U.S. patent application number 11/947174 was filed with the patent office on 2008-06-05 for methods and apparatus for electronic cooling unit with unique features.
Invention is credited to Carl Libby, James A. Pruett, William G. Wyatt.
Application Number | 20080128112 11/947174 |
Document ID | / |
Family ID | 39468710 |
Filed Date | 2008-06-05 |
United States Patent
Application |
20080128112 |
Kind Code |
A1 |
Wyatt; William G. ; et
al. |
June 5, 2008 |
METHODS AND APPARATUS FOR ELECTRONIC COOLING UNIT WITH UNIQUE
FEATURES
Abstract
An apparatus, system, and method for electronic cooling unit
with unique features is disclosed. In representative embodiments
and applications, the present invention generally provides improved
methods and systems for cooling electronic equipment in
environments subject to ingestion of foreign object debris.
Inventors: |
Wyatt; William G.; (Plano,
TX) ; Pruett; James A.; (Lucas, TX) ; Libby;
Carl; (Allen, TX) |
Correspondence
Address: |
NOBLITT & GILMORE, LLC.
4800 NORTH SCOTTSDALE ROAD, SUITE 6000
SCOTTSDALE
AZ
85251
US
|
Family ID: |
39468710 |
Appl. No.: |
11/947174 |
Filed: |
November 29, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60867732 |
Nov 29, 2006 |
|
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|
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
F28D 1/05366 20130101;
F28F 9/026 20130101; F28F 2250/08 20130101; F28D 2021/0031
20130101; F28F 19/01 20130101; F28D 15/0266 20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. An electronic cooling unit comprising: a heat exchanger suitably
canted off axis in relation to gravity to permit gravimetrically
assisted ambient air flow through said heat exchanger; and a
plurality of fins affixed to said heat exchanger suitably adapted
to reduce the probability of blockage resulting from foreign object
debris contained within the ambient air flow.
2. The apparatus of claim 1, further comprising: a fan configured
to move ambient air across the heat exchanger; and an air duct
positioned between the heat exchanger and the fan.
3. The apparatus of claim 2, wherein the fan is configured to
temporarily cease operation when the electronic cooling unit is
submerged in water.
4. The apparatus of claim 1, further comprising: a first cooling
line suitably adapted to move a fluid through the heat exchanger;
and a second heat exchanger suitably adapted to transfer heat to or
from the first cooling line.
5. The apparatus of claim 1, further comprising a protective
element substantially covering the cooling unit, wherein the
protective element comprises a first opening and a second opening
configured to provide a flow path for ambient air through the
electronic cooling unit.
6. The apparatus of claim 5, wherein the first opening and second
opening are further configured to prevent a direct line of sight
into the electronic cooling unit.
7. An electronic cooling unit system comprising: a first heat
exchanger suitably canted off axis in relation to gravity to permit
gravimetrically assisted ambient air flow through said heat
exchanger; a plurality of fins affixed to said heat exchanger
suitably adapted to reduce the probability of blockage resulting
from foreign object debris contained within the ambient air flow; a
first cooling line configured to pass a first fluid through said
first heat exchanger; and a second heat exchanger suitably adapted
to transfer heat to said first cooling line.
8. The system of claim 7, further comprising: a fan configured to
move ambient air across the first heat exchanger; and an air duct
positioned between the first heat exchanger and the fan.
9. The system of claim 8, wherein the fan is configured to
temporarily cease operation when the electronic cooling unit is
submerged in water.
10. The system of claim 7, further comprising a second cooling line
suitably adapted to move a second fluid through the second heat
exchanger and transfer heat to said first fluid.
11. The system of claim 10, wherein the second cooling line is
configured to circulate the second fluid from the second heat
exchanger to a remote location.
12. The system of claim 10, wherein the second cooling loop is
configured to absorb heat from an electronics assembly essentially
attached to the electronic cooling unit.
13. The system of claim 12, wherein the second heat exchanger
comprises a coldplate suitably configured to absorb heat from an
electronics assembly essentially attached to the electronic cooling
unit.
14. The system of claim 7, further comprising a protective element
substantially coveting the cooling unit, wherein the protective
element comprises a first opening and a second opening configured
to provide a flow path for ambient air through the electronic
cooling unit.
15. The system of claim 14, wherein the first opening and the
second opening are configured with an overlapping multi-layered
element suitably adapted to provide a non-straight flow path for
ambient air through the first and second openings.
16. The system of claim 14, wherein the first opening and the
second opening are configured with a chevron shaped element
suitably adapted to provide a non-straight flow path for ambient
air through the first and second openings.
17. A method for cooling electronic equipment comprising: moving
ambient air through a heat exchanger suitably canted off axis in r
elation to gravity to permit gravimetrically assisted ambient air
flow through said heat exchanger, wherein the heat exchanger
comprises a plurality of fins affixed to the heat exchanger
suitably configured to withstand clogging from foreign object
debris contained within the ambient air flow; and exchanging heat
from a first cooling line to the ambient air flow.
18. The method of claim 17, further comprising: a second heat
exchanger suitably adapted to transfer heat to the first cooling
line; and a second cooling line suitably adapted to exchange heat
from a remote heat source with the first cooling line through the
second heat exchanger.
19. The method of claim 18 further comprising a protective covering
that at least partially covers at least one of said first heat
exchanger and said second heat exchanger.
Description
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Patent Application Ser. No. 60/867,732 filed in the United States
Patent and Trademark Office on Nov. 29, 2006.
BACKGROUND OF INVENTION
[0002] Various techniques are used to facilitate cooling of
mechanical and electronic equipment. The ability to provide
sufficient cooling to components that experience heat gain is
essential to proper function and product reliability. Common
methods of cooling typically include forced movement of ambient
air, radiators, heatsinks, and use of cooling liquids. Cooling may
be as simple as using a fan to move relatively cooler air over a
component that has experienced heating.
[0003] Prior attempts to address this problem have resulted in
cooling units that suffer from clogging if large amounts of foreign
debris are passed through them. An example of this phenomenon is
the typical air conditioning unit that employs a fin-tube heat
exchanger. Fin spacing on a cooling system may withstand small
amounts of sand passing through the fin, but as the mass flow
volume of sand increase the system may clog.
[0004] Typical fin-tube heat exchangers can accept water
impingement during operation but they cannot operate while
submerged. Also, fin-tube heat exchangers tend to suffer damage
from small arms fire or shrapnel. Accordingly, there exists a need
to address these and other deficiencies associated with
conventional techniques.
SUMMARY OF THE INVENTION
[0005] In a representative aspect, the present invention includes a
system and method for convection cooling for electronics. The
system comprises a fin-tube heat exchanger and/or the like. In
accordance with various aspects of the present invention, the
system may provide cooling for equipment located adjacent to and/or
equipment located away from the cooling unit with a reduced
likelihood of clogging due to ingestion of foreign matter such as
sand.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Representative elements, operational features, applications
and/or advantages of the present invention reside inter alia in the
details of construction and operation as more fully hereafter
depicted, described or otherwise identified--reference being made
to the accompanying drawings, images, figures, etc. forming a part
hereof--wherein like numerals refer to like parts throughout. Other
elements, operational features, applications and/or advantages will
become apparent in view of certain exemplary embodiments recited in
the claims.
[0007] FIG. 1 representatively illustrates an electronic cooling
unit in accordance with a representative embodiment of the present
invention;
[0008] FIG. 2 representatively illustrates a possible installation
of an electronic cooling unit in accordance with a representative
embodiment of the present invention; and
[0009] FIG. 3 representatively illustrates an operational schematic
of an electronic cooling unit in accordance with a representative
embodiment of the present invention;
[0010] FIG. 4 representatively illustrates additional elements that
may be incorporated with an electronic cooling unit in accordance
with a representative embodiment of the present invention.
[0011] Elements in the figures, drawings, images, etc. are
illustrated for simplicity and clarity and have not necessarily
been drawn to scale. For example, the dimensions of some of the
elements in the figures may be exaggerated relative to other
elements to help improve understanding of various embodiments of
the present invention. Furthermore, the terms `first`, `second`,
and the like herein, if any, are used inter alia for distinguishing
between similar elements and not necessarily for describing a
sequential or chronological order. Moreover, the terms `front`,
`back`, `top`, `bottom`, `over`, `under`, and the like in the
disclosure and/or in the claims, are generally employed for
descriptive purposes and not necessarily for comprehensively
describing exclusive relative position. It will be understood that
any of the preceding terms so used may be interchanged under
appropriate circumstances such that various embodiments of the
invention described herein, for example, are capable of operation
in other configurations and/or orientations than those explicitly
illustrated or otherwise described.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0012] The following representative descriptions of the present
invention generally relate to exemplary embodiments and the
inventors' conception of the best mode, and are not intended to
limit the applicability or configuration of the invention in any
way. Rather, the following description is intended to provide
convenient illustrations for implementing various embodiments of
the invention. As will become apparent, changes may be made in the
function and/or arrangement of any of the elements described in the
disclosed exemplary embodiments without departing from the spirit
and scope of the invention.
[0013] The present invention may be described herein in terms of
conventional fin-tube heat exchangers, environmental control units,
and/or air conditioning systems in conjunction with one or more
cooling fluids. It should be appreciated that the cooling unit may
comprise any number of conventional materials including but not
limited to ceramics, metals, plastics, fiberglass, glass, and
various other inorganic and/or organic materials. Furthermore, such
fins, tubes, and/or ducting may comprise various forms, layers,
sizes, thicknesses, textures and dimensions and/or the like.
[0014] The cooling fluid, in accordance with various aspects of the
present invention, may comprise any fluid, liquid/vapor or
liquid/gas mixture suitable for cooling, stabilizing temperature,
and/or the like. In a representative embodiment of the present
invention, fluids used in an electronic cooling unit system in
accordance with various aspects of the present invention may
include R134a and/or a 50/50 Propylene Glycol/Water solution.
[0015] Referring now to FIG. 1, an electronic cooling unit system
100 in accordance with various aspects of the present invention may
be implemented in conjunction with a series closed-loop fluid
cooling sections and a forced air system such as a heat exchanger
and/or a fan. In a representative embodiment of the present
invention, the electronic cooling unit 100 comprises a condenser
110, a fan 112, an expansion valve 114, an evaporator 116, a
compressor 118, a pump 120, and one or more cooling loops, such as
a refrigerant loop 122, and a coolant loop 124. The electronic
cooling unit 100 may further comprise additional elements for the
application and/or environment, such as fins 126, a mounting plate,
a protective covering, and/or an electronics assembly 128.
[0016] The condenser 110 may comprise any system that converts a
fluid from a gaseous state to a liquid state and/or may be
substantially configured to exchange heat with another medium. For
example, in a representative embodiment of the present invention,
the condenser 110 may comprise a fin-tube heat exchanger such as a
conventional radiator and/or air conditioning unit. The condenser
110 may be set at any orientation in order to have ambient air
passed through it. The fins 126 may also be configured in any
manner to affect heat transfer.
[0017] Referring now to FIG. 2, in a representative embodiment of
the present invention, the condenser 110 may be positioned at least
one of non-vertically and non-horizontally in relation to gravity
and an inlet 210 in order to facilitate the passage of foreign
object debris, such as sand, through the electronic cooling unit
100 without clogging. The fins 126 may also be configured with a
spacing that reduces the probability of foreign object debris
clogging in the fin area of the condenser 110.
[0018] The condenser 110 may further comprise an air duct 212 to
facilitate the movement of air flow through the condenser 110. The
air duct 212 may be made of any material such as ceramics, metals,
plastics, fiberglass, glass, various other inorganic and organic
materials and/or the like.
[0019] The condenser 110 may also be configured to transfer heat
through multiple mediums. In a representative embodiment of the
present invention, the condenser may dissipate heat from the fluid
to passing air and to another fluid such as water if the electronic
cooling unit 100 was submerged during the crossing of a river.
[0020] The fan 112 may comprise any system that moves air through
the electronic cooling unit 100 and over the condenser 110. For
example, in a representative embodiment of the present invention,
the fan 112 may pull air through the condenser 110 and air duct 212
and/or push air through the condenser 110 and air duct 212. In
another representative embodiment of the present invention, the fan
112 may be further configured to pull ambient air in via an inlet
210 in the electronic cooling unit 100, through the fins 126 of the
condenser 110, and then move the air down the air duct 212 before
exhausting the air through an outlet 216 on the back side of the
fan 112.
[0021] It should be appreciated that in accordance with various
aspects of the present invention the fan 112 may also be adapted to
cease operation on the occurrence of a specified event. Specified
events may include, for example, extremely cold conditions
and/submersion of the cooling unit in water. Any system may be used
to signal the fan 112 to stop operating, such as a moisture sensor,
a thermocouple and/or the like. In a representative embodiment of
the present invention, the fan may be configured to temporarily
deactivate if the electronic cooling unit 100 is submerged allowing
the condenser 110 to dissipate heat directly to the surrounding
water. Once the electronic cooling unit 100 is no longer submerged,
the fan 112 may be reactivated and the condenser 110 may dissipate
heat to the ambient air.
[0022] The expansion valve 114, in accordance with various aspects
of the present invention, may be configured to convert high
pressure fluid into a relatively lower pressure fluid. The
expansion valve 114 may be configured in any manner to cause a
change in pressure of the fluid, such as through a block type
expansion valve and/or an internally equalized expansion valve. In
a representative embodiment of the present invention, the expansion
valve 114 comprises a thermostatic expansion valve that reduces the
pressure of the fluid while regulating the mass flow of the
fluid.
[0023] The evaporator 116, in accordance with various aspects of
the present invention, may comprise any system that converts a
fluid from a liquid state to a gaseous state for the purpose of
exchanging heat with another medium. For example, the evaporator
116 may comprise a fin-tube heat exchanger such as a conventional
radiator, an air conditioning unit, and/or a coldplate.
[0024] Referring now to FIG. 3, in a representative embodiment of
the present invention, the evaporator 116 may comprise a coldplate
with one or more fluid loops flowing through it. For example, the
evaporator 116 may comprise a refrigerant loop 122 further
comprising the fluid that passes through the condenser 110 and
expansion valve 114. The fluid in the refrigerant loop 122 may
comprise any fluid, liquid/vapor or liquid/gas mixture suitable for
cooling, stabilizing temperature and/or the like. In a
representative embodiment of the present invention, the refrigerant
may comprise R134a.
[0025] In a representative embodiment of the present invention, the
refrigerant loop 122 may be used to absorb heat from a coolant loop
124 that is used to remove heat from nearby or remote sources. For
example, the coolant loop 124 may be used to cool remote sources
such as a radar unit. The coolant loop 124 may also be configured
to absorb heat from multiple sources by partitioning the fluid
among several heat sources through various pipes, tubes, coldwalls,
and/or the like. The coolant loop 124 may further be configured to
provide heating to nearby or remote sources through the addition or
use of a heat source. In a representative embodiment of the present
invention, the fluid in the coolant loop may comprise a combination
of a water/glycol solution.
[0026] The evaporator 116 may also act as a coldplate for nearby
electronic assemblies. For example, referring now to FIG. 1, the
evaporator may be mounted directly to an electronics assembly and
act as a coldplate. The refrigerant loop 122 of the evaporator 116
may be configured to absorb heat from the electronics assembly in
addition to the heat transferred by the coolant loop 124.
[0027] The compressor 118, in accordance with various aspects of
the present invention, converts low pressure fluid into a
relatively higher pressure fluid. The compressor 118 may be
configured in any manner to cause a change in pressure of the
fluid, e.g., a centrifugal, rotary, and/or axial compressor.
[0028] It should be appreciated that the pump 120, in accordance
with various aspects of the present invention, converts a low
pressure fluid into a relatively higher pressure fluid. The pump
120 may comprise any system that causes an increase in the pressure
of a fluid, e.g., a centrifugal, kinetic, or positive displacement
pump. Referring now to FIG. 3, in a representative embodiment of
the present invention, the pump 120 may be configured to increase
the head pressure in the coolant loop 124.
[0029] Referring now to FIG. 4, the electronic cooling unit 100 may
further comprise a mounting plate 410. The mounting plate 410 may
be made of any material such as ceramics, metals, plastics,
fiberglass, glass, various other inorganic and organic materials
and/or the like. In a representative embodiment of the present
invention, the mounting plate 410 may be used to mount the
electronic cooling unit 100 and other nearby components such as a
projectile tube launcher 412 to a larger system such as a vehicle.
In another representative embodiment of the present invention,
mounting plate 410 may also perform any appropriate function for
the application of the electronic cooling unit 100 such as
providing protection from small arms fire and/or shrapnel.
[0030] The electronic cooling unit 100, in accordance with various
aspects of the present invention, may additionally comprise a
protective cover. The protective cover may be made of any material
such as ceramics, metals, plastics, fiberglass, glass, various
other inorganic and organic materials and/or the like. In a
representative embodiment of the present invention, the protective
cover may act to protect the individual elements of the electronic
cooling unit 100 from external damage from sources such as small
arms fire or shrapnel.
[0031] It should further be appreciated that in accordance with
various aspects of the present invention the protective cover may
comprise an opening to facilitate air movement into and/or out of
the electronic cooling unit 100. The opening may be configured in
any manner that allows air to pass through the electronic cooling
unit 100.
[0032] In a representative embodiment of the present invention, the
opening may comprise an opening near the inlet of the condenser 110
and a second opening near the fan 112 outlet. The openings may
further comprise a chevron design that allows air movement through
the electronic cooling unit 100 while also hindering a direct air
path from the outside the protective cover to the internal elements
of the electronic cooling unit 100.
[0033] In another representative embodiment of the present
invention, the openings may also comprise a series of alternating
holes in multiple layers of protective material. For example, the
first layer may comprise a one-half inch thick layer of steel with
one-half inch holes spaced one inch apart. The second layer may be
positioned at a short distance away from the first layer providing
an air gap between the two layers and comprise one-half inch thick
steel with similar one-half inch holes that are offset from the
holes in the first layer of steel such that there is no direct line
of sight between the two layers.
[0034] The protective cover may also be configured to be accessible
to allow for the inspection, repair, cleaning, or replacement of
the electronic cooling unit 100 or its individual elements. For
example, the protective cover may be completely removable, hinged
at one end, or comprise a removable interlocking piece of
protective material.
[0035] The electronic cooling unit 100, in accordance with various
aspects of the present invention, may be implemented to remove heat
via a coolant loop 124 and exchange heat to a refrigerant loop 122
in the evaporator 116. The heat absorbed by the refrigerant loop
122 may then be mixed with ambient air through a condenser 110.
Alternatively and/or conjunctively, the condenser 110 may be
configured to operate with a reduced likelihood of clogging from
foreign object debris due to its fin 126 spacing and/or its
orientation in relation to gravity.
[0036] It should be appreciated that in accordance with various
aspects of the present invention an internal fan 112 may be
configured to facilitate air movement into the electronic cooling
unit 100 and/or through the condenser 110. In a representative
embodiment of the present invention, the fan 112 may be deactivated
if the electronic cooling unit 100 is at least partially submerged
in water, such as when a vehicle is crossing a river. In another
representative embodiment of the present invention, the condenser
110 may the adapted to dissipate heat directly to the water while
the electronic cooling unit 100 is at least partially submerged.
The fan 112 is reactivated once the electronic cooling unit 100 is
no longer submerged.
[0037] The electronic cooling unit 100 may include a protective
cover capable of protecting internal components from damage
resulting from shrapnel and/or small arms fire.
[0038] The electronic cooling unit 100 may be further adapted for
use in an airborne application through the removal,
reconfiguration, and/or addition of internal elements. For example,
the fan 112 may be removed from an airborne application and RAM air
used instead to facilitate heat transfer.
[0039] In the foregoing specification, the invention has been
described with reference to specific exemplary embodiments. Various
modifications and changes may be made, however, without departing
from the scope of the present invention as set forth in the claims.
The specification and figures are illustrative, rather than
restrictive, and modifications are intended to be included within
the scope of the present invention. Accordingly, the scope of the
invention should be determined by the claims and their legal
equivalents rather than by merely the examples described.
[0040] For example, the steps recited in any method or process
claims may be executed in any order and are not limited to the
specific order presented in the claims. Additionally, the
components and/or elements recited in any apparatus claims may be
assembled or otherwise operationally configured in a variety of
permutations and are accordingly not limited to the specific
configuration recited in the claims.
[0041] Benefits, other advantages and solutions to problems have
been described above with regard to particular embodiments;
however, any benefit, advantage, solution to problem or any element
that may cause any particular benefit, advantage or solution to
occur or to become more pronounced are not to be construed as
critical, required or essential features or components of any or
all the claims.
[0042] As used herein, the terms "comprise", "comprises",
"comprising", "having", "including", "includes" or any variation
thereof, are intended to reference a non-exclusive inclusion, such
that a process, method, article, composition or apparatus that
comprises a list of elements does not include only those elements
recited, but may also include other elements not expressly listed
or inherent to such process, method, article, composition or
apparatus. Other combinations and/or modifications of the
above-described structures, arrangements, applications,
proportions, elements, materials or components used in the practice
of the present invention, in addition to those not specifically
recited, may be varied or otherwise particularly adapted to
specific environments, manufacturing specifications, design
parameters or other operating requirements without departing from
the general principles of the same.
* * * * *