U.S. patent application number 11/510157 was filed with the patent office on 2008-02-28 for 10gbase-lx4 optical transceiver in xfp package.
Invention is credited to John Dallesasse, Paul Wachtel, Thomas Whitehead.
Application Number | 20080050074 11/510157 |
Document ID | / |
Family ID | 38988763 |
Filed Date | 2008-02-28 |
United States Patent
Application |
20080050074 |
Kind Code |
A1 |
Dallesasse; John ; et
al. |
February 28, 2008 |
10GBASE-LX4 OPTICAL TRANSCEIVER IN XFP PACKAGE
Abstract
An optical transceiver for including an electrical connector
with a serial interface for coupling with an external electrical
cable or information system device, a fiber optic connector adapted
for coupling with an external optical fiber, and an electro-optical
subassembly for converting between an information containing
electrical signal and a modulated optical signal corresponding to
the electrical signal including a transmitter subassembly including
at least first and second lasers operating at different wavelengths
and modulated with respective first and second electrical signals
for emitting first and second laser light beams, and an optical
multiplexer for receiving the first and second beams and
multiplexing the respective optical signals into a single
multi-wavelength beam.
Inventors: |
Dallesasse; John; (Geneva,
IL) ; Whitehead; Thomas; (Chicago, IL) ;
Wachtel; Paul; (Arlington Heights, IL) |
Correspondence
Address: |
EMCORE CORPORATION
1600 EUBANK BLVD, S.E.
ALBUQUERQUE
NM
87123
US
|
Family ID: |
38988763 |
Appl. No.: |
11/510157 |
Filed: |
August 25, 2006 |
Current U.S.
Class: |
385/92 ; 385/1;
385/14; 385/2; 385/24; 385/88; 398/135; 398/139; 398/79;
439/577 |
Current CPC
Class: |
G02B 6/4277 20130101;
G02B 6/4269 20130101; G02B 6/4201 20130101; G02B 6/4284 20130101;
G02B 6/4246 20130101; G02B 6/4292 20130101 |
Class at
Publication: |
385/92 ; 385/88;
385/1; 385/2; 385/14; 385/24; 398/79; 398/135; 398/139;
439/577 |
International
Class: |
G02B 6/36 20060101
G02B006/36; H04B 10/00 20060101 H04B010/00; H01R 33/945 20060101
H01R033/945 |
Claims
1. An optical transceiver for converting and coupling an
information-containing electrical signal with an optical fiber
comprising: a housing including an electrical connector with a
single line serial electrical interface for coupling with an
external electrical cable or information system device and for
transmitting and/or receiving an information-containing electrical
signal, and a fiber optic connector adapted for coupling with an
external optical fiber for transmitting and/or receiving an optical
communications signal; wherein the housing includes a base member
and a cover member forming a pluggable module conforming to the XFP
Multi Source Agreement; and at least one electro-optical
subassembly in the housing for converting between an
information-containing electrical signal and a modulated optical
signal corresponding to the electrical signals including a
transmitter subassembly including first and second lasers operating
at different wavelengths and modulated with respective first and
second electrical signals for emitting first and second laser light
beams; and an optical multiplexer for receiving said first and
second beams and multiplexing the respective optical signals into a
single multi-wavelength beam that is coupled to said fiber optic
connector for transmitting the optical signal to an external
optical fiber.
2. A transceiver as defined in claim 1, wherein one of said
electro-optical subassemblies is a receiver subassembly including
an optical demultiplexer coupled to said fiber optic connector for
receiving a multi-wavelength optical signal having a plurality of
information-containing signals each with a different predetermined
wavelength and demultiplexing the optical signal into distinct
optical beams corresponding to said predetermined wavelengths; and
a substrate forming an optical reference plane and including first
and second photodiodes disposed thereon in the path of said first
and second beams respectively, the photodiodes functioning to
convert the respective optical signals into an electrical signal
that is coupled to said electrical connector for transmitting the
electrical signal to an electrical cable or external information
system device.
3. A transceiver as defined in claim 2, further comprising an array
of individual photodetectors and wherein the optical demultiplexer
includes an optical block with a plurality of wavelength selecting
elements and reflectors operative to direct the optical beams from
each respective wavelength selecting element to respective ones of
a plurality of spatially separated image positions corresponding to
the locations of discrete photodetectors.
4. An optical transceiver as defined in claim 1, wherein an
electro-optical subassembly includes a plurality of lasers with
each laser emitting a laser beam of different wavelength; and an
optical multiplexer for receiving and multiplexing the respective
laser beams into a single multi-wavelength beam that is coupled to
the fiber optic connector for transmitting the single beam to an
external optical fiber; a plurality of optical fibers disposed
within the housing extending between the plurality of lasers and
the optical multiplexer; and a flexible substrate disposed within
the housing for mounting the optical fibers thereto so as to
prevent tangling of the optical fibers within the housing.
5. A transceiver as defined in claim 4, wherein the optical
multiplexer is supported on said flexible substrate.
6. A transceiver as defined in claim 1, further comprising a
photodiode array disposed on a printed circuit board in said
receiver; and demultiplexer disposed in the receiver subassembly
and positioned with respect to the optical reference plane defined
by the surface of the printed circuit board surface, so that the
output beam from the demultiplexer focuses on the photodiode
array.
7. (canceled)
8. A transceiver as defined in claim 1, further comprising a
communications protocol processing subassembly in the housing for
processing the communications signal into a predetermined
electrical or optical communications protocol.
9. A transceiver as defined in claim 8, wherein the protocol
processing subassembly is compliant with IEEE 802.3ae
10GBASE-LX4.
10. A transceiver as defined in claim 1, wherein the single line
serial electrical interface is an XFI interface.
Description
REFERENCE TO RELATED APPLICATIONS
[0001] This application is related to co-pending U.S. patent
application Ser. No. 10/866,265 filed Jun. 14, 2004, assigned to
the common assignee.
[0002] This application is related to co-pending U.S. patent
application Ser. No. ______ filed simultaneously herewith and
assigned to the common assignee.
BACKGROUND OF THE INVENTION
[0003] 1. Field of the Invention
[0004] The invention relates to optical transceivers, and in
particular to Ethernet (IEEE 802.3ae standard) compliant
transceivers that provide a 10 Gigabit per second communications
link between computers or communications units over optical fibers,
such as used in high throughput fiber optic communications links in
local and wide area networks and storage networks.
[0005] 2. Description of the Related Art
[0006] A variety of optical transceivers are known in the art which
include an optical transmit portion that converts an electrical
signal into a modulated light beam that is coupled to a first
optical fiber, and a receive portion that receives a second optical
signal from a second optical fiber and converts it into an
electrical signal.
[0007] Optical transceivers are packaged in a number of standard
form factors which are "hot pluggable" into the chassis of the
communications data system unit. Standard form factors provide
standardized dimensions and electrical input/output interfaces that
allow devices from different manufacturers to be used
interchangeably. Some of the most popular form factors include
XENPAK (see www.xenpak.org), X2 (see www.X2 msa.org), SFF ("small
form factor"), SFP ("small form factor pluggable"), and XFP ("10
Gigabit Small Form Factor Pluggable", see www.XFPMSA.org).
[0008] Although these conventional pluggable designs have been used
successfully in the past for low data rate protocol, challenge
miniaturization for which is an ever-constant objective in the
industry. It is desirable to miniaturize the size of transceivers
in order permit greater port density associated with the electrical
network connection, such as, for example, the input/output ports of
switch boxes, cabling patch panels, wiring closets, and computer
I/O interfaces.
[0009] The XFP module is a hot-pluggable, serial-to-serial optical
transceiver that supports SONET OC-192, 10 Gigabit Ethernet,
10-Gbit/s Fibre Channel, and G.709 links. The module is 78 mm in
length, 18.4 mm in width, and 8.5 mm in height. This small size
limits the amount of electrical circuitry that can be implemented
in the package, and consequentially in the prior art the majority
of electronic signal processing is located in devices on the host
board (inside the computer or network unit) rather than within the
module in current commercial XFP devices. The XFP form factor
features a serial 10 Gbit/s electrical interface called XFI that
assumes that the majority of electronic signal processing functions
are located within the circuits or ASICs on the system printed
circuit board rather than within the optical transceiver module.
Since the electronic processing defines the communication protocol,
the XFP module is protocol independent.
[0010] The XFI interface is a differentially signaled, serial
interconnect with nominal baud rate between 9.95 and 10.75 Gbit/s.
Transmit and receive signals are AC coupled, 100-ohm differential
pairs. The electrical interconnect may include combinations of
microstrip and/or stripline traces on the printed circuit board up
to 12 in. (300 mm) in length, with layer-to-layer or through-hole
via structures, a 30-pin connector, and a BGA ASIC package.
[0011] One of the most important optical communications protocols
is the 10 Gigabit per second Ethernet standard (GbE). The 10
Gigabit Ethernet standard specifications are set forth in the IEEE
802.3ae supplement to the IEEE 802.3 Ethernet standard. The
supplement extends the 802.3 protocol and MAC specification to an
operating speed of 10 Gb/s. Several Physical Coding Sublayers known
as 10GBASE-X, 10GBASE-R and 10-GBASE-W are specified, as well as a
10 Gigabit Media Independent Interface (XGMII), a 10 Gigabit
Attachment Unit Interface (XAUI) a 10 Gigabit Sixteen-Bit Interface
(XSBI) and management.
[0012] The 10GBASE-LX4 media type uses wave division multiplexing
technology to send signals over four wavelengths of light carried
over a single pair of fiber optic cables. The use of course
wavelength division multiplexing (CWDM) allows four optically
multiplexed channels each transmitting a 3.125 Gb/sec signal over a
single fiber pair (i.e. utilizing one fiber for each direction), as
set forth in IEEE 802.3ae Clause 53, setting forth the 10GBASE-LX4
Physical Media Dependent (PMD) sublayer. An optical transceiver
designed for operating in conformance with such protocol is
described in U.S. patent Ser. No. 10/866,265, herein incorporated
by reference. The 10GBASE-LX4 system is designed to operate at 1310
nm over multi-mode or single-mode dark fiber. The design goal for
this media system is from two meters up to 300 meters over
multimode fiber or from two meters up to 10 kilometers over
single-mode fiber, with longer distances possible depending on
cable type and signal quality requirements.
[0013] WDM high date rate applications have found widespread
application in short reach Ethernet networks. Ethernet (the IEEE
802.3 standard) is the most popular data link network protocol. The
Gigabit Ethernet Standard (IEEE 802.3) was released in 1998 and
included both optical fiber and twisted pair cable implementations.
The 10 GB/sec Ethernet standard (IEEE 802.3 ae) was released in
2002 with both optical fiber and twisted pair cabling. The
difficulties associated with multi-gigabit signaling over existing
wiring has limited the applications for such cabling, although
efforts are currently underway for new copper cabling
standards.
[0014] Among the many features defined in the 10 Gigabit Ethernet
draft standard is the XAUI (pronounced "Zowie") interface. The
"AUI" portion is borrowed form the Ethernet Attachment Unit
Interface. The "X" represents the Roman numeral for ten and implies
ten gigabits per second. The XAUI is a low pin count, self-clocked
serial bus designed as an Interface extender for the 74 signal wide
interface (32-bit data paths for each of transmit and received)
XGMII. The XAUI may be used in place of, or to extend, the XGMII in
chip-to-chip applications typical of most Ethernet MAC to PHY
interconnects
[0015] In the transmit direction, the MAC parallel electrical
interface (XAUI) is monitored and retimed by the physical layer
device (PHY). The XAUI bus is a four lane, 8b/10b encoded, 3.125
Gb/s CML electrical signal. Much like scrambling in traditional
SONET systems, 8b/10b encoding ensures DC-balance (the average
number of logic ones is equal to the average number of logic zeros)
and a minimum transition density simplifying the optical
architecture. The retimed XAUI bus modulates an optical transmitter
array, generating four optical Non-Return-to-Zero (NRZ) waveforms.
Each optical transmitter operates at a different wavelength, near
1310 nm with 24.5 nm center spacing and 13 nm tolerance. The
optical signals are wavelength division multiplexed for
transmission over a single fiber.
[0016] In the received direction, the CWDM signal is optically
demultiplexed into its four constituent wavelengths. A quad
receiver array converts the demultiplexed optical signals into four
3.125 Gb/s electrical signals. The PHY device performs clock
recovery on each data lane, retimes the signal, and monitors the
network interface performance. The retimed XAUI interface is then
transmitted to the MAC device.
[0017] The fact that 10GBASE-LX4 is simply an optical extension of
the XAUI interface may call into question whether or not the PHY
device is always required. In fact, IEEE 802.3ae does not
explicitly define a requirement for the PHY device and remains
intentionally vague on the implementation details. However, the PHY
device performs two very important tasks, which cannot be easily
addressed in its absence.
[0018] First, the XAUI interface was originally defined to extend
the system reach between layer 2 and layer 1 devices while
simultaneously reducing the pin count requirements of small form
factor pluggable modules. This interface is loosely defined to
support 50 cm (two inches) of FR-4 material. In a typical
10GBASE-LX4 module-based implementation, the XAUI interface would
be subject to transmission distances on the order of 10 cm (4
inches) on each of four independent substrates, plus two connector
interfaces. With additional penalties due to the
electrical-to-optical and optical-to-electrical conversion combined
with impairments introduced by the transmission media, XAUI
amplitude and phase noise limits will likely be exceeded. Highly
integrated PHYs, such as the Quake Technologies QT2044, provide
full 3R (recover, retime, reshape) regeneration with compliance to
the IEEE 802.3ae 10GBASE-LX4 and XAUI specifications.
[0019] Secondly, the 10GBASE-LX4 standard also requires conformance
to the XGXS and PCS/PMA physical layer clauses, which contain an
extensive set of registers for provisioning and performance
monitoring. The majority of these registers is associated with XAUI
performance and is best handled within a high-speed PHY device. In
addition, PHY devices specifically designed for 10GBASE-LX4
applications, such as the QT2044, integrate management for the
pluggable module non-volatile memory space and Diagnostic Optical
Monitoring (DOM) devices defined within the XENPAK, XPAK, and X2
Multi-Source Agreements.
[0020] The electrical input to the optical transceiver is a serial
10 Gbit/sec XFI interface. In order to produce a 10GBASE0LX4
optical signal, the electrical input must be converted into a four
lane XAUI signal, with each lane applied to and modulating a
different laser.
[0021] Although single chip integrated circuits such as the Puma
AEL1002 are commercially available, such chips are designed for
implementation on the host side, and convert four lanes of 3.125
Gbps/XAUI data signals from the host into a 10 Gbps XFI data signal
which is applied to the XFP module. Since the optical signal being
transmitted by such existing modules is a serial 10 Gbps signal,
there has been no need for an XFI to XAUI data signal
conversion.
[0022] Prior to the present invention, there has not been a
suitable transceiver for high speed (10 Gigabits/sec. or more)
optical transmission in a very small (XFP type) form factor.
SUMMARY OF THE INVENTION
1. Objects of the Invention
[0023] It is an object of the present invention to provide an
improved high speed optical transceiver using a serial electrical
interface in a small pluggable standardized form factor.
[0024] It is also another object of the present invention to
provide an optical transceiver in an XFP form factor for use in an
optical fiber transmission system with an industry standard
10GBASE-LX4 physical layer.
[0025] It is still another object of the present invention to
provide an optical transceiver for use in an optical wavelength
division multiplexed (WDM) transmission system suitable for short
range and long haul applications using multiple semiconductor laser
chips and a serial electrical interface.
[0026] It is also another object of the present invention to
provide an optical transceiver in an XFP form factor for use with
an XFI serial interface.
2. Features of the Invention
[0027] Briefly, and in general terms, the present invention
provides an optical transceiver for converting and coupling an
information-containing electrical signal with an optical fiber
including a housing including an electrical connector with a serial
XFI interface for coupling with an external electrical cable or
information system device and a fiber optic connector adapted for
coupling with an external optical fiber, at least one
electro-optical subassembly in the housing for converting between
an information containing electrical signal and a modulated optical
signal corresponding to the electrical including a transmitter
subassembly including first and second lasers operating at
different wavelengths and modulated with respective first and
second electrical signals for emitting first and second laser light
beams, and an optical multiplexer for receiving the first and
second beams and multiplexing the respective optical signals into a
single multi-wavelength beam.
[0028] Additional objects, advantages, and novel features of the
present invention will become apparent to those skill in the art
from this disclosure, including the following detailed description
as well as by practice of the invention. While the invention is
described below with reference to preferred embodiments, it should
be understood that the invention is not limited thereto. Those of
ordinary skill in the art having access to the teachings herein
will recognize additional applications modifications and
embodiments in other fields, which are within the scope of the
invention as disclosed and claimed herein and with respect to which
the invention could be of utility.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] These and other features and advantages of this invention
will be better understood and more fully appreciated by reference
to the following detailed description when considered in
conjunction with the accompanying drawings, wherein:
[0030] FIG. 1 is a perspective view of an optical transceiver
module in which an exemplary embodiment in accordance with aspects
of the present invention may be implemented;
[0031] FIG. 2 is an exploded perspective view of an optical
transceiver module in accordance with aspects of the present
invention may be implemented;
[0032] FIG. 3 is a block diagram showing the electrical signal
interfaces between a network unit and the XFP module as known in
the prior art;
[0033] FIG. 4 is a block diagram of the optical transceiver module
according to the present invention; and
[0034] FIG. 5 is a block diagram of the XFI/XAUI conversion
integrated circuit according to the present invention.
[0035] The novel features and characteristics of the invention are
set forth in the appended claims. The invention itself, however, as
well as other features and advantages thereof, will be best
understood by reference to a detailed description of a specific
embodiment, when read in conjunction with the accompanying
drawings.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0036] Details of the present invention will now be described,
including exemplary aspects and embodiments thereof. Referring to
the drawings and the following description, like reference numbers
are used to identify like or functionally similar elements, and are
intended to illustrate major features of exemplary embodiments in a
highly simplified diagrammatic manner. Moreover, the drawings are
not intended to depict every feature of actual embodiments or the
relative dimensions of the depicted elements, and are not drawn to
scale.
[0037] FIG. 1 is a perspective view of an optical transceiver
module 100 in which an exemplary embodiment in accordance with
aspects of the present invention may be implemented. In particular,
FIG. 1 depicts the XFP form factor as is known in the prior
art.
[0038] Referring now to FIG. 2, there is shown an exploded view of
an exemplary pluggable optical transceiver module 100 according to
a preferred embodiment of the present invention. In this particular
embodiment, the module 100 is compliant with the IEEE 802.3ae
10GBASE-LX4 Physical Media Dependent sub-layer (PMD) and is
implemented in the XFP form factor having a length of 78 mm, a
width of 18.35 mm, and a height of 8.5 mm. It is to be noted,
however, that in other embodiments the transceiver module 100 may
be configured to operate under various other standard protocols
(such as Fibre Channel or SONET) and be manufactured in various
alternate form factors such as XENPAK, X2, etc. The module 100 is
preferably a 10 Gigabit Wide Wavelength Division Multiplexed (WWDM)
transceiver having four 3.125 Gbps distributed feedback lasers that
enable 300 meter transmission of an optical signal at least 300
meters over a single legacy installed multimode fiber or a distance
from 10 to 40 km over a single standard single mode fiber.
[0039] The transceiver module 100 includes a two-piece housing 102
including a base 104 and a cover 106. In addition, contact strips
(not shown) may be provided to ground the module to an external
chassis ground as well. The housing 102 is constructed of die-case
or milled metal, preferably die-cast zinc, although other materials
also may be used, such as specialty plastics and the like.
Preferably, the particular material used in the housing
construction assists in reducing EMI.
[0040] The front end of the housing 102 includes a faceplate 131
for securing a pair of receptacles 124, 126. The receptacles, 124,
126 are configured to receive fiber optic connectors (not shown)
which mate with optical plugs 128, 130 respectively. In the
preferred embodiment, the connector receptacles 124, 126 are
configured to receive industry standard LC duplex connectors. As
such, keying channels 132, 134 are provided to ensure that the LC
connectors are inserted into the receptacles 124, 126 in their
correct orientation. Further, as shown in the exemplary embodiment
and discussed further herein, the connector receptacle 124 is
intended for an LC transmitter connector, and the connector
receptacle 126 receives an LC receiver connector.
[0041] In one embodiment, the housing 102 holds three subassemblies
or circuit boards, including a transmit board 108, a receive board
110, and a physical coding sublayer (PCS)/physical medium
attachment (PMA) board 112, which is used to provide an electrical
interface to external computer or communications units (not shown).
The transmit subassembly includes four distributed feedback (DFB)
semiconductor lasers mounted which may be mounted in a single,
hermetically sealed enclosure 415, which interfaces to a fiber
coupling subassembly 416. The transmit board 108 is secured in
place at the bottom of the housing using a brace 418 attached to
the coupling subassembly 416. The brace also functions as a heat
sink for dissipating heat from the metallic fiber coupling
subassembly 416. In addition, the transmit board 108 and receive
board 110 are connected to the PCS/PMA board 112 by respective flex
interconnects 120, or other board-to-board electrical connectors or
cables. Thermally conductive gap pads may be provided to transmit
the heat generated by the lasers or other components in the
transmitter subassembly to the base 104 or cover 106 of the
housing, which acts as a heat sink. The receiver subassembly 110 is
directly mounted on the housing base 104 using a thermally
conductive adhesive to achieve heat dissipation. Different
subassemblies therefore dissipate heat to different portions of the
housing for a more uniform heat dissipation. The output optical
signal from the four lasers is multiplexed and input into a single
optical fiber 420 which coils and reverses direction, and is
preferably attached or mounted on a flexible substrate 140. The
flexible material may be an optical flexible planar material such
as FlexPlane.TM. available from Molex, Inc. of Lisle, Ill.,
although other flexible substrate may be used as well. The optical
fiber 420 originating from the transmitter subassembly is thereby
routed to the transmit optical connector plug 130, which is
attached to the housing 102. The fiber is routed and attached in
such a manner as to minimize sharp bends in the optical fiber to
avoid optical loss and mechanical failure.
[0042] The flexible substrate 140 may include an opening 142 or
hole in a portion of the material that is located directly above
the retimer IC or other heat generating components mounted on the
PCS/PMA board 112. The opening 142, which is substantially an area
the size of the unused portion of the substrate 140, enables the
heat sink on the cover 106 to contact a heat transmission gap pad
160, so as to provide access and a heat conductive path to the
mounted components on the board 112. This area on the board 112
normally would be inaccessible if not for the opening 142. For
example, a heat sink may be installed without interfering with the
routing of the optical fibers on the substrate 140 and without
removing the mounted substrate 140 to allow access to the PCS/PMA
board 112.
[0043] Although the embodiment described above is a pluggable 10
Gigabit WWDM transceiver, the same principles are applicable in
other types of optical transceivers suitable for operating over
both multimode (MM) and single mode (SM) fiber using single or
multiple laser light sources, single or multiple photodetectors,
and an appropriate optical multiplexing and demultiplexing system.
The design is also applicable to a single transmitter or receiver
module, or a module as either a transmitter, receiver, or
transceiver to communicate over different optical networks using
multiple protocols and satisfying a variety of different range and
distance goals.
[0044] Although in the depicted embodiment, the transceiver 100 is
manufactured in a modular manner using three separate subassemblies
mounted in the housing--a transmitter subassembly, a receiver
subassembly, and a protocol processing board, with each subassembly
or board having dedicated functions and electrically connected to
each other using either flex circuitry or mating multipin
connectors, land grid arrays, or other electrical interconnect
devices, the invention may also be implemented in a transceiver
having a single board or subassembly mounted inside the
housing.
[0045] FIG. 3 is a block diagram showing the electrical signal
interfaces between a network unit and the XFP module as known in
the prior art. The network unit 200 is connected to a 10 Gigabit
Ethernet (GE) media access controller (MAC) 201. The interface
between the network unit 200 and the MAC 201 is typically a System
Packet Interface Level 4 (SPI-4) defined by the Optical
Internetworking Form Implementation Agreement OIF-SP04-02.1 (see
www.oiforum.com). In particular, SPI-4 is an interface for packet
and cell transfer between a physical layer (PHY) device and a link
layer device, for aggregate bandwidths of OC-192 ATM and Packet
over SONET/SDH(POS), as well as 10 Gb/s Ethernet applications.
[0046] Since the MAC electrical interface on the optical side is
XAUI, and the XFP module 100 utilizes an XFI interface, an
integrated circuit 202 is utilized to convert from XAUI to XFI. The
XFI side of the IC 202 is then interfaced with the XFP module
100.
[0047] The XFI ("Ziffy") interface is defined in the XFP MSA as a
high-speed serial electrical interface with a nominal baudrate of
9.95-11.1 Gb/s. The electrical interface is based on high speed low
voltage AC coupled logic with a nominal differential impedance of
100 ohms. It is designed to support SONET OC-192, IEEE Std-802.3ae,
10 GFC and G.709 (OUT-2) applications. For the purposes of the
XFP-LX4 module the XFI interface should at a minimum support
IEEE.Std 802.3ae 10 Gigabit Ethernet at 10.3125 Gb/s. The XFI
channel should be compliant to the datacom jitter and differential
output masks defined in the XFP MSA standard. Although the XFI
interface is the preferred embodiment, other serial interfaces
could be utilized as well.
[0048] Ideally, the XFI-XAUI device should be able to derive its
timing from a+/-100 PPM Baudrate/64 clock signal provided by the
host system. If the host does not provide this optional clock, then
a crystal oscillator will be placed in the module.
[0049] The XFI-XAUI device has the following hardware pins for
control and status: [0050] MOD_DeSel [0051] TX_DIS [0052] MOD_NR
[0053] Interrupt [0054] RX-LOS
MOD_DeSel
[0055] The MOD-DeSel is an input pin. When held low by the host,
the module response to 2-wire serial communication commands. When
the pin is pulled high the device shall not respond to or
acknowledge any 2-wire interface communication.
TX-DIS
[0056] TX-DIS is an input pin. When TX_DIS is asserted High, the
XFP module transmitter output must be turned off. Ideally, the
device would also have four TX-DIS output pins that would connect
to the individual laser drivers in the module.
P_Down/RST
[0057] This is a multifunction pin for module Power Down and Reset.
When held High the module shall be placed in Low Power mode with
all functionally disabled except for 12C communication, laser
safety features, and variable power supply functions. The negative
edge of P_Down/RST signal initiates a complete module reset.
MOD_NR
[0058] The MOD-NR is an output pin that when High indicates that
the module has detected a condition that renders transmitter and/or
receiver data invalid. It shall consist of the logical OR of
Transmitter LOL, Transmitter Laser Fault, and Receiver LOL. Inputs
that trigger LASO in the XENPAK MSA should probably also be
included.
Interrupt
[0059] Interrupt is an output pin. It should be pulled Low to
indicate possible module operational fault or a status critical to
the host system. The logic for this pin is defined in section 5.11
of the XFP MSA standard.
RX_LOS
[0060] RX_LOS is an output pin. It should be pulled High to
indicate insufficient optical power for reliable signal reception.
Ideally, the device should also have four RX-LOS input pins to
connect to the digital status signals provided by the optical
receiver.
Management Interface
[0061] Communication with the device shall be performed with the
2-wire interface described in Chapter 4 of the XFP MSA. The address
of the device shall be 0xa0. The device shall mirror the contents
of an EEPROM to report vendor specific information. The memory map
should be set up according to Chapter 5 of the XFP MSA. The
internal I.sup.2C bus used to communication with the NVRAM should
also be able to provide I.sup.2C communication to digital
potentiometers or laser controllers.
Digital Optical Monitoring (DOM)
[0062] The XFP standard was created for single channel devices.
Therefore, all DOM registers shall be populated based on a fixed
representative channel. The data shall be mirrored from a DOM
device inside the module with an address specified in the Vendor
Specific register space. The parameters measured shall be
transceiver temperature, TX bias current, TX output power, received
optical power, and VCC2 voltage.
Variable Power Supply (VPS)
The "Bypassed Regulator Mode" option in section 5.7 of the XFP MSA
standard is preferred for the XFP-LX4. The XFI-XAUI device must
contain the necessary logic to enable this function, which may
include a digital output hardware pin.
Loopback Modes
[0063] At a minimum the XFI-XAUI device shall implement the
following loopback modes: [0064] XFI loopback [0065] XAUI loopback
[0066] Analog XAUI loopback Section 5.3 of the XFP MSA standard
details the control of the loopback modes.
* * * * *
References