U.S. patent application number 11/798434 was filed with the patent office on 2008-04-03 for heat dissipating system and method.
Invention is credited to Chin-Kuang Luo.
Application Number | 20080078202 11/798434 |
Document ID | / |
Family ID | 39259822 |
Filed Date | 2008-04-03 |
United States Patent
Application |
20080078202 |
Kind Code |
A1 |
Luo; Chin-Kuang |
April 3, 2008 |
Heat dissipating system and method
Abstract
A heat dissipating system includes: a heat-absorbing unit having
at least one cavity body adapted to contact a heat source, and a
working fluid received in the cavity body; a condenser to condense
the working fluid; and a tubing unit connected fluidly to the
condenser and the heat-absorbing unit. The working fluid flows
through the tubing unit to circulate from the condenser to the
heat-absorbing unit by gravity and from the heat-absorbing unit to
the condenser by natural convection. The tubing unit forms a closed
circulating loop with the heat-absorbing unit and the
condenser.
Inventors: |
Luo; Chin-Kuang; (Taichung
City, TW) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Family ID: |
39259822 |
Appl. No.: |
11/798434 |
Filed: |
May 14, 2007 |
Current U.S.
Class: |
62/485 ;
257/E23.088 |
Current CPC
Class: |
H01L 35/30 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; F25B 21/02
20130101; H01L 2924/00 20130101; H01L 23/427 20130101 |
Class at
Publication: |
62/485 |
International
Class: |
F25B 15/00 20060101
F25B015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 28, 2006 |
TW |
095136005 |
Claims
1. A heat dissipating system, comprising: a heat-absorbing unit
having at least one cavity body adapted to contact a heat source,
and a working fluid received in said cavity body; a condenser to
condense said working fluid; and a tubing unit connected fluidly to
said condenser and said heat-absorbing unit, said working fluid
flowing through said tubing unit to circulate from said condenser
to said heat-absorbing unit by gravity and from said heat-absorbing
unit to said condenser by natural convection, said tubing unit
forming a closed circulating loop with said heat-absorbing unit and
said condenser.
2. The heat dissipating system of claim 1, wherein said condenser
has a top end provided with a vapor-receiving part, an inlet
connected fluidly to said vapor-receiving part, a bottom end
provided with a liquid-receiving part, an outlet connected fluidly
to said liquid-receiving part, and a plurality of channels
connected between said vapor-receiving and liquid-receiving parts,
said inlet and said outlet of said condenser being disposed at a
level higher than that of said cavity body, said working fluid
flowing from said cavity body to said inlet of said condenser when
vaporized and from said outlet of said condenser to said cavity
body after being condensed.
3. The heat dissipating system of claim 2, wherein said condenser
includes a thermoelectric cooler having a cold side in contact with
said liquid-receiving part, and a hot side opposite to said cold
side.
4. The heat dissipating system of claim 3, further comprising a
heat sink disposed adjacent to said condenser and having a contact
portion in contact with said hot side, and a plurality of fins.
5. The heat dissipating system of claim 4, further comprising a fan
disposed proximate to said condenser and said heat sink.
6. The heat dissipating system of claim 2, wherein said
heat-absorbing unit includes a plurality of said cavity bodies,
each of said cavity bodies having an inlet and an outlet.
7. The heat dissipating system of claim 6, wherein said tubing unit
includes a plurality of tubes, said cavity bodies and said
condenser being interconnected in series through said tubes, each
of said tubes being connected to said inlet of one of said cavity
bodies and said condenser and to said outlet of the other one of
said cavity bodies and said condenser.
8. The heat dissipating system of claim 6, wherein said tubing unit
includes a first manifold, a plurality of spaced-apart first tubes
each connected between said first manifold and said inlet of a
respective one of said cavity bodies, a second manifold, a
plurality of spaced-apart second tubes each connected between said
second manifold and said outlet of the respective one of said
cavity bodies, a third tube connected between said liquid-receiving
part and said first manifold, and a fourth tube connected between
said vapor-receiving part and said second manifold.
9. A computer module comprising: a housing; at least one chip
disposed in said housing; a heat-absorbing unit having at least one
cavity body contacting said chip, and a working fluid received in
said cavity body; a condenser disposed in said housing to condense
said working fluid; and a tubing unit connected fluidly to said
condenser and said heat-absorbing unit, said working fluid flowing
through said tubing unit to circulate from said condenser to said
heat-absorbing unit by gravity and from said heat-absorbing unit to
said condenser by natural convection, said tubing unit forming a
closed circulating loop with said heat-absorbing unit and said
condenser.
10. The computer module of claim 9, wherein said condenser has a
top end provided with a vapor-receiving part, an inlet connected
fluidly to said vapor-receiving part, a bottom end provided with a
liquid-receiving part, an outlet connected fluidly to said
liquid-receiving part, and a plurality of channels connected
between said vapor-receiving and liquid-receiving parts, said inlet
and said outlet of said condenser being disposed at a level higher
than that of said cavity body, said working fluid flowing from said
cavity body to said inlet of said condenser when vaporized and from
said outlet of said condenser to said cavity body after being
condensed.
11. The computer module of claim 10, wherein said condenser
includes a thermoelectric cooler having a cold side in contact with
said liquid-receiving part, and a hot side opposite to said cold
side.
12. The computer module of claim 11, further comprising a heat sink
disposed adjacent to said condenser and having a contact portion in
contact with said hot side, and a plurality of fins.
13. The computer module of claim 12, further comprising a fan
disposed proximate to said condenser and said heat sink.
14. A method for dissipating heat from a heat source, comprising:
(a) contacting the heat source with a heat-absorbing cavity body to
cause a working fluid contained in the cavity body to vaporize; (b)
allowing the vaporized working fluid to flow upward and enter a
condenser by natural convection; (c) condensing the vaporized
working fluid in the condenser; (d) cooling the condensed working
fluid using a thermoelectric cooler and a heat sink; and (e)
allowing the condensed working fluid to flow downward and back into
the cavity body by gravity.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority of Taiwanese Application
No. 095136005, filed on Sep. 28, 2006.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to heat dissipation, more particularly
to a heat dissipating system and method.
[0004] 2. Description of the Related Art
[0005] Referring to FIG. 1, a liquid-cooling heat dissipating
system, as disclosed in Taiwanese Publication No. M295424, includes
a heat sink 11 for exchanging heat with external cold air by
convection, a thermoelectric cooler 12, a pressure-increasing pump
13 to circulate a working fluid within the system, a liquid-cooling
connector 14 in contact with a heat source 2, three input pipes 15
for interconnecting the heat sink 11, the thermoelectric cooler 12,
the pump 13, and the liquid-cooling connector 14 in series, an
output pipe 16 connected fluidly to the heat sink 11 and the
liquid-cooling connector 14, and a fan 17 for directing a current
of cold air toward the heat sink 11. The heat source 2 may be a
central processing unit of a computer.
[0006] When the pressure-increasing pump 13 is activated, the
working fluid in the liquid-cooling connector 14 circulates toward
the heat sink 11 after absorbing the heat generated by the heat
source 2. The heat sink 11 then exchanges heat with the external
current of cold air so as to dissipate the heat. Although the
aforementioned heat dissipating system can achieve its intended
purpose, in actual practice, it has the following drawbacks:
[0007] 1. Since the aforementioned liquid-cooling heat dissipating
system relies on the pressure-increasing pump 13 to circulate the
working fluid, the system not only has more components, is more
costly, and is more noisy, but also generates more heat itself due
to the pressure-increasing pump 13. This runs counter to efforts at
reducing the temperature of the working fluid in the system and,
therefore, reduces the cooling efficiency of the system.
[0008] 2. If the aforementioned working fluid is water, the water
will freeze when the system is used in a cold area with a
temperature lower than 0.degree. C., thereby rendering the system
useless. Further, if there is water leakage in the system,
circuitry in the heat source 2 and/or elements of the system itself
may be destroyed.
SUMMARY OF THE INVENTION
[0009] Therefore, the object of the present invention is to provide
a heat dissipating system that can reduce noise to a minimum and
that can effectively enhance heat dissipation. The present
invention also provides a method for dissipating heat from a heat
source. According to one aspect of this invention, a heat
dissipating system comprises: a heat-absorbing unit having at least
one cavity body adapted to contact a heat source, and a working
fluid received in the cavity body; a condenser to condense the
working fluid; and a tubing unit connected fluidly to the condenser
and the heat-absorbing unit. The working fluid flows through the
tubing unit to circulate from the condenser to the heat-absorbing
unit by gravity and from the heat-absorbing unit to the condenser
by natural convection. The tubing unit forms a closed circulating
loop with the heat-absorbing unit and the condenser.
[0010] According to another aspect of this invention, a computer
module comprises a housing, at least one chip disposed in the
housing, a heat-absorbing unit, a condenser, and a tubing unit. The
heat-absorbing unit has at least one cavity body contacting the
chip, and a working fluid received in the cavity body. The
condenser is disposed in the housing to condense the working fluid.
The tubing unit is connected fluidly to the condenser and the
heat-absorbing unit. The working fluid flows through the tubing
unit to circulate from the condenser to the heat-absorbing unit by
gravity and from the heat-absorbing unit to the condenser by
natural convection. The tubing unit forms a closed circulating loop
with the heat-absorbing unit and the condenser. According to still
another aspect of this invention, a method for dissipating heat
from a heat source comprises the steps of: (a) contacting the heat
source with a heat-absorbing cavity body to cause a working fluid
contained in the cavity body to vaporize; (b) allowing the
vaporized working fluid to flow upward and enter a condenser by
natural convection; (c) condensing the vaporized working fluid in
the condenser; (d) cooling the condensed working fluid using a
thermoelectric cooler and a heat sink; and (e) allowing the
condensed working fluid to flow downward and back into the cavity
body by gravity.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Other features and advantages of the present invention will
become apparent in the following detailed description of the
preferred embodiments with reference to the accompanying drawings,
of which:
[0012] FIG. 1 is a perspective view of a conventional
liquid-cooling heat dissipating system disclosed in Taiwanese
Publication No. M295424;
[0013] FIG. 2 is a perspective view of the first preferred
embodiment of a heat dissipating system and method according to the
present invention;
[0014] FIG. 3 is a fragmentary sectional view of a condenser of the
first preferred embodiment;
[0015] FIG. 4 illustrates the first preferred embodiment installed
in a computer module;
[0016] FIG. 5 is a schematic side view of FIG. 4;
[0017] FIG. 6 is a flow chart illustrating the steps involved
during operation of the heat dissipating system of the present
invention;
[0018] FIG. 7 is a schematic view of the second preferred
embodiment of a heat dissipating system and method according to the
present invention; and
[0019] FIG. 8 is a schematic view of the third preferred embodiment
of a heat dissipating system and method according to the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0020] Before the present invention is described in greater detail,
it should be noted that the same reference numerals have been used
to denote like elements throughout the specification.
[0021] Referring to FIGS. 2 to 5, the first preferred embodiment of
a heat dissipating system according to the present invention is
installed in a computer module 3. The computer module 3 has a
housing 33 defining upper and lower chambers 31, 32, a mounting
board 34 fixed inside the lower chamber 32, and a plurality of
module chips 35 mounted on the mounting board 34. The heat
dissipating system of the present invention comprises a condenser
4, a heat-absorbing unit 5, and a tubing unit 6. The module chips
35 are heat sources to undergo heat dissipation by the system of
the present invention. The condenser 4 is disposed in the upper
chamber 31 of the computer module 3, and includes a vapor-receiving
part 411 formed on a top end thereof, an inlet 414 connected
fluidly to the vapor-receiving part 411, a liquid-receiving part
412 formed on a bottom end thereof, an outlet 415 connected fluidly
to the liquid-receiving part 412, a plurality of channels 413
connected between the vapor-receiving and liquid-receiving parts
411, 412, and a thermoelectric cooler 42. The thermoelectric cooler
42 is controlled through a circuit, and has a cold side 421 in
contact with the liquid-receiving part 412, and a hot side 422
opposite to the cold side 421. The cold side 421 has a cooling
function so as to keep the liquid-receiving part 412 at a constant
temperature. The heat dissipating system of the present invention
further comprises a heat sink 43 and a fan 44. The heat sink 43 is
disposed adjacent to the condenser 4, and has an L-shaped
configuration. The heat sink 43 includes a horizontal plate 431
having a contact portion 4311 in contact with the hot side 422 of
the thermoelectric cooler 42, a vertical plate 432 extending
upwardly from an end periphery of the horizontal plate 431 and
parallel to the condenser 4, and a plurality of fins 433 provided
on the vertical plate 432. The fan 44 is disposed proximate to the
condenser 4 and the heat sink 43, and directs a current of cold air
toward the condenser 4 and the heat sink 43, as best shown in FIG.
5.
[0022] The heat-absorbing unit 5, in this embodiment, includes
first, second, and third cavity bodies 51, 52, 53 respectively in
contact with the chips 35 of the computer module 3. Each of the
first to third cavity bodies 51, 52, 53 has an inlet 511, 521, 531,
and an outlet 512, 522, 532. The inlet 414 and the outlet 415 of
the condenser 4 are disposed at a level higher than those of the
first to third cavity bodies 51, 52, 53.
[0023] The tubing unit 6, in this embodiment, includes first,
second, third, and fourth tubes 61, 62, 63, 64. The first tube 61
is connected to the outlet 415 of the condenser 4 and to the inlet
511 of the first cavity body 51. The second tube 62 is connected to
the outlet 512 of the first cavity body 51 and to the inlet 521 of
the second cavity body 52. The third tube 63 is connected to the
outlet 522 of the second cavity body 52 and to the inlet 531 of the
third cavity body 53. The fourth tube 64 is connected to the outlet
532 of the third cavity body 53 and to the inlet 414 of the
condenser 4. As such, the first to fourth tubes 61, 62, 63, 64, the
condenser 4, and the first to third cavity bodies 51, 52, 53 form a
closed circulating loop, as best shown in FIG. 4.
[0024] A working fluid 30 is injected into the system of the
present invention after the first to fourth tubes 61, 62, 63, 64,
the first to third cavity bodies 51, 52, 53, and the condenser 4
are evacuated, so that the working fluid 30 circulates in a vacuum
environment. In this embodiment, the working fluid 30 is a coolant
that is in a liquid state at room temperature. Alternatively, the
working fluid 30 may be a super-thermal-conductive liquid.
[0025] Referring to FIG. 6, the steps involved in the method for
dissipating heat from the chips 35 are shown.
[0026] In step 71, the first, second, and third cavity bodies 51,
52, 53 are placed in contact with the respective chips 35, which
have the lowest, medium, and highest temperatures, respectively.
Initially, the working fluid 30 is in a liquid state and is in the
first and second cavity bodies 51, 52. After the computer module 3
is switched on, the liquid-state working fluid 30 in the first and
second cavity bodies 51, 52 is vaporized. As the pressure inside
the first cavity body 51 increases, the working fluid 30 in a
vaporized state flows into the second cavity body 52 through the
second tube 62. As the pressure inside the second cavity body 52
also increases, the liquid-state working fluid 30 in the second
cavity body 52 is pressurized and is caused to flow through the
third tube 63 and into the third cavity body 53 where the
temperature is the highest. The liquid-state working fluid 30 is
vaporized in the third cavity body 53.
[0027] The number of tubes of the tubing unit 6 can be set
according to the number of the module chips 35. As such, the
working fluid 30 can flow successively from the lowest- to the
highest-temperature module chips 35 through the cavity bodies 51,
52, 53.
[0028] In step 72, the vaporized working fluid 30 flows upward by
natural convection through the fourth tube 64 from a high-density
region, which is the third cavity body 53, into a low-density
region, which is the vapor-receiving part 411 of the condenser
4.
[0029] In step 73, the fan 44 blows cold air toward the condenser 4
and the heat sink 43 so that the condenser 4 and the heat sink 43
exchange heat with the cold air. The vaporized working fluid 30
from the fourth tube 64 is condensed in the condenser 4, and flows
downward through the channels 413 by gravity into the
liquid-receiving part 412.
[0030] In step 74, through the cooling function of the cold side
421 of the thermoelectric cooler 42, the temperature of the working
fluid 30 in a condensed state and in the liquid-receiving part 412
continues to drop to a preset value, and the hot side 422 of the
thermoelectric cooler 42 transfers the heat from the condensed
working fluid 30 to the heat sink 43, which dissipates the
heat.
[0031] In step 75, the cooled condensed working fluid 30 in the
liquid-receiving part 412 then flows back into the first cavity
body 51 through the first tube 61 by gravity so as to repeat the
aforementioned steps. Hence, by circulating the working fluid 30
through the condenser 4, the first to third cavity bodies 51, 52,
53, and the first to fourth tubes 61-64, heat is effectively
dissipated.
[0032] Referring to FIG. 7, the heat dissipating system and method
according to the second preferred embodiment of the present
invention is shown to be similar to the first preferred embodiment.
However, in this embodiment, the tubing unit 6 includes
spaced-apart first and second manifolds 65, 67, three spaced-apart
first tubes 66 each connected between the first manifold 65 and the
inlet 511, 521, 531 of the respective cavity body 51, 52, 53 so as
to direct the liquid-state working fluid 30 into the respective
cavity body 51, 52, 53, three spaced-apart second tubes 68 each
connected between the second manifold 67 and the outlet 512, 522,
532 of the respective cavity body 51, 52, 53 so as to direct the
vaporized working fluid 30 into the second manifold 67, a third
tube 69 connected between the first manifold 65 and the
liquid-receiving part 412 (see FIG. 2) of the condenser 4, and a
fourth tube (69') connected between the second manifold 67 and the
vapor-receiving part 411 of the condenser 4.
[0033] The condensed working fluid 30 in the liquid-receiving part
412 of the condenser 4 flows down first into the first manifold 65
by gravity, and enters simultaneously the first to third cavity
bodies 51, 52, 53 through the first tubes 66. The vaporized working
fluid 30 in the first to third cavity bodies 51, 52, 53 is
collected at the second manifold 67, and from the second manifold
67, the vaporized working fluid 30 flows through the fourth tube
69' and into the vapor-receiving part 411 of the condenser 4. The
working fluid 30 can self-circulate through the condenser 4, the
first to third cavity bodies 51, 52, 53, and the first to fourth
tubes 66, 68, 69, 69', thereby effectively dissipating the heat in
the system.
[0034] Referring to FIG. 8, the heat dissipating system and method
according to the third preferred embodiment of the present
invention is shown to be similar to the second preferred
embodiment. However, in this embodiment, the heat-absorbing unit 5
includes five cavity bodies 54 connected in parallel to each other
using the first and second manifolds 65, 67 of the tubing unit 6.
Each cavity body 54 is in contact with an electronic component 7
that can generate heat. The arrangement of the tubing unit 6 is as
illustrated in FIG. 8.
[0035] The heat dissipating system and method of the present
invention may also be applicable to dissipating heat of an engine
or a machine of a car, or any other article that needs heat
dissipation.
[0036] From the aforementioned description, the advantages of the
heat dissipating system and method of the present invention may be
summarized as follows:
[0037] 1. Through phase change of the working fluid 30 from liquid
to vapor and vapor to liquid, the working fluid 30 can undergo a
self-circulating effect. Hence, compared to the conventional heat
dissipating system that utilizes the pressure-increasing pump 13
(see FIG. 1), the system of the present invention not only utilizes
simple components, and reduces cost and noise to a minimum, but
also minimizes self-generated heat.
[0038] 2. The working fluid 30 of the present invention, while in a
liquid state, can effectively absorb heat from the module chips 35
through heat conduction, and is then vaporized so as to exchange
heat with the condenser 4. As such, not only can a heat dissipating
effect and efficiency be enhanced, the present invention can also
cooperate with the thermoelectric cooler 42 to control the
temperature through an electric-controlled process, so that the
condensed working fluid 30 can be maintained in a particular
temperature range for any length of time, thereby ensuring a
favorable heat dissipation effect.
[0039] 3. The working fluid 30 of the present invention makes use
of a coolant or a super-thermal-conductive liquid, so that no
freezing of the working fluid 30 is likely to occur when the
working fluid 30 is used at a temperature below 0.degree. C. Hence,
the heat dissipation process can be carried out smoothly. Further,
even if there is a leak in the system, the working fluid 30 will
turn immediately into vapor so as not to damage electronic
circuitry and/or elements of the heat dissipating system.
[0040] While the present invention has been described in connection
with what are considered the most practical and preferred
embodiments, it is understood that this invention is not limited to
the disclosed embodiments but is intended to cover various
arrangements included within the spirit and scope of the broadest
interpretation so as to encompass all such modifications and
equivalent arrangements.
* * * * *