U.S. patent application number 11/902902 was filed with the patent office on 2008-04-10 for heat dissipation module and fan thereof.
This patent application is currently assigned to DELTA ELECTRONICS, INC.. Invention is credited to Wen-Shi Huang, Hao-Wen Ko, Tsung-Yu Lei.
Application Number | 20080084663 11/902902 |
Document ID | / |
Family ID | 39185177 |
Filed Date | 2008-04-10 |
United States Patent
Application |
20080084663 |
Kind Code |
A1 |
Ko; Hao-Wen ; et
al. |
April 10, 2008 |
Heat dissipation module and fan thereof
Abstract
A heat dissipation module is disclosed. The heat dissipation
module includes fan and at least a heat sink. The fan includes a
frame and an impeller. The frame includes a body and at least an
extension. The extension protrudes from at least a side of the
body. The extension or the body is connected with the circuit
board. The impeller is disposed in the body. The heat sink is
connected with the extension for dissipating heat produced from the
electronic element.
Inventors: |
Ko; Hao-Wen; (Taoyuan Hsien,
TW) ; Lei; Tsung-Yu; (Taoyuan Hsien, TW) ;
Huang; Wen-Shi; (Taoyuan Hsien, TW) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Assignee: |
DELTA ELECTRONICS, INC.
|
Family ID: |
39185177 |
Appl. No.: |
11/902902 |
Filed: |
September 26, 2007 |
Current U.S.
Class: |
361/697 ;
257/E23.086; 257/E23.099; 361/695 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/4093 20130101; H01L 23/467 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
361/697 ;
361/695 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 4, 2006 |
TW |
95136868 |
Claims
1. A heat dissipation module assembled with a circuit board,
comprising: a fan comprising: a frame comprising a body and at
least an extension, wherein the extension protrudes from at least a
side of the body; and an impeller disposed in the body; and at
least a heat sink coupled to the extension for dissipating heat
produced from an electronic element disposed on the circuit
board.
2. The heat dissipation module as claimed in claim 1, wherein the
cross-sectional shape of the body is pillared, board-shaped,
L-shaped, U-shaped, O-shaped or D-shaped, and the extension
protrudes from at least a side of the body along the axial
direction.
3. The heat dissipation module as claimed in claim 1, wherein the
heat sink comprises at least a dissipating portion and at least a
contact portion, the contact portion provides contact with the
electronic element; and the extension comprises at least an opening
for allowing the contact portion to pass through the extension to
be contacted with the electronic element.
4. The heat dissipation module as claimed in claim 1, wherein the
extension or the body comprises at least a base for receiving at
least a fastener to fix the fan on the circuit board.
5. The heat dissipation module as claimed in claim 1, wherein the
extension or the body comprises at least a connecting structure for
connecting the fan to the circuit board, wherein the collecting
structure is a bolt, a fastening structure, a sliding structure, or
a guiding structure.
6. The heat dissipation module as claimed in claim 1, further
comprising at least a fastener for fixing the fan on the circuit
board.
7. The heat dissipation module as claimed in claim 1, wherein the
electronic element is a central processing unit or an integrated
chip, and the circuit board is a printed circuit board or laminated
circuit board.
8. The heat dissipation module as claimed in claim 1, wherein the
impeller comprises at least a blade with a flat, curved, or arced
shape.
9. The heat dissipation module as claimed in claim 1, wherein the
extension is connected with the heat sink by clipping, engaging,
locking, or receiving.
10. The heat dissipation module as claimed in claim 1, wherein the
frame is made of non-metal materials, plastics, rubber, or polymer
materials.
11. The heat dissipation module as claimed in claim 1, wherein the
extension and the body are formed as a monolithic unit.
12. A fan comprising: a frame comprising a body and at least an
extension, wherein the extension protrudes from at least a side of
the body; and an impeller disposed in the body.
13. The fan as claimed in claim 12, wherein the cross-sectional
shape of the extension is pillared, board-shaped, L-shaped,
U-shaped, O-shaped or D-shaped.
14. The fan as claimed in claim 12, wherein the extension protrudes
from at least a side of the body along an axial direction, and the
extension comprises at least an opening for allowing the contact
portion to pass through the extension.
15. The fan as claimed in claim 12, wherein the extension or the
body comprises at least a base for receiving at least a fastener
used to fix the fan on a circuit board.
16. The fan as claimed in claim 12, wherein the extension or the
body comprises at least a connecting structure for connecting the
fan and a circuit board.
17. The fan as claimed in claim 16, wherein the connecting
structure is a fast bolt, a fastening structure, a sliding
structure, or a guiding structure.
18. The fan as claimed in claim 12, further comprising at least a
fastener for fixing the frame on a circuit board.
19. The fan as claimed in claim 12, wherein the frame is made of
non-metal materials, plastics, rubber or polymer materials.
20. The fan as claimed in claim 12, wherein the extension and the
body are formed as a monolithic piece.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates to a heat dissipation module and a fan
thereof and more particularly, to a heat dissipation module and fan
engaged with a circuit board by a fan frame.
[0003] 2. Description of the Related Art
[0004] Electronic systems typically include heat dissipation
modules for dissipating heat produced by electronic elements
disposed on the circuit board of the electronic system. A
conventional heat dissipation module can be separated into a heat
sink and a fan, wherein the fan is fixed to the heat sink and the
heat sink is fixed to the circuit board.
[0005] Because the heat sink and a base thereof for fixing the heat
dissipation module to the circuit board are metal materials. Thus,
the materials cost are high.
[0006] Another conventional heat dissipation module can be provided
at less cost. This conventional heat dissipation module includes a
support with a base, a fan, and a heat sink, each of which is an
independent structure. The fan and the heat sink are respectively
locked on the support. The heat dissipation module is fixed on the
circuit board by the base of the support. The material of the
support can be plastic rather than metal and thus, cost can be
reduced because the support is an independent structure.
[0007] The adjustment and fabrications steps for the support and
the fan, the support and the heat sink, and the fan and the heat
sink are increased. Thus, the number of steps required to fabricate
the entire heat dissipation module is increased and precision
adjustment is required. The cost is additionally increased and the
reliability and quality are decreased.
BRIEF SUMMARY OF THE INVENTION
[0008] Thus, to solve the described problems, the invention
provides a heat dissipation module and a fan thereof with fewer
elements and fabrication procedures, and reduced fabrication time
and cost.
[0009] Accordingly, a heat dissipation module and a fan thereof are
provided. The fan includes a frame and an impeller. The frame
includes a body and at least an extension protruding from at least
a side of the body. The extension or the body is connected to the
circuit board. The impeller is disposed in the body. The heat sink
is coupled to the extension for dissipating heat produced from the
electronic element disposed on the circuit board.
[0010] Furthermore, a fan is provided. The fan includes a frame and
an impeller. The frame includes a body and at least an extension
protruding from at least a side of the body. The extension is
connected to the circuit board. The impeller is disposed in the
body.
[0011] The frame can be plastics, rubber, or polymer materials.
[0012] The heat sink includes at least a dissipating portion and at
least a contact portion. The contact portion serves as a contact
with the electronic element disposed on the circuit board. The
extension includes at least an opening so that the contact portion
can pass through the extension to be contacted with the electronic
element. The dissipating portion can be a plurality of fins. The
extension is coupled to the heat sink by clipping, engaging,
locking, or receiving.
[0013] The body of the heat dissipation module or the fan is
annular. The cross-sectional shape by the axial direction of the
body is pillar, board-shape, L-shape, U-shape, O-shape or
D-shape.
[0014] The extension and the body of the heat dissipation module or
the fan respectively include at least a base for receiving at least
a fastener. The fastener is utilized to fix the fan on the circuit
board. The fastener is a screw, spring screw, bolt, or fastening
structure.
[0015] The extension and the body of the heat dissipation module or
the fan respectively include at least a connecting structure for
connecting the fan with the circuit board. The connecting structure
is a bolt, a fastening structure, a sliding structure, or a guiding
structure.
[0016] The heat dissipation module or the fan further includes at
least a fastener for fixing the fan on the circuit board.
[0017] The electronic element is a central processing unit or an
integrated chip. The impeller includes at least a blade, and the
shape thereof is flat, curved, or arced. The fan can also be a
blower. The circuit board is a printed circuit board or laminated
circuit board.
[0018] The heat dissipation module or the fan of the present
invention, due to being directly connected to the fan frame with
the circuit board, an additional support is not required. Thus, the
number of elements, fabrication procedures, and required adjustment
precision and cost are all decreased while improving reliability
and quality. Additionally, the fan frame can be plastic material,
and formed by injection-molding and thus, increasing production
time, decreasing cost and increasing reliability and quality.
[0019] A detailed description is given in the following embodiments
with reference to the accompanying drawings:
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present invention will become more fully understood from
the subsequent detailed description and the accompanying drawings,
which are given by way of illustration only, and thus are not
limitative of the present invention, and wherein:
[0021] FIG. 1 is a schematic view of a first embodiment of a
fan;
[0022] FIG. 2 is a schematic view of a first embodiment of a heat
dissipation module;
[0023] FIG. 3 is a schematic view of a second embodiment of a
fan;
[0024] FIG. 4 is a schematic view of a second embodiment of a heat
dissipation module;
[0025] FIG. 5 is a schematic view of a first embodiment of a
system;
[0026] FIG. 6 is a schematic view of a second embodiment of a
system; and
[0027] FIG. 7 is a schematic view of a third, embodiment of a
system.
DETAILED DESCRIPTION OF THE INVENTION
[0028] The following description is of the best-contemplated mode
of carrying out the invention. This description is made for the
purpose of illustrating the general principles of the invention and
should not be taken in a limiting sense. The scope of the invention
is best determined by reference to the appended claims.
[0029] FIG. 1 is a schematic view of a first embodiment of a fan
100. Referring to FIG. 1, the fan 100 includes a frame 112 and an
impeller 102. The frame 112 includes a body 108 and at least an
extension 110 protruding from at least a side of the body 108.
Particularly, the extension 110 protrudes in the axial direction
from at least a side of the body 108.
[0030] The extension 110 or the body 108 is connected to a circuit
board 208. The body 108 and the extension 110 are formed as a
monolithic piece. Additionally, the frame 112 can be non-metal
materials such as plastic, rubber, or polymer materials.
[0031] The body 108 can be annular. The sectional shape of the
extension 110 extending in the axial direction of the body 108 is
pillar, board-shape, L-shape, U-shape, O-shape or D-shape. In this
embodiment, the sectional shape of the extension 110 extending in
the axial direction of the body 108 is board shape.
[0032] The extension 110 includes at least an opening 116 so that a
contact portion 122 of a heat sink 124 can pass through the
extension 110 via the opening 116 and the contact portion 112 can
contact with an electronic element 206 similar to the heat
dissipation module 300 shown in FIG. 2. The extension 110 or the
body 108 further includes a base 114 for receiving at least a
fastener 202 as shown in FIG. 5. The fastener 202 serves to fix the
fan 100 on a circuit board 208. The fastener 202 is a screw, a
spring screw, a bolt, or a fastening structure.
[0033] The impeller 102 is disposed in the body 108. The impeller
102 includes a hub 104 and a plurality of blades 106 disposed
around the hub 104. The fan 100 can be a blower. The shape of the
blade 106 is flat, curved, or arced.
[0034] FIG. 2 is a schematic view of a first embodiment of a heat
dissipation module 300. Referring to FIG. 2, the heat dissipation
module 300 includes a fan and at least a heat sink 124. Different
from FIG. 1, the extension 110a shown in FIG. 2 includes a
connecting structure 118 substituting the base 114. A connecting
structure 118, similar to the base 114 shown in FIG. 1, is a bolt,
a fastening structure, a sliding structure, or a guiding structure.
In this embodiment, the connecting structure 118 is a fastening
bolt.
[0035] The heat sink 124 includes at least a dissipating portion
120 and at least a contact portion 122. The contact portion 122
contacts the electronic element 206. The heat sink 124 can be
fins.
[0036] The heat sink 124 is coupled to the extension 110a for
guiding heat produced from the electronic element 206 of the
circuit board 208. The extension 110a is coupled to the heat sink
124 by clipping, engaging, locking, or receiving.
[0037] FIG. 3 is a schematic view of a second embodiment of a fan
100a. Referring to FIG. 3, the difference between the fan 100a and
the preceding embodiments is the cross-sectional shape of the
extension 110a of the frame 112b, wherein the sectional shape of
the extension 110a toward an axial direction of the body 108 is
U-shaped. Thus, the heat sink 124 is received in the extension
110a. The extension 110a is connected to the circuit board 208 by a
base 126, which receives screws or spring screws therein.
[0038] FIG. 4 is a schematic view of a second embodiment of a heat
dissipation module 300a. Referring to FIG. 4, a U-shaped extension
110b of a frame 112c conforms to the body 108a for aesthetic
considerations. Additionally, the heat sink 124a is coupled to the
extension 110b by side screwing. Thus, the extension 110b is a
guiding-type connecting structure 128 for rapidly and securely
connecting the heat dissipation module 300a and the circuit board
208.
[0039] For further describing the heat dissipation module or the
fan, a general system is described. Referring to FIG. 5, a system
200 includes a circuit board 208 therein. The circuit board 208
includes at least an electronic element 206 and at least a fixed
portion 210. The electronic element 206 can be a central processing
unit or an integrated chip. The circuit board 208 can be a printed
circuit board or a laminated circuit board.
[0040] Due to the excessive heat produced from the electronic
element 206, the system 200 requires a heat dissipation module. At
first, the heat sink 124b is disposed in the frame 112b and then, a
base 126 is roughly aligned corresponding to the fixed portion 210.
The fastener 202 passes through the base 126 and is screwed on the
base 126. Thus, the heat sink 124b of the fan 100a is securely
disposed on the electronic element 206. Thus, while the system is
operating, the heat dissipation module 124b dissipates heat
produced from the electronic element 206.
[0041] Because the frame 112b is not required to be in direct
contact with the electronic element 206 in the system 200. Thus,
the frame 112b does not require materials with high conductive
coefficient, and can include non-metal materials such as plastic.
Thus, the cost is decreased when compared with the conventional
technology.
[0042] Moreover, referring to FIG. 6, when a system 200a uses the
fan 100 instead of the fan 100a, the fan 100 and the heat sink 124
are coupled to the extension 110 by screwing. The heat sink 124 is
attached to the electronic element 206 via the contact portion of
heat sink 124 passing through the opening of the extension 110. The
spring screw 212 received in the base 114 fastens the fan 100 on
the circuit board 208. A gap is formed between the extension 110
and the electronic element 206. Thus, the frame 112 can include
non-metal materials, such as plastic, to reduce the cost to lower
than that of the conventional. Furthermore, the extension 110 is
board-shaped and the material of the extension 110 is less than
that of the extension 110a so that the cost of the system 200a is
less than that of the system 200.
[0043] Referring to FIG. 7, the frame 112c is fixed on the circuit
board 208 by a fastener 214. Thus, in system 200b, the frame 112c
and the heat sink 124 can be attached to the circuit board 208 more
rapidly, reducing production time.
[0044] As mentioned above, since the fan frame is directly
connected to the circuit board, additional support is not required.
Thus, the number of elements, fabrication, and adjustment
procedures and cost are decreased while reliability and quality are
improved. Additionally, the fan frame can include a plastic
material. Thus, the fan frame can be formed by injection-molding,
decreasing production time and increasing reliability and
quality.
[0045] While the invention has been described by way of example and
in terms of the preferred embodiment, it is to be understood that
the invention is not limited thereto. To the contrary, it is
intended to cover various modifications and similar arrangements
(as would be apparent to those skilled in the art). Therefore, the
scope of the appended claims should be accorded the broadest
interpretation so as to encompass all such modifications and
similar arrangements.
* * * * *