U.S. patent application number 11/795232 was filed with the patent office on 2008-05-08 for polyketone fiber paper, polyketone fiber paper core material for printed wiring board, and printed wiring board.
Invention is credited to Masao Higuchi, Fumio Matsushita, Naoyuki Shiratori.
Application Number | 20080105395 11/795232 |
Document ID | / |
Family ID | 39358742 |
Filed Date | 2008-05-08 |
United States Patent
Application |
20080105395 |
Kind Code |
A1 |
Shiratori; Naoyuki ; et
al. |
May 8, 2008 |
Polyketone Fiber Paper, Polyketone Fiber Paper Core Material For
Printed Wiring Board, And Printed Wiring Board
Abstract
An aliphatic polyketone fiber paper comprising aliphatic
polyketone fibers and a polyketone fiber paper core material for a
printed wiring board are provided. The polyketone fiber paper and
the core material have high strength and modulus of elasticity;
excellent dimensional stability, chemical resistance, heat
resistance, adhesiveness and electrical insulation; and low
dielectricity and water absorbance, and are thin, porous, and
uniform. A printed wiring board prepared from the core material
having a low dielectric constant, dimensional stability, electrical
insulation, and properties of being uniformly bored by laser
punching is also provided. The aliphatic polyketone fiber paper and
the core material for a printed wiring board comprises 1 to 100% by
mass of aliphatic polyketone fibers which comprise the repeating
unit of the below-mentioned formula (1), the fibers having an
average fiber length of 0.5 to 10 mm, an average fiber diameter of
0.1 to 20 .mu.m, a thickness of 5 to 200 .mu.m, a void ratio of 30
to 90%, and a strength per unit mass of 100 MN/kg or more. Also
provided is a single layer or multilayer printed wiring board which
comprises a core material impregnated or coated with a polymer
resin, a low dielectric polymer resin, or a polyphenylene
ether-based epoxy resin. --CH.sub.2--CH.sub.2--CO-- (1)
Inventors: |
Shiratori; Naoyuki; (Tokyo,
JP) ; Higuchi; Masao; (Tokyo, JP) ;
Matsushita; Fumio; (Tokyo, JP) |
Correspondence
Address: |
FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER;LLP
901 NEW YORK AVENUE, NW
WASHINGTON
DC
20001-4413
US
|
Family ID: |
39358742 |
Appl. No.: |
11/795232 |
Filed: |
January 16, 2006 |
PCT Filed: |
January 16, 2006 |
PCT NO: |
PCT/JP06/00435 |
371 Date: |
July 13, 2007 |
Current U.S.
Class: |
162/123 ;
162/157.2 |
Current CPC
Class: |
D21H 27/00 20130101;
D21H 13/12 20130101 |
Class at
Publication: |
162/123 ;
162/157.2 |
International
Class: |
D21H 13/12 20060101
D21H013/12; D21H 27/12 20060101 D21H027/12 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 18, 2005 |
JP |
2005-010560 |
Jan 18, 2005 |
JP |
2005-010573 |
Claims
1. A polyketone fiber paper comprising 1 to 100% by mass of
aliphatic polyketone fibers which comprise the repeating unit of
the following formula (1), wherein the polyketone fiber paper is
produced by a wet process. --CH.sub.2--CH.sub.2--CO-- (1)
2. A polyketone fiber paper comprising 1 to 99% by mass of
aliphatic polyketone fibers which comprise the repeating unit of
the following formula (1), wherein the polyketone fiber paper is
produced by a wet process. --CH.sub.2--CH.sub.2--CO-- (1)
3. A polyketone fiber paper comprising aliphatic polyketone fibers
which comprise the repeating unit of the following formula (1),
wherein the polyketone fiber paper is produced by a wet process.
--CH.sub.2--CH.sub.2--CO-- (1)
4. The polyketone fiber paper according to any one of claims 1 to
3, having a thickness of 5 to 200 .mu.m.
5. The polyketone fiber paper according to any one of claims 1 to
3, having a thickness of 5 to 100 .mu.m.
6. The polyketone fiber paper according to any one of claims 1 to
3, having a thickness of 5 to 50 .mu.m.
7. The polyketone fiber paper according to any one of claims 1 to
6, having a void ratio shown by the following formula of 30 to 90%.
Void ratio=(1-total mass of fibers forming the fiber paper/density
of the fibers/(thickness of fiber paper.times.area of fiber
paper)).times.100
8. The polyketone fiber paper according to any one of claims 1 to
7, wherein the strength per unit mass of the fiber paper is 100
MN/kg or more, wherein the strength per unit mass is tensile
strength/thickness/basis weight.
9. The polyketone fiber paper according to any one of claims 1 to
7, wherein the strength per unit mass of the fiber paper is 200
MN/kg or more, wherein the strength per unit mass is tensile
strength/thickness/basis weight.
10. The polyketone fiber paper according to any one of claims 1 to
7, wherein the strength per unit mass of the fiber paper is 400
MN/kg or more, wherein the strength per unit mass is tensile
strength/thickness/basis weight.
11. The polyketone fiber paper according to any one of claims 1 to
10, wherein the polyketone fibers are staple fibers with an average
fiber length of 0.5 to 10 mm.
12. The polyketone fiber paper according to any one of claims 1 to
11, wherein the polyketone fibers have an average diameter of 1 to
20 .mu.m.
13. A polyketone fiber paper core material for a printed wiring
board comprising the polyketone fiber papers according to any one
of claims 1 to 12.
14. The polyketone fiber paper core material for a printed wiring
board according to claim 13, wherein the polyketone fiber paper is
used in a single layer or multiple layers.
15. A printed wiring board comprising the polyketone fiber paper
core material according to claim 13 or 14 and a polymer resin.
16. The printed wiring board according to claim 15, wherein the
polyketone fiber paper core material is impregnated or coated with
the polymer resin.
17. The printed wiring board according to claim 15 or 16, wherein
the polymer resin is a low dielectric polymer resin.
18. The printed wiring board according to any one of claims 15 to
17, wherein the polymer resin is a polyphenylene ether-based epoxy
resin comprising polyphenylene ether substituted with or containing
an epoxy group in an average amount of one or more per molecule and
at least one curing agent selected from the group consisting of an
amine, a novolak phenol, and an acid anhydride as essential
components.
19. The printed wiring board according to any one of claims 15 to
18, wherein the printed wiring board is a single layer board or a
multilayer board.
20. A method for producing an aliphatic polyketone fiber paper
comprising preliminarily refining aliphatic polyketone fibers,
crushing the refined aliphatic polyketone fibers, and making paper
from the crushed aliphatic polyketone fibers.
21. The method for producing an aliphatic polyketone fiber paper
according to claim 20, wherein the preliminary refining comprises a
treatment using a beater or a refiner.
22. The method for producing an aliphatic polyketone fiber paper
according to claim 20, wherein the crushing comprises a treatment
using a high pressure homogenizer.
Description
TECHNICAL FIELD
[0001] The present invention relates to a polyketone fiber paper
which comprises 1 to 100% by mass of aliphatic polyketone fibers
and which is obtained by a wet paper making process, a polyketone
fiber paper core material for a printed wiring board, and a printed
wiring board using the polyketone fiber paper core material.
[0002] More particularly, the present invention relates to a
polyketone fiber paper which comprises aliphatic polyketone fibers,
which has high strength and modulus of elasticity; excellent
dimensional stability, chemical resistance, heat resistance,
adhesiveness, and electrical insulation; and low dielectricity and
water absorbance, and which is light, thin, and porous with uniform
pores, a polyketone fiber paper core material for a printed wiring
board, and a printed wiring board using the polyketone fiber paper
core material.
BACKGROUND ART
[0003] In recent years, the manufacture of synthetic fiber paper
using synthetic fibers instead of wood pulp has been studied.
Synthetic fiber paper has good water resistance combined with the
various properties of the synthetic fibers. Thus, synthetic fiber
paper has received attention as a new material and various types
have been proposed.
[0004] For example, a fiber paper using polyester fibers is
disclosed in Patent Document 1. This has excellent water resistance
and chemical resistance. Thus, it is used in supports for printing
plates of heat-sensitive stencils. However, it is necessary to
improve heat resistance since polyester fibers are a thermoplastic
resin and dimensional stability and strength are reduced by thermal
expansion when exposed to a high temperature.
[0005] Also, a fiber paper using aromatic polyamide fibers is
disclosed in Patent Document 2. This fiber paper has excellent
mechanical strength, dimensional stability, heat resistance, and
the like. Thus, the fiber paper is used in substrates for
multilayer printed wiring boards. However, since aromatic polyamide
fibers have high water absorbance, the printed wiring board
substrates made from the aromatic polyamide fibers swell by
desorption of the absorbed water during processing at a high
temperature. Thus, there is room for improvement. In addition, the
aromatic polyamide fibers are desired to possess improved
performance in adhesion with other resins.
[0006] A sheet-like product using aliphatic polyketone fibers is
disclosed in Patent Document 3. Although it is disclosed that the
sheet-like structure material has low water absorbance, is highly
rigid, and has chemical resistance, mechanical strength,
dimensional stability, heat resistance, and adhesiveness, there is
still room for improvement.
[0007] Although it is disclosed in Patent Document 4 that a
polyketone nonwoven fabric having a thickness of 50 to 200 .mu.m is
applied to a battery separator and exhibits excellent electrolyte
infinity, there is still room for improvement.
[0008] Synthetic fiber paper also has excellent electrical
insulation. Thus, use thereof in electrical materials, in
particular, substrates of printed wiring boards (core material) and
the like is being studied.
[0009] With progression in the miniaturization and high integration
of electronic devices, the slimming and multilayering of printed
wiring boards are desired.
[0010] In multilayer printed wiring boards, slimming is difficult
when the core material is thick. If the core material is thin,
printed wiring boards are easily deformed and have poor dimensional
stability. Also, when the core material has high water absorbance,
there is trouble such as the occurrence of swelling and/or damage
to the electrical insulation of the substrate when immersed in a
molten solder bath. Furthermore, when adhesion of the core material
and the thermoplastic resin or thermosetting resin impregnated into
or applied to the core material is bad, the impact resistance of
the substrate is inferior.
[0011] When a fiber paper using aromatic polyamide fibers is used
as the core material for a multilayer printed wiring board, an
improvement in low water absorbance and high adhesiveness is
desired. Also, when a fiber paper comprising polyester fibers is
used, the multilayer printed wiring board is easily deformed since
the modulus of elasticity is low. Thus, there is room for
improvement in dimensional stability. When a glass woven fabric or
a glass nonwoven fabric is used, there are limitations in its
application to uses desiring high frequency characteristics since
the dielectric constant of glass is high. However, a polyketone
fiber paper core material and a printed wiring board using a
polyketone fiber paper are still not on the market.
[0012] (Patent Document 1) Japanese Patent Application No.
2003-171191
[0013] (Patent Document 2) Japanese Patent Application Laid-open
No. H08-190326
[0014] (Patent Document 3) Japanese Patent Application Laid-open
No. 2001-207335
[0015] (Patent Document 4) Japanese Patent Application No.
2004-10408
DISCLOSURE OF THE INVENTION
Problems to be Solved by the Invention
[0016] The present invention solves the above-mentioned problems
seen in the prior art. Specifically, an object of the present
invention is to provide an aliphatic polyketone fiber paper which
comprises 1 to 100% by mass of aliphatic polyketone fibers, which
has high strength and modulus of elasticity; excellent dimensional
stability, chemical resistance, heat resistance, adhesiveness and
electrical insulation; and low dielectricity and water absorbance,
and which is light, thin, porous, and uniform.
[0017] Another object of the present invention is to provide a
polyketone fiber paper core material for a printed wiring board
which has excellent heat resistance, adhesiveness, and chemical
resistance; low dielectricity and water absorbance; and high
modulus of elasticity, and which is light, thin, porous and
uniform, and also to provide a printed wiring board which uses a
fiber paper comprising aliphatic polyketone fibers as the core
material and which has low dielectricity, and excellent dimensional
stability and electrical insulation.
Means for Solving the Problems
[0018] In order to achieve the above objects, the inventors of the
present invention have conducted extensive studies on fiber papers
comprising aliphatic polyketone fibers. As a result, the inventors
have found that an aliphatic polyketone fiber paper exhibiting
excellent chemical resistance, heat resistance, dimensional
stability, adhesiveness, and electrical insulation; having low
dielectricity and water absorbance, high strength and modulus of
elasticity; and being light, thin, porous and uniform can be
brought to fruition.
[0019] The inventors have further found that a polyketone fiber
paper core material for a printed wiring board which has excellent
heat resistance, adhesiveness, and chemical resistance; low
dielectricity and water absorbance; and high modulus of elasticity,
and which is light, thin, porous and uniform can be brought to
fruition, and that a printed wiring board which uses a fiber paper
comprising aliphatic polyketone fibers and which has low
dielectricity and excellent dimensional stability and electrical
insulation can be brought to fruition. These findings have led to
the completion of the invention.
[0020] Specifically, the present invention provides:
[0021] 1. A polyketone fiber paper comprising 1 to 100% by mass of
aliphatic polyketone fibers which comprise the repeating unit of
the following formula (1), wherein the polyketone fiber paper is
produced by a wet process.
--CH.sub.2--CH.sub.2--CO-- (1)
[0022] 2. A polyketone fiber paper comprising 1 to 99% by mass of
aliphatic polyketone fibers which comprise the repeating unit of
the following formula (1), wherein the polyketone fiber paper is
produced by a wet process.
--CH.sub.2--CH.sub.2--CO-- (1)
[0023] 3. A polyketone fiber paper comprising aliphatic polyketone
fibers which comprise the repeating unit of the following formula
(1), wherein the polyketone fiber paper is produced by a wet
process.
--CH.sub.2--CH.sub.2--CO-- (1)
[0024] 4. The polyketone fiber paper according to any one of 1 to 3
above having a thickness of 5 to 200 .mu.m.
[0025] 5. The polyketone fiber paper according to any one of 1 to 3
above having a thickness of 5 to 100 .mu.m.
[0026] 6. The polyketone fiber paper according to any one of 1 to 3
above having a thickness of 5 to 50 .mu.m.
[0027] 7. The polyketone fiber paper according to any one of 1 to 6
above, having a void ratio shown by the following formula of 30 to
90%.
Void ratio=(1-total mass of fibers forming the fiber paper/density
of the fibers/(thickness of fiber paper.times.area of fiber
paper)).times.100
[0028] 8. The polyketone fiber paper according to any one of 1 to 7
above, wherein the strength per unit mass of the fiber paper is 100
MN/kg or more, wherein the strength per unit mass is tensile
strength/thickness/basis weight.
[0029] 9. The polyketone fiber paper according to any one of 1 to 7
above, wherein the strength per unit mass of the fiber paper is 200
MN/kg or more, wherein the strength per unit mass is tensile
strength/thickness/basis weight.
[0030] 10. The polyketone fiber paper according to any one of 1 to
7 above, wherein the strength per unit mass of the fiber paper is
400 MN/kg or more, wherein the strength per unit mass is tensile
strength/thickness/basis weight.
[0031] 11. The polyketone fiber paper according to any one of 1 to
10 above, wherein the aliphatic polyketone fibers are staple fibers
having an average fiber length of 0.5 to 10 mm.
[0032] 12. The polyketone fiber paper according to any one of 1 to
11 above, wherein the aliphatic polyketone fibers have an average
fiber diameter of 0.1 to 20 .mu.m.
[0033] 13. A polyketone fiber paper core material for a printed
wiring board comprising the polyketone fiber paper according to any
one of 1 to 12 above.
[0034] 14. The polyketone fiber paper core material for a printed
wiring board according to 13 above, wherein the polyketone fiber
paper is used in a single layer or multiple layers.
[0035] 15. A printed wiring board comprising the polyketone fiber
paper core material according to any one of 13 to 14 above and a
polymer resin.
[0036] 16. A printed wiring board comprising a polyketone fiber
paper core material impregnated or coated with a polymer resin.
[0037] 17. The printed wiring board according to any one of 15 to
16 above, wherein the polymer resin is a low dielectric polymer
resin.
[0038] 18. The printed wiring board according to any one of 15 to
17 above, wherein the polymer resin is a polyphenylene ether-based
epoxy resin comprising polyphenylene ether substituted with or
containing an epoxy group in an average amount of one or more per
molecule and at least one curing agent selected from the group
consisting of an amine, a novolak phenol, and an acid anhydride as
essential components.
[0039] 19. The printed wiring board according to any one of 15 to
18 above, comprising the printed wiring board of a single layer or
multiple layers.
[0040] 20. A method for producing an aliphatic polyketone fiber
paper comprising preliminarily refining aliphatic polyketone
fibers, crushing the refined aliphatic polyketone fibers, and
making paper from the crushed aliphatic polyketone fibers.
[0041] 21. The method for producing an aliphatic polyketone fiber
paper according to 20 above, wherein the preliminary refining
comprises a treatment using a beater or a refiner.
[0042] 22. The method for producing an aliphatic polyketone fiber
paper according to 20 above, wherein the crushing comprises a
treatment using a high pressure homogenizer.
EFFECT OF THE INVENTION
[0043] The polyketone fiber paper of the present invention provides
a fiber paper having high strength and modulus of elasticity;
dimensional stability, heat resistance, and chemical resistance;
low dielectricity and water absorbance; high electrical insulation;
and excellent adhesiveness, and being light, very thin, porous, and
uniform. Thus, the polyketone fiber paper has a prominent effect of
having features which have not been possessed by any known
materials.
[0044] The polyketone fiber paper core material for a printed
wiring board of the present invention provides a light, very thin,
and porous core material, which has low dielectricity, high
strength and modulus of elasticity, excellent heat resistance,
chemical resistance, low water absorbance, and excellent
adhesiveness. In addition, the printed wiring board using the
aliphatic polyketone fiber paper as a core material is light and
thin and excels in low dielectricity, dimensional stability, impact
resistance, electrical insulation, and properties of being
uniformly bored by laser punching. Thus, the printed wiring board
has a prominent effect of having features which have not been
possessed by any known printed wiring board.
BEST MODE FOR CARRYING OUT THE INVENTION
[0045] The present invention is described below in detail.
[0046] The polyketone fiber paper of the present invention is a
fiber paper produced by a wet process comprising 1 to 100% by mass
of aliphatic polyketone fibers. The polyketone fiber paper rapidly
softens and deforms near the melting point of the aliphatic
polyketone fibers. The polyketone fiber paper of the present
invention makes use of these properties and is characterized in
which aliphatic polyketone fibers thermally fused among themselves
or with other fibers. Furthermore, the method described herein can
produce a uniform and tough fiber paper, notwithstanding its
lightness, thinness, and porosity.
[0047] The polyketone fiber paper core material for a printed
wiring board of the present invention contains the polyketone fiber
paper of the present invention.
[0048] The polyketone fiber paper core material for a printed
wiring board of the present invention may either consist only of
the polyketone fiber paper of the present invention or contain
other components necessary as a core material for a printed wiring
board.
[0049] The thickness of the fiber paper of the present invention is
preferably from 5 to 200 .mu.m, more preferably from 5 to 100
.mu.m, more preferably from 5 to 90 .mu.m, more preferably from 5
to 50 .mu.m, more preferably from 5 to 40 .mu.m, more preferably
from 5 to 20 .mu.m, and still more preferably from 5 to 15 .mu.m.
The fiber paper with a thickness of 5 to 200 .mu.m can be handled
in the same manner as commonly used paper. Such a fiber paper is
soft and can be variously processed, and the formed products can be
easily deformed and cut. In addition, the fiber paper exhibits
excellent air permeability, impregnation properties, and ink
permeability, allowing gas and liquid to permeate or pass through.
The fiber paper with a thickness of 5 .mu.m or more can maintain
its strength. A thickness not more than 200 .mu.m ensures not only
good flexibility and processability, but also excellent
impregnation properties and permeability of gas and liquid. In
addition, if the thickness is not more than 200 .mu.m, heat is
sufficiently transferred inside the fiber paper and allows fibers
inside the fiber paper to be sufficiently fused during
heat-pressing, thereby providing the fiber paper with sufficient
strength.
[0050] It is preferable that the fiber paper core material for a
printed wiring board of the invention also has a thickness of 5 to
200 .mu.m, more preferably from 5 to 100 .mu.m, more preferably
from 5 to 90 .mu.m, more preferably from 5 to 50 .mu.m, more
preferably from 5 to 40 .mu.m, more preferably from 5 to 20 .mu.m,
and still more preferably from 5 to 15 .mu.m.
[0051] The fiber paper of the present invention preferably has a
void ratio shown by the following formula of 30 to 90%.
Void ratio=(1-total mass of fibers forming the fiber paper/density
of the fibers/(thickness of fiber paper.times.area of fiber
paper)).times.100
[0052] A more preferable void ratio is 35 to 85%. A void ratio
between 30 to 90% ensures lightness, porosity, processability,
impregnation property, and other characteristics of fiber paper. A
void ratio of 30% or more can provide light and porous properties
characteristic to fiber paper. A void ratio of 90% or less can
provide strength necessary for fiber paper.
[0053] The strength per unit mass of the fiber paper of the present
invention, that is, the strength per unit thickness and unit basis
weight (=tensile strength/thickness/basis weight) is preferably 100
MN/kg or more, more preferably 200 MN/kg or more, more preferably
400 MN/kg or more, more preferably 700 MN/kg or more, more
preferably 1,000 MN/kg or more, more preferably 1,500 MN/kg or
more, still more preferably 2,000 MN/kg or more, and particularly
preferably 2,500 MN/kg or more. A tough fiber paper having strength
necessary for processing and handling in spite of its lightness and
thinness can be obtained by making the strength per unit mass 100
MN/kg or more.
[0054] The aliphatic polyketone fibers used in the present
invention have a structure comprising 90 mol % by mass or more of
the repeating unit of the following formula (1).
--CH.sub.2--CH.sub.2--CO-- (1)
[0055] If the content of the repeating unit is 90 mol % or more,
the fiber paper has high strength and modulus of elasticity and
excellent heat resistance.
[0056] Crystallinity of the fiber is preferably 30% or more. A
crystallinity of 30% or more ensures that the fiber paper exhibits
high strength and high modulus of elasticity.
[0057] As a process for producing polyketone fibers, a process
comprising wet-spinning the fibers from an aqueous solution of a
polyketone using a zinc salt, a calcium salt, an isocyanate salt,
or the like, followed by heat-drawing the fibers as described in
Patent Document 3 is preferable for obtaining polyketone fibers
having high strength and high modulus of elasticity.
[0058] The aliphatic polyketone fibers used in the present
invention are preferably staple fibers having an average fiber
length of 0.5 to 10 mm, and more preferably 1 to 7 mm. Cut staple
fibers are preferably used. Staple fibers with a fiber length of
0.5 mm or more can ensure necessary paper strength during the paper
making process. Staple fibers with a fiber length of not more than
10 mm can improve the homogeneity of the fiber dispersion during
the paper making process.
[0059] The aliphatic polyketone fibers used in the present
invention preferably have an average fiber diameter of 20 .mu.m or
less in order to produce uniform and thin fiber paper. A more
preferable average fiber diameter is 17 .mu.m or less. In addition,
in order to maintain strength during the thermal fusion of sheets,
the average fiber diameter is preferably 0.1 .mu.m or more, and
more preferably 1 .mu.m or more.
[0060] It is preferable to blend 1 to 100% by mass of the
polyketone fibers of the present invention with 99 to 0% by mass of
other fibers. A more preferable amount of the polyketone fibers is
100% by mass or 1 to 99% by mass. A still more preferable amount of
the polyketone fibers is 1 to 99% by mass or 100% by mass. The
lower limit of the amount of the polyketone fiber is more
preferably 10% by mass, more preferably 50% by mass, more
preferably 60% by mass, more preferably 70% by mass, and still more
preferably 80% by mass. The amount of 1% by mass or more ensures
the product to exhibit high strength and high heat resistance of
polyketone fibers. The fiber paper is provided with properties
peculiar to polyketone fibers when the amount is 100% by mass, and
with properties peculiar to the other fibers when the amount is 99%
by mass or less.
[0061] As examples of the other fibers used in the present
invention, natural fibers, regenerated natural fibers, inorganic
fibers, and/or synthetic fibers can be given. Cellulose fibers such
as cotton, hemp, and wood can be given as examples of the natural
fibers. As examples of the regenerated natural fibers, viscose
fibers, rayon fibers, and solvent-spun cellulose fibers can be
given. As examples of the inorganic fibers, glass fibers, carbon
fibers, and metal fibers can be given. As examples of the synthetic
fibers, polyethylenes, polypropylenes, nylons, polyesters, and
polyacrylonitriles can be given. Heat resistance can be improved
particularly by using synthetic heat resistant fibers such as
wholly aromatic polyamide fibers (p-phenyleneterephtalamide fibers
and p-phenylenediphenyl ether terephtalamide fibers (these are
hereafter called "para-aramid fibers")), wholly aromatic polyester
fibers, poly(p-phenylenebenzobisoxazole) (PBO) fibers, polyimide
fibers, polyphenylene sulfide fibers, and Teflon.TM. fibers. Either
one of these other fibers or a combination of two or more of these
other fibers can be mixed with the polyketone fiber to obtain a
fiber paper possessing properties of these other fibers. The fiber
length of these other fibers is the same as the length of the
polyketone fibers, that is, preferably 0.5 to 10 mm. The average
fiber diameter is preferably 0.1 to 20 .mu.m.
[0062] The polyketone fiber paper of the present invention can be
produced by a wet paper making process comprising homogeneously
dispersing 100% by mass of the polyketone fibers or a mixture of 1
to 99% by mass of the polyketone fibers and 99 to 1% by mass of the
other fibers in water using a pulper, processing the dispersion
liquid by a cylinder paper machine, a Fourdrinier paper machine, an
inclined-wire former, or a combination paper-making machine of
these machines, thereby forming a plane paper layer in which fibers
are uniformly distributed on a net, sufficiently drying the paper
by a drier such as a drum dryer, a Yankee dryer, or a hot-blast
dryer, and hot-pressing the dried paper to cause the polyketone
fibers to be fused among themselves or with other fibers, thereby
causing the paper to exhibit the target strength.
[0063] This is a typical process for producing the fiber paper, but
the process is by no means limited to the above-described process.
For example, when 1 to 99% by mass of the polyketone fibers is
mixed with 99 to 1% by mass of the other fibers, these fibers may
be mixed using a pulper while deflaking or may be separately
deflaked before being mixed. When fibers are dispersed in water,
additives such as an emulsifier, a dispersant, a viscosity
controlling agent, and/or a paper-reinforcing agent may be added to
improve dispersibility, whereby a thinner and more uniform fiber
paper with an adequate strength can be obtained. The addition of
additives by no means provides limitations to the present
invention. Furthermore, the whole or a part of the polyketone
fibers may be refined to become fibrillated before paper-making,
the whole or a part of the other fibers may be mixed after refining
and fibrillation, or the polyketone fibers and other fibers are
refined after mixing. Refining makes fiber layers uniform,
increases the strength of paper layers, increases the production
speed, improves productivity, and ensures production of thinner and
more uniform fiber paper possessing increased strength. The
refining may be carried out using a device called a beater or may
be carried out using a disc refiner, a high-pressure homogenizer,
or the like. In order to produce a thinner fiber paper possessing
more uniform strength, it is preferable that fibers are
preliminarily refined using a beater or a disc refiner, followed by
fibrillation using a high-pressure homogenizer to decrease the
fiber diameter. In order to produce a thinner fiber paper
possessing more uniform strength, preliminary refining is
preferably carried out for 1 to 4 hours using a beater. It is
preferable to circulate the fibers 10 to 200 times in a disc
refiner, followed by crushing by circulating 5 to 50 times using a
high-pressure homogenizer under a pressure of 100 Mpa. Freeness
after refining is preferably 20 to 50.degree. SR, and more
preferably 25 to 45.degree. SR. The freeness is determined using a
Schopper Riegler freeness tester according to JIS-P8121 by diluting
the fibers with water to a fiber concentration of 0.2% by mass. The
average of two measurements is used as the value of freeness. Since
the number of fibers in the fiber paper thickness direction is
increased by highly fibrillating the fibers and decreasing the
fiber diameter, it is possible to obtain a thinner and more uniform
fiber paper by fibrillating the fibers and decreasing the fiber
diameter. A high degree of fibrillation and miniaturization of the
fiber diameter can increase contact points among fibers and
increase the strength after thermal fusion. Provision of the step
of refining by no means limits the present invention. Furthermore,
it is possible to previously make a 100% by mass polyketone fiber
paper and form a paper of other fibers on the 100% by mass
polyketone fiber paper, or to form a paper of other fibers on both
sides of the 100% by mass polyketone fiber paper. The step of the
process may be reversed. There are no specific limitations to the
process of making paper.
[0064] The fiber paper with a high strength per unit mass of the
present invention can only be obtained by thermally fusing fibers
of a light, thin, and uniform fiber paper. In order to thermally
fuse the whole or a part of the aliphatic polyketone fibers among
themselves or with other fibers, it is preferable to heat-press the
fibers at a temperature in the range from 40 degrees lower to 40
degrees higher than the melting point of the polyketone fiber. The
polyketone fibers are thermally fused by heat-pressing at a
temperature of 40 degrees lower than the melting point or over.
Heat-pressing at a temperature of 40 degrees higher than the
melting point or below is preferable, because the fibers are
neither molten nor baked in this temperature range. When the
melting point of other fibers is lower than that of the melting
point of the polyketone fibers, the polyketone fibers and still
other fibers may be thermally fused using such other fibers. In
this instance the other fibers are preferably heat-pressed at a
temperature in the range from 40 degrees lower to 40 degrees higher
than the melting point of such other fibers. Although a commonly
used press linear load is applied during the heat press, a linear
load in the range from 1 to 200 kN/m is preferable in order to
control the thickness.
[0065] To further increase the strength or to provide the
polyketone fiber paper core material for a printed wiring board
with processability and other functions, the polyketone fiber paper
and the polyketone fiber paper core material for a printed wiring
board of the present invention can be impregnated or coated with
the same or different polymer resin, such as a thermoplastic resin
or a thermoset resin, as used when producing a printed wiring
board.
[0066] The polyketone fiber paper and the polyketone fiber paper
core material for a printed wiring board of the present invention
can be used as a printed wiring board in a single layer or multiple
layers. When a thin polyketone fiber paper is used in multiple
layers, the multilayer fiber paper exhibits greater strength than a
single layer fiber paper made from the same fiber and having the
same void ratio and the same thickness. Such a material can be used
as a high strength printed wiring board or in other applications as
a high-strength resin-impregnated board.
[0067] The printed wiring board of the present invention is
prepared by impregnating or coating the aliphatic polyketone fiber
paper core material comprising 1 to 100% by mass of aliphatic
polyketone fibers with a polymer resin. Due to the low dielectric
properties of the polyketone fiber paper core material, the
substrate is provided with excellent electrical characteristics
such as a low dielectric constant and a low dielectric loss
tangent.
[0068] As examples of the polymer resins used in the present
invention, thermoplastic resins such as a polyolefin resin and a
fluororesin, and thermoset resins such as a phenol resin, an epoxy
resin, and a polyimide resin can be given. In particular, if a low
dielectric polymer resin having a dielectric constant of 4.0 or
less such as a polyolefin resin, a polystyrene resin, a
fluororesin, a silicon resin, a polyimide resin, an epoxy resin,
and particularly a polyphenylene ether epoxy resin (a resin
containing polyphenylene ether substituted with or containing an
epoxy group in an average amount of one or more per molecule and at
least one curing agent selected from the group consisting of an
amine, a novolak phenol, and an acid anhydride as essential
components), is used, the substrate exhibits very excellent
electrical characteristics, along with the low dielectric
properties of the polyketone fiber paper core material. Such a
substrate can be suitable as a substrate for high frequency
circuits.
[0069] The printed wiring board of the present invention can be
prepared by melting a polymer resin or diluting the polymer resin
with a solvent to fluidize the resin, impregnating the polyketone
fiber paper core material with the melted or fluidized polymer
resin, and cooling or drying the resin. In the case of a thermoset
resin, the resin may be cured after further heating to the curing
temperature. It is possible to press the printed wiring board in
order to adjust the thickness. There are no limitations to the
method for preparing the printed wiring board of the present
invention.
[0070] The printed wiring board of the present invention may be
used for an application in which a single-layer substrate is used.
Furthermore, making the best use of the thinness, the core material
can be used for an application of forming a laminated board by
heat-pressing or an application of forming an insulating layer or a
multilayer printed wiring board in the multilayer printed wiring
board in which the printed wiring is provided in an inner layer and
a surface layer across the insulating layer.
EXAMPLES
[0071] The present invention will be described in more detail by
examples, which should not be construed as limiting the present
invention.
[0072] The type, form, and the like of the fibers used for the
polyketone fiber papers and polyketone fiber paper core materials
for a printed wiring board are shown in Table 1, and the
constitution and the measurement results of the properties of the
polyketone fiber papers and the polyketone fiber paper core
materials for a printed wiring board are shown in Table 2. The
measurement results of the properties of the printed wiring boards
in which the core materials are used are also shown in Table 2.
[0073] The polyketone fibers shown in Table 1 comprise
substantially 100 mol % of the repeating unit of the
below-mentioned formula (1). Fibers A6 and A7 in Table 1 were
refined by circulating a water dispersion with a fiber
concentration of 1% by mass, to which the defoamer (as described in
Example 1) has been added, 30 times in a disc refiner (manufactured
by Kumagai Riki Kogyo Co., Ltd.) in which the disc interval is
adjusted to 0.2 mm, then adjusting the fiber concentration of the
water dispersion to 0.75% by mass, and circulating this water
dispersion 10 times (in the case of Fiber A) or 20 times (in the
case of Fiber B) in a high-pressure homogenizer (manufactured by
Niro Soavi S. p. A.) under the conditions of pressure 100 MPa.
Fiber F in Table 1 was refined by circulating a water dispersion of
a solvent-spun cellulose fiber (TENCEL.TM. manufactured by
Courtaulds Fibers, Inc.) 30 times in the disc refiner and 5 times
in the high-pressure homogenizer in the same manner.
--CH.sub.2--CH.sub.2--CO-- (1)
Example 1
[0074] 100% by mass of aliphatic polyketone staple fibers with an
average fiber diameter of 10 .mu.m and fiber length of 3 mm were
charged to a pulper, followed by the addition of water warmed to
50.degree. C., to obtain a polyketone staple fiber water dispersion
(fiber concentration: 2% by mass). The dispersion liquid was
stirred for 15 minutes. Water was added to the dispersion liquid to
make the fiber concentration 1% by mass. A defoamer
(polyoxyalkylene glycol fatty acid ester) was added in an amount of
0.5% by mass of the amount of fibers, and the mixture was stirred
for 30 minutes in a low-speed stirring vessel. Water was further
added to the fiber dispersion liquid to adjust the slurry
concentration to 0.1% by mass, followed by the addition of 20 ppm
of a viscosity controlling agent (polyethylene oxide). The
resulting slurry was deaerated under vacuum immediately before
making paper using a cylinder paper machine equipped with a 100
mesh wire at a rate of 30 m/min. The wet paper thus produced was
dried using a Yankee drier at a surface temperature of 130.degree.
C. and pressed using a hot roller at a surface temperature of
275.degree. C. to obtain a polyketone fiber paper with a thickness
of 50 .mu.m and a void ratio of 70%.
[0075] The fiber paper was stored at a temperature at which
cellulose decomposes (230.degree. C.) for three hours. Neither the
color nor the size changed, demonstrating excellent heat resistance
and dimensional stability. In addition, the fiber paper did not
change after being dipped in 40% sulfuric acid, a 40% aqueous
solution of sodium hydroxide, or hexane at room temperature for 10
days, showing excellent chemical resistance. Moreover, water
absorption of the fiber paper after storing at 23.degree. C. and
80% RH for three days was less than 1% by mass, demonstrating low
water absorptivity.
[0076] The fiber paper, as a polyketone fiber paper core material
for a printed wiring board, was immersed in an epoxy resin solution
(bisphenol A epoxy resin: 75 parts by mass, high brominated
bisphenol A epoxy resin: 25 parts by mass, and dicyandiamide curing
agent: 3 parts by mass) with a solid component concentration of
45%. The supporting body was removed from the epoxy resin solution,
dried and half-cured at 160.degree. C., and pressed and cured at
185.degree. C. to obtain a flat board with a smooth surface.
Examples 2 to 9
[0077] Polyketone fiber papers and polyketone fiber paper core
materials for a printed wiring board were prepared in the same
manner as in Example 1 using the aliphatic polyketone fibers shown
in Table 2. Conditions differing from the conditions of Example 1
are described in Table 2. Printed wiring boards were prepared in
the same manner as in Example 1 using the core materials.
Example 10
[0078] Printed wiring boards were prepared in the same manner as in
Example 1 by immersing the polyketone fiber paper core materials
for a printed wiring board prepared in Example 1 in an epoxy resin
solution (polyphenylene ether-based epoxy resin: 100 parts by mass,
dicyandiamide curing agent: 3 parts by mass) with a solid component
content of 45%.
Examples 11 to 15
[0079] Polyketone fiber papers and polyketone fiber paper core
materials for a printed wiring board were prepared in the same
manner as in Example 1 using the aliphatic polyketone fibers shown
in Table 2. Conditions differing from the conditions of Example 1
are described in Table 2. Printed wiring boards were prepared in
the same manner as in Example 10 using the core materials.
Example 16
[0080] A defoamer was added to a mixture of 70% by mass of
aliphatic polyketone staple fibers with an average fiber diameter
of 10 .mu.m and fiber length of 3 mm and 30% by mass of para-aramid
fibers (Technora.TM. manufactured by Teijin, Ltd.) with a fiber
length of 3 mm. The mixture was charged to a pulper and dispersed
in water to obtain a fiber dispersion liquid. A viscosity
controlling agent was added to the fiber dispersion liquid and the
mixture was deaerated under vacuum immediately before making paper
using a cylinder paper machine equipped with a 100 mesh wire. The
resulting paper was dried using a Yankee drier at a surface
temperature of 130.degree. C. and pressed using a hot roller at a
surface temperature of 275.degree. C. to obtain a polyketone fiber
paper with a thickness of 50 .mu.m and a void ratio of 70%.
[0081] The fiber paper was stored at a temperature at which
cellulose decomposes (230.degree. C.) for three hours. Neither the
color nor the size changed, demonstrating excellent heat resistance
and dimensional stability. In addition, the fiber paper did not
change after being dipped in 40% sulfuric acid, a 40% aqueous
solution of sodium hydroxide, or hexane at room temperature for one
day, showing excellent chemical resistance. Moreover, water
absorption of the fiber paper after storing at 23.degree. C. and
80% RH for three days was 1% by mass, demonstrating low water
absorptivity.
[0082] A substrate was prepared in the same manner as in Example 1
using this fiber paper as a polyketone fiber paper core material
for a printed wiring board.
Examples 17 to 27
[0083] Polyketone fiber papers and polyketone fiber paper core
materials for a printed wiring board were prepared in the same
manner as in Example 1 using the aliphatic polyketone fibers and
other fibers shown in Table 2. Conditions differing from the
conditions of Example 1 are described in Table 2. Printed wiring
boards were prepared in the same manner as in Example 1 using the
core materials.
Example 28
[0084] A printed wiring board was prepared in the same manner as in
Example 1 by immersing the polyketone fiber paper core material for
a printed wiring board prepared in Example 16 in an epoxy resin
solution (polyphenylene ether epoxy resin: 100 parts by mass,
dicyandiamide curing agent: 3 parts by mass) with a solid component
content of 45%.
Comparative Examples 1 to 2
[0085] A defoamer was added respectively to glass fibers with an
average fiber diameter of 12 .mu.m and fiber length of 3 mm and to
para-aramid fibers. The fibers were each dispersed in water using a
pulper to obtain fiber dispersion liquids. After the addition of a
viscosity controlling agent, each of the fiber dispersion liquids
was deaerated under vacuum immediately before making paper using a
cylinder paper machine equipped with a 100 mesh wire. The resulting
papers were dried using a Yankee drier at a surface temperature of
130.degree. C. installed with a heat press roller of which the
temperature was set at the upper limit of 350.degree. C. Neither
the glass fibers nor the para-aramid fibers reached the respective
softening temperature, thus failing to exhibit fiber paper
strength. Therefore, after moving onto a polytetrafluoroethylene
sheet, the fiber papers were impregnated with the same epoxy resin
solution as used in Example 1 to obtain printed wiring boards under
the same conditions as in Example 1.
[0086] The glass fibers and para-aramid fibers were stored for
three hours at a temperature at which cellulose decomposes
(230.degree. C.). Neither the color nor the size changed,
demonstrating excellent heat resistance and dimensional stability.
As a result of immersion in 40% sulfuric acid, a 40% aqueous
solution of sodium hydroxide, and hexane at room temperature for 10
days, the glass fibers and para-aramid fibers were found to have
been damaged by the aqueous solution of sodium hydroxide. In
addition, the glass fibers and para-aramid fibers were stored under
the conditions of a temperature of 23.degree. C. and RH of 80% for
three days to confirm that the water adsorption of the glass fibers
was less than 1% by mass and that of the para-aramid fibers was 4%
by mass.
Comparative Example 3
[0087] A fiber paper was obtained using polyethylene terephthalate
(polyester) fibers (EPO43.TM. manufactured by Kuraray Co., Ltd.)
according to the same method as used in Example 1.
[0088] Although the resulting fiber paper exhibited low water
absorptivity, the fiber paper was deformed in the heat resistance
test and dimensional stability test, and was damaged by a 40%
aqueous solution of sodium hydroxide in the chemical resistance
test.
[0089] A printed wiring board was prepared in the same manner as in
Example 1 using the fiber paper as a core material for a printed
wiring board.
Comparative Example 4
[0090] A defoamer was added to a mixture of 50% by mass of
para-aramid fiber with an average fiber diameter of 12 .mu.m and
fiber length of 3 mm and 50% by mass of PBO fibers (ZYLON AS.TM.
manufactured by Toyobo Co., Ltd.). The mixture was dispersed in
water using a pulper to obtain a fiber dispersion liquid. After the
addition of a viscosity controlling agent, the fiber dispersion
liquid was deaerated under vacuum immediately before making paper
using a cylinder paper machine equipped with a 100 mesh wire. The
resulting paper was dried using a Yankee drier at a surface
temperature of 130.degree. C. installed with a heat press roller of
which the temperature was set at the upper limit of 350.degree. C.
Neither the para-aramid fibers nor the PBO fibers reached the
respective softening temperature, thus failing to exhibit strength
of a fiber paper. Therefore, after moving onto a
polytetrafluoroethylene sheet, the fiber paper was impregnated with
the same epoxy resin solution used in Example 1 to obtain a printed
wiring board under the same conditions as in Example 1.
Comparative Examples 5 to 7
[0091] Core materials for a printed wiring board were prepared in
the same manner as in Example 1 by combining the other fibers shown
in Table 2. Conditions differing from the conditions of Example 1
are described in Table 2. Printed wiring boards were prepared in
the same manner as in Example 1 using the core materials.
[0092] The fiber papers and the fiber paper core materials for a
printed wiring board prepared in Examples 1 to 28 and Comparative
Examples 1 to 7 were evaluated by the following methods.
[0093] Tensile strength: Test specimens with a width of 15 mm and a
length of 100 mm were elongated using a constant speed drawing
tensile tester at an elongation rate of 300 mm/min to determine the
maximum load up to the point of breaking. The average of five
measurements was regarded as the tensile strength (kN/m).
[0094] Thickness unevenness: The thickness was measured at ten
arbitrary points using a micrometer to calculate the rate of
thickness change. Samples with a rate of thickness change of less
than 10% were evaluated as "O", those with a rate of thickness
change of 10 to 20% were evaluated as ".DELTA.", and those with a
rate of thickness change of 20% or more were evaluated as "X".
Rate of thickness change=(maximum measured thickness-minimum
measured thickness)/average measured thickness.times.100
[0095] The printed wiring boards prepared from the fiber paper core
materials prepared above were evaluated and compared by the
following methods.
[0096] Smoothness: The mirror reflection light on the surface of
the substrate was visually observed. The samples of which the
reflection light was uniform were evaluated as "O", otherwise the
samples were evaluated as "X".
[0097] Heat resistance: The printed wiring boards were stored for
three days under an atmosphere of 30.degree. C. and 80% RH, then
immersed in a molten solder bath at 260.degree. C. for two minutes
to visually observe the change of state. The samples with no change
being observed were evaluated as "O", otherwise the samples were
evaluated as "X".
[0098] Half-cured printed wiring boards obtained above were
laminated and heat-pressed at 185.degree. C. to obtain laminated
boards with a thickness of 1 mm. The laminated boards were stored
under an atmosphere of 23.degree. C. and 65% RH for one day and the
following evaluations were carried out.
[0099] Dielectric constant: A copper foil was applied to both sides
of the substrate to measure the dielectric constant of the
substrate as an electrode using a dielectric property meter
manufactured by Agilent Technologies, Inc. (Type 4284.TM.). A
frequency of 1 MHz was used for the measurement.
[0100] Dimensional stability: The coefficient of thermal expansion
in the XY direction of a test specimen was measured using a linear
expansion measuring device when the temperature was increased from
100.degree. C. to 200.degree. C. Samples were evaluated as "O" when
the coefficient of thermal expansion was 10 ppm/.degree. C. or
less, as ".DELTA." when the coefficient of thermal expansion was 10
to 20 ppm/.degree. C., and as "X" when the coefficient of thermal
expansion was 20 ppm/.degree. C. or more.
TABLE-US-00001 TABLE 1 Fiber length Average fiber Freeness Name of
fiber (mm) diameter (.mu.m) Refining (.degree.SR) Fiber A1
Polyketon fiber 3 10 No .ltoreq.10 Fiber A2 Polyketon fiber 1 10 No
.ltoreq.10 Fiber A3 Polyketon fiber 5 10 No .ltoreq.10 Fiber A4
Polyketon fiber 7 10 No .ltoreq.10 Fiber A5 Polyketon fiber 2 15 No
.ltoreq.10 Fiber A6 Polyketon fiber 2 6 Yes 26 Fiber A7 Polyketon
fiber 2 3 Yes 43 Fiber A8 Polyketon fiber 15 15 No .ltoreq.10 Fiber
A9 Polyketon fiber 5 25 No .ltoreq.10 Fiber B Glass fiber 3 12 No
.ltoreq.10 Fiber C Para-aramid fiber 3 12 No .ltoreq.10 Fiber D PBO
fiber 3 12 No .ltoreq.10 Fiber E Polyester fiber 3 8 No .ltoreq.10
Fiber F Solvent-spun cellulose fiber -- -- Yes 60
TABLE-US-00002 TABLE 2 Fiber paper and core material Heat-pressing
Heat-pressing Basis Mixture (% by mass) temperature linear load
weight Thickness Thickness Fiber 1 Fiber 2 Fiber 3 (.degree. C.)
(kN/m) (g/m.sup.2) (.mu.m) unevenness Example 1 A1 (100) 275 100 20
50 .largecircle. 2 A2 (100) 265 70 20 67 .largecircle. 3 A3 (100)
267 200 30 76 .largecircle. 4 A4 (100) 270 200 30 68 .largecircle.
5 A5 (100) 265 70 50 156 .largecircle. 6 A6 (100) 267 70 40 80
.largecircle. 7 A7 (100) 270 200 7 11 .largecircle. 8 A8 (100) 270
100 30 80 .DELTA. 9 A9 (100) 265 70 30 240 .DELTA. 10 A1 (100) 275
100 20 50 .largecircle. 11 A7 (100) 267 100 8 19 .largecircle. 12
A7 (100) 267 70 12 28 .largecircle. 13 A6 (100) 267 70 20 47
.largecircle. 14 A1 (100) 265 70 40 96 .largecircle. 15 A1 (100)
260 50 80 210 .DELTA. 16 A1 (70) C (30) 275 100 20 60 .largecircle.
17 A2 (80) C (20) 265 70 30 120 .largecircle. 18 A3 (20) D (80) 270
100 40 144 .largecircle. 19 A4 (50) D (50) 265 100 20 73
.largecircle. 20 A5 (80) E (20) 265 200 30 42 .largecircle. 21 A5
(70) E (30) 265 200 40 95 .largecircle. 22 A6 (80) F (20) 270 100 7
15 .largecircle. 23 A7 (60) F (40) 270 100 30 55 .largecircle. 24
A1 (40) C (40) E (20) 265 200 40 106 .largecircle. 25 A1 (50) A6
(30) F (20) 270 100 20 56 .largecircle. 26 A8 (70) D (30) 270 70 30
133 .DELTA. 27 A9 (80) E (20) 265 70 30 240 .DELTA. 28 A1 (70) C
(30) 275 100 20 60 .largecircle. Comparative 1 B (100) 350 200 60
-- -- Example 2 C (100) 350 200 30 -- -- 3 E (100) 235 50 30 80
.largecircle. 4 C (50) D (50) 350 200 20 -- -- 5 C (50) E (50) 235
50 20 65 .largecircle. 6 D (50) F (50) -- -- 20 55 .largecircle. 7
E (50) F (50) 235 100 20 50 .largecircle. Fiber paper and core
material Strength Void Tensile per unit Wiring board ratio strength
mass Thickness Heat Dielectric Dimensional (%) (kN/m) (MN/kg)
(.mu.m) Smoothness resistance constant stability Example 1 70 0.39
390 60 .largecircle. .largecircle. 3.7 .largecircle. 2 77 0.35 261
75 .largecircle. .largecircle. 3.7 .largecircle. 3 70 0.62 272 85
.largecircle. .largecircle. 3.7 .largecircle. 4 66 0.57 279 80
.largecircle. .largecircle. 3.6 .largecircle. 5 75 0.90 115 160
.largecircle. .largecircle. 3.7 .largecircle. 6 62 0.88 275 90
.largecircle. .largecircle. 3.6 .largecircle. 7 51 0.22 2857 15
.largecircle. .largecircle. 3.6 .largecircle. 8 71 0.59 246 90
.DELTA. .largecircle. 3.7 .largecircle. 9 92 0.10 14 250 .DELTA.
.largecircle. 3.9 .DELTA. 10 70 0.39 390 60 .largecircle.
.largecircle. 3.3 .largecircle. 11 68 0.24 1579 30 .largecircle.
.largecircle. 3.3 .largecircle. 12 67 0.34 1012 40 .largecircle.
.largecircle. 3.3 .largecircle. 13 67 0.52 553 60 .largecircle.
.largecircle. 3.3 .largecircle. 14 68 0.72 188 120 .largecircle.
.largecircle. 3.3 .largecircle. 15 71 1.18 70 230 .DELTA.
.largecircle. 3.3 .largecircle. 16 74 0.36 300 75 .largecircle.
.largecircle. 3.7 .largecircle. 17 81 0.60 167 140 .largecircle.
.largecircle. 3.7 .largecircle. 18 79 0.26 45 160 .largecircle.
.largecircle. 3.9 .largecircle. 19 79 0.29 199 90 .largecircle.
.largecircle. 3.8 .largecircle. 20 45 0.70 556 55 .largecircle.
.largecircle. 3.7 .largecircle. 21 68 0.75 197 110 .largecircle.
.largecircle. 3.7 .largecircle. 22 63 0.29 2762 25 .largecircle.
.largecircle. 3.7 .largecircle. 23 55 0.52 315 70 .largecircle.
.largecircle. 3.8 .largecircle. 24 71 0.44 104 130 .largecircle.
.largecircle. 3.8 .largecircle. 25 73 0.62 554 70 .largecircle.
.largecircle. 3.7 .largecircle. 26 83 0.10 25 150 .DELTA.
.largecircle. 3.7 .largecircle. 27 91 0.13 18 270 .DELTA.
.largecircle. 3.9 .DELTA. 28 74 0.36 300 75 .largecircle.
.largecircle. 3.4 .largecircle. Comparative 1 -- did not exhibit 80
.largecircle. .largecircle. 4.4 .DELTA. Example strength 2 -- did
not exhibit 90 .largecircle. X 4.1 .largecircle. strength 3 71 0.35
146 90 .largecircle. X 4.0 X 4 -- did not exhibit 90 X X 4.1
.largecircle. strength 5 76 0.16 123 80 .largecircle. X 4.1 X 6 68
0.18 164 70 .largecircle. X 4.5 .DELTA. 7 65 0.19 190 65
.largecircle. X 4.5 X
INDUSTRIAL APPLICABILITY
[0101] The polyketone fiber paper of the present invention can be
suitably used for applications such as a core material for a
printed wiring board; an electrode separator or a separator core
material for a condenser such as an aluminum electrolytic condenser
or an electrical double layer capacitor; an electrode separator or
a separator core material for a cell such as a fuel cell, a lithium
ion battery, or a nickel-hydrogen battery; and a core material for
an ion exchange membrane.
[0102] The polyketone fiber paper core material for a printed
wiring board and the printed wiring board using the core material
are particularly suitable for a printed wiring board for electrical
equipment, in particular, for use in a multilayer printed wiring
board and the like because of the thinness of the core material.
Moreover, the polyketone fiber paper core material for a printed
wiring board and the printed wiring board using the core material
can be suitably used for a printed wiring board for a high
frequency circuit and the like because of the low
dielectricity.
* * * * *