U.S. patent application number 11/853030 was filed with the patent office on 2008-06-26 for thermal module mounted on carrier by using magnetic force.
This patent application is currently assigned to COMPAL ELECTRONICS, INC.. Invention is credited to I-Feng Hsu, Chang-Chiang Shih, Chi-Wei Tien, Chang-Yuan Wu, Li-Kan Yeh.
Application Number | 20080149321 11/853030 |
Document ID | / |
Family ID | 39541218 |
Filed Date | 2008-06-26 |
United States Patent
Application |
20080149321 |
Kind Code |
A1 |
Tien; Chi-Wei ; et
al. |
June 26, 2008 |
THERMAL MODULE MOUNTED ON CARRIER BY USING MAGNETIC FORCE
Abstract
A thermal module includes a thermal conductor and at least one
first magnetic element. The thermal conductor is disposed above a
carrier. In addition, the thermal module may further include at
least one second magnetic element or at least one magnetically
susceptible element. Either the second magnetic element or the
magnetically susceptible element and the first magnetic element can
produce magnetic attractive force or magnetic repulsion force
therebetween. By such magnetic force, the thermal conductor can be
retained with respect to the carrier, thus making contact with a
heat generating component.
Inventors: |
Tien; Chi-Wei; (Taipei City,
TW) ; Wu; Chang-Yuan; (Taipei City, TW) ;
Shih; Chang-Chiang; (Taipei City, TW) ; Yeh;
Li-Kan; (Taipei City, TW) ; Hsu; I-Feng;
(Taipei City, TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100, ROOSEVELT ROAD, SECTION 2
TAIPEI
100
omitted
|
Assignee: |
COMPAL ELECTRONICS, INC.
Taipei City
TW
|
Family ID: |
39541218 |
Appl. No.: |
11/853030 |
Filed: |
September 11, 2007 |
Current U.S.
Class: |
165/185 ;
248/206.5; 257/E23.083; 257/E23.084 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/0002 20130101; F28F 9/002 20130101; H01L 23/40 20130101;
F28D 15/02 20130101; H01L 2023/4087 20130101; F28F 2275/08
20130101; H01L 23/4006 20130101; H01L 2924/00 20130101; H01L
2023/4062 20130101 |
Class at
Publication: |
165/185 ;
248/206.5 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 20, 2006 |
TW |
95147916 |
Claims
1. A thermal module comprising: a thermal conductor located at a
first side of a carrier, and having at least one receiving portion;
a bracket located at a second side of the carrier opposite to the
first side; at least one magnetic element disposed in the receiving
portion; and at least one magnetically susceptible element fixedly
mounted to the bracket, and extending through a through hole of the
carrier to contact with the magnetic element, wherein a magnetic
attractive force produced between the magnetic element and the
magnetically susceptible element retains the thermal conductor and
the bracket with respect to the carrier.
2. A thermal module in accordance with claim 1, wherein the
receiving portion has an opening defined in a bottom thereof, and
the magnetically susceptible element extends through the through
hole and the opening to contact with the magnetic element.
3. A thermal module in accordance with claim 1, wherein the
magnetic element is adhered to the thermal conductor.
4. A thermal module in accordance with claim 1, wherein the
magnetic element is a permanent magnet.
5. A thermal module suitable for being detachably mounted between a
carrier and a cover, a position of the carrier being fixed with
respect to the cover, the thermal module comprising: a thermal
conductor located at a side of the carrier, and having at least one
receiving portion; at least one first magnetic element disposed in
the receiving portion; and at least one second magnetic element
fixedly mounted to the cover, wherein the first magnetic element
and the second magnetic element comprise same magnetic poles
confronting with each other, and a magnetic repulsion force
produced between the first magnetic element and the second magnetic
element retains the thermal conductor with respect to the
carrier.
6. A thermal module in accordance with claim 5, wherein the first
magnetic element is adhered to the thermal conductor.
7. A thermal module in accordance with claim 5, wherein the first
magnetic element and the second magnetic element are permanent
magnets.
8. A thermal module comprising: a thermal conductor located at a
first side of a carrier; a pressing member located at the first
side of the carrier, and having a first opening and a second
opening, the first opening and the second opening collectively
forming a through opening, the pressing member connected with the
thermal conductor; a bracket located at a second side of the
carrier opposite to the first side; at least one magnetic element
disposed in the through opening; and at least one magnetically
susceptible element fixedly mounted to the bracket, the
magnetically susceptible element extending through a through hole
of the carrier to contact with the magnetic element; wherein a
magnetic attractive force produced between the magnetic element and
the magnetically susceptible element enables the pressing member to
retain the thermal conductor with respect to the carrier.
9. A thermal module in accordance with claim 8, wherein the
pressing member comprises at least one resilient arm, and the
magnetic element is connected to the resilient arm.
10. A thermal module in accordance with claim 9, wherein the
magnetic element comprises a head portion and a shank portion
connected with the head portion, the first opening fits the shank
portion in a non-interference manner, the shank portion of the
magnetic element contacts with the magnetically susceptible
element, and the head portion of the magnetic element retains the
resilient arm with respect to the magnetically susceptible element
in a substantially vertical direction.
11. A thermal module in accordance with claim 10, wherein the
magnetically susceptible element is columnar in shape, the second
opening fits the magnetically susceptible element in a
non-interference manner, and the magnetically susceptible element
retains the resilient arm with respect to the magnetically
susceptible element in a substantially horizontal direction.
12. A thermal module in accordance with claim 8, wherein the
magnetic element is a permanent magnet.
13. A thermal module comprising: a thermal conductor located at a
first side of a carrier; a pressing member located at the first
side of the carrier, and having a first opening and a second
opening, the first opening and the second opening collectively
forming a through opening, the pressing member connected with the
thermal conductor; a bracket located at a second side of the
carrier opposite to the first side; at least one first magnetic
element disposed in the through opening; and at least one second
magnetic element fixedly disposed on the carrier at a position
vertically aligned with the through opening, the second magnetic
element and the bracket producing therebetween a magnetic
attractive force to secure the bracket on the second side of the
carrier, wherein another magnetic attractive force produced between
the first magnetic element and the second magnetic element enables
the pressing member to retain the thermal conductor with respect to
the carrier.
14. A thermal module in accordance with claim 13, wherein the
second magnetic element and the first magnetic element are made in
contact with each other by the magnetic attractive force produced
therebetween.
15. A thermal module in accordance with claim 13, wherein the
pressing member comprises at least one resilient arm, and the first
magnetic element is connected to the resilient arm.
16. A thermal module in accordance with claim 15, wherein the first
magnetic element comprises a head portion and a shank portion
connected with the head portion, the first opening fits the shank
portion in a non-interference manner, the shank portion of the
first magnetic element contacts with the second magnetic element,
and the head portion of the first magnetic element retains the
resilient arm with respect to the second magnetic element in a
substantially vertical direction.
17. A thermal module in accordance with claim 15, wherein the
second magnetic element is columnar in shape, the second opening
fits the second element in a non-interference manner, and the
second magnetic element retains the resilient arm with respect to
the second magnetic element in a substantially horizontal
direction.
18. A thermal module in accordance with claim 13, wherein the first
magnetic element is a permanent magnet.
19. A thermal module in accordance with claim 13, wherein the
second magnetic element is a permanent magnet.
20. A thermal module comprising: a thermal conductor located at a
first side of a carrier; a pressing member located at the first
side of the carrier, and having a first opening and a second
opening, the first opening and the second opening collectively
forming a through opening, the pressing member connected with the
thermal conductor; at least one first magnetic element disposed in
the through opening; and at least one second magnetic element
fixedly disposed on the carrier at a position vertically aligned
with the through opening, wherein a magnetic attractive force
produced between the first magnetic element and the second magnetic
element enables the pressing member to retain the thermal conductor
with respect to the carrier.
21. A thermal module in accordance with claim 20, wherein the
pressing member comprises at least one resilient arm, and the first
magnetic element is connected to the resilient arm.
22. A thermal module in accordance with claim 21, wherein the first
magnetic element comprises a head portion and a shank portion
connected with the head portion, the first opening fits the shank
portion in a non-interference manner, the shank portion of the
first magnetic element contacts with the first side of the carrier,
and the head portion of the first magnetic element retains the
resilient arm with respect to the second magnetic element in a
substantially vertical direction.
23. A thermal module in accordance with claim 20, wherein the
position is on one of the first side of the carrier and a second
side of the carrier opposite to the first side.
24. A thermal module in accordance with claim 20, further
comprising: a limit element fixedly mounted to the carrier for
horizontally retaining the second magnetic element with respect to
the first magnetic element.
25. A thermal module in accordance with claim 20, wherein the first
magnetic element is a permanent magnet.
26. A thermal module in accordance with claim 20, wherein the
second magnetic element is a permanent magnet.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 95147916, filed Dec. 20, 2006. All
disclosure of the Taiwan application is incorporated herein by
reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a thermal module, and more
particularly, to a thermal module which is mounted on a carrier by
using magnetic force.
[0004] 2. Description of Related Art
[0005] With rapid advance of computer technology in recent years,
computers are being made to operate at higher frequency, and the
heat generation of electronic components inside the computer host
are becoming greater and greater. To avoid temporary or permanent
failure of the electronic components inside the computer host due
to overheat thereof, the heat generated by the electronic
components must be sufficiently dissipated. Therefore, thermal
modules are necessarily attached to those electronic components
having high heat generation such as CPUs, Graphics Chips,
Northbridge Chips, Southbridge Chips, and random-access memory
modules, or the like, for cooling these electronic components.
Therefore, assembly of the thermal modules is critically important,
so that the thermal modules can be truly in contact with the heat
generating components to achieve a good heat dissipation
result.
[0006] FIG. 1 is a cross-sectional view of a conventional thermal
module mounted on a carrier. Referring to FIG. 1, the conventional
thermal module 100 includes a thermal conductor 110, a bracket 120,
and a plurality of mounting members 130. The thermal conductor 110
is positioned on a first side 50a of a carrier 50, and includes a
plurality of receiving portions 112, a bottom plate 114, and a heat
pipe 116. The bottom plate 114 is in contact with a heat generating
component 60 on the carrier 50, whereby heat generated from the
heat generating component 60 is conducted through the bottom plate
114 to the heat pipe 116 and is then dissipated out. Besides, the
receiving portions 112 are arranged at a peripheral portion of the
thermal conductor 110. Each receiving portion 112 has an opening
112a defined in a top thereof, and a through hole 112b in a bottom
thereof.
[0007] The bracket 120 is positioned on a second side 50b of the
carrier 50 opposite to the first side 50a, and is positioned
corresponding to the thermal conductor 110. Besides, the bracket
120 includes a plurality of metal posts 122 arranged at a
peripheral portion thereof. The metal posts 122 extend through a
plurality of through holes 54 of the carrier 50, and are aligned
with the through holes 112b of the receiving portions 112,
respectively. In addition, each metal post 122 has a screw hole
122a defined therein. The mounting members 130 are respectively
disposed in the receiving portions 112, and each of the mounting
members 130 includes a screw 132 and a spring 134.
[0008] When the mounting members 130 are respectively disposed in
the receiving portions 112, shank portions 132b of the screws 132
extend through the through holes 112b of the receiving portion 112
and engage into the screw holes 122a of the metal posts 122
respectively, while the springs 134 interfere with the receiving
portions 112 around the through holes 112 respectively and are also
compressed by head portions 132a of the screws 132 and the
receiving portions 112. Therefore, during assembly, spring force
generated by the springs 134 under compression is applied on the
peripheral portion of the thermal conductor 110, thereby retaining
the location of the thermal conductor 110 with respect to the
carrier 50, and making the thermal conductor in contact with the
heat generating component 60.
[0009] When assembling the thermal module 100 on the carrier 50, an
operator must take time to secure the mounting members 130 in order
to secure the thermal module 100. Besides, when the heat generating
component 60 needs repair because of damage, before repairing or
replacing of the heat generating component 60, a considerable
amount of time must likewise be taken to remove the mounting
members 130 in order to remove the thermal module 100.
[0010] FIG. 2 is a cross-sectional view of another conventional
thermal module mounted on a carrier. Referring to FIG. 2, the
conventional thermal module 200 includes a thermal conductor 210, a
bracket 220, a pressing member 230, and a plurality of screws 240.
The thermal conductor 210 is positioned on a first side 50a of a
carrier 50, and includes a heat pipe 212 and a bottom plate 214.
The bottom plate 214 is in contact with a heat generating component
60 on the carrier 50, whereby heat generated from the heat
generating component 60 is conducted through the bottom plate 214
to the heat pipe 212 and is then dissipated out. The pressing
member 230 is located at the first side 50a of the carrier 50, for
pressing the thermal conductor 210 against the heat generating
component 60. In addition, the pressing member 230 has a plurality
of first openings 232a and a plurality of second openings 232b, and
each first opening 232a and one corresponding second opening 232b
collectively form a through opening 232.
[0011] The bracket 220 is positioned on a second side 50b of the
carrier 50 opposite to the first side 50a, and is positioned
corresponding to the thermal conductor 210. Besides, the bracket
220 includes a plurality of metal posts 222 arranged at a
peripheral portion thereof, and the metal posts 222 respectively
extend through the second openings 232b of the pressing member 230.
In addition, each metal post 222 has a screw hole 222a defined
therein. The screws 240 fit in the through openings 232 of the
pressing member 230, respectively.
[0012] When the screws 240 fit in the through openings 232 of the
pressing member 230, shank portions 240b of the screws 240 extend
through the first openings 232a, and engage into the screw holes
222a of the metal posts 222 respectively. Besides, head portions
240a of the screws 240 interfere with the pressing member 230
around the first openings 232a respectively. Therefore, during
assembly, the head portions 240a of the screws 240 exert a force on
the pressing member 230 toward the carrier 50, and the thermal
conductor 210 is thereby made in contact with the heat generating
component 60 under the pressing force of the pressing member
230.
[0013] Likewise, when assembling the thermal module 200, the
operator must take time to fasten the screws 240 in order to secure
the thermal module 200. Besides, when the heat generating component
60 needs repair because of damage, before repairing or replacing of
the heat generating component 60, a considerable amount of time
must likewise be taken to remove the screws 240 in order to remove
the thermal module 200.
[0014] Thus, in both of the conventional thermal modules 100 and
200, there exists a problem that the assembly and disassembly can
be time-consuming, which increases the cost for assembly and
repair.
SUMMARY OF THE INVENTION
[0015] Accordingly, the present invention is directed to a thermal
module which can be mounted to a carrier and be made in contact
with a heat generating component by magnetic force.
[0016] In one aspect, a thermal module is provided. The thermal
module includes a thermal conductor, a bracket, at least one
magnetic element, and at least one magnetically susceptible
element. The thermal conductor is located at a first side of a
carrier, and has at least one receiving portion. The bracket is
located at a second side of the carrier opposite to the first side.
The magnetic element is disposed in the receiving portion. The
magnetically susceptible element is fixedly mounted to the bracket,
and extends through a through hole of the carrier to contact with
the magnetic element. A magnetic attractive force produced between
the magnetic element and the magnetically susceptible element
retains the thermal conductor and the bracket with respect to the
carrier.
[0017] According to one embodiment of the present invention, the
receiving portion has an opening defined in a bottom thereof, and
the magnetically susceptible element extends through the through
hole and the opening to contact with the magnetic element.
[0018] According to one embodiment of the present invention, the
magnetic element is adhered to the thermal conductor.
[0019] According to one embodiment of the present invention, the
magnetic element is a permanent magnet.
[0020] According to one embodiment of the present invention, the
material of the magnetically susceptible element is metal.
[0021] According to one embodiment of the present invention, the
bracket and the magnetically susceptible element are integrally
formed together.
[0022] In another aspect, a thermal module suitable for being
detachably mounted between a carrier and a cover is provided, and a
position of the carrier is fixed with respect to the cover. The
thermal module includes a thermal conductor, at least one first
magnetic element, and at least one second magnetic element. The
thermal conductor is located at a side of the carrier, and includes
at least one receiving portion. The first magnetic element is
disposed in the receiving portion. The second magnetic element is
fixedly mounted to the cover. The first magnetic element and the
second magnetic element include same magnetic poles confronting
with each other, and a magnetic repulsion force produced between
the first magnetic element and the second magnetic element retains
the thermal conductor with respect to the carrier.
[0023] According to one embodiment of the present invention, the
first magnetic element is adhered to the thermal conductor.
[0024] According to one embodiment of the present invention, the
first magnetic element and the second magnetic element are
permanent magnets.
[0025] In another aspect, a thermal module is provided. The thermal
module includes a thermal conductor, a pressing member, a bracket,
at least one magnetic element, and at least one magnetically
susceptible element. The thermal conductor is located at a first
side of a carrier. The pressing member is located at the first side
of the carrier, and has a first opening and a second opening
collectively forming a through opening. The pressing member is
connected with the thermal conductor. The bracket is located at a
second side of the carrier opposite to the first side. The magnetic
element is disposed in the through opening. The magnetically
susceptible element is fixedly mounted to the bracket. The
magnetically susceptible element extends through a through hole of
the carrier to contact with the magnetic element. A magnetic
attractive force produced between the magnetic element and the
magnetically susceptible element enables the pressing member to
retain the thermal conductor with respect to the carrier.
[0026] According to one embodiment of the present invention, the
pressing member includes at least one resilient arm, and the
magnetic element is connected to the resilient arm.
[0027] According to one embodiment of the present invention, the
magnetic element includes a head portion and a shank portion
connected with the head portion, the first opening fits the shank
portion in a non-interference manner, the shank portion of the
magnetic element contacts with the magnetically susceptible
element, and the head portion of the magnetic element retains the
resilient arm with respect to the magnetically susceptible element
in a substantially vertical direction.
[0028] According to one embodiment of the present invention, the
magnetically susceptible element is columnar in shape, the second
opening fits the magnetically susceptible element in a
non-interference manner, and the magnetically susceptible element
retains the resilient arm with respect to the magnetically
susceptible element in a substantially horizontal direction.
[0029] According to one embodiment of the present invention, the
magnetic element is a permanent magnet.
[0030] According to one embodiment of the present invention, the
material of the magnetically susceptible element is metal.
[0031] According to one embodiment of the present invention, the
bracket and the magnetically susceptible element are integrally
formed together.
[0032] In another aspect, a thermal module is provided. The thermal
module includes a thermal conductor, a pressing member, a bracket,
at least one first magnetic element, and at least one second
magnetic element. The thermal conductor is located at a first side
of a carrier. The pressing member is located at the first side of
the carrier, and has a first opening and a second opening
collectively forming a through opening. The pressing member is
connected with the thermal conductor. The bracket is located at a
second side of the carrier opposite to the first side. The first
magnetic element is disposed in the through opening. The second
magnetic element is fixedly disposed on the carrier at a position
vertically aligned with the through opening. The second magnetic
element and the bracket produce therebetween a magnetic attractive
force to secure the bracket on the second side of the carrier.
Another magnetic attractive force produced between the first
magnetic element and the second magnetic element enables the
pressing member to retain the thermal conductor with respect to the
carrier.
[0033] According to one embodiment of the present invention, the
material of the bracket is metal.
[0034] According to one embodiment of the present invention, the
second magnetic element and the first magnetic element are made in
contact with each other by the magnetic attractive force produced
therebetween.
[0035] According to one embodiment of the present invention, the
pressing member includes at least one resilient arm, and the first
magnetic element is connected to the resilient arm.
[0036] According to one embodiment of the present invention, the
first magnetic element includes a head portion and a shank portion
connected with the head portion, the first opening fits the shank
portion in a non-interference manner, the shank portion of the
first magnetic element contacts with the second magnetic element,
and the head portion of the first magnetic element retains the
resilient arm with respect to the second magnetic element in a
substantially vertical direction.
[0037] According to one embodiment of the present invention, the
second magnetic element is columnar in shape, the second opening
fits the second element in a non-interference manner, and the
second magnetic element retains the resilient arm with respect to
the second magnetic element in a substantially horizontal
direction.
[0038] According to one embodiment of the present invention, the
first magnetic element is a permanent magnet.
[0039] According to one embodiment of the present invention, the
second magnetic element is a permanent magnet.
[0040] In another aspect, a thermal module is provided. The thermal
module includes a thermal conductor, a pressing member, at least
one first magnetic element, and at least one second magnetic
element. The thermal conductor is located at a first side of a
carrier. The pressing member is located at the first side of the
carrier, and has a first opening and a second opening collectively
forming a through opening. The pressing member is connected with
the thermal conductor. The first magnetic element is disposed in
the through opening. The second magnetic element is fixedly
disposed on the carrier at a position vertically aligned with the
through opening. A magnetic attractive force produced between the
first magnetic element and the second magnetic element enables the
pressing member to retain the thermal conductor with respect to the
carrier.
[0041] According to one embodiment of the present invention, the
pressing member includes at least one resilient arm, and the first
magnetic element is connected to the resilient arm.
[0042] According to one embodiment of the present invention, the
first magnetic element includes a head portion and a shank portion
connected with the head portion, the first opening fits the shank
portion in a non-interference manner, the shank portion of the
first magnetic element contacts with the first side of the carrier,
and the head portion of the first magnetic element retains the
resilient arm with respect to the second magnetic element in a
substantially vertical direction.
[0043] According to one embodiment of the present invention, the
position at which the second magnetic element is fixedly disposed
is on the first side of the carrier, or a second side of the
carrier opposite to the first side.
[0044] According to one embodiment of the present invention, the
thermal module further includes a limit element fixedly mounted to
the carrier for horizontally retaining the second magnetic element
with respect to the first magnetic element.
[0045] According to one embodiment of the present invention, the
first magnetic element is a permanent magnet.
[0046] According to one embodiment of the present invention, the
second magnetic element is a permanent magnet.
[0047] The thermal module of the present invention can retain the
thermal conductor with respect to the carrier by using the magnetic
attractive force or repulsion force produced between either the
magnetic element or the magnetically susceptible element and the
magnetic element. As a result, the thermal module of the present
invention can be quickly mounted to or removed from the carrier
manually.
[0048] In order to make the aforementioned and other features and
advantages of the present invention more comprehensible,
embodiments accompanied with figures are described in detail
below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0049] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0050] FIG. 1 is a cross-sectional view of a conventional thermal
module mounted on a carrier.
[0051] FIG. 2 is a cross-sectional view of another conventional
thermal module mounted on a carrier.
[0052] FIG. 3 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a first embodiment of the present
invention.
[0053] FIG. 4 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a second embodiment of the present
invention.
[0054] FIG. 5 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a third embodiment of the present
invention.
[0055] FIG. 6 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a fourth embodiment of the present
invention.
[0056] FIG. 7 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a fifth embodiment of the present
invention.
DESCRIPTION OF THE EMBODIMENTS
First Embodiment
[0057] FIG. 3 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a first embodiment of the present
invention. Referring to FIG. 3, the thermal module 300 is
configured to be detachably mounted to a carrier 50, wherein the
carrier 50 may be a motherboard of an electronic device such as a
motherboard of a notebook computer. The thermal module 300 includes
a thermal conductor 310, a bracket 320, a plurality of magnetic
elements 330, and a plurality of magnetically susceptible elements
340. The thermal conductor 310 is positioned on a first side 50a of
the carrier 50, and includes a plurality of receiving portions 312,
a bottom plate 314, and a heat pipe 316. The bottom plate 314 is in
contact with a heat generating component 60 positioned on the
carrier 50, whereby heat generated from the heat generating
component 60 is conducted through the bottom plate 314 to the heat
pipe 316 and is then dissipated out. In an alternative embodiment
not depicted, however, the heat pipe 316 may be replaced with other
components having good heat dissipation performance such as cooling
fins. In addition, the receiving portions 312 are arranged at a
peripheral portion of the thermal conductor 310, and each receiving
portion 312 has an opening 312a defined in a bottom thereof. The
magnetic elements 330 are respectively disposed in the receiving
portions 312, and may be adhered to the thermal conductor 310. In
this embodiment, the magnetic elements 330 are permanent magnets,
for example.
[0058] The bracket 320 is positioned on a second side 50b of the
carrier 50 opposite to the first side 50a, and is positioned
corresponding to the thermal conductor 310. The bracket 320 is
utilized to support the carrier 50 to prevent deformation thereof.
The magnetically susceptible elements 340 are integrally formed
with the bracket 320. In an alternative embodiment not depicted,
however, the magnetically susceptible elements 340 may be mounted
to the bracket 320 by suitable methods such as welding. Further,
the magnetically susceptible elements 340 are positioned to align
with the receiving portions 312 respectively. In this embodiment,
the material of the magnetically susceptible elements 340 is metal,
for example.
[0059] In addition, the magnetically susceptible elements 340
extend through a plurality of through holes 54 of the carrier 50
respectively, and may extend through the openings 312a of the
receiving portions 312 so as to make contact with the magnetic
elements 330 respectively. Bottoms of the magnetic elements 330
interfere with the receiving portions 312 around the openings 312a.
Therefore, once a magnetic attractive force is produced between the
magnetic elements 330 and the magnetically susceptible elements
340, the magnetic elements 330 will exert a force on the thermal
conductor 310 toward the carrier 50, thereby retaining the thermal
conductor 310 and the bracket 320 with respect to the carrier 50,
and making the thermal conductor 310 in contact with the heat
generating component 60.
[0060] In assembly of the thermal module 300 of this embodiment
onto the carrier 50, it is only required to make the magnetic
elements 330 and the magnetically susceptible elements 340 contact
with each other to produce a magnetic attractive force
therebetween, thus the assembly thereof can be quickly
accomplished. In addition, in disassembly of the thermal module
300, it is only required to exert a force in a reverse direction to
counteract the magnetic attractive force produced between the
magnetic elements 330 and the magnetically susceptible elements
340, then the thermal conductor 310 can easily be removed from the
carrier 50, thus facilitating repairing or replacing of the heat
generating component 60.
Second Embodiment
[0061] FIG. 4 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a second embodiment of the present
invention. Referring to FIG. 4, the thermal module 400 is
configured to be detachably mounted between a carrier 50 and a
cover 56, wherein the carrier 50 may be a motherboard of an
electronic device such as a motherboard of a notebook computer, and
the cover 56 may be a detachable portion of a housing of the
electronic device. The thermal module 400 includes a thermal
conductor 410, a plurality of first magnetic elements 420, and a
plurality of second magnetic elements 430. The thermal conductor
410 is positioned on a first side 50a of the carrier 50, and
includes a plurality of receiving portions 412, a bottom plate 414,
and a heat pipe 416. The bottom plate 414 is in contact with a heat
generating component 60 positioned on the carrier 50, whereby heat
generated from the heat generating component 60 is conducted
through the bottom plate 414 to the heat pipe 416 and is then
dissipated out. In an alternative embodiment not depicted, however,
the heat pipe 416 may be replaced with other components having good
heat dissipation performance such as cooling fins. Further, the
cover 56 is positioned above the thermal conductor 410, and its
position with respect to the carrier 50 is fixed.
[0062] In addition, the receiving portions 412 are arranged at a
peripheral portion of the thermal conductor 410. The first magnetic
elements 420 are respectively disposed in the receiving portions
412, and may be adhered to the thermal conductor 410. The second
magnetic elements 430 are respectively fixedly mounted to the cover
56. In this embodiment, the first magnetic elements 420 and the
second magnetic elements 430 are permanent magnets, for
example.
[0063] Furthermore, the first magnetic elements 420 and
corresponding second magnetic elements 430 have same magnetic poles
confronting with each other, and the second magnetic elements 430
and the bottom portions of the receiving portions 412 interfere
with each other, respectively. Therefore, once a magnetic repulsion
force is produced between the first magnetic elements 420 and the
corresponding second magnetic elements 430, the second magnetic
elements 430 will exert a force on the thermal conductor 410 toward
the carrier 50, thereby retaining the thermal conductor 410 with
respect to the carrier 50, and making the thermal conductor 410 in
contact with the heat generating component 60.
[0064] In assembly of the thermal module 400 of this embodiment
onto the carrier 50, it is only required to make the second
magnetic elements 430 on the cover 56 and the first magnetic
elements 420 in the receiving portions 412 produce a magnetic
repulsion force therebetween, thus the assembly thereof can be
quickly accomplished. In addition, in disassembly of the thermal
module 400, it is only required to remove the cover 56 so that the
magnetic repulsion force between the first magnetic elements 420
and the second magnetic elements 430 disappears, and then the
thermal conductor 410 can easily be removed from the carrier 50,
thus facilitating repairing or replacing of the heat generating
component 60.
Third Embodiment
[0065] FIG. 5 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a third embodiment of the present
invention. Referring to FIG. 5, the thermal module 500 is
configured to be detachably mounted to a carrier 50, wherein the
carrier 50 may be a motherboard of an electronic device such as a
motherboard of a notebook computer. The thermal module 500 includes
a thermal conductor 510, a bracket 520, a pressing member 530, a
plurality of magnetic elements 540, and a plurality of magnetically
susceptible elements 550. The thermal conductor 510 is positioned
on a first side 50a of the carrier 50, and includes a heat pipe 512
and a bottom plate 514. The bottom plate 514 is in contact with a
heat generating component 60 positioned on the carrier 50, whereby
heat generated from the heat generating component 60 is conducted
through the bottom plate 514 to the heat pipe 512 and is then
dissipated out. In an alternative embodiment not depicted, however,
the heat pipe 512 may be replaced with other components having good
heat dissipation performance such as cooling fins.
[0066] The bracket 520 is positioned on a second side 50b of the
carrier 50 opposite to the first side 50a. The magnetically
susceptible elements 550 are integrally formed with the bracket
520. In an alternative embodiment not depicted, however, the
magnetically susceptible elements 550 may be mounted to the bracket
520 by suitable methods such as welding. In this embodiment, the
material of the magnetically susceptible elements 550 may be metal,
and the magnetically susceptible elements 550 is columnar in shape,
for example.
[0067] In addition, the pressing member 530 is located at the first
side 50a of the carrier 50, for pressing the thermal conductor 510
against the heat generating component 60. The pressing member 530
may further include a plurality of resilient arms 532 to which the
magnetic elements 540 are connected. The pressing member 530
includes a plurality of first openings 534a and a plurality of
second openings 534b. Each first opening 534a and one corresponding
second opening 534b collectively form a through opening 534. The
magnetic elements 540 are respectively disposed in the through
openings 534, and each of the magnetic elements 540 include a head
portion 540a and a shank portion 540b connected with the head
portion 540a. In this embodiment, the magnetic elements 540 are
permanent magnets, for example.
[0068] In addition, the shank portions 540b of the magnetic
elements 540 may respectively extend through the first openings
534a of the pressing member 530, and the first openings 534a
respectively fit the shank portions 540b of the magnetic elements
540 in a non-interference manner. An outer diameter D1 of the head
portion 540a of each magnetic element 540 is larger than an inner
diameter D2 of a corresponding one of the first openings 534a, so
that the head portions 540a of the magnetic elements 540 interfere
with the pressing member 530 around the first openings 534a to
thereby retain the resilient arms 532 with respect to the
magnetically susceptible elements 550 in a substantially vertical
direction.
[0069] Furthermore, the magnetically susceptible elements 550
respectively extend through through holes 54 of the carrier 50 and
the second openings 534b, and the second openings 534b respectively
fit the magnetically susceptible elements 550 in a non-interference
manner, so that the magnetically susceptible elements 550 retain
the resilient arms 534 with respect to the magnetically susceptible
elements 550 in a substantially horizontal direction. Once the
magnetically susceptible elements 550 and the magnetic elements 540
contact with each other to produce the magnetic attractive force
therebetween, the magnetic elements 540 exert a force on the
pressing member 530 toward the carrier 50, whereby the pressing
member 530 is enabled to retain the thermal conductor 510 with
respect to the carrier 50, making the thermal conductor 510 in
contact with the heat generating component 60.
[0070] In assembly of the thermal module 500 of this embodiment
onto the carrier 50, it is only required to make the magnetic
elements 540 and the magnetically susceptible elements 550 produce
a magnetic attractive force therebetween, thus the assembly thereof
can be quickly accomplished. In addition, in disassembly of the
thermal module 500, it is only required to exert a force in a
reverse direction to counteract the magnetic attractive force
produced between the magnetic elements 540 and the magnetically
susceptible elements 550, then the thermal conductor 510 can easily
be removed from the carrier 50, thus facilitating repairing or
replacing of the heat generating component 60.
Fourth Embodiment
[0071] FIG. 6 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a fourth embodiment of the present
invention. Referring to FIG. 6, the thermal module 600 is
configured to be detachably mounted to a carrier 50, wherein the
carrier 50 may be a motherboard of an electronic device such as a
motherboard of a notebook computer. The thermal module 600 includes
a thermal conductor 610, a bracket 620, a pressing member 630, a
plurality of first magnetic elements 640, and a plurality of second
magnetic elements 650. The thermal conductor 610 is positioned on a
first side 50a of the carrier 50, and includes a heat pipe 612 and
a bottom plate 614. The bottom plate 614 is in contact with a heat
generating component 60 positioned on the carrier 50, whereby heat
generated from the heat generating component 60 is conducted
through the bottom plate 614 to the heat pipe 612 and is then
dissipated out. In an alternative embodiment not depicted, however,
the heat pipe 612 may be replaced with other components having good
heat dissipation performance such as cooling fins.
[0072] In addition, the pressing member 630 is located at the first
side 50a of the carrier 50 and presses the thermal conductor 610.
The pressing member 630 may further include a plurality of
resilient arms 632 to which the first magnetic element 640 are
connected. The pressing member 630 includes a plurality of first
openings 634a and a plurality of second openings 634b. Each first
opening 634a and one corresponding second opening 634b collectively
form a through opening 634. The first magnetic elements 640 are
respectively disposed in the through openings 634, and each of the
first magnetic elements 640 includes a head portion 640a and a
shank portion 640b connected with the head portion 640a. The second
magnetic elements 650 are fixedly disposed on the carrier 50 at
positions vertically aligned with the through openings 634, and
cooperate with the bracket 620 to produce a magnetic attractive
force therebetween, by which the bracket 620 is secured on an
second side 50b of the carrier 50 opposite to the first side 50a.
In this embodiment, the first magnetic elements 640 and the second
magnetic elements 650 are permanent magnets, for example, and the
material of the bracket 620 may be metal.
[0073] In addition, the shank portions 640b of the first magnetic
elements 640 may respectively extend through the through openings
634, and the through openings 634 respectively fit the shank
portions 640b of the first magnetic elements 640 in a
non-interference manner. An outer diameter D1 of the head portion
640a of each first magnetic element 640 is larger than an inner
diameter D2 of a corresponding one of the second openings 634b, so
that the head portions 640a of the first magnetic elements 640
interfere with the pressing member 630 around the first openings
634a to thereby retain the resilient arms 632 with respect to the
second magnetic elements 650 in a substantially vertical direction.
Therefore, once each first magnetic element 640 and one
corresponding second magnetic element 650 produce a magnetic
attractive force therebetween, the first magnetic elements 640
exert a force on the pressing member 630 toward the carrier 50,
whereby the pressing member 630 is enabled to retain the thermal
conductor 610 with respect to the carrier 50, making the thermal
conductor 610 in contact with the heat generating component 60.
[0074] In assembly of the thermal module 600 of this embodiment
onto the carrier 50, it is only required to make the first magnetic
elements 640 and the second magnetic elements 650 to produce a
magnetic attractive force therebetween, thus the assembly thereof
can be quickly accomplished. In addition, in disassembly of the
thermal module 600, it is only required to exert a force in a
reverse direction to counteract the magnetic attractive force
produced between the first magnetic elements 640 and the second
magnetic elements 650, and then the thermal conductor 610 can
easily be removed from the carrier 50, thus facilitating repairing
or replacing of the heat generating component 60.
Fifth Embodiment
[0075] FIG. 7 is a cross-sectional view of a thermal module mounted
on a carrier in accordance with a fifth embodiment. Referring to
FIG. 7, the thermal module 700 is configured to be detachably
mounted to a carrier 50, wherein the carrier 50 may be a
motherboard of an electronic device such as a motherboard of a
notebook computer. The thermal module 700 includes a thermal
conductor 710, a pressing member 720, a plurality of first magnetic
elements 730, a plurality of second magnetic elements 740, and a
plurality of limit elements 750. The thermal conductor 710 is
located at a first side 50a of the carrier 50, and includes a heat
pipe 712 and a bottom plate 714. The bottom plate 714 is in contact
with a heat generating component 60 positioned on the carrier 50,
whereby heat generated from the heat generating component 60 is
conducted through the bottom plate 714 to the heat pipe 712 and is
then dissipated out. In an alternative embodiment not depicted,
however, the heat pipe 712 may be replaced with other components
having good heat dissipation performance such as cooling fins.
[0076] In addition, the pressing member 720 is located at the first
side 50a of the carrier 50 and presses the thermal conductor 710.
The pressing member 720 may further include a plurality of
resilient arms 722 to which the first magnetic elements 730 are
connected. The pressing member 720 includes a plurality of first
openings 724a and a plurality of second openings 724b. Each first
opening 724a and one corresponding second opening 724b collectively
form a through opening 724. The first magnetic elements 730 are
respectively disposed in the through openings 724, and each of the
first magnetic elements 730 includes a head portion 730a and a
shank portion 730b connected with the head portion 730a. The second
magnetic elements 740 are located on a second side 50b of the
carrier 50 opposite to the first side 50a, and fixedly disposed on
the carrier 50 at positions vertically aligned with the through
openings 724, respectively. In an alternative embodiment not
depicted, however, the second magnetic elements 740 may be located
on the first side 50a of the carrier 50. In this embodiment, the
first magnetic elements 730 and the second magnetic elements 740
are permanent magnets, for example.
[0077] The limit elements 750 are fixedly mounted to the carrier 50
for horizontally retaining the second magnetic elements 740 with
respect to the first magnetic elements 730. The limit elements 750
are each shaped, for example, as a column having an opening 752,
and respectively fit the shank portions 730b of the first magnetic
elements 730 in a non-interference manner. In an alternative
embodiment not depicted, however, the limit elements 750 may be of
another suitable shape.
[0078] In addition, the shank portions 730b of the first magnetic
elements 730 may respectively extend through the through openings
724, and the through openings 724 respectively fit the shank
portions 730b of the first magnetic elements 730 in a
non-interference manner. An outer diameter D1 of the head portion
730a of each first magnetic element 730 is larger than an inner
diameter D2 of a corresponding one of the first openings 724a, so
that the head portions 730a of the first magnetic elements 730
interfere with the pressing member 720 around the first openings
724a to thereby retain the resilient arms 722 in a substantially
vertical direction. Once the first magnetic element 730 and the
corresponding second magnetic elements 740 produce a magnetic
attractive force therebetween, the first magnetic elements 730
exert a force on the pressing member 720 toward the carrier 50,
whereby the pressing member 720 is enabled to retain the thermal
conductor 710 with respect to the carrier 50, making the thermal
conductor 710 in contact with the heat generating component 60.
[0079] In assembly of the thermal module 700 of this embodiment
onto the carrier 50, it is only required to make the first magnetic
elements 730 and the second magnetic elements 740 produce the
magnetic attractive force therebetween, thus the assembly thereof
can be quickly accomplished. In addition, in disassembly of the
thermal module 700, it is only required to exert a force in a
reverse direction to counteract the magnetic attractive force
produced between the first magnetic elements 730 and the second
magnetic elements 740, and then the thermal conductor 710 can
easily be removed from the carrier 50, thus facilitating repairing
or replacing of the heat generating component 60.
[0080] In sum, the thermal module of the present invention employs
a securing force derived from magnetic force, which can quickly
assemble the thermal module to the carrier. In addition, if
desired, the thermal module can be quickly removed from the carrier
for repairing or replacing of the thermal module. Therefore, the
thermal module of the present invention can effectively reduce the
time and cost for assembly or disassembly, and enhance the
efficiency of repairing or replacing in comparison with the prior
arts.
[0081] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *