U.S. patent application number 11/979921 was filed with the patent office on 2008-03-27 for shredder apparatus and shredding method.
This patent application is currently assigned to FUJI XEROX CO., LTD.. Invention is credited to Yasuo Horino, Hajime Kishimoto, Yasuhiro Matsuo, Masayoshi Sakakibara, Akihiko Takada, Ryoji Watanabe, Toshiyuki Yano.
Application Number | 20080073453 11/979921 |
Document ID | / |
Family ID | 32072438 |
Filed Date | 2008-03-27 |
United States Patent
Application |
20080073453 |
Kind Code |
A1 |
Watanabe; Ryoji ; et
al. |
March 27, 2008 |
Shredder apparatus and shredding method
Abstract
When a printing paper to which an IC chip storing secret
information is attached is discarded, a shredder applied voltage to
the IC chip by a discharging unit to destroy the IC chip and to
make it impossible to read the secret information therefrom.
Thereafter, a shredding cutter shreds the printing paper and the
shred printing paper is discarded.
Inventors: |
Watanabe; Ryoji; (Kanagawa,
JP) ; Takada; Akihiko; (Kanagawa, JP) ;
Sakakibara; Masayoshi; (Kanagawa, JP) ; Kishimoto;
Hajime; (Kanagawa, JP) ; Horino; Yasuo;
(Tokyo, JP) ; Yano; Toshiyuki; (Kanagawa, JP)
; Matsuo; Yasuhiro; (Kanagawa, JP) |
Correspondence
Address: |
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA
VA
22320-4850
US
|
Assignee: |
FUJI XEROX CO., LTD.
Tokyo
JP
|
Family ID: |
32072438 |
Appl. No.: |
11/979921 |
Filed: |
November 9, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10647235 |
Aug 26, 2003 |
7311277 |
|
|
11979921 |
Nov 9, 2007 |
|
|
|
Current U.S.
Class: |
241/25 |
Current CPC
Class: |
G06K 1/128 20130101;
B02C 18/0007 20130101; B02C 2018/0023 20130101; G06K 19/073
20130101; G06K 19/07758 20130101 |
Class at
Publication: |
241/025 |
International
Class: |
B02C 19/00 20060101
B02C019/00; B02C 23/00 20060101 B02C023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 28, 2002 |
JP |
2002-248789 |
Jun 13, 2003 |
JP |
2003-169622 |
Claims
1. A shredding method comprising: destroying data stored in an
image display member; and shredding the image display member.
Description
[0001] This is a Division of application Ser. No. 10/647,235 filed
Aug. 26, 2003, which in turn relates to the subject matter
contained in Japanese Patent Application No. 2002-248789 filed on
Aug. 28, 2002 and Japanese Patent Application No. 2003-169622 filed
on Jun. 13, 2003, which are incorporated herein by reference in its
entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a shredding apparatus and a
shredding method, which perform a shredding process with respect to
an image display member to which a non-contact memory has been
attached.
[0004] 2. Description of the Related Art
[0005] A compact semiconductor chip (for example, p-chip by
HITACHI, LTD.) from which an external unit can read stored data in
a non-contact manner has been known.
[0006] Also, JP-A-2001-229199, JP-A-2000-285203, JP-A-2001-134672,
JP-A-2001-283011, JP-A-2001-148000, and JP-A-2001-260580 disclose
applications of the compact semiconductor chip.
[0007] The invention has been made based on the above-described
technical background. An object of the invention is to provide a
shredding apparatus and a shredding method, which destroy data
stored in a data storage device so that the data cannot be read
therefrom when an image display member to which the data storage
device such as a semiconductor chip is discarded.
SUMMARY OF THE INVENTION
[Shredding Apparatus]
[0008] To achieve the above described object, according to a first
aspect of the invention, a shredding apparatus includes a destroy
process unit for destroying data stored in an image display member,
and a shredding process unit for shredding the image display
member.
[0009] Preferably, the shredding process unit shreds the image
display member to make an image displayed on the image display
member be invisible.
[0010] Preferably, the data is stored in a data storage device of
the image display member.
[0011] Preferably, the destroy process unit applies one of electric
field and magnetic field to a data storage unit of the image
display member to destroy the data.
[0012] Preferably, the destroy process unit destroys the data
storage device physically.
[0013] Preferably, the shredding apparatus further includes an
insertion port from which the image display member is inserted into
the shredding apparatus. The destroy process unit is disposed
closer to the insertion port than the shredding process unit.
[0014] Preferably, the shredding process unit shreds the image
display member after applying the at least one of the electric
field and the magnetic field to the data storage device.
[0015] Preferably, the destroy process unit applies voltage to the
data storage device to destroy the data storage device and the
data.
[0016] Preferably, the data destroy unit applies an electromagnetic
wave to the data storage device to overwrite another data into the
data storage device so that the data stored in the data storage
device is destroyed.
[0017] Preferably, the shredding apparatus further includes a
sensing unit for sensing as to whether the image display unit
includes a data storage device storing the data, and a control unit
for controlling the destroy process unit to destroy the data when
the sensing unit senses that the image display unit includes the
data storage device.
[0018] Preferably, the shredding apparatus further includes a
display member sensing unit for sensing presence of the image
display member and a control unit for controlling at least one of
the destroy process unit and the shredding process unit to perform
each operation when the display member sensing unit senses the
image display member.
[0019] Preferably, the shredding process unit shreds the image
display member so that the displayed image cannot be
recognized.
[Shredding Method]
[0020] Also, according to a second aspect of the invention, a
shredding method includes destroying data stored in an image
display member, and shredding the image display member.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIG. 1 is a diagram for exemplifying a printing paper (image
display member) which is processed in a post processing method
according to the present invention.
[0022] FIG. 2 is a diagram for exemplifying a hardware structure of
a shredder 2 (shredder apparatus) to which the post processing
method according to the present invention is applied.
[0023] FIG. 3 is an explanatory diagram for explaining an outline
of a discharge unit shown in FIG. 2.
[0024] FIG. 4 is a flow chart for describing operations (S10) of
the shredder 2 shown in FIG. 2.
[0025] FIG. 5 represents a hardware structure of a second shredder
3.
[0026] FIG. 6 is a diagram for representing a structure of an IC
chip into which data is writable.
[0027] FIG. 7 is a diagram for indicating a structure of an IC chip
IF shown in FIG. 5.
[0028] FIG. 8 is a flow chart for describing operations (S20) of
the shredder 3 shown in FIG. 5.
[0029] FIG. 9 represents a hardware structure of a third shredder
5.
[0030] FIG. 10 is a diagram for indicating a structure of an IC
chip IF shown in FIG. 9.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Embodiment
[0031] An embodiment of a shredding method according to the
invention will now be described with reference to a specific
example.
[0032] FIG. 1 is a diagram for showing a printing paper 40 (image
display member), which is processed by the shredding method
according to the invention.
[0033] As shown in FIG. 1, an image has been printed on the
printing paper 40.
[0034] An image, which has been printed on the printing paper 40,
corresponds to, for instance, secret information (confidential
information). After this secret information image is viewed, this
image is desirably postprocessed so that the secret information
cannot be visibly recognized.
[0035] Also, an IC chip 420 (data storage device) is attached to
the printing paper 40.
[0036] The IC chip 420 attached to the printing paper 40
corresponds to a semiconductor chip from which data stored
thereinto can be read in a non-contact manner. For instance,
information having higher secrecy than the secret information
printed on a surface of the printing paper 40 may be stored in the
IC chip 420.
[0037] Preferably, after information stored in the IC chip 420 is
viewed, this information is also processed so that this information
cannot be read form the IC chip 420.
[0038] It should be noted that the IC chip 420 may be a ROM or a
RAM.
Shredder 2
[0039] FIG. 2 is a diagram for showing an example of a hardware
structure of a shredder 2 (shredding apparatus) to which the
shredding method according to the invention is applied.
[0040] As shown in FIG. 2, the shredder 2 includes a control
apparatus 12 (control unit), a power supply apparatus 14, a user
interface apparatus 16 (UI apparatus), an insertion port sensor 18
(display medium detecting unit), a discharge unit 20 (destroying
process unit), a shredding cutter 22 (shredding process unit), and
a storage unit 23. The control apparatus 12 controls an operation
of each constituent component of the shredder 2. The power supply
apparatus 14 supplies electric power to each constituent component
of the shredder 2. The user interface apparatus 16 contains either
an LCD display device or a CRT display device, and a keyboard/touch
panel etc. The discharge unit 20 applies voltage to the IC chip
420. The shredding cutter 22 shreds the printing paper 40. The
storage unit 23 stores thereinto shredded printing paper 40.
[0041] Also, an insertion port 6 used to insert the printing paper
40 thereinto is formed in an upper surface 4 of a housing of the
shredder 2. A transport path 8 is formed inside the housing of the
shredder 2. This transport path 8 transports the printing paper 40
inserted from the insertion port 6.
[0042] This transport path 8 transports the printing paper 40,
which is shredded by the shredding cutter 22 (the shredded printing
paper 40 will be referred to as "scraps" hereinafter) to the
storage unit 23.
[0043] The UI apparatus 16 is arranged on the upper surface 4 of
the housing of the shredder 2, and displays status of the shredder
2 (under shredding operation, or full scraps etc.).
[0044] The insertion port sensor 18 corresponds to, for example, an
optical sensor for sensing as to whether or not the printing paper
40 is present. This insertion port sensor 18 is arranged in the
vicinity of the insertion port 6 to sense the printing paper 40
inserted into this insertion port 6.
[0045] The discharge unit 20 is arranged in the vicinity of the
transport path 8 in order to apply a high voltage to the printing
paper 40.
[0046] A shredding cutter 22-1 and another shredding cutter 22-2
are cutting blades, side surfaces of which are made in contact with
each other, and are arranged in the transport path 8.
[0047] The shredding cutter 22-1 has a rotation shaft 222-1, and
the shredding cutter 22-2 has another rotation shaft 222-2. While
both the shredding cutter 22-1 and the shredding cutter 22-2
receive drive force of a motor (not shown), these shredding rollers
22-1 and 22-2 are rotated in a direction along which the printing
paper 40 is drawn to the storage unit 23 to shred the printing
paper 4, which is transported via the transport path 8 (shredding
process).
[0048] The shredding cutter 22-1 and the shredding cutter 22-1
preferably may shred the printing paper 40 finely so that the image
printed on the printing paper 40 cannot be visibly recognized.
[0049] The storage unit 23 stores therein scraps shredded by the
shredding cutter 22.
[0050] The storage unit 23 has a take-out port (not shown) through
which scraps are taken out. The scraps stored in this storage unit
23 are taken out and discarded.
Discharge Unit 20
[0051] FIG. 3 is an explanatory diagram for explaining an outline
of the discharge unit 20 shown in FIG. 2.
[0052] As shown in FIG. 3, the discharge unit 20 includes a
discharge wire 202 having an electric conductivity, a shield case
204, a base electrode 206, and the like.
[0053] The discharge wire 202 is, for example, a tungsten wire
having a very small diameter. This discharge wire 202 generates
corona discharge toward the base electrode 206 by utilizing a
voltage, which is applied from a power supply apparatus 14.
[0054] The shield case 204 corresponds to a metal plate made of
aluminum etc., which is formed in such a manner that this shield
case 204 surrounds a peripheral portion of the discharge wire 202.
This shield case 204 has an opening at a plane opposite to the base
electrode 206.
[0055] The discharge unit 20 generates corona discharge when the
printing paper 40 is located between the discharge wire 202 and the
base electrode 206 in order to produce overcurrents in the IC chip
420 attached to the printing paper 40, so that this overcurrent can
destroy the IC chip 420 in an electromagnetic manner.
Overall Operation
[0056] FIG. 4 is a flowchart for describing operation (S10) of the
shredder 2 shown in FIG. 2.
[0057] As indicated in FIG. 4, in a step 100 (S100) of this flow
chart, when a user inserts the printing paper 40 (FIG. 1) to be
discarded into the insertion port 6 (FIG. 2), the insertion port
sensor 18 senses that this printing paper 40 is inserted and then
notifies this sensing result to the control apparatus 12.
[0058] Upon receipt of this notification, the control apparatus 12
controls each constituent component so as to commence the shredding
process of this printing paper 40.
[0059] Concretely speaking, when the insertion port sensor 18
senses the printing paper 40, the control apparatus 12 controls the
discharge unit 20 to commence the discharging process, and controls
the shredding cutter 22 to commence the shredding process.
[0060] Also, the power supply apparatus 14 supplies the electric
power to the discharge unit 20 in accordance with control of the
control apparatus 12.
[0061] In a step 102 (S102), the transport path 8 (FIG. 2)
transports the inserted printing paper 40 to a position of the
discharge unit 20 in response to the control of the control
apparatus 12.
[0062] In a step 104 (S104), the discharge unit 20 (FIG. 2) applies
a high voltage to the transported printing paper 40 to generate
corona discharge.
[0063] In a step 106 (S106), after the corona discharge process has
been carried out, when the transport path 8 transports the printing
paper 40 to a position of the shredding cutter 22, the shredding
cutter 22-1 and the shredding cutter 22-2 are rotated to shred the
printing paper 40.
[0064] The shredder 2 transports the shredded printing paper 40 to
the storage unit 23, and then accomplishes the shredding
process.
[0065] As described above, the shredder 2 generates the corona
discharge with respect to the printing paper 40 to produce the
overcurrent in the IC chip 420 attached to the printing paper 40,
so that at least a part of a semiconductor circuit of this IC chip
420 is destroyed. Therefore, the data stored in this IC chip 420
cannot be read therefrom.
[0066] Furthermore, the shredder 2 shreds the printing paper 40 in
order that the image printed on the printing paper 40 cannot be
visibly recognized.
First Modification
[0067] It should be understood that when the IC chip 420 is a
rewritable semiconductor chip, the information, which has been
stored in the IC chip 420, may be destroyed by overwriting data
(will be referred to as "overwritten data" hereinafter) in this IC
chip 420.
[0068] FIG. 5 schematically shows a hardware structure of a second
shredder 3.
[0069] As shown in FIG. 5, this second shredder 3 employs a
structure in which the discharge unit 20 of the shredder 2 is
replaced with an IC chip interface (IC chip IF) 24.
[0070] The IC chip IF 24 applies electromagnetic waves to the IC
chip 420 to rewrite data stored in this IC chip 420 (this process
will be explained later with reference to FIGS. 6 and 7).
[0071] It should also be noted that constituent components of the
shredder 3, which are substantially same as those of the shredder
2, are allotted the same reference numerals.
IC Chip 420/IC Chip IF 24
[0072] FIG. 6 is a diagram for schematically showing a structure of
the IC chip 420 into which data is writable.
[0073] FIG. 7 is a diagram for schematically showing a structure of
the IC chip IF 24 shown in FIG. 5.
[0074] As shown in FIG. 6, the IC chip 420 includes an antenna 422,
a clock reproducing circuit 424, a memory circuit 426, a data
transmitting/receiving circuit 428, and a power supply circuit
430.
[0075] It should also be noted that when it is so guaranteed that
the IC chip 420 of the printing paper 40 may pass in the close
proximity to the IC chip IF 24, an IC chip 420 having no antenna
422 may be employed.
[0076] Also, as shown in FIG. 7, the IC chip IF 24 includes a
transmitting circuit 244, a transmission control circuit 242, an
overwritten-data producing circuit 246, a modulating circuit 248,
and an antenna 250.
[0077] The constituent components of the IC chip 420 and the IC
chip IF 24 operate as described below. Thereby, the overwritten
data is written into the IC chip 420 via the IC chip IF 24, so that
the data indicating the secret information stored in the IC chip
420 can be rewritten by the overwritten data.
[0078] In the IC chip 420 (see FIG. 6), the power supply circuit
430 rectifies an electromagnetic wave signal supplied via the
antenna 422 to supply electric power to each constituent components
of the IC chip 420. This electric power is required for the
constituent components.
[0079] The clock reproducing circuit 424 reproduces a clock signal
from the electromagnetic wave signal supplied via the antenna 422
from the IC chip IF 24 and then, outputs the reproduced clock
signal to the memory circuit 426 and the data
transmitting/receiving circuit 428.
[0080] The memory circuit 426 is, for example, a nonvolatile RAM
(random access memory). This memory circuit 426 stores the
overwritten data, which is input from the data
transmitting/receiving circuit 428 in synchronization with the
clock signal input from the clock reproducing circuit 424.
[0081] The data transmitting/receiving circuit 428 demodulates the
electromagnetic wave signal input from the antenna 422 into data
and then, outputs this demodulated data to the memory circuit 426
in synchronization with the clock signal input from the clock
reproducing circuit 424.
[0082] Also, the data transmitting/receiving circuit 428 changes a
reflection intensity of the electromagnetic wave signal supplied
from an external in accordance with a value of a data input from
the memory circuit 426 in synchronization with the clock signal
when the IC chip 420 transmits the data to the external.
[0083] As described above, the data, which has been stored in the
memory circuit 426, can be transmitted from the IC chip 420 to the
external by changing the intensity of the reflection signal of the
electromagnetic wave signal transmitted from the external to the IC
chip 420.
[0084] In the IC chip IF 24 (FIG. 7), the transmission/reception
control circuit 244 controls an operation of each constituent
component of this IC chip IF 24.
[0085] Also, this transmission/reception control circuit 244
outputs data input from the overwritten-data producing circuit 246
to the modulating circuit 248.
[0086] The modulating circuit 248 modulates a high frequency signal
(radio frequency signal) based on the data input from the
transmission/reception control circuit 242 to produce an
electromagnetic wave signal and then, outputs this produced
electromagnetic wave signal to the transmitting circuit 244.
[0087] The transmitting circuit 244 transmits the electromagnetic
wave signal via the antenna 250 to the IC chip 420. This
electromagnetic wave signal contains data to be stored in the IC
chip 420, and the clock signal.
[0088] The overwritten-data producing circuit 246 produces data,
which will be written into the IC chip 420, and then outputs this
produced data to the transmission control circuit 242.
[0089] For instance, the overwritten-data producing circuit 246
produces data indicating that a data-postprocess has been
completed.
[0090] FIG. 8 is a flow chart for describing an operation (S20) of
the second shredder 3 shown in FIG. 5.
[0091] It should also be understood that processes in FIG. 8, which
are substantially same as those in FIG. 4, are allotted the same
reference numerals.
[0092] In the operations of the shredder 3, when the printing paper
40 is transported in the vicinity of the IC chip IF 24 in the
process of the step S102, the IC chip IF 24 (FIG. 5) rewrites the
data, which has been stored in the IC chip 420 of the printing
paper 40, by using the overwritten data.
[0093] As described above, the technical idea that the data stored
in the IC chip 42 is rewritten by using the overwritten data so
that the secret information cannot be read therefore is suitable
for a case that the IC chip 420 is extracted from the shredded
printing paper 40 so as to be wanted to be reused.
Second Modification
[0094] Alternatively, the shredder 2 may sense as to whether or not
the IC chip 420 has been attached to the printing paper 40, and
when the IC chip 420 is attached to the printing paper 40, an
operation may be applied to the IC chip 420 so that the data stored
in the IC chip 420 cannot be read therefrom.
[0095] FIG. 9 is a diagram for indicating a hardware structure of a
third shredder 5.
[0096] As indicated in FIG. 9, the shredder 5 employs a structure
in which an IC chip IF 24 is additionally provided in an upper
stream of the discharge unit 20 of the shredder 2.
[0097] The IC chip IF 24 is one example of a sensing unit for
sensing as to whether or not the IC chip 420 is present. This IC
chip IF 24 may sense as to whether or not the IC chip 420 is
present by communicating with the IC chip 420.
[0098] It should also be noted that constituent components of the
shredder 5, which are substantially same as those of the shredder
2, are allotted the same reference numerals.
[0099] FIG. 10 is a diagram for schematically showing an
arrangement of the IC chip IF 24 shown in FIG. 9.
[0100] As shown in FIG. 10, the IC chip IF 24 includes a
transmitting circuit 244, a receiving circuit 245, a
transmission/reception control circuit 243, a demodulating circuit
247, and a modulating circuit 248.
[0101] It should be understood that the transmitting circuit 244,
the modulating circuit 248, and the antenna 250 are substantially
identical to those shown in FIG. 7.
[0102] The transmission/reception control circuit 243 controls an
operation of each constituent component of the IC chip IF 24.
[0103] Also, the transmission/reception control circuit 243 outputs
to the control apparatus 12 (FIG. 9) , data, which has been
received by the receiving circuit 245 and then has been demodulated
by the demodulating circuit 247. This demodulated data may
indicates as to whether or not the IC chip 420 is present,
identification information of the IC chip 420, identification
information of data contained in the IC chip 420, or the like.
[0104] It should also be noted that the control apparatus 12
determines as to whether or not the discharge unit 20 (FIG. 9) is
made to operate based on the data input from the
transmission/reception control circuit 243 (this data indicates as
to whether or not the IC chip 420 is present, identification
information of the IC chip 420, identification information of data
contained in the IC chip 420, or the like) . Then, the control
apparatus 12 controls the discharge unit 20.
[0105] The transmitting circuit 244 supplies an electromagnetic
wave signal containing a clock signal and the like via the antenna
250 to the IC chip 420.
[0106] The receiving circuit 245 receives a reflection signal
reflected from the IC chip 420, and outputs the received signal to
the demodulating circuit 247.
[0107] The demodulating circuit 247 demodulates the data
transmitted from the IC chip 420 in response to a change of the
reflection signal input from the receiving circuit 245 and then,
outputs the demodulated data to transmission/reception control
circuit 243.
[0108] With the above described structure, when the control
apparatus 12 receives the notification that the IC chip 420 is
sensed from the IC chip IF 24, this control apparatus 12 controls
the discharge unit 24 to commence the discharging process. In other
cases than the above described case, the control apparatus 12
prohibits the discharge unit 20 from performing the discharging
process.
[0109] As described above, since the third shredder 5 of this
second modification commences the discharge process only when the
IC chip 420 is sensed, the control apparatus 12 can prohibit the
discharge process with respect to the printing paper to which the
IC chip 420 is not been attached to reduce the power
consumption.
Other Modifications
[0110] The shredder 2 (FIG. 2) destroys the IC chip 420 by using
the non-contact discharge such as the corona discharge.
Alternatively, either an electric conductive brush or an electric
conductive roller may be directly contacted to the printing paper
40 to charge this printing paper 40. Thereby, the IC chip 420
attached to the printing paper 40 can be destroyed.
[0111] Also, when the data storage device attached to the printing
paper 40 is a magnetic recording apparatus, the discharge unit 20
of the shredder 2 shown in FIG. 2 may be replaced with a magnetic
field generating unit for generating a high magnetic field. This
magnetic field generating unit may expose the magnetic recording
device attached to the printing paper 40 to the high magnetic field
so as to destroy the data recorded on this magnetic recording
apparatus.
[0112] shredding cutters are arranged to have a narrow gap
therebetween in comparison with the size of the IC chip so that the
IC chip is cut (destroyed) physically or mechanically.
[0113] In a still another embodiment, rollers made of a
comparatively hard material may be added to the shredding
apparatus. The rollers may be arranged to contact with each other.
With this configuration, when a printing paper to which the IC chip
is attached passes through between the rollers, a pressure by the
rollers can destroy the IC chip physically (mechanically). As
described above, in accordance with the shredder apparatus and the
shredding method according to the invention, when the image display
member to which the data storage device is attached is discarded,
the data stored in this data storage device can be destroyed.
* * * * *