U.S. patent application number 11/474574 was filed with the patent office on 2008-01-17 for talking toy ball having impact data sensor.
Invention is credited to Mark J. Chernick, Webb T. Nelson, Simeon E. Tiefel.
Application Number | 20080015064 11/474574 |
Document ID | / |
Family ID | 38949945 |
Filed Date | 2008-01-17 |
United States Patent
Application |
20080015064 |
Kind Code |
A1 |
Nelson; Webb T. ; et
al. |
January 17, 2008 |
Talking toy ball having impact data sensor
Abstract
A toy ball assembly and its method of operation. The toy ball
assembly speaks or otherwise communicates with the person playing
with the toy ball assembly. Within the toy ball assembly, an
electronic module is provided. The electronics module holds a
battery, an activation switch, a processor, an impact sensor, an
audio signal memory and a speaker. The electronics module is
encased deep within the center of a high-bounce ball. Channels are
formed into the material of the high-bounce ball to provide
unobstructed access to both the activation switch and the speaker.
The impact sensor provides an impact signal to the processor each
time the ball impacts a surface. Utilizing the impact signal, the
processor selects an audio signal from the audio signal memory. The
speaker receives and broadcasts the selected audio signal.
Inventors: |
Nelson; Webb T.;
(Woodinville, WA) ; Tiefel; Simeon E.; (Kenmore,
WA) ; Chernick; Mark J.; (Woodinville, WA) |
Correspondence
Address: |
LAMORTE & ASSOCIATES P.C.
P.O. BOX 434
YARDLEY
PA
19067
US
|
Family ID: |
38949945 |
Appl. No.: |
11/474574 |
Filed: |
June 26, 2006 |
Current U.S.
Class: |
473/571 |
Current CPC
Class: |
A63B 2071/0625 20130101;
A63H 5/00 20130101; A63B 2071/063 20130101; A63B 2220/803 20130101;
A63B 43/00 20130101 |
Class at
Publication: |
473/571 |
International
Class: |
A63B 43/00 20060101
A63B043/00 |
Claims
1. A method comprising the steps of: providing an electronics
module that includes a battery, a processor, an impact sensor, an
audio signal memory, and a speaker; encasing said electronics
module inside a ball; wherein said impact sensor provides an impact
signal to said processor each time said ball impacts a surface, and
said processor selects an audio signal from said audio signal
memory based upon said impact signal, and wherein said speaker
receives and broadcasts said audio signal.
2. The method according to claim 1, further including the step of
providing a conduit in said ball that aligns with said speaker in
said electronics module, therein providing an unobstructed pathway
out of said ball for sounds broadcast by said speaker.
3. The method according to claim 1, wherein said step of encasing
said electronics module inside a ball includes providing an
activation switch as part of said electronics module.
4. The method according to claim 3, further including the step of
providing a conduit in said ball that aligns with said activation
switch, therein providing unobstructed access to said activation
switch.
5. The method according to claim 1, wherein said processor counts
each said impact signal received from said impact sensor, therein
creating a cumulative count.
6. The method according to claim 5, wherein said audio signal
selected from said audio signal memory corresponds to said
cumulative count.
7. The method according to claim 1, wherein said processor
calculates bounce height from said impact signal received from said
impact sensor.
8. The method according to claim 7, wherein said audio signal
selected from said audio signal memory corresponds to said bounce
height.
9. The method according to claim 1, wherein said processor
calculates ball impact speed from said impact signal received from
said impact sensor.
10. The method according to claim 9, wherein said audio signal
selected from said audio signal memory corresponds to said ball
impact speed.
11. A method of broadcasting impact information about a ball,
comprising the steps of: providing a ball containing an impact
sensor that produces an impact signal, when said ball is impacted,
that is proportional to how hard said ball is impacted; detecting
when said ball impacts a surface; retrieving one of a plurality of
audio signals from an audio signal memory depending upon said
impact signal; and broadcasting said audio signal from said
ball.
12. The method according to claim 11, further including the step of
calculating bounce height of said ball from said impact signal,
wherein said audio signal identifies said bounce height.
13. The method according to claim 11, further including the step of
calculating the impact speed of said ball from said impact signal,
wherein said audio signal identifies said impact speed.
14. The method according to claim 11, further including the step of
calculating cumulative impacts of said ball from cumulative
occurrences of said impact signal, wherein said audio signal
identifies said cumulative impacts.
15. The method according to claim 11, wherein said step of
providing a ball containing an impact sensor, includes providing a
ball containing an internal electronics module, wherein said
electronics module holds said impact sensor and a speaker.
16. A novelty ball, comprising: a ball structure of resilient
material, wherein said ball structure has an external first
diameter; a cavity centrally defined within said ball structure,
said cavity having a second diameter; an electronics module
containing a speaker retained in said cavity; a conduit descending
into said ball structure to said speaker, therein providing an
unobstructed pathway to said speaker.
17. The ball according to claim 16, wherein said electronics module
further includes an impact sensor.
18. The ball according to claim 16, wherein said electronics module
further includes an audio signal memory.
19. The ball according to claim 16, wherein said second diameter is
no greater than half of said first diameter.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] In general, the present invention relates to toy balls. More
particularly, the present invention relates to toy balls with
internal sensors that detect impact forces experienced by the
balls.
[0003] 2. Prior Art Description
[0004] Balls, in various forms, have been a favorite toy of
children for many centuries. During this long history, balls have
been created in countless forms using a wide variety of materials.
For example, a tennis ball has a different structure and is made
from different materials than is a baseball or a golf ball.
[0005] Most balls have an intended use. For instance, baseballs are
used in the game of baseball; soccer balls are used in the game of
soccer. Only a small percentage of balls that are sold every year
are just general use balls having no intended purpose other than a
child's play. The present invention is directed to such a general
use toy ball.
[0006] One of the most popular general use toy balls is known in
the toy industry as high-bounce balls. High-bounce balls are made
from dense, highly resilient polymers. This enables the ball to
reutilize over ninety percent of its kinetic energy after impacting
a hard surface. A high-bounce ball therefore has the ability to
bounce to nearly the same height from which it is dropped. This
enables high-bounce balls to bounce for long periods of time. It
also enables high-bounce balls to bounce very high if thrown
against the ground with force.
[0007] A high-bounce ball depends upon its large mass of resilient
polymer to rebound efficiently from an impact. A high-bounce ball
must, therefore, be solid or have a very thick shell in order to
retain its rebound characteristics. The requirement of such a thick
shell structure has limited the ways high-bounce balls can be
designed. If a ball is not made with the required thick shell, or
if the ball is not made from the right type of resilient polymers,
then the ball will not have the bounce characteristics of a proper
high-bounce ball.
[0008] In the toy industry, high-bounce balls have been molded in a
variety of different colors and patterns to make the high-bounce
balls more visually appealing to children. The change in color does
not effect the bounce characteristics of the ball. High-bounce
balls have also been molded with objects inside of them. Again, the
purpose is aesthetics to increase the visual appeal of the
high-bounce ball. Since the object is embedded deep inside the
high-bounce ball, the embedded object has no appreciable effect on
the bounce characteristics of the high-bounce ball.
[0009] Other than to change the visual appearance of a high bounce
ball, the technology of the high-bounce ball has remained stagnant
for decades. The same is not true for other types of balls. Many
other types of balls have incorporated microelectronics technology
to make the balls more interesting, if not better. For instance,
talking modules have been added to some prior art toy balls, so
that the balls can make sounds. Such prior art balls are
exemplified by U.S. Pat. No. 5,375,839 to Pagani, entitled Impact
Sensitive Talking Ball. However, such technology cannot be readily
added to high-bounce balls. High-bounce balls are commonly thrown
against hard surfaces with the full force of the thrower. Any part
of an electronics module that is exposed on the surface of the
high-bounce ball would be quickly broken from such impacts.
Furthermore, if part of an electronics module were to be exposed on
the impact area of the high-bounce ball, the high-bounce ball would
not bounce as expected.
[0010] Electronics have been added to balls that are intended to
experience extreme impacts. Such high tech balls are typically used
in golf. For example, golf balls exist with internal sensors that
measure impact. The data is transmitted to an external computer
using radio signals. Such prior art golf balls are exemplified by
U.S. Patent Application Publication No. 2005/0233815 to McCreary,
entitled Method Of Determining A Flight Trajectory And Extracting
Flight Data For A Trackable Golf Ball; and U.S. Patent Application
Publication No. 2005/0227784 to Corzillius, entitled Self-Recording
Golf Ball, Golf Ball Cup, and Reading Device System.
[0011] Internal sensors, such as those used in golf balls, are used
strictly for training purposes in helping a golfer improve his/her
game. The sensor system is unpractical to add to a child's toy
since the sensors are expensive, complex, and require an external
signal reading computer. Furthermore, the use of such a sensor
system in a toy ball would do little or nothing to improve the play
value of the toy.
[0012] A need therefore exists for a system and method for adding
an electronics module to the structure of a high-bounce ball,
wherein the electronic module will not detract from the bounce
characteristics of the ball and adds play value to the high-bounce
ball. This need is met by the present invention as described and
claimed below.
SUMMARY OF THE INVENTION
[0013] The present invention is a toy ball assembly and its method
of operation. The toy ball assembly speaks or otherwise
communicates with the person playing with the toy.
[0014] Within the toy ball assembly, an electronic module is
provided. The electronics module holds a battery, an activation
switch, a processor, an impact sensor, an audio signal memory and a
speaker. The electronics module is encased deep within the center
of a high-bounce ball. Channels are formed into the material of the
high-bounce ball to provide unobstructed access to both the
activation switch and the speaker.
[0015] The impact sensor provides an impact signal to the processor
each time the ball impacts a surface. Utilizing the impact signal,
the processor selects an audio signal from the audio signal memory.
The speaker receives and broadcasts the selected audio signal.
Depending upon the operation mode of the toy, the broadcast audio
signal may announce the velocity, bounce height and/or number of
bounces experienced by the toy ball.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] For a better understanding of the present invention,
reference is made to the following description of exemplary
embodiments thereof, considered in conjunction with the
accompanying drawings, in which:
[0017] FIG. 1 is an exploded perspective view of an exemplary
embodiment of the present invention;
[0018] FIG. 2 is a partially cross-sectioned view of the embodiment
of FIG. 1;
[0019] FIG. 3 is a schematic of the electronics embodies by the
present invention;
[0020] FIG. 4 is a block diagram showing the logic of a first
computational subroutine;
[0021] FIG. 5 is a block diagram showing the logic of a second
computational subroutine; and
[0022] FIG. 6 is a block diagram showing the logic of a third
computational subroutine.
DETAILED DESCRIPTION OF THE DRAWINGS
[0023] Although the present invention system and method can be
adapted for use in any type of molded toy ball, the present
invention is particularly well suited for use with high-bounce
balls. Accordingly, the exemplary embodiment shows a high-bounce
ball. The use of the high-bounce ball is merely exemplary and is
intended to represent the best mode contemplated for the invention.
The use of a high-bounce ball, however, should not be considered a
limitation on the use of the present invention in other ball
types.
[0024] Referring to FIG. 1, there is shown a ball assembly 10 in
accordance with the present invention. The ball assembly 10
includes two ball halves 12, 14. Each of the ball halves 12, 14 is
identical in structure. Accordingly, both ball halves 12, 14 can be
fabricated from the same cavity of an injection mold. Both ball
halves 12, 14 are made from the highly resilient polymers of the
types typically used in the production of high-bounce balls.
[0025] A semi-spherical relief 16 is formed in the center of both
ball halves 12, 14. Accordingly, it will be understood that when
the two ball halves 12, 14 are placed together, the semi-spherical
reliefs 16 combine to form a central spherical cavity 20.
[0026] Each semi-spherical relief 16 has a maximum diameter D2 that
is no more than half as large as the exterior diameter D1 of the
ball halves 12, 14. In this manner, it can be assured that a thick
layer of polymer material surrounds the central spherical cavity 20
throughout the toy ball assembly 10.
[0027] Two open channels 22, 24 extend into the toy ball assembly
10 and communicate with the central spherical cavity 20. The two
open channels 22, 24 are defined by half channel reliefs 26, 28
that are disposed on the opposite ball halves 12, 14. The two open
channels 22, 24 both have a maximum diameter that is less than ten
percent of the exterior diameter D1 of the toy ball assembly 10.
The use of small open channels 22, 24 is important in maintaining
the bounce characteristics of the overall toy ball assembly 10. By
having narrow open channels 22, 24, the open channels 22, 24 do not
significantly detract from the bounce characteristics of the toy
ball assembly 10 when the toy ball assembly 10 is impacted at or
near one of the open channels 22, 24. Bounce efficiency decreases
by only a couple of percentage points, which is usually
unperceivable by the user.
[0028] An electronics module 29 is provided. The electronics module
29 is defined by a protective casing 30. The protective casing 30
is spherical in shape and fills the central spherical cavity 20 in
the center of the toy ball assembly 10. The protective casing 30 is
made of a hard plastic. Accordingly, any deformation created in the
toy ball assembly 10 from an impact does not propagate through the
protective casing 30.
[0029] A circuit board 32 is disposed inside the protective casing
30. The circuit board 32 contains a small speaker 34, an activation
switch 36, batteries 38, an impact sensor 40 and at least once
microchip 42 containing a computational processor and an audio
signal memory. The protective casing 30 defines openings 43, 44
that enable the speaker 34 and the activation switch 36 to protrude
outside of the confines of the protective casing 30.
[0030] Referring to FIG. 2, it can be seen that when assembled, the
speaker 34 on the circuit board 32 aligns with one of the open
channels 24 in the toy ball assembly 10. Accordingly, any sound
produced by the speaker 34 can propagate outside of the toy ball
assembly 10 in an unobstructed manner.
[0031] Similarly, the activation switch 36 aligns with one of the
open channels 22 in the toy ball assembly 10. This enables the
activation switch 36 to be pressed by a user by using a pen tip or
similar object. The activation switch 36 remains deep enough inside
the open channel 24 that it is never effected by impact
deformations.
[0032] The impact sensor 40 can be an accelerometer, a vibration
sensor, or even a sound sensor. The impact sensor detects large
changes in acceleration, vibration, and/or sound that occur when
the toy ball assembly 10 impacts a hard surface. Depending upon the
nature of the impact sensor 40 selected, the impact sensor 40 may
not only detects the occurrence of an impact, but may detect the
severity of the impact. Thus, the impact sensor 40 may provide an
analog signal that is proportional to the magnitude of the impact.
For example, if the toy ball assembly 10 is dropped, it may
experience a change in acceleration of 1-2 G's on impact. If the
toy ball assembly 10 is thrown against a hard object, much higher
impact forces will be detected.
[0033] The computational processor embedded in one of the
microchips 42 receives signals from the impact sensor 40. The
computational processor runs algorithms using the signal data
received from the impact sensor 40. Three primary subroutines are
run by the circuitry of the computational processor. The first
subroutine utilizes a simple counting algorithm.
[0034] Referring to FIG. 3 in conjunction with FIG. 4, the details
of the counting subroutine will be understood. As is indicated by
Block 51, the computational processor 50 determines if a signal has
been detected from the impact sensor 40. Preferably, the
computational processor 50 determines if the impact signal
generated by the impact sensor 40 is larger than some preset
threshold. See Block 52. In this manner, the computational
processor 50 will distinguish real impact events from simple ball
manipulations in a child's hands.
[0035] If the signal from the impact sensor 40 surpasses the preset
threshold, the impact signal is counted. See Block 54. The
computational processor 50 then recalls an audio signal from a
preprogrammed audio signal memory 53, which is a read only memory
(ROM). The audio signal recalled corresponds to the count. See
Block 58. The audio signal is then sent to the speaker 34 where the
audio signal is broadcast. See Block 59. In this manner, the toy
ball assembly 10 will count and broadcast the number of times it
has been bounced. Thus, a child bouncing the toy ball assembly 10
will hear the words "one", "two", "three", etc.
[0036] The selection of the counting mode subroutine and the
resetting of the counting mode subroutine is done by selectively
pressing the activation switch 36.
[0037] The second subroutine run by the computational processor
contains a height calculation algorithm. Referring to FIG. 5 in
conjunction with FIG. 3, the details of the second subroutine are
detailed. The material of the ball halves 12, 14 (FIG. 1) is known,
as are the thickness of these parts. The resiliency and bounce
characteristics of the ball material can therefore be calculated or
measured.
[0038] If the impact sensor 40 is capable of sensing the magnitude
of an impact, then the computational processor 50 reads the signal
from the impact sensor 40 in order to determine the impact
magnitude. See Block 60. The intensity of the impact is then used
with the known ball bounce characteristics to calculate how high
the toy ball assembly 10 will bounce after experiencing that
impact. See Block 62.
[0039] If the impact sensor 40 is an unsophisticated sensor that
can just detect the occurrence of an impact, then the computational
processor 50 calculated the time that elapses in between impacts.
The time in between impact corresponds directly to the time the toy
ball assembly 10 is in flight. Knowing the flight time for the toy
ball assembly 10, an estimate of the height achieved by the toy
ball assembly can easily be calculated.
[0040] Once the height of the toy ball assembly 10 has been
calculated, the computational processor 50 then recalls an audio
signal from the audio signal memory 53 corresponding to the
calculated height. See Block 66. The audio signal is then broadcast
for the child to hear. See Block 67. Consequently, a child who
throws the toy ball assembly 10 against the ground may hear "one
hundred feet" broadcast from the ball. The value broadcast is a
calculated value for the bounce height of the toy ball assembly
10.
[0041] In FIG. 5, an optional subroutine is also shown. As is
indicated by Block 68, the computational processor 50 can also
calculate the speed of the toy ball assembly 10 at impact from the
signal of the impact sensor 40. The speed at impact is directly
proportional to the forces at impact. Consequently, calculating the
speed of the toy ball assembly 10 from the impact data is a simple
calculation. The computational processor 50 may then broadcast the
calculated speed with or without the calculated bounce height.
[0042] Again, the selection of the height calculation subroutine or
speed calculation subroutine is done by the selective engagement of
the activation switch 36.
[0043] The last subroutine run by the computational processor 50
contains a novelty algorithm. Referring to FIG. 6 in conjunction
with FIG. 3, the details of this subroutine are described. As is
indicated by Block 70, the computational processor 50 determines
the degree of impact from the impact sensor 40. The severity of the
detected impact is used to select an audio signal from the audio
signal memory 53. See Block 72. The audio signals in the audio
signal memory 53 are all novelty words or phases that are intended
to be encouraging or humorous. The selected audio signal is then
broadcast through the speaker 34. See Block 74. For instance, if
the impact sensor 40 detects a large impact, the computational
processor 50 may broadcast the words "Wow" or "Good Throw". If a
mild impact is detected, the computational processor 50 may
broadcast "You Stink" or "You Can Throw Harder Than That".
[0044] Depending upon which of the subroutines is selected, there
is a time delay in the broadcasting of the audio signal. If the toy
ball assembly 10 is counting out loud, a short delay of perhaps 0.5
to 1.0 seconds may be used. For the other applications, the toy
ball assembly 10 may be in flight for a few seconds after bouncing.
The audio signal is therefore delayed by a few seconds to ensure
that a child can catch the toy ball assembly 10 and hear the words
that are being broadcast. It will be understood that the words
and/or phrases to be broadcast are a matter of design choice.
[0045] Referring now back to FIG. 2, it will be understood that
neither the speaker 34 nor the activation switch 36 are exposed on
the exterior of the toy ball assembly 10. Consequently, neither of
these objects can be directly impacted when the toy ball assembly
10 bounces. Furthermore, when a high-bounce ball is thrown against
a hard object, the vast majority of deformation occurs only in the
outermost 25% of the ball's structure. Consequently, by placing an
electronics module 29 into the center of a high-bounce ball that is
less than half the diameter of the high-bounce ball, more than 25%
of the ball's resilient material surrounds the electronics module
29. The presence of the electronics module 29 in the high-bounce
ball therefore has little adverse effect upon the bounce
characterizes of the overall toy ball assembly 10.
[0046] Referring back to FIG. 1, a preferred method of manufacture
for the toy ball assembly 10 can be detailed. To manufacture the
toy ball assembly 10, the two ball halves 12, 14 are molded. The
two ball halves 12, 14 are identical. The electronics module 29 is
separately manufactured using traditional manufacturing techniques.
The electronics module 29 is placed in between the ball halves 12,
14 in the proper orientation. The two ball halves 12, 14 are then
bonded together, therein trapping the electronics module 29 in the
central spherical cavity 20.
[0047] It will be understood that the embodiment of the present
invention that is illustrated is merely exemplary and that a person
skilled in the art can make many variations to the shown
embodiment. For instance, the size of the electronics module, the
size of the ball, the material of the ball, and the position of the
open conduits can all be varied from what is described and
illustrated. All such variations, modifications and alternate
embodiments are intended to be included within the scope of the
present invention as set forth by the claims.
* * * * *