U.S. patent application number 11/784932 was filed with the patent office on 2008-02-28 for integrated circuit tampering protection and reverse engineering prvention coatings and methods.
This patent application is currently assigned to Rockwell Collins, Inc.. Invention is credited to Alan P. Boone, Nathan P. Lower, Ross K. Wilcoxon.
Application Number | 20080050512 11/784932 |
Document ID | / |
Family ID | 39113782 |
Filed Date | 2008-02-28 |
United States Patent
Application |
20080050512 |
Kind Code |
A1 |
Lower; Nathan P. ; et
al. |
February 28, 2008 |
Integrated circuit tampering protection and reverse engineering
prvention coatings and methods
Abstract
A method of protecting an electronics package is discussed along
with devices formed by the method. The method involves providing at
least one electronic component that requires protecting from
tampering and/or reverse engineering. Further, the method includes
mixing into a liquid glass material at least one of high durability
micro-particles or high-durability nano-particles, to form a
coating material. Further still, the method includes depositing the
coating material onto the electronic component and curing the
coating material deposited.
Inventors: |
Lower; Nathan P.; (North
Liberty, IA) ; Boone; Alan P.; (Swisher, IA) ;
Wilcoxon; Ross K.; (Cedar Rapids, IA) |
Correspondence
Address: |
ROCKWELL COLLINS, INC.;Attention: Kyle Eppele M/S 124-323
400 Collins Rd. NE
Cedar Rapids
IA
52498
US
|
Assignee: |
Rockwell Collins, Inc.
Cedar Rapids
IA
|
Family ID: |
39113782 |
Appl. No.: |
11/784932 |
Filed: |
April 10, 2007 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
11508403 |
Aug 23, 2006 |
|
|
|
11784932 |
|
|
|
|
Current U.S.
Class: |
427/58 ;
257/E21.503; 257/E23.118; 257/E23.121 |
Current CPC
Class: |
H01L 2224/8192 20130101;
H01L 2924/00014 20130101; H01L 24/48 20130101; H01L 2924/181
20130101; H01L 2924/181 20130101; H01L 2924/15311 20130101; H01L
24/73 20130101; H01L 2924/00011 20130101; H01L 2924/01068 20130101;
H01L 2224/73265 20130101; H01L 21/563 20130101; H01L 2924/14
20130101; H01L 23/573 20130101; H01L 2224/8592 20130101; H01L
2924/00011 20130101; H01L 2224/16225 20130101; H01L 2924/14
20130101; H01L 23/291 20130101; H01L 2924/00014 20130101; H01L
23/295 20130101; H01L 2224/48227 20130101; H01L 2924/01004
20130101; H01L 2224/32225 20130101; H01L 2924/00014 20130101; H01L
2924/10253 20130101; H01L 2924/15311 20130101; H01L 23/3128
20130101; H01L 2924/15311 20130101; H01L 2924/10253 20130101; H01L
2924/00 20130101; H01L 2224/0401 20130101; H01L 2924/00012
20130101; H01L 2224/32225 20130101; H01L 2224/73265 20130101; H01L
2924/00012 20130101; H01L 2224/16225 20130101; H01L 2224/48227
20130101; H01L 2224/73204 20130101; H01L 2924/00012 20130101; H01L
2224/48227 20130101; H01L 2224/32225 20130101; H01L 2224/45099
20130101; H01L 2924/00 20130101; H01L 2224/0401 20130101; H01L
2224/32225 20130101; H01L 2224/48227 20130101; H01L 2924/00
20130101; H01L 2224/32225 20130101; H01L 2924/00 20130101; H01L
2224/73203 20130101; H01L 2924/09701 20130101; H01L 2224/73265
20130101; H01L 2924/0102 20130101; H01L 2224/73204 20130101; H01L
2224/73265 20130101 |
Class at
Publication: |
427/58 |
International
Class: |
B05D 5/12 20060101
B05D005/12 |
Claims
1. A method of protecting an electronics package, comprising:
providing at least one electronic component; mixing into a liquid
glass material at least one of high durability micro-particles or
high-durability nano-particles, to form a coating material;
depositing the coating material onto the electronic component; and
curing the coating material deposited.
2. The method of protecting an electronics package of claim 1,
wherein the glass coating comprises alkali silicate glass.
3. The method of protecting an electronics package of claim 1,
further comprising: mixing a solvent with the liquid glass
material.
4. The electronic package of claim 3, wherein the ratio of solvent
to glass material is at least 3 to 1
5. The electronic package of claim 3, wherein the ratio of solvent
to glass material is at least 4 to 1
6. The electronic package of claim 3, wherein the ratio of solvent
to glass material is at least 5 to 1.
7. The electronic package of claim 3, wherein the solvent comprises
water.
8. The electronic package of claim 1, wherein the coating comprises
thermally conductive particles.
9. The electronic package of claim 1, wherein the electronics
package comprises a wirebond.
10. A method of forming a protected electronics package,
comprising: providing at least one electronic component; mixing an
alkali silicate material with a solvent; mixing into the alkali
silicate material at least one of high durability micro-particles
or high-durability nano-particles, to form a coating material;
depositing the coating material onto the electronic component; and
curing the alkali silicate material to form a coated electronics
package, wherein the coated electronics package resists tampering
and reverse engineering of the electronic component.
11. A method of claim 10, wherein the alkali silicate material
comprises alkali silicate glass.
12. A method of claim 10, wherein the solvent comprises deionized
water.
13. A method of claim 10, wherein the curing is carried out at room
temperature.
14. A method of claim 10, wherein the curing is carried out at an
elevated temperature.
15. A method of claim 14, wherein the elevated temperature is
approximately 90 to 150 degrees C.
16. A method of claim 10, wherein the coating material forms an
opaque coating.
17. An electronics device, comprising: a substrate; at least one
electronic component coupled to the substrate; and a low curing
temperature glass coating encasing at least a portion of at least
one electronic component, the low curing temperature glass coating
including at least one of high durability micro-particles or
high-durability nano-particles.
18. The electronics package of claim 17, wherein the glass coating
is formed by diluting alkali silicate glass in a solvent.
19. The electronics package of claim 18, wherein the solvent
comprises water.
20. The electronics package of claim 18, wherein, the coated
electronic component of the electronics device resists tampering
and reverse engineering of the electronic component.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part of U.S.
application Ser. No. 11/508,403, entitled INTEGRATED CIRCUIT
PROTECTION AND RUGGEDIZATION COATINGS AND METHODS, by Lower et al.,
filed on Aug. 23, 2006, the entirety of which is herein
incorporated by reference.
BACKGROUND
[0002] The invention generally relates to applications of coatings
for integrated circuits or other electronics packages. The
invention also relates generally to methods of using such coatings
to prevent reverse engineering of integrated circuits and other
electronics packages.
[0003] Conventionally, integrated circuits are designed for use in
relatively benign environments such as desktop PC's, cell phones,
and the like. When these integrated circuit technologies are used
in more demanding environments such as avionics they may experience
excessively high failure rates due to the higher operating
temperature, corrosion, etc. In addition, due to the sensitive
nature of the information that may be stored on these components,
it may be necessary to protect these devices from reverse
engineering in the event that a system containing them were to fall
into unfriendly hands. Modifying integrated circuits to improve
their thermal performance, corrosion resistance, and tamper
resistance is typically very expensive and can be detrimental to
reliability.
[0004] Therefore, what is needed is a low-cost, simple method for
making commercial integrated circuits resistant to tampering and
reverse engineering. Further, what is needed is a low-cost simple
method whereby reverse engineering of proprietary or secretive
circuits or electronics packages is rendered difficult, impossible
or nearly impossible by a coating applied to the circuit or
electronics package.
[0005] The techniques herein below extend to those embodiments
which fall within the scope of the appended claims, regardless of
whether they accomplish one or more of the above-mentioned
needs.
SUMMARY
[0006] What is provided is a method of protecting an electronics
package. The method includes providing at least one electronic
component. The method also includes the use of a low temperature
curing alkali silicate (liquid glass) solution. Further, the method
includes mixing into the alkali silicate material at least one of
high durability micro-particles or high-durability nano-particles,
to form a coating material. Further still, the method includes
depositing the coating material onto the electronic component. Yet
further still, the method includes curing the coating material
deposited.
[0007] What is also provided is a method of forming a protected
electronics package. The method includes providing at least one
electronic component. The method also includes the use of an alkali
silicate material. Further, the method includes mixing into the
alkalai silicate material at least one of high durability
micro-particles or high-durability nano-particles, to form a
coating material. Further still, the method includes depositing the
coating material onto the electronic component. Yet further still,
the method includes curing the alkali silicate material to form a
coated electronics package. The coated electronics package resists
tampering and reverse engineering of the electronic component.
[0008] What is also provided is an electronics device. The
electronic device includes a substrate and at least one electronic
component coupled to the substrate. The electronic device also
includes a low curing temperature glass coating encasing at least a
portion of at least one electronic component. The low curing
temperature glass coating including at least one of high durability
micro-particles or high-durability nano-particles.
[0009] Alternative exemplary embodiments relate to other features
and combination of features as may be generally recited in the
claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] A better understanding of the features and advantages of the
present invention will be obtained by reference to the following
detailed description that sets forth illustrative embodiments by
way of example only, in which the principles of the invention are
utilized, and the accompanying drawings, of which:
[0011] FIG. 1 is an exemplary embodiment of the reaction of silica
onto metal, glass, or ceramic surfaces;
[0012] FIG. 2 is an exemplary graph of resultant performance of the
thermal properties of alkali silicate glass composites.
[0013] FIGS. 3-8 depict exemplary embodiments of various coating
configurations for microelectronic packages.
[0014] FIG. 9 is an exemplary process diagram in accordance with an
exemplary embodiment.
[0015] FIG. 10 is an exemplary process diagram in accordance with
an exemplary embodiment.
DETAILED DESCRIPTION
[0016] Before describing in detail the particular improved system
and method, it should be observed that the invention includes, but
is not limited to a novel structural combination of conventional
data/signal processing components and communications circuits, and
not in the particular detailed configurations thereof. Accordingly,
the structure, methods, functions, control and arrangement of
conventional components and circuits have, for the most part, been
illustrated in the drawings by readily understandable block
representations and schematic diagrams, in order not to obscure the
disclosure with structural details which will be readily apparent
to those skilled in the art, having the benefit of the description
herein. Further, the invention is not limited to the particular
embodiments depicted in the exemplary diagrams, but should be
construed in accordance with the language in the claims.
[0017] In accordance with an exemplary embodiment, low processing
temperature hermetic glass coatings for microelectronics packaging
are desirable for hermetically sealing the packaging as well as
providing resistance to any one or any combination of tampering,
reverse engineering, corrosion and high temperature. These glass
coatings are applied and cured at low temperatures, typically
around or below 120.degree. C. and produce tightly adhering
hermetic (water impermeable) coatings capable of withstanding very
high temperatures, theoretically up to .about.700.degree. C. These
glass coatings may be composed of alkali silicate glass with
nanoparticle and or microparticle modifiers, including, but not
limited to, alkaline earth carbonates or oxides, metal oxides,
rare-earth metal oxides, and non-metal oxides. Aqueous alkali
silicate composite solutions applied on or between surfaces of
materials, dry to form tough, tightly adhering inorganic bonds that
exhibit many desirable characteristics.
[0018] Other particles such as but not limited to diamond, aluminum
nitride, and other inorganics may also be combined with aqueous
alkali silicate based solutions and cured to form very hard and
durable composites. Varying combination and concentrations of the
various particles allows the production of composites with specific
thermal expansion, durability, and adhesion properties. These
composites have been shown to bond very well to integrated circuit
materials, including but not limited to silicon, silica, silicon
nitride, metals, and other inorganics. These alkali silicate glass
coatings are very hard and corrosion resistant, making them
extremely difficult to remove. Accordingly, it is desirable to add
micro- and nano-particles to create a very hard glass composite
coating that is difficult, impossible, or nearly impossible to
mechanically remove without damaging the underlying integrated
circuit. Therefore, many applications exist for utilizing these
composites for reverse engineering protection of integrated
circuits and/or electronics packages.
[0019] In accordance with exemplary embodiments, the micro- or
nano-particles may include but are not limited to those mentioned
above as well as boron nitride, silicon carbide, high durability
ceramics, non-metallics, different types of glass particles. When
these or other durable, high hardness particles are added to the
glass, the coating becomes exceptionally durable. Without the
particles in the coating the coating may be potentially etched
away. The addition of the particles can provide near the durability
of the particles in the coating.
[0020] Generally, alkali silicate glasses are produced by fusing
varying portions of sand (SiO.sub.2) and alkali metal carbonate
(M.sub.2CO.sub.3) or oxide (M.sub.2O), at high temperatures,
between 1000-1500.degree. C. The resulting product, upon cooling
from its molten state, is an amorphous glass that can, under the
appropriate processing conditions (temperature and pressure), be
dissolved into water to produce liquid alkali silicate solutions.
The solution can be further modified by the addition of metal
hydroxides and or silica. In accordance with an exemplary
embodiment the glass solutions may be mixed with deionized water.
The proportion of SiO.sub.2 to M.sub.2O is typically defined as the
weight ratio. The solution viscosity can be controlled by the
concentration of water.
[0021] Alkali silicates, in general, are economical,
environmentally friendly chemicals which have been used to protect
a variety of materials from the corrosive effects of water. These
chemicals are classified as corrosion inhibitors because they can
deposit protective silicate rich films, isolating materials from
corrosive attack. Additionally, they raise the pH of water which
can make it less corrosive to metals. Studies have shown that
alkali silicates are reactive with cationic metals and metal
surfaces. This is the basis by which silicates inhibit corrosion,
as illustrated in FIG. 1. Although alkali silicates have been used
to protect materials from corrosion, alkali silicates have not been
applied to protecting microelectronics, because in standard, off
the shelf configuration, they may not cure appropriately and may
not exhibit resultant properties which are desirable for protecting
microelectronics in harsh environments.
[0022] Liquid alkali silicate solutions are commercially available
in a variety of SiO.sub.2/M.sub.2O ratios. Typically, ratios of
3.25 down to 1 are readily available in aqueous or powder form.
Highly siliceous liquid alkali silicate solutions tend to air dry
rapidly, are the most refractory (high melting temperature), and
are the most resistant to acids and corrosion. These silica rich
liquid solutions tend to contain more water than the alkaline rich
solutions (per similar viscosity), and thus undergo greater
shrinkage while curing. Low ratio, alkaline rich, solutions tend to
have greater elasticity, lower brittleness, and less shrinkage but
may exhibit poor corrosion resistance. These low ratio coatings
also dry more slowly because their alkali content creates a greater
affinity for water. Many chemically resistant cements and mortars
are produced using high ratio (N.about.3.25) alkali silicate
solutions. In order for the silicate coatings to become impermeable
and relatively insoluble, water must be completely removed. Air
drying alone is usually not adequate for coatings which will be
exposed to weather or high moisture environments. For these
applications heat curing is often needed. Curing temperatures
between 95 and 120.degree. C. are often sufficient for adequate
dehydration.
[0023] It may be desirable to use highly corrosion resistant
coatings in microelectronics packaging. While off-the-shelf alkali
silicate solutions applied and processed in an appropriate manner
could potentially provide a temporary hermetic barrier for
microelectronic devices, they may not hold up in harsh testing
environments, such as those produced during Highly Accelerated
Stress Testing (HAST). In order to produce highly corrosion
resistant coatings, modifiers must be added to the base alkali
silicate solutions. Studies have shown that adding colloidal
silicon dioxide to liquid alkali silicates can produce coatings
that are comparable to that of current chromium based passivation,
as characterized by salt spray testing. The purpose of these
coatings is to protect steel and other metals from environmental
corrosion. While a broad range of alkali silicate compositions may
be used, highly silica rich coatings (R.gtoreq.3.25) are the most
corrosion resistant. These high ratio solutions can be made by
adding additional SiO.sub.2 to the base alkali silicate. However,
these silica rich coatings can crack during the curing process.
This cracking may be avoided by applying the appropriate solution
mixture, thickness, and using an appropriate curing process, all of
which may be application specific. Successful silicate rich
coatings (R.gtoreq.4) have been applied to the surfaces of silicon
die and other inorganic substrates, which can be cured quickly, are
crack free, and possess excellent adhesion strength and durability.
These silica enhanced alkali silicate solutions provide improved
corrosion resistance, but they can be made more corrosion resistant
with the addition of nano- and or micro-particles, such as calcium
carbonate and or zinc oxide. Silicate solutions can react with
calcium to form insoluble calcium-silicate compounds. Similarly,
zinc oxide has been used to produce silicate coatings that are
capable of shedding water. In order to achieve good mixing and
dispersion, nano-sized particles of these constituents may be used
in the coatings described herein. The large surface area per weight
of the nanoparticles helps to maximize silicate glass modification
for improved corrosion resistance of the composite.
[0024] It has been shown that increasing the silicate ratio, for
alkali silicate glass coatings, may lead to cracking in thick
coatings.
[0025] In an exemplary lab test, a particular amount of cracking
was observed in thick 200+ micron silica rich (R=3.22) coatings,
whereas little or no cracking was seen in the alkali rich coatings.
In the silica rich coating, delamination was observed around the
periphery and significant cracking throughout. When this same
solution is applied in the appropriate thickness (several microns
or less), a much stronger, crack free, fast curable coating can be
formed. Such coatings have been applied to copper clad PCB
substrates, aluminum and copper metals, and silicon die. These
coatings are thin (<2 microns), but can be applied in multiple
layers to build up the thickness. It has been observed that even
these very thin coatings can provide a rugged moisture barrier at
high temperatures (.gtoreq.450.degree. C.). The corrosion
protection of silicate coatings applied to copper clad PCB boards
and silicon die have been demonstrated. Also, these coatings can be
adapted for strength and durability to prevent tampering and
reverse engineering.
[0026] When compared with conventional silicon Room Temperature
Vulcanizing (RTV) (polymer) coatings, very little oxidation
protection is seen while the alkali silicate glass coating provided
a hermetic barrier. Also, when properly adapted and applied, these
coatings may exhibit high strength and durability to prevent
tampering and reverse engineering.
[0027] In another exemplary embodiment, silica rich coatings may be
applied to wire bonded dies. The purpose of the coatings is to
prevent galvanic corrosion at the wire bond/pad interface, a
primary failure mechanism in these devices. Preventing this
galvanic corrosion leads to significantly greater reliability and
can potentially eliminate the need for hermetic packaging.
[0028] In an exemplary and non-limiting embodiment, the alkali
silicate glass coated wire bond pads may be formed by applying
alkali silicate solutions onto chip surfaces then curing at
150.degree. C. Multiple layers may be applied to the coated wire
bonds. The result of the coating process has been exemplary shown
that the shear strength of coated joints were up to a 25% stronger
than uncoated joints. Additionally, pull testing has shown no ball
lifts (i.e. there were no separations between ball and pad) in the
testing environment.
[0029] In addition to thin coatings, composites may be made by
mixing the silicate solutions with high thermal conductivity
particles such as aluminum nitride, beryllium oxide, diamond, and
or metals. These coatings have been found to significantly improve
heat transfer when coated over power dissipating devices. For
example, thermal improvements in these coated devices are shown in
FIG. 2.
[0030] Referring to FIG. 2, alkali silicate glass composites have
been applied over power dissipating devices mounted on both
laminate and copper metal substrates. The resulting package
temperatures were reduced by more than 50%, while standard
encapsulants caused device temperatures to increase up to 130%.
[0031] In a further exemplary embodiment, the addition of
nanoparticles to the alkali silicate glass thermal composites
provides additional corrosion resistance.
[0032] In accordance with exemplary embodiments, numerous ways may
be applied in which to provide heat and corrosion resistance to
microelectronics packages. These are detailed below and include but
are not limited to the following:
[0033] Coating bare dies that have been wire bonded or flip chip
attached with a coating to form a hermetic glass barrier over the
electronics. The coated device could then presumably be
encapsulated using standard processing methods. The coating would
be a thin layer of glass (.gtoreq.100 nm) that will provide a
hermetic seal to the die and therefore protect it from corrosive
elements. For example, FIG. 3 depicts a coating applied to a flip
chip and to a wire bonded dies for corrosion and tamper
resistance.
[0034] It may be particularly desirable to add particles to the
coating discussed above to make it opaque and then coating the
solution onto a wire bonded or flip chip die. Thus, the coating
would provide tamper resistance to the device without exposing it
to high processing temperatures. An illustration of this is shown
in FIG. 4 which depicts the coating with opaque filler for the
tamper resistance of wire bonded and flip chip dies. Alternatively,
the solution could also be applied under a flip chip.
[0035] Adding high thermal conductivity particles, such as diamond,
beryllium oxide, and or aluminum nitride to the coating prior to
applying it to a wire bonded or flip chip die. The resulting
coating (or paste) over the die may possess a very high thermal
conductivity without creating an electrically conductive path and
may be applied in conjunction with, or in addition to the high
strength and durability of the coating for anti-tampering and
reverse engineering prevention or resistance. Thus, hot spots on
the die could be easily spread over the entire die surface and
conceivably to the boar to which the component is attached and the
high durability and strength of the coatings will lead to
ant-tampering and anti-reverse engineering properties.
[0036] Using high thermal conductivity "filled" coating solution
for creating low cost thermal bridges between high temperature
components or power dissipating die and thermal sinks. The solution
may be applied and cured at low temperature (.ltoreq.120.degree.
C.). Alternatively, to decrease the cure time, it may be desirable
cure these coatings at high temperatures that are greater than
120.degree. C. High thermal conductivity particles such as aluminum
nitride, beryllium oxide, and or diamond (thermal conductivity near
2000 W/mK) can be used in this application to provide a highly
thermally conducting path and may be applied in conjunction with,
or in addition to the high strength and durability of the coating
for anti-tampering and reverse engineering prevention or
resistance. See FIG. 5 for an exemplary illustration.
[0037] Adding a coefficient of thermal expansion (CTE) matching
filler, such as glass or ceramics, to the coating liquid to
increase the bond layer thickness so that the solution can be used
as an underfill for flip chip devices. This may provide both tamper
resistance protection to the die while improving its thermal cycle
and shock loading reliability as do many other underfills. Another
advantage to this configuration is that these coatings may provide
a high-temperature underfill solution (>700.degree. C.). Current
underfills are limited to relatively low operating temperatures
(.ltoreq.200.degree. C.). An illustration of this is shown in FIG.
6.
[0038] It may also be desirable to use these coatings to create 3D
wire bondable or flip chip stacked IC's. These coatings provide a
unique high-temperature (>200.degree. C.) solution for chip
stacking. The coating bond layer thickness can be made as thin as
100 nm, allowing for the thinnest possible interface formed at low
temperature. The coating bonds are very strong and rigid allowing
the possibility of wire bonding at higher stack levels without
stack compliance (smashing) causing problems. The thinner bonding
layers would decrease thermal resistance, thus improving heat
transfer. High thermal conductivity particles may also be added to
improve heat transfer. The majority of chip or wafer stacking
adhesives are not hermetic, which can lead to corrosion and
degradation of the bonding interface over time. See FIG. 7, for
example. Therefore, because of the high re-melting temperature of
the glass coating, disassembly and reverse engineering of the
electronic component(s) is rendered more difficult.
[0039] These coatings may also be used for applying over high
frequency electronic components to create a low dielectric coating
(Er=3 to 10) to improve RF performance. These devices may then be
encapsulated using standard methods and encapsulants to improve
their reliability and handling characteristics without degrading
their electrical performance. Further, by the addition of certain
particles, increased durability and hence anti-tampering and
anti-reverse engineering properties may be achieved. See FIG. 8 for
an example.
[0040] As discussed briefly above, in accordance with an exemplary
embodiment, micro- and nano-particles can be added to an alkalai
silicate solution to make it opaque. The solution can then be
coated onto a wirebonded die using a low curing temperature (for
example .about.110.degree. C.). Once the material has been cured,
the material will be nearly impossible to remove without etching or
mechanically damaging the underlying integrated circuit. Thus, the
wirebonded die will be nearly impossible to remove, due to its
exceptional adhering properties or to see through the coating to
the die because of the opacity of the coating. The cured alkali
silica glass may sufficiently be well bonded to the die such that
attempting to remove it from the die will irreversibly damage it.
For example, an attempt to dice or cleave the coating would lead to
damage of the integrated circuit due to the hardness of the
particle fillers contained within the composite. One particular
advantage of the glass composites discussed is that they provide
reverse engineering and tamper resistance without exposing the
device to high curing temperatures.
[0041] Referring now to FIG. 10, a process 1000 of protecting an
electronics package includes providing at least one electronic
component that requires protection against tampering and/or reverse
engineering as well as other outside factors (process 1010).
Process 1000 also includes mixing a low temperature curing glass
material with a solvent, to form a liquid glass material (process
1020). In order to change the properties of the coating the process
includes mixing into the liquid glass material at least one of high
durability micro-particles or high-durability nano-particles, to
form a coating material (process 1030). The coating material is
deposited onto the electronic component (process 1040). The coating
material is then cured to form a hardened coating (process
1050).
[0042] Referring now to FIG. 9, a process for forming a protected
electronics package includes providing at least one electronic
component that requires protection against tampering and/or reverse
engineering as well as other outside factors (process 910). Process
900 also includes mixing an alkali silicate material with a solvent
(process 920). Further, process 900 includes mixing into the
alkalai silicate material at least one of high durability
micro-particles or high-durability nano-particles, to form a
coating material (process 930). The coating material is then
deposited onto the electronic component (process 940). The alkali
silicate material is then deposited to form a coated electronics
package (process 950). The coated electronics package resists
tampering and reverse engineering of the electronic component
(process 960).
[0043] While the detailed drawings, specific examples, and
particular formulations given described exemplary embodiments, they
serve the purpose of illustration only. It should be understood
that various alternatives to the embodiments of the invention
described maybe employed in practicing the invention. It is
intended that the following claims define the scope of the
invention and that structures within the scope of these claims and
their equivalents be covered thereby. The hardware and software
configurations shown and described may differ depending on the
chosen performance characteristics and physical characteristics of
the computing and analysis devices. For example, the type of
computing device, communications bus, or processor used may differ.
The systems shown and described are not limited to the precise
details and conditions disclosed. Method steps provided may not be
limited to the order in which they are listed but may be ordered
any way as to carry out the inventive process without departing
from the scope of the invention. Furthermore, other substitutions,
modifications, changes and omissions may be made in the design,
operating conditions and arrangements of the exemplary embodiments
without departing from the scope of the invention as expressed in
the appended claims.
* * * * *