U.S. patent application number 11/969985 was filed with the patent office on 2008-06-26 for complementary resistive memory structure.
Invention is credited to Sheng Teng Hsu.
Application Number | 20080149907 11/969985 |
Document ID | / |
Family ID | 36098846 |
Filed Date | 2008-06-26 |
United States Patent
Application |
20080149907 |
Kind Code |
A1 |
Hsu; Sheng Teng |
June 26, 2008 |
Complementary Resistive Memory Structure
Abstract
A complementary resistive memory structure is provided
comprising a common source electrode and a first electrode
separated from the common source electrode by resistive memory
material; and a second electrode adjacent to the first electrode
and separated from the common source electrode by resistive memory
material, along with accompanying circuitry and methods of
programming and reading the complementary resistive memory
structure.
Inventors: |
Hsu; Sheng Teng; (Camas,
WA) |
Correspondence
Address: |
SHARP LABORATORIES OF AMERICA, INC.;C/O LAW OFFICE OF GERALD MALISZEWSKI
P.O. BOX 270829
SAN DIEGO
CA
92198-2829
US
|
Family ID: |
36098846 |
Appl. No.: |
11/969985 |
Filed: |
January 7, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10957298 |
Sep 30, 2004 |
7339813 |
|
|
11969985 |
|
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Current U.S.
Class: |
257/2 ;
257/E47.001 |
Current CPC
Class: |
G11C 13/0011
20130101 |
Class at
Publication: |
257/2 ;
257/E47.001 |
International
Class: |
H01L 47/00 20060101
H01L047/00 |
Claims
1-8. (canceled)
9. A complementary resistive memory structure comprising: a common
source electrode; a first electrode separated from the common
source electrode by a resistive memory material; and a second
electrode adjacent to the first electrode and separated from the
common source electrode by the resistive memory material.
10. The memory structure of claim 9, wherein the first memory
resistor comprises a colossal magnetoresistance (CMR) material.
11. The memory structure of claim 9, wherein the first memory
resistor comprises Pr.sub.1-xCa.sub.xMnO.sub.3 (PCMO).
12. The memory structure of claim 9, wherein the first memory
resistor comprises Gd.sub.1-xCa.sub.xBaCo.sub.2O.sub.5+.sub.5.
13. The memory structure of claim 9, further comprising: a first
active transistor connected between the first electrode and a first
load transistor; which is connected between a drain voltage and the
first active transistor at a first active transistor drain; and a
first output connected at the first active drain; a second active
transistor connected between the second electrode and a second load
transistor; which is connected between a drain voltage and the
second active transistor at a second active transistor drain; and a
second output connected at the second active drain; and a word line
connected to a first gate of the first active transistor and to a
second gate of the second active transistor.
14-18. (canceled)
Description
RELATED APPLICATIONS
[0001] This application is a Divisional Application of a pending
patent application entitled, COMPLEMENTARY OUTPUT RESISTIVE MEMORY
CELL, invented by Sheng Teng Hsu, Ser. No. 10/957,298, filed Sep.
30, 2004, Attorney Docket No. SLA0792, which is incorporated herein
by reference.
BACKGROUND OF THE INVENTION
[0002] The present device structures relate generally to resistive
memory devices and more specifically to a complementary output
memory cell.
[0003] A complementary memory cell has two bits capable of being
programmed and of outputting a complementary output such that when
the first bit is 0; the second bit is 1, and when first bit is 1;
the second bit is 0. Complementary memory cells often require a
large cell size and the programming process may be complicated and
slow.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is a schematic view of a unit resistive memory
cell.
[0005] FIG. 2 is a schematic view of a complementary resistive
memory cell employing two unit resistive memory cells as provided
in FIG. 1.
[0006] FIG. 3 is a cross-sectional view of a resistive memory
structure for implementing the complementary resistive memory cell
of FIG. 2.
[0007] FIG. 4. is a cross-sectional view of a resistive memory
structure for implementing an alternate embodiment of the
complementary resistive memory cell.
[0008] FIG. 5 is a schematic view of a complementary resistive
memory cell.
[0009] FIG. 6 is a cross-sectional view of a resistive memory
structure for use in a complementary resistive memory cell shown in
FIG. 5.
[0010] FIG. 7 is a cross-sectional view of a resistive memory
structure for implementing another embodiment of the complementary
resistive memory cell.
[0011] FIG. 8 is a cross-sectional view of a resistive memory
structure for implementing the complementary resistive memory cell
utilizing the resistive memory structure of FIG. 7.
[0012] FIG. 9 is a schematic view of a complementary resistive
memory cell corresponding to the memory structures with separated
power supplies associated with each bit.
DETAILED DESCRIPTION OF THE INVENTION
[0013] Certain embedded memory applications require a complementary
digital output, that is a 0 for bit A and a 1 for bit B, or vice
versa. Accordingly, a complementary, resistive memory device is
provided.
[0014] FIG. 1 is a schematic view of a unit, resistive memory cell
10 with a gated diode load (V.sub.D) provided by the load
transistor (T.sub.L) 12. A memory resistor (R) 14 is written to a
high-resistance state by applying ground to an output (V.sub.O) 16,
applying a programming voltage (Vp). also referred to herein as
gate voltage (V.sub.G), to a gate 18 of an active transistor (TA)
24, and applying a programming pulse voltage to the memory resistor
(R) at a voltage source (V.sub.S) 20 and floating the drain 26 of
the load transistor The programming voltage (Vp) is larger than the
amplitude of the minimum programming pulse voltage by at least 1
V.
[0015] The memory resistor (R) 14 is written to a low-resistance
state by setting the source voltage (Vs) to ground at the voltage
source 20, setting the gate voltage (V.sub.G) to a programming
voltage (Vp) at the gate 18, and applying a programming pulse
voltage to a drain 26. Again, the programming voltage (Vp) is
larger than the amplitude of the minimum programming pulse voltage
by at least 1V. Again the drain voltage of the load transistor,
V.sub.D is not biased.
[0016] The memory resistor (R) 14 may be read by setting the
voltage source (V.sub.S) to ground at the source 20, setting the
gate voltage (V.sub.G) at the gate 18 and the drain voltage
(V.sub.D) at the drain 26 to a read voltage (V.sub.A), and
monitoring the output voltage (V.sub.O) at the output 16. When the
memory resistor (R) 14 is at the high-resistance state the current
is very small, and the output voltage (V.sub.O) at the output 16 is
nearly equal to the drain voltage (V.sub.D) at the drain 26. When
the memory resistor (R) 14 is at the low-resistance state the
output voltage (V.sub.O) at the output 16 is nearly equal to the
source voltage (V.sub.S) at the source 20, which is being held at
ground. This property is illustrated by the following
equations:
I D = ( W 2 L ) .mu. C o ( V G - V T - IR ) = ( E 2 L ) .mu. C o (
V D - V T - V O ) 2 ##EQU00001## R .apprxeq. 0 V G - V T = V D - V
T - V O V O = V D - V G ##EQU00001.2## R .apprxeq. .infin. I D
.apprxeq. 0 V O .apprxeq. V D - V T ##EQU00001.3##
In these calculations, it is assumed that the active transistor
(T.sub.A) and the load transistor (T.sub.L) are identical. The
geometry of these two transistors can be adjusted to improve memory
device performance.
[0017] FIG. 2 is a schematic view of a complementary resistive
memory cell employing a first unit resistive memory cell 100 and a
second unit resistive memory cell 200 similar to that provided in
FIG. 1. The complementary resistive memory cell has a first memory
resistor (R.sub.1) 114 connected between a first voltage source
(V.sub.S1) 120 and a first active transistor (TAI) 124. A first
load transistor (T.sub.L1) 112 is connected between the first
active transistor 124 and a first drain 126 connected to a drain
voltage (V.sub.D). A first output (V.sub.01) 116, also identified
as bit line (BL) is connected between the first active transistor
124 and the first load transistor 112.
[0018] The complementary resistive memory cell has a second memory
resistor (R.sub.2) 214 connected between a second voltage source
(V.sub.S2) 220 and a second active transistor .sub.(TA2) 224. A
second load transistor .sub.(TL2) 212 is connected between the
second active transistor 224 and a second drain 226 connected to
the drain voltage (V.sub.D). A second output (V.sub.02) 216 is
connected between the second active transistor 224 and the second
load transistor 212. A gate voltage (V.sub.G) is applied along a
word line (WL) 300, which is connected to the gates of both the
first active transistor 120 124 and the second active transistor
224.
[0019] The first unit resistive memory cell 100 and the second unit
resistive memory cell 200 can have their respective memory
resistors 114 and 214 programmed to a high-resistance state, and a
low-resistance state respectively. With the first memory resistor
114 in the high-resistance state, the first output 116 will have
its output voltage (V.sub.01) equal to about V.sub.D; while the
second memory resistor 214, which is in the low-resistance state,
will have its output voltage (V.sub.02) equal to about V.sub.S2.
This corresponds to a complementary output of 1 and 0,
respectively.
[0020] FIG. 3 illustrates a layout cross-section of a portion of
the complementary resistive memory cell shown in FIG. 2, but does
not show the load transistors. The item numbers in FIG. 3
correspond to the item numbers in FIG. 2 for ease of reference to
like components. The memory resistors 114 and 214 are formed using
a resistive memory material. The resistive memory material is a
material capable of having its resistivity changed in response to
an electrical signal. The resistive memory material is preferably a
perovskite material, such as a colossal magnetoresistive (CMR)
material or a high temperature superconducting (HTSC) material, for
example a material having the formula Pr.sub.1-xCa.sub.xMnO.sub.3
(PCMO), such as Pr.sub.0.7Ca.sub.0.3MnO.sub.3. Another example of a
suitable material is Gd.sub.1-xCa.sub.xBaCo.sub.2O.sub.5+5, for
example Gd.sub.0.7Ca.sub.0.3BaCo.sub.2O.sub.5+5. The resistive
memory material can be deposited using any suitable deposition
technique including pulsed laser deposition, rf-sputtering, e-beam
evaporation, thermal evaporation, metal organic deposition, sol gel
deposition, and metal organic chemical vapor deposition.
[0021] The complementary resistive memory cell shown and described
in connection with FIGS. 2 and 3 is somewhat complicated to program
and it may be possible to program each of the memory resistors into
either the high-resistance state or the low resistance state at the
same time, which would defeat the purpose of having a complementary
memory cell.
[0022] A simpler complementary resistive memory cell may be
achieved by taking advantage of certain resistive memory material
properties. FIG. 4 shows a portion of a resistive memory cell 400,
focusing on the arrangement of the memory resistors 114 and 214. A
common electrode (C) 420, which corresponds to a common source
connection is shown. A first electrode (A) 415 and a second
electrode (B) 417 are provided.
[0023] Due in part to the effect of the field direction and pulse
polarity on the resistive state of a resistive memory material,
when a voltage pulse is applied to A relative to B, while C is left
floating, the resistance of A and B will change in opposite
relation. For example, when a positive programming pulse is applied
to A with B grounded and C floating, the resistance between A and C
is at a low-resistance state, while the resistance between B and C
is at a high-resistance state. The same result would be achieved if
a negative programming pulse were applied to B with A grounded and
C floating.
[0024] Alternatively, when a negative programming pulse is applied
to A with B grounded and C floating, the resistance between A and C
is in a high-resistance state, while the resistance between B and C
is at a low-resistance state. The same result would also be
achieved if a positive programming pulse were applied to B with A
grounded and C floating.
[0025] FIG. 5 shows a schematic view of a complementary resistive
memory unit that takes advantage of the phenomenon described above
in connection with FIG. 4, and has a common voltage
source/electrode (Vs) 420, instead of first voltage source 120 and
second voltage source 220, shown in FIG. 3.
[0026] A cross-sectional view of a portion of the complementary
resistive memory unit of FIG. 5 is provided in FIG. 6. Common
voltage source 420 is shown.
[0027] The use of a common voltage source 420 simplifies
programming of the complementary resistive memory unit as compared
to the embodiment shown in FIGS. 2 and 3, without a common source.
The word line 300 is biased with the programming voltage V.sub.P,
while the common source 420 is allowed to float. When the first
output 116 (V.sub.01) is grounded and the second output 216
(V.sub.02) is allowed to float, applying a positive programming
pulse at the drain voltage VD, which is connected to the first
drain 126 and the second drain 226, causes a positive pulse to be
applied to the second memory resistor 214 with respect to the first
memory resistor 114. Therefore, if the second memory resistor 214
is programmed to the low-resistance state, the first memory
resistor 114 will be programmed to the opposite high-resistance
state. Similarly, when the second output 216 is grounded and the
first output 116 is allowed to float, applying a positive
programming pulse at the drain voltage V.sub.D cause the first
memory resistor 114 and the second memory resistor 214 to have the
opposite complementary state, such that if the first memory
resistor 114 is programmed to the low-resistance state, the second
memory resistor 214 will be programmed to the high-resistance
state.
[0028] As fabricated the resistance state of memory resistors 114
and 214 are unknown. The memory array has to be programmed before
any application.
[0029] FIG. 7 illustrates another embodiment of a complementary
resistive memory structure 500. The common electrode (C) 420, which
corresponds to a common source connection is shown, along with the
first electrode (A) 415 and the second electrode (B) 417. A single
region 510 of resistive memory material is provided. Due to the
properties of the resistive memory material and because the
distance between A and C, or B and C, are shorter than the distance
between A and C, this single resistive memory layer behaves
similarly to that of the structure shown in FIG. 4. Any change in
resistance between A and B caused by applying programming pulses is
negligible compared to the changes in resistance occurring between
A and C or B and C. This enables the single resistive memory
material layer 510 having a first electrode 415 and a second
electrode 417 on one side with a common electrode 420 on the other
to act as two resistors between A and C, and between B and C,
comparable to resistors 114 and 214 discussed above, and appearing
the schematic view.
[0030] Accordingly, just as in the case described in connection
with FIG. 4, when a voltage pulse is applied to A relative to B,
while C is left floating, the resistance of A to C and B to C will
change in opposite relation. For example, when a positive
programming pulse is applied to A with B grounded and C floating,
the resistance between A and C is at a low-resistance state, while
the resistance between B and C is at a high-resistance state. The
same result would be achieved if a negative programming pulse were
applied to B with A grounded and C floating.
[0031] Alternatively, when a negative programming pulse is applied
to A with B grounded and C floating, the resistance between A and C
is in a high-resistance state, while the resistance between B and C
is at a low-resistance state. The same result would also be
achieved if a positive programming pulse were applied to B with A
grounded and C floating.
[0032] FIG. 8 illustrates a cross-section utilizing the resistive
memory structure 500, shown in FIG. 7, having a single resistive
memory region 510 and a common voltage source 420.
[0033] The schematic for FIG. 5 corresponds to the structure shown
in FIG. 8 as well as that of FIG. 6. When using the programming
process described above, there is a large current flow through the
load transistor corresponding to whichever output is grounded, the
power consumption during programming may be relatively high.
[0034] When the power supply of the load transistors is separated,
as shown in FIG. 9, the programming power may be significantly
reduced. The first load transistor (T.sub.L1) 112 has drain 126
connected to a first drain voltage (V.sub.D1), while the second
load transistor (T.sub.L2) 212 has drain 226 connected to a second
drain voltage (V.sub.D2). To program this embodiment, the word line
300 is biased with the programming voltage Vp, while the common
voltage source 420 is allowed to float. When the first output 116
(V.sub.01) is grounded and the second output 216 (V.sub.02) and the
drain 126 are allowed to float, applying a positive programming
pulse to drain voltage V.sub.D2 at drain 226 causes a positive
pulse to be applied to the second memory resistor 214 with respect
to the first memory resistor 114. Therefore, if the second memory
resistor 214 is programmed to the low-resistance state, the first
memory resistor 114 will be programmed to the opposite
high-resistance state. Since power is not applied to the first
drain, the first load transistor (T.sub.L1) draws a relatively
insignificant amount of power, significantly reducing power
consumption during programming.
[0035] In an alternative power-saving, programming process, the
power consumption of the load resistors is significantly reduced by
allowing the drain voltage (V.sub.D) to float during the
programming operation. This may be accomplished by grounding the
first output 116 and biasing the word line 300 with the programming
voltage Vp, while the common source 420 and the drain voltage
V.sub.D at the first drain 126 are allowed to float, and a
programming pulse is applied to the second output 216, which will
cause a positive pulse to be applied to the second memory resistor
214 with respect to the first memory resistor 114. Therefore if the
second memory resistor 214 is programmed to the low-resistance
state, the first memory resistor will be programmed to the opposite
state, in this case the high-resistance state. Note that the drain
voltage V.sub.D may be allowed to float whether there is a single
drain voltage V.sub.D, or separated drain voltages V.sub.D1 and
V.sub.D2 with both floating. Similar to the processes described
above, this programming sequence can be modified by applying a
negative pulse to the second output 216, or by grounding the second
output 216 and applying the either a positive or negative
programming pulse to the first output 116.
[0036] For one embodiment of the present complementary resistive
memory unit, the process of reading the complementary resistive
memory unit is achieved by applying ground to the voltage source of
both sources V.sub.S1 and V.sub.S2, and applying a read voltage at
the gate voltage V.sub.G through the word line 300 and to the
drains 126 and 226 through a single drain source V.sub.D. The
output voltage V.sub.01 at the first output 116 and the output
voltage V.sub.02 at the second output 216 will be complementary
such that when V.sub.01 is 1, V.sub.02 is 0; and when V.sub.01 is
0, V.sub.02 is 1.
[0037] For another embodiment of the present complementary
resistive memory unit, the process of reading the complementary
resistive memory unit is achieved by applying ground to the common
source voltage Vs at common voltage source 420, and applying a read
voltage at the gate voltage V.sub.G through the word line 300 and
to the drains 126 and 226 through a single drain source V.sub.D.
The output voltage V.sub.01 at the first output 116 and the output
voltage V.sub.02 at the second output 216 will be complementary
such that when V.sub.01 is 1, V.sub.02 is 0; and when V.sub.01 is
0, V.sub.02 is 1.
[0038] For another embodiment of the present complementary
resistive memory unit having separated power supplies, the process
of reading the complementary resistive memory unit is achieved by
applying ground to the common voltage source Vs at common source
420, and applying a read voltage at the gate voltage V.sub.G
through the word line 300 and to each drain 126 and 226 through the
drain electrodes V.sub.D1, and V.sub.D2. The output voltage
V.sub.01 at the first output 116 and the output voltage V.sub.02 at
the second output 216 will be complementary such that when V.sub.01
is 1, V.sub.02 is 0; and when V.sub.01 is 0, V.sub.02 is 1.
[0039] Although embodiments, including certain preferred
embodiments, have been discussed above, the coverage is not limited
to any specific embodiment. Rather, the claims shall determine the
scope of the invention.
* * * * *