U.S. patent application number 11/960074 was filed with the patent office on 2008-07-03 for surface acoustic wave device.
This patent application is currently assigned to MURATA MANUFACTURING CO., LTD.. Invention is credited to Michio KADOTA, Takeshi NAKAO, Kenji NISHIYAMA, Eiichi TAKATA.
Application Number | 20080160178 11/960074 |
Document ID | / |
Family ID | 34909075 |
Filed Date | 2008-07-03 |
United States Patent
Application |
20080160178 |
Kind Code |
A1 |
NISHIYAMA; Kenji ; et
al. |
July 3, 2008 |
SURFACE ACOUSTIC WAVE DEVICE
Abstract
A surface acoustic wave device includes a piezoelectric
substrate made of LiTaO.sub.3 or LiNbO.sub.3 having an
electromechanical coefficient of about 15% or more, at least one
electrode which is disposed on the piezoelectric substrate and
which is a laminate film having a metal layer defining a primary
metal layer primarily composed of a metal having a density higher
than that of Al or an alloy of the metal and a metal layer which is
laminated on the primary metal layer and which is composed of
another metal, and a first SiO.sub.2 layer which is disposed in a
remaining area other than that at which the at least one electrode
is located and which has a thickness approximately equivalent to
that of the electrode. In the surface acoustic wave device
described above, the density of the electrode is at least about 1.5
times that of the first SiO.sub.2 layer. In addition, a second
SiO.sub.2 layer disposed so as to cover the electrode and the first
SiO.sub.2 layer and a silicon nitride compound layer disposed on
the second SiO.sub.2 layer are further provided.
Inventors: |
NISHIYAMA; Kenji; (Yasu-shi,
JP) ; TAKATA; Eiichi; (Nagaokakyo-shi, JP) ;
NAKAO; Takeshi; (Omihachiman-shi, JP) ; KADOTA;
Michio; (Kyoto-shi, JP) |
Correspondence
Address: |
MURATA MANUFACTURING COMPANY, LTD.;C/O KEATING & BENNETT, LLP
8180 GREENSBORO DRIVE, SUITE 850
MCLEAN
VA
22102
US
|
Assignee: |
MURATA MANUFACTURING CO.,
LTD.
Nagaokakyo-shi
JP
|
Family ID: |
34909075 |
Appl. No.: |
11/960074 |
Filed: |
December 19, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11469505 |
Sep 1, 2006 |
7327071 |
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11960074 |
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PCT/JP2005/002895 |
Feb 23, 2005 |
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11469505 |
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Current U.S.
Class: |
427/100 |
Current CPC
Class: |
H03H 9/25 20130101; H03H
3/08 20130101; H03H 9/02984 20130101; H03H 9/14538 20130101 |
Class at
Publication: |
427/100 |
International
Class: |
H01L 41/24 20060101
H01L041/24; B05D 5/12 20060101 B05D005/12 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 2, 2004 |
JP |
2004-057935 |
Claims
1. A method of manufacturing a surface acoustic wave device
comprising the step of: providing a piezoelectric substrate of made
one of LiTaO.sub.3 or LiNbO.sub.3 and having an electromechanical
coefficient of at least about 15%; forming at least one electrode
having a density greater than that of Al on the piezoelectric
substrate; forming a first SiO.sub.2 layer on a remaining area
other than that at which said at least one electrode is formed, the
first SiO.sub.2 layer having a thickness approximately equal to
that of the at least one electrode; forming a second SiO.sub.2
layer so as to cover the at least one electrode and the first
SiO.sub.2 layer; and forming a silicon nitride compound layer on
the second SiO.sub.2 layer; wherein the density of the at least one
electrode is at least about 1.5 times that of the first SiO.sub.2
layer.
2. The method of manufacturing a surface acoustic wave device
according to claim 1, wherein when the thickness of the second
SiO.sub.2 film is represented by h, and the wavelength of a surface
acoustic wave is represented by .lamda.,
0.08.ltoreq.h/.lamda..ltoreq.0.5 is satisfied.
3. The method of manufacturing a surface acoustic wave device,
according to claim 1, wherein the silicon nitride compound layer is
formed of an SiN layer, and when the thickness of the SiN layer is
represented by h, and the wavelength of a surface acoustic wave is
represented by .lamda., 0<h/.lamda..ltoreq.0.1 is
maintained.
4. The method of manufacturing a surface acoustic wave device,
according to claim 1, further comprising the step of: forming a
diffusion inhibition film made of SiN between the second SiO.sub.2
layer and the at least one electrode; wherein when the thickness of
the diffusion inhibition film is represented by h, and the
wavelength of a surface acoustic wave is represented by .lamda.,
0.005.ltoreq.h/.lamda..ltoreq.0.05 is satisfied.
5. The method of manufacturing a surface acoustic wave device,
according to claim 1, wherein the at least one electrode is formed
of one of Cu, a Cu alloy, and a laminate film comprising a metal
layer primarily composed of Cu or a Cu alloy.
6. The method of manufacturing a surface acoustic wave device,
according to claim 1, wherein the piezoelectric substrate is made
of one of rotated Y-plate X-propagation LiTaO.sub.3 or LiNbO.sub.3,
and when the thickness of the second SiO.sub.2 layer is represented
by h.sub.1, the thickness of the silicon nitride compound layer
formed on the second SiO.sub.2 layer is represented by h.sub.2, the
wavelength of a surface acoustic wave is represented by .lamda.,
and the following equations are satisfied: coefficient
A.sub.1=-190.48; coefficient A.sub.2=76.19; coefficient
A.sub.3=-120.00; coefficient A.sub.4=-47.30; coefficient
A.sub.5=55.25; H.sub.1=h.sub.1/.lamda.,H.sub.2=h.sub.2/.lamda., and
.theta.=(A.sub.1H.sub.1.sup.2+A.sub.2H.sub.1+A.sub.3)H.sub.2+A.sub.4H.sub-
.1+A.sub.5, a Y-X cut angle of the rotated Y-plate X-propagation
piezoelectric substrate is in the range of
.theta..+-.5.degree..
7. The method of manufacturing a surface acoustic wave device
according to claim 1, wherein the density of the at least one
electrode is at least about 2.5 times that of the first SiO.sub.2
layer.
8. The method of manufacturing a surface acoustic wave device
according to claim 1, wherein the step of forming the at least one
electrode includes the steps of: laminating a metal layer as a
primary metal layer made of a metal having a density greater than
that of Al or an alloy primarily composed of the metal; and
laminating a metal layer on the primary metal layer and which is
made of another metal.
9. The method of manufacturing a surface acoustic wave device
according to claim 1, further comprising the step of: planarizing
an upper surface of each of the at least one electrode and the
first SiO.sub.2 layer before the step of forming the second
SiO.sub.2 layer.
10. The method of manufacturing a surface acoustic wave device
according to claim 1, further comprising the step of: planarizing
an upper surface of the second SiO.sub.2 layer before the step of
forming the silicon nitride compound layer.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a surface acoustic wave
device used, for example, for a resonator and a band pass filter,
and more particularly, relates to a surface acoustic wave device
having a structure in which an insulating layer is arranged so as
to cover electrodes.
[0003] 2. Description of the Related Art
[0004] A DPX and an RF filter used for mobile communication systems
have been required to satisfy broadband properties and superior
temperature properties. Heretofore, in a surface acoustic wave
device used for a DPX and an RF filter, a piezoelectric substrate
of 36.degree. to 50.degree. rotated Y-plate X-propagation
LiTaO.sub.3 has been used. This piezoelectric substrate has a
frequency-temperature coefficient of approximately -40 ppm/.degree.
C. to -30 ppm/.degree. C. Hence, in order to improve the
temperature properties, a method has been used in which a SiO.sub.2
film having a positive frequency-temperature coefficient is formed
on the piezoelectric substrate so as to cover an IDT electrode. In
FIGS. 18A-18D, one example of a manufacturing method of this type
of surface acoustic wave device is shown.
[0005] As shown in FIG. 18A, a resist pattern 52 is formed on a
piezoelectric substrate 51 except for portions at which the IDT
electrode is to be formed. Next, as shown in FIG. 18B, in order to
form the IDT electrode, an electrode film 53 is formed over the
entire surface. Subsequently, by using a resist stripping solution,
the resist patter 52 and the metal film provided thereon are
removed. As described above, as shown in FIG. 18C, an IDT electrode
53A is formed. Next, as shown in FIG. 18D, a SiO.sub.2 film 54 is
formed so as to cover the IDT electrode 53A.
[0006] On the other hand, for a purpose different from that for
improving frequency-temperature properties described above, a
manufacturing method of a surface acoustic wave device is disclosed
in Japanese Unexamined Patent Application Publication No. 11-186866
(Patent Document 1) in which an insulating or an semi-conductive
protective film is formed so as to cover an IDT electrode of the
surface acoustic wave device. FIG. 19 is a schematic
cross-sectional view of the surface wave device described in this
prior art. In a surface acoustic wave device 61, an IDT electrode
63 of Al or an alloy primarily made of Al is formed on a
piezoelectric substrate 62. In a region other than that at which
the IDT electrode 63 is provided, an insulating or an
anti-conductive inter-electrode-finger film 64 is formed. In
addition, so as to cover the IDT electrode 63 and the
inter-electrode-finger film 64, an insulating or an anti-conductive
film 65 is formed. In the surface acoustic wave device 61 described
in this prior art, the inter-electrode-finger film 64 and the
protective film 65 are formed of an insulating material, such as
SiO.sub.2, or an anti-conductive material, such as silicon. In this
method, with the formation of an inter-electrode-finger film 64,
degradation in properties caused by discharge between the electrode
fingers induced by the pyroelectric properties of a piezoelectric
substrate 62 is suppressed.
[0007] In addition, in Japanese Unexamined Patent Application
Publication No. 61-136312 (Patent Document 2), a one-port type
surface acoustic wave resonator is disclosed in which after
electrodes made of a metal such as aluminum or gold are formed on a
piezoelectric substrate made of quartz or lithium niobate, and a
SiO.sub.2 film is further formed, planarization of the SiO.sub.2
film is performed. In this case, due to the planarization, superior
resonant properties are obtained.
[0008] As shown in FIGS. 18A-18D, in a conventional manufacturing
method of a surface acoustic wave device in which a SiO.sub.2 film
is formed in order to improve the frequency-temperature properties,
the surface height of the SiO.sub.2 film 54 disposed at locations
at which the IDT electrode is present and the surface height at
which the IDT electrode is not present are different from each
other. Thus, the presence of irregularities of the surface of the
SiO.sub.2 film 54 causes a problem in that the insertion loss is
degraded. In addition, as the thickness of the IDT electrode is
increased, the irregularities are increased. Accordingly, the
thickness of the IDT electrode cannot be sufficiently
increased.
[0009] On the other hand, in the surface acoustic wave device
described in Patent Document 1, after the inter-electrode-finger
film 64 is formed between electrode fingers of the IDT 63, the
protective film 65 is formed. Accordingly, the surface of the
protective film 65 can be planarized.
[0010] However, according to the structure described in Patent
Document 1, the IDT electrode 63 is formed of Al or an alloy
primarily composed of Al. Although the inter-electrode-finger film
64 is formed so as to be in contact with this IDT electrode 63, a
sufficient reflection coefficient cannot be obtained at the IDT
electrode 63. As a result, for example, there has been a problem in
that ripples are generated in the resonant properties.
[0011] Furthermore, in the manufacturing method described in Patent
Document 1, prior to the formation of the protective film 65, the
resist formed on the inter-electrode-finger film 64 must be removed
using a resist stripping solution. However, in this step, the IDT
electrode 63 may be corroded by a resist stripping solution. Thus,
as a metal forming the IDT electrode, a metal that is susceptible
to corrosion cannot be used. That is, the type of metal forming the
IDT electrode is limited.
[0012] On the other hand, in the one-port type surface acoustic
wave resonator described in Patent Document 2, it has been
disclosed that quartz or lithium niobate is used as the
piezoelectric substrate and the electrode is formed of aluminum or
gold. However, the situation in which an electrode made of Al is
formed on a quartz substrate is only described as an example. That
is, a surface acoustic wave device using another substrate material
and/or another metal material has not been specifically
described.
SUMMARY OF THE INVENTION
[0013] To overcome the problems described above, preferred
embodiments of the present invention provide a surface acoustic
wave device in which an insulating layer is formed on an electrode
and in which the properties are not degraded by ripples which
appear, for example, in resonant properties. That is, a surface
acoustic wave device is provided which has superior resonant
properties and filter properties.
[0014] As described above, in Patent Document 2, it has been
disclosed that superior resonant properties can be obtained by
planarization of the upper surface of the SiO.sub.2 film. Hence,
the inventors of the present invention formed a one-port type
surface acoustic wave resonator having a structure that is
equivalent to that described in Patent Document 2 except that a
LiTaO.sub.3 substrate having a high electromechanical coefficient
was used as the piezoelectric substrate, and subsequently, the
properties of the resonator were determined. That is, after an
electrode of Al was formed on the LiTaO.sub.3 substrate, a
SiO.sub.2 film was formed, and the surface of the SiO.sub.2 film
was then planarized. However, after the SiO.sub.2 film was formed,
the properties were severely degraded, and it was determined that
the resonator cannot be practically used.
[0015] When a LiTaO.sub.3 substrate or a LiNbO.sub.3 substrate is
used which has a high electromechanical coefficient as compared to
that of quartz, the fractional band width is significantly
increased. However, according to detailed investigation performed
by the inventors of the present invention, as shown in FIGS. 2 and
3, it was found that when an electrode of Al is formed on a
LiTaO.sub.3 substrate, and a SiO.sub.2 film is further formed, by
planarization of the surface of the SiO.sub.2 film, the refection
coefficient is drastically decreased to approximately 0.02. FIGS. 2
and 3 are graphs each showing the relationship between the
reflection coefficient and an electrode thickness H/.lamda. of a
surface acoustic wave device in which an IDT electrode of gold or
platinum is formed on a LiTaO.sub.3 substrate of Euler angles
(0.degree., 126.degree., 0.degree.) so as to have various
thicknesses, and a SiO.sub.2 film is further formed. Solid lines in
FIGS. 2 and 3 indicate the changes in reflection coefficient when
the surface of the SiO.sub.2 film is not planarized as
schematically shown in FIGS. 2 and 3, and dotted lines indicate the
changes in reflection coefficient when the surface of the SiO.sub.2
film is planarized.
[0016] As shown in FIGS. 2 and 3, when a conventional electrode
made of Al is used, by planarizing the surface of the SiO.sub.2
film, regardless of the electrode thickness, it is understood that
the reflection coefficient is drastically decreased to
approximately 0.02. Thus, it has been believed that a sufficient
stop band cannot be obtained and that sharp ripples are generated
in the vicinity of an antiresonant frequency.
[0017] In addition, heretofore, it has been known that the
reflection coefficient is increased as the electrode thickness is
increased. However, as shown in FIGS. 2 and 3, in the case in which
an electrode made of Al is used, although the thickness of the
electrode is increased, the refection coefficient is not increased
when the surface of the SiO.sub.2 film is planarized.
[0018] On the other hand, as shown in FIGS. 2 and 3, in the case in
which the electrode is formed from Au or Pt, even when a surface of
the SiO.sub.2 film is planarized, the reflection coefficient is
increased as the electrode thickness is increased. Various
investigations were performed by the inventors of the present
invention based on the findings as described above, and as a
result, the present invention was developed.
[0019] According to a preferred embodiment of the present
invention, a surface acoustic wave device includes a piezoelectric
substrate made of LiTaO.sub.3 or LiNbO.sub.3, which has an
electromechanical coefficient of at least about 15%, at least one
electrode disposed on the piezoelectric substrate and which is a
laminate having a metal layer defining a primary metal layer
primarily composed of a metal having a density higher than that of
Al or an alloy primarily composed of the metal and a metal layer
which is laminated on the primary metal layer and which is composed
of another metal, and a first SiO.sub.2 layer which is disposed in
a remaining area other than that at which the at least one
electrode is disposed and which has a thickness approximately equal
to that of the at least one electrode. In the surface acoustic wave
device described above, the density of the electrode is at least
about 1.5 times that of the first SiO.sub.2 layer. In addition, a
second SiO.sub.2 layer arranged so as to cover the electrode and
the first SiO.sub.2 layer and a silicon nitride compound layer
disposed on the second SiO.sub.2 layer are further provided.
[0020] In another preferred embodiment of the surface acoustic wave
device according to the present invention, when the thickness of
the second SiO.sub.2 film is represented by h, and the wavelength
of a surface acoustic wave is represented by .lamda.,
0.08.ltoreq.h/.lamda..ltoreq.0.5 is preferably satisfied.
[0021] In another preferred embodiment of the surface acoustic wave
device according to the present invention, when the silicon nitride
compound layer is composed of an SiN layer, the thickness of the
SiN layer is represented by h, and the wavelength of a surface
acoustic wave is represented by .lamda., 0<h/.lamda..ltoreq.0.1
is preferably satisfied.
[0022] In this case, the silicon nitride compound layer may be
Si.sub.3N.sub.4 or other suitable silicon nitride compound other
than SiN.
[0023] In another preferred embodiment of the surface acoustic wave
device according to the present invention, a diffusion inhibition
film is further provided which is made of SiN and which is disposed
between the second SiO.sub.2 layer and the electrode, and when the
thickness of the diffusion inhibition film is represented by h, and
the wavelength of a surface acoustic wave is represented by
.lamda., 0.005.ltoreq.h/.lamda..ltoreq.0.05 is preferably
satisfied.
[0024] In another preferred embodiment of the surface acoustic wave
device according to the present invention, the electrode is
composed of one of Cu or a Cu alloy, or a laminate film having a
metal layer primarily composed of Cu or a Cu alloy.
[0025] In another preferred embodiment of the surface acoustic wave
device according to the present invention, when the piezoelectric
substrate is formed of rotated-Y plate X propagating LiTaO.sub.3 or
LiNbO.sub.3, the thickness of the second SiO.sub.2 layer is
represented by h.sub.1, the thickness of the silicon nitride
compound layer formed on the second SiO.sub.2 layer is represented
by h.sub.2, the wavelength of a surface acoustic wave is
represented by .lamda., and the following equations are satisfied:
coefficient A.sub.1=-190.48, coefficient A.sub.2=76.19, coefficient
A.sub.3=-120.00, coefficient A.sub.4=-47.30, coefficient
A.sub.5=55.25, H.sub.1=h.sub.1/.lamda., H.sub.2=h.sub.2/.lamda.,
and .theta.=(A.sub.1H.sub.1.sup.2+A.sub.2H.sub.1+A.sub.3)
H.sub.2+A.sub.4H.sub.1+A.sub.5, a Y-X cut angle of the rotated
Y-plate X-propagation piezoelectric substrate is in the range of
.theta..+-.5.degree..
[0026] In the surface acoustic wave device according to preferred
embodiments of the present invention, on the piezoelectric
substrate, the electrode is preferably composed of a metal having a
density higher than that of Al, an alloy primarily composed of the
metal, or a laminate having a metal layer composed of a metal
having a density higher than that of Al or an alloy primarily
composed of the metal, the first SiO.sub.2 layer having a thickness
approximately equal to that of the electrode is disposed in a
remaining area other than that at which the electrode is provided,
and the second SiO.sub.2 layer is disposed so as to cover the
electrode and the first SiO.sub.2 layer. In the surface acoustic
wave device described above, the density of the electrode is
preferably set to at least about 1.5 times that of the first
SiO.sub.2 layer. Thus, when the upper surface of the second
SiO.sub.2 layer is planarized, ripples which appear in resonant
properties and/or filter properties are moved out of the band, and
in addition, the ripples are prevented and minimized. In addition,
superior frequency-temperature properties are achieved.
[0027] In addition, since the silicon nitride compound layer is
disposed on the second SiO.sub.2 layer, the properties can be
adjusted and improved. Furthermore, by performing dry etching of
the SiN, the frequency can be adjusted without changing TCF and the
fractional band width.
[0028] In addition, in the case in which
0.08.ltoreq.h/.lamda..ltoreq.0.5 is satisfied, where the thickness
of the second SiO.sub.2 film is represented by h, and the
wavelength of a surface acoustic wave is represented by .lamda., as
will be apparent from experimental results described below, the
frequency-temperature properties TCF is improved. That is, the
absolute value of TCF is decreased.
[0029] In addition, in the case in which 0<h/.lamda..ltoreq.0.1
is satisfied, where the silicon nitride compound layer is composed
of SiN, the thickness of the SiN is represented by h, and the
wavelength of a surface acoustic wave is represented by .lamda.,
the absolute value of the frequency-temperature properties TCF is
further decreased, and a surface acoustic wave device having a
smaller change in frequency-temperature properties TCF is
provided.
[0030] Furthermore, in the case in which
0.005.ltoreq.h/.lamda..ltoreq.0.05 is satisfied, where the
diffusion inhibition film made of SiN is disposed between the
second SiO.sub.2 layer and the electrode, the thickness of the
diffusion inhibition film is represented by h, and the wavelength
of a surface acoustic wave is represented by .lamda., the amount of
change in frequency-temperature properties TCF is decreased, and in
addition, resistance properties are improved when a direct current
voltage is applied. In addition, when the diffusion inhibition film
is provided, diffusion of an electrode material to the second
SiO.sub.2 layer is prevented, and thus, the surface of the second
SiO.sub.2 layer can be further planarized. Since the diffusion of
the metal forming the electrode to the SiO.sub.2 layer is
prevented, degradation defects of properties in a high temperature
load test are not likely to occur. Thus, the resistance properties
are improved when a direct current is applied.
[0031] When an electrode of Cu or an alloy primarily composed of Cu
or an electrode made of a laminate having an electrode layer of Cu
or an alloy primarily composed of Cu is used, an electrode can be
provided which is inexpensive and which has superior
conductivity.
[0032] Other features, elements, steps, characteristics and
advantages of the present invention will become more apparent from
the following detailed description of preferred embodiments of the
present invention with reference to the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0033] FIG. 1 is a schematic, partially cut-away, cross-sectional
front view of a surface acoustic wave device of a first preferred
embodiment according to the present invention.
[0034] FIG. 2 is a graph showing the relationship between the
reflection coefficient and the electrode thickness of a one-port
type surface acoustic wave device in which an IDT electrode made of
Al, Au, or Pt is formed on a LiTaO.sub.3 substrate of Euler angles
(0.degree., 126.degree., 0.degree.) to have various thicknesses,
and a SiO.sub.2 film having a normalized thickness Hs/.lamda. of
about 0.2 is further formed. The relationship is obtained for
instances in which the surface of the SiO.sub.2 film is planarized
and in which the surface thereof is not planarized.
[0035] FIG. 3 is a graph showing the relationship between the
reflection coefficient and the electrode thickness of a one-port
type surface acoustic wave device in which an IDT electrode made of
Cu or Ag is formed on a LiTaO.sub.3 substrate of Euler angles
(0.degree., 126.degree., 0.degree.) to have various thicknesses,
and a SiO.sub.2 film having a normalized thickness Hs/.lamda. of
about 0.2 is further formed. The relationship is obtained for
situations in which the surface of the SiO.sub.2 film is planarized
and in which the surface thereof is not planarized.
[0036] FIG. 4 is a front view illustrating an electrode structure
of the surface acoustic wave device of the first preferred
embodiment, in which the state is shown before a SiN layer is
formed.
[0037] FIG. 5 is a graph showing the change in a resonant frequency
fa when the thickness of a SiN film is changed in the surface
acoustic wave device of the first preferred embodiment of the
present invention.
[0038] FIG. 6 is a graph showing the relationship between the
frequency and the frequency-temperature properties obtained when
frequency adjustment is performed by adjusting the thickness of a
SiN film in a surface acoustic wave device of this preferred
embodiment, and showing the above relationship obtained when
frequency adjustment is performed by adjusting the thickness of a
SiO.sub.2 film of a surface acoustic wave device prepared for
comparison.
[0039] FIG. 7 is a graph showing the relationship between the
frequency and the fractional band width obtained when frequency
adjustment is performed by adjusting the thickness of the SiN film
in the surface acoustic wave device of the first preferred
embodiment, and showing the above relationship obtained when
frequency adjustment is performed by adjusting the thickness of a
SiO.sub.2 film of a surface acoustic wave device prepared for
comparison.
[0040] FIG. 8 is a graph showing the changes in impedance-frequency
properties and phase-frequency properties of the surface acoustic
wave device when the thickness of the SiN film is increased in the
first preferred embodiment of the present invention.
[0041] FIG. 9 is a graph showing the change in fractional band
width when the thickness of the SiN film is changed in the first
preferred embodiment of the present invention.
[0042] FIG. 10 is a graph showing the change in antiresonant
resistance Ra when the thickness of the SiN film is changed in the
first preferred embodiment of the present invention.
[0043] FIG. 11 is a graph showing the impedance-frequency
properties and the phase-frequency properties of a surface acoustic
wave device of a reference example in which the surface of an
insulating layer of SiO.sub.2 is planarized, the reference example
being based on the first preferred embodiment, and showing the
above properties of a surface acoustic wave device in which the
surface of a second SiO.sub.2 layer is not planarized.
[0044] FIG. 12 is a graph showing the relationship between the
fractional band width and the thickness of SiN obtained when the
thickness of a SiN film is changed in this preferred embodiment in
which the surface of a second SiO.sub.2 layer made of SiO.sub.2 is
planarized, and showing the above relationship obtained when the
thickness of a SiN film of a surface acoustic wave device prepared
for comparison is changed in which the surface of a second
SiO.sub.2 layer in not planarized.
[0045] FIG. 13 is a graph showing the relationship between
antiresonant resistance Ra and the thickness of SiN obtained when
the thickness of a SiN film is changed in this preferred embodiment
in which the surface of a second SiO.sub.2 layer made of SiO.sub.2
is planarized, and showing the above relationship obtained when the
thickness of a SiN film of a surface acoustic wave device prepared
for comparison is changed in which the surface of a second
SiO.sub.2 layer is not planarized.
[0046] FIG. 14 is a schematic, partially cut-away, cross-sectional
front view of a surface acoustic wave device of a second preferred
embodiment according to the present invention.
[0047] FIGS. 15A and 15B are a SIM photograph and a scanning
electron microscopic photograph, respectively, the SIM photograph
showing the state in which Cu as an electrode material diffuses
from an IDT electrode when a SiN film is not formed as a diffusion
inhibition film, the scanning electron microscopic photograph
showing the state in which a void is generated because of the
diffusion.
[0048] FIGS. 16A and 16B are a SIM photograph and a scanning
electron microscopic photograph, respectively, each showing the
state in which diffusion from an IDT electrode does not
substantially occur in the second preferred embodiment in which a
SiN film is formed as a diffusion inhibition film.
[0049] FIG. 17 is a graph showing the results of a high temperature
load test for the surface acoustic wave device of the second
preferred embodiment and for a surface acoustic wave device of a
comparative example in which a diffusion inhibition film made of
SiN is not formed.
[0050] FIGS. 18A to 18D are schematic, partially cut-away,
cross-sectional front views illustrating a conventional method for
manufacturing a surface acoustic wave device.
[0051] FIG. 19 is a partially cut-away, cross-sectional front view
showing one example of a conventional surface acoustic wave
device.
[0052] FIGS. 20A to 20G are schematic, partially cut-away,
cross-sectional views illustrating a method for manufacturing a
surface acoustic wave device of one example according to a
preferred embodiment of the present invention.
[0053] FIG. 21 is a graph showing the relationship among the phase
properties, impedance properties, and normalized thickness of the
thickness of a SiO.sub.2 film of a surface acoustic wave device
obtained by a manufacturing method according to the comparative
example.
[0054] FIG. 22 is a graph showing the relationship between MF of a
resonator and the thickness of a SiO.sub.2 film of a surface
acoustic wave device prepared for comparison purposes.
[0055] FIG. 23 is a graph showing the changes in impedance
properties and phase properties obtained when the normalized
thickness of a SiO.sub.2 film of a surface acoustic wave device is
changed in a manufacturing method of the reference example.
[0056] FIG. 24 is a graph showing the relationship between the
thicknesses of a SiO.sub.2 film of each surface acoustic wave
resonator and .gamma. thereof, said each resonator being obtained
by a manufacturing method according to the reference example or the
comparative example.
[0057] FIG. 25 is a graph showing the relationship between the
thickness of a SiO.sub.2 film of each surface acoustic wave
resonator and MF thereof, the resonator being obtained by a
manufacturing method according to the reference example or the
comparative example.
[0058] FIG. 26 is a graph showing the relationship between the
change in frequency-temperature properties TCF and the thickness of
a SiO.sub.2 film of each resonator prepared in the reference
example or the comparative example.
[0059] FIG. 27 is a graph showing the impedance-frequency
properties of a surface acoustic wave device having a SiO.sub.2
film prepared in a second comparative example and the above
properties of that having no SiO.sub.2 film.
[0060] FIGS. 28A to 28E are graphs each showing the change in
impedance properties when the ratio of the average density of an
IDT electrode and a protective metal film to the density of a first
SiO.sub.2 layer.
[0061] FIG. 29 is a graph showing the change in electromechanical
coefficient obtained when IDT electrodes are formed on a
LiTaO.sub.3 substrate of Euler angles (0.degree., 126.degree.,
0.degree.) using various metals having various thicknesses.
[0062] FIG. 30 is a graph showing the relationship between the
density of an electrode material and the range of an electrode
thickness in which when an IDT electrode is formed on a LiTaO.sub.3
substrate using various metals, the electromechanical coefficient
is increased as compared to that obtained when an electrode made of
Al is used.
[0063] FIG. 31 is a graph showing the change in antiresonance Ra
when the thickness of a SiN film used as a diffusion inhibition
film is changed in an experimental example of the surface acoustic
wave device according to the second preferred embodiment of the
present invention.
[0064] FIG. 32 is a graph showing the change in fractional band (%)
of a filter when the thickness of a SiN film used as a diffusion
inhibition film is changed in an experimental example of the
surface acoustic wave device according to the second preferred
embodiment of the present invention.
[0065] FIG. 33 is a graph showing the change in
frequency-temperature properties TCF when the thickness of a SiN
film used as a diffusion inhibition film is changed in an
experimental example of the surface acoustic wave device according
to the second preferred embodiment of the present invention.
[0066] FIG. 34 is a graph showing one example of the change in
antiresonant Q value when the cut angle of a LiTaO.sub.3 substrate
is changed in the surface acoustic wave device according to the
first preferred embodiment of the present invention.
[0067] FIG. 35 is a graph showing the change in optimum cut angle
at which antiresonance Ra is regarded as a superior value when the
thickness of a SiN film forming a SiN layer is changed at which the
normalized thickness of a SiO.sub.2 film forming a second SiO.sub.2
layer is set to 0.15, 0.30, and 0.40 in the first preferred
embodiment of the present invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0068] Hereinafter, with reference to the figures, particular
preferred embodiments of the present invention will be described so
as to facilitate the understanding of the present invention.
[0069] With reference to FIG. 20A-20G, a reference example of a
manufacturing method of a surface acoustic wave device will be
described, the reference example being not yet known or disclosed
to the public and being the base of the present invention.
[0070] As shown in FIG. 20A, first, a LiTaO.sub.3 substrate 1 is
prepared. In this reference example, a 36.degree. Y-plate
X-propagation LiTaO.sub.3 substrate of Euler angles (0.degree.,
126.degree., 0.degree.) is used. However, as the piezoelectric
substrate, another LiTaO.sub.3 substrate having a different crystal
orientation may also be used, or a substrate made of another
piezoelectric crystal may also be used. In addition, a
piezoelectric substrate made of a piezoelectric thin film laminated
on an insulating substrate may also be used. Incidentally, .theta.
of Euler angles (.phi., .theta., .psi.) corresponds to the cut
angle +90.degree..
[0071] A first SiO.sub.2 layer 2 is formed over the entire surface
of the LiTaO.sub.3 substrate 1. In this reference example, the
first SiO.sub.2 layer 2 is made of a SiO.sub.2 film.
[0072] A method for forming the first SiO.sub.2 layer 2 may be
performed by an optional method, such as printing, deposition, or
sputtering. In addition, the thickness of the first SiO.sub.2 layer
2 is set to be equal to that of an IDT electrode which is to be
formed in a subsequent step.
[0073] Next, as shown in FIG. 20B, using a photolithographic
technique, a resist pattern 3 is formed. The resist pattern 3 is
formed so that a resist is located at positions other than those at
which IDT is to be formed.
[0074] Next, with a reactive ion etching method (RIE) performed by
ion irradiation as shown by arrows in FIG. 20C, portions of the
first SiO.sub.2 layer 2 other than the portions located under the
resist pattern 3 are removed.
[0075] When SiO.sub.2 is etched by RIE using a fluorinated gas,
residues may be generated by a polymerization reaction. In this
case, after RIE, treatment may be performed using BHF (buffered
hydrofluoric acid) or other suitable treatments.
[0076] Subsequently, a Cu film and a Ti film are formed so as to
have a thickness equivalent to that of the first SiO.sub.2 layer 2.
As shown in FIG. 20D, in a region at which the first SiO.sub.2
layer 2 is removed, that is, in a region at which IDT is to be
formed, a Cu film 4 is formed, and simultaneously, the Cu film 4 is
also formed on the resist pattern 3. Next, a Ti film 5 is formed as
an entire surface-protection metal film. As shown in FIG. 20E, the
Ti film 5 is formed on the upper surface of an IDT electrode 4A and
the Cu film 4 is formed on the resist pattern 3. Thus, for the IDT
electrode 4A, the side surfaces thereof are covered with the first
SiO.sub.2 layer 2 and the upper surface is covered with the Ti film
5. As described above, the IDT electrode 4A and the protection
metal film are formed so that the total of the thickness of the IDT
electrode 4A and that of the Ti film 5 used as the protection metal
film is substantially equal to the thickness of the first SiO.sub.2
layer 2.
[0077] Next, using a resist stripping solution, the resist pattern
3 is removed. As described above, as shown in FIG. 20F, a structure
is obtained in which the IDT electrode 4A is formed in the region
other than that at which the first SiO.sub.2 layer 2 is provided
and in which the upper surface of the IDT electrode 4A is covered
with the Ti film 5.
[0078] Then, as shown in FIG. 20G, a SiO.sub.2 film is formed over
the entire surface as a second SiO.sub.2 layer 6.
[0079] As described above, a one-port type surface acoustic wave
resonator 11 having the electrode structure shown in FIG. 4 is
obtained.
[0080] In FIGS. 20A to 20G, only the portion at which the IDT
electrode 4A is formed is particularly described. However, as shown
in FIG. 4, the surface acoustic wave resonator 11 includes
reflectors 12 and 13 at two sides of the IDT electrode 4A in the
propagation direction of a surface acoustic wave. The reflectors 12
and 13 are also formed in the same step as the IDT electrode
4A.
[0081] In the above reference example, since the one-port type
surface acoustic wave resonator 11 is formed, the IDT electrode 4A
is formed on the LiTaO.sub.3 substrate 1. However, depending on the
application of the surface acoustic wave device, a plurality of IDT
electrodes may be formed, and in addition, reflectors may be formed
in the same step as the IDTs as described above or may not be
provided at all.
[0082] For comparison purposes, in accordance with the conventional
manufacturing method of a surface acoustic wave device having a
SiO.sub.2 film, shown in FIGS. 18A-18D, a one-port type surface
acoustic wave resonator was formed. Also in this comparative
example, as a substrate material, a 36.degree. rotated Y-plate
X-propagation LiTaO.sub.3 substrate having Euler angle of
(0.degree., 126.degree., 0.degree.) was used, and the IDT electrode
was formed from Cu. As is apparent from the manufacturing method
shown in FIGS. 18A-18D, after the IDT electrode 53A is formed, the
SiO.sub.2 film 54 is formed, and as a result, irregularities cannot
be prevented from being formed on the surface of the SiO.sub.2 film
54. In FIG. 21, the impedance properties and the phase properties
are shown which are obtained in the comparative example in which a
normalized thickness h/.lamda. (where h indicates the thickness of
the IDT electrode, and .lamda. indicates the wavelength of a
surface acoustic wave) of an IDT electrode made of Cu is set to
about 0.042 and in which a normalized thickness Hs/.lamda. (where
Hs indicates the thickness of the SiO.sub.2 film) of the SiO.sub.2
film is set to about 0.11, about 0.22, and about 0.33. As shown in
FIG. 21, as the normalized thickness Hs/.lamda. of the SiO.sub.2
film is increased, the impedance ratio, the ratio between an
impedance at the antiresonant point and an impedance at the
resonant point, is decreased.
[0083] In addition, in FIG. 22, the relationship between the
normalized thickness Hs/.lamda. of the SiO.sub.2 film of the
surface acoustic wave resonator formed in the comparative example
and MF (Figure of Merit) of the resonator is shown. As shown in
FIG. 22, as the thickness of the SiO.sub.2 film is increased, MF is
decreased.
[0084] That is, when the IDT electrode and the SiO.sub.2 film are
formed in accordance with the conventional method shown in FIG. 18,
even if the IDT electrode is formed from Cu, as the thickness of
the SiO.sub.2 film is increased, the properties are severely
degraded. The reason for this is believed to be the afore-mentioned
irregularities that are inevitably generated on the surface of the
SiO.sub.2 film.
[0085] On the other hand, according to the manufacturing method of
this reference example, even when the thickness of the SiO.sub.2
film is increased, the properties are not substantially degraded as
shown in FIGS. 23 to 25.
[0086] FIG. 23 is a graph showing the changes in impedance
properties and phase properties obtained by changing the thickness
of the SiO.sub.2 film of the surface acoustic wave resonator 11
formed in accordance with the above reference example, that is, by
changing the thickness of the second SiO.sub.2 layer 6. In
addition, dotted lines in FIGS. 24 and 25 show the changes in
capacitance ratio .gamma. and MF of a resonator obtained when the
thickness Hs/.lamda. of the SiO.sub.2 film is changed in the
reference example. Incidentally, when the electromechanical
coefficient is represented by k.sup.2, the capacitance ratio
.gamma. can be approximated by an equation of the form
.gamma.=1/k.sup.2-1, based on the theory of piezoelectric bulk
waves, and it is preferable since the electromechanical coefficient
k.sup.2 increases as .gamma. decreases.
[0087] In addition, in FIGS. 24 and 25, the results of the above
comparative example are shown by solid lines.
[0088] When the results in FIG. 23 are compared with those in FIG.
21, in the above reference example, it is understood that even when
the normalized thickness Hs/.lamda. of the SiO.sub.2 film is
increased, the decrease in impedance is not likely to occur as
compared to that in the comparative example.
[0089] In addition, from the results shown in FIGS. 24 and 25, it
is understood that according to the manufacturing method of the
reference example, the degradation in properties concomitant with
the increase in normalized thickness Hs/.lamda. of the SiO.sub.2
film is suppressed as compared to that of the comparative
example.
[0090] That is, according to the manufacturing method of the
reference example, even when the thickness of the SiO.sub.2 film is
increased as described above, the impedance ratio is not likely to
substantially decrease, and the degradation in properties is
prevented and minimized.
[0091] In addition, FIG. 26 is a graph showing the relationship
between the thickness of the SiO.sub.2 film and the
frequency-temperature properties TCF of surface acoustic wave
resonators obtained by the manufacturing methods according to the
comparative example and the reference example.
[0092] In FIG. 26, the solid line and the dotted line indicate the
results of the comparative example and the reference example,
respectively.
[0093] As shown in FIG. 26, according to the manufacturing method
of the reference example, when the thickness of the SiO.sub.2 film
is increased, the frequency-temperature properties TCF is ideally
improved in accordance with the increase in thickness. In addition,
as shown in FIG. 26, where the thickness of the SiO.sub.2 film is
represented by h, and the wavelength of a surface acoustic wave is
represented by .lamda., when h/.lamda. is in the range of about
0.08 to about 0.5, the frequency-temperature properties TCF are
increased to more than about -20 ppm/.degree. C., that is, the
absolute value of the frequency-temperature properties TCF is
decreased to less than about 20 ppm/.degree. C., and the variation
in frequency-temperature properties TCF is effectively suppressed.
Accordingly, in a surface acoustic wave device of a preferred
embodiment of the present invention, which will be described later,
when the thickness of a second SiO.sub.2 film is represented by h,
h/.lamda. is preferably set in the range of about 0.08 to about 0.5
as described below.
[0094] Thus, it is understood that when the manufacturing method of
the above reference example is used, a surface acoustic wave
resonator is provided in which the properties are not likely to be
degraded and in which the temperature properties are effectively
improved.
[0095] In addition, in the manufacturing method of the reference
example, the IDT electrode is formed of Cu which has a density
greater than that of Al. Thus, the IDT electrode 4A has a
sufficient reflection coefficient, and undesired ripples which
appear in the resonant properties are prevented and minimized. The
reasons for this will be described below.
[0096] A surface acoustic wave resonator according to a second
comparative example was formed in a similar manner to that of the
above reference example except that an Al film was used instead of
Cu. However, the normalized thickness Hs/.lamda. of the SiO.sub.2
film was set to about 0.08. That is, the normalized thickness of
the thickness of the first SiO.sub.2 film was set to about 0.08.
The impedance and the phase properties of the surface acoustic wave
resonator are shown by solid lines in FIG. 27.
[0097] In addition, the impedance and the phase properties of a
surface acoustic wave resonator, which was formed in a manner
similar to that of the second comparative example except that the
SiO.sub.2 film was not formed, are shown by dotted lines in FIG.
27.
[0098] As apparent from the solid lines shown in FIG. 27, although
the manufacturing method was performed in accordance with that of
the above reference example, when the IDT electrode is formed of Al
and the SiO.sub.2 film is formed, a large ripple shown by an arrow
A in FIG. 27 appears between the resonant point and the
antiresonant point. In addition, in the surface acoustic wave
resonator having no SiO.sub.2 film, no ripples as described above
appear.
[0099] Hence, it is understood that although it is intended to
improve the frequency-temperature properties by the formation of
the SiO.sub.2 film, when the IDT electrode is formed of Al, the
ripple A appears, and as a result, the properties are degraded.
Through investigation further performed on the above point by the
inventors of the present invention, it was determined that when a
metal having a density greater than that of Al is used for the IDT
electrode, the reflection coefficient thereof can be increased, and
that the ripple A is thereby eliminated.
[0100] That is, in accordance with a manufacturing method similar
to that of the above reference example, surface acoustic wave
resonators are formed in a similar manner to that of the above
reference example, while the density of a metal forming the IDT
electrode 4 was variously changed. The impedance properties of the
surface acoustic wave resonators formed as described above are
shown in FIGS. 28A to 28E. FIGS. 28A to 28E show the results
obtained at ratios .rho..sub.1/.rho..sub.2 of 2.5, 2.0, 1.5, 1.2,
and 1.0, respectively, where .rho..sub.1 indicates the average
density of a laminate structure formed of the IDT electrode and the
protective metal film, and .rho..sub.2 indicates the density of the
first SiO.sub.2 layer.
[0101] As shown in FIGS. 28A to 28C, the ripple A is shifted out of
the band and, in addition, as shown in FIG. 28A, the ripple A is
significantly suppressed.
[0102] Thus, from the results shown in FIGS. 28A to 28E, it is
understood that when the density ratio of the laminate structure of
the IDT electrode and the protective metal film to the first
SiO.sub.2 layer is set to at least about 1.5 times, the ripple A is
shifted outside the band between the resonant frequency and the
antiresonant frequency such that superior properties are obtained.
In addition, it is understood that when the density ratio is more
preferably set to at least about 2.5 times, the ripple itself is
reduced.
[0103] In FIGS. 28A to 28E, since the Ti film is laminated on the
IDT electrode 4A in accordance with the above reference example,
the above average density is used. However, in the present
invention, the protective metal film may not be provided on the IDT
electrode 4A. In this case, the thickness of the IDT electrode 4A
is preferably equal to that of the first SiO.sub.2 layer, and the
ratio of the density of the IDT electrode to that of the first
SiO.sub.2 layer is preferably set to at least about 1.5 times, and
is more preferably set to at least about 2.5 times. As a result, it
was confirmed that effects similar to those described above are
also obtained.
[0104] Therefore, in a surface acoustic wave resonator in which the
IDT electrode is covered with a SiO.sub.2 film, it is understood
that when the density of the IDT electrode or the average density
of the laminate of the IDT electrode and the protective metal film
is greater than the density of the first SiO.sub.2 layer located at
the side of the IDT electrode, the reflection coefficient of the
IDT electrode is increased and that, as a result, the degradation
in properties shown between the resonant point and the antiresonant
point is prevented and minimized.
[0105] In addition, as the metal or the alloy, which has a density
greater than that of Al, instead of Cu, for example, Ag, Au, or an
alloy primarily formed therefrom may be used.
[0106] In addition, when the protective metal film is laminated on
the IDT electrode as in the above reference example, as shown in
the manufacturing method of FIGS. 20A to 20G, since the side
surfaces and the upper surface of the IDT electrode 4A are covered
with the first SiO.sub.2 layer 2 and the protective metal film 6,
respectively, when the resist pattern 3 is removed, the IDT
electrode 4A is prevented from being corroded. Thus, a surface
acoustic wave resonator having more superior properties is
provided.
[0107] Furthermore, instead of SiO.sub.2, the first and the second
SiO.sub.2 layers may be formed of an insulating material, such as
SiO.sub.xN.sub.y, having a temperature-property improving effect.
In addition, the first and the second SiO.sub.2 layers may be
formed of different insulating materials or may be formed of the
same material as described above.
[0108] FIG. 29 is a graph showing the relationship between the
electromechanical coefficient and the normalized thickness
H/.lamda. of the IDT electrode which is formed on a LiTaO3
substrate having Euler angles (0.degree., 126.degree., 0.degree.)
using various metals having various thicknesses.
[0109] The normalized thickness of the electrode at which the
electromechanical coefficient is greater than that of Al was
investigated for each metal from the data obtained from FIG. 29,
and the results shown in FIG. 30 were obtained. That is, in the
graph shown in FIG. 30, the electrode thickness ranges are shown in
which the electromechanical coefficient is greater than that of the
IDT electrode formed from Al as described above, those ranges being
obtained when IDT electrodes are formed using metals having various
densities on the LiTaO.sub.3 substrate.
[0110] In FIG. 30, in the thickness range of the electrode of each
metal, an upper limit is a limiting value in the range in which the
electromechanical coefficient of the metal is greater than that of
Al, and a lower limit of the electrode thickness range of each
metal is determined based on formation ability. When the upper
limit is approximated by a quadratic expression,
y=0.00025x2-0.01056x+0.16473 is satisfied, where y indicates the
range of an electrode thickness having a large electromechanical
coefficient, and x indicates the density.
[0111] Thus, as apparent from the description of particular
examples using various different electrode materials, which will be
described later, in the structure in which the electrode is formed
on a piezoelectric substrate of a 14.degree..about.50.degree.
rotated Y-plate X-propagation (Euler angles: (0.degree.,
104.degree..about.140.degree., 0.degree.) LiTaO.sub.3, and in which
the SiO.sub.2 film is further formed so as to have a normalized
thickness H/.lamda. in the range of about 0.03 to about 0.45, when
the normalized thickness H/.lamda. of the electrode satisfies the
following equation:
0.005.ltoreq.H/.lamda..ltoreq.0.00025x.rho..sup.2-0.01056x.rho.+0.16473
Equation (1),
as apparent from the results shown in FIG. 30, the
electromechanical coefficient is increased. In the above equation,
.rho. indicates the average density of the electrode.
[0112] In addition, the electrode is formed of the afore-mentioned
metal having a density greater than that of aluminum. In this case,
the electrode may be formed of a metal having a density greater
than that of aluminum or may be formed of an alloy primarily
composed of aluminum. In addition, the electrode may be formed of a
laminate having a major metal film made of aluminum or an alloy
primarily composed of aluminum and a minor metal film made of a
metal different from that used for the above-described major metal
film. When the electrode is formed of a laminate film, the average
density of the electrode preferably satisfies the equation
.rho.0x0.7.ltoreq..rho..ltoreq..rho.x1.3, where .rho.0 indicates
the metal density of the major electrode layer.
[0113] In addition, in the present invention, although the surface
of the second SiO.sub.2 layer is planarized as described above, the
planarization may be performed such that the irregularities are
about 30% or less of the thickness of the electrode. When the
irregularities are more than about 30%, the advantageous effects of
the planarization may not be sufficiently obtained.
[0114] Furthermore, as described above, the planarization of the
second SiO.sub.2 layer may be performed using various methods. For
example, a planarization method performed by an etch-back step, a
planarization method using an oblique incidence effect by a reverse
sputtering effect, a method for polishing an insulating layer
surface, or a method for polishing an electrode may be used.
Alternatively, at least two of these methods may be used in
combination.
First Preferred Embodiment
[0115] FIG. 1 is a schematic, front, cross-sectional view of a
surface acoustic wave device according to a first preferred
embodiment of the present invention. The electrode structure of the
surface acoustic wave device of this preferred embodiment is
preferably equivalent to that of the surface acoustic wave device
11 described above. That is, the electrode structure shown in FIG.
4 is also provided in the surface acoustic wave device of this
preferred embodiment. Thus, FIG. 4 is also a schematic front view
illustrating the electrode structure of the surface acoustic wave
device of this preferred embodiment. However, in FIG. 4, a SiN
layer which will be described later is omitted.
[0116] A surface acoustic wave device 21 of this preferred
embodiment is formed in a similar manner to that of the above
surface acoustic wave device 11 except that a SiN layer 22 is
provided at the topmost portion.
[0117] That is, as shown in FIG. 1, the surface acoustic wave
device 21 includes a piezoelectric substrate 1 formed from a
36.degree. rotated Y-plate X-propagation LiTaO.sub.3 substrate. On
the piezoelectric substrate 1, the IDT electrode 4A is formed. More
particularly, as the electrode, the IDT electrode 4A is provided
and the reflectors 12 and 13 are disposed at two sides of the IDT
electrode 4A in the surface acoustic wave propagation direction.
That is, in order to define a one terminal-pair surface acoustic
wave resonator, the IDT electrode 4A and the reflectors 12 and 13
are provided. The IDT electrode 4A has a pair of comb electrodes
each having a plurality of electrode fingers, and the electrode
fingers of said pair of the comb electrodes are interdigitated with
each other. In addition, the reflectors 12 and 13 each include
electrode fingers that are short-circuited at two ends of the
reflector.
[0118] With reference to FIG. 1, in regions other than those at
which the electrode is provided, the first SiO.sub.2 layer 2 is
provided.
[0119] In addition, the thickness of the first SiO.sub.2 layer 2 is
set to be approximately equal to that of the electrode. Thus, the
upper surface of the structure including the electrode and the
first SiO.sub.2 layer 2 is planarized, as in the case of the
above-described reference example. In other words, the upper
surface of the electrode and the upper surface of the first
SiO.sub.2 layer 2 are disposed at approximately the same
height.
[0120] The second SiO.sub.2 layer 6 is disposed so as to cover the
electrode and the first SiO.sub.2 layer 2.
[0121] When the second SiO.sub.2 layer 6 is formed using a
thin-film forming method such as sputtering, the upper surface of
the second SiO.sub.2 layer 6 is formed so as to be flat. That is,
since the upper surface of the first SiO.sub.2 layer 2 and that of
the electrodes are disposed at approximately the same height, when
the second SiO.sub.2 layer 6 is formed by a thin-film forming
method, the upper surface of the second SiO.sub.2 layer 6 has an
approximately flat surface, and as a result, the generation of
undesired ripples is effectively eliminated.
[0122] In addition, with the various planarization methods
described above, the upper surface of the second SiO.sub.2 layer 6
may also be planarized. The meaning of the planarization is the
same as that described above.
[0123] In addition, as described with reference to FIG. 26, the
thickness h/.lamda. of the second SiO.sub.2 layer 6 covering the
electrode is preferably set in the range of about 0.08 to about 0.5
in accordance with the results shown in FIG. 26, and as a result,
the absolute value of the amount of change in frequency-temperature
properties TCF is decreased to about 20 ppm/.degree. C. or
less.
[0124] As described above, the surface acoustic wave device 21 is
substantially the same as the surface acoustic wave device 11
described in the reference example, except for the SiN layer 22.
That is, in the surface acoustic wave device 21, the electrode is
formed of (1) a metal having a density greater than that of Al or
an alloy primarily formed of the metal, or is formed of (2) a
laminate film including a metal layer as a major metal layer, which
is composed of a metal having a density greater than that of Al or
an alloy primarily formed of the metal, and a metal layer made of
another metal and provided on the major metal layer. In addition,
the density of the electrode is set to be at least about 1.5 times
the density of the first SiO.sub.2 layer 2. Thus, in the surface
acoustic wave device 21 of this preferred embodiment, the same
function and advantage as that obtained by the surface acoustic
wave device 11 of the above reference example are obtained.
[0125] In the surface acoustic wave device 21 of this preferred
embodiment, the SiN layer 22 is disposed so as to cover the second
SiO.sub.2 layer 6. In this preferred embodiment, the SiN layer 22
is preferably defined by a SiN film. The SiN layer 22 is made of a
material having an acoustic velocity different from that of the
second SiO.sub.2 layer 6. In addition to the above-described
function and advantage obtained by the surface acoustic wave device
11 in which the surface of the second SiO.sub.2 layer 6 is
planarized, the fractional band width (fa-fc)/fc (%) is increased
in the surface acoustic wave device 21 according to this preferred
embodiment. In the fractional band width, fc indicates a resonant
frequency, and fa indicates an antiresonant frequency. In addition,
since the resistance at the antiresonant frequency fa, that is,
antiresonant resistance Ra, is increased, Q at the antiresonant
frequency fa is increased, and for example, in a band pass filter
including a plurality of the surface acoustic wave devices 21, the
attenuation amount in the attenuation region at a high frequency
side of the pass band is increased, such that the steepness of the
filter properties is increased.
[0126] The above-described functions and advantages of the surface
acoustic wave device 21 of this preferred embodiment will be
described with reference to more particular experimental
examples.
[0127] A SiO.sub.2 film having a thickness h/.lamda. of about 0.04
and the first SiO.sub.2 layer 2 were formed over the entire surface
of a 36.degree. rotated Y-plate X-propagation LiTaO.sub.3 substrate
used as the piezoelectric substrate 1. The formation of the
SiO.sub.2 film may be performed by an optional method such as
printing, deposition, or sputtering. However, in this preferred
embodiment, the formation was performed by sputtering.
[0128] Next, by using a photolithographic technique, the SiO.sub.2
film was patterned. Patterning was performed so as to remove the
SiO.sub.2 film provided in the region at which the electrode was
formed.
[0129] Next, a Ti film having a thickness h/.lamda. of about 0.0025
and a Cu film having a thickness h/.lamda. of about 0.0325 were
sequentially formed. The total thickness h/.lamda. of the Ti film
and the Cu film was about 0.035.
[0130] Subsequently, the Ti film and the Cu film disposed on the
resist pattern provided on the SiO.sub.2 film were removed. As
described above, the first SiO.sub.2 layer 2 and the electrode were
formed.
[0131] Next, by sputtering, a SiO.sub.2 film was formed over the
entire surface, such that the second SiO.sub.2 layer 6 was formed.
Finally, a SiN film was formed by sputtering, such that the SiN
layer 22 was formed. In the surface acoustic wave device 21
obtained as described above, after the frequency properties are
measured, frequency adjustment is performed by machining the SiN
layer 22. This frequency adjustment will be described with
reference to FIG. 5. The data including the frequency properties
shown in FIG. 5, and other figures, are properties obtained when a
one-port type surface acoustic wave resonator for a 1.9 GHz band
was formed which had the electrode structure shown in FIG. 4.
[0132] FIG. 5 is a graph showing the change in antiresonant
frequency fa when the thickness of a SiN layer 22 of the surface
acoustic wave device 21 is changed.
[0133] In general, in the surface acoustic wave device 21, when the
thickness of the laminate film made of the SiO.sub.2 film and the
SiN film is increased, the insertion loss is increased, and the
frequency properties are significantly degraded. However, in this
preferred embodiment, since the upper surface of the second
SiO.sub.2 layer 6 is planarized as described above, the degradation
in properties caused by the increase in thickness of the laminate
film is eliminated and minimized.
[0134] As shown in FIG. 5, when the thickness of the SiN film is
changed, the antiresonant frequency fa is substantially changed.
Thus, when the thickness of the SiN layer 22 is decreased, for
example, using reactive ion etching or physical etching by
irradiation of inert ions such as Ar or N.sub.2, the frequency is
easily adjusted. Alternatively, when the SiN film is further formed
by sputtering so as to increase the thickness of the SiN layer 22,
the frequency adjustment may also be performed so as to increase
the frequency.
[0135] The frequency adjustment performed by the thickness
adjustment of the SiN layer 22 as described above can be easily
performed at a mother wafer stage to obtain the surface acoustic
wave device 21. In addition, when the frequency adjustment is
performed so as to decrease the thickness of the SiN layer 22
using, for example, reactive ion etching or physical etching by
irradiation of inert ions such as Ar or N.sub.2, the frequency
adjustment can be performed when the surface acoustic wave device
21 is mounted on a package.
[0136] The surface acoustic wave device 11 of the reference example
had the same structure as that of this preferred embodiment, except
that the SiN layer 22 was not formed on the second SiO.sub.2 layer
6. In the surface acoustic wave device 11 of the reference example,
by adjusting the thickness of the second SiO.sub.2 layer 6, the
frequency is adjusted. However, since the SiN layer 22 was not
provided, when the frequency was adjusted by adjusting the
thickness of the second SiO.sub.2 layer 6, the
frequency-temperature coefficient TCF (ppm/.degree. C.) and the
fractional band width were substantially changed. On the other
hand, in this preferred embodiment, the frequency adjustment is
performed by adjusting the thickness of the SiN layer 22, and in
this case, the change in frequency-temperature coefficient TCF and
that in fractional band width are suppressed. These effects will be
described with reference to FIGS. 6 and 7. The change in the
fractional band width is produced by the variation in
electromechanical coefficient caused by the thickness
adjustment.
[0137] FIG. 6 is a graph showing the change in
frequency-temperature properties with the change in frequency when
the frequency adjustment is performed by the thickness adjustment
of the SiN film in this preferred embodiment, and when the
frequency adjustment is performed by the thickness adjustment of
the SiO.sub.2 film in the surface acoustic wave device 11 of the
reference example, and FIG. 7 is a graph showing the change in
fractional band width with the change in frequency.
[0138] As shown in FIGS. 6 and 7, in the surface acoustic wave
device 11, when the frequency is adjusted by the thickness
adjustment of the second SiO.sub.2 layer 6, the
frequency-temperature coefficient TCF and the fractional band width
are substantially changed. On the other hand, in the surface
acoustic wave device 21 of this preferred embodiment, when the
frequency is adjusted by the thickness adjustment of the SiN layer
22, the frequency-temperature coefficient TCF and the fractional
band width are not substantially changed.
[0139] Thus, as described above, since the SiN layer 22 is provided
in this preferred embodiment, the frequency adjustment is performed
without causing considerable changes in fractional band width and
frequency-temperature TCF. In particular, as shown in FIG. 6, when
h/.lamda. is set so as to satisfy an equation,
0<h/.lamda..ltoreq.0.1, in which the wavelength of a surface
acoustic wave is represented by h, the amount of change in
frequency-temperature properties TCF is controlled to be about 10
ppm/.degree. C. or less.
[0140] In this preferred embodiment, since the layer 22 is formed
of SiN, reactive ion etching thereof can be performed with a gas
similar to that used for SiO.sub.2 forming the second SiO.sub.2
layer 6. Thus, in addition to the thickness adjustment of the SiN
layer 22 which is easily performed by reactive ion etching, a step
of removing an insulating film provided on electrode pads, which
are necessarily exposed for electrical connection of the electrode
with the exterior, is easily performed.
[0141] Next, in the surface acoustic wave device 21 of this
preferred embodiment, the change in frequency properties with the
change in thickness of the SiN layer 22 is shown in FIG. 8. In
addition, FIGS. 9 and 10 show the changes in fractional band width
and antiresonant resistance Ra in response to changes in the
thickness of the SiN film.
[0142] As shown in FIG. 8, the resonant frequency fr and the
antiresonant frequency fa are increased as the thickness of the SiN
film is increased from about 0 to about 200 nm. In addition, as
shown in FIG. 9, as the thickness of the SiN layer 22 is increased,
the fractional band width is increased. In particular, when the
thickness of the SiN layer 22 is in the range of about 100 nm to
about 200 nm, that is, when h/.lamda. is set in the range of about
0.05 to about 0.1, the fractional band width is increased to at
least about 3.1%.
[0143] In addition, as shown in FIG. 10, the antiresonant
resistance Ra increases as the thickness of the SiN film increases,
and thereby Q at the antiresonant frequency is increased. Thus, in
a band pass filter including this surface acoustic wave device 21,
the steepness of the filter properties at a high frequency region
of the pass band are effectively increased.
[0144] In particular, when the thickness of the SiN film is in the
range of about 100 nm to about 200 nm, that is, when the normalized
thickness h/.lamda. is in the range of about 0.05 to about 0.1, the
antiresonant resistance Ra is at least about 57.5 dB, and when the
thickness is about 150 nm, that is, when the normalized thickness
h/.lamda. is about 0.075, the antiresonant resistance Ra is
maximally increased to about 60 db.
[0145] In this preferred embodiment, the surface of the second
SiO.sub.2 layer 6 is planarized, and the SiN layer 22 is formed on
the upper surface of the second SiO.sub.2 layer 6, such that the
properties are improved as described above. The effect obtained by
the formation of the SiN layer 22 is based on the planarization of
the surface of the second SiO.sub.2 layer 6 as described above. The
above effect will be described with reference to FIGS. 11 to
13.
[0146] FIG. 11 is a graph showing the frequency properties of the
surface acoustic wave device of this preferred embodiment, which
are obtained before the SiN layer 22 is formed, and for comparison
purposes, showing the frequency properties of a surface acoustic
wave device formed in a manner similar to that described above,
except that the upper surface of the SiO.sub.2 film is not
planarized. When the surface acoustic wave device used for
comparison purposes was formed, after the electrode was formed, a
SiO.sub.2 film having a thickness of about 400 nm (h/.lamda. equal
to about 0.2) was formed by sputtering. That is, the first
SiO.sub.2 layer 2 and the second SiO.sub.2 layer 6 were not
separately formed, and the surface acoustic wave device used for
comparison purposes was formed by forming a SiO.sub.2 film having a
thickness of about 400 nm (h/.lamda. equal to about 0.2). As shown
in FIG. 11, when the planarization is performed, the resistance at
the antiresonant frequency, that is, the antiresonant resistance,
and the fractional band width are increased.
[0147] As in the above-described preferred embodiment, the SiN film
was formed so as to have various thicknesses, and the fractional
band width and the antiresonant resistance Ra were measured. The
results are shown in FIGS. 12 and 13. As shown in FIGS. 12 and 13,
in this preferred embodiment, with the formation of the SiN layer
22 from the SiN film and the increase in thickness of the SiN film,
the increase in fractional band width and the improvement in
antiresonant resistance Ra are achieved. However, in the
comparative example in which the upper surface of the second
SiO.sub.2 layer 6 is not planarized, even when the SiN film is
formed, the properties are not improved. In particular, when the
thickness of the SiN film is increased, the properties are further
degraded.
[0148] In addition, as in the above-described preferred embodiment,
various surface acoustic wave devices 21 were formed while the
thickness of the second SiO.sub.2 layer 6, the thickness of the SiN
film 22, and the cut angle of the piezoelectric substrate are
varied, and the change in antiresonant Q value with the change in
cut angle of the piezoelectric substrate was measured. One example
of the change in antiresonant Q value with the cut angle is shown
in FIG. 34. In FIG. 34, the change in antiresonant Q value of the
surface acoustic wave device 21 is shown, which is obtained when
the normalized thickness of the second SiO.sub.2 layer 6 is set to
about 0.28, the normalized thickness of the SiN layer 22 is set to
about 0.075, and the cut angle of the piezoelectric substrate made
of LiTaO.sub.3 is changed.
[0149] As shown in FIG. 34, when the cut angle is in the range of
34.+-.5.degree., the antiresonant Q value is preferably high, such
as at least approximately 500.
[0150] As shown in FIG. 34, the relationship between the thickness
of the SiN film and the range of the cut angle of the LiTaO3
substrate is obtained at which an antiresonant Q value of at least
approximately 500 is achieved. The results are shown in FIG. 35.
That is, in FIG. 35, the change in optimal cut angle range with the
change in thickness of the SiN film is shown when the normalized
thickness of the second SiO.sub.2 layer 6 is set to about 0.15,
about 0.30, and about 0.40. When the results shown in FIG. 35 are
approximated, a preferable cut angle range of a rotated Y-plate
X-propagation LiTaO.sub.3 substrate is .theta..+-.5.degree. where
.theta.=(A.sub.1H.sub.1.sup.2+A.sub.2H.sub.1+A.sub.3)H.sub.2+A.sub.4H.sub-
.1+A.sub.5 is satisfied.
[0151] In the above equation, coefficients A1 to A5 are as
follows.
coefficient A.sub.1=-190.48, coefficient A.sub.2=76.19, coefficient
A.sub.3=-120.00, coefficient A.sub.4=-47.30, coefficient
A.sub.5=55.25, H.sub.1=h.sub.1/.lamda., and
H.sub.2=h.sub.2/.lamda..
[0152] In addition, h.sub.2 indicates the thickness of the SiN
layer, and h.sub.1 indicates the thickness of the second SiO.sub.2
layer 6.
Second Preferred Embodiment
[0153] FIG. 14 is a schematic, front, cross-sectional view of a
surface acoustic wave device of a second preferred embodiment
according to the present invention. In a surface acoustic wave
device 31, the electrode is formed on the 36.degree. rotated
Y-plate X-propagation LiTaO.sub.3 substrate 1. The electrode has a
plane shape equivalent to that of the first preferred embodiment.
That is, in this preferred embodiment, the electrode including the
IDT electrode 4A and a pair of the reflectors 12 and 13 is arranged
so as to define a one-port type surface acoustic wave device for a
1.9 GHz band.
[0154] In addition, the electrode includes a Ti film, a Cu film,
and a Ti film having thicknesses of about 5 nm, about 65 nm, and
about 10 nm, respectively. Then, a first SiO.sub.2 layer 32 is
provided so as to have a thickness of about 80 nm.
[0155] In this preferred embodiment, a diffusion inhibition film 35
is disposed so as to cover the electrode and the first SiO.sub.2
layer 32. The diffusion inhibition film 35 is made of a SiN film in
this preferred embodiment.
[0156] In addition, on the diffusion inhibition film 35, a second
SiO.sub.2 layer 36 is provided.
[0157] In this preferred embodiment, since the diffusion inhibition
film 35 is made of SiN, diffusion of metal particles from the
electrode to the second SiO.sub.2 layer 36 is effectively
eliminated and minimized.
[0158] When the surface acoustic wave device 31 of this preferred
embodiment is manufactured, after the diffusion inhibition film 35
is formed, the second SiO.sub.2 layer 36 is provided as a
temperature property-improvement film by forming a SiO.sub.2 film
so as to improve the temperature properties, and subsequently, an
insulating material on electrode pads of the electrode is removed
by reactive ion etching to expose the electrode pads.
[0159] When the diffusion inhibition film 35 is not formed, while
the second SiO.sub.2 layer 36 is formed, an electrode material, Cu
in this preferred embodiment, diffuses. As a result, as shown in
FIGS. 15A and 15B, when the diffusion inhibition film 35 is not
provided, due to the diffusion of Cu, voids are formed in the
electrode and/or the flatness of the surface of the second
SiO.sub.2 layer 36 is degraded.
[0160] On the other hand, as shown in FIGS. 16A and 16B, in this
preferred embodiment, since the diffusion inhibition film 35 made
of SiN is formed, the diffusion of Cu of the electrode is
eliminated and minimized. Thus, the generation of voids shown in
FIG. 15B is prevented, and the flatness of the surface of the
second SiO.sub.2 layer 36 is improved.
[0161] Hereinafter, the above-described effects will be described
with reference to particular experimental examples.
[0162] The following table 1 shows variations in properties of
individual surface acoustic wave devices including a surface
acoustic wave wafer having a diameter of about 10.16 cm, which were
obtained for the surface acoustic wave device of the second
preferred embodiment in which the diffusion inhibition film 35 is
provided, and when a surface acoustic wave device is formed in a
manner equivalent to that described above except that the diffusion
inhibition film 35 is not provided. In this case, the thickness of
the SiN film used as the diffusion inhibition film 35 was set to
about 30 nm (h/.lamda.=0.015).
TABLE-US-00001 TABLE 1 Antiresonant Antiresonant Fractional Band
Frequency (MHz) Resistance (dB) Width (%) Standard Standard
Standard Aver- Deviation Aver- Deviation Aver- Deviation age
.sigma. age .sigma. age .sigma. With SiN 1924.18 2.64 53.2 0.31
2.88 0.036 Film Without SiN 1934.61 1.53 53.4 0.11 2.85 0.021
Film
[0163] As shown in Table 1, with the insertion of the diffusion
inhibition film 35, the variation in properties, such as variation
in frequency, is effectively prevented and minimized.
[0164] In addition, in this preferred embodiment, since the
diffusion inhibition film 35 is made of SiN, reactive ion etching
can be performed using a gas similar to that used for forming the
first SiO.sub.2 layer 32 and the second SiO.sub.2 layer 36. Thus,
the step of removing an insulating film on the electrode pads for
exposure thereof is simplified.
[0165] In the second preferred embodiment, the surface acoustic
wave device 31 is received in a package and is then wire-bonded and
sealed, such that a surface acoustic wave device product is
obtained. For the surface acoustic wave device product thus
obtained, a high temperature load test was performed in which the
product was maintained for approximately 600 hours under the
following conditions.
[0166] High Temperature Load Test . . . While a direct current
voltage of 6V was applied to a surface acoustic wave device
product, the product was placed in a high temperature bath, and the
insulating resistance was measured with time.
[0167] For comparison purposes, in a manner similar to the
above-described experimental example, a high temperature load test
was performed for a surface acoustic wave device product formed in
a manner similar to that described above except that the diffusion
inhibition film 35 was not provided. The results are shown in FIG.
17.
[0168] As shown in FIG. 17, in the experimental example in which
the diffusion inhibition film 35 is provided, malfunction is
unlikely to occur even after approximately 600 hours as compared to
that of the comparative example having no diffusion inhibition
film. In addition, as shown in Table 1, even when the diffusion
inhibition film 35 is provided, the antiresonant resistance Ra and
the fractional band width of the surface acoustic wave device are
not degraded.
[0169] The thickness h of the diffusion inhibition film 35 made of
SiN is preferably set so as to satisfy the equation
0.005.ltoreq.h/.lamda..ltoreq.0.05, where .lamda. indicates the
wavelength of a surface acoustic wave. This will be described with
reference to FIGS. 31 to 33 and Table 2 shown below.
[0170] That is, in the second preferred embodiment, various surface
acoustic wave filter devices were formed by variously changing the
thickness of the SiN film defining the diffusion inhibition film
35, and the properties were measured. FIGS. 31 to 33 are graphs
showing the changes in antiresonant resistance, fractional band
width of a filter, and temperature properties TCF at the resonant
frequency, described above, which were obtained when the thickness
of the SiN film was changed.
[0171] In addition, in the surface acoustic wave filter device of
the second preferred embodiment described above, after individual
surface acoustic wave devices 21 were formed in a manner similar to
that described above except that the thickness of the SiN film was
changed to about 5 nm, about 10 nm, and about 30 nm, and
furthermore, the surface acoustic wave device 31 having no
diffusion inhibition film was formed for comparison purpose, a high
temperature load test was performed. The results are shown in Table
2 below.
[0172] In Table 2, .largecircle. indicates no malfunctions (an
insulating resistance of at least about 106.OMEGA.), .DELTA.
indicates that although a suppression effect is observed, some are
out of order, and x indicates that all show inferior resistance
properties and are out of order.
TABLE-US-00002 TABLE 2 Thickness of SiN Film (nm) 0 X 5 .DELTA. 10
.largecircle. 30 .largecircle.
[0173] As shown in FIGS. 31 to 33 and the result shown in Table 2,
when the thickness of the diffusion inhibition film 35 made of the
SiN film is set in the range of about 10 nm to about 100 nm, that
is, when the normalized thickness h/.lamda. is set in the range of
about 0.005 to about 0.05, the surface acoustic wave device 31 has
stable temperature properties, such that the amount of change in
TCF is about 10 ppm/.degree. C. or less, and has superior
resistance properties when a direct current voltage is applied.
[0174] In the second preferred embodiment, SiN is preferably used
as the diffusion inhibition film 35. However, another nitride film
may also be used. For example, AlN, TiN, TaN, or WN may be used.
Furthermore, the diffusion inhibition film may be made of an oxide
film, such as, for example, Ta.sub.2O.sub.5.
[0175] In addition, in FIG. 14, although the diffusion inhibition
film 35 is disposed so as to cover the upper surface of the
electrode, it may also be disposed so as to cover the side surfaces
thereof, and in this case, it is preferable since the diffusion of
the electrode material is more effectively prevented.
[0176] In addition, in the second preferred embodiment, the
diffusion inhibition film 35 is provided between the electrode and
the second SiO.sub.2 layer 36, and the SiN layer 22 shown in the
first preferred embodiment may also be formed on the second
SiO.sub.2 layer 36. The configuration described above is preferable
since the effects of both of the first and the second preferred
embodiments are obtained.
[0177] In the first and the second preferred embodiments, as the
piezoelectric substrate, a 36.degree. rotated Y-plate X-propagation
LiTaO.sub.3 substrate is used. However, a LiTaO.sub.3 substrate
having another cut angle may also be used, or another piezoelectric
substrate, such as a LiNbO.sub.3 substrate, may also be used.
[0178] In addition, in the above first and the second preferred
embodiments, a one-port type surface acoustic wave resonator is
described. However, the present invention can be applied to various
general surface acoustic wave devices, including surface acoustic
wave filters, such as a ladder type filter including a plurality of
one-port type surface acoustic wave resonators as described above.
In addition, instead of the one-port type surface acoustic wave
resonator described above, the electrode may be formed so as to
have various filter and resonator structures.
[0179] While preferred embodiments of the present invention have
been described above, it is to be understood that variations and
modifications will be apparent to those skilled in the art without
departing the scope and spirit of the present invention. The scope
of the present invention, therefore, is to be determined solely by
the following claims.
* * * * *