U.S. patent application number 11/558018 was filed with the patent office on 2008-05-15 for housing of an electrical card.
Invention is credited to Chin-Chun Liu, Shih-Tung Liu.
Application Number | 20080112123 11/558018 |
Document ID | / |
Family ID | 39332307 |
Filed Date | 2008-05-15 |
United States Patent
Application |
20080112123 |
Kind Code |
A1 |
Liu; Chin-Chun ; et
al. |
May 15, 2008 |
HOUSING OF AN ELECTRICAL CARD
Abstract
The invention provides a housing for an electrical card, which
is an RSMMC memory card. The housing includes a metal cover and a
frame integrally formed at a periphery of the metal cover by way of
injection molding. A long frame is formed with a long slot for
accommodating a control chip. The long slot has a length ranging
from 7 to 9 mm to accommodate various types of control chips. The
structure intensity of the long slot can be increased by forming
through hole slots to be pressed by push needles at the bottom of
the long slot when the frame is injected to cover a metal sheet.
Then, the substrate formed with the IC is closed and fixed from the
other surface. Thus, it is possible to effectively increase the
structure intensity of the long slot to improve the function
thereof.
Inventors: |
Liu; Chin-Chun; (Gongguan
Township, TW) ; Liu; Shih-Tung; (Gongguan Township,
TW) |
Correspondence
Address: |
NIKOLAI & MERSEREAU, P.A.
900 SECOND AVENUE SOUTH, SUITE 820
MINNEAPOLIS
MN
55402
US
|
Family ID: |
39332307 |
Appl. No.: |
11/558018 |
Filed: |
November 9, 2006 |
Current U.S.
Class: |
361/679.32 |
Current CPC
Class: |
H05K 5/026 20130101 |
Class at
Publication: |
361/684 |
International
Class: |
H05K 5/06 20060101
H05K005/06 |
Claims
1. A housing for an electrical card, which is an RSMMC memory card,
the housing comprising: a metal cover having a periphery integrally
formed with a frame by way of injection molding, wherein one corner
of the frame is formed with a bevel for preventing the card from
being inserted incorrectly, a long side of the bevel is 20 mm, a
long frame of the bevel is formed with a long slot for
accommodating a control chip, a length of the long slot ranges from
7 to 9 mm, a bottom of the long slot is formed with through hole
slots for pressing push needles when the frame is injected to cover
metal sheets, so as to increase a structure integrity of the long
slot; and a substrate comprising a first surface and a second
surface, wherein the control chip and a passive device are disposed
on the first surface, the first surface is packaged into the metal
cover and is positioned with and fixed to the frame of the
periphery of the metal cover, and a plurality of electrical
contacts is formed on the second surface of the substrate.
2. The housing according to claim 1, wherein the periphery of the
metal cover is formed with an L-shaped protruding plate bent
downward to increase a combined integrity of the frame and the
metal cover.
3. The housing according to claim 2, wherein the metal cover is
formed with a notched slot at a position corresponding to the long
slot of the long frame of the bevel.
4. The housing according to claim 3, wherein a top surface of the
frame is formed with a support seat for supporting the substrate.
Description
BACKGROUND OF THE INVENTION
[0001] (1) Field of the Invention
[0002] The invention relates to the field of a RSMMC (Reduced Size
MultiMedia Card) memory card, and more particularly to an
improvement of a housing of a memory card.
[0003] (2) Description of the Prior Art
[0004] Among the current electrical cards, the RSMMC memory card is
frequently used in a mobile phone and is packaged as follows. A
plastic housing is provided to fix the RSMMC memory card to a
substrate, wherein the plastic housing formed by way of injection
molding has to keep a predetermined thickness to keep the structure
intensity. Thus, under the limitation of the standard thickness of
the memory card, the space and height in the plastic housing are
inevitably reduced. Thus, the dimension of the control IC is also
limited so that the control IC with the large size and the higher
speed cannot be used and only the thinned and miniaturized control
IC can be used. However, this thinned and miniaturized control IC
has to be formed using special package processes, so the cost
thereof is relatively high, which is disadvantageous to the
reduction of the cost of the RSMMC memory card.
[0005] Taiwan Patent No. M256568 and Taiwan patent No. M283292 to
this inventor disclose memory card packages each including a frame
body and a metal sheet combined together to from an upper cover.
The portion of the lower cover is formed by directly combining the
substrate with the frame body and then forming golden fingers on
the other surface of the substrate. Thus, when the memory card is
packaged, the accommodating size of the substrate element can be
increased, and the mechanical intensity and the
distortion-resisting intensity of the housing can be increased.
[0006] However, although the above-mentioned two methods improve
the prior art problems of the memory card, they neglect the
frequently encountered problems of the size of the RSMMC memory
card. First, the RSMMC memory card together with the housing have
the standard size of 24 mm*18 mm. However, the lateral side only
has 20 mm after the corner is cut to form the idiot-proof design.
Thus, in order to provide the sufficient accommodating portion for
the integrated circuit device during the package processes, the
control IC of the substrate is placed at the lateral side of the
cut corner, and the frame body is directly formed with a slot near
the lateral side to accommodate the integrated circuit device
(FLASH IC). As shown in Taiwan patent No. M293292, the slot at the
long side of the cut corner can directly accommodate the integrated
circuit device disposed on the substrate when the substrate is
inserted. However, the slot is formed by injecting the plastic
material to cover the metal cover. So, the metal sheet in the slot
tends to be depressed due to the provision of the slot.
Furthermore, the size of the RSMMC chip may vary according to
different capacities of the integrated circuit device adopted
therein. However, in order to prevent the intensity of the slot
from being too low under the current consideration of the
structure, the slot cannot meet the size of most control chips, and
the manufacturing processes are also relatively restricted.
[0007] Although other associated references may have different
designs and application considerations on the housing of the
electrical card, no adaptive design relating to the size of the
housing is discussed.
[0008] In view of this, it is an important subject of the invention
to provide a housing of an electrical card satisfying various stand
electrical cards and having the good intensity to solve the
above-mentioned problems. Thus, the invention provides the novel
housing of the electrical card in the following description.
SUMMARY OF THE INVENTION
[0009] The invention provides a housing of an electrical card,
which is a RSMMC memory card, wherein the RSMMC memory card
together with the housing has a standard size of 24*18 mm. Due to
the provision of the idiot-proof bevel, the original length thereof
only has 20 mm left. The structure of the invention includes a
metal cover and a frame integrally formed at a periphery of the
metal cover by way of injection molding. A long slot for
accommodating a control chip is formed at a long frame. The long
slot has a length ranging from 7 to 9 mm to accommodate various
types of control chips. The bottom of the long slot is formed with
through hole slots to be pressed by push needles when the frame is
injected to cover the metal sheet. Thus, the structure intensity of
the long slot can be increased. Then, the other side opposite to
the side of the substrate formed with the IC is sealed and fixed to
complete the structure of the invention.
[0010] The following features can be obtained after comparing the
invention structure with the prior art structure.
[0011] 1. The housing of the electrical card according to the
invention utilizes the long slot having the length ranging from 7
to 9 mm to accommodate various types of control chips. In addition,
the structure utilizes the metal cover in conjunction with the
lower cover formed by the substrate, so the inner space in the
housing can be increased, and the flexibility of using various IC
devices can be increased.
[0012] 2. The housing of the invention has the hole slots, which is
formed beside the long slot and to be pressed by the push needles,
so the structure intensity of the long slot can be effectively
increased.
[0013] 3. The housing of the invention can have the better effect
and the higher structure intensity than those of the prior art
without modifying the original manufacturing processes. So, the
cost effectiveness can be enhanced.
[0014] Further aspects, objects, and desirable features of the
invention will be better understood from the detailed description
and drawings that follow in which various embodiments of the
disclosed invention are illustrated by way of examples.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a schematic illustration showing an exterior of a
metal cover of a housing of an electrical card according to the
invention.
[0016] FIG. 2 is a schematic illustration showing the metal cover
combined with a frame of the housing of the electrical card
according to the invention.
[0017] FIG. 3 is a schematic illustration showing push needles of
the housing of the electrical card, which press the metal cover
according to the invention.
[0018] FIG. 4 is an exploded schematic illustration showing the
metal cover of the housing of the electrical card, which is to be
combined with the substrate according to the invention.
[0019] FIG. 5 is a cross-sectional view taken along a line A-A of
FIG. 4.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0020] As shown in FIGS. 1, 2 and 5, an improved housing of an
electrical card of this embodiment is used in conjunction with a
RSMMC memory card and includes a metal cover 1 and a substrate 2.
The metal cover 1 has a periphery formed with an L-shaped
protruding plate 10 bent downward. A bevel 11 is formed at a corner
of the metal cover 1. The bevel 11 has a long lateral side formed
with a notched slot 12 without the L-shaped protruding plate
10.
[0021] A frame 3 is integrally formed to cover the periphery of the
metal cover 1 by way of injection molding. When the frame 3 is
formed, a bevel 31 corresponding to the bevel 11 is also formed to
provide an idiot-proof design to prevent the user from inserting
the card incorrectly. The frame 3 is formed with a thinner wall
surface 32 corresponding to the notched slot 12 of the metal cover
1 at the long lateral side of the bevel 31. The inner side of the
wall surface 32 corresponding to the notched slot 12 of the metal
cover 1 is formed with a long slot 33 (see FIG. 2) at the frame 3.
The long slot 33 has the length ranging from 7 to 9 mm in order to
match with and accommodate control chips with different sizes.
Also, because the provision of the long slot 33 is to match with
the notched slot 12, the wall surface 32 is not covered with the
L-shaped protruding plate 10 for supporting, and the depressed
problem may occur during the manufacturing processes. So, in this
embodiment, hole slots 34 are formed beside the long slot 33, as
shown in FIG. 3. The hole slots 34 can be pressed by push needles
40 during the injection molding process to prevent the metal cover
1 from being depressed. That is, the invention has to match with
different kinds of control chips, so the long slot 33 must have the
length ranging from 7 to 9 mm. In order to prevent the longer long
slot 33 from encountering the problem of the insufficient structure
intensity, the invention can obtain the better injection quality
according to the pressing of the push needles 40.
[0022] Also, in order to increase the covering intensity of the
long slot 33, the lateral side of the long slot 33 is additionally
formed with a covering layer for covering the plane of the metal
cover 1.
[0023] As shown in FIG. 4, the substrate 2 is a circuit board
having a circuit layout and includes a first surface 20 and a
second surface 21. The first surface 20 is formed with various IC
elements for the memory card. The IC elements include a control
chip and an integrated circuit device 22. The second surface 21 of
the substrate 2 is formed with a plurality of golden fingers to be
electrically connected to other electrical products.
[0024] The first surface 20 of the substrate 2 is placed into the
ladder-like support seat formed in the frame 3 and is combined with
the support seat.
[0025] New characteristics and advantages of the invention covered
by this document have been set forth in the foregoing description.
It is to be expressly understood, however, that the drawings are
for the purpose of illustration only and are not intended as a
definition of the limits of the invention. Changes in methods,
shapes, structures or devices may be made in details without
exceeding the scope of the invention by those who are skilled in
the art. The scope of the invention is, of course, defined in the
language in which the appended claims are expressed.
* * * * *