U.S. patent application number 11/904514 was filed with the patent office on 2008-01-31 for system and method for housing power supplies for an electronic device.
This patent application is currently assigned to Foundry Networks, Inc., a Delaware Corporation. Invention is credited to A. Fred Hendrix, Francisco Martinez-Ponce.
Application Number | 20080025002 11/904514 |
Document ID | / |
Family ID | 38562172 |
Filed Date | 2008-01-31 |
United States Patent
Application |
20080025002 |
Kind Code |
A1 |
Hendrix; A. Fred ; et
al. |
January 31, 2008 |
System and method for housing power supplies for an electronic
device
Abstract
A housing for an electronic device has a first volume bounded by
a first face and a second volume bounded by a second face. The
second face is indented from the first face. A plurality of
electronic components are housed in the first volume, and one or
more power supplies are housed in the second volume. The electronic
components are operable to be powered by a coupling to the one or
more power supplies, the coupling running between the indented
second face and the first face.
Inventors: |
Hendrix; A. Fred; (Salida,
CA) ; Martinez-Ponce; Francisco; (Modesto,
CA) |
Correspondence
Address: |
FOUNDRY-THELEN REID BROWN RAYSMAN & STEINER LLP
P.O. BOX 640640
SAN JOSE
CA
95164-0640
US
|
Assignee: |
Foundry Networks, Inc., a Delaware
Corporation
|
Family ID: |
38562172 |
Appl. No.: |
11/904514 |
Filed: |
September 26, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10810498 |
Mar 26, 2004 |
7280366 |
|
|
11904514 |
Sep 26, 2007 |
|
|
|
Current U.S.
Class: |
361/735 ;
312/223.2 |
Current CPC
Class: |
G06F 1/181 20130101;
H05K 5/0247 20130101; H05K 7/1457 20130101 |
Class at
Publication: |
361/735 ;
312/223.2 |
International
Class: |
H05K 7/00 20060101
H05K007/00; A47B 81/00 20060101 A47B081/00 |
Claims
1-38. (canceled)
39. An electronic device comprising: a modular first housing
enclosing one or more electronic components; a modular second
housing coupled to the first housing, the second housing enclosing
one or more power supplies, the first housing overhanging the
second housing, thereby defining an overhang region between the
first and second housings; and one or more power supply cords
coupled between the one or more power supplies and the one or more
electronic components, the one or more power supply cords extending
through the overhang region.
40. The device of claim 39 wherein the first housing is higher than
the second housing.
41. The device of claim 39 wherein the first housing is lower than
the second housing.
42. The device of claim 39 the one or more power supplies comprises
a plurality of power supplies.
43. The device of claim 42 wherein at least two of the power
supplies are disposed in separate sub-housings of the second
housing, separated by a structure disposed within the second
housing.
44. The device of claim 39 the one or more electronic components
comprises a plurality of electronic components.
45. An electronic device comprising: a modular first housing for
enclosing one or more electronic components; a modular second
housing coupled to the first housing, the second housing for
enclosing one or more power supplies, the first housing overhanging
the second housing, thereby defining an overhang region between the
first and second housings; and one or more power supply cords for
coupling between the one or more power supplies and the one or more
electronic components, the one or more power supply cords extending
through the overhang region.
46. The device of claim 45 wherein the first housing is higher than
the second housing.
47. The device of claim 45 wherein the first housing is lower than
the second housing.
48. The device of claim 45 the one or more power supplies comprises
a plurality of power supplies.
49. The device of claim 48 wherein at least two of the power
supplies are disposed in separate sub-housings of the second
housing, separated by a structure disposed within the second
housing.
50. The device of claim 45 the one or more electronic components
comprises a plurality of electronic components.
51. An electronic device comprising: a modular first housing for
enclosing one or more electronic components; and a modular second
housing coupled to the first housing, the second housing for
enclosing one or more power supplies, the first housing overhanging
the second housing and thereby defining an overhang region between
the first and second housings for extending one or more power
supply cords therein, thereby coupling between the one or more
power supplies and the one or more electronic components.
52. The device of claim 51 wherein the first housing is higher than
the second housing.
53. The device of claim 51 wherein the first housing is lower than
the second housing.
54. The device of claim 51 the one or more power supplies comprises
a plurality of power supplies.
55. The device of claim 54 wherein at least two of the power
supplies are disposed in separate sub-housings of the second
housing, separated by a structure disposed within the second
housing.
56. The device of claim 51 the one or more electronic components
comprises a plurality of electronic components.
Description
FIELD OF THE INVENTION
[0001] The invention is directed towards housing power supplies for
an electronic device. More specifically, the invention is directed
towards a chassis design for modular or attached power supply
units.
BACKGROUND OF THE ART
[0002] Many electronic components, such as computer systems, need a
power supply for operation. In some multi-unit systems, the power
supplies need to supply a large amount of power while minimizing
the volume used to house the power system.
[0003] Some typical "box" component systems have built-in power
supply slots in the system itself. However, the "built-in" systems
tend to conform to the measurements of the main chassis itself. In
this manner, external connections between the power supplies and
the components tend to bow out in an arc-like manner from the rear
plane of the panel enclosing the power supplies to the connections
for the components. In use, such "cord-draping" of high-current
power supply cables can pose potential problems with access to
other connectors at the rear of the "boxes" and the like.
[0004] When the full cord is exposed, the cords tend to become a
jumble of connections that are hard to decipher. In this case, care
must be taken to distinguish the cords running between the power
supply and the input power connection, and the "draping" effect
leads to the maximum amount of visible cord possible. This draping
often leads to confusing masses of cord and/or tangles in the cords
when a plurality of components and/or power supplies are
involved.
[0005] Further, the cords may also pose a reliability issue. When
placed near passageways, or when under service for whatever reason,
the "draping" effect leads to large amounts of cord that may be
inadvertently yanked or tugged. In this manner, if the cords are
pulled from the connections to the electronic components, the cords
may be separated from the component, the power supply, or both.
When this happens the component may cease to operate, leading to
downtime and possible failures to other related components.
BRIEF DESCRIPTION OF INVENTION
[0006] A housing for an electronic device has a first volume
bounded by a first face and a second volume bounded by a second
face. The second face is indented from the first face. A plurality
of electronic components are housed in the first volume, and one or
more power supplies are housed in the second volume. The electronic
components are operable to be powered by a coupling to the one or
more power supplies, the coupling running between the indented
second face and the first face.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The accompanying drawings, which are incorporated into and
constitute a part of this specification, illustrate one or more
embodiments of the present invention and, together with the
detailed description, serve to explain the principles and
implementations of the invention.
[0008] In the drawings:
[0009] FIG. 1 is a cutaway side view of a housing for electronic
components with an attached power supply chassis in accordance with
an embodiment of the present invention.
[0010] FIG. 2 is a cutaway top plan view of a housing for
electronic components with an attached power supply chassis in
accordance with an embodiment of the present invention.
[0011] FIG. 3 is a cutaway side view of an alternative housing for
electronic components with an attached power supply chassis in
accordance with an embodiment of the present invention.
[0012] FIG. 4 is cutaway top plan view of the housing for
electronic components with an attached power supply chassis of FIG.
3 in accordance with an embodiment of the present invention.
[0013] FIG. 5 is a front perspective view of the housing, and the
optional cover, according to an embodiment of the present
invention.
[0014] FIG. 6 is a cutaway side view of a housing for electronic
components with an attached power supply chassis in accordance with
an embodiment of the present invention.
[0015] FIG. 7 is a cutaway side view of a housing for electronic
components with an attached power supply chassis in accordance with
an embodiment of the present invention.
[0016] FIG. 8 is a cutaway side view of a housing for electronic
components with an attachable power supply chassis in accordance
with an embodiment of the present invention.
[0017] FIG. 9 is a cutaway side view of a housing for electronic
components with an attachable power supply chassis in accordance
with an embodiment of the present invention.
[0018] FIG. 10 is a cutaway side view of a housing for electronic
components with multiple chasses in accordance with an embodiment
of the present invention.
DETAILED DESCRIPTION
[0019] Embodiments of a system and method for housing power
supplies for an electronic device are described herein in the
context of an enclosure for the storage and operation of electronic
components. Those of ordinary skill in the art will realize that
the following detailed description of the present invention is
illustrative only and is not intended to be in any way limiting.
Other embodiments of the present invention will readily suggest
themselves to such skilled persons having the benefit of this
disclosure. Reference will now be made in detail to implementations
of the present invention as illustrated in the accompanying
drawings. The same reference indicators will be used throughout the
drawings and the following detailed description to refer to the
same or like parts.
[0020] In the interest of clarity, not all of the routine features
of the implementations described herein are shown and described. It
will, of course, be appreciated that in the development of any such
actual implementation, numerous implementation-specific decisions
must be made in order to achieve the developer's specific goals,
such as compliance with application- and business-related
constraints, and that these specific goals will vary from one
implementation to another. Moreover, it will be appreciated that
such a development effort might be complex and time-consuming, but
would nevertheless be a routine undertaking of engineering for
those of ordinary skill in the art having the benefit of this
disclosure. In accordance with the present invention, the
components or structures may be implemented using various types of
items.
[0021] FIG. 1 is a cutaway side view of a housing for electronic
components with an attached power supply chassis in accordance with
an embodiment of the present invention. A chassis 10 encloses both
electronic components 14 and the associated power supply or
supplies 12. The chassis 10 can be divided into subsections by an
inner wall 11. The electronic components 14 are housed in a
housing, the electronic component chassis 15, and the power supply
12 is housed within a sub-chassis 13.
[0022] When the inner wall 11 is present, the electronic component
chassis 15 can be isolated from the sub-chassis 13. In this manner
the electronic component(s) 14 can be protected from any
environmental conditions associated with the power supply 12.
[0023] In an aspect of the invention, at least portions of the face
of the sub-chassis 13 are indented from the plane of the
corresponding face of the electronic component chassis 15. As
shown, the sub-chassis 13 is indented from the faces of the
electronic component chassis 15.
[0024] A power supply cord 16 runs from the power supply 12 to the
electronic component 14. The differing plane of the electronic
component chassis 15 and the sub-chassis 13 provide an overhang or
ledge that shields the connector from being disturbed by external
influences, such as pedestrians or other components. In the
depicted embodiment, the "looping" of the connector between the
electronic component 14 and the power supply 12 is protected in the
vertical plane by the overhang 17 of the electronic component
chassis. Thus, the risk of accidental disconnection is minimized,
and the profile of the power supply cord 16 that extends beyond the
profile of the chassis 10 is minimized relative to the overall
profile of the system.
[0025] In an embodiment, a face 20 of the electronic component
chassis 15 follows a contour at approximately a first distance from
its opposite face. To create the overhang, the face of the
sub-chassis 13 is in an approximately parallel relationship to the
plane of the face 20, but disposed inward in the direction towards
the opposite face of electronic component chassis 15. Accordingly,
the "loop" of the power supply cord 16 coupling the power supply 12
and the electronic component 14 is protected by the overhang
created by the electronic component chassis 15 and the sub-chassis
13. Thus, the cord 16 impinges across the plane of the face 20 in a
less intrusive manner than if the face 20 and a back face 18 of the
sub-chassis 13 were at approximately the same distance from the
front edge of the chassis assembly.
[0026] FIG. 2 is a cutaway top plan view of a housing for
electronic components with an attached power supply chassis in
accordance with an embodiment of the present invention. In this
embodiment, the chassis 10 has a plurality of power supplies 12a-d.
A plurality of power supply cords 16a-d couple the respective power
supplies 12a-d to the specific components within the chassis 10.
The face 20 indicates the edge of the chassis housing the
electronic components. The back face 18 of the sub-chassis 13 is
indicated as well in the drawing. The diagram indicates that the
cords tend to be placed in the described design under the ledge or
within the indentation provided by the interaction of the faces of
the chassis. In this manner, the couplings will more likely not be
disturbed, since the silhouette of the chassis tends to protect the
length of the couplings form external interference.
[0027] In one embodiment, the power supplies are placed within
portions of the sub-chassis 13. Each of the power supplies 12a-d
can be isolated from the other supplies by a structure, such as the
walls 24a-c, noted in FIG. 2. This helps protect the individual
power supplies.
[0028] It should be noted that the majority of the length of the
power couplings 16a-d are contained in the volume under the
overhang defined by the face 20 of the electronic component chassis
15. Thus, there is a lesser chance of the power cords 16a-d
snagging on any foreign object that might come into proximity to
the chassis, since power cords 16a-d tend to be protected under the
overhang structure and within the indentation defined by the face
of the sub-chassis 13 with respect to the electronic component
chassis 15.
[0029] Further, the indentation/overhang aspect of the chassis
ensures that the power couplings must extend in a horizontal manner
at least the distance between the indented face 18 of the
sub-chassis 13 and the overhanging back face 20 the electronic
component chassis 15. Thus, the power cords 16a-d have less "play"
in them, since it is used in horizontal extension. As such, the
power cords 16a-d tend to run straighter between the power supplies
12a-d and the associated connection points into the electronic
component chassis 15. This tends to result in neater defined
coupling lines, less "tangling" of cords, and less length of cord
to dangle outside the silhouette of the chassis 10 as with other
types of conventional chassis designs.
[0030] FIG. 3 is a cutaway side view of an alternative housing for
electronic components with an attached power supply chassis in
accordance with an embodiment of the present invention. Many of the
features as shown in FIG. 1 are present in this embodiment,
including the overhang/indented orientation of the sub-chassis 13
housing the power supply 12. In this embodiment, however, a cover
26 is placed over the indentation/overhang created by the
electronic component chassis 15 and the sub-chassis 13. In effect,
the cover "squares off" the form of the overall chassis. This
allows the power cord 16 to be even more protected from external
interference. In this case, the power coupling is almost completely
protected from external interference when it runs from the
sub-chassis 13 to the electronic component chassis 15.
[0031] FIG. 4 is cutaway top view of the housing for electronic
components with an attached power supply chassis of FIG. 3, in
accordance with an embodiment of the present invention. FIG. 4
shows that the cover 26 of FIG. 3 can be made with the same
protective structures as mentioned in FIG. 2. The structures within
the cover 26 tend to isolate the power supplies 16a-d from each
other. Thus, the same protection afforded the power supplies from
mishaps happening with the other power supplies is continued into
the cover 26 with the continuation of the protective structures
into the cover 26.
[0032] Should one of the power supplies 16a-d suffer adverse
circumstances, the protective structures in the cover 26 shield the
other power supplies such circumstances. Thus, in addition to
protecting the couplings 16a-d, the cover also serves to protect
the power supplies 16a-d.
[0033] FIG. 5 is a perspective view of the housing, and the
optional cover, according to an embodiment of the present
invention. The perspective view shows the indented sub-chassis 13
housing the power supply 12, and the power cord 16 connecting the
power supply to an electronic component. This view gives an idea
that the indentation/overhang provides protection to the power
coupling 16 from interference via external sources. Further, when
the cover 26 is placed into the indentation volume, the structures
within the cover 26 give further protection to the unit.
[0034] The cover 26 can be coupled by a variety of mechanisms to
the chassis 10. Those of ordinary skill in the art will now know
that these many coupling mechanisms exist, and this application
should be read as including them. Further, those of ordinary skill
in the art will now realize that the cover 26 may be coupled to the
sub-chassis 13. Or the cover 26 may be coupled electronic component
chassis 15. Again, this application should be read as including
these types of coupling devices, including slots, hooks, rails,
wings with fasteners, to name just a few.
[0035] FIG. 6 is a cutaway side view of a housing for electronic
components with an attached power supply chassis in accordance with
an embodiment of the present invention. On this chassis, the
orientation of the connecting face between the back face 20 of the
electronic component chassis 15 and the sub-chassis 13 is different
than that depicted in the other drawings. Those of ordinary skill
in the art will now realize that the connecting face can be
oriented in a number of differing ways, and this description should
be read to include those orientations.
[0036] FIG. 7 is a cutaway side view of a housing for electronic
components with an attached power supply chassis in accordance with
an embodiment of the present invention. On this chassis, the
orientation of the back face 20 of the electronic component chassis
15 and corresponding face 18 of the sub-chassis 13 is different
than that depicted in the other drawings. In this case, it should
be noted that the face 20 and the face 18 are not in a parallel
relationship. However, the overhang/indentation relationship
between the faces is present. Those of ordinary skill in the art
will now realize that the faces of the various chasses can be
oriented in a number of differing ways relative to one another, and
this description should be read to include those orientations.
[0037] FIG. 8 is a cutaway side view of a housing for electronic
components with an attached power supply chassis in accordance with
an embodiment of the present invention. In this chassis, the
vertical relationship between the electronic component chassis 15
and the sub-chassis 13 is reversed. Those of ordinary sill in the
art will now realize that the vertical relationship between the
chasses may be reversed, or that any number of sub-chasses and
electronic chasses may be used in the context of the invention.
[0038] FIG. 9 is a cutaway side view of a housing for electronic
components with an attachable power supply chassis in accordance
with an embodiment of the present invention. In this chassis, the
sub-chassis 13 is modular, and operable to be attached to the
electronic component chassis 15.
[0039] FIG. 10 is a cutaway side view of a housing for electronic
components with multiple chasses in accordance with an embodiment
of the present invention. In this aspect of the invention, the
chassis 10 has multiple electronic component chasses in conjunction
with a single sub-chassis. Those of ordinary skill in the art will
now realize that any number of electronic component chasses may be
utilized, as well as any number of sub-chasses, in the context of
the invention.
[0040] Accordingly, a system and method for housing power supplies
associated with an electronic device is described and illustrated.
Those of ordinary skill in the art will now recognize that many
modifications and variations of the present invention are possible
without departing from the invention. Of course, the various
features depicted in each of the figures and the accompanying text
may be combined together. Accordingly, it should be clearly
understood that the present invention is not intended to be limited
by the particular features specifically described and illustrated
in the drawings, but the concept of the present invention is to be
measured by the scope of the appended claims. It should be
understood that various changes, substitutions, and alterations
could be made hereto without departing from the spirit and scope of
the invention as described by the appended claims that follow.
* * * * *