U.S. patent application number 11/571355 was filed with the patent office on 2008-03-06 for thermoelectric refrigerating modules.
Invention is credited to Yaosheng Wen.
Application Number | 20080053108 11/571355 |
Document ID | / |
Family ID | 36497727 |
Filed Date | 2008-03-06 |
United States Patent
Application |
20080053108 |
Kind Code |
A1 |
Wen; Yaosheng |
March 6, 2008 |
Thermoelectric Refrigerating Modules
Abstract
The present invention relates to a thermoelectric refrigeration
module, comprising a TEC refrigerating piece (8) having a top
surface and a bottom surface, a radiator (16) closely contacted to
the bottom surface of the TEC refrigerating piece (8), and a cold
eliminator (18) including a brick body (4) having a bottom surface
adhered to the top surface of the TEC refrigerating piece (8),
characterized in that a thermal insulation frame structure (7) is
disposed between the radiator (16) and the cold eliminator (18);
the brick body of the cold eliminator and the TEC refrigerating
piece are located within thermal insulation frame structure (7);
the radiator and the cold eliminator are connected to the thermal
insulation frame structure (7) via a connecting piece respectively;
the cold eliminator has an end portion at which a plurality of cold
aluminum fins are provided; a locating frame structure (1) having
an inside frame, within which the end portion of the cold
eliminator is located, is provided; the inside frame of the
locating frame (1), the cold eliminator (18), and the thermal
insulation frame structure (7) are sealed by a sealing device; and
the locating frame structure provides a plurality of screw rods at
sides thereof. The cold eliminator according to the present
invention together with the TEC refrigeration piece is located
within the thermal insulation frame structure which improves the
refrigerating effect of the refrigeration piece.
Inventors: |
Wen; Yaosheng; (Guangdong,
CN) |
Correspondence
Address: |
THELEN REID BROWN RAYSMAN & STEINER LLP
2225 EAST BAYSHORE ROAD
SUITE 210
PALO ALTO
CA
94303
US
|
Family ID: |
36497727 |
Appl. No.: |
11/571355 |
Filed: |
December 20, 2004 |
PCT Filed: |
December 20, 2004 |
PCT NO: |
PCT/CN04/01477 |
371 Date: |
December 27, 2006 |
Current U.S.
Class: |
62/3.7 |
Current CPC
Class: |
F25B 2321/0251 20130101;
F25B 21/02 20130101; F25B 2321/023 20130101 |
Class at
Publication: |
062/003.7 |
International
Class: |
F25B 21/02 20060101
F25B021/02 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 24, 2004 |
CN |
200420095575.8 |
Claims
1. A thermoelectric refrigeration module, comprising a TEC
refrigerating piece having a top surface and a bottom surface, a
radiator closely contacted to the bottom surface of the TEC
refrigerating piece, and a cold eliminator including a brick body
having a bottom surface adhered to the top surface of the TEC
refrigerating piece, characterized in that a thermal insulation
frame structure is disposed between the radiator and the cold
eliminator; the brick body of the cold eliminator and the TEC
refrigerating piece are located within thermal insulation frame
structure; the radiator and the cold eliminator are connected to
the thermal insulation frame structure via a connecting piece
respectively; the cold eliminator has an end portion at which a
plurality of cold aluminum fins are provided; a locating frame
structure having an inside frame, within which the end portion of
the cold eliminator is located, is provided; the inside frame of
the locating frame, the cold eliminator and the thermal insulation
frame structure are sealed by a sealing device; and the locating
frame structure provides a plurality of screw rods at sides
thereof.
2. The thermoelectric refrigeration module according to claim 1,
characterized in that the thermal insulation frame structure
provides by injection molding a plastic guide rod having a threaded
portion therein, the radiator and the cold eliminator are
respectively connected to the thermal insulation frame structure by
screws being screwed up to the threaded portion, and plastic
spacers are provided between the screws and the radiator and the
cold eliminator.
3. The thermoelectric refrigeration module according to claim 1,
characterized in that the sealing device comprises a silicone
rubber sealing ring and a plastic support frame providing a groove
formed along the periphery thereof to receive the silicone rubber
sealing ring.
4. The thermoelectric refrigeration module according to claim 3,
characterized in that the radiator comprises a base at which a
plurality of recesses in parallel are provided, and a plurality of
radiating fins each having an end portion which is inserted into
one of the plurality of recesses to fix the same to the base.
5. The thermoelectric refrigeration module according to claim 4,
characterized in that the radiator further comprises an air guide
plate having a U-shaped profile, and the U-shaped air guide plate
houses another end portion of each of the radiating fins such that
a plurality of air channels for heat radiating are formed among the
U-shaped air guide plate, the base and the radiating fins.
6. The thermoelectric refrigeration module according to claim 2,
characterized in that the sealing device comprises a silicone
rubber sealing ring and a plastic support frame providing a groove
formed along the periphery thereof to receive the silicone rubber
sealing ring.
7. The thermoelectric refrigeration module according to claim 6,
characterized in that the radiator comprises a base at which a
plurality of recesses in parallel are provided, and a plurality of
radiating fins each having an end portion which is inserted into
one of the plurality of recesses to fix the same to the base.
8. The thermoelectric refrigeration module according to claim 7,
characterized in that the radiator further comprises an air guide
plate having a U-shaped profile, and the U-shaped air guide plate
houses another end portion of each of the radiating fins such that
a plurality of air channels for heat radiating are formed among the
U-shaped air guide plate, the base and the radiating fins.
Description
TECHNICAL FIELD OF THE INVENTION
[0001] The present invention relates to a thermoelectric
refrigeration module for a refrigeration apparatus and belongs to
the technical field of refrigeration.
BACKGROUND OF THE INVENTION
[0002] Thermoelectric refrigeration technology is also referred to
as semiconductor refrigeration technology or temperature difference
electric refrigeration technology. Thermoelectric refrigeration
achieves a refrigeration effect by means of a thermoelectric effect
of special semiconductor materials. A core for this technique is
utilizing a thermoelectric chip (TEC). A conventional TEC has a
width of 40 mm, a length of 40 mm and a thickness of 5 mm. After a
thermoelectric refrigeration chip is electrified, one side surface
of the refrigeration chip will absorb heat and the other side
surface thereof will emit heat. A thermoelectric refrigeration
module is obtained by mounting a plurality of heat-emitting fins to
the two sides of a TEC.
[0003] Usually TEC fails to operate efficiently and reasonably due
to an improper assembly and arrangement in an object. TEC shall be
assembled by a person with high professional knowledge. Since the
heat and cold side surfaces of the TEC are made from ceramic, while
it is equipped to an object, it needs the strict requirements for a
pressure to apply to, flatness and smoothness of contact surfaces
of the object, selection of heat dissipation coefficients of the
heat and cold side surfaces and thermal insulation of the object.
If one of the requirements is not met, the total refrigeration
effect will be reduced.
[0004] Most of the existing refrigeration modules mainly consist of
a thermoelectric refrigeration chip, a heat dissipation aluminum
body, an aluminum brick and a cold dissipation aluminum body. The
heat dissipation aluminum body is mounted to the heat side surface
of the TEC, and the aluminum brick and the cold dissipation
aluminum body are mounted in turn to the cold side surface of the
TEC. Refrigeration performance of a refrigeration structure is
subject to the insulation effect between the heat and cold side
surfaces in addition to a thermoelectric performance of the TEC
itself and a heat dissipation effect of the heat side surface.
Since a distance between the heat and cold side surfaces of the TEC
is only 4-5 mm while a temperature difference between the heat and
cold side surfaces of the TEC can reach up to 40-50.degree. C., a
thermal short will occur between the heat and cold side surfaces
where the insulation performance between the heat and cold side
surfaces is poor. Therefore, an insulation structure shall be
provided for a TEC refrigeration module to improve the
refrigeration performance.
[0005] As shown in FIG. 1, most of the existing thermoelectric
refrigeration insulation structures comprise a thermal insulation
foaming layer structure. The thermal insulation foaming layer
structure comprises a heat side plastic housing a21, a cold side
plastic housing a22 and a thermal insulation foaming layer a23. A
refrigeration structure (chip) is mounted within a mounting hole of
the thermal insulation foaming layer structure. However, this
structure has the following shortcomings.
[0006] Firstly, the plastic housings themselves can conduct heat.
When the cold side plastic housing a22 is connected to the heat
side plastic housing a21, because the contact area between the heat
and cold side surfaces can reach up to 100 cm.sup.2 but the
distance between the heat and cold side surfaces is normally only
about 4-5 cm, and also because the thermal conductive coefficient
of some plastic is 0.2, the insulation performance will be
affected. Further, since the refrigeration structure is arranged
within the mounting hole providing gaps in which air can fill to
conduct heat.
[0007] Secondly, since the heat dissipation aluminum body a11 and
the cold dissipation aluminum body a12 are directly fastened to the
aluminum brick a14 by fastening screws a13 and the fastening screws
a13 are separated from the heat dissipation aluminum body a11 and
the cold dissipation aluminum body a12 only by spacers a16, the
fastening screws a13 become thermal conductive media which
counterbalance the thermal potential difference between the heat
side and the cold side surfaces of the TEC a1.
[0008] In addition, since an interface between the cold dissipation
aluminum body a12 and the cold side plastic housing a22 is only
sealed by sponge a15, when the TEC module works, condensed water
will permeate into the sponge a15 and come into gaps of the cold
dissipation aluminum body a12, resulting in heat-transferring
between the heat and cold side surfaces by means of the condensed
water, which indirectly counterbalances the thermal potential
difference between the cold and heat side surfaces reducing the
refrigeration effect.
[0009] The shortcomings of the insulation structure of the existing
TEC module in the art mentioned above significantly affect the
refrigeration effect thereof.
SUMMARY OF THE INVENTION
[0010] A technical problem to be solved in the present invention,
i.e. an object of the present invention, is to provide a
thermoelectric refrigeration module improving the refrigeration
effect.
[0011] In order to solve the technical problem of the present
invention, a thermoelectric refrigeration module is provided, which
comprises a TEC refrigerating piece; a radiator; a cold eliminator;
and the TEC refrigerating piece having a top surface adhered to a
bottom surface of a brick body of the cold eliminator, and a bottom
surface closely contacting the radiator, wherein between the
radiator and the cold eliminator is provided a thermal insulation
frame structure, within which the brick body of the cold eliminator
together with the TEC refrigerating piece is positioned, both the
radiator and the cold eliminator are connected to the thermal
insulation frame structure via a connecting piece respectively, the
cold eliminator provides an end portion at which a plurality of
cold aluminum fins are provided, the end portion is located within
an inside frame of a locating frame structure, the inside frame is
respectively sealed by a sealing device to the cold eliminator and
the thermal insulation frame structure, and a plurality of screw
rods are provided at the locating frame structure along sides
thereof.
[0012] Embodiments according to the present invention can be
provided as follows.
[0013] The thermal insulation frame structure provides by injection
molding a plastic guide rod having a threaded portion, to which the
radiator and the cold eliminator are connected by screws, and a
plastic spacer is provided between the screws and the radiator and
the cold eliminator.
[0014] The sealing device comprises a silicone rubber sealing ring
and a plastic support frame providing a groove formed along the
periphery thereof to receive the silicone rubber sealing ring.
[0015] The radiator comprises a base at which a plurality of
recesses in parallel are provided, and a plurality of radiating
fins, each, with an end portion, being inserted into one of the
recesses, thereby fixing the end portion to the base.
[0016] The radiator further comprises an air guide plate having a
U-shaped profile, which houses another end portion of the plurality
of radiating fins so that a plurality of heat radiating channels
are formed among the air guide plate, the base and the plurality of
radiating fins.
[0017] The present invention has the following prominent technical
effects:
[0018] 1. Since the brick body of the cold eliminator according to
the present invention together with the TEC refrigerating piece is
located in the thermal insulation frame structure, this causes that
the thermal conduction between the heat or cold side surface of the
TEC refrigerating piece and the outside can be carried out only via
the brick body of the cold eliminator and the radiator. Further,
the thermal insulation frame structure has such a height that a
thermal short between the heat and cold side surfaces of the TEC
refrigerating piece can be avoided in a relative long distance so
that the refrigerating effect of the TEC refrigerating piece is
improved.
[0019] 2. The radiator and the cold eliminator according to the
present invention are connected to the thermal insulation frame
structure via a connecting piece respectively and the thermal
insulation frame structure has the thermal insulation function. As
a result, direct or indirect thermal conduction occurring between
the cold eliminator and connecting pieces connected thereto or
between the radiator and connecting pieces connected thereto in the
prior art can be eliminated and the refrigerating efficiency of the
TEC refrigerating piece can be increased, which helps improve the
refrigerating effect of the TEC refrigeration module.
[0020] 3. Since the inside frame of the locating frame structure,
the cold eliminator, and the thermal insulation frame structure are
sealed by a sealing device which can prevent permeation of
condensed water, the thermal conduction between the radiator and
the cold eliminator through condensed water can be prevented, which
helps improve the refrigerating effect of the TEC refrigeration
module.
[0021] 4. Since a plurality of recesses in parallel are provided at
the base of the radiator and a plurality of radiating fins are
inserted into the recesses with one end portion to fix the same to
the base, such a structure makes the fins greatly thinned so that
more radiating fins can be mounted to the base to increase the area
of thermal radiation. Consequently, heat radiation efficiency of
the radiator can be improved.
[0022] 5. The TEC module according to the present invention can be
applied to various products flexibly and be assembled easily
thereto. Where the module according to the present invention is
applied to a product, the product only needs to be pre-provided
with corresponding mounting holes to fix the locating frame
structure of the invention. Further, the requirements for mounting
the module of the invention to a product are not strict so that the
product can be volume-produced in pipelining.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] FIG. 1 is a schematic diagram of the structure of a
refrigeration module in the prior art;
[0024] FIG. 2 is a section diagram of the structure of one
embodiment according to the present invention;
[0025] FIG. 3 is an enlarged diagram of the structure of a sealing
device in the embodiment as shown in FIG. 2 according to the
present invention; and
[0026] FIG. 4 is an exploded diagram of an embodiment according to
the present invention.
EMBODIMENTS OF THE INVENTION
[0027] The present invention will be described in detail in
connection with the following preferred embodiments with reference
to the companying drawings.
[0028] FIGS. 2, 3 and 4 show an embodiment according to the present
invention. As shown in FIG. 2, a refrigeration module of the
embodiment comprises a TEC refrigeration piece 8 having a top
surface and a bottom surface, a radiator 16 and a cold eliminator
18 including a brick body 4 with a bottom surface. The top surface
of the TEC refrigeration piece 8 is adhered to the bottom surface
of the brick body 4, and the bottom surface of the TEC
refrigeration piece 8 is closely contacted to the cold eliminator
18. The radiator 16 comprises a base 10, a plurality of radiating
fins 15 each having an end portion and a top portion, and an air
guide plate 13 with a U-shaped profile. The base 10 provides a
plurality of recesses 19 in parallel. The end portions of the
plurality of radiating fins 15 are inserted into the respective
recesses so that the end portions are fixed to the base 10. The top
portions of the radiating fins 15 are housed within the U-shaped
air guide plate 13 so that a plurality of air channels for heat
radiating are formed among the U-shaped air guide plate 13, the
base 10 and the radiating fins 15. A fan for radiating heat may be
mounted to one end of the plurality of air channels for heat
radiating.
[0029] As shown in FIGS. 2 and 4, a thermal insulation frame
structure 7 is disposed between the radiator 16 and the cold
eliminator 18. The brick body 4 of the cold eliminator 18 together
with the TEC refrigeration piece 8 is located within the thermal
insulation frame structure 7. The radiator 16 and the cold
eliminator 8 are connected to the thermal insulation frame
structure 7 via connecting pieces respectively. The thermal
insulation frame structure 7 provides by injection molding plastic
guide rods 9 having threaded portions 14. The radiator 16 and the
cold eliminator 18 are connected to the thermal insulation frame
structure 7 respectively by fastening screws 2, 12 that are screwed
up to the threaded portions 14. Plastic spacers 3 are provided
between the screws and the radiator 16 or the cold eliminator 18,
and plastic spacers 11 are provided between the screws 12 and the
cold eliminator 18.
[0030] A locating frame structure 1 can be provided in the
invention, which includes an inside frame. An end portion of the
cold eliminator 18 to which cold aluminum fins are provided is
located within the inside frame of the locating frame 1. The inside
frame of the locating frame structure, the cold eliminator, and the
thermal insulation frame are sealed by a sealing device. The
sealing device comprises a silicone rubber sealing ring 6, and a
plastic support frame 5 providing a groove formed along the
periphery thereof to receive the silicone rubber sealing ring 6.
The inside frame of the locating frame is pressed onto the sealing
ring 6. A plurality of screw rods 17 can be provided at sides of
the locating frame 1 to fix the module of the present invention to
an object.
[0031] When a refrigeration module in the prior art is applied to a
product with a volume of 30 L, a temperature difference between the
inside and outside is generally lower than 20.degree. C., whereas a
temperature difference can reach 32.degree. C. where the module
described above according to the invention is applied to a product
having a volume of 30 L.
* * * * *