U.S. patent application number 11/616794 was filed with the patent office on 2008-07-03 for socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator.
Invention is credited to David S. Chau, Ashish Gupta.
Application Number | 20080155990 11/616794 |
Document ID | / |
Family ID | 39582017 |
Filed Date | 2008-07-03 |
United States Patent
Application |
20080155990 |
Kind Code |
A1 |
Gupta; Ashish ; et
al. |
July 3, 2008 |
SOCKET ENABLED CURRENT DELIVERY TO A THERMOELECTRIC COOLER TO COOL
AN IN-SUBSTRATE VOLTAGE REGULATOR
Abstract
An apparatus including a socket having a socket body and a
cavity within the socket body. The apparatus further including a
thermoelectric cooler coupled to an in-substrate voltage regulator
positioned within the cavity. A method including coupling a
thermoelectric cooler to an in-substrate voltage regulator
positioned within a cavity of a socket and electrically coupling
the thermoelectric cooler to the socket using a contact of the
socket. A system including an electronic appliance having a
processor including an in-substrate voltage regulator positioned
within a cavity of a socket coupled to the processor. The system
further including a thermoelectric cooler positioned within the
cavity and coupled to the in-substrate voltage regulator.
Inventors: |
Gupta; Ashish; (Chandler,
AZ) ; Chau; David S.; (Chandler, AZ) |
Correspondence
Address: |
INTEL/BLAKELY
1279 OAKMEAD PARKWAY
SUNNYVALE
CA
94085-4040
US
|
Family ID: |
39582017 |
Appl. No.: |
11/616794 |
Filed: |
December 27, 2006 |
Current U.S.
Class: |
62/3.2 ;
62/259.2; 62/3.7 |
Current CPC
Class: |
H05K 7/1092 20130101;
F25B 21/02 20130101; G06F 1/20 20130101; F25B 2321/0212
20130101 |
Class at
Publication: |
62/3.2 ; 62/3.7;
62/259.2 |
International
Class: |
F25B 21/02 20060101
F25B021/02; F25D 23/12 20060101 F25D023/12 |
Claims
1. An apparatus comprising: a socket comprising a socket body and a
cavity within the socket body; and a thermoelectric cooler coupled
to an in-substrate voltage regulator positioned within the
cavity.
2. The apparatus of claim 1, wherein the socket comprises a set of
contacts and at least one of the contacts is electrically coupled
to the thermoelectric cooler.
3. The apparatus of claim 1, further comprising: an integrated heat
spreader coupled to the thermoelectric cooler.
4. The apparatus of claim 3, wherein the thermoelectric cooler is
embedded in the integrated heat spreader.
5. The apparatus of claim 1, further comprising: a thermal
interface material coupled to the in-substrate voltage regulator
and the thermoelectric cooler.
6. The apparatus of claim 1, further comprising: one of a heat
pipe, a cold plate of a microchannel liquid cooler and a heat sink
thermally coupled to the thermoelectric cooler.
7. The apparatus of claim 1, wherein more than one thermoelectric
cooler is coupled to the in-substrate voltage regulator.
8. A method comprising: coupling a thermoelectric cooler to an
in-substrate voltage regulator positioned within a cavity of a
socket; and electrically coupling the thermoelectric cooler to the
socket using a contact of the socket.
9. The method of claim 8, further comprising: coupling an
integrated heat spreader to the thermoelectric cooler.
10. The method of claim 9, wherein coupling the integrated heat
spreader to the thermoelectric cooler comprises embedding the
thermoelectric cooler in the integrated heat spreader.
11. The method of claim 8, further comprising: thermally coupling a
thermal interface material to the in-substrate voltage regulator
and the thermoelectric cooler.
12. The method of claim 8, further comprising: thermally coupling
one of a heat sink, a cold plate of a microchannel liquid cooler
and a heat pipe to the thermoelectric cooler.
13. The method of claim 8, further comprising: coupling more than
one thermoelectric cooler to the in-substrate voltage
regulator.
14. A system comprising: an electronic appliance comprising: a
processor including an in-substrate voltage regulator positioned
within a cavity of a socket coupled to the processor; and a
thermoelectric cooler positioned within the cavity and coupled to
the in-substrate voltage regulator.
15. The system of claim 14, further comprising: an integrated heat
spreader coupled to the thermoelectric cooler.
16. The system of claim 15, wherein the thermoelectric cooler is
embedded in the integrated heat spreader.
17. The system of claim 14, wherein a contact of the socket is
electrically coupled to the thermoelectric cooler.
18. The system of claim 14, further comprising: a thermal interface
material coupled to the in-substrate voltage regulator and the
thermoelectric cooler.
19. The system of claim 14, further comprising: one of a heat sink,
cold plate of a microchannel liquid cooler and a heat pipe
thermally coupled to the thermoelectric cooler.
20. The system of claim 14, wherein more than one thermoelectric
cooler is coupled to the in-substrate voltage regulator.
Description
FIELD
[0001] Embodiments described herein generally relate to the field
of integrated circuit package cooling, and more particularly, to
socket enabled current delivery to a thermoelectric cooler for
cooling of in-substrate voltage regulators.
BACKGROUND
[0002] The demand for small form-factor, high-speed computing
systems has led to placing components such as voltage regulators on
a substrate of an integrated circuit package. Voltage regulators
have the potential to remove system board parasitic influences and
improve on third, and possibly second, voltage droop. A voltage
regulator, however, can produce a significant amount of heat that
could impact the performance and reliability of the integrated
circuit package.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] The features, aspects, and advantages of the invention will
become more thoroughly apparent from the following detailed
description, appended claims, and accompanying drawings that are
used to illustrate embodiments of the invention. In the
drawings:
[0004] FIG. 1 shows a cross-sectional side view of socket enabled
current delivery to a thermoelectric cooler to cool an in-substrate
voltage regulator in connection with a computer system, in
accordance with one embodiment.
[0005] FIG. 2 shows a cross-sectional side view of socket enabled
current delivery to a thermoelectric cooler to cool an in-substrate
voltage regulator, in accordance with another embodiment.
[0006] FIG. 3 shows a cross-sectional side view of socket enabled
current delivery to a thermoelectric cooler to cool an in-substrate
voltage regulator, in accordance with another embodiment.
[0007] FIG. 4 shows an exploded view of a thermoelectric cooler to
cool an in-substrate voltage regulator, in accordance with one
embodiment.
DETAILED DESCRIPTION
[0008] In the following description, numerous specific details are
set forth. However, it is understood that embodiments of the
invention may be practiced without these specific details. In other
instances, well-known circuits, structures and techniques have not
been shown in detail in order not to obscure the understanding of
this description.
[0009] FIG. 1 shows a cross-sectional side view of socket enabled
current delivery to a thermoelectric cooler to cool an in-substrate
voltage regulator, in accordance with one embodiment. In accordance
with the illustrated embodiment, electronic assembly 100 includes
one or more of socket 101 including a socket body 102, socket
contacts 104, integrated heat spreader 106, die 108, substrate 110,
in-substrate voltage regulator 112, die heat spreader 114, heat
sink 116, and printed circuit board 118.
[0010] Socket body 102 represents a material such as plastic that
provides mechanical support and attachment for an integrated
circuit package and includes socket contacts 104 to electrically
couple the integrated circuit package with traces and other
components (not shown) on printed circuit board 118. In one
embodiment, socket body 102 is a land grid array (LGA) socket with
socket contacts 104 arranged around a substantially central cavity
120. Alternatively, socket body 102 may be any type of socket body
deemed desirable. In some embodiments, socket contacts 104 are
arranged around cavity 120 in a square pattern.
[0011] One or more of thermoelectric cooler 122 may be placed in
cavity 120 to dissipate heat from in-substrate voltage regulator
112. In this aspect, thermoelectric cooler 122 is placed adjacent
in-substrate voltage regulator 112. Thermoelectric cooler 122 may
have any dimensions suitable for positioning thermoelectric cooler
122 within cavity 120 and cooling in-substrate voltage regulator
112. For example, thermoelectric cooler 122 may be a thin film,
micro or nano sized thermoelectric cooler or any other similarly
sized thermoelectric cooler. Thermoelectric cooler 122 may be made
of any material suitable to dissipate heat from in-substrate
voltage regulator 112, such as, thin film superlattices or
nanocomposites.
[0012] In some embodiments, thermoelectric cooler 122 has
substantially the same or smaller dimensions than that of
in-substrate voltage regulator 112. For example, it is contemplated
that in some embodiments, thermoelectric cooler 122 has
substantially the same surface dimensions as in-substrate voltage
regulator 112 such that the entire in-substrate voltage regulator
112 may be cooled by a single thermoelectric cooler 122. In other
embodiments, such as that shown in FIG. 1, thermoelectric cooler
122 has a smaller surface dimension than in-substrate voltage
regulator 112. In this aspect, thermoelectric cooler 122 may be
positioned adjacent a hot spot of in-substrate voltage regulator so
that it cools this portion of in-substrate voltage regulator 112.
In this aspect, localized cooling of in-substrate voltage regulator
112 may be achieved. It is contemplated that more then one
thermoelectric cooler 122 may be used where cooling of multiple
localized regions of in-substrate voltage regulator 112 is deemed
desirable. For example, in some embodiments, more than one
thermoelectric cooler 122 could be placed thermally parallel to
each other (next to each other) for cooling of different locations
or in series (stacked on top of each other) to enhance a cooling
load.
[0013] Integrated heat spreader 106 may further be placed in cavity
120 of socket body 102. Integrated heat spreader 106 may be used to
dissipate heat from thermoelectric cooler 122 and in-substrate
voltage regulator 112. In this aspect, a thermal impact of
in-substrate voltage regulator 112 on assembly 100, and die 108
specifically, may be reduced.
[0014] Integrated heat spreader 106 may further be used to
facilitate insertion of thermoelectric cooler 122 within cavity
120. Due to the dimensions of cavity 120 it may be difficult to
position thermoelectric cooler 122 within cavity 120. In this
aspect, thermoelectric cooler 122 may be connected to a flat
surface of integrated heat spreader 106 as shown in FIG. 1 prior to
inserting integrated heat spreader 106 in cavity 120. Integrated
heat spreader 106 with thermoelectric cooler 122 attached may then
be inserted into cavity 120 when the associated integrated circuit
package is inserted in socket body 120. In this aspect, integrated
heat spreader 106 provides support for thermoelectric cooler 122
within cavity 120.
[0015] Integrated heat spreader 106 may be made of copper, aluminum
or any other metal or metal alloy that would be suitable for
spreading heat. Integrated heat spreader 106 may be L-shaped with
one end attached to socket body 102 and the other end floating over
cavity 120, or U-shaped with two ends attached to socket body 102
on opposite sides of cavity 120, or basket-shaped with four sides
attached to socket body 102 and a flat surface that covers cavity
120. In some embodiments, integrated heat spreader 106 is enclosed
in socket 101 from four or less sides. Still further, integrated
heat spreader 106 may be any other shape that allows integrated
heat spreader 106 to attach to socket body 102 and provide a heat
spreading surface to components within cavity 120.
[0016] Thermal interface material 130 may further be provided to
promote adhesion and promote heat transfer between thermoelectric
cooler 122, in-substrate voltage regulator 112 and integrated heat
spreader 106. In some embodiments, thermal interface material 130
may be a paste, including, but not limited to, a thixotropic paste,
carbon black paste or fluidic paste. In still further embodiments,
thermal interface material could be a two-phase material. In other
embodiments, thermal interface material 130 may be, but is not
limited to, a sheet or foil such as a metal sheet, graphite sheet,
aluminum foil or copper foil. It is further contemplated that
thermal interface material 130 may be a nanoparticle loaded fluid,
i.e. nanofluid. In some embodiments, it is contemplated that
integrated heat spreader 106 may be omitted and thermal interface
material 130 may be used to support thermoelectric cooler 122.
[0017] Electrical power may be delivered to thermoelectric cooler
122 through one or more of contacts 104. As illustrated in FIG. 1,
contacts 124 and 126 adjacent cavity 120 are dimensioned to contact
thermoelectric cooler 122 on one end and printed circuit board 118
on another end. In some embodiments, one end of contacts 124 and
126 may be in direct contact with, or soldered to, metal pads (not
shown) on thermoelectric cooler 122. The other end of contacts 124
and 126 may be connected to printed circuit board 118 though solder
balls 128 and 129, respectively. Contacts 124 and 126 may be of any
size and shape suitable for contacting thermoelectric cooler 122.
Contacts 124 and 126 may be of a same or different material than
contacts 104 not connected to thermoelectric cooler. Although only
contacts 124 and 126 are shown connected to thermoelectric cooler
122, it is contemplated that any number of contacts 104 deemed
desirable may be connected to one or more of thermoelectric cooler
122. In this aspect, power may be delivered directly to
thermoelectric cooler 122 through socket 102.
[0018] It is further contemplated that power may be delivered to
thermoelectric cooler 122 by connecting contacts 124 and 126 to
metal pads on heat spreader 106 applied to thermoelectric cooler
122. In this aspect, contact metal pads can be placed on heat
spreader 106 and metal traces may be provided through heat spreader
106 to a point where heat spreader 106 contacts thermoelectric
cooler 122. In this aspect, power to thermoelectric cooler 122 may
be supplied through heat spreader 106. Alternatively, heat spreader
106 may be omitted and replaced with a heat sink having contact
metal pads and metal traces to provide power to thermoelectric
cooler 122.
[0019] Loading of socket 101 as described herein allows for
multiple cooling components to be connected to assembly 100 without
requiring any substantial form factor modifications to assembly
100. Although embodiments described herein may reduce a volume
within socket cavity 120, it will not impact power delivery to
assembly 100. In addition, assembly 100 as described herein allows
heat to be directly transferred to printed circuit board 118 for
heat dissipation. In this aspect, a lower thermal resistance path
may be achieved than when cavity 120 is not loaded as
described.
[0020] Electronic assembly 100 may be part of a processor of an
electronic appliance such as a computer (e.g., desktop, laptop,
hand-held, server, internet appliance, etc.), a wireless
communications device (e.g., cellular phone, cordless phone,
pager), a computer-related peripheral (e.g., printer, scanner,
monitor), and entertainment device (e.g., television, radio,
stereo, tape player, compact disc player, video cassette recorder,
Motion Picture Experts Group, audio writer 3 (MP3) player and the
like. FIG. 1 shows electronic assembly 100 that is part of a
desktop computer.
[0021] FIG. 2 shows a cross-sectional side view of socket enabled
current delivery to a thermoelectric cooler to cool an in-substrate
voltage regulator, in accordance with another embodiment. In
accordance with the illustrated embodiment, electronic assembly 200
includes one or more of socket 101 including socket body 102,
socket contacts 104, integrated heat spreader 106, die 108,
substrate 110, in-substrate voltage regulator 112, die heat
spreader 114, heat sink 116, and printed circuit board 118. Socket
body 102, socket contacts 104, die 108, substrate 110, in-substrate
voltage regulator 112, die heat spreader 114, heat sink 116, and
printed circuit board 118 are substantially similar to those
described in reference to FIG. 1. Socket body 102 includes socket
contacts 104 to electrically couple the integrated circuit package
with traces and other components (not shown) on printed circuit
board 118. Socket body 102 includes socket contacts 104 arranged
around a substantially central cavity 120.
[0022] One or more of thermoelectric cooler 122 may be placed in
cavity 120 to cool in-substrate voltage regulator 112. In this
embodiment, thermoelectric cooler 122 is embedded within integrated
heat spreader 106 and placed adjacent to in-substrate voltage
regulator 112. Thermoelectric cooler 122 may be embedded within
integrated heat spreader 106 by any suitable technique, such as
forming a hole or depression within integrated heat spreader 106
and placing thermoelectric cooler 122 within the hole or
depression.
[0023] Similar to the embodiment of FIG. 1, thermal interface
material 130 may be provided to promote adhesion and heat transfer
between thermoelectric cooler 122, in-substrate voltage regulator
112 and integrated heat spreader 106. In the embodiment illustrated
in FIG. 2, thermal interface material 130 is placed between
thermoelectric cooler 122 and in-substrate voltage regulator
112.
[0024] Power may be delivered directly to thermoelectric cooler 122
by contacts 124 and 126 of socket body 102 connected to
thermoelectric cooler 122 on one end and printed circuit board 118
on another end through solder balls 128 and 129, respectively, as
described in reference to FIG. 1. Although only contacts 124 and
126 are shown connected to thermoelectric cooler 122, it is
contemplated that any number of contacts 104 deemed desirable may
be connected to one or more of thermoelectric cooler 122.
Alternatively, power may be delivered to thermoelectric cooler 122
through heat spreader 106 or a heat sink as described in reference
to FIG. 1.
[0025] FIG. 3 shows a cross-sectional side view of socket enabled
current delivery to a thermoelectric cooler to cool an in-substrate
voltage regulator, in accordance with another embodiment. In
accordance with the illustrated embodiment, electronic assembly 300
includes one or more of socket 101 including a socket body 102,
socket contacts 104, integrated heat spreader 106, die 108,
substrate 110, in-substrate voltage regulator 112, die heat
spreader 114, heat sink 116, thermal interface material 130 and
printed circuit board 118. Socket body 102, socket contacts 104,
die 108, substrate 110, in-substrate voltage regulator 112, die
heat spreader 114, heat sink 116, integrated heat spreader 106,
thermal interface material 130 and printed circuit board 118 are
substantially similar to those described in reference to FIG. 1.
Socket body 102 includes socket contacts 104 to electrically couple
the integrated circuit package with traces and other components
(not shown) on printed circuit board 118. Socket contacts 104
arranged around a substantially central cavity 120.
[0026] One or more of thermoelectric cooler 122 may be placed in
cavity 120 to cool in-substrate voltage regulator 112. In this
aspect, thermoelectric cooler 122 is positioned between integrated
heat spreader 106 and in-substrate voltage regulator 112, by for
example, connecting thermoelectric cooler 122 to a surface of
integrated heat spreader 106 and then inserting integrated heat
spreader 106 within cavity 120. Similar to the embodiment of FIG.
1, thermal interface material 130 may be provided to promote
adhesion and heat transfer between thermoelectric cooler 122,
in-substrate voltage regulator 112 and integrated heat spreader
106.
[0027] Power may be delivered directly to thermoelectric cooler 122
by contacts 124 and 126 of socket body 102 connected to
thermoelectric cooler 122 on one end and printed circuit board 118
on another end through solder balls 128 and 129, respectively, as
described in reference to FIG. 1. Although only contacts 124 and
126 are shown connected to thermoelectric cooler 122, it is
contemplated that any number of contacts 104 deemed desirable may
be connected to one or more of thermoelectric cooler 122.
Alternatively, power may be delivered to thermoelectric cooler 122
through heat spreader 106 or a heat sink as described in reference
to FIG. 1.
[0028] An additional cooling component 302 may be connected to
integrated heat spreader 106 by any suitable technique when further
cooling is deemed desirable. In some embodiments, cooling component
302 may be a heat sink, a heat pipe or a cold plate of a
microchannel liquid cooler.
[0029] FIG. 4 shows an exploded view of a thermoelectric cooler to
cool an in-substrate voltage regulator, in accordance with one
embodiment. In accordance with the illustrated embodiment,
in-substrate voltage regulator 112, thermoelectric cooler 122,
thermal interface material 130 and integrated heat spreader 106 are
shown prior to assembly. In this embodiment, thermoelectric cooler
122 is smaller than in-substrate voltage regulator 112. In this
aspect, when assembled, thermoelectric cooler 122 will cool a
localized area of in-substrate voltage regulator 112 adjacent the
surface of thermoelectric cooler 122. Integrated heat spreader 106
is shown substantially U-shaped with two ends. Each of the ends may
be attached to socket body 102 on opposite sides of cavity 120.
[0030] In the preceding detailed description, specific embodiments
are illustrated, including techniques for socket enabled current
delivery to a thermoelectric cooler to cool an in-substrate voltage
regulator. It will, however, be evident that various modifications
and changes may be made thereto without departing from the broader
spirit and scope of the invention as set forth in the claims. For
example, cooling components described herein may be modified to
accommodate various form factor limitations of the electronic
assembly, for example, the mechanical envelope designed for some
standard computer chassis. It is contemplated that, the cooling
configuration described herein is suitable for use with a wide
variety of electronic appliances that would benefit from the
embodiments described herein. The specification and drawings are,
accordingly, to be regarded in an illustrative rather than a
restrictive sense.
* * * * *