U.S. patent application number 11/608808 was filed with the patent office on 2008-06-12 for heat dissipation device.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to GUO-HE HUANG, NING-YU WANG, LI-FU XU.
Application Number | 20080137301 11/608808 |
Document ID | / |
Family ID | 39497737 |
Filed Date | 2008-06-12 |
United States Patent
Application |
20080137301 |
Kind Code |
A1 |
HUANG; GUO-HE ; et
al. |
June 12, 2008 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device (100) includes a base plate (10), a
fin assembly (30), at least one heat pipe (40), and a pair of foot
members (20) attached to the base plate. The base plate defines a
top surface (12). At least one first channel (18) is defined in the
top surface. The fin assembly has a first bottom surface (32). At
least one second channel (38) is defined in the first bottom
surface corresponding to the at least one first channel. At least
one indented portion (324) is defined in the first bottom surface.
The at least one heat pipe is received in the first channel and the
second channel, and attached through the fin assembly. At least one
foot member is attached to the at least one indented portion of the
fin assembly.
Inventors: |
HUANG; GUO-HE; (Shenzhen,
CN) ; XU; LI-FU; (Shenzhen, CN) ; WANG;
NING-YU; (Shenzhen, CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. CHENG-JU CHIANG
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Taipei Hsien
TW
|
Family ID: |
39497737 |
Appl. No.: |
11/608808 |
Filed: |
December 9, 2006 |
Current U.S.
Class: |
361/700 ;
257/E23.084; 257/E23.088; 257/E23.099 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 23/4006 20130101; H01L 2924/0002 20130101; H01L 23/467
20130101; H01L 2924/00 20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
361/700 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A heat dissipation device for cooling a heat generating element,
the heat dissipation device comprising: a base plate, a top surface
of the base plate defining at least one first channel therein; a
fin assembly having a first bottom surface, at least one second
channel defined in the first bottom surface corresponding to the at
least one first channel, at least one indented portion defined in
the first bottom surface; at least one heat pipe received in the
first channel and the second channel, and attached through the fin
assembly; and at least one foot member attached to the base plate,
the at least one foot member having a second bottom surface, and
the at least one foot member being received in the indented portion
of the first bottom surface; wherein the top surface of the base
plate touches the first bottom surface and the second bottom
surface.
2. The heat dissipation device as described in claim 1, wherein the
at least one foot member comprises at least one generally "C"
shaped foot member.
3. The heat dissipation device as described in claim 1, wherein the
base plate has a generally rectangular shape, and at least one
corner portion of the base plate is cutoff therefrom.
4. The heat dissipation device as described in claim 1, wherein a
plurality of fasteners extends through the at least one foot member
for fastening the base plate to the heat generating element.
5. The heat dissipation device as described in claim 1, wherein the
at least one heat pipe comprises at least one substantially
U-shaped heat pipe.
6. The heat dissipation device as described in claim 1, wherein the
fin assembly comprises a plurality of substantially planar fins
disposed in a substantially perpendicular orientation to the base
plate.
7. A heat dissipation device assembly for cooling a heat generating
element, the dissipation device assembly comprising: at least one
fan for creating an airflow; a fin assembly disposed within the
path of the airflow, a projecting portion formed on a bottom
surface of the fin assembly, the projecting portion having a first
bottom surface; a base assembly comprising: a heat-conductive base
plate, a bottom surface of the base plate having approximately a
same size and shape as an exposed surface of the heat generating
element; at least one foot member formed on a top surface of the
base plate; a cavity cooperatively defined by the base plate and
the at least one foot member for receiving the projecting portion
of the fin assembly; and at least one heat pipe received between
the first bottom surface and the top surface of the base plate;
wherein the top surface of the base plate touches with the first
bottom surface directly, and the at least one foot member is
embedded into the fin assembly.
8. The heat dissipation device assembly as described in claim 7,
wherein the at least one foot member comprises two foot members
aligned at opposite sides of the base plate, and each foot member
is generally "C" shaped.
9. The heat dissipation device assembly as described in claim 7,
wherein the base plate has a generally rectangular shape, and at
least one corner portion of the base plate is cutoff.
10. The heat dissipation device assembly as described in claim 7,
wherein a plurality of fasteners attached to the at least one foot
member for fastening the base plate to the heat generating
element.
11. The heat dissipation device assembly as described in claim 7,
wherein the at least one heat pipe comprises at least one
substantially U-shaped heat pipe.
12. The heat dissipation device assembly as described in claim 7,
wherein the fin assembly comprises a plurality of substantially
planar fins disposed in a substantially perpendicular orientation
to the base plate.
13. The heat dissipation device assembly as described in claim 7,
wherein the base plate defines at least one first channel, and the
first bottom surface defines at least one second channel, the first
channel and the second channel are coupled for receiving the at
least one heat pipe.
14. A heat dissipation device assembly comprising: a base plate
having a bottom surface configured for contacting with a heat
generating component and a top surface opposing to the bottom
surface; a pair of foot members disposed on the top surface of the
base plate with a cavity formed therebetween; a fin assembly
mounted on the base plate and comprising a plurality of fins each
having at a bottom side thereof a projecting portion and a recess
communicating with the projection portion at one side of the
projecting portion, the projecting portions of the fins being
received in the cavity and one of the foot members being received
in the recesses; and at least one heat pipe having one portion
attached to the base plate and another portion extending into the
fin assembly.
15. The heat dissipation device assembly as described in claim 14,
wherein the bottommost sides of the projecting portions of the fins
are coplanar.
16. The heat dissipation device assembly as described in claim 14,
wherein the projecting portions of the fins are sandwiched between
the pair of foot members in a direction parallel to the bottom
surface and the one of the foot members is sandwiched between the
fins and base plate at the recesses in another direction
perpendicular to the bottom surface.
17. The heat dissipation device assembly as described in claim 16,
wherein each of the fins further comprises another recess
communicating with the projection portion at an opposite side of
the projecting portion, the other one of the foot members being
sandwiched between the fins and the base plate in said another
recesses.
18. The heat dissipation device assembly as described in claim 17,
further comprising a fan attached to one lateral side of the fins
adjacent to said another recess, wherein said another recess has a
smaller size than that of the recess in the direction parallel to
the bottom surface.
19. The heat dissipation device assembly as described in claim 17,
wherein each of the foot members has a generally C shape, and one
portion of each of the foot members sandwiched between the fins and
the base plate is generally parallel to the portion of the at least
one heat pipe attached to the base plate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to heat dissipation devices
for removing heat from electronic devices, and more particularly to
a heat dissipation device incorporating heat pipes for improving
heat dissipation efficiency thereof.
[0003] 2. Description of Related Art
[0004] As technology has advanced, the amount of heat to be
dissipated from electronic components of computers has risen
dramatically, while the acceptable cost of heat dissipation devices
has remained constant or, in many cases, has dropped.
[0005] Conventionally, a typical heat sink conducts and dissipates
heat by metal thermal conduction, and generally comprises a heat
spreader for contacting a heat source, a plurality of parallel fins
on the heat spreader, and two U-shaped heat pipes attached to the
heat spreader and extending through the fins to transfer heat from
the heat spreader to the fins. The heat sink draws heat from the
heat source via the heat spreader, some of the heat is directly
conducted up to the fins. The remainder is transferred to the fins
via the heat pipes. Limited by inherent characteristics of metal
and cost considerations, heat conduction is not sufficiently fast.
Further, spreaders are large, heavy and costly.
[0006] What is needed, therefore, is a heat dissipation device
which not only has simple structure but also has greater heat
dissipation capability.
SUMMARY OF THE INVENTION
[0007] A heat dissipation device is used for cooling a heat
generating element. The heat dissipation device includes a base
plate, a fin assembly, at least one heat pipe, and a pair of foot
members. The base plate defines a top surface. At least one first
channel is defined in the top surface. The fin assembly has a first
bottom surface. At least one second channel is defined in the first
bottom surface corresponding to the at least one first channel. At
least one indented portion is defined in the first bottom surface.
The at least one heat pipe is received in the first channel and the
second channel, and attached through the fin assembly. At least one
foot member is attached to the base plate. The at least one foot
member has a second bottom surface. The at least one foot member is
received in the indented portion of the first bottom surface. The
top surface of the base plate contacts the first bottom surface and
the second bottom surface.
[0008] Other advantages and novel features will be drawn from the
following detailed description of a preferred embodiment with
attached drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an isometric view of a heat dissipation device of
a preferred embodiment of the present invention, the heat
dissipation device comprising a base plate, a pair of foot members,
a pair of heat pipes, a fin assembly and a fan;
[0010] FIG. 2 is a front perspective, exploded view of the heat
dissipation device of FIG. 1; and
[0011] FIG. 3 is an assembly view of FIG. 2;
DETAILED DESCRIPTION OF THE INVENTION
[0012] Referring to FIG. 1 and FIG. 2, a heat dissipation device
100 includes a heat-conductive base plate 10, a pair of foot
members 20, a pair of heat pipes 40, a fin assembly 30 and a fan 50
attached to one side of the fin assembly 30.
[0013] The heat pipes 40 are substantially "U" shaped. Each heat
pipe 40 has a top portion and a bottom portion.
[0014] The base plate 10 includes a top surface 12 and a bottom
surface 13. Two channels 18 are defined in the top surface 12 for
receiving the bottom portions of the heat pipes 40. The base plate
10 has a generally rectangular shape with the bottom surface
approximately a same size as an exposed surface of the heat source
(not shown) for lower material cost. At least one corner portion of
the base plate 10 is cutoff therefrom for avoiding interference
with other electric elements, which are disposed on a circuit board
(not shown) near the heat source. The base plate 10 is manufactured
of a material, such as copper or aluminum, which has relatively
good thermal conductivity, and should be of sufficient thickness to
efficiently spread heat from a heat source disposed upon its bottom
surface 13 to the fin assembly 30 and the heat pipes 40 attached to
its top surface 12.
[0015] The fin assembly 30 includes a plurality of fins. The fins
are parallel to and spaced apart from one another a distance that
is determined by the nature of the airflow between the spaces. The
fin assembly 30 has a bottom surface 32. Two channels 38 are
defined in the bottom surface 32 for receiving the bottom portions
of the heat pipes 40 corresponding to the channels 18 of the base
plate 10. A pair of indented portions 322, 324 is respectively
defined in opposite sides of the bottom surface 32 of the fin
assembly 30 for positioning the foot members 20. The indented
portion 322 has a smaller size than that of the indented portion
324 in the direction parallel to the bottom surface 32. A
projecting portion (not labeled) is therefore formed between the
indented portions 322, 324. The fin assembly 30 includes notches
that correspond to locations of the top portions of the heat pipes
40.
[0016] Each foot member 20 is generally "C" shaped, and has two
fasteners 26 and a rivet 28 for attaching the base plate 10 to the
foot member 20. Each foot member 20 has two locking holes
respectively defined in opposite distal ends thereof for receiving
the fasteners 26. Each foot member 20 includes a connect portion
22. The connect portion 22 parallel to the bottom portion of each
heat pipe 40. The connect portion 22 defines a top surface 23 for
attaching to the bottom surface 32 of the fin assembly 30 and a
bottom surface 24 for attaching to the top surface 12 of the base
plate 10.
[0017] Referring also to FIG. 3, when assembling the heat
dissipation device 100, the two foot members 20 are first attached
to the base plate 10 with the rivet 28 or other similar attaching
means. The two heat pipes 40 are attached to the fin assembly 30
with their bottom portions received in the corresponding channels
38. Then the base plate 10 and the foot members 20 are attached to
the bottom surface 32 of the fin assembly 30. The middle portion of
the top surface 12 of the base plate 10 is directly contacted with
the bottom surface 32, and an outer side of the bottom portion of
the heat pipe 40 is received in the corresponding channels 18. The
foot members 20 are respectively positioned into the corresponding
indented portions 322, 324 of the fin assembly 30 with the bottom
surface 24 of each foot member 20 aligned with the bottom surface
32 of the fin assembly in one plane. The base plate 10 and the foot
members 20 are jointed with the bottom surface 32 of the fin
assembly 30 in the preferred embodiment of the present invention.
The fan 50, for generating airflow through the spaces between the
fins, is attached to one side of the fin assembly 30. When used,
the heat dissipation device 100 is attached to an electronic device
for heat dissipation via the fasteners 26 engaging with a circuit
board (not shown) on which the electronic device is installed.
[0018] In the preferred embodiment of the present invention, the
base plate 10 and the foot members 20 can be incorporated in a base
assembly. A cavity is enclosed by the two foot members 20 and the
base plate 10 for receiving the bottom projecting portion of the
fin assembly.
[0019] It is to be understood, however, that even though numerous
characteristics and advantages have been set forth in the foregoing
description of a preferred embodiment, together with details of the
structure and function of the preferred embodiment, the disclosure
is illustrative only, and changes may be made in detail, especially
in matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *