U.S. patent application number 11/427878 was filed with the patent office on 2008-01-03 for heat sink assembly having retaining device with relatively better heat dissipation effectiveness.
This patent application is currently assigned to Malico Inc.. Invention is credited to Robert Liang.
Application Number | 20080002368 11/427878 |
Document ID | / |
Family ID | 38792897 |
Filed Date | 2008-01-03 |
United States Patent
Application |
20080002368 |
Kind Code |
A1 |
Liang; Robert |
January 3, 2008 |
HEAT SINK ASSEMBLY HAVING RETAINING DEVICE WITH RELATIVELY BETTER
HEAT DISSIPATION EFFECTIVENESS
Abstract
The proposed heat sink assembly mounted on a heat source
includes a heat sink including a base with a top surface and a
plurality of fins, and a retaining device including a frame with a
top, a hole with a size larger than that of the base, an elastic
rod connected with the frame, extending into the hole and having an
end portion protruding towards the hole and pushing the heat sink
and a plurality of retaining plates extending downwards from one of
the first two and the second two opposite sides. Each of the
retaining plates has a barb mounting the heat sink on the heat
source and making the top surface raise through the hole to a same
height of the top to facilitate the heat dissipation.
Inventors: |
Liang; Robert; (Taoyuan
County, TW) |
Correspondence
Address: |
ALSTON & BIRD LLP
BANK OF AMERICA PLAZA, 101 SOUTH TRYON STREET, SUITE 4000
CHARLOTTE
NC
28280-4000
US
|
Assignee: |
Malico Inc.
|
Family ID: |
38792897 |
Appl. No.: |
11/427878 |
Filed: |
June 30, 2006 |
Current U.S.
Class: |
361/710 ;
257/E23.086 |
Current CPC
Class: |
H01L 23/4093 20130101;
H01L 2224/16 20130101; H01L 2224/73253 20130101; Y10T 24/44026
20150115 |
Class at
Publication: |
361/710 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A heat sink assembly dissipating heat from a heat source having
a first top, comprising: a heat sink, comprising: a base having a
top surface; and a plurality of fins formed on said top surface and
forming a plurality of gaps therebetween; and a retaining device,
comprising: a frame having a second top and a hole with a size
larger than that of said base; an elastic rod connected with said
frame, extending into said hole and having an end portion
protruding towards said hole, falling into one of said plurality of
gaps and pushing said heat sink; and a plurality of retaining
plates extending downwards from said frame and each having a barb
mounting said heat sink on said first top and making said top
surface raise through said hole only to a same height of said
second top.
2. The assembly according to claim 1, wherein said elastic rod is
extending along one of said plurality of gaps and bending towards
said hole at said end portion.
3. The assembly according to claim 1, wherein said retaining device
further comprises two bottom plates, said frame further comprises a
first pair and a second pair of opposite sides, two of said
plurality of retaining plates extend from said first pair of
opposite sides, and said two bottom plates position said heat sink
and extend downwards from said second pair of opposite sides.
4. The assembly according to claim 1, wherein said retaining device
further comprises two bottom plates, said frame further comprises a
first pair and a second pair of opposite sides, two of said
plurality of retaining plates extend from said second pair of
opposite sides, and said two bottom plates position said heat sink
and extend downwards from said first pair of opposite sides.
5. The assembly according to claim 4, wherein said elastic rod,
said plurality of retaining plates and said two bottom plates are
all integrally formed with said frame.
6. The assembly according to claim 1, wherein said base further
comprises a base plate.
7. The assembly according to claim 6, wherein a distance from said
second top to said barb equals to a sum of a thickness of said base
plate and a thickness of said first top.
8. The assembly according to claim 1, wherein a distance from said
second top to said barb equals to a sum of a thickness of said base
and a thickness of said first top.
9. The assembly according to claim 1, wherein said frame and said
plurality of gaps at said same height could facilitate a
dissipation of said heat generated by said heat source when said
heat sink is mounted on said first top.
10. The assembly according to claim 1, wherein said frame further
comprises a plurality of bottom plates positioning said heat sink
and extending downwards from said frame.
11. A heat sink assembly dissipating heat from a heat source having
a first top, comprising: a heat sink, comprising: a base having a
top surface; and a plurality of fins formed on said top surface and
forming a plurality of gaps therebetween; and a retaining device,
comprising: a frame having a second top and a hole with a size
larger than that of said base; an elastic rod connected with said
frame, extending into said hole and having an end portion
protruding towards said hole, falling into one of said plurality of
gaps and pushing said heat sink; and a plurality of retaining
plates extending downwards from said frame and each having a barb
mounting said heat sink on said first top and making said top
surface raise through said hole only to a height relatively higher
than that of the second top.
12. A heat sink assembly dissipating heat from a heat source having
a first top, comprising: a heat sink, comprising: a base having a
top surface; and a plurality of fins formed on said top surface and
forming a plurality of gaps therebetween; and a retaining device,
comprising: a frame having a second top and a hole with a size
larger than that of said base; an elastic rod connected with said
frame, extending into said hole and having an end portion
protruding towards said hole, falling into one of said plurality of
gaps and pushing said heat sink; and a plurality of retaining
plates extending downwards from said frame and each having a barb
mounting said heat sink on said first top.
13. The assembly according to claim 12, wherein said top surface
rises through said hole only to a height relatively lower than that
of said second top.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a heat sink assembly
including a heat sink and a retaining device and more particularly
to a heat sink retaining device having a frame, which reaches the
same height as that of a base of the heat sink when the heat sink
is mounted on a heat source, to facilitate the heat
dissipation.
BACKGROUND OF THE INVENTION
[0002] Nowadays, many electronic devices such as chipsets and RAMs
would generate large amounts of heat during the operation. The heat
must be removed efficiently. Otherwise, malfunction or damage may
result. Due to the increasingly requirements in heat dissipation,
various kinds of heat sink assemblies are proposed so as to
dissipate the heat generated by the electronic devices more
effectively.
[0003] Please refer to FIG. 1, which is an exploded perspective
view of a conventional heat sink assembly 1 having a heat sink 11
and a retaining device 12, which is employed to mount the heat sink
11 on a first top 210 of a chipset assembly 2 (a heat source) so as
to dissipate the heat generated by the heat source. The chipset
assembly 2 further includes a chipset 21 having the first top 210,
a substrate 22 and a PC board 23. The heat sink 11 further includes
a plurality of fins 111 and a base 112 having a top surface 1121
and a base plate 1122. The retaining device 12 further includes a
frame 121 having a second top 1210, four side portions 1211 and a
hole 1212 with a size smaller than that of the base 112, two
retaining plates 122 each with a barb 1221 mounting the heat sink
11 on the first top 210 of the chipset assembly 2, four elastic
rods 123 extending inwards the hole from the second top 1210 of the
frame 121 and each with a end portion 1231 bending towards the hole
1212 and pressing the heat sink 11, two positioning columns 124
extending downwards from the frame 121 and positioning the heat
sink 11.
[0004] FIG. 2 is a schematic diagram showing that the conventional
heat sink assembly 1 is mounted on the first top 210 of the chipset
assembly 2. FIGS. 3(a) and 3(b) are a transverse cross sectional
view of the conventional heat sink assembly 1 and the chipset
assembly 2 of FIG. 2 and a longitudinal cross sectional view of the
conventional heat sink assembly 1 and the chipset assembly 2 of
FIG. 2 respectively. Referring to FIGS. 3(a) and 3(b), notice that
the frame 121 would cover an outer portion of the base 112 such
that no fin could be formed on the outer portion of the top surface
1121 of the base 112, which is covered by the frame 121 firstly.
Thus, relatively the heat dissipation effectiveness of the heat
sink assembly 1 would be lower since the heat sink 11 has less
number of fins 111 secondly. And the airflow flows through the
plurality of gaps 1111 formed therebetween the plurality of fins
111 would be blocked by the frame 121, which will dramatically damp
the heat dissipation effectiveness of the heat sink assembly 1
especially when the height of the plurality of fins is relatively
lower as is the case of FIG. 2 thirdly. These are the main
drawbacks of the above-mentioned conventional heat sink assembly
1.
[0005] Keeping the drawbacks of the prior art in mind, and
employing experiments and research full-heartily and persistently,
the applicant finally conceived a heat sink assembly having a
retaining device with relatively better heat dissipation
effectiveness.
SUMMARY OF THE INVENTION
[0006] It is therefore an object of the present invention to
propose a heat sink assembly having a retaining device with
relatively better heat dissipation effectiveness.
[0007] According to a first aspect of the present invention, the
heat sink assembly dissipating a heat from a heat source having a
first top includes a heat sink including a base having a top
surface and a plurality of fins formed on the top surface and
forming a plurality of gaps therebetween and a retaining device
including a frame having a second top and a hole with a size larger
than that of the base, an elastic rod connected with the frame,
extending into the hole and having an end portion protruding
towards the hole, falling into one of the plurality of gaps and
pushing the heat sink and a plurality of retaining plates extending
downwards from the frame and each having a barb mounting the heat
sink on the first top and making the top surface raise through the
hole only to a same height of the second top.
[0008] Preferably, the elastic rod is extending along one of the
plurality of gaps and bending towards the hole at the end
portion.
[0009] Preferably, the retaining device further includes two bottom
plates, the frame further includes a first pair and a second pair
of opposite sides, two of the plurality of retaining plates extend
from the first pair of opposite sides, and the two bottom plates
position the heat sink and extend downwards from the second pair of
opposite sides.
[0010] Preferably, the retaining device further includes two bottom
plates, the frame further includes a first pair and a second pair
of opposite sides, two of the plurality of retaining plates extend
from the second pair of opposite sides, and the two bottom plates
position the heat sink and extend downwards from the first pair of
opposite sides.
[0011] Preferably, the elastic rod, the plurality of retaining
plates and the two bottom plates are all integrally formed with the
frame.
[0012] Preferably, the base further includes a base plate.
[0013] Preferably, a distance from the second top to the barb
equals to a sum of a thickness of the base plate and a thickness of
the first top.
[0014] Preferably, a distance from the second top to the barb
equals to a sum of a thickness of the base and a thickness of the
first top.
[0015] Preferably, the frame and the plurality of gaps at the same
height could facilitate a dissipation of the heat generated by the
heat source when the heat sink is mounted on the first top.
[0016] Preferably, the frame further includes a plurality of bottom
plates positioning the heat sink and extending downwards from the
frame.
[0017] According to a second aspect of the present invention, the
heat sink assembly dissipating a heat from a heat source having a
first top includes a heat sink including a base having a top
surface and a plurality of fins formed on the top surface and
forming a plurality of gaps therebetween and a retaining device
including a frame having a second top and a hole with a size larger
than that of the base, an elastic rod connected with the frame,
extending into the hole and having an end portion protruding
towards the hole, falling into one of the plurality of gaps and
pushing the heat sink and a plurality of retaining plates extending
downwards from the frame and each having a barb mounting the heat
sink on the first top and making the top surface raise through the
hole only to a height relatively higher than that of the second
top.
[0018] According to a third aspect of the present invention, the
heat sink assembly dissipating a heat from a heat source having a
first top includes a heat sink including a base having a top
surface and a plurality of fins formed on the top surface and
forming a plurality of gaps therebetween and a retaining device
including a frame having a second top and a hole with a size larger
than that of the base, an elastic rod connected with the frame,
extending into the hole and having an end portion protruding
towards the hole, falling into one of the plurality of gaps and
pushing the heat sink and a plurality of retaining plates extending
downwards from the frame and each having a barb mounting the heat
sink on the first top.
[0019] Preferably, the top surface rises through the hole only to a
height relatively lower than that of the second top.
[0020] The present invention may best be understood through the
following descriptions with reference to the accompanying drawings,
in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIG. 1 is an exploded perspective view of a conventional
heat sink assembly and a chipset assembly in the prior art;
[0022] FIG. 2 is a schematic diagram showing that the conventional
heat sink assembly and the chipset assembly of FIG. 1 are
assembled;
[0023] FIG. 3(a) is a transverse cross sectional view of the
conventional heat sink assembly and the chipset assembly of FIG.
2;
[0024] FIG. 3(b) is a longitudinal cross sectional view of the
conventional heat sink assembly and the chipset assembly of FIG.
2;
[0025] FIG. 4 is an exploded perspective view of a preferred
embodiment of the proposed heat sink assembly and a chipset
assembly in the present invention;
[0026] FIG. 5 is a schematic diagram showing that the proposed heat
sink assembly and the chipset assembly of FIG. 4 are assembled;
[0027] FIG. 6(a) is a transverse cross sectional view of the
preferred embodiment of the proposed heat sink assembly and the
chipset assembly of FIG. 5; and
[0028] FIG. 6(b) is a longitudinal cross sectional view of the
preferred embodiment of the proposed heat sink assembly and the
chipset assembly of FIG. 5.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0029] Please refer to FIG. 4, which shows an exploded perspective
view of a preferred embodiment of the proposed heat sink assembly 3
having a heat sink 31 and a retaining device 32, which is employed
to mount the heat sink 31 on a first top 210 of a chipset assembly
2 in the present invention. The chipset assembly 2 includes the
first top 210, a chipset 21, a substrate 22 and a PC board 23. The
heat sink 31 further includes a plurality of fins 311 and a base
312 having a top surface 3121 and a base plate 3122. The retaining
device 32 further includes a frame 321 having a second top 3210,
four side portions 3211 and a hole 3212 with a size larger than the
base 312. The four side portions 3211 further include a first two
and a second two opposite sides (32111 and 32112 respectively) and
surround the hole 3212. The retaining device 32 further includes
two retaining plates 322 each with a barb 3221 mounting the heat
sink 31 on the first top 210 of the chipset assembly 2, two elastic
rods 323 connected with the frame 321, extending inwards into the
hole 3212 and each with a end portion 3231 protruding towards the
hole 3212, falling into one of the plurality of gaps 3111 formed
therebetween the plurality of fins 311 and pressing the heat sink
31 and two bottom plates 324 positioning the heat sink 31. The two
retaining plates 322 are extending downwards from one of the first
two and the second two opposite sides (32111 and 32112), and the
two barbs 3221 are employed to mount the heat sink 31 on the first
top 210 and make the top surface 3121 raise through the hole 3212
to the same height of the second top 3210 and position the heat
sink 31 so as to facilitate the dissipation of a heat generated by
the chipset assembly 2, which is a heat source (see FIG. 5). Notice
that there are also many fins formed on an outer portion of the top
surface 3121 of the base 312 and the frame 321 having the second
top 3210 located at the same height as the top surface 3121 of the
base 312 would not block the airflow flowing through the plurality
of gaps 3111 formed therebetween the plurality of fins 311. Thus,
relatively the proposed heat sink assembly 1 having more fins and
airflows for cooling could dissipate the heat generated by the heat
source, the chipset assembly 2, more effectively.
[0030] FIG. 5 is a schematic diagram showing that the proposed heat
sink assembly 3 having the heat sink 31 and the retaining device 32
is mounted on the first top 210 of the chipset assembly 2.
[0031] FIG. 6(a) shows a transverse cross sectional view of the
preferred embodiment of the proposed heat sink assembly 3 and the
chipset assembly 2 of FIG. 5, and FIG. 6(b) is a longitudinal cross
sectional view of the preferred embodiment of the proposed heat
sink assembly 3 and the chipset assembly 2 of FIG. 5
respectively.
[0032] In conclusion, the present invention would effectively
improve the drawbacks of the prior art, and further enhance the
heat transfer since each of the two retaining plates 322 has a barb
3221 mounting the heat sink 31 on the first top 210 and making the
top surface 3121 raise through the hole 3212 to the same height of
the second top 3210 such that the plurality of fins 311 could be
formed on the outer portion of the top surface 3121 of the base
312, which is not covered by the frame 321 anymore, and the airflow
flows through the plurality of gaps 3111 formed therebetween the
plurality of fins 311 would not be blocked by the frame 321. The
proposed heart sink assembly 3 including the heat sink 31 and the
retaining device 32 would have a relatively better heat dissipation
effectiveness. Thus, the present invention has its value in the
industry, and the purpose of developing the present invention is
achieved.
[0033] While the invention has been described in terms of what are
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention need not be
limited to the disclosed embodiment. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all such modifications and similar structures. Therefore,
the above description and illustration should not be taken as
limiting the scope of the present invention which is defined by the
appended claims.
* * * * *