U.S. patent application number 11/550915 was filed with the patent office on 2008-06-26 for electronic device with dual function outer surface.
This patent application is currently assigned to SONY ERICSSON MOBILE COMMUNICATIONS AB. Invention is credited to Maria Hugosson, Torbjorn Karlelid, Krister Nilsson, Andreas Ryden, Taro Takamoto, Florin Vantu.
Application Number | 20080149320 11/550915 |
Document ID | / |
Family ID | 39314422 |
Filed Date | 2008-06-26 |
United States Patent
Application |
20080149320 |
Kind Code |
A1 |
Nilsson; Krister ; et
al. |
June 26, 2008 |
ELECTRONIC DEVICE WITH DUAL FUNCTION OUTER SURFACE
Abstract
An outer portion of an electronic device has an uneven profile
to aid in the dissipation of heat. Raised points in the uneven
profile may be manufactured with a non-thermal conductive coating.
In one implementation, the outer portion of the device includes a
thermally conductive layer having an uneven surface and at least
one other surface that is thermally coupled with a heat source. The
uneven surface includes high areas that are higher than other areas
of the uneven surface. A number of non-thermally conductive second
layer areas are located on the high areas of the thermally
conductive surface.
Inventors: |
Nilsson; Krister; (Bjarred,
SE) ; Hugosson; Maria; (Lund, SE) ; Ryden;
Andreas; (Malmo, SE) ; Karlelid; Torbjorn;
(Malmo, SE) ; Vantu; Florin; (Malmo, SE) ;
Takamoto; Taro; (Malmo, SE) |
Correspondence
Address: |
HARRITY SNYDER, L.L.P.
11350 RANDOM HILLS ROAD, SUITE 600
FAIRFAX
VA
22030
US
|
Assignee: |
SONY ERICSSON MOBILE COMMUNICATIONS
AB
Lund
SE
|
Family ID: |
39314422 |
Appl. No.: |
11/550915 |
Filed: |
October 19, 2006 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H05K 5/02 20130101; G06F
1/203 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A device having an outer surface that comprises: a thermally
conductive layer having an uneven surface and at least one other
surface that is thermally coupled to a heat source, the uneven
surface including a plurality of first areas that are higher than
other areas of the uneven surface; and a plurality of second layer
areas located on the first areas of the uneven surface.
2. The device of claim 1, wherein the plurality of second layer
areas are non-thermally conductive.
3. The device of claim 1, wherein the plurality of second layer
areas include a plastic material or an elastomer.
4. The device of claim 3, wherein the thermally conductive layer
includes a metal.
5. The device of claim 1, wherein the thermally conductive layer
acts as a heat sink for the device.
6. The device of claim 1, wherein the uneven surface of the
thermally conductive layer includes a wave like contour.
7. The device of claim 1, wherein the uneven surface of the
thermally conductive layer includes a hill like or box like
contour.
8. The device of claim 1, wherein the plurality of second layer
areas are formed of a material that is relatively easy to grip.
9. The device of claim 1, wherein the first areas of the uneven
surface are separated from lower areas of the uneven surface by a
distance ranging from approximately 0.2 to on the order of a few
millimeters.
10. An electronic device comprising: a heat source; and an outer
surface portion that includes a thermally conductive layer having
an uneven surface and at least one other surface that is thermally
coupled to the heat source, the uneven surface including a
plurality of raised areas; and a plurality of second layer areas
located on the raised areas of the uneven surface.
11. The electronic device of claim 10, wherein the electronic
device is a mobile terminal or a portable computer.
12. The electronic device of claim 10, wherein the second layer
areas include non-thermally conductive areas.
13. The electronic device of claim 12, wherein the plurality of
second layer areas each include a plastic material or an
elastomer.
14. The electronic device of claim 13, wherein the thermally
conductive layer includes a metal.
15. The electronic device of claim 10, wherein the uneven surface
includes a wave like contour.
16. The electronic device of claim 10, wherein the uneven surface
includes a hill like contour or a box like contour.
17. The electronic device of claim 10, wherein the plurality of
second layer areas are formed of a material is relatively easy to
grip.
18. The electronic device of claim 10, wherein the raised areas of
the uneven surface are separated from low areas of the uneven
surface by approximately 0.2 millimeters to on the order of a few
millimeters.
19. A dual function surface comprising: means for dispersing heat,
the means for dispersing heat having a thermally conductive uneven
surface; and means for insulating portions of the uneven surface
with a material that is relatively non-thermally conductive.
20. The dual function surface of claim 19, wherein the material has
a high coefficient of friction and a pleasant tactile feel.
21. The dual function surface of claim 19, wherein the uneven
surface has a wave like contour.
Description
BACKGROUND
[0001] 1. Technical Field of the Invention
[0002] Implementations described herein relate generally to
electronic devices and, more particularly, to heat dissipating
surfaces of electronic devices.
[0003] 2. Description of Related Art
[0004] Electronic devices, such as mobile phones, media players,
navigational devices, laptop computers, and hand held computers are
becoming increasingly useful as technology shrinks the size and
increases the computational power of such devices. All electronic
devices require power to operate, some of which is given off as
heat.
[0005] Heat sinks may be used in electronic devices to help
dissipate heat into the ambient atmosphere. In certain situations,
the electronic devices, and in particular, the surface of the heat
sink surface, can become uncomfortably hot for the user.
SUMMARY
[0006] According to one aspect, a device has an outer surface and
includes a thermally conductive layer and second layer areas. The
thermally conductive layer has an uneven surface and at least one
other surface that is thermally coupled to a heat source. The
uneven surface includes first areas that are higher than other
areas of the uneven surface and further includes the second layer
areas located on the first areas of the thermally conductive
surface.
[0007] In another aspect, the second layer areas of the device may
be non-thermally conductive areas.
[0008] In another aspect, the second layer areas of the device may
include a plastic material or an elastomer. The thermally
conductive layer may include a metal.
[0009] In another aspect, the thermally conductive layer may act as
a heat sink for the device.
[0010] In another aspect, the uneven surface of the thermally
conductive layer includes a wave like contour.
[0011] In another aspect, the uneven surface of the thermally
conductive includes a hill like contour or a box like contour.
[0012] In another aspect, the second layer areas are formed of a
material that is relatively easy to grip.
[0013] In another aspect, the first areas of the uneven surface are
separated from the low areas of the uneven surface by approximately
0.2 millimeters to on the order of a few millimeters.
[0014] In yet another aspect, an electronic device includes a heat
source and an outer surface portion. The outer surface portion
includes a thermally conductive layer having an uneven surface and
at least one other surface that is thermally coupled to the heat
source. The uneven surface includes a plurality of raised areas.
Further, the outer surface portion includes a number of second
layer areas located on the raised areas of the thermally conductive
surface.
[0015] In another aspect, the electronic device is a mobile
terminal or a portable computer.
[0016] In another aspect, the second layer areas of the electronic
device include non-thermally conductive areas.
[0017] In another aspect, the plurality of second layer areas of
the electronic device each include a plastic material or an
elastomer.
[0018] In another aspect, the thermally conductive layer includes a
metal.
[0019] In another aspect, the uneven surface includes a wave like
contour. The uneven surface may alternatively include a hill like
contour or a box like contour.
[0020] In another aspect, the plurality of second layer areas may
be formed of a material that is relatively easy to grip.
[0021] In yet another aspect, a dual function surface is provided
that comprises means for dispersing heat, the means for dispersing
heat having a thermally conductive uneven surface. The dual
function surface further comprises means for insulating portions of
the uneven surface with a material that is relatively non-thermally
conductive.
[0022] In another aspect, the means for insulating portions of the
uneven surface has a high coefficient of friction and a pleasant
tactile feel.
[0023] In another aspect, the uneven surface has a wave
contour.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings, which are incorporated in and
constitute a part of this specification, illustrate an embodiment
of the invention and, together with the description, explain the
invention. In the drawings,
[0025] FIG. 1A is a front side view of an exemplary electronic
device;
[0026] FIG. 1B is a back side view of the exemplary electronic
device;
[0027] FIG. 2 is a diagram illustrating a cross-section of an
exemplary implementation of the dual function surface shown in FIG.
1B;
[0028] FIG. 3 is a diagram conceptually illustrating the exemplary
implementation of dual function surface when in use by an
operator;
[0029] FIG. 4 is a diagram illustrating a cross-section of an
alternate exemplary implementation of the dual function surface
shown in FIG. 1B;
[0030] FIG. 5 is a diagram illustrating a cross-section of another
alternate exemplary implementation of the dual function surface
shown in FIG. 1B; and
[0031] FIG. 6 is a diagram illustrating another exemplary
electronic device in which the dual function surface is
implemented.
DETAILED DESCRIPTION OF EMBODIMENTS
[0032] The following detailed description of the invention refers
to the accompanying drawings. The same reference numbers in
different drawings may identify the same or similar elements. Also,
the following detailed description does not limit the
invention.
[0033] As described herein, an outer portion of an electronic
device is given an uneven profile, such as a wavy profile, to aid
in the dissipation of heat. The high points in the uneven profile,
such as the peaks of the wavy profile, may be stamped or coated
with a non-thermal conductive coating. The non-thermal conductive
coating may be relatively pleasant to user touch. In this manner,
the uneven profile portion of the electronic device functions to
both dissipate heat while allowing the user to comfortably touch or
hold the device.
[0034] FIGS. 1A and 1B are front side and back side views,
respectively, of an exemplary electronic device 100. In this
example, electronic device 100 is a mobile terminal. More
generally, it can be appreciated that electronic device 100 can be
any type of electronic device.
[0035] Device 100 may include housing 110, speaker 120, display
130, control keys 140, keypad 150, and microphone 160. Housing 110
may protect the components of device 100 from outside elements.
Housing 110 may be made from thermoplastics, metals, elastomers
(e.g., synthetic rubber and/or natural rubber), and/or other
similar materials. Speaker 120 may provide audible information to a
user of device 100. Display 130 may provide visual information to
the user. For example, display 130 may provide information
regarding incoming or outgoing telephone calls, games, telephone
numbers, the current time, e-mail, etc. Control keys 140 may permit
the user to interact with device 100 to cause device 100 to perform
one or more operations. Keypad 150 may include a standard telephone
keypad and may include additional keys to enable typing information
into device 100. Microphone 160 may receive audible information
from the user.
[0036] At least one portion of housing 110 of device 100 may
include an uneven surface portion, referred to as a dual function
surface 115 herein. In this example, dual function surface 115 is
implemented on the back side of device 100. Dual function surface
115 is designed to dissipate heat while having a surface that is
pleasant for the user to touch. Dual function surface 115 may
generally be implemented on any external surface of housing 110,
and can be particularly useful when implemented on areas of housing
110 from which it is desirable to dissipate heat, such as over a
battery charging area or over an area an covers core circuitry of
device 100.
[0037] FIG. 2 is a diagram illustrating a cross-section of an
exemplary implementation of dual function surface 115. In this
implementation, dual function surface 115 is shown as having a
"wavy" or wave-like profile that includes peak portions 216 that
are higher than valley portions 217. The wavy profile may be formed
by thermally conductive layer 210. Layer 210 may be made from, for
example, a thermally conductive metal or other material. Layer 210
may generally operate to dissipate heat into the ambient atmosphere
through the surface of layer 210. In other words, layer 210 may
operate as a heat sink in which a top surface contacts the outside
atmosphere and another surface is in contact with, or thermally
coupled to, a heat source 250 that is to be dissipated. Heat source
250 may include internal heat producing elements of device 100,
such as electronic circuitry. As conceptually shown via the dashed
arrows in FIG. 2, heat generated by heat source 250 may move to the
cooler outer surface of device 100 via layer 210. The uneven
profile of the top surface of layer 210 provides a relatively large
surface area for dissipating heat. The surface area of the top
surface of layer 210 may be larger than if layer 210 was
constructed as a flat surface, thus providing additional
ventilation surface for heat exchange.
[0038] The top surface of layer 210 may be stamped or coated with
non-thermal conductive areas 215. As shown, non-thermal conductive
areas 215 may be located at or near the peaks of layer 210 (i.e.,
near peak portions 216). Non-thermal conductive areas 215 may, for
example, be implemented as a plastic material (e.g., a
thermoplastic) or as an elastomer (e.g., rubber). In general, the
material may be selected as a material that is relatively
non-thermally conductive and has a pleasing tactile feel and/or has
a high coefficient of static or dynamic friction (i.e., it's
"grippy"). The total area covered by the non-thermal conductive
areas 215 may be less, and in some implementations, significantly
less than the total area covered by dual function surface 115.
Making layer 210 uneven serves to increase the available outer
surface, for improved thermal exchange, and create a relief that
allows for non-thermal conductive areas 215 to be simply added.
[0039] The amplitude of the waves of layer 210 may vary based on
the design of the particular device, and may typically vary from
the order of a few tenths of a millimeter to a few millimeters. For
example, the amplitude, shown as distance "D" in FIG. 2, may range
from approximately 0.2-0.5 millimeters to a few millimeters or
greater (e.g., 3 millimeters or more).
[0040] FIG. 3 is a diagram conceptually illustrating the exemplary
implementation of dual function surface 115, as shown in FIG. 2,
when in use by an operator. In this diagram, curve 320 represents
an outline of a human hand touching (e.g., holding) electronic
device 100 on dual function surface 115. The hand may tend to
naturally contact non-thermal conductive areas 215, which may
provide a pleasant tactile response/feel while providing shielding
from the heat of layer 210. In some implementations, non-thermal
conductive area 215 may be designed so that it is physically very
difficult or unlikely for the operator's hand to contact layer 210.
In other applications, it may be acceptable if some portion of the
operator's hand comes into contact with layer 210. In other words,
in some applications, non-thermal conductive area 215 may provide
acceptable results without acting as a complete physical separator
between the operator's hand and layer 210.
[0041] Dual function surface 115, as shown in FIGS. 2 and 3 and as
described, includes a thermally conductive layer 210 that includes
uneven portions that are capped or topped by non-thermal conductive
areas 215. The tops provided by non-thermal conductive areas 215
allow a user to hold electronic device 100 without actually
contacting much or all of the heat dissipating portion of layer
210. Further, waves in dual function surface 115 provide for
greater ventilation than a flat thermally conductive surface. Still
further, since only the tops of the waves of layer 210 are covered
with non-thermal conductive areas 215, manufacture of dual function
surface 115 may be relatively simple and cheap to implement. For
example, non-thermal conductive areas 215 may be stamped or pressed
onto layer 210. In this manner, a surface is provided that is
pleasant to touch, but yet provides effective heat dissipation. In
some implementations, layer 210 may be a single continuous layer
with the peak portions (i.e., portions 216) being made from a
non-thermally conductive material and the remaining portions being
made from a thermally conductive material.
[0042] It can be appreciated that the "wavy" profile of the top
surface of layer 210 is exemplary. Many other different profiles
are possible and may be used to provide similar functionality. For
example, FIG. 4 is a cross-section diagram illustrating an
alternate exemplary implementation of dual function surface 115. In
this implementation, dual function surface 115 includes a "hilly"
profile. The hilly profile is formed by a thermally conductive
layer 410. Thermally conductive layer 410 may be made of materials
similar to and functions in a manner similar to layer 210
(described above).
[0043] Layer 410 may be stamped or coated with non-thermal
conductive areas 415. Non-thermal conductive areas 415 function
similarly to non-thermal conductive areas 215 (described above).
That is, non-thermal conductive areas 415 may be located at or near
the top of layer 410 and be selected as a material that is
relatively non-thermally conductive and that has a pleasing tactile
feel and/or is relatively easy to grip.
[0044] FIG. 5 is a cross-section diagram illustrating another
alternate exemplary implementation of dual function surface 115. In
this implementation, dual function surface 115 has a "boxy"
profile. The boxy profile is formed by a thermally conductive layer
510. Thermally conductive layer 510 may be made of materials
similar to and functions in a manner similar to layer 210
(described above).
[0045] Layer 510 may be stamped or coated with non-thermal
conductive areas 515. Non-thermal conductive areas 515 function
similarly to non-thermal conductive areas 215 (described above).
That is, non-thermal conductive areas 515 may be located at or near
the top of layer 510 and be selected as a material that is
relatively non-thermally conductive and that has a pleasing tactile
feel and/or is relatively easy to grip/hold.
[0046] Although dual function surface 115 is shown in FIG. 1B as
being implemented in mobile terminal 100, it can be appreciated
that dual function surface 115 could be implemented with any
electronic device.
[0047] FIG. 6 is a diagram illustrating another exemplary
electronic device in which the dual function surface is
implemented. As shown, a portable computer (i.e., a laptop) 600 may
include the dual function surface described above. Portable
computer 600 may include, for example, a touch pad entry portion
601, a keyboard 602, and a display 603. Additionally, portable
computer 600 includes a dual function surface 615 (shown as the
area including diagonal lines). Dual function surface 615 may be
implemented as described above, such as the implementations shown
in FIGS. 2-5. In this example, dual function surface 615 is located
on a front portion of portable computer 600. It can be appreciated
that in other implementations, dual function surface 615 may be
located in other or in additional locations on portable computer
600, such as on a back or side surface of portable computer
600.
CONCLUSION
[0048] As described above, a dual function surface acts as a heat
sink to dissipate heat while also including relatively good tactile
qualities.
[0049] The foregoing description of the embodiments of the
invention provides illustration and description, but is not
intended to be exhaustive or to limit the invention to the precise
form disclosed. Modifications and variations are possible in light
of the above teachings or may be acquired from practice of the
invention.
[0050] It should be emphasized that the term "comprises/comprising"
when used in this specification is taken to specify the presence of
stated features, integers, steps, or components, but does not
preclude the presence or addition of one or more other features,
integers, steps, components, or groups thereof.
[0051] No element, act, or instruction used in the description of
the present application should be construed as critical or
essential to the invention unless explicitly described as such.
Also, as used herein, the article "a" is intended to include one or
more items. Where only one item is intended, the term "one" or
similar language is used. Further, the phrase "based on," as used
herein is intended to mean "based, at least in part, on" unless
explicitly stated otherwise.
[0052] The scope of the invention is defined by the claims and
their equivalents.
* * * * *