for connecting
transducer components for thermal survival. An array of elements is
bonded to a backing block. The backing block is positioned at least
partially within a case. Less than 50% of the surface area of the
backing block is bonded to the case.
[0007] In a third aspect, a backing block is provided for thermal
survivability in an ultrasound transducer array. A body of
acoustically absorbing material has a top, bottom and sides. A rim
connects with at least a portion of the sides of the body. The rim
extends from the sides such that a first area including the rim in
cross-section perpendicular to an axis extending between the top
and bottom is greater than a second area free of the rim in
cross-section also perpendicular to the axis. The second area is
spaced from the first area along the axis.
[0008] The present invention is defined by the following claims,
and nothing in this section should be taken as a limitation on
those claims. Further aspects and advantages of the invention are
discussed below in conjunction with the preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The components and the figures are not necessarily to scale,
emphasis instead being placed upon illustrating the principles of
the invention. Moreover, in the figures, like reference numerals
designate corresponding parts throughout the different views.
[0010] FIG. 1 is a cross-sectional diagram of one embodiment of a
transducer stack with a backing block provided for thermal
survivability;
[0011] FIG. 2 is a top view of one embodiment of the transducer
stack of FIG. 1; and
[0012] FIG. 3 is a flow chart diagram of one embodiment of a method
for connecting transducer components for thermal survival.
DETAILED DESCRIPTION OF THE DRAWINGS AND PRESENTLY PREFERRED
EMBODIMENTS
[0013] Stress caused by a mismatch of thermal coefficients of
expansion between a backing block and other materials of a
transducer stack or array are minimized by decoupling at least a
portion of the backing block from any support material. For
example, about 70-80% of the sides of the backing material are
decoupled from a rigid case surrounding the transducer stack. The
full depth of the backing block is maintained for absorbing
acoustic energy from the transducer material.
[0014] FIGS. 1 and 2 show two different views of one embodiment of
an ultrasound transducer 10 for thermal survival. The transducer 10
includes transducer material 12, a support case 14 and a backing
block 16. Additional, different or fewer components may be
provided, such as providing matching layers, flexible circuits,
wire bonds, a lens, a transducer probe housing, combinations
thereof or other now known or later developed transducer stack
materials. As another example, the transducer 10 is free of or does
not include the case 14.
[0015] The transducer material 12 is a slab, plate or block of
piezoelectric ceramic. Alternatively, the transducer material 12 is
a composite transducer material, capacitive membrane, micro
electromechanical structures, combinations thereof or other now
known or later developed material or structure for transducing
between acoustical and electrical energies. The transducer material
12 is diced or otherwise separated to form an array of transducer
elements, such as a 1, 1.25, 1.5, 1.75 or multidimensional array of
transducer elements. The transducer material 12 is formed into
elements prior to or after being positioned within the case 14.
[0016] The case 14 is graphite, but other rigid or semi-rigid
materials may be used, such as metals, plastics and combinations
thereof. The case 14 is shaped as a box structure with an open top
and bottom. Oval or shapes with other numbers of sides may be used.
Wider or longer shapes may be used. In alternative embodiments, a
portion or entirety of the bottom is also enclosed. Vents, holes,
gaps or other structures may be formed within or through the walls
of the case 14. Alternatively, the walls of the case 14 are solid.
In one embodiment, one or more grooves or divots within the case 14
are used for holding the transducer material 12 and/or the backing
block 16 in a desired position relative to case 14. For example, an
extension or a depression within the backing block 16 along an area
of contact with the case 14 mates with a corresponding depression
or extension in the case 14. The case 14 surrounds the sides of the
transducer material 12 and the sides of backing block 16.
Alternatively, the case surrounds a portion of the sides of the
transducer material 12 and the backing block 16. As shown in FIG.
1, the case 14 has a height corresponding to the height of the
transducer material 12 and the backing block 16. Either or both of
the transducer material 12 and the backing block 16 may extend
beyond the case 14, such as the transducer material 12 shown in
FIG. 1. In one embodiment, the case 14 extends just to or a little
past the rim 20 of the backing material 16. The case 14 assists in
manufacture and protection of the transducer material 12 and
backing block 16.
[0017] The case 14 includes one or more tabs 18. The tabs 18 are
shaped and sized for mounting with other structures, such as a
probe housing. In one embodiment, the tabs 18 are formed as a
unitary structure with the case 14, but may alternatively be
otherwise connected or bonded to the case 14. Tabs 18 are of the
same or different material than the case 14. The tabs 18 may
include one or more holes or other structures for mounting the case
to the transducer probe housing.
[0018] The backing block 16 is a soft or semi-rigid material. In
one embodiment, a composite of hard or soft epoxy with tungsten
powder, mica, combination thereof or other filler materials is
used. Other unitary or composite structures may be used. The
material is selected to absorb acoustic energy behind the
transducer material 12 and efficiently damp the acoustics to
minimize artifacts for imaging. The backing block material is
selected to damp by absorption rather than scattering. The
acoustically absorbing material may have a greater thermal
expansion coefficient than the transducer material 12.
Alternatively, a similar or lesser thermal expansion coefficient is
provided. Alternatively, the backing material 16 is shaped to
provide for scattering away from the transducer material 12.
[0019] The backing block 16 is a body of acoustically absorbing
material having a top 22, a bottom 24 and sides 26. The bottom 24,
sides 26, or top 22 may include divots, holes or other structures.
The top 22 is flat or curved to accommodate the shape or structure
of the transducer material 12. The top 22 has a same or similar
surface shape and/or texture as the bottom of the transducer
material 12. The depth of the backing block 16 or height of the
sides 26 is selected as a function of the ability of the backing
block 16 to acoustically damp or absorb acoustic energy while
minimizing secondary echoes. In one embodiment, the height of the
sides 26 is less than half-an-inch, such as being about one-third
of an inch. Greater or lesser heights of the sides 26 and depths of
the backing block 16 may be provided.
[0020] The top 22 of the backing block 16 connects with the
transducer material 12. In one embodiment, the backing block 16 is
bonded directly to the transducer material 12. Alternatively, the
top 22 connects with the transducer material 12 through one or more
other layers of material, such as a flexible circuit, conductors or
electrodes.
[0021] The backing block 16 includes a rim 20 around or connected
with a portion of the sides 26. The rim 20 is formed of
acoustically absorbing material, such as forming the rim 20 and the
remainder of the backing block 16 as a singular or unitary
structure of the same material or materials. The rim 20 is
positioned adjacent to the top 22, but may be positioned lower or
spaced away from the top 22. The rim 20 is formed completely around
the sides 26 of the backing block 16, but may have gaps or only
extend partially around the sides 26. The rim has a height along
the sides 26 or a depth that is about one-third of the total height
of the sides 26 or depth of the backing block 16. Greater or lesser
heights may be provided. By being formed along a third or upper
third of the height of the sides 26 of the backing block 26, the
rim 20 covers less than 50% of the surface area of the sides 26,
such as covering about a third of the sides. Greater or lesser
amounts of coverage may be provided. The rim 20 has a depth or
height sufficient to allow the depth of kerfs for providing
separation of elements and/or electrodes without extending beyond
the height of the rim 20.
[0022] The rim 20 extends from the sides 26 such that an area that
includes the rim in cross-section (e.g. a cross-section through the
rim 20 along all sides 26 of the backing block 16 orthogonal to the
plane of the FIG. 1) perpendicular to an axis extending between the
top 22 and the bottom 24 is greater than an area of the backing
block 16 that is free of the rim 20 but also perpendicular to the
same axis. The area free of the rim 20 is spaced away from the area
including the rim along the same axis. The rim 20 adds or
contributes to the additional area. The other portions of the side
26 are formed by milling away, molding, or otherwise removing a
portion of the backing block material 16 to form the rim 20. The
top surface 22 of the backing block 16 includes the portion of the
rim 20. The top surface 22 is of a same or full aperture size of
the transducer material 12. An area spaced from the top 22 but
parallel to the top 22 is lesser in cross-section than the area of
the top 22.
[0023] The rim 20 connects with the case 14. In one embodiment, the
connection is a direct connection, but indirect connections through
one or more other materials may be provided. The rim 20 connects
with the case 14 by bonding, but a pressure fit or other mounting
or latch mechanisms may be used. The rim 20 is also connected with
a portion of the transducer material 12, such as through bonding or
sintering. Since the rim 20 covers less than 50% of the sides 26 of
the backing block 16, less than 50% of the sides 26 connects with
the case 14. For example, less than 30% of the sides 26 connect
with the case 14. In one embodiment, about 20% of the sides 26
connect with the case 14. The surface area of the sides of the rim
20 correspond to the portion of the sides 26 of the backing block
16 for connection with the case 14. The rim extends about 1 to 11/2
hundredths of an inch from the sides 26. The gap between the case
14 and the sides 26 has a similar extent. Greater or lesser extents
may be provided. Air, Teflon, a film, or other materials may fill
the gap between the sides 26 and the case 14.
[0024] In an alternative embodiment, contact from the sides 26 with
the case 14 is minimized by having a case 14 that extends less than
the height of the backing block 16. The backing block 16 may be
formed with or without the rim 20 where the case 14 has a limited
extend. By limiting the height of the case 14, the amount of the
sides 26 of the backing block 16 in contact with the case 14 is
controlled.
[0025] FIG. 3 shows one embodiment of a method for connecting
transducer components for thermal survival. The method uses the
components shown above in FIGS. 1 and 2, but other components may
be used. Additional, different or fewer acts than shown in FIG. 3
may be used, such as performing acts 34 and 36 without act 32.
[0026] In act 32, a portion of the backing block is covered prior
to bonding the backing block to a case or other support structure.
The covering prevents bonding of the covered portion of the backing
block to the case or support structure. For example, a non-bonding
film, such as Teflon, is wrapped around the backing block below the
rim. The film may extend along a portion of the height or the
entire height of the backing block other than the rim or bonding
portion. In one embodiment, the film is slit or cut at the corners
of the backing block so that the film lies against the backing
block. Alternatively, the film is wrapped without any cuts. The
covering may be thick enough to fill a space between backing block
and the case, but thinner coverings may be used in other
embodiments. The covering prevents or limits an amount of bonding
of the backing block to the case. The covering acts to prevent or
reduce a gap between the backing block and the case from filling
with bonding material.
[0027] In act 34, the transducer material or array and backing
block are positioned. The backing block is positioned at least
partially within a case. The sides of the backing block are at
least partially surrounded with the case. Alternatively, less than
all of the sides are covered with the case. The backing block is
machined or otherwise formed to have a rim structure. The rim on
the backing block is placed in contact with the case. Portions of
the backing block other than the rim are free of contact with the
case. In alternative embodiments, other portions of the backing
block contact the case. The rim and other portion of the backing
block forming a top surface are a full aperture size of the
transducer material, such as completely filling in cross-section
the case or matching a size and shape to the transducer material.
Larger or smaller relative surface areas may be provided. Spaced
away from a top surface, the backing block has a region with a
lesser area in cross-section than the top surface, full aperture
size or even a larger size where the case expands outward or is not
around a portion of the backing.
[0028] The array or transducer material is also positioned within
the case. In one embodiment, the backing block and transducer
material are stacked together within the case. In alternative
embodiments, the array or transducer material is bonded to the
backing block and then both are positioned within the case.
[0029] In act 36, bonding is performed. The array of elements or
transducer material is bonded to the backing block. The backing
block and/or the transducer material are bonded to the case. In one
embodiment, the bonding of the transducer material to the backing
block happens before or after bonding the backing block to the
case. In alternative embodiments, the transducer material, backing
block and case are bonded together in a same step. Due to the rim,
shape of the backing block or relative positioning of the backing
block to the case 14, less than 50% of a surface area of the
backing block is bonded to the case. For example, only the rim of
the backing block is bonded to the case. In one embodiment, less
than 30% of the backing block is bonded to the case. An air or
filled gap is provided between the backing block and the case for
at least 50% of the surface area of the sides of the backing block.
Other relative areas of bonding versus areas free of bonding of the
backing block to the case may be provided. The Teflon or other
covering may limit the bonding of the backing block to the case.
Alternatively, a pressure fit is used with limited or little
leaking of bonding agent, allowing an air gap free of bonding of
the backing block to the case.
[0030] After bonding, the transducer material is diced. Matching
layers may be positioned on the transducer material prior to or
after bonding. In alternative embodiments, the dicing is performed
prior to bonding of the backing to the case. Lensing is also
performed at after the bonding, but may be performed prior to the
bonding in other embodiments.
[0031] The covering remains within the transducer stack.
Alternatively, a portion or all of the covering is removed, forming
an air gap between the backing block and the case except where the
backing block bonded at the rim section or other area to the case
and the electrodes or transducer material. The covering is removed
by pulling the covering out using tweezers or other
instruments.
[0032] While the invention has been described above by reference to
various embodiments, it should be understood that many changes and
modifications can be made without departing from the scope of the
invention. It is therefore intended that the foregoing detailed
description be regarded as illustrative rather than limiting, and
that it be understood that it is the following claims, including
all equivalents, that are intended to define the spirit and scope
of this invention.
* * * * *