U.S. patent application number 11/302160 was filed with the patent office on 2008-05-01 for patterned substrate, electro-optical device, and method for manufacturing an electro-optical device.
This patent application is currently assigned to Seiko Epson Corporation. Invention is credited to Hirofumi Sakai.
Application Number | 20080100203 11/302160 |
Document ID | / |
Family ID | 36733119 |
Filed Date | 2008-05-01 |
United States Patent
Application |
20080100203 |
Kind Code |
A1 |
Sakai; Hirofumi |
May 1, 2008 |
PATTERNED SUBSTRATE, ELECTRO-OPTICAL DEVICE, AND METHOD FOR
MANUFACTURING AN ELECTRO-OPTICAL DEVICE
Abstract
A patterned substrate includes a base layer; a droplet holding
space surrounded by a barrier that is formed over the base layer;
and a pattern formed by discharging droplets containing a pattern
formation material into the droplet holding space surrounded by the
barrier. A recess that is lyophilic with respect to the droplets
and that expands outward in a planar direction of the base layer is
provided on a base layer side of the barrier.
Inventors: |
Sakai; Hirofumi; (Suwa-shi,
JP) |
Correspondence
Address: |
GLOBAL IP COUNSELORS, LLP
1233 20TH STREET, NW, SUITE 700
WASHINGTON
DC
20036-2680
US
|
Assignee: |
Seiko Epson Corporation
Shinjuku-ku
JP
|
Family ID: |
36733119 |
Appl. No.: |
11/302160 |
Filed: |
December 14, 2005 |
Current U.S.
Class: |
313/504 |
Current CPC
Class: |
H01L 27/3246 20130101;
H01L 51/0005 20130101 |
Class at
Publication: |
313/504 |
International
Class: |
H01L 51/00 20060101
H01L051/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 21, 2004 |
JP |
2004-368871 |
Claims
1. A patterned substrate, comprising: a base layer; a barrier
formed over the base layer having first and second wall surfaces
with the first wall surface being disposed between the base layer
and the second wall surface, and the second wall surface defining a
droplet holding space disposed on an inner side of the second wall
surface; and a pattern formed by discharging droplets containing a
pattern formation material into the droplet holding space
surrounded by the barrier, the first wall surface of the barrier
being lyophilic with respect to the droplets and at least part of
the first wall surface that contacts the droplets being disposed
outward on an outer side of the second wall surface in a planar
direction of the base layer to define a recess that expands outward
with respect to the second wall surface in the planar direction of
the base layer.
2. The patterned substrate according to claim 1, wherein the
barrier includes a first barrier having the first wall surface
formed over the base layer and a second barrier having the second
wall surface formed over the first barrier, the droplet holding
space is formed by the second barrier, and the recess is formed by
the first barrier, which is located farther outside in the planar
direction than the second barrier.
3. The patterned substrate according to claim 2, wherein the first
barrier is formed such that it gradually widens outward in the
planar direction from a position across from the droplet holding
space of the base layer toward the second barrier.
4. The patterned substrate according to claim 2, wherein the first
barrier is formed such that it gradually narrows in the planar
direction from a position across from the droplet holding space of
the base layer toward the second barrier.
5. The patterned substrate according to claim 2, wherein the first
barrier is lyophilic with respect to the droplets, and the second
barrier repels the droplets.
6. The patterned substrate according to claim 1, wherein the
pattern formation material is a light emitting element formation
material, and the pattern is a light emitting element.
7. The patterned substrate according to claim 1, wherein the
pattern formation material is a color filter formation material,
and the pattern is a color filter.
8. An electro-optical device comprising: a base layer; a barrier
formed over the base layer having first and second wall surfaces
with the first wall surface being disposed between the base layer
and the second wall surface, and the second wall surface defining a
droplet holding space disposed on an inner side of the second wall
surface; and a light emitting element formed by discharging
droplets containing a light emitting element formation material
into the droplet holding space surrounded by the barrier, the first
wall surface of the barrier being lyophilic with respect to the
droplets and at least part of the first wall surface that contacts
the droplets being disposed outward on an outer side of the second
wall surface in a planar direction of the base layer to define a
recess that expands outward with respect to the second wall surface
in the planar direction of the base layer.
9. The electro-optical device according to claim 8, wherein the
barrier includes a first barrier having the first wall surface
formed over the base layer and a second barrier having the second
wall surface formed over the first barrier, the droplet holding
space is formed by the second barrier, and the recess is formed by
the first barrier, which is located farther outside in the planar
direction than the second barrier.
10. The electro-optical device according to claim 9, wherein the
first barrier is formed such that it gradually widens outward in
the planar direction from a position across from the droplet
holding space of the base layer toward the second barrier.
11. The electro-optical device according to claim 10, wherein the
first barrier is lyophilic with respect to the droplets, and the
second barrier repels the droplets.
12. The electro-optical device according to claim 9, wherein the
light emitting element is an electroluminescence element equipped
with a light emitting layer between a transparent electrode and a
back electrode.
13. The electro-optical device according to claim 12, wherein the
light emitting element is an organic electroluminescence element
equipped with a light emitting layer composed of an organic
material.
14. The electro-optical device according to claim 12, wherein the
base layer is either the transparent electrode or the back
electrode.
15. A method for manufacturing an electro-optical device,
comprising: forming a barrier having first and second wall surfaces
on a base layer with the first wall surface being disposed between
the base layer and the second wall surface, and the second wall
surface defining a droplet holding space disposed on an inner side
of the second wall surface; and forming a light emitting element by
discharging droplets containing a light emitting element formation
material into the droplet holding space, the forming of the barrier
including forming the barrier with the first wall surface being
lyophilic with respect to the droplets and at least part of the
first wall surface that contacts the droplets being disposed
outward on an outer side of the second wall surface in a planar
direction of the base layer to define a recess that expands outward
with respect to the second wall surface in the planar direction of
the base layer.
16. The method for manufacturing an electro-optical device
according to claim 15, wherein the forming of the barrier includes
laminating a second barrier layer over a first barrier layer on the
base layer, patterning the second barrier layer to form a second
barrier having the second wall surface surrounding the droplet
holding space, and patterning the first barrier layer to form a
first barrier having the first wall surface positioned farther
outside in the planar direction than the second barrier.
17. The method for manufacturing an electro-optical device
according to claim 16, wherein the first barrier is formed by using
the second barrier as a mask and isotropically etching the first
barrier layer.
18. The method for manufacturing an electro-optical device
according to claim 15, wherein the base layer is either a
transparent electrode or a back electrode, and the light emitting
element is an electroluminescence element having a light emitting
layer between the transparent electrode and the back electrode.
19. The method for manufacturing an electro-optical device
according to claim 16, wherein the light emitting element is an
organic electroluminescence element equipped with a light emitting
layer composed of an organic material.
20. The method for manufacturing an electro-optical device
according to claim 15, wherein the droplets are discharged from a
droplet discharge apparatus.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present invention relates to a patterned substrate, an
electro-optical device, and a method for manufacturing an
electro-optical device. 2. Related Art
[0003] Known displays equipped with light emitting elements include
organic electroluminescence displays (organic EL displays) used as
an electro-optical device equipped with an organic
electroluminescence element (organic EL element).
[0004] Methods for manufacturing organic EL elements are generally
classified by the kind of material that makes up the organic EL
layer thereof. When the material that makes up the organic EL layer
is a low-molecular weight organic material, a vapor phase process
is utilized, in which the organic EL layer is formed by the vapor
deposition of this low-molecular weight organic material. On the
other hand, when the material that makes up the organic EL layer is
a high-molecular weight organic material, a liquid phase process is
utilized, in which the high-molecular weight organic material is
dissolved in an organic solvent or the like, and a coating of this
solution is applied and dried.
[0005] With an inkjet method, which is a type of liquid phase
process, tiny droplets (micro-droplets) of solution are discharged,
so the location where the organic EL layer is formed, the film
thickness, and the like can be controlled more precisely than with
other liquid phase processes (such as spin coating).
[0006] With an inkjet method, however, the shape of the pattern
after drying is affected by the shape of the micro-droplets that
land on the pattern formation surface. Consequently, if the
micro-droplets that land are not flat in shape (if they have a
convex hemispherical shape, for instance), this can lead to the
problem of non-uniform pattern shape.
[0007] In view of this, it has been proposed in the past that the
uniformity of this pattern shape be increased with an inkjet method
(see JP-A-2004-133031, for example). In Patent JP-A-2004-133031,
the pattern formation surface is bounded by a first film (first
barrier) that is lyophilic with respect to the droplets, and a
second barrier that repels the droplets is formed over this first
barrier. The second barrier forms a droplet holding space that
holds the droplets, and droplets that go through this droplet
holding space and land on the pattern formation surface wet and
spread out over the surface due to the surface tension of the first
barrier. This improves the uniformity of the shape of the pattern
formed on the pattern formation surface.
[0008] With JP-A-2004-133031, however, since the first barrier is
formed in the same size as the droplet holding space, the range
over which the surface tension of the first barrier works is
limited to the size of the inner periphery of the droplet holding
space (second barrier). Consequently, this can lead to a problem in
that the discharged droplets do not wet and spread out over the
outer periphery of the pattern formation surface.
[0009] Therefore, if the contact range of this first barrier with
respect to the droplets could be expanded, the droplets that landed
on the pattern formation surface would be better able to wet and
spread out over the surface, which in turn would improve the shape
uniformity of the pattern formed by the droplets.
SUMMARY
[0010] An advantage of the invention is to provide a patterned
substrate, an electro-optical device, and a method for
manufacturing an electro-optical device, with which the shape
uniformity of a pattern formed by droplets is increased.
[0011] The patterned substrate of an aspect of the invention is
furnished with a base layer; a droplet holding space surrounded by
a barrier that is formed over the base layer; and a pattern formed
by discharging droplets containing a pattern formation material
into the droplet holding space surrounded by the, wherein a recess
that expands outward in the planar direction of the base layer is
provided on the base layer side of the barrier.
[0012] With this patterned substrate, because a lyophilic recess is
formed, the area that is lyophilic to the droplets is
correspondingly larger, and because the droplets will be drawn into
this recess, there will be a corresponding improvement in how well
the droplets discharged into the droplet holding space wet and
spread out over the surface outward in the planar direction of the
base layer. Therefore, the pattern can be formed in a more uniform
shape, which in turn improves the productivity of the patterned
substrate.
[0013] In this patterned substrate, the barrier preferably includes
a first barrier formed over the base layer and a second barrier
formed over the first barrier, the droplet holding space is formed
by the second barrier, and the recess is formed by the first
barrier, which is located farther outside in the planar direction
than the second barrier.
[0014] With this patterned substrate, because the first barrier is
located farther outside in the planar direction of the base layer
than the second barrier, there is a corresponding improvement in
how well the droplets discharged into the droplet holding space wet
and spread out over the surface outward in the planar direction of
the base layer.
[0015] In this patterned substrate, the first barrier is preferably
formed such that it widens outward in the planar direction from a
position across from the droplet holding space of the base layer
toward the second barrier.
[0016] With this patterned substrate, because the first barrier is
formed so that it widens from a position across from the droplet
holding space toward the second barrier, the area that is lyophilic
to the droplets is correspondingly larger, and the droplets
discharged into the droplet holding space wet and spread out more
effectively.
[0017] In this patterned substrate, the first barrier is formed
such that it narrows outward in the planar direction from a
position across from the droplet holding space of the base layer
toward the second barrier.
[0018] With this patterned substrate, because the first barrier is
formed such that it narrows from a position across from the droplet
holding space of the base layer toward the second barrier, the area
that is lyophilic to the droplets is correspondingly larger, and
the droplets discharged into the droplet holding space wet and
spread out more effectively.
[0019] In this patterned substrate, the first barrier is lyophilic
with respect to the droplets, and the second barrier repels the
droplets.
[0020] With this patterned substrate, because the second barrier
repels the droplets, the droplets discharged into the droplet
holding space can be guided more effectively to the first barrier
side. Therefore, the uniformity of the pattern shape can be further
improved.
[0021] In this patterned substrate, the pattern formation material
is preferably a light emitting element formation material, and the
pattern is a light emitting element.
[0022] With this patterned substrate, a light emitting element can
be formed in a more uniform shape, and the productivity of a
patterned substrate equipped with this light emitting element can
be increased.
[0023] In this patterned substrate, the pattern formation material
is a color filter formation material, and the pattern is a color
filter.
[0024] With this patterned substrate, a color filter can be formed
in a more uniform shape, and the productivity of a patterned
substrate equipped with this color filter can be increased.
[0025] The electro-optical device of another aspect of the
invention is equipped with a light emitting element formed by
discharging droplets containing a light emitting element formation
material into a droplet holding space surrounded by a barrier
formed on a base layer, wherein a recess that is lyophilic with
respect to the droplets and expands outward in the planar direction
of the base layer is formed on the base layer side of the
barrier.
[0026] With the electro-optical device of this aspect of the
invention, because a lyophilic recess is formed, the area that is
lyophilic to the droplets is correspondingly larger, and because
the droplets will be drawn into this recess, there will be a
corresponding improvement in how well the droplets discharged into
the droplet holding space wet and spread out over the surface
outward in the planar direction of the base layer. Therefore, the
pattern can be formed in a more uniform shape, which in turn
improves the productivity of the electro-optical device.
[0027] In this electro-optical device, the barrier preferably
includes a first barrier formed over the base layer and a second
barrier formed over the first barrier, the droplet holding space is
formed by the second barrier, and the recess is formed by the first
barrier, which is located farther outside in the planar direction
than the second barrier.
[0028] With this electro-optical device, because the first barrier
is located farther outside in the planar direction of the base
layer than the second barrier, there is a corresponding improvement
in how well the droplets discharged into the droplet holding space
wet and spread out over the surface outward in the planar direction
of the base layer.
[0029] In this electro-optical device, the first barrier is formed
such that it widens outward in the planar direction from a position
across from the droplet holding space of the base layer toward the
second barrier.
[0030] With this electro-optical device, since the first barrier is
formed in a position across from the droplet holding space, the
droplets discharged into the droplet holding space can be guided
more effectively to the first barrier side. Therefore, the
uniformity of the pattern shape can be further improved.
[0031] In this electro-optical device, the first barrier is
preferably lyophilic with respect to the droplets, and the second
barrier repels the droplets.
[0032] With this electro-optical device, because the second barrier
repels the droplets, the droplets discharged into the droplet
holding space can be guided more effectively to the first barrier
side. Therefore, the uniformity of the pattern shape can be further
improved.
[0033] In this electro-optical device, the light emitting element
is preferably an electroluminescence element equipped with a light
emitting layer between a transparent electrode and a back
electrode.
[0034] With this electro-optical device, the uniformity of the
shape of an electroluminescence element can be improved, and the
productivity of an electro-optical device equipped with this
electroluminescence element can be increased.
[0035] In this electro-optical device, the light emitting element
is preferably an organic electroluminescence element equipped with
a light emitting layer composed of an organic material.
[0036] With this electro-optical device, the uniformity of the
shape of an organic electroluminescence element can be improved,
and the productivity of an electro-optical device equipped with
this organic electroluminescence element can be increased.
[0037] In this electro-optical device, the base layer is preferably
either the transparent electrode or the back electrode.
[0038] With this electro-optical device, there is better uniformity
in the light emitting layer formed over a transparent electrode or
a back electrode.
[0039] The method for manufacturing an electro-optical device of
still another aspect of the invention includes forming on a base
layer a droplet holding space surrounded by a barrier; and forming
a light emitting element by discharging droplets containing a light
emitting element formation material into the droplet holding space,
wherein a recess that is lyophilic with respect to the droplets and
expands outward in the planar direction of the base layer is formed
on the base layer side of the barrier prior to the discharge of the
droplets.
[0040] With the method of this aspect of the invention for
manufacturing an electro-optical device, because a lyophilic recess
is formed, the area that is lyophilic to the droplets is
correspondingly larger, and because the droplets will be drawn into
this recess, there will be a corresponding improvement in how well
the droplets discharged into the droplet holding space wet and
spread out over the surface outward in the planar direction of the
base layer. Therefore, a light emitting element can be formed in a
more uniform shape, which in turn improves the productivity of the
electro-optical device.
[0041] In the method for manufacturing an electro-optical device,
the barrier preferably includes a second barrier that forms the
droplet holding space, and a first barrier that is in between the
second barrier and the base layer and forms the recess, and a
second barrier layer laminated over a first barrier layer on the
base layer is patterned to form the second barrier surrounding the
droplet holding space, after which the first barrier layer is
patterned to form the first barrier positioned farther outside in
the planar direction than the second barrier.
[0042] With this method for manufacturing an electro-optical
device, the second barrier is formed and then the first barrier is
formed outward in the planar direction of this second barrier, so
the recess that is lyophilic to the droplets can be expanded more
effectively than the droplet holding space. Therefore, the droplets
discharged into the droplet holding space can more effectively wet
and spread out over the surface outward in the planar direction of
the base layer.
[0043] In this method for manufacturing an electro-optical device,
the first barrier is preferably formed by using the second barrier
as a mask and isotropically etching the first barrier layer.
[0044] With this method for manufacturing an electro-optical
device, since the first barrier layer is isotropically etched using
the second barrier as a mask, the first barrier can be formed so
that it widens outward in the planar direction from a position
across from the droplet holding space toward the second barrier.
Therefore, the droplets discharged into the droplet holding space
can wet and spread out more effectively. Furthermore, the formation
of a mask for forming the first barrier and other such steps can be
eliminated, and as a result the uniformity of the shape of a light
emitting element can be improved, and the productivity of the
electro-optical device can be increased.
[0045] In this method for manufacturing an electro-optical device,
the base layer is preferably either a transparent electrode or a
back electrode, and the light emitting element is an
electroluminescence element having a light emitting layer between
the transparent electrode and the back electrode.
[0046] With this method for manufacturing an electro-optical
device, the uniformity of the shape of an electroluminescence
element can be improved, and the productivity of an electro-optical
device equipped with this electroluminescence element can be
increased.
[0047] In this method for manufacturing an electro-optical device,
the light emitting element is preferably an organic
electroluminescence element equipped with a light emitting layer
composed of an organic material.
[0048] With this method for manufacturing an electro-optical
device, the uniformity of the shape of an organic
electroluminescence element can be improved, and the productivity
of an electro-optical device equipped with this organic
electroluminescence element can be increased.
[0049] In this method for manufacturing an electro-optical device,
the droplets are preferably discharged from a droplet discharge
apparatus.
[0050] With this method for manufacturing an electro-optical
device, because fine droplets are formed by a droplet discharge
apparatus, there will be a corresponding increase in the uniformity
of shape in which a light emitting element is formed, and the
productivity of the electro-optical device can be increased.
BRIEF DESCRIPTION OF THE DRAWINGS
[0051] FIG. 1 is a simplified plan view of an organic EL display
that is an embodiment of the present invention;
[0052] FIG. 2 is a simplified plan view of pixels in the same;
[0053] FIG. 3 is a simplified cross section of the control element
formation region in the same;
[0054] FIG. 4 is a simplified cross section of the control element
formation region in the same;
[0055] FIG. 5 is a simplified cross section of the light emitting
element formation region in the same;
[0056] FIG. 6 is a flowchart of the steps of manufacturing an
electro-optical device in the same;
[0057] FIG. 7 is a diagram illustrating the steps of manufacturing
an electro-optical device in the same;
[0058] FIG. 8 is a diagram illustrating the steps of manufacturing
an electro-optical device in the same;
[0059] FIG. 9 is a diagram illustrating the steps of manufacturing
an electro-optical device in the same; and
[0060] FIG. 10 is a diagram illustrating the steps of manufacturing
an electro-optical device in the same.
DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0061] Specific embodiments of the invention will now be described
through reference to FIGS. 1 to 10. FIG. 1 is a simplified plan
view of an organic electroluminescence display (organic EL display)
that serves as an electro-optical device.
[0062] As shown in FIG. 1, an organic EL display 10 is equipped
with a transparent substrate 11 as a patterned substrate. The
transparent substrate 11 is a non-alkaline glass substrate formed
in the shape of a square, and a square element formation region 12
is formed on the surface thereof (element formation side 11a). In
this element formation region 12, a plurality of data lines Ly are
formed at a specific spacing and extending in the vertical
direction (column direction). The data lines Ly are electrically
connected to a data line drive circuit Dr1 disposed on the lower
side of the transparent substrate 11. The data line drive circuit
Dr1 produces a data signal on the basis of display data supplied
from an external apparatus (not shown), and outputs this data
signal at a specific timing to the data lines Ly corresponding to
the data signal.
[0063] In the element formation region 12, a plurality of power
lines Lv extending in the column direction are provided to the data
lines Ly at a specific spacing. The power lines Lv are electrically
connected to a common power line Lvc formed on the lower side of
the element formation region 12, and drive power produced by a
power supply voltage production circuit (not shown) is supplied to
the power lines Lv.
[0064] A plurality of scanning lines Lx extending in the direction
perpendicular to the data lines Ly and the power lines Lv (the row
direction) are formed at a specific spacing in the element
formation region 12. The scanning lines Lx are electrically
connected to a scanning line drive circuit Dr2 formed on the left
side of the transparent substrate 11. The scanning line drive
circuit Dr2 selectively drives specific scanning lines Lx from
among the plurality of scanning lines Lx at a specific timing on
the basis of a scanning control signal supplied from a control
circuit (not shown), and a scanning signal is outputted to the
scanning lines Lx.
[0065] A plurality of pixels 13 arranged in a matrix are formed by
connecting to the corresponding data lines Ly, power lines Lv, and
scanning lines Lx where the data lines Ly and the scanning lines Lx
intersect. A control element formation region 14 and a light
emitting element formation region 15 are delineated within each of
the pixels 13. The pixels 13 are protected by covering the top side
of the element formation region 12 with a square sealing substrate
16 (the two-dot chain line in FIG. 1).
[0066] The pixels 13 in this embodiment are pixels that emit light
of corresponding colors, and are either red pixels that emit red
light, or green pixels that emit green light, or blue pixels that
emit blue light. These pixels 13 are used to display a full-color
image on the back side (display side 11b) of the transparent
substrate 11.
[0067] The pixels 13 will now be described. FIG. 2 is a simplified
plan view of the layout of the control element formation region 14
and the light emitting element formation region 15. FIGS. 3 and 4
are simplified cross sections of the control element formation
region 14 along the one-dot chain lines A-A and B-B, respectively,
in FIG. 2. FIG. 5 is a simplified cross section of the light
emitting element formation region 15 along the one-dot chain line
C-C in FIG. 2.
[0068] First the structure of the control element formation regions
14 will be described. As shown in FIG. 2, a control element
formation region 14 is formed on the lower side of each of the
pixels 13, and a first transistor (switching transistor) T1, a
second transistor (drive transistor) T2, and a holding capacitor Cs
are formed in each control element formation region 14.
[0069] As shown in FIG. 3, the switching transistor T1 is equipped
with a first channel film B1 at its lowermost layer. The first
channel film B1 is a p-type polysilicon film formed in the shape of
an island on the element formation side 11a, in the middle of which
is formed a first channel region C1. Activated n-type regions (a
first source region S1 and a first drain region D1) are formed
flanking the first channel region C1 on the left and right sides.
In other words, the switching transistor T1 is what is known as a
polysilicon TFT.
[0070] A gate insulation film Gox and a first gate electrode G1 are
formed on the upper side of the first channel region C1, in that
order from the element formation side 11a. The gate insulation film
Gox is a silicon oxide film or other such insulating film having
optical transmissivity, and is deposited over substantially the
entire surface of the element formation side 11a and the upper side
of the first channel region C1. The first gate electrode G1 is a
tantalum, aluminum, or other such low-resistance metal film, formed
across from the first channel region C1, and is electrically
connected to a scanning line Lx as shown in FIG. 2. As shown in
FIG. 3, the first gate electrode G1 is electrically insulated by a
first interlayer insulation film IL1 deposited on the upper side of
the gate insulation film Gox.
[0071] When the scanning line drive circuit Dr2 inputs a scanning
signal through the scanning line Lx to the first gate electrode G1,
the switching transistor T1 is switched on by this scanning
signal.
[0072] A data line Ly that goes through the first interlayer
insulation film IL1 and the gate insulation film Gox is
electrically connected to the first source region S1. A first drain
electrode Dp1 that goes through the first interlayer insulation
film IL1 and the gate insulation film Gox is electrically connected
to the first drain region D1. As shown in FIG. 3, this data line Ly
and first drain electrode Dp1 are electrically connected by a
second interlayer insulation film IL2 deposited on the upper side
of the first interlayer insulation film IL1.
[0073] The scanning line drive circuit Dr2 then successively
selects the scanning lines Lx one at a time on the basis of
line-order scanning, whereupon the switching transistor T1 of the
pixel 13 is switched on in its turn and while selected. When the
switching transistor T1 is switched on, the data signal outputted
from the data line drive circuit Dr1 is outputted through the data
line Ly and the switching transistor T1 (channel film B1) to the
first drain electrode Dp1.
[0074] As shown in FIG. 4, the drive transistor T2 is a polysilicon
TFT equipped with a second channel region C2, a second source
region S2, and a second drain region D2. A second gate electrode G2
is formed via the gate insulation film Gox on the upper side of a
second channel film B2 thereof. The second gate electrode G2 is a
tantalum, aluminum, or other such low-resistance metal film, and as
shown in FIG. 2, is electrically connected to a lower electrode Cp1
of the holding capacitor Cs and the first drain electrode Dp1 of
the switching transistor T1. As shown in FIG. 4, the second gate
electrode G2 and the lower electrode Cp1 are electrically connected
by the first interlayer insulation film IL1 deposited on the upper
side of the gate insulation film Gox.
[0075] The second source region S2 is electrically connected to an
upper electrode Cp2 of the holding capacitor Cs that goes through
the first interlayer insulation film IL1. As shown in FIG. 2, this
upper electrode Cp2 is electrically connected to the corresponding
power line Lv. In other words, as shown in FIGS. 2 and 4, the
holding capacitor Cs, in which the first interlayer insulation film
IL1 serves as a capacitance film, is connected between the second
source region S2 and the second gate electrode G2 of the drive
transistor T2. The second drain region D2 is electrically connected
to a second drain electrode Dp2 that goes through the first
interlayer insulation film IL1. The second drain electrode Dp2 and
the upper electrode Cp2 are electrically connected by the second
interlayer insulation film IL2 deposited on the upper side of the
first interlayer insulation film IL1.
[0076] When the data signal outputted from the data line drive
circuit Dr1 is outputted through the switching transistor T1 to the
first drain region D1, the holding capacitor Cs stores a charge
relative to the outputted data signal. Then, when the switching
transistor T1 is switched off, a drive current relative to the
charge stored in the holding capacitor Cs is outputted through the
drive transistor T2 (channel film B2) to the second drain region
D2.
[0077] Next, the structure of the light emitting element formation
regions 15 will be described.
[0078] As shown in FIG. 2, a square light emitting element
formation region 15 is formed on the upper side of each of the
pixels 13. As shown in FIG. 5, a transparent electrode (anode) 20
is formed as a base layer on the upper side of the second
interlayer insulation film IL2 in the light emitting element
formation region 15.
[0079] The anode 20 is a transparent conductive film having optical
transmissivity, such as an ITO film, one end of which goes through
the second interlayer insulation film IL2 and is electrically
connected to the second drain region D2, as shown in FIG. 4.
[0080] A third interlayer insulation film 21 is deposited (as a
first barrier layer) on the upper side of the anode 20. This third
interlayer insulation film 21 is formed from a material (such as a
silicon oxide film) that is lyophilic to a hole layer droplet 25D
(discussed below), and insulates the anodes 20 from each other. A
square through-hole 21h that flares out upward is made in the
approximate middle of the anode 20 in this third interlayer
insulation film 21. The through-hole 21h is formed such that it
widens outward in the planar direction of the anode 20 from the top
side of the anode 20 upward.
[0081] A first barrier W1 (see FIG. 8) that is lyophilic with
respect to the hole layer droplet 25D and widens outward in the
planar direction of the anode 20 from the top side of the anode 20
is formed by the inner peripheral surface of the through-hole 21h.
This first barrier W1 surrounds the top side of the anode 20,
thereby forming a landing surface 20a delineated by the bottom W1a
of the first barrier W1 on the top side of the anode 20.
[0082] A liquid-repellent film 22 is formed (as a second barrier
layer) on the upper side of the third interlayer insulation film
21. The liquid-repellent film 22 is formed from what is called a
positive photosensitive material, which when exposed to exposure
light Lpr (see FIG. 7) of a specific wavelength, only the exposed
portion becomes soluble in a developing solution such as an
alkaline solution, and more specifically is formed from a
fluororesin or the like that repels the hole layer droplet 25D and
a light emitting layer droplet 27D (discussed above).
[0083] A receptacle hole 22h that flares out upward from a position
across from the bottom W1a of the first barrier W1 is formed in the
liquid-repellent film 22. In other words, the above-mentioned
through-hole 21h is formed downward (toward the landing surface
20a) from this receptacle hole 22h. The receptacle hole 22h is
formed in a size that allows a microscopic hole layer droplet 25b
and a microscopic light emitting layer droplet 27b (discussed
below; see FIGS. 9 and 10) to be accommodated in the corresponding
light emitting element formation region 15.
[0084] A second barrier W2 that repels the hole layer droplet 25D
(see FIG. 9) and the light emitting layer droplet 27D (see FIG.
10), which are discussed below, and that holds the hole layer
droplet 25D and the light emitting layer droplet 27D is formed by
the inner peripheral surface of the receptacle hole 22h. This
second barrier W2 surrounds the space over the landing surface 20a,
thereby forming a droplet holding space S that permits the landing
of the microscopic hole layer droplet 25b and the microscopic light
emitting layer droplet 27b on the landing surface 20a.
[0085] The upper side of the through-hole 21h (first barrier W1) is
covered by the liquid-repellent film 22 equipped with the
receptacle hole 22h, and the through-hole 21h contracts downward
from the receptacle hole 22h, so that a recessed groove 23 (serves
as a recess) that extends outward in the planar direction of the
landing surface 20a is formed by the outer periphery of the landing
surface 20a.
[0086] A hole transport layer 25 (hereinafter referred to simply as
the hole layer 25) is formed as a pattern, whose outer edge is the
recessed groove 23 (first barrier W1), in the through-hole 21h and
over the landing surface 20a. This hole layer 25 is a pattern
composed of a hole layer formation material 25s (as a pattern
formation material and a light emitting element formation material)
(see FIG. 9).
[0087] The hole layer formation material 25s in this embodiment is,
for example, a benzidine derivative, styrylamine derivative,
triphenylmethane derivative, triphenylamine derivative, hydrazone
derivative, or other such low-molecular weight compound, or a
high-molecular weight compound whose structure partly includes one
of these, or polyaniline, polythiophene, polyvinylcarbazole,
.alpha.-naphthylphenyldiamine, a mixture of
poly(3,4-ethylenedioxythiophene) and polystyrenesulfonic acid
(PEDOT/PSS) (Baytron P, trademark of Bayer), or another such
high-molecular weight compound.
[0088] A light emitting layer 27 is laminated in the receptacle
hole 22h over the hole layer 25. The light emitting layer 27 in
this embodiment is formed from a light emitting layer formation
material of the corresponding color (a red light emitting layer
formation material that emits red light, a green light emitting
layer formation material that emits green light, or a blue light
emitting layer formation material that emits blue light). Examples
of the red light emitting layer formation material include a
high-molecular weight compound having an alkyl or alkoxy
substituent on the benzene ring of a polyvinylenestyrene
derivative, or a high-molecular weight compound having a cyano
group on the vinylene group of a polyvinylenestyrene derivative.
Examples of the green light emitting layer formation material
include a polyvinylenestyrene derivative in which an alkyl, alkoxy,
or allyl derivative substituent has been introduced into a benzene
ring. Examples of the blue light emitting layer formation material
include a polyfluorene derivative (such as a copolymer of
dialkylfluorene and anthracene, or a copolymer of dialkylfluorene
and thiophene).
[0089] An organic electroluminescence layer (organic EL layer) 30
is formed by the hole layer 25 and the light emitting layer 27.
[0090] A cathode 31 is formed as a back electrode composed of an
optically reflective metal film, such as aluminum, on the upper
side of the liquid-repellent film 22 (second barrier W2) and the
upper side of the organic EL layer 30. The cathode 31 is formed so
as to cover the entire surface of the element formation side 11a,
and supplies potential for all of the light emitting element
formation regions 15 shared by the pixels 13.
[0091] Specifically, an organic electroluminescence element
(organic EL element) is constituted as a light emitting element by
the anode 20, the organic EL layer 30, and the cathode 31.
[0092] When drive current corresponding to the data signal is
supplied through the second drain region D2 to the anode 20, the
organic EL layer 30 emits light at a brightness corresponding to
this drive current. Here, the light emitted from the organic EL
layer 30 toward the cathode 31 side (the upper side in FIG. 4) is
reflected by the cathode 31. Accordingly, almost all of the light
emitted from the organic EL layer 30 is transmitted through the
anode 20, the second interlayer insulation film IL2, the first
interlayer insulation film IL1, the gate insulation film Gox, the
element formation side 11a, and the transparent substrate 11, and
is emitted outward from the back (the display side 11b) of the
transparent substrate 11. Specifically, an image based on the data
signal is displayed on the display side 11b of the organic EL
display 10.
[0093] An adhesive layer 32 composed of an epoxy resin or the like
is formed on the upper side of the cathode 31, and a sealing
substrate 16 that covers the element formation region 12 is applied
via this adhesive layer 32. The sealing substrate 16 is a
non-alkaline glass substrate, and serves to prevent the oxidation
and so forth of the pixels 13 and the wiring lines Lx, Ly, and
Lv.
[0094] Method for Manufacturing Organic EL Display 10
[0095] Next, the method for manufacturing the organic EL display 10
will be described. FIG. 6 is a flowchart illustrating the method
for manufacturing the organic EL display 10, and FIGS. 7 to 10 are
diagrams illustrating this method for manufacturing the organic EL
display 10.
[0096] As shown in FIG. 6, first a holding space formation step
(step S11) is performed, in which the wiring lines Lx, Ly, Lv, and
Lvc and the transistors T1 and T1 are formed on the element
formation side 11a of the transparent substrate 11, and the
liquid-repellent film 22 is patterned to form the droplet holding
space S. FIG. 7 is a diagram illustrating the organic EL layer
preliminary step.
[0097] Specifically, in the organic EL layer preliminary step,
first a crystallized polysilicon film is formed by excimer laser or
the like over the entire element formation side 11a, and this
polysilicon film is patterned to form the channel films B1 and B2.
Next, the gate insulation film Gox composed of a silicon oxide film
or the like is formed over the entire upper surface of the element
formation side 11a and the channel films B1 and B2, and a
low-resistance metal film of tantalum or the like is deposited over
the entire upper surface of the gate insulation film Gox. This
low-resistance metal film is patterned to form the gate electrodes
G1 and G2, the lower electrode Cp1 of the holding capacitor Cs, and
the scanning line Lx.
[0098] When the gate electrodes G1 and G2 have been formed, an
n-type impurity region is formed in each of the channel films B1
and B2 by ion doping, using the gate electrodes G1 and G2 as masks.
This forms the channel regions C1 and C2, the source regions S1 and
S2, and the drain regions D1 and D2. When the source regions S1 and
S2 and the drain regions D1 and D2 have been formed in the channel
films B1 and B2, respectively, the first interlayer insulation film
IL1 composed of a silicon oxide film or the like is deposited over
the entire upper surface of the gate electrodes G1 and G2, the
scanning line Lx, and the gate insulation film Gox.
[0099] When the first interlayer insulation film IL1 has been
deposited, a pair of contact holes is patterned at positions
relative to the source regions S1 and S2 and the drain regions D1
and D2 in the first interlayer insulation film IL1. Next, a metal
film of aluminum or the like is deposited over the entire upper
surface of the first interlayer insulation film IL1 and in these
contact holes, and this metal film is patterned to form the data
line Ly and the upper electrode Cp2 of the holding capacitor Cs
corresponding to each of the source regions S1 and S2. At the same
time, the drain electrodes Dp1 and Dp2 corresponding to the drain
regions D1 and D2 are formed. The second interlayer insulation film
IL2 composed of a silicon oxide film or the like is deposited over
the entire upper surface of the data line Ly, the upper electrode
Cp2, the drain regions D1 and D2, and the first interlayer
insulation film IL1. This forms the switching transistor T1 and the
drive transistor T2.
[0100] When the second interlayer insulation film IL2 has been
deposited, a via hole is formed at a position across from the
second drain region D2 in this second interlayer insulation film
IL2. Then, a transparent conductive film having optical
transmissivity, such as an ITO film, is deposited over the entire
upper surface of the second interlayer insulation film IL2 and in
this via hole, and this transparent conductive film is patterned to
form the anode 20 that connects to the second drain region D2. When
the anode 20 has been formed, the third interlayer insulation film
21 composed of a silicon oxide film or the like is formed over the
entire upper surface of the second interlayer insulation film IL2
and this anode 20.
[0101] When the third interlayer insulation film 21 has been
deposited, as shown in FIG. 7, the entire upper surface of the
third interlayer insulation film 21 is coated with a photosensitive
polyimide resin or the like to form the liquid-repellent film 22.
Developing is then performed by exposing the liquid-repellent film
22 at a position across from the anode 20 to exposure light Lpr of
a specific wavelength through a mask Mk, which results in the
patterning of the receptacle hole 22h, whose inner peripheral
surface is the second barrier W2, in this liquid-repellent film
22.
[0102] As shown in FIG. 6, when the holding space formation step is
complete (step S11), a recessed groove formation step (step S12) is
performed, in which the third interlayer insulation film 21 is
patterned to form the recessed groove 23. FIG. 8 is a diagram
illustrating this recessed groove formation step.
[0103] Specifically, in the recessed groove formation step, the
third interlayer insulation film 21 is isotropically etched using
the liquid-repellent film 22 as a mask. As a result, as shown in
FIG. 8, an etching surface Es is formed in an approximate arc shape
in the third interlayer insulation film 21 from the
liquid-repellent film 22 side, and eventually this forms the first
barrier W1 that flares out from the anode 20 side. When etching is
concluded once the size of the bottom W1a is substantially the same
as the size of the droplet holding space S (receptacle hole 22h) on
the anode 20 side, the through-hole 21h equipped with the first
barrier W1 is formed on the top side of the anode 20, and the
landing surface 20a surrounded by the bottom W1a is formed. The
recessed groove 23 extending outward in the planar direction of the
landing surface 20a is formed in the outer periphery of this
landing surface 20a. This allows the position of the first barrier
W1 to be adjusted with respect to the second barrier W2 (droplet
holding space S).
[0104] As shown in FIG. 6, when the recessed groove 23 has been
formed (step S12), a hole layer formation step (step S13) is
performed, in which the hole layer droplet 25D containing the hole
layer formation material 25s is formed in the receptacle hole 22h,
and the hole layer 25 is formed. FIG. 9 is a diagram illustrating
this hole layer formation step.
[0105] First, the structure of the droplet discharge apparatus used
to form the hole layer droplet 25D will be described.
[0106] As shown in FIG. 9, a liquid discharge head 35 that
constitutes the droplet discharge apparatus in this embodiment is
equipped with a nozzle plate 36. Numerous nozzles 36n for
discharging a liquid are formed facing upward on the bottom side
(the nozzle formation side 36a) of this nozzle plate 36. A liquid
supply chamber 37 that communicates with a liquid reservoir (not
shown) and allows a liquid to be supplied to the nozzles 36n is
formed on the upper side of the nozzles 36n. A diaphragm 38 that
vibrates reciprocally up and down and expands and contracts the
volume inside the liquid supply chamber 37 is provided on the upper
side of the liquid supply chamber 37. A piezoelectric element 39
that vibrates the diaphragm 38 by expanding and contracting
vertically is provided on the upper side of each diaphragm 38 at a
position across from the liquid supply chamber 37.
[0107] As shown in FIG. 9, a transparent substrate 11 conveyed to
the droplet discharge apparatus is positioned with its element
formation side 11a parallel to the nozzle formation side 36a and
with the center of the receptacle holes 22h disposed directly under
each of the nozzles 36n.
[0108] Here, a hole layer formation solution 25L produced by
dissolving the hole layer formation material 25s is supplied into
the liquid supply chamber 37.
[0109] When a drive signal for forming the hole layer droplet 25D
is inputted to the liquid discharge head 35, the piezoelectric
element 39 expands or contracts according to this drive signal,
thereby increasing or decreasing the volume of the liquid supply
chamber 37. If the volume of the liquid supply unit 37 decreases
here, the hole layer formation solution 25L is discharged as a
microscopic hole layer droplet 25b from the nozzle 36n in an amount
corresponding to the reduction in volume. The discharged
microscopic hole layer droplet 25b goes through the droplet holding
space S and lands on the landing surface 20a in the through-hole
21h. When the volume of the liquid supply chamber 37 then
increases, the hole layer formation solution 25L is supplied from a
liquid reservoir (not shown) into the liquid supply chamber 37 in
an amount equal to the increase in volume. In other words, the
liquid discharge head 35 discharges the required volume of hole
layer formation solution 25L toward the receptacle hole 22h by
means of the expansion and contraction of the liquid supply chamber
37. Here, the liquid discharge head 35 discharges the microscopic
lower layer droplet 25b in an amount such that the hole layer
formation material 25s contained in the hole layer droplet 25D will
form a film of the desired thickness.
[0110] The microscopic hole layer droplet 25b that lands on the
landing surface 20a comes into contact with the first barrier W1,
and wets and spreads out along the recessed groove 23 due to the
surface tension (capillary force) of the first barrier W1 on the
microscopic hole layer droplet 25b. Specifically, because the
recessed groove 23 is formed so that it widens outward in the
planar direction of the landing surface 20a, there is a
corresponding increase in the range over which the surface tension
acts on the microscopic hole layer droplet 25b, and the microscopic
hole layer droplet 25b uniformly wets and spreads out over the
entire landing surface 20a.
[0111] The microscopic hole layer droplet 25b that uniformly wets
and spreads out over the landing surface 20a eventually forms the
hole layer droplet 25D, which has a hemispherical surface, because
of the surface tension and the liquid repellency of the second
barrier W2, as shown by the two-dot chain line in FIG. 9.
[0112] When the hole layer droplet 25D has been formed, the
transparent substrate 11 (the hole layer droplet 25D) is placed
under a specific reduced pressure to dry the hole layer droplet 25D
and solidify the hole layer formation material 25s. The solidified
hole layer formation material 25s forms the hole layer 25 in a
uniform shape, according to the amount of uniform wetting and
spreading over the entire top side of the anode 20. As a result,
the hole layer 25 is formed in a uniform shape over the entire
landing surface 20a within the through-hole 21h.
[0113] As shown in FIG. 6, when the hole layer 25 has been formed
(step S13), a light emitting layer formation step (step S14) is
performed in which the light emitting layer 27 is formed in the
receptacle hole 22h. FIG. 10 is a diagram illustrating the light
emitting layer formation step.
[0114] In this light emitting layer formation step, as shown in
FIG. 10, just as in the hole layer formation step, a microscopic
light emitting layer droplet 27b of the light emitting layer
formation solution 27L containing a light emitting layer formation
material 27s of the corresponding color is discharged from each
nozzle 36n onto the corresponding hole layer 25, and the light
emitting layer droplet 27D formed by the discharged microscopic
light emitting layer droplet 27b is dried to form the light
emitting layer 27.
[0115] Here, the microscopic light emitting layer droplet 27b
discharged on the hole layer 25 uniformly wets and spreads out over
the surface and makes the shape of the light emitting layer 27
uniform, that is, makes the shape of the organic EL layer 30
uniform, according to how uniformly the shape of the hole layer 25
is formed by the recessed groove 23.
[0116] As shown in FIG. 6, when the hole layer 25 (organic EL layer
30) has been formed (step S14), an organic EL layer post-step (step
S15) is performed, in which the cathode 31 is formed over the light
emitting layer 27 (organic EL layer 30) and the liquid-repellent
film 22, and the pixel 13 is sealed. Specifically, the cathode 31
composed of a metal film such as aluminum is deposited over the
entire top side of the organic EL layer 30 and the liquid-repellent
film 22, forming an organic EL element composed of the anode 20,
the organic EL layer 30, and the cathode 31. When the organic EL
element has been formed, an adhesive layer 32 is formed by coating
the entire top side of the cathode 31 (pixel 13) with an epoxy
resin or the like, and the sealing substrate 16 is applied to the
transparent substrate 11 via this adhesive layer 32.
[0117] The result of the above is that an organic EL display 10 in
which the organic EL layer 30 has a uniform shape can be
manufactured.
[0118] Next, the effects of this embodiment, constituted as above,
will be described.
[0119] With the above embodiment, the third interlayer insulation
film 21 composed of a lyophilic material was formed on the landing
surface 20a side of the second barrier W2 forming the droplet
holding space S, and the through-hole 21h was formed in this third
interlayer insulation film 21. The inner peripheral surface (first
barrier W1) of the through-hole 21 h was formed so that it widened
outward in the planar direction of the landing surface 20a from the
landing surface 20a side, and the recessed groove 23 consisting of
the first barrier W1 was formed on the outer periphery of the
landing surface 20a.
[0120] Therefore, the surface tension (capillary force) of the
recessed groove 23 (first barrier W1) causes the microscopic hole
layer droplet 25b that goes through the droplet holding space S and
lands on the landing surface 20a to wet and spread out over the
landing surface 20a.
[0121] Furthermore, because the first barrier W1 is formed so that
widens outward in the planar direction, the contact area between
the microscopic hole layer droplet 25b and the first barrier W1 is
correspondingly larger, and the range over which the surface
tension can act on the microscopic hole layer droplet 25b is
expanded.
[0122] As a result, the shape of the hole layer 25 can be made more
uniform, and the shape of the organic EL layer 30 can be made more
uniform. This in turn increases the productivity of the organic EL
display 10.
[0123] In this embodiment, the liquid-repellent film 22 was
laminated over the third insulation film 21 to form the second
barrier W2. Therefore, the hole layer droplet 25D and the light
emitting layer droplet 27D can be effectively held in the droplet
holding space S, without any leakage. Furthermore, since the second
barrier W2 and the first barrier W1 constitute different members,
there is greater latitude in choosing the material for wetting with
the microscopic hole layer droplet 25b and the material for holding
the hole layer droplet 25D. Accordingly, the shape of the organic
EL layer 30 can be made more uniform, and the productivity of the
organic EL display 10 can be increased.
[0124] With this embodiment, the through-hole 21h (first barrier
W1) was formed by isotropically etching the third interlayer
insulation film 21 using as a mask the liquid-repellent film 22
having the receptacle hole 22h (second barrier W2). Therefore, the
position of the first barrier W1 can be adjusted with respect to
the second barrier W2 (droplet holding space S), and the recessed
groove 23 can be reliably formed around the entire outer periphery
of the landing surface 20a. Accordingly, the shape of the organic
EL layer 30 can be made more uniform.
[0125] Furthermore, since the third interlayer insulation film 21
can be etched without separately forming a mask for forming the
first barrier W1, the step of forming the first barrier W1 can be
eliminated. This in turn increases the productivity of the organic
EL display 10.
[0126] With this embodiment, the hole layer droplet 25D was formed
by the microscopic hole layer droplet 25b discharged from a droplet
discharge apparatus. Therefore, the desired amount of microscopic
light emitting layer droplet 27b can be reliably discharged into
the droplet holding space S, so the organic EL layer 30 can be
formed in a more uniform shape than with other liquid phase
processes (such as spin coating).
[0127] The above embodiment may be modified as follows.
[0128] In the above embodiment, the position of the bottom W1a of
the first barrier W1 was across from the landing surface 20a side
of the receptacle hole 22h, but is not limited to this, and the
position of the bottom W1 a may instead be disposed more toward the
center of the landing surface 20a than that shown in FIG. 5, so
that the bottom W1a is formed at a position across from the
receptacle hole 22h. This further increases the contact area
between the first barrier W1 and the microscopic hole layer droplet
25b that goes through the receptacle hole 22h (droplet holding
space S) and lands on the landing surface 20a, and allows the
microscopic hole layer droplet 25b to wet and spread out more
effectively.
[0129] In the above embodiment, the first barrier W1 was formed so
that it widen outward in the planar direction of the landing
surface 20a from its bottom W1a, but is not limited to this, and
may instead have a shape in which the recessed groove 23 is formed
by covering the liquid-repellent film 22 having the receptacle hole
22h. Alternatively, it may be formed so that it narrows outward in
the planar direction of the landing surface 20a from its bottom
W1a, that is, so that it protrudes to the inside of the landing
surface 20a.
[0130] With this patterned substrate, because the first barrier is
formed so that it narrows from a position across from the droplet
holding space toward the second barrier, the area that is lyophilic
to the droplets is corresponding larger, and the droplets
discharged from the droplet holding space can wet and spread out
more effectively.
[0131] In the above embodiment, the through-hole 21h (first barrier
W1) was formed using as a mask the liquid-repellent film 22 having
the receptacle hole 22h, but is not limited tot his, and the
receptacle hole 22h may instead be formed after the first barrier
W1 has been formed.
[0132] In the above embodiment, the first barrier W1 and the second
barrier W2 were formed from different members (the third interlayer
insulation film 21 and the liquid-repellent film 22), but the
invention is not limited to this, and the first barrier W1 and the
second barrier W2 may instead constitute the same member.
[0133] In the above embodiment, the pattern was embodied as the
hole layer 25, but its not limited to this, and may instead be the
light emitting layer 27, for example, or may be a color filter of
various colors formed by droplets.
[0134] In the above embodiment, the organic EL display 10 was
embodied as a bottom emission type, but is not limited to this, and
may involve a top emission type instead. Specifically, the recessed
groove 23 may be formed on a back electrode.
[0135] In the above embodiment, the organic EL layer 30 was formed
by an inkjet method, but the invention is not limited to this, and
the method for forming the organic EL layer 30 may instead be such
that, for example, the hole layer droplet 25D or the light emitting
layer droplets 27D are formed by a liquid applied by spin coating
or another such method, and the organic EL layer 30 is formed by
drying and solidifying this liquid.
[0136] In the above embodiment, the control element formation
region 14 was equipped with the switching transistor T1 and the
drive transistor T2, but is not limited to this, and the
constitution may instead be such that a single transistor, or
numerous transistors, or numerous capacitors are used, according to
the desired element design.
[0137] In the above embodiment, the organic EL layer 30 was formed
by an inkjet method, but the invention is not limited to this, and
the method for forming the organic EL layer 30 may instead be spin
coating or another such method, and the organic EL layer 30 may be
formed by drying and solidifying a liquid.
[0138] In the above embodiment, the microscopic hole layer droplets
25b were discharged by the piezoelectric elements 39, but the
invention is not limited to this, and a resistance heating element
may be provided to the liquid supply chamber 37, for example, and
the microscopic hole layer droplets 25b may be discharged by
bursting the bubbles formed by the heating of this resistance
heating element.
[0139] In the above embodiment, the electro-optical device was
embodied as the organic EL display 10, but is not limited to this,
and may instead be a backlight mounted in a liquid crystal panel,
for example, or may be a field effect type of display (FED, SED,
etc.) that is equipped with a flat electron emission element, and
that utilizes the ability of a fluorescent substance to emit light
as a result of the electrons emitted from this element.
[0140] This application claims priority to Japanese Patent
Application No. 2004-368871. The entire disclosure of Japanese
Patent Application No. 2004-368871 is hereby incorporated herein by
reference.
* * * * *