U.S. patent application number 11/845195 was filed with the patent office on 2008-02-28 for cooling system and cooling method for cooling components of a power electronics.
This patent application is currently assigned to AIRBUS DEUTSCHLAND GMBH. Invention is credited to Wilson Willy Casas Noriega, Wolfgang Ebigt, Andreas Frey.
Application Number | 20080047688 11/845195 |
Document ID | / |
Family ID | 39112276 |
Filed Date | 2008-02-28 |
United States Patent
Application |
20080047688 |
Kind Code |
A1 |
Ebigt; Wolfgang ; et
al. |
February 28, 2008 |
Cooling System And Cooling Method For Cooling Components Of A Power
Electronics
Abstract
Cooling system and cooling method for cooling components of a
power electronics The invention relates to a cooling system for
cooling components (10) of power electronics installed on board an
aircraft, in particular a passenger aircraft, comprising a cooling
device (30) which is to be coupled in a heat-transmitting and
planar manner to the components of the power electronics, and which
cooling device (30) comprises at least two heat sinks (32, 34, 36,
38, 39, 50) fluidly isolated from one another, the cooling system
further comprising at least two cooling circuits each including a
cooling fluid source, wherein the at least two heat sinks of the
cooling device (30) can be separately supplied with cooling fluids
from different cooling fluid sources, and wherein the cooling
system is configured such that no phase transition of the cooling
fluids within the cooling circuits occurs, during operation of the
cooling system. The invention also relates to a method for cooling
components of power electronics.
Inventors: |
Ebigt; Wolfgang; (Hamburg,
DE) ; Casas Noriega; Wilson Willy; (Hamburg, DE)
; Frey; Andreas; (Immenstadt, DE) |
Correspondence
Address: |
WOOD, HERRON & EVANS, LLP
2700 CAREW TOWER
441 VINE STREET
CINCINNATI
OH
45202
US
|
Assignee: |
AIRBUS DEUTSCHLAND GMBH
Kreetslag 10
Hamburg
DE
21129
|
Family ID: |
39112276 |
Appl. No.: |
11/845195 |
Filed: |
August 27, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60840625 |
Aug 28, 2006 |
|
|
|
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 2924/0002 20130101; F28D 7/0025 20130101; F28D 7/0033
20130101; F28D 15/00 20130101; F28F 7/02 20130101; H01L 2924/00
20130101; F28D 2021/0029 20130101 |
Class at
Publication: |
165/080.2 |
International
Class: |
F28F 7/02 20060101
F28F007/02 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 28, 2006 |
DE |
DE 102006040187.5 |
Claims
1. Cooling system for cooling components (10) of power electronics
installed on board an aircraft, in particular a passenger aircraft,
comprising a cooling device (30) which is to be coupled in a
heat-transmitting and planar manner to the components of the power
electronics, and which cooling device (30) comprises at least two
heat sinks (32, 34, 36, 38, 39, 50) which are fluidly isolated from
one another, the cooling system further comprising at least two
cooling circuits each including a cooling fluid source, wherein the
at least two heat sinks of the cooling device (30) can be
separately supplied with cooling fluids from different cooling
fluid sources, and wherein the cooling system is configured such
that no phase transition of the cooling fluids within the cooling
circuits occurs, during operation of the cooling system.
2. Cooling device according to claim 1, wherein at least one of the
at least two heat sinks (32, 34, 36, 38, 39, 50) is formed as a
redundant heat sink.
3. Cooling device according to claim 1, wherein the heat sinks are
formed as a plurality of adjacent cooling channels (32, 34, 36, 38,
39).
4. Cooling device according to claim 3, wherein the cooling
channels (32,34,36,38, 39) extend parallel to one another in the
cooling device (30), at least in sections.
5. Cooling device according to claim 3, wherein the cooling
channels (32, 34, 36, 38, 39) extend in a rectilinear manner
through the cooling device.
6. Cooling device according to claim 3, wherein the cooling
channels (46, 58) extend in a meandering manner through the cooling
device.
7. Cooling device according to claim 3, wherein each cooling
channel comprises a cooling fluid inlet (32a, 34a, 36a, 38a, 39a)
and a cooling fluid outlet (32b, 34b, 36b, 38b, 39b) which are
formed separately from one another.
8. Cooling device according to claim 7, wherein the cooling fluid
inlets (32a, 34a, 36a, 38a, 39a) and the cooling fluid outlets
(32b, 34b, 36b, 38b, 39b) are disposed at opposite ends of the
cooling device.
9. Cooling device according to claim 7, wherein the cooling fluid
inlets (32a, 34a, 36a, 38a, 39a) and the cooling fluid outlets
(32b, 34b, 36b, 38b, 39b) are disposed at the same end of the
cooling device.
10. Cooling device according to claim 3, wherein the cooling
channels (32, 34, 36, 38, 39) are contained completely in the
interior of the cooling device.
11. Cooling device according to claim 1, wherein the cooling device
comprises on its outside a plurality of ribs (50) which are
provided to air-cool the cooling device.
12. Cooling device according to claim 1, characterised in that the
cooling device is formed as an elongate cooling plate.
13. Method for cooling components (10) of power electronics
installed onboard an aircraft, in particular a passenger aircraft,
in which method a cooling device (30) comprising at least two heat
sinks (32, 34, 36, 38, 39, 50) which are fluidly isolated from one
another is coupled in a heat-transmitting and planar manner to the
components of the power electronics, and in which method the at
least two heat sinks are separately supplied with a cooling fluid
from different cooling fluid sources associated to different
cooling circuits, and in which method no phase transition of the
cooling fluid occurs.
14. Method according to claim 13, in which a cooling device (30)
comprising a plurality of cooling channels (32, 34, 36, 38, 39)
fluidly isolated from one another is used, wherein adjacent cooling
channels (32, 34, 36, 38, 39) of the cooling device are supplied
with a pressurised cooling fluid from different cooling fluid
sources.
15. Method according to claim 14, in which the directions of flow
of the cooling fluid in adjacent cooling channels (32, 34, 36, 38,
39) of the cooling device (30) are opposite to one another.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a cooling system and a
cooling method for cooling components of power electronics
installed on board an aircraft, in particular a passenger
aircraft.
BACKGROUND OF THE INVENTION
[0002] Components of power electronics must be cooled on account of
the heat which is generated in operation under load. The cooling of
the components represents a safety feature which ensures that the
components function properly.
[0003] Since in many cases air cooling does not guarantee
sufficient cooling of the components of the power electronics,
cooling plates 20 are used, as represented in FIG. 1, which are
brought into thermal contact with the components 10 to be cooled.
These cooling plates 20 usually comprise a cooling channel 22
through which a cooling fluid, for example a cold liquid, flows.
The inlet 22a and the outlet 22b of the cooling plate 20 are
connected to a cooling fluid circuit which comprises a cooling
fluid source.
[0004] One disadvantage of the conventional cooling plates lies in
the fact that, should a leakage occur in the cooling fluid circuit,
the flow of cooling fluid through the cooling plate will no longer
be sufficient, so that sufficient cooling of the components of the
power electronics will not be guaranteed. The consequence would be
overheating of these components.
[0005] Constant and sufficient cooling of the components must be
guaranteed, in particular in the case of power electronics
installed on board an aircraft, in order to prevent possible
failure of the components on account of overheating. Overheating of
the components of electronic flight safety systems would have
adverse effects on the flight safety of the passengers.
[0006] An object of the present invention is therefore to provide a
cooling system including a cooling device for cooling components of
power electronics installed on board an aircraft, in particular a
passenger aircraft which, should a leakage occur in a cooling fluid
circuit comprising the cooling device, prevents the components from
overheating and therefore guarantees a high level of fail safety of
the components.
SUMMARY OF THE INVENTION
[0007] The above-mentioned object is achieved according to a first
aspect of the invention by a cooling system for cooling components
of power electronics installed on board an aircraft, in particular
a passenger aircraft, comprising a cooling device which is to be
coupled in a heat-transmitting and planar manner to the components
of the power electronics, and which cooling device comprises at
least two heat sinks which are fluidly isolated from one another,
the cooling system further comprising at least two cooling circuits
each including a cooling fluid source, wherein the at least two
heat sinks of the cooling device can be separately supplied with
cooling fluids from different cooling fluid sources, and wherein
the cooling system is configured such that no phase transition of
the cooling fluids within the cooling circuits occurs, during
operation of the cooling system.
[0008] As the cooling device comprises at least two heat sinks
which are fluidly isolated from one another, the two heat sinks can
be separately connected to different cooling fluid circuits.
However it is also possible for just one heat sink to be connected
to a cooling fluid circuit, while the other heat sink is merely
brought into thermal contact with a cooling fluid. The second heat
sink can therefore continue to guarantee sufficient cooling of the
cooling device and therefore of the components of the power
electronics if the cooling fluid circuit connected to the first
heat sink fails, for example through the occurrence of a
leakage.
[0009] In one preferred configuration of the invention at least one
of the at least two heat sinks is formed as a redundant heat sink
in the cooling device. This redundant second heat sink guarantees
sufficient cooling of the components in the event of failure of a
cooling fluid circuit connected to the first heat sink. The
redundancy requires that the arrangement and the cooling capacity
of the at least two heat sinks in the cooling device be selected
such that just one heat sink (in the case of a total of two heat
sinks present in the cooling device) suffices to guarantee
sufficient cooling of the components. In a case of this kind the
second heat sink takes over the entire cooling of the cooling
device.
[0010] The heat sinks of the cooling device are preferably formed
as a plurality of cooling channels which are adjacent to one
another. In the case of a cooling device which comprises a
plurality of adjacent cooling channels the cooling efficiency of
the cooling device can be increased in the event of failure of a
cooling fluid circuit if respective cooling channels which are
adjacent to one another are supplied by different cooling fluid
circuits. Should a cooling fluid circuit fail, cooling fluid
continues to flow through approximately 50% of the cooling channels
provided in the cooling device, thereby preventing the components
of the power electronics from overheating.
[0011] According to one preferred embodiment, the cooling channels
in the cooling device extend parallel to one another, at least in
sections. Because of the cooling channels extending parallel at
least in sections, the cooling device can also uniformly cool the
components which are disposed on the cooling device and are to be
cooled, at least in regions, to a temperature which guarantees
their proper functioning if a cooling fluid circuit fails.
[0012] The cooling channels preferably extend in a rectilinear or
meandering manner through the cooling device. The meandering path
of the cooling channels lengthens the distance between the cooling
channel inlet and the cooling channel outlet when compared with a
rectilinear path, so that the retention time of the cooling fluid
flowing through the cooling device in the cooling channels is
increased and the heat transfer from the components to the cooling
fluid therefore is maximised.
[0013] According to a further configuration of the invention, each
cooling channel comprises a cooling fluid inlet and a cooling fluid
outlet which are each formed separately from one another. Because
each cooling channel comprises a separate cooling fluid inlet and
cooling fluid outlet, each cooling channel can easily be connected
to a cooling fluid circuit and thus supplied with cooling fluid.
This also results in the possibility of providing some of the
cooling channels present in the cooling device as redundant cooling
channels which increase the fail safety of the cooling device and
thus of the components of the power electronics.
[0014] The cooling fluid inlets and the cooling fluid outlets are
preferably disposed at opposite ends of the cooling device, so that
the cooling device can easily be connected via a plurality of
cooling fluid circuits to a plurality of cooling fluid sources. The
cooling fluid inlets and the cooling fluid outlets can also
preferably be disposed at the same end of the cooling device. This
makes it easier to fit the cooling device under certain spatial
conditions, as the cooling device only has to be accessible from
one side for connecting the cooling fluid inlets and the cooling
fluid outlets to the cooling fluid sources.
[0015] The cooling channels are preferably contained completely in
the interior of the cooling device. This results in a homogeneous
temperature profile which is virtually symmetrical relative to the
longitudinal axis of the cooling device. It is also in particular
possible to use liquids to cool the cooling device.
[0016] According to a further preferred embodiment of the
invention, the cooling device comprises on its outside a plurality
of ribs which are provided to air-cool the cooling device. The heat
sink provided in the form of the plurality of ribs can therefore
air-cool the components of the power electronics by means of the
ribs if the entire fluid cooling system fails, which again
increases the reliability and fail safety of the cooling
device.
[0017] The cooling device is preferably formed as an elongate
cooling plate. Components of power electronics can thus easily be
coupled in a heat-transmitting manner to a face of the cooling
plate.
[0018] A further aspect of the present invention relates to a
method for cooling components of power electronics installed on
board an aircraft, in particular a passenger aircraft, in which
method a cooling device comprising at least two heat sinks which
are fluidly isolated from one another is coupled in a
heat-transmitting and planar manner to the components of the power
electronics, and in which method the at least two heat sinks are
separately supplied with a cooling fluid from different cooling
fluid sources associated to different cooling circuits, and in
which method no phase transition of the cooling fluid occurs.
[0019] According to one preferred embodiment of the method
according to the invention, a cooling device is used which
comprises a plurality of cooling channels which are fluidly
isolated from one another, with adjacent cooling channels of the
cooling device being supplied with a pressurised cooling fluid from
different cooling fluid sources.
[0020] By separately supplying adjacent cooling channels with
pressurised cooling fluid, the cooling device can also guarantee
sufficient cooling of the components of the power electronics if a
cooling fluid circuit of the cooling device fails. The method
according to the invention is therefore in particular suitable for
cooling the power electronics installed on board a commercial
aircraft, as the flight safety is thus considerably increased.
[0021] The directions of flow of the cooling fluid in adjacent
cooling channels of the cooling device are preferably opposite to
one another.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The invention is described by way of example on the basis of
preferred embodiments of the invention with reference to the
accompanying drawings, in which:
[0023] FIG. 1 represents a conventional cooling device for cooling
components of power electronics;
[0024] FIG. 2 represents a cooling device according to a first
embodiment of the invention;
[0025] FIG. 3 represents a cooling device according to a second
embodiment of the invention;
[0026] FIG. 4 represents a variant of the embodiments shown in
FIGS. 2 and 3, in which air cooling is additionally provided.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0027] FIG. 2 is a schematic perspective view of a cooling device
30 according to a first embodiment of the invention.
[0028] The cooling device 30 is formed as an elongate cooling
plate. It comprises a plurality of cooling channels 32, 34, 36, 38,
39 which are fluidly isolated from one another and through which
one or a plurality of cooling fluid(s) can flow. In the embodiment
which is represented in FIG. 2 the cooling channels 32, 34, 36, 38,
39 extend in a rectilinear manner through the cooling device 30 and
are disposed adjacent to one another. Furthermore, the sum of the
volumes of the cooling channels 32, 34, 36, 38, 39 corresponds
almost to the volume of the cooling device 30. The cooling channels
32, 34, 36, 38, 39 are isolated from one another such that the
cooling fluid in one cooling channel does not mix with the cooling
fluid in another cooling channel. To this end, the cooling channels
are separated from one another by partition walls (not shown). The
provision of impermeable membranes, through which the cooling fluid
cannot pass, between the cooling channels 32, 34, 36, 38, 39 has
equally been taken into consideration.
[0029] Each cooling channel 32, 34, 36, 38, 39 comprises a cooling
fluid inlet 32a, 34a, 36a, 38a, 39a and a cooling fluid outlet 32b,
34b, 36b, 38b, 39b which are disposed at opposite ends of the
cooling device 30 and formed separately from each other. Therefore,
each of the cooling channels 32, 34, 36, 38, 39 provided in the
cooling device 30 can be connected separately through the cooling
fluid inlets 32a, 34a, 36a, 38a, 39a and the cooling fluid outlets
32b, 34b, 36b, 38b, 39b with a cooling circuit comprising a cooling
fluid source, which is not shown.
[0030] In the embodiment which is represented in FIG. 2, the
cooling channels 32, 36, 39 are part of one cooling fluid circuit,
as is indicated by the arrows, while the cooling channels 34, 38
are part of a second cooling fluid circuit. The cooling device 30
can therefore continue to provide sufficient cooling of the
components of the power electronics if one cooling fluid circuit
fails (for example the one which comprises the cooling channels 34,
38).
[0031] The components of the power electronics are coupled in a
heat-transmitting and planar manner to the top side of the cooling
device 30 (as opposed to mounting the components of the power
electronics sideways to the top side of the cooling device 30). For
example, the s heat transfer from the components to the cooling
device 30 can be improved by means of a paste in which metal
particles are contained, for example by means of a silver
paste.
[0032] FIG. 3 represents a cooling device 40 according to a second
embodiment of the present invention. The cooling device 40 which is
represented in FIG. 3 is in the same way formed as an elongate
cooling plate which comprises two cooling channels 46, 48 in the
interior of the cooling device 40. The cooling channels 46, 48 pass
through the cooling device 40 in a meandering manner, the cooling
channels 46, 48 extending parallel to one another, at least in
sections.
[0033] The cooling channels 46, 48 comprise cooling fluid inlets
46a, 48a as well as cooling fluid outlets 46b, 48b. In the
embodiment illustrated in FIG. 3 each cooling channel 46, 48 can be
connected through the cooling fluid inlets 46a, 48a and the cooling
fluid outlets 46b, 48b to a separate cooling fluid circuit.
Therefore, one of the cooling channels 46, 48 is always formed as a
redundant cooling channel, so that, should one cooling fluid
circuit fail, the remaining cooling fluid circuit guarantees
sufficient cooling of the components mounted on the cooling device
40.
[0034] FIG. 4 represents a variant of the embodiments of the
invention represented in FIG. 2 and FIG. 3 in which, in addition to
the fluid cooling, a plurality of ribs 50 are provided on the
outside of the cooling device 30, 40 (on the side opposite the
components of the power electronics), by means of which ribs the
cooling device 30, 40 can additionally be air-cooled.
[0035] Through this additionally provided air cooling, the cooling
device 30, 40 and therefore the components 10 of the power
electronics are maintained at an operating temperature at which
overheating of the components of the power electronics is
prevented, even if the entire fluid cooling fails. The fail safety
of the cooling device according to the invention is additionally
increased as a result.
[0036] The dimensions of the cooling channels of all the
embodiments which are represented in FIG. 2 to FIG. 4 are selected
such that, if a leakage occurs in one cooling fluid circuit, the
other cooling channels of the cooling device can guarantee
sufficient cooling of the components of the power electronics.
[0037] All the cooling devices are preferably made of a material
with a high thermal conductivity, for example, copper, brass,
aluminum.
[0038] The cooling fluids which are used to cool the cooling
devices and therefore to cool the components of the power
electronics include liquids and gases as well as two-phase cooling
fluids. Water maintained at a low temperature or liquid nitrogen
can thus be used as a cooling liquid, for example. However it is
also possible to use cooling gases. If gases are routed through the
cooling channels of the cooling device according to the invention,
the connection points at the inlets and outlets of the cooling
device must be appropriately sealed in order to prevent the gases
from escaping.
[0039] The cooling fluids used to cool the cooling devices are
circulated through the respective cooling circuits of the cooling
system such that the cooling fluids, as already indicated above, do
not undergo a phase transition. Pumps positioned in the respective
cooling circuits is are used to maintain an appropriate cooling
fluid flow through the cooling system. In order to keep the cooling
fluids at a temperature level sufficient for cooling the components
of the power electronics, the cooling fluids may flow through a
heat sink, such as for example an air-liquid heat exchanger,
fluidly connected to the cooling device. In practice, the
air-liquid heat exchanger may be positioned inside a ram-air inlet
duct so that, during flight of the aircraft, ram-air flows through
the heat exchanger which thus cools the cooling liquid. During
ground operation of the aircraft where no ram-air is available, a
ventilator is used in order to provide for a sufficient air flow
through the air-liquid heat exchanger.
[0040] Thus, the cooling device on which the components of the
power electronics are to be mounted in a heat-transmitting and
planar manner (as opposed to mounting the components sideways onto
the cooling device) can be connected at its inlet and outlet to the
so-called "cooling bus" of the aircraft, in which the cooling fluid
(cooling liquid or cooling gas) is already processed to a
temperature level sufficient for cooling the components of the
power electronics, thereby avoiding the need of the cooling fluid
to undergo a phase transition at any point inside the cooling
system, as being the case in refrigeration systems, and in which
means are provided for maintaining a sufficiently high flow of
cooling fluid through the cooling device.
* * * * *