U.S. patent application number 11/837873 was filed with the patent office on 2007-12-20 for anisotropic conductive connector and circuit-device electrical inspection device.
This patent application is currently assigned to JSR CORPORATION. Invention is credited to Kazuo Inoue, Katsumi SATO.
Application Number | 20070293062 11/837873 |
Document ID | / |
Family ID | 33295990 |
Filed Date | 2007-12-20 |
United States Patent
Application |
20070293062 |
Kind Code |
A1 |
SATO; Katsumi ; et
al. |
December 20, 2007 |
ANISOTROPIC CONDUCTIVE CONNECTOR AND CIRCUIT-DEVICE ELECTRICAL
INSPECTION DEVICE
Abstract
An anisotropically conductive connector having a frame plate, in
which a plurality of openings have been formed in accordance with a
pattern corresponding to electrodes to be connected, and an elastic
anisotropically conductive film composed of a plurality of
functional parts arranged in the respective openings of the frame
plate. The conductive film is composed of a conductive part for
connection extending in a thickness-wise direction of the film and
an insulating part formed integrally with the conductive part.
Conductive parts for high-frequency shielding are arranged to
surround each of the conductive parts for connection, electrically
connected to the frame plate and extending in the thickness-wise
direction, and are formed in the part to be supported in the
elastic anisotropically conductive film. The frame plate is
connected to a ground.
Inventors: |
SATO; Katsumi; (Tokyo,
JP) ; Inoue; Kazuo; (Tokyo, JP) |
Correspondence
Address: |
OBLON, SPIVAK, MCCLELLAND MAIER & NEUSTADT, P.C.
1940 DUKE STREET
ALEXANDRIA
VA
22314
US
|
Assignee: |
JSR CORPORATION
Chuo-ku
JP
|
Family ID: |
33295990 |
Appl. No.: |
11/837873 |
Filed: |
August 13, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10552995 |
Oct 13, 2005 |
7255579 |
|
|
PCT/JP04/04891 |
Apr 5, 2004 |
|
|
|
11837873 |
Aug 13, 2007 |
|
|
|
Current U.S.
Class: |
439/91 ;
257/E23.067; 257/E23.07 |
Current CPC
Class: |
G01R 1/0735 20130101;
H01L 2924/0002 20130101; H01L 23/49827 20130101; H01L 23/49838
20130101; H01R 13/2414 20130101; H01L 2924/0002 20130101; H01L
2924/00 20130101 |
Class at
Publication: |
439/091 |
International
Class: |
H01R 4/58 20060101
H01R004/58 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 16, 2003 |
JP |
2003-111225 |
Claims
1. An anisotropically conductive connector comprising: a frame
plate having conductivity, in which a plurality of openings have
been formed in accordance with a pattern corresponding to
electrodes to be connected; and an elastic anisotropically
conductive film composed of a plurality of functional parts
arranged in the respective openings of the frame plate and composed
of a conductive part for connection extending in a thickness-wise
direction of the film and an insulating part formed integrally with
the periphery of the conductive part, and a part to be supported,
which is formed integrally with the peripheries of the functional
parts and fixed to the frame plate by being laminated on the frame
plate, wherein conductive parts for high-frequency shielding
arranged so as to surround the each of conductive parts for
connection, electrically connected to the frame plate and extending
in the thickness-wise direction are formed in the part to be
supported in the elastic anisotropically conductive film, and the
frame plate is connected to a ground.
2. An anisotropically conductive connector comprising: a frame
plate having conductivity, in which an opening extending through in
a thickness-wise direction has been formed; and an elastic
anisotropically conductive film arranged in the opening of the
frame plate and composed of a functional part having a plurality of
conductive parts for connection arranged in accordance with a
pattern corresponding to electrodes to be connected and extending
in the thickness-wise direction and an insulating part mutually
insulating the conductive parts for connection, and a part to be
supported, which is formed integrally with the periphery of the
functional part and fixed to the frame plate by being laminated on
the frame plate, wherein a conductive part for high-frequency
shielding arranged so as to surround a group of conductive parts
including the plurality of the conductive parts for connection,
electrically connected to the frame plate and extending in the
thickness-wise direction is formed in the part to be supported in
the elastic anisotropically conductive film, and the frame plate is
connected to a ground.
3. An anisotropically conductive connector comprising: a frame
plate having conductivity, in which a plurality of openings have
been formed in accordance with a pattern corresponding to
electrodes to be connected; and an elastic anisotropically
conductive film composed of a plurality of functional parts
arranged in the respective openings of the frame plate and composed
of a conductive part for connection extending in a thickness-wise
direction of the film and an insulating part formed integrally with
the periphery of the conductive part, and a part to be supported,
which is formed integrally with the peripheries of the functional
parts and fixed to the frame plate by being laminated on the frame
plate, wherein a conductive part for high-frequency shielding
arranged so as to surround a group of conductive parts including
the plurality of the conductive parts for connection, electrically
connected to the frame plate and extending in the thickness-wise
direction is formed in the part to be supported in the elastic
anisotropically conductive film, and the frame plate is connected
to a ground.
4. The anisotropically conductive connector according to claim 1,
which comprises a plurality of conductive parts for high-frequency
shielding for surrounding the same conductive part for
connection.
5. The anisotropically conductive connector according to claim 4,
wherein a clearance distance between conductive parts for
high-frequency shielding adjoining each other, which surround the
same conductive part for connection, is at most 1/10 of a
wavelength of a measurement signal.
6. The anisotropically conductive connector according to claim 2,
wherein one or more conductive parts for non-connection are formed
in addition to the conductive parts for connection in the elastic
anisotropically conductive film, and the conductive parts for
high-frequency shielding are arranged so as to surround a group of
conductive parts including the plurality of the conductive parts
for connection and one or more conductive parts for
non-connection.
7. The anisotropically conductive connector according to claim 2, 3
or 6, which comprises a plurality of conductive parts for
high-frequency shielding surrounding the group of conductive parts
including the plurality of the conductive parts for connection.
8. The anisotropically conductive connector according to claim 7,
wherein a clearance distance between conductive parts for
high-frequency shielding adjoining each other, which surround the
group of conductive parts, is at most 1/10 of a wavelength of a
measurement signal.
9. An electrical inspection apparatus for circuit devices, which
comprises the anisotropically conductive connector according to
claim 1, 2, 3, 4, 5 or 6.
10. An electrical inspection apparatus for circuit devices,
comprising: a circuit board for inspection, on which inspection
electrodes have been formed in accordance with a pattern
corresponding to electrodes to be inspected of a circuit device,
which is an object of inspection, and the anisotropically
conductive connector according to claim 1, 2 or 3, which is
arranged on the circuit board for inspection, wherein in the
circuit board for inspection, grounding electrodes connected to a
ground are formed in accordance with a pattern corresponding to the
conductive parts for high-frequency shielding in the
anisotropically conductive connector.
11. An electrical inspection apparatus for circuit devices,
comprising: a circuit board for inspection, on which inspection
electrodes have been formed in accordance with a pattern
corresponding to electrodes to be inspected of a circuit device,
which is an object of inspection, and the anisotropically
conductive connector according to claim 1, 2 or 3, which is
arranged on the circuit board for inspection, wherein the frame
plate in the anisotropically conductive connector is connected to a
ground.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of and claims the benefit
of priority from U.S. Ser. No. 10/552,995, filed Oct. 13, 2005, and
now allowed, which is a National Stage application under 35 U.S.C.
.sctn. 371 of International Application PCT/JP04/04891, filed Apr.
5, 2004, and is based upon and claims the benefit of priority from
Japanese Patent Application No. 2003-111225, filed Apr. 16, 2003,
the entire contents of all of which are incorporated herein by
reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an anisotropically
conductive connector and an electrical inspection apparatus for
circuit devices, which is equipped with this anisotropically
conductive connector, and more particularly to an anisotropically
conductive connector and an electrical inspection apparatus for
circuit devices, which are suitable for use in electrical
inspection of a circuit device having a clock frequency of, for
example, at least 1 GHz.
[0004] 2. Description of the Related Art
[0005] An anisotropically conductive elastomer sheet is a sheet
exhibiting conductivity only in its thickness-wise direction or
having pressure-sensitive conductive conductor parts exhibiting
conductivity only in the thickness-wise direction when they are
pressurized in the thickness-wise direction. As such
anisotropically conductive elastomer sheets, there have heretofore
been known those of various structures.
[0006] As anisotropically conductive elastomer sheets exhibiting
conductivity only in the thickness-wise direction in a
non-pressurized state, there have been known, for example, those
obtained by arranging conductive fiber in a sheet substrate
composed of insulating rubber in a state oriented so as to extend
in the thickness-wise direction, and those (see, for example, the
following Prior Art. 1) obtained by alternately laminating
conductive rubber with carbon black or metal powder incorporated
therein and insulating rubber in a plane direction thereof. wise
direction, there have been known those (see, for example, the
following Prior Art. 2) obtained by uniformly dispersing metal
particles in an elastomer, those (see, for example, the following
Prior Art. 3) obtained by unevenly distributing particles of a
conductive magnetic substance in an elastomer, thereby forming a
great number of conductive parts each extending in a thickness-wise
direction thereof and an insulating part mutually insulating them
and those (see, for example, the following Prior Art. 4) obtained
by defining a difference in level between the surface of each
conductive part and an insulating part.
[0007] Since such an anisotropically conductive elastomer sheet has
such features that compact electrical connection can be achieved
without using any means such as soldering or mechanical fitting,
and that soft connection is feasible with mechanical shock or
strain absorbed therein, it is widely used as a connector for
achieving electrical connection between a circuit device, for
example, a printed circuit board, and a leadless chip carrier,
liquid crystal panel or the like in fields of, for example,
electronic computers, electronic digital clocks, electronic cameras
and computer key boards.
[0008] On the other hand, in electrical inspection of circuit
devices such as semiconductor integrated circuit devices such as
packaged IC and MCM, wafers, on which integrated circuits have been
formed, and printed circuit boards, an anisotropically conductive
elastomer sheet is used as a connector for achieving electrical
connection between electrodes to be inspected formed on one surface
of a circuit device, which is an object of inspection, and
inspection electrodes formed on the surface of a circuit board for
inspection.
[0009] In this electrical inspection of the circuit device, a test
of direct current characteristics for measuring a source current,
input-output voltage, input-output current and the like in the
circuit device, a test of alternating current characteristics for
measuring a propagation delay time between input and output
terminals, transition time of an output waveform, maximum clock
frequency and the like in the circuit device, or the like is
conducted.
[0010] With the demand for speeding-up of processing in an
electronic apparatus such as a computer, in resent years, a device
having a high clock frequency has been used as a circuit device
such as CPU installed in the electronic apparatus. In order to
conduct the expected test of alternating current characteristics
without causing a misfunction in electrical inspection of such a
circuit device, it is important to sufficiently control noises to
high-frequency signals.
[0011] As a means for controlling the noises to the high-frequency
signals in an anisotropically conductive elastomer sheet used in
the electrical inspection of the circuit device, there has been
proposed a means for supporting the anisotropically conductive
elastomer sheet by a frame plate having conductivity and connecting
the frame plate to a ground (see, for example, the following Prior
Art. 5 and Prior Art. 6).
[0012] However, according to such a means, it is difficult to
sufficiently control the noises to the high-frequency signals when
electrical inspection is conducted as to a circuit device having a
clock frequency of, for example, at least 1 GHz.
[0013] Prior Art. 1: Japanese Patent Application Laid-Open No.
94495/1975;
[0014] Prior Art. 2: Japanese Patent Application Laid-Open No.
93393/1976;
[0015] Prior Art. 3: Japanese Patent Application Laid-Open No.
147772/1978;
[0016] Prior Art. 4: Japanese Patent Application Laid-Open No.
250906/1986;
[0017] Prior Art. 5: Japanese Patent Application Laid-Open No.
2000-164041;
[0018] Patent Art. 6: Japanese Patent Application Laid-Open No.
2002-33358.
SUMMARY OF THE INVENTION
[0019] The present invention has been made on the basis of the
foregoing circumstances and has as its first object the provision
of an anisotropically conductive connector, by which expected
electrical inspection can be conducted even to a circuit device
having a clock frequency of, for example, at least 1 GHz.
[0020] A second object of the present invention is to provide an
electrical inspection apparatus for circuit devices, by which
expected electrical inspection can be conducted even to a circuit
device having a clock frequency of, for example, at least 1
GHz.
[0021] According to the present invention, there is provided an
anisotropically conductive connector comprising an elastic
anisotropically conductive film having a plurality of conductive
parts for connection arranged in accordance with a pattern
corresponding to electrodes to be connected and extending in a
thickness-wise direction of the film and an insulating part
mutually insulating these conductive parts for connection,
[0022] Wherein a conductive part for high-frequency shielding
extending in the thickness-wise direction is formed in the elastic
anisotropically conductive film.
[0023] According to the present invention, there is also provided
an anisotropically conductive connector comprising an elastic
anisotropically conductive film having a plurality of conductive
parts for connection arranged in accordance with a pattern
corresponding to electrodes to be connected and extending in a
thickness-wise direction of the film and an insulating part
mutually insulating these conductive parts for connection,
[0024] wherein conductive parts for high-frequency shielding
arranged so as to surround the each of conductive parts for
connection and extending in the thickness-wise direction are formed
in the elastic anisotropically conductive film.
[0025] According to the present invention, there is further
provided an anisotropically conductive connector comprising an
elastic anisotropically conductive film having a plurality of
conductive parts for connection arranged in accordance with a
pattern corresponding to electrodes to be connected and extending
in a thickness-wise direction of the film and an insulating part
mutually insulating these conductive parts for connection,
[0026] wherein a conductive part for high-frequency shielding
arranged so as to surround a group of conductive parts including
the plurality of the conductive parts for connection and extending
in the thickness-wise direction is formed in the elastic
anisotropically conductive film.
[0027] According to the present invention, there is still further
provided an anisotropically conductive connector comprising:
[0028] a frame plate having conductivity, in which a plurality of
openings have been formed in accordance with a pattern
corresponding to electrodes to be connected, and
[0029] an elastic anisotropically conductive film composed of a
plurality of functional parts arranged in the respective openings
of the frame plate and composed of a conductive part for connection
extending in a thickness-wise direction of the film and an
insulating part formed integrally with the periphery of the
conductive part, and a part to be supported, which is formed
integrally with the peripheries of the functional parts and fixed
to the frame plate by being laminated on the frame plate,
[0030] wherein conductive parts for high-frequency shielding
arranged so as to surround the each of conductive parts for
connection, electrically connected to the frame plate and extending
in the thickness-wise direction are formed in the part to be
supported in the elastic anisotropically conductive film.
[0031] According to the present invention, there is yet still
further provided an anisotropically conductive connector
comprising:
[0032] a frame plate having conductivity, in which an opening
extending through in a thickness-wise direction has been formed,
and
[0033] an elastic anisotropically conductive film arranged in the
opening of the frame plate and composed of a functional part having
a plurality of conductive parts for connection arranged in
accordance with a pattern corresponding to electrodes to be
connected and extending in the thickness-wise direction and an
insulating part mutually insulating the conductive parts for
connection, and a part to be supported, which is formed integrally
with the periphery of the functional part and fixed to the frame
plate by being laminated on the frame plate,
[0034] wherein a conductive part for high-frequency shielding
arranged so as to surround a group of conductive parts including
the plurality of the conductive parts for connection, electrically
connected to the frame plate and extending in the thickness-wise
direction is formed in the part to be supported in the elastic
anisotropically conductive film.
[0035] According to the present invention, there is yet still
further provided an anisotropically conductive connector
comprising:
[0036] a frame plate having conductivity, in which a plurality of
openings have been formed in accordance with a pattern
corresponding to electrodes to be connected, and
[0037] an elastic anisotropically conductive film composed of a
plurality of functional parts arranged in the respective openings
of the frame plate and composed of a conductive part for connection
extending in a thickness-wise direction of the film and an
insulating part formed integrally with the periphery of the
conductive part, and a part to be supported, which is formed
integrally with the peripheries of the functional parts and fixed
to the frame plate by being laminated on the frame plate,
[0038] wherein a conductive part for high-frequency shielding
arranged so as to surround a group of conductive parts including
the plurality of the conductive parts for connection, electrically
connected to the frame plate and extending in the thickness-wise
direction is formed in the part to be supported in the elastic
anisotropically conductive film.
[0039] The anisotropically conductive connectors according to the
present invention may comprise cylindrical conductive parts for
high-frequency shielding, wherein the cylindrical conductive part
for high-frequency shielding is arranged by being each located
concentrically with one conductive part for connection so as to
surround the respective conductive parts for connection.
[0040] The anisotropically conductive connectors according to the
present invention may have a plurality of conductive parts for
high-frequency shielding for surrounding the same conductive part
for connection. In such an anisotropically conductive connector, a
clearance distance between conductive parts for high-frequency
shielding adjoining each other, which surround the same conductive
part for connection, may be preferably at most 1/10 of a wavelength
of a measurement signal.
[0041] In the anisotropically conductive connectors according to
the present invention, one or more conductive parts for
non-connection may be formed in addition to the conductive parts
for connection in the elastic anisotropically conductive film, and
the conductive parts for high-frequency shielding may be arranged
so as to surround a group of conductive parts including the
plurality of the conductive parts for connection and one or more
conductive parts for non-connection.
[0042] The anisotropically conductive connectors according to the
present invention may have a pipe-like conductive part for
high-frequency shielding, wherein the pipe-like conductive part for
high-frequency shielding is arranged so as to surround the group of
conductive parts including the plurality of the conductive parts
for connection.
[0043] The anisotropically conductive connectors may have a
plurality of conductive parts for high-frequency shielding, which
are arranged so as to surround the group of conductive parts
including the plurality of the conductive parts for connection. In
such an anisotropically conductive connector, a clearance distance
between conductive parts for high-frequency shielding adjoining
each other, which surround the group of conductive parts, may be
preferably at most 1/10 of a wavelength of a measurement
signal.
[0044] In the anisotropically conductive connectors according to
the present invention, the conductive parts for high-frequency
shielding may preferably be connected to a ground.
[0045] When the anisotropically conductive connector has the
conductive parts for high-frequency shielding electrically
connected to the frame plate, the frame plate may preferably be
connected to a ground.
[0046] According to the present invention, there is yet still
further provided an electrical inspection apparatus for circuit
devices, which comprises any one of the above-described
anisotropically conductive connectors.
[0047] According to the present invention, there is yet still
further provided an electrical inspection apparatus for circuit
devices, which comprises a circuit board for inspection, on which
inspection electrodes have been formed in accordance with a pattern
corresponding to electrodes to be inspected of a circuit device,
which is an object of inspection, and any one of the
above-described anisotropically conductive connectors, which is
arranged on the circuit board for inspection,
[0048] wherein in the circuit board for inspection, grounding
electrodes connected to a ground are formed in accordance with a
pattern corresponding to the conductive parts for high-frequency
shielding in the anisotropically conductive connector.
[0049] According to the present invention, there is yet still
further provided an electrical inspection apparatus for circuit
devices, which comprises a circuit board for inspection, on which
inspection electrodes have been formed in accordance with a pattern
corresponding to electrodes to be inspected of a circuit device,
which is an object of inspection, and the above-described
anisotropically conductive connector having the frame plate, which
is arranged on the circuit board for inspection,
[0050] wherein the frame plate in the anisotropically conductive
connector is connected to a ground.
EFFECTS OF THE INVENTION
[0051] According to the anisotropically conductive connectors of
the present invention, in addition to the conductive parts for
connection electrically connected to electrodes that are an object
of connection, the conductive parts for high-frequency shielding
extending in the same direction as the conductive parts for
connection are formed in the elastic anisotropically conductive
film, so that external noises to high-frequency signals and noises
from adjoining conductive parts for connection can be controlled in
each of the conductive parts for connection by connecting the
conductive parts for high-frequency shielding to a ground.
Accordingly, in the case where the anisotropically conductive
connector according to the present invention is used in the
electrical inspection of a circuit device, an expected electrical
inspection can be performed as to the circuit device, which is an
object of inspection, without being influenced by the noises even
when the clock frequency of the circuit device is, for example, at
least 1 GHz.
[0052] According to the electrical inspection apparatus for circuit
devices of the present invention, any one of the above-described
anisotropically conductive connectors is provided, so that both
external noises to high-frequency signals and noises from adjoining
conductive parts for connection can be controlled in each of the
conductive parts for connection by connecting the conductive parts
for high-frequency shielding in the anisotropically conductive
connector to a ground. Accordingly, expected electrical inspection
as to a circuit device, which is an object of inspection, can be
performed without being influenced by the noises even when the
clock frequency of the circuit device is, for example, at least 1
GHz.
BRIEF DESCRIPTION OF THE DRAWINGS
[0053] FIG. 1 is a plan view illustrating an anisotropically
conductive connector according to a first embodiment of the present
invention.
[0054] FIG. 2 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the first
embodiment of the present invention.
[0055] FIG. 3 is a cross-sectional view illustrating, on an
enlarged scale, a principal part of a mold used for molding an
elastic anisotropically conductive film in the anisotropically
conductive connector according to the first embodiment.
[0056] FIG. 4 is a cross-sectional view illustrating a state that a
frame plate has been arranged in the mold shown in FIG. 3, and a
molding material layer for the elastic anisotropically conductive
film has been formed.
[0057] FIG. 5 is a cross-sectional view illustrating a state that a
magnetic field having an intensity distribution has been applied to
the molding material layer in a thickness-wise direction
thereof.
[0058] FIG. 6 is a plan view illustrating an anisotropically
conductive connector according to a second embodiment of the
present invention.
[0059] FIG. 7 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the second
embodiment of the present invention.
[0060] FIG. 8 is a plan view illustrating an anisotropically
conductive connector according to a third embodiment of the present
invention.
[0061] FIG. 9 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the third
embodiment of the present invention.
[0062] FIG. 10 is a plan view illustrating an anisotropically
conductive connector according to a fourth embodiment of the
present invention.
[0063] FIG. 11 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the fourth
embodiment of the present invention.
[0064] FIG. 12 is a plan view illustrating an anisotropically
conductive connector according to a fifth embodiment of the present
invention.
[0065] FIG. 13 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the fifth
embodiment of the present invention.
[0066] FIG. 14 is a plan view illustrating an anisotropically
conductive connector according to a sixth embodiment of the present
invention.
[0067] FIG. 15 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the sixth
embodiment of the present invention.
[0068] FIG. 16 is a plan view illustrating an anisotropically
conductive connector according to a seventh embodiment of the
present invention.
[0069] FIG. 17 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the seventh
embodiment of the present invention.
[0070] FIG. 18 is a plan view illustrating an anisotropically
conductive connector according to an eighth embodiment of the
present invention.
[0071] FIG. 19 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the eighth
embodiment of the present invention.
[0072] FIG. 20 is a plan view illustrating an anisotropically
conductive connector according to a ninth embodiment of the present
invention.
[0073] FIG. 21 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the ninth
embodiment of the present invention.
[0074] FIG. 22 is a plan view illustrating an anisotropically
conductive connector according to a tenth embodiment of the present
invention.
[0075] FIG. 23 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the tenth
embodiment of the present invention.
[0076] FIG. 24 is a plan view illustrating an anisotropically
conductive connector according to an eleventh embodiment of the
present invention.
[0077] FIG. 25 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the eleventh
embodiment of the present invention.
[0078] FIG. 26 is a plan view illustrating a modified example of
the anisotropically conductive connector according to the present
invention.
[0079] FIG. 27 is a plan view illustrating another modified example
of the anisotropically conductive connector according to the
present invention.
[0080] FIG. 28 is a plan view illustrating a further modified
example of the anisotropically conductive connector according to
the present invention.
[0081] FIG. 29 is a plan view illustrating a still further modified
example of the anisotropically conductive connector according to
the present invention.
[0082] FIG. 30 illustrates the construction of an electrical
inspection apparatus for circuit devices according to a first
embodiment of the present invention.
[0083] FIG. 31 illustrates the construction of an electrical
inspection apparatus for circuit devices according to a second
embodiment of the present invention.
[0084] FIG. 32 illustrates the construction of a modified example
of the electrical inspection apparatus for circuit devices
according to the present invention.
[0085] FIG. 33 illustrates the construction of another modified
example of the electrical inspection apparatus for circuit devices
according to the present invention.
[0086] FIG. 34 is a plan view illustrating the construction of an
anisotropically conductive connector produced in Comparative
Example 1.
[0087] FIG. 35 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector produced in Comparative
Example 1.
[0088] FIG. 36 is a cross-sectional view illustrating, on an
enlarged scale, a principal part of a mold for molding of an
elastic anisotropically conductive film used in Comparative Example
1.
DESCRIPTION OF CHARACTERS
[0089] 1 Circuit device
[0090] 2 Electrodes to be inspected
[0091] 10 Anisotropically conductive connector
[0092] 11 Frame plate
[0093] 12 Opening
[0094] 13 Positioning holes
[0095] 15, 16 Spacers
[0096] 20 Elastic anisotropically conductive film
[0097] 20A Molding material layer
[0098] 21 Functional part
[0099] 22 Conductive parts for connection
[0100] 22a Projected parts
[0101] 23 Insulating part
[0102] 24 Conductive part for non-connection
[0103] 25 Group of conductive parts
[0104] 26, 26a, 26b, 26c Conductive parts for high-frequency
shielding
[0105] 26a Projected parts
[0106] 28 Part to be supported
[0107] 30 Top force
[0108] 31 Ferromagnetic base plate
[0109] 32, 33 Ferromagnetic substance layers
[0110] 32a, 33a Recessed parts
[0111] 34 Nonmagnetic substance layers
[0112] 35 Top force
[0113] 36 Ferromagnetic base plate
[0114] 37, 38 Ferromagnetic substance layers
[0115] 37a, 38a Recessed parts
[0116] 39 Nonmagnetic substance layers
[0117] 40 Circuit board for inspection
[0118] 41 Inspection electrodes
[0119] 42 Grounding electrodes
[0120] 43 Guiding pins
[0121] 50 Anisotropically conductive connector
[0122] 51 Frame plate
[0123] 52 Opening
[0124] 55 Elastic anisotropically conductive film
[0125] 56 Functional part
[0126] 57 Conductive parts for connection
[0127] 58 Insulating part
[0128] 60 Top force
[0129] 61 Ferromagnetic base plate
[0130] 62 Ferromagnetic substance layers
[0131] 63 Nonmagnetic substance layers
[0132] 65 Bottom force
[0133] 66 Ferromagnetic base plate
[0134] 67 Ferromagnetic substance layers
[0135] 68 Nonmagnetic substance layers
[0136] 70, 71 Spacers
[0137] P Conductive particles.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0138] The embodiments of the present invention will hereinafter be
described in details.
[0139] [Anisotropically Conductive Connector]
[0140] FIG. 1 is a plan view illustrating an anisotropically
conductive connector according to a first embodiment of the present
invention, and FIG. 2 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the first
embodiment.
[0141] The anisotropically conductive connector 10 according to the
first embodiment has a frame-like frame plate 11 in the shape of a
rectangle as a whole, at the center of which a rectangular opening
12 (indicated by a broken line in FIG. 1) has been formed, and a
rectangular elastic anisotropically conductive film 20 having
conductivity in a thickness-wise direction thereof is arranged on
the opening 12 in this frame plate 11 in a state supported by an
opening edge of the frame plate 11. In this embodiment, positioning
holes 13 for conducting positioning to a circuit device to be
connected are formed at positions of 4 corners in the frame plate
11.
[0142] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
functional part 21 composed of a plurality of conductive parts 22
for connection arranged in accordance with a pattern corresponding
to a pattern of electrodes of a circuit device to be connected and
each extending in the thickness-wise direction, a plurality of
conductive parts 26 for high-frequency shielding arranged so as to
surround the respective conductive parts 22 for connection and
extending in the thickness-wise direction, and an insulating part
23 mutually insulating the respective conductive parts 22 for
connection and the respective conductive parts 26 for
high-frequency shielding. The functional part 21 is arranged so as
to be located in the opening 12 in the frame plate 11.
[0143] In this embodiment, each of the conductive parts 22 for
connection has a columnar form and is arranged in accordance with
positions of lattice points. Each of the conductive parts 26 for
high-frequency shielding has a cylindrical form having an inner
diameter greater than the diameter of the conductive part 22 for
connection and is arranged by being located concentrically with one
conductive part 22 for connection so as to surround the conductive
part 22 for connection. Projected parts 22a and 26a protruding from
other surfaces than portions, at which the conductive parts 22 for
connection and the conductive parts 26 for high-frequency shielding
are located, are formed at those portions on both surfaces of the
functional part 21 in the elastic anisotropically conductive film
20.
[0144] At a peripheral edge of the functional part 21, a part 28 to
be supported, which is fixed and supported by being laminated on an
opening edge of the frame plate 11, is formed integrally and
continuously with the functional part 21. More specifically, the
part 28 to be supported in this embodiment is shaped in a forked
form and fixed and supported in a closely contacted state so as to
grasp the opening edge of the frame plate 11.
[0145] The thickness of the frame plate 11 varies according to the
material thereof, but is preferably 20 to 600 .mu.m, more
preferably 40 to 400 .mu.m.
[0146] If this thickness is less than 20 .mu.m, the strength
required upon use of the resulting anisotropically conductive
connector 10 is not achieved, and the durability thereof is liable
to be lowered. In addition, such stiffness as the form of the frame
plate 11 is retained is not achieved, and the handling property of
the anisotropically conductive connector 10 becomes low. If the
thickness exceeds 600 .mu.m on the other hand, the elastic
anisotropically conductive film 20 arranged in the opening 12
becomes too great in thickness, and it may be difficult in some
cases to achieve good conductivity in the conductive parts 22 for
connection and necessary insulating property between the conductive
part 22 for connection and the conductive part 26 for
high-frequency shielding.
[0147] No particular limitation is imposed on a material for
forming the frame plate 11 so far as it has such stiffness as the
resulting frame plate 11 is hard to be deformed, and the form
thereof is stably retained. For example, various kinds of materials
such as metallic materials, ceramic materials and resin materials
may be used. When the frame plate 11 is formed by, for example, a
metallic material, an insulating film may be formed on the surface
of the frame plate 11.
[0148] Specific examples of the metallic material for forming the
frame plate 11 include metals such as iron, copper, nickel,
chromium, cobalt, magnesium, manganese, molybdenum, indium, lead,
palladium, titanium, tungsten, aluminum, gold, platinum and silver,
and alloys or alloy steels composed of a combination of at least
two of these metals.
[0149] Specific examples of the resin material forming the frame
plate 11 include liquid crystal polymers and polyimide resins.
[0150] The elastic polymeric substance forming the anisotropically
conductive film 20 is preferably a heat-resistant polymeric
substance having a crosslinked structure. As curable polymeric
substance-forming materials usable for obtaining such crosslinked
polymeric substances, various materials may be used. Specific
examples thereof include silicone rubber; conjugated diene rubbers
such as polybutadiene rubber, natural rubber, polyisoprene rubber,
styrene-butadiene copolymer rubber and acrylonitrile-butadiene
copolymer rubber, and hydrogenated products thereof; block
copolymer rubbers such as styrene-butadiene-diene block terpolymer
rubber and styrene-isoprene block copolymers, and hydrogenated
products thereof; and chloroprene, urethane rubber, polyester
rubber, epichlorohydrin rubber, ethylene-propylene copolymer
rubber, ethylene-propylene-diene terpolymer rubber and soft liquid
epoxy rubber.
[0151] Among these, silicone rubber is preferred from the
viewpoints of molding and processing ability and electrical
properties.
[0152] As the silicone rubber, is preferred that obtained by
crosslinking or condensing liquid silicone rubber. The liquid
silicone rubber preferably has a viscosity not higher than 10.sup.5
poises as measured at a shear rate of 10.sup.-1 sec and may be any
of condensation type, addition type and those having a vinyl group
or hydroxyl group. As specific examples thereof, may be mentioned
dimethyl silicone raw rubber, methylvinyl silicone raw rubber and
methylphenylvinyl silicone raw rubber.
[0153] Among these, vinyl group-containing liquid silicone rubber
(vinyl group-containing dimethyl polysiloxane) is generally
obtained by subjecting dimethyldichlorosilane or
dimethyldialkoxysilane to hydrolysis and condensation reaction in
the presence of dimethylvinylchlorosilane or
dimethylvinylalkoxysilane and then fractionating the reaction
product by, for example, repeated dissolution-precipitation.
[0154] Liquid silicone rubber having vinyl groups at both terminals
thereof is obtained by subjecting a cyclic siloxane such as
octamethylcyclotetrasiloxane to anionic polymerization in the
presence of a catalyst, using, for example, dimethyldivinylsiloxane
as a polymerization terminator and suitably selecting other
reaction conditions (for example, amounts of the cyclic siloxane
and polymerization terminator). As the catalyst for the anionic
polymerization used herein, may be used an alkali such as
tetramethylammonium hydroxide or n-butyl-phosphonium hydroxide, or
a silanolate solution thereof. The reaction is conducted at a
temperature of, for example, 80 to 130.degree. C.
[0155] Such a vinyl group-containing dimethyl polysiloxane
preferably has a molecular weight Mw (weight average molecular
weight as determined in terms of standard polystyrene equivalent;
the same shall apply hereinafter) of 10,000 to 40,000. It also
preferably has a molecular weight distribution index (a ratio Mw/Mn
of weight average molecular weight Mw as determined in terms of
standard polystyrene equivalent to number average molecular weight
Mn as determined in terms of standard polystyrene equivalent; the
same shall apply hereinafter) of at most 2 from the viewpoint of
the heat resistance of the resulting elastic anisotropically
conductive film 20.
[0156] On the other hand, hydroxyl group-containing liquid silicone
rubber (hydroxyl group-containing dimethyl polysiloxane) is
generally obtained by subjecting dimethyldichlorosilane or
dimethyldialkoxysilane to hydrolysis and condensation reaction in
the presence of dimethylhydrochlorosilane or
dimethylhydroalkoxysilane and then fractionating the reaction
product by, for example, repeated dissolution-precipitation.
[0157] The hydroxyl group-containing liquid silicone rubber is also
obtained by subjecting a cyclic siloxane to anionic polymerization
in the presence of a catalyst, using, for example,
dimethylhydrochlorosilane, methyldihydrochlorosilane or
dimethylhydroalkoxysilane as a polymerization terminator and
suitably selecting other reaction conditions (for example, amounts
of the cyclic siloxane and polymerization terminator). As the
catalyst for the anionic polymerization, may be used an alkali such
as tetramethylammonium hydroxide or n-butyl-phosphonium hydroxide
or a silanolate solution thereof. The reaction is conducted at a
temperature of, for example, 80 to 130.degree. C.
[0158] Such a hydroxyl group-containing dimethyl polysiloxane
preferably has a molecular weight Mw of 10,000 to 40,000. It also
preferably has a molecular weight distribution index of at most 2
from the viewpoint of the heat resistance of the resulting elastic
anisotropically conductive film 20.
[0159] In the present invention, either one of the above-described
vinyl group-containing dimethyl polysiloxane or hydroxyl
group-containing dimethyl polysiloxane may be used, or both may
also be used in combination.
[0160] A curing catalyst for curing the polymeric substance-forming
material may be contained in the polymeric substance-forming
material. As such a curing catalyst, may be used an organic
peroxide, fatty acid azo compound, hydrosilylated catalyst or the
like.
[0161] Specific examples of the organic peroxide used as the curing
catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide,
dicumyl peroxide and di-tert-butyl peroxide.
[0162] Specific examples of the fatty acid azo compound used as the
curing catalyst include azobisisobutyronitrile.
[0163] Specific examples of that used as the catalyst for
hydrosilylation reaction include publicly known catalysts such as
platinic chloride and salts thereof, platinum-unsaturated
group-containing siloxane complexes, vinylsiloxane-platinum
complexes, platinum-1,3-divinyltetramethyldisiloxane complexes,
complexes of triorganophosphine or phosphite and platinum, acetyl
acetate platinum chelates, and cyclic diene-platinum complexes.
[0164] The amount of the curing catalyst used is suitably selected
in view of the kind of the polymeric substance-forming material,
the kind of the curing catalyst and other curing treatment
conditions. However, it is generally 3 to 15 parts by weight per
100 parts by weight of the polymeric substance-forming
material.
[0165] In the polymeric substance-forming material, as needed, may
be contained a general inorganic filler such as silica powder,
colloidal silica, aerogel silica or alumina. By containing such an
inorganic filler, the thixotropic property of the resulting molding
material is secured, the viscosity thereof becomes high, the
dispersion stability of conductive particles P is improved, and
moreover the strength of the elastic anisotropically conductive
film 20 obtained by the curing treatment can be made high.
[0166] No particular limitation is imposed on the amount of such an
inorganic filler used. However, the use in a too large amount is
not preferred because the movement of the conductive particles P by
a magnetic field is greatly inhibited in a production process,
which will be described subsequently.
[0167] As illustrated in FIG. 2, conductive particles P exhibiting
magnetism are contained at a high density in the conductive parts
22 for connection and the conductive parts 26 for high-frequency
shielding in the functional part 21 of the elastic anisotropically
conductive film 20 in a state oriented so as to align in the
thickness-wise direction of the film. On the other hand, the
insulating part 23 does not contain the conductive particles P at
all or scarcely contains them.
[0168] As the conductive particles P contained in the conductive
parts 22 for connection and the conductive parts 26 for
high-frequency shielding, those exhibiting magnetism are preferably
used in that such conductive particles P can be easily moved in the
molding material for forming the elastic anisotropically conductive
film 20 by a process, which will be described subsequently.
Specific examples of such conductive particles P exhibiting
magnetism include particles of metals exhibiting magnetism, such as
iron, cobalt and nickel, particles of alloys thereof, particles
containing such a metal, particles obtained by using these
particles as core particles and plating surfaces of the core
particles with a metal having good conductivity, such as gold,
silver, palladium or rhodium, particles obtained by using particles
of a non-magnetic metal, particles of an inorganic substance, such
as glass beads, or particles of a polymer as core particles and
plating surfaces of the core particles with a conductive magnetic
substance such as nickel or cobalt, and particles obtained by
coating the core particles with both conductive magnetic substance
and metal having good conductivity.
[0169] Among these, particles obtained by using nickel particles as
core particles and plating their surfaces with a metal having good
conductivity, such as gold or silver are preferably used.
[0170] No particular limitation is imposed on a means for coating
the surfaces of the core particles with the conductive metal.
However, for example, the coating may be conducted by electroless
plating.
[0171] When those obtained by coating the surfaces of the core
particles with the conductive metal are used as the conductive
particles P, the coating rate (proportion of an area coated with
the conductive metal to the surface area of the core particles) of
the conductive metal on the particle surfaces is preferably at
least 40%, more preferably at least 45%, particularly preferably 47
to 95% from the viewpoint of achieving good conductivity.
[0172] The amount of the conductive metal to be coated is
preferably 2.5 to 50% by weight, more preferably 3 to 45% by
weight, still more preferably 3.5 to 40% by weight, particularly
preferably 5 to 30% by weight based on the core particles.
[0173] The particle diameter of the conductive particles P is
preferably 1 to 500 .mu.m, more preferably 2 to 400 .mu.m, still
more preferably 5 to 300 .mu.m, particularly preferably 10 to 150
.mu.m.
[0174] The particle diameter distribution (Dw/Dn) of the conductive
particles P is preferably 1 to 10, more preferably 1 to 7, still
more preferably 1 to 5, particularly preferably 1 to 4.
[0175] Conductive particles P satisfying such conditions are used,
whereby the resulting elastic anisotropically conductive film 20
becomes easy to be deformed under pressure, and sufficient
electrical contact is achieved among the conductive particles P in
the conductive parts 22 for connection in the elastic
anisotropically conductive film 20.
[0176] No particular limitation is imposed on the shape of the
conductive particles P. However, they are preferably in the shape
of a sphere or star, or secondary particles obtained by aggregating
these particles from the viewpoint of permitting easy dispersion of
these particles in the polymeric substance-forming material.
[0177] The content of water in the conductive particles P is
preferably at most 5%, more preferably at most 3%, further
preferably at most 2%, particularly preferably at most 1%. The use
of conductive particles P satisfying such conditions can prevent or
inhibit the molding material layer from causing bubbles therein
upon the curing treatment of the molding material layer in the
production process, which will be described subsequently.
[0178] Those obtained by treating surfaces of the conductive
particles P with a coupling agent such as a silane coupling agent
may be suitably used. By treating the surfaces of the conductive
particles P with the coupling agent, the adhesion property of the
conductive particles P to the elastic polymeric substance is
improved, so that the resulting elastic anisotropically conductive
film 20 becomes high in durability in repeated use.
[0179] The amount of the coupling agent used is suitably selected
within limits not affecting the conductivity of the conductive
particles P. However, it is preferably such an amount that a
coating rate (proportion of an area coated with the coupling agent
to the surface area of the conductive core particles) of the
coupling agent on the surfaces of the conductive particles P
amounts to at least 5%, more preferably 7 to 100%, further
preferably 10 to 100%, particularly preferably 20 to 100%.
[0180] The proportion of the conductive particles P contained in
the conductive parts 22 for connection in the functional part 21 is
preferably 10 to 60%, more preferably 15 to 50% in terms of volume
fraction. If this proportion is lower than 10%, conductive parts 22
for connection sufficiently low in electric resistance value may
not be obtained in some cases. If the proportion exceeds 60% on the
other hand, the resulting conductive parts 22 for connection are
liable to be brittle, so that elasticity required of the conductive
parts 22 for connection may not be achieved in some cases.
[0181] The proportion of the conductive particles P contained in
the conductive parts 26 for high-frequency shielding is preferably
5 to 60%, more preferably 10 to 50% in terms of volume fraction. If
this proportion is lower than 5%, the resulting conductive parts 26
for high-frequency shielding are liable to cause non-dense
portions, so that it may be difficult in some cases to form
conductive parts 26 for high-frequency shielding uniform in
composition. If the proportion exceeds 60% on the other hand, the
conductive particles are liable to remain between the conductive
part 26 for high-frequency shielding and the conductive part 22 for
connection adjoining each other upon the production of the
anisotropically conductive elastomer sheet, so that insulating
property between them tends to be insufficient to encounter
difficulties upon the provision of an anisotropically conductive
sheet usable in electrical inspection of a circuit device having a
clock frequency of, for example, at least 1 GHz.
[0182] Such an anisotropically conductive connector 10 can be
produced, for example, in the following manner.
[0183] A frame plate 11, in which an opening 12 has been formed, is
first produced. As a method for forming the opening 12 in the frame
plate 11, may be used, for example, an etching method or the
like.
[0184] A mold for molding an elastic anisotropically conductive
film is provided. FIG. 3 is a cross-sectional view illustrating the
construction of an exemplary mold for molding the elastic
anisotropically conductive film. This mold is so constructed that a
top force 30 and a bottom force 35 making a pair therewith are
arranged so as to be opposed to each other.
[0185] In the top force 30, ferromagnetic substance layers 32 are
formed on a lower surface of a ferromagnetic base plate 31 in
accordance with a pattern antipodal to an arrangement pattern of
conductive parts 22 for connection in an elastic anisotropically
conductive film 20 to be molded, ferromagnetic substance layers 33
are formed in accordance with a pattern antipodal to an arrangement
pattern of conductive parts 26 for high-frequency shielding, and
non-magnetic substance layers 34 are formed in other regions than
the regions, in which the ferromagnetic substance layers 32, 33 are
formed. A molding surface is formed by these ferromagnetic
substance layers 32, 33 and non-magnetic substance layers 34. Each
of the ferromagnetic substance layers 32, 33 has a thickness
smaller than that of the non-magnetic substance layers 34, whereby
recessed parts 32a and 33a are formed in the molding surface of the
top force 30 corresponding to projected parts 22a and 26a in the
elastic anisotropically conductive film 20 to be molded.
[0186] In the bottom force 35 on the other hand, ferromagnetic
substance layers 37 are formed on an upper surface of a
ferromagnetic base plate 36 in accordance with the same pattern as
the arrangement pattern of the conductive parts 22 for connection
in the elastic anisotropically conductive film 20 to be molded,
ferromagnetic substance layers 38 are formed in accordance with the
same pattern as the arrangement pattern of the conductive parts 26
for high-frequency shielding, and non-magnetic substance layers 39
are formed in other regions than the regions, in which the
ferromagnetic substance layers 37, 38 are formed. A molding surface
is formed by these ferromagnetic substance layers 37, 38 and
non-magnetic substance layers 39. Each of the ferromagnetic
substance layers 37, 38 has a thickness smaller than that of the
non-magnetic substance layers 39, whereby recessed parts 37a and
38a are formed in the molding surface of the bottom force 35
corresponding to the projected parts 22a and 26a in the elastic
anisotropically conductive film 20 to be molded.
[0187] As a ferromagnetic substance for forming the respective
ferromagnetic base plates 31 and 36 in the top force 30 and bottom
force 35, may be used a ferromagnetic metal such as iron,
iron-nickel alloy, iron-cobalt alloy, nickel or cobalt. The
ferromagnetic base plates 31, 36 preferably have a thickness of 0.1
to 50 mm, and surfaces thereof are preferably smooth and subjected
to a chemical degreasing treatment or mechanical polishing
treatment.
[0188] As a material for forming the ferromagnetic substance layers
32, 33, and 37, 38 in both top force 30 and bottom force 35, may be
used a ferromagnetic metal such as iron, iron-nickel alloy,
iron-cobalt alloy, nickel or cobalt. These ferromagnetic substance
layers 32, 33, and 37, 38 preferably have a thickness of at least
10 .mu.m. When this thickness is at least 10 .mu.m, a magnetic
field having a sufficient intensity distribution can be applied to
a molding material layer 20A. As a result, the conductive particles
can be gathered at a high density to portions to become conductive
parts 22 for connection and portions to become conductive parts 26
for high-frequency shielding in the molding material layer 20A, and
so conductive parts 22 for connection and conductive parts 26 for
high-frequency shielding having good conductivity can be
provided.
[0189] As a material for forming the non-magnetic substance layers
34 and 39 in both top force 30 and bottom force 35, may be used a
non-magnetic metal such as copper, a polymeric substance having
heat resistance, or the like. However, a polymeric substance cured
by radiation may preferably be used in that the non-magnetic
substance layers 34, 39 can be easily formed by a technique of
photolithography. As a material thereof, may be used, for example,
a photoresist such as an acrylic type dry film resist, epoxy type
liquid resist or polyimide type liquid resist.
[0190] A molding material for molding the elastic anisotropically
conductive film with conductive particles exhibiting magnetism
dispersed in a polymeric substance-forming material, which will
become an elastic polymeric substance by a curing treatment, is
then prepared.
[0191] As illustrated in FIG. 4, the frame plate 11 is then
arranged in alignment on the molding surface of the bottom force 35
through a spacer 16, and on the frame plate 11, the top force 30 is
arranged in alignment through a spacer 15, whereby a molding cavity
is defined between the top force 30 and the bottom force 35, and
the molding material is charged into this molding cavity to form a
molding material layer 20A. In the molding material layer 20A, the
conductive particles P are contained in a state dispersed
throughout in the molding material layer 20A.
[0192] A pair of, for example, electromagnets are then arranged on
an upper surface of the ferromagnetic base plate 31 in the top
force 30 and a lower surface of the ferromagnetic base plate 36 in
the bottom force 35, and the electromagnets are operated, whereby a
magnetic field having higher intensity is formed at portions
between the ferromagnetic substance layers 32 of the top force 30
and their corresponding ferromagnetic substance layers 37 of the
bottom force 35 and portions between the ferromagnetic substance
layers 33 of the top force 30 and their corresponding ferromagnetic
substance layers 38 of the bottom force 35 than surrounding regions
thereof because the top force 30 and the bottom force 35 have the
ferromagnetic substance layers 32, 33, and 37, 38, respectively. As
a result, in the molding material layer 20A, the conductive
particles P dispersed in the molding material layer 20A are
gathered at portions to become the conductive parts 22 for
connection located between the ferromagnetic substance layers 32 of
the top force 30 and their corresponding ferromagnetic substance
layers 37 of the bottom force 35 and portions to become the
conductive parts 26 for high-frequency shielding located between
the ferromagnetic substance layers 33 of the top force 30 and their
corresponding ferromagnetic substance layers 38 of the bottom force
35, and oriented so as to align in the thickness-wise direction as
illustrated in FIG. 5.
[0193] In this state, the molding material layer 20A is subjected
to a curing treatment, whereby an elastic anisotropically
conductive film 20 composed of a functional part 21, in which a
plurality of the conductive parts 22 for connection containing the
conductive particles P in the elastic polymeric substance in a
state oriented so as to align in the thickness-wise direction, and
the conductive parts 26 for high-frequency shielding surrounding
the respective conductive parts 22 for connection are arranged in a
state mutually insulated by an insulating part 23 composed of the
polymeric elastic substance, in which the conductive particles P
are not present at all or scarcely present, and a part 28 to be
supported, which is formed continuously and integrally with a
periphery of the functional part 21 and composed of the elastic
polymeric substance, is formed in a state that the part 28 to be
supported has been fixed to the opening edge in the frame plate 11,
thus producing the anisotropically conductive connector 10.
[0194] In the above-described process, the intensity of the
magnetic field applied to the portions to become the conductive
parts 22 for connection and the portions to become the conductive
parts 26 for high-frequency shielding in the molding material layer
20A is preferably an intensity that it amounts to 0.1 to 2.5 T on
the average.
[0195] The curing treatment of the molding material layer 20A is
suitably selected according to the material used. However, the
treatment is generally conducted by a heating treatment. When the
curing treatment of the molding material layer 20A is conducted by
heating, it is only necessary to provide a heater in
electromagnets. Specific heating temperature and heating time are
suitably selected in view of the kinds of the polymeric
substance-forming material forming the molding material layer 20A
and the like, the time required for movement of the conductive
particles P, and the like.
[0196] According to the anisotropically conductive connector 10
according to the first embodiment, in addition to the conductive
parts 22 for connection to be electrically connected to electrodes
that are an object of connection, the cylindrical conductive parts
26 for high-frequency shielding extending in the same direction as
the conductive parts 22 for connection are arranged in the
functional part 21 of the elastic anisotropically conductive film
20 in such a manner that they are located concentrically with the
individual conductive parts 22 for connection, thereby surrounding
the respective conductive parts 22 for connection. So that both
external noises to high-frequency signals and noises from adjoining
conductive parts 22 for connection can be controlled in each of the
conductive parts 22 for connection by connecting the conductive
parts 26 for high-frequency shielding to a ground. Accordingly,
expected electrical inspection as to a circuit device, which is an
object of inspection, can be performed without being influenced by
the noises even when the clock frequency of the circuit device is,
for example, at least 1 GHz in the case where the anisotropically
conductive connector 10 according to the first embodiment is used
in the electrical inspection of the circuit device.
[0197] FIG. 6 is a plan view illustrating an anisotropically
conductive connector according to a second embodiment of the
present invention, and FIG. 7 is a cross-sectional view
illustrating, on an enlarged scale, the construction of a principal
part of the anisotropically conductive connector according to the
second embodiment.
[0198] The anisotropically conductive connector 10 according to the
second embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
first embodiment, and an elastic anisotropically conductive film 20
having conductivity in a thickness-wise direction thereof is
arranged on the opening 12 in this frame plate 11 in a state
supported by an opening edge of the frame plate 11.
[0199] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
functional part 21 composed of a plurality of conductive parts 22
for connection arranged in accordance with a pattern corresponding
to a pattern of electrodes of a circuit device to be connected and
each extending in the thickness-wise direction, a plurality of
conductive parts 26 for high-frequency shielding arranged so as to
surround the individual conductive parts 22 for connection and
extending in the thickness-wise direction, and an insulating part
23 mutually insulating the respective conductive parts 22 for
connection and the respective conductive parts 26 for
high-frequency shielding. The functional part 21 is arranged so as
to be located in the opening 12 in the frame plate 11.
[0200] In this embodiment, each of the conductive parts 22 for
connection has a columnar form and is arranged in accordance with
positions of lattice points. Each of the conductive parts 26 for
high-frequency shielding has a columnar form, and a plurality (8
parts in the illustrated embodiment) of the conductive parts 26 for
high-frequency shielding are arranged so as to surround each of the
conductive parts 22 for connection along a concentric circle
(indicated by an alternate long and two short dashes line in FIG.
6) having a diameter greater than the diameter of the conductive
part 22 for connection. Projected parts 22a and 26a protruding from
other surfaces than portions, at which the conductive parts 22 for
connection and the conductive parts 26 for high-frequency shielding
are located, are formed at those portions on both surfaces of the
functional part 21 in the elastic anisotropically conductive film
20.
[0201] As illustrated in FIG. 7, conductive particles P exhibiting
magnetism are contained at a high density in the conductive parts
22 for connection and the conductive parts 26 for high-frequency
shielding in the functional part 21 of the elastic anisotropically
conductive film 20 in a state oriented so as to align in the
thickness-wise direction of the film. On the other hand, the
insulating part 23 does not contain the conductive particles P at
all or scarcely contains them.
[0202] At a peripheral edge of the functional part 21, a part 28 to
be supported, which is fixed and supported by being laminated on an
opening edge of the frame plate 11, is formed integrally and
continuously with the functional part 21. More specifically, the
part 28 to be supported in this embodiment is shaped in a forked
form and fixed and supported in a closely contacted state so as to
grasp the opening edge of the frame plate 11.
[0203] In such an anisotropically conductive connector 10, a
clearance between conductive parts 26 for high-frequency shielding
adjoining each other, which surround the same conductive part 22
for connection, is preferably at most 1/10 of a wavelength of a
measurement signal. If this clearance is too great, a
high-frequency noise becomes easy to pass through between the
adjoining conductive parts 26 for high-frequency shielding, so that
the shielding effect by the conductive parts 26 for high-frequency
shielding is lowered, and so electrical inspection by
high-frequency signals may become difficult in some cases.
[0204] As a material of the elastic polymeric substance for forming
the elastic anisotropically conductive film and a material of the
conductive particles P in the conductive parts 22 for connection
and conductive parts 26 for high-frequency in the anisotropically
conductive connector 10 according to the second embodiment, may be
used the same materials as those in the anisotropically conductive
connector 10 according to the first embodiment.
[0205] The anisotropically conductive connector 10 according to the
second embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0206] According to the anisotropically conductive connector 10
according to the second embodiment, in addition to the conductive
parts 22 for connection to be electrically connected to electrodes
that are an object of connection, a plurality of the conductive
parts 26 for high-frequency shielding extending in the same
direction as the conductive parts 22 for connection are arranged in
the functional part 21 of the elastic anisotropically conductive
film 20 so as to surround each of the conductive parts 22 for
connection along a concentric circle with the conductive part 22
for connection. So that both external noises to high-frequency
signals and noises from adjoining conductive parts 22 for
connection can be controlled in each of the conductive parts 22 for
connection by connecting the conductive parts 26 for high-frequency
shielding to a ground. Accordingly, expected electrical inspection
as to a circuit device, which is an object of inspection, can be
performed without being influenced by the noises even when the
clock frequency of the circuit device is, for example, at least 1
GHz in the case where the anisotropically conductive connector 10
according to the second embodiment is used in the electrical
inspection of the circuit device.
[0207] FIG. 8 is a plan view illustrating an anisotropically
conductive connector according to a third embodiment of the present
invention, and FIG. 9 is a cross-sectional view illustrating, on an
enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the third
embodiment.
[0208] The anisotropically conductive connector 10 according to the
third embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
first embodiment, and an elastic anisotropically conductive film 20
having conductivity in a thickness-wise direction thereof is
arranged on the opening 12 in this frame plate 11 in a state
supported by an opening edge of the frame plate 11.
[0209] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
functional part 21 composed of a plurality of conductive parts 22
for connection arranged in accordance with a pattern corresponding
to a pattern of electrodes of a circuit device to be connected and
each extending in the thickness-wise direction, a conductive part
26 for high-frequency shielding arranged so as to surround a group
25 of conductive parts including the plurality of the conductive
parts 22 for connection and extending in the thickness-wise
direction, and an insulating part 23 mutually insulating the
respective conductive parts 22 for connection and the conductive
part 26 for high-frequency shielding. This functional part 21 is
arranged so as to be located in the opening 12 in the frame plate
11.
[0210] In this embodiment, each of the conductive parts 22 for
connection has a columnar form and is arranged in accordance with
positions of lattice points. The conductive part 26 for
high-frequency shielding having a form of rectangular pipe, the
size of a pipe hole of which is greater than the size of the group
25 of conductive parts, is arranged in such a manner that the group
25 of conductive parts is received in the pipe hole so as to
surround the group 25 of conductive parts. Projected parts 22a and
26a protruding from other surfaces than portions, at which the
conductive parts 22 for connection and the conductive part 26 for
high-frequency shielding are located, are formed at those portions
on both surfaces of the functional part 21 in the elastic
anisotropically conductive film 20.
[0211] As illustrated in FIG. 9, conductive particles P exhibiting
magnetism are contained at a high density in the conductive parts
22 for connection and the conductive part 26 for high-frequency
shielding in the functional part 21 of the elastic anisotropically
conductive film 20 in a state oriented so as to align in the
thickness-wise direction of the film. On the other hand, the
insulating part 23 does not contain the conductive particles P at
all or scarcely contains them.
[0212] At a peripheral edge of the functional part 21, a part 28 to
be supported, which is fixed and supported by being laminated on an
opening edge of the frame plate 11, is formed integrally and
continuously with the functional part 21. More specifically, the
part 28 to be supported in this embodiment is shaped in a forked
form and fixed and supported in a closely contacted state so as to
grasp the opening edge of the frame plate 11.
[0213] In this anisotropically conductive connector 10 according to
the third embodiment, as a material of the elastic polymeric
substance for forming the elastic anisotropically conductive film
and a material of the conductive particles P in the conductive
parts 22 for connection and conductive part 26 for high-frequency,
may be used the same materials as those in the anisotropically
conductive connector 10 according to the first embodiment.
[0214] The anisotropically conductive connector 10 according to the
third embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0215] According to the anisotropically conductive connector 10
according to the third embodiment, in addition to the conductive
parts 22 for connection to be electrically connected to electrodes
that are an object of connection, the conductive part 26 for
high-frequency shielding of rectangular pipe extending in the same
direction as the conductive parts 22 for connection is arranged in
the functional part 21 of the elastic anisotropically conductive
film 20 in such a manner that the group 25 of conductive parts
including all the conductive parts 22 for connection is received in
the pipe hole thereof, thereby surrounding the group 25 of
conductive part. So that an external noise to high-frequency
signals can be controlled in each of the conductive parts 22 for
connection by connecting the conductive part 26 for high-frequency
shielding to a ground. Accordingly, expected electrical inspection
as to a circuit device, which is an object of inspection, can be
performed without being influenced by the noise even when the clock
frequency of the circuit device is, for example, at least 1 GHz in
the case where the anisotropically conductive connector 10
according to the third embodiment is used in the electrical
inspection of the circuit device.
[0216] FIG. 10 is a plan view illustrating an anisotropically
conductive connector according to a fourth embodiment of the
present invention, and FIG. 11 is a cross-sectional view
illustrating, on an enlarged scale, the construction of a principal
part of the anisotropically conductive connector according to the
fourth embodiment.
[0217] The anisotropically conductive connector 10 according to the
fourth embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
first embodiment, and an elastic anisotropically conductive film 20
having conductivity in a thickness-wise direction thereof is
arranged on the opening 12 in this frame plate 11 in a state
supported by an opening edge of the frame plate 11.
[0218] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
functional part 21 composed of a plurality of conductive parts 22
for connection arranged in accordance with a pattern corresponding
to a pattern of electrodes of a circuit device to be connected and
each extending in the thickness-wise direction, a plurality of
conductive parts 26 for high-frequency shielding arranged so as to
surround a group 25 (indicated by an alternate long and short dash
line in FIG. 10) of conductive parts including all the conductive
parts 22 for connection and extending in the thickness-wise
direction, and an insulating part 23 mutually insulating the
respective conductive parts 22 for connection and conductive parts
26 for high-frequency shielding. The functional part 21 is arranged
so as to be located in the opening 12 in the frame plate 11.
[0219] In this embodiment, each of the conductive parts 22 for
connection has a columnar form and is arranged in accordance with
positions of lattice points. Each of the conductive parts 26 for
high-frequency shielding has a columnar form, and the plurality of
the conductive parts 26 for high-frequency shielding are arranged
so as to surround the group 25 of conductive parts along sides of a
rectangle having a size greater than the size of the group 25 of
conductive parts. Projected parts 22a and 26a protruding from other
surfaces than portions, at which the conductive parts 22 for
connection and the conductive parts 26 for high-frequency shielding
are located, are formed at those portions on both surfaces of the
functional part 21 in the elastic anisotropically conductive film
20.
[0220] As illustrated in FIG. 11, conductive particles P exhibiting
magnetism are contained at a high density in the conductive parts
22 for connection and the conductive parts 26 for high-frequency
shielding in the functional part 21 of the elastic anisotropically
conductive film 20 in a state oriented so as to align in the
thickness-wise direction of the film. On the other hand, the
insulating part 23 does not contain the conductive particles P at
all or scarcely contains them.
[0221] At a peripheral edge of the functional part 21, a part 28 to
be supported, which is fixed and supported by being laminated on an
opening edge in the frame plate 11, is formed integrally and
continuously with the functional part 21. More specifically, the
part 28 to be supported in this embodiment is shaped in a forked
form and fixed and supported in a closely contacted state so as to
grasp the opening edge of the frame plate 11.
[0222] In such an anisotropically conductive connector 10, a
clearance between conductive parts 26 for high-frequency shielding
adjoining each other, which surround the group 25 of conductive
parts, is preferably at most 1/10 of a wavelength of a measurement
signal. If this clearance is too great, a high-frequency noise
becomes easy to pass through between the adjoining conductive parts
26 for high-frequency shielding, so that the shielding effect by
the conductive parts 26 for high-frequency shielding is lowered,
and so electrical inspection by high-frequency signals may become
difficult in some cases.
[0223] As a material of the elastic polymeric substance for forming
the elastic anisotropically conductive film and a material of the
conductive particles P in the conductive parts 22 for connection
and conductive parts 26 for high-frequency in the anisotropically
conductive connector 10 according to the fourth embodiment, may be
used the same materials as those in the anisotropically conductive
connector 10 according to the first embodiment.
[0224] The anisotropically conductive connector according to the
fourth embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0225] According to the anisotropically conductive connector 10
according to the fourth embodiment, in addition to the conductive
parts 22 for connection to be electrically connected to electrodes
that are an object of connection, a plurality of the conductive
parts 26 for high-frequency shielding extending in the same
direction as the conductive parts 22 for connection are arranged in
the functional part 21 of the elastic anisotropically conductive
film 20 so as to surround the group 25 of the conductive parts
including all the conductive parts 22 for connection. So that an
external noise to high-frequency signals can be controlled in each
of the conductive parts 22 for connection by connecting the
conductive parts 26 for high-frequency shielding to a ground.
Accordingly, expected electrical inspection as to a circuit device,
which is an object of inspection, can be performed without being
influenced by the noise even when the clock frequency of the
circuit device is, for example, at least 1 GHz in the case where
the anisotropically conductive connector 10 according to the fourth
embodiment is used in the electrical inspection of the circuit
device.
[0226] FIG. 12 is a plan view illustrating an anisotropically
conductive connector according to a fifth embodiment of the present
invention, and FIG. 13 is a cross-sectional view illustrating, on
an enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the fifth
embodiment.
[0227] The anisotropically conductive connector 10 according to the
fifth embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
first embodiment, and an elastic anisotropically conductive film 20
having conductivity in a thickness-wise direction thereof is
arranged on the opening 12 in this frame plate 11 in a state
supported by an opening edge of the frame plate 11.
[0228] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
functional part 21 composed of a plurality of conductive parts 22
for connection arranged in accordance with a pattern corresponding
to a pattern of electrodes of a circuit device to be connected and
each extending in the thickness-wise direction, a plurality of
conductive parts 24 for non-connection formed about a group
(indicated by an alternate long and two short dashes line in FIG.
12) of conductive parts for connection including these conductive
parts 22 for connection, a plurality of conductive parts 26 for
high-frequency shielding arranged so as to surround a group 25
(indicated by an alternate long and short dash line in FIG. 12) of
conductive parts including all the conductive parts 22 for
connection and all the conductive parts 24 for non-connection and
extending in the thickness-wise direction, and an insulating part
23 mutually insulating the respective conductive parts 22 for
connection and conductive parts 26 for high-frequency shielding.
The functional part 21 is arranged so as to be located in the
opening 12 in the frame plate 11.
[0229] In this embodiment, each of the conductive parts 22 for
connection and conductive parts 24 for non-connection has a
columnar form and is arranged in accordance with positions of
lattice points. Each of the conductive parts 26 for high-frequency
shielding has a columnar form, and the plurality of the conductive
parts 26 for high-frequency shielding are arranged so as to
surround the group 25 of conductive parts along sides of a
rectangle having a size greater than the size of the group 25 of
conductive parts. Projected parts 22a and 26a protruding from other
surfaces than portions, at which the conductive parts 22 for
connection and the conductive parts 26 for high-frequency shielding
are located, are formed at those portions on both surfaces of the
functional part 21 in the elastic anisotropically conductive film
20.
[0230] As illustrated in FIG. 13, conductive particles P exhibiting
magnetism are contained at a high density in the conductive parts
22 for connection and the conductive parts 26 for high-frequency
shielding in the functional part 21 of the elastic anisotropically
conductive film 20 in a state oriented so as to align in the
thickness-wise direction of the film. On the other hand, the
insulating part 23 does not contain the conductive particles P at
all or scarcely contains them.
[0231] At a peripheral edge of the functional part 21, a part 28 to
be supported, which is fixed and supported by being laminated on an
opening edge of the frame plate 11, is formed integrally and
continuously with the functional part 21. More specifically, the
part 28 to be supported in this embodiment is shaped in a forked
form and fixed and supported in a closely contacted state so as to
grasp the opening edge of the frame plate 11.
[0232] As a material of the elastic polymeric substance for forming
the elastic anisotropically conductive film and a material of the
conductive particles P in the conductive parts 22 for connection
and conductive parts 26 for high-frequency in the anisotropically
conductive connector 10 according to the fifth embodiment, may be
used the same materials as those in the anisotropically conductive
connector 10 according to the first embodiment.
[0233] A clearance between conductive parts 26 for high-frequency
shielding adjoining each other, which surround the group 25 of
conductive parts, is the same as in the anisotropically conductive
connector 10 according to the fourth embodiment.
[0234] The anisotropically conductive connector 10 according to the
fifth embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0235] According to the anisotropically conductive connector 10
according to the fifth embodiment, in addition to the conductive
parts 22 for connection to be electrically connected to electrodes
that are an object of connection, a plurality of the conductive
parts 26 for high-frequency shielding extending in the same
direction as the conductive parts 22 for connection are arranged in
the functional part 21 of the elastic anisotropically conductive
film 20 so as to surround the group 25 of the conductive parts
including all the conductive parts 22 for connection. So that an
external noise to high-frequency signals can be controlled in each
of the conductive parts 22 for connection by connecting the
conductive parts 26 for high-frequency shielding to a ground.
Accordingly, expected electrical inspection as to a circuit device,
which is an object of inspection, can be performed without being
influenced by the noise even when the clock frequency of the
circuit device is, for example, at least 1 GHz in the case where
the anisotropically conductive connector 10 according to the fifth
embodiment is used in the electrical inspection of the circuit
device.
[0236] FIG. 14 is a plan view illustrating an anisotropically
conductive connector according to a sixth embodiment of the present
invention, and FIG. 15 is a cross-sectional view illustrating, on
an enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the sixth
embodiment.
[0237] The anisotropically conductive connector 10 according to the
sixth embodiment has a frame plate 11 in the shape of a rectangle
as a whole, in which a plurality of circular openings 12 (each
indicated by a broken line in FIG. 14) have been formed in
accordance with a pattern corresponding to a pattern of electrodes
to be connected, and a rectangular elastic anisotropically
conductive film 20 having conductivity in a thickness-wise
direction thereof is fixed to and supported by the frame plate 11.
In this embodiment, positioning holes 13 for conducting positioning
to a circuit device to be connected are formed at positions of 4
corners in the frame plate 11.
[0238] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
plurality of functional parts 21 each composed of a columnar
conductive part 22 for connection extending in the thickness-wise
direction, and an insulating part 23 formed integrally with a
periphery of the conductive part 22 for connection. Each of these
functional parts 21 is arranged so as to be located in the
respective openings 12 of the frame plate 11.
[0239] At the peripheral edge of each of the functional parts 21, a
part 28 to be supported, which is fixed and supported by being
laminated on each of both surfaces of the frame plate 11, is formed
integrally and continuously with the respective functional parts
21. In this part 28 to be supported, a plurality of conductive
parts 26 for high-frequency shielding each extending in the
thickness-wise direction and electrically connected to the frame
plate 11 are formed. Each of these conductive parts 26 for
high-frequency shielding has a cylindrical form having an inner
diameter greater than the diameter of the conductive part 22 for
connection and is arranged by being located concentrically with one
conductive part 22 for connection so as to surround the conductive
part 22 for connection. Projected parts 22a and 26a protruding from
other surfaces than portions, at which the conductive parts 22 for
connection and the conductive parts 26 for high-frequency shielding
are located, are formed at those portions on both surfaces of the
elastic anisotropically conductive film 20.
[0240] As illustrated in FIG. 15, conductive particles P exhibiting
magnetism are contained at a high density in the conductive part 22
for connection in each functional part 21 and the conductive parts
26 for high-frequency shielding in the part 28 to be supported in
the elastic anisotropically conductive film 20 in a state oriented
so as to align in the thickness-wise direction of the film. On the
other hand, the insulating part 23 in each functional part 21 and
portions other than the conductive parts 26 for high-frequency
shielding in the part 28 to be supported do not contain the
conductive particles P at all or scarcely contains them.
[0241] No particular limitation is imposed on a material for
forming the frame plate 11 so far as it has conductivity and such
stiffness as the resulting frame plate 11 is hard to be deformed,
and the form thereof is stably retained. However, a metallic
material is preferably used.
[0242] Specific examples of the metallic material for forming the
frame plate 11 include metals such as iron, copper, nickel,
chromium, cobalt, magnesium, manganese, molybdenum, indium, lead,
palladium, titanium, tungsten, aluminum, gold, platinum and silver,
and alloys or alloy steels composed of a combination of at least
two of these metals.
[0243] As a material of the elastic polymeric substance for forming
the elastic anisotropically conductive film and a material of the
conductive particles P in the conductive parts 22 for connection
and conductive parts 26 for high-frequency shielding in the
anisotropically conductive connector 10 according to the sixth
embodiment, may be used the same materials as those in the
anisotropically conductive connector 10 according to the first
embodiment.
[0244] The anisotropically conductive connector 10 according to the
sixth embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0245] According to the anisotropically conductive connector 10
according to the sixth embodiment, in addition to the conductive
parts 22 for connection arranged in the respective functional parts
21 and to be electrically connected to electrodes that are an
object of connection, the cylindrical conductive parts 26 for
high-frequency shielding extending in the same direction as the
conductive parts 22 for connection are arranged in the part 28 to
be supported of the elastic anisotropically conductive film 20 in
such a manner that they are located concentrically with the
individual conductive parts 22 for connection, thereby surrounding
the respective conductive parts 22 for connection, and further each
of the conductive parts 26 for high-frequency shielding is
electrically connected to the frame plate 11 having conductivity.
So that both external noises and noises from adjoining conductive
parts 22 for connection to high-frequency signals can be controlled
in each of the conductive parts 22 for connection by connecting the
frame plate 11 to a ground. Accordingly, expected electrical
inspection as to a circuit device, which is an object of
inspection, can be performed without being influenced by the noises
even when the clock frequency of the circuit device is, for
example, at least 1 GHz in the case where the anisotropically
conductive connector 10 according to the sixth embodiment is used
in the electrical inspection of the circuit device.
[0246] FIG. 16 is a plan view illustrating an anisotropically
conductive connector according to a seventh embodiment of the
present invention, and FIG. 17 is a cross-sectional view
illustrating, on an enlarged scale, the construction of a principal
part of the anisotropically conductive connector according to the
seventh embodiment.
[0247] The anisotropically conductive connector 10 according to the
seventh embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
sixth embodiment, and a rectangular elastic anisotropically
conductive film 20 having conductivity in a thickness-wise
direction thereof is fixed to and supported by the frame plate
11.
[0248] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
plurality of functional parts 21 each composed of a columnar
conductive part 22 for connection extending in the thickness-wise
direction, and an insulating part 23 formed integrally with a
periphery of the conductive part 22 for connection. Each of these
functional parts 21 is arranged so as to be located in the
respective openings 12 of the frame plate 11.
[0249] At the peripheral edge of each of the functional parts 21, a
part 28 to be supported, which is fixed and supported by being
laminated on both surfaces of the frame plate 11, is formed
integrally and continuously with the each functional parts 21. In
this part 28 to be supported, a plurality of conductive parts 26
for high-frequency shielding each extending in the thickness-wise
direction and electrically connected to the frame plate 11 are
formed. Each of the conductive parts 26 for high-frequency
shielding has a columnar form, and a plurality (8 parts in the
illustrated embodiment) of the conductive parts 26 for
high-frequency shielding are arranged so as to surround each of the
conductive parts 22 for connection along a concentric circle
(indicated by an alternate long and two short dashes line in FIG.
16) having a diameter greater than the diameter of the conductive
part 22 for connection. Projected parts 22a and 26a protruding from
other surfaces than portions, at which the conductive parts 22 for
connection and the conductive parts 26 for high-frequency shielding
are located, are formed at those portions on both surfaces of the
elastic anisotropically conductive film 20.
[0250] As illustrated in FIG. 17, conductive particles P exhibiting
magnetism are contained at a high density in the conductive part 22
for connection in each functional part 21 and the conductive parts
26 for high-frequency shielding in the part 28 to be supported in
the elastic anisotropically conductive film 20 in a state oriented
so as to align in the thickness-wise direction of the film. On the
other hand, the insulating part 23 in each functional part 21 and
portions other than the conductive parts 26 for high-frequency
shielding in the part 28 to be supported do not contain the
conductive particles P at all or scarcely contains them.
[0251] As a material of the elastic polymeric substance for forming
the elastic anisotropically conductive film and a material of the
conductive particles P in the conductive parts 22 for connection
and conductive parts 26 for high-frequency shielding in the
anisotropically conductive connector 10 according to the seventh
embodiment, may be used the same materials as those in the
anisotropically conductive connector 10 according to the first
embodiment.
[0252] A clearance between conductive parts 26 for high-frequency
shielding adjoining each other, which surround the respective
conductive parts 25 for connection, is the same as in the
anisotropically conductive connector 10 according to the second
embodiment.
[0253] The anisotropically conductive connector 10 according to the
seventh embodiment can be produced in accordance with the
production process of the anisotropically conductive connector 10
according to the first embodiment.
[0254] According to the anisotropically conductive connector 10
according to the seventh embodiment, in addition to the conductive
parts 22 for connection arranged in the respective functional parts
21 and to be electrically connected to electrodes that are an
object of connection, a plurality of the conductive parts 26 for
high-frequency shielding extending in the same direction as the
conductive parts 22 for connection are arranged in the part 28 to
be supported of the elastic anisotropically conductive film 20 in
such a manner that they surround each of the conductive parts 22
for connection along a concentric circle with the conductive part
22 for connection, and further each of the conductive parts 26 for
high-frequency shielding is electrically connected to the frame
plate 11 having conductivity. So that both external noises to
high-frequency signals and noises from adjoining conductive parts
22 for connection can be controlled in each of the conductive parts
22 for connection by connecting the frame plate 11 to a ground.
Accordingly, expected electrical inspection as to a circuit device,
which is an object of inspection, can be performed without being
influenced by the noises even when the clock frequency of the
circuit device is, for example, at least 1 GHz in the case where
the anisotropically conductive connector 10 according to the
seventh embodiment is used in the electrical inspection of the
circuit device.
[0255] FIG. 18 is a plan view illustrating an anisotropically
conductive connector according to an eighth embodiment of the
present invention, and FIG. 19 is a cross-sectional view
illustrating, on an enlarged scale, the construction of a principal
part of the anisotropically conductive connector according to the
eighth embodiment.
[0256] The anisotropically conductive connector 10 according to the
eighth embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
first embodiment, and an elastic anisotropically conductive film 20
having conductivity in a thickness-wise direction thereof is
arranged on the opening 12 in this frame plate 11 in a state
supported by an opening edge of the frame plate 11.
[0257] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
functional part 21 composed of a plurality of conductive parts 22
for connection arranged in accordance with a pattern corresponding
to a pattern of electrodes of a circuit device to be connected and
each extending in the thickness-wise direction, and an insulating
part 23 mutually insulating the respective conductive parts 22 for
connection. This functional part 21 is arranged so as to be located
in the opening 12 in the frame plate 11. In this embodiment, each
of the conductive parts 22 for connection has a columnar form and
is arranged in accordance with positions of lattice points.
[0258] At a peripheral edge of the functional part 21, a part 28 to
be supported, which is fixed and supported by being laminated on an
opening edge of the frame plate 11, is formed integrally and
continuously with the functional part 21. More specifically, the
part 28 to be supported in this embodiment is shaped in a forked
form and fixed and supported in a closely contacted state so as to
grasp the opening edge in the frame plate 11. In this part 28 to be
supported, a conductive part 26 for high-frequency shielding
extending in the thickness-wise direction and electrically
connected to the frame plate 11 is formed. The conductive part 26
for high-frequency shielding of this embodiment having a form of
rectangular pipe, the size of a pipe hole of which is greater than
the size of the opening 12 in the frame plate 11, is arranged in
such a manner that a group 25 (indicated by an alternate long and
short dash line in FIG. 18) of conductive parts including all the
conductive parts 22 for connection in the functional part 21 is
received in the pipe hole so as to surround the group 25 of
conductive parts.
[0259] Projected parts 22a and 26a protruding from other surfaces
than portions, at which the conductive parts 22 for connection and
the conductive part 26 for high-frequency shielding are located,
are formed at those portions on both surfaces of the functional
part 21 in the elastic anisotropically conductive film 20.
[0260] As illustrated in FIG. 19, conductive particles P exhibiting
magnetism are contained at a high density in the conductive parts
22 for connection in the functional part 21 and the conductive part
26 for high-frequency shielding in the part 28 to be supported of
the elastic anisotropically conductive film 20 in a state oriented
so as to align in the thickness-wise direction of the film. On the
other hand, the insulating part 23 in the functional part 21 and
portions other than the conductive part 26 for high-frequency
shielding in the part 28 to be supported do not contain the
conductive particles P at all or scarcely contain them.
[0261] In this anisotropically conductive connector 10 according to
the eighth embodiment, as a material of the elastic polymeric
substance for forming the elastic anisotropically conductive film
and a material of the conductive particles P in the conductive
parts 22 for connection and conductive part 26 for high-frequency
shielding, may be used the same materials as those in the
anisotropically conductive connector 10 according to the first
embodiment.
[0262] The anisotropically conductive connector 10 according to the
eighth embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0263] According to the anisotropically conductive connector 10
according to the eighth embodiment, in addition to the conductive
parts 22 for connection arranged in the functional part 21 and to
be electrically connected to electrodes that are an object of
connection, the rectangular pipe-like conductive part 26 for
high-frequency shielding extending in the same direction as the
conductive parts 22 for connection is arranged in the part 28 to be
supported of the elastic anisotropically conductive film 20 in such
a manner that the group 25 of conductive parts including all the
conductive parts 22 for connection is received in the pipe hole
thereof, thereby surrounding the group 25 of conductive part, and
further the conductive part 26 for high-frequency shielding is
electrically connected to the frame plate 11 having conductivity.
So that an external noise to high-frequency signals can be
controlled in each of the conductive parts 22 for connection by
connecting the frame plate 11 to a ground. Accordingly, expected
electrical inspection as to a circuit device, which is an object of
inspection, can be performed without being influenced by the noise
even when the clock frequency of the circuit device is, for
example, at least 1 GHz in the case where the anisotropically
conductive connector 10 according to the eighth embodiment is used
in the electrical inspection of the circuit device.
[0264] FIG. 20 is a plan view illustrating an anisotropically
conductive connector according to a ninth embodiment of the present
invention, and FIG. 21 is a cross-sectional view illustrating, on
an enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the ninth
embodiment.
[0265] The anisotropically conductive connector 10 according to the
ninth embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
first embodiment, and an elastic anisotropically conductive film 20
having conductivity in a thickness-wise direction thereof is
arranged on the opening 12 in this frame plate 11 in a state
supported by an opening edge of the frame plate 11.
[0266] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
functional part 21 composed of a plurality of conductive parts 22
for connection arranged in accordance with a pattern corresponding
to a pattern of electrodes of a circuit device to be connected and
each extending in the thickness-wise direction, and an insulating
part 23 mutually insulating the respective conductive parts 22 for
connection. The functional part 21 is arranged so as to be located
in the opening 12 in the frame plate 11. In this embodiment, each
of the conductive parts 22 for connection has a columnar form and
is arranged in accordance with positions of lattice points.
[0267] At a peripheral edge of the functional part 21, a part 28 to
be supported, which is fixed and supported by being laminated on an
opening edge in the frame plate 11, is formed integrally and
continuously with the functional part 21. More specifically, the
part 28 to be supported in this embodiment is shaped in a forked
form and fixed and supported in a closely contacted state so as to
grasp the opening edge of the frame plate 11. In this part 28 to be
supported, a plurality of columnar conductive parts 26 for
high-frequency shielding each extending in the thickness-wise
direction and electrically connected to the frame plate 11 are
formed. In this embodiment, the respective conductive parts 26 for
high-frequency shielding are arranged so as to surround a group 25
(indicated by an alternate long and short dash line in FIG. 20) of
conductive parts including all the conductive parts 22 for
connection in the functional part 21 along sides of a rectangle
having a size greater than the size of the opening 12 in the frame
plate 11.
[0268] Projected parts 22a and 26a protruding from other surfaces
than portions, at which the conductive parts 22 for connection and
the conductive parts 26 for high-frequency shielding are located,
are formed at those portions on both surfaces of the functional
part 21 in the elastic anisotropically conductive film 20.
[0269] As illustrated in FIG. 21, conductive particles P exhibiting
magnetism are contained at a high density in the conductive parts
22 for connection in the functional part 21 and the conductive
parts 26 for high-frequency shielding in the part 28 to be
supported of the elastic anisotropically conductive film 20 in a
state oriented so as to align in the thickness-wise direction of
the film. On the other hand, the insulating part 23 in the
functional part 21 and portions other than the conductive parts 26
for high-frequency shielding in the part 28 to be supported do not
contain the conductive particles P at all or scarcely contain
them.
[0270] In this anisotropically conductive connector 10 according to
the ninth embodiment, as a material of the elastic polymeric
substance for forming the elastic anisotropically conductive film
and a material of the conductive particles P in the conductive
parts 22 for connection and conductive parts 26 for high-frequency
shielding, may be used the same materials as those in the
anisotropically conductive connector 10 according to the first
embodiment.
[0271] A clearance between conductive parts 26 for high-frequency
shielding adjoining each other, which surround the group 25 of
conductive parts, is the same as in the anisotropically conductive
connector 10 according to the fourth embodiment.
[0272] The anisotropically conductive connector 10 according to the
ninth embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0273] According to the anisotropically conductive connector 10
according to the ninth embodiment, in addition to the conductive
parts 22 for connection arranged in the functional part 21 and to
be electrically connected to electrodes that are an object of
connection, the plurality of the conductive parts 26 for
high-frequency shielding extending in the same direction as the
conductive parts 22 for connection are arranged in the part 28 to
be supported of the elastic anisotropically conductive film 20 so
as to surround the group 25 of conductive parts including all the
conductive parts 22 for connection, and further each of the
conductive parts 26 for high-frequency shielding is electrically
connected to the frame plate 11 having conductivity. So that an
external noise to high-frequency signals can be controlled in each
of the conductive parts 22 for connection by connecting the frame
plate 11 to a ground. Accordingly, expected electrical inspection
as to a circuit device, which is an object of inspection, can be
performed without being influenced by the noise even when the clock
frequency of the circuit device is, for example, at least 1 GHz in
the case where the anisotropically conductive connector 10
according to the ninth embodiment is used in the electrical
inspection of the circuit device.
[0274] FIG. 22 is a plan view illustrating an anisotropically
conductive connector according to a tenth embodiment of the present
invention, and FIG. 23 is a cross-sectional view illustrating, on
an enlarged scale, the construction of a principal part of the
anisotropically conductive connector according to the tenth
embodiment.
[0275] The anisotropically conductive connector 10 according to the
tenth embodiment has a frame plate 11 of the same construction as
in the anisotropically conductive connector 10 according to the
sixth embodiment, and a rectangular elastic anisotropically
conductive film 20 having conductivity in a thickness-wise
direction thereof is fixed to and supported by the frame plate
11.
[0276] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
plurality of functional parts 21 each composed of a columnar
conductive part 22 for connection extending in the thickness-wise
direction, and an insulating part 23 formed integrally with a
periphery of the conductive part 22 for connection. These
functional parts 21 are arranged so as to be located in the
respective openings 12 of the frame plate 11.
[0277] At the peripheral edge of each of the functional parts 21, a
part 28 to be supported, which is fixed and supported by being
laminated on both surfaces of the frame plate 11, is formed
integrally and continuously with each of the functional parts 21.
In this part 28 to be supported, a conductive part 26 for
high-frequency shielding extending in the thickness-wise direction
and electrically connected to the frame plate 11 is formed. The
conductive part 26 for high-frequency shielding of this embodiment
having a form of rectangular pipe, the size of a pipe hole of which
is greater than the size of a group 25 (indicated by an alternate
long and short dash line in FIG. 22) of conductive parts including
all the conductive parts 22 for connection, is arranged in such a
manner that the group 25 of conductive parts is received in the
pipe hole so as to surround the group 25 of conductive parts.
Projected parts 22a and 26a protruding from other surfaces than
portions, at which the conductive parts 22 for connection and the
conductive part 26 for high-frequency shielding are located, are
formed at those portions on both surfaces of the elastic
anisotropically conductive film 20.
[0278] As illustrated in FIG. 23, conductive particles P exhibiting
magnetism are contained at a high density in the conductive part 22
for connection in each functional part 21 and the conductive part
26 for high-frequency shielding in the part 28 to be supported in
the elastic anisotropically conductive film 20 in a state oriented
so as to align in the thickness-wise direction of the film. On the
other hand, the insulating part 23 in each functional part 21 and
portions other than the conductive part 26 for high-frequency
shielding in the part 28 to be supported do not contain the
conductive particles P at all or scarcely contains them.
[0279] As a material of the elastic polymeric substance for forming
the elastic anisotropically conductive film and a material of the
conductive particles P in the conductive parts 22 for connection
and conductive part 26 for high-frequency shielding in the
anisotropically conductive connector 10 according to the tenth
embodiment, may be used the same materials as those in the
anisotropically conductive connector 10 according to the first
embodiment.
[0280] The anisotropically conductive connector 10 according to the
tenth embodiment can be produced in accordance with the production
process of the anisotropically conductive connector 10 according to
the first embodiment.
[0281] According to the anisotropically conductive connector 10
according to the tenth embodiment, in addition to the conductive
parts 22 for connection arranged in the respective functional parts
21 and to be electrically connected to electrodes that are an
object of connection, the rectangular pipe-like conductive part 26
for high-frequency shielding extending in the same direction as the
conductive parts 22 for connection is arranged in the part 28 to be
supported of the elastic anisotropically conductive film 20 in such
a manner that the group 25 of conductive parts including all the
conductive parts 22 for connection is received in the pipe hole
thereof, thereby surrounding the group 25 of conductive part, and
further the conductive part 26 for high-frequency shielding is
electrically connected to the frame plate 11 having conductivity.
So that an external noise to high-frequency signals can be
controlled in each of the conductive parts 22 for connection by
connecting the frame plate 11 to a ground. Accordingly, expected
electrical inspection as to a circuit device, which is an object of
inspection, can be performed without being influenced by the noises
even when the clock frequency of the circuit device is, for
example, at least 1 GHz in the case where the anisotropically
conductive connector 10 according to the tenth embodiment is used
in the electrical inspection of the circuit device.
[0282] FIG. 24 is a plan view illustrating an anisotropically
conductive connector according to an eleventh embodiment of the
present invention, and FIG. 25 is a cross-sectional view
illustrating, on an enlarged scale, the construction of a principal
part of the anisotropically conductive connector according to the
eleventh embodiment.
[0283] The anisotropically conductive connector 10 according to the
eleventh embodiment has a frame plate 11 of the same construction
as in the anisotropically conductive connector 10 according to the
sixth embodiment, and a rectangular elastic anisotropically
conductive film 20 having conductivity in a thickness-wise
direction thereof is fixed to and supported by the frame plate
11.
[0284] The elastic anisotropically conductive film 20 is composed
of an elastic polymeric substance as a base material and has a
plurality of functional parts 21 each composed of a columnar
conductive part 22 for connection extending in the thickness-wise
direction, and an insulating part 23 formed integrally with a
periphery of the conductive part 22 for connection. These
functional parts 21 are arranged so as to be located in the
respective openings 12 of the frame plate 11.
[0285] At the peripheral edge of each of the functional parts 21, a
part 28 to be supported, which is fixed and supported by being
laminated on both surfaces of the frame plate 11, is formed
integrally and continuously with each of the functional parts 21.
In this part 28 to be supported, a plurality of columnar conductive
parts 26 for high-frequency shielding each extending in the
thickness-wise direction and electrically connected to the frame
plate 11 are formed. The respective conductive parts 26 for
high-frequency shielding in this embodiment are arranged so as to
surround a group 25 (indicated by an alternate long and short dash
line in FIG. 24) of conductive parts including all the conductive
parts 22 for connection in the functional parts 21 along sides of a
rectangle having a size greater than the size of the group 25 of
conductive parts.
[0286] Projected parts 22a and 26a protruding from other surfaces
than portions, at which the conductive parts 22 for connection and
the conductive parts 26 for high-frequency shielding are located,
are formed at those portions on both surfaces of the elastic
anisotropically conductive film 20.
[0287] As illustrated in FIG. 25, conductive particles P exhibiting
magnetism are contained at a high density in the conductive part 22
for connection in each functional part 21 and the conductive parts
26 for high-frequency shielding in the part 28 to be supported in
the elastic anisotropically conductive film 20 in a state oriented
so as to align in the thickness-wise direction of the film. On the
other hand, the insulating part 23 in each functional part 21 and
portions other than the conductive parts 26 for high-frequency
shielding in the part 28 to be supported do not contain the
conductive particles P at all or scarcely contains them.
[0288] As a material of the elastic polymeric substance for forming
the elastic anisotropically conductive film and a material of the
conductive particles P in the conductive parts 22 for connection
and conductive parts 26 for high-frequency in the anisotropically
conductive connector 10 according to the eleventh embodiment, may
be used the same materials as those in the anisotropically
conductive connector 10 according to the first embodiment.
[0289] A clearance between conductive parts 26 for high-frequency
shielding adjoining each other, which surround the group 25 of
conductive parts, is the same as in the anisotropically conductive
connector 10 according to the fourth embodiment.
[0290] The anisotropically conductive connector 10 according to the
eleventh embodiment can be produced in accordance with the
production process of the anisotropically conductive connector 10
according to the first embodiment.
[0291] According to the anisotropically conductive connector 10
according to the eleventh embodiment, in addition to the conductive
parts 22 for connection arranged in the-respective functional parts
21 and to be electrically connected to electrodes that are an
object of connection, the plurality of the conductive parts 26 for
high-frequency shielding extending in the same direction as the
conductive parts 22 for connection are arranged in the part 28 to
be supported of the elastic anisotropically conductive film 20 so
as to surround the group 25 of conductive parts including all the
conductive parts 22 for connection, and further each of the
conductive parts 26 for high-frequency shielding is electrically
connected to the frame plate 11 having conductivity. So that an
external noise to high-frequency signals can be controlled in each
of the conductive parts 22 for connection by connecting the frame
plate 11 to a ground. Accordingly, expected electrical inspection
on a circuit device, which is an object of inspection, can be
performed without being influenced by the noises even when the
clock frequency of the circuit device is, for example, at least 1
GHz in the case where the anisotropically conductive connector 10
according to the eleventh embodiment is used in the electrical
inspection of the circuit device.
[0292] The anisotropically conductive connectors according to the
present invention are not limited to the above-described first to
eleventh embodiments, and various changes or modifications may be
added thereto.
[0293] For example, in addition to conductive parts 26a for
high-frequency shielding, which surround individual conductive
parts 22 for connection, conductive parts 26b for high-frequency
shielding, which surround a group of conductive parts including a
plurality of conductive parts 22 for connection, may be
additionally formed in the functional part 21 of the elastic
anisotropically conductive film 20 as illustrated in FIG. 26. In
addition to conductive parts 26a, 26b for high-frequency shielding
formed in the functional part 21, conductive parts 26c for
high-frequency shielding, which surround a group of conductive
parts including a plurality of conductive parts 22 for connection,
may be additionally formed in the part 28 to be supported as
illustrated in FIG. 27.
[0294] As illustrated in FIG. 28, when plural groups 25 (indicated
by an alternate long and short dash line in FIG. 28) of conductive
parts each including a plurality of conductive parts 22 for
connection are formed at apart from each other in the functional
part 21, the conductive parts 26 for high-frequency shielding may
be formed so as to surround all the groups 25 of conductive parts
or as illustrated in FIG. 29, the conductive parts 26 for
high-frequency shielding may also be formed so as to surround the
individual group 25 of conductive parts.
[0295] The application of the anisotropically conductive connectors
according to the present invention is not limited to the electrical
inspection of circuit devices, and they may also be useful as
connectors used for mounting electronic parts on printed wiring
boards.
[0296] [Electrical Inspection Apparatus for Circuit Device]
[0297] FIG. 30 illustrates the construction of an electrical
inspection apparatus according to a first embodiment of the present
invention for circuit boards. This electrical inspection apparatus
for circuit devices has a rectangular circuit board 40 for
inspection and the anisotropically conductive connector 10
according to the first embodiment, which is arranged on a front
surface of the circuit board 40 for inspection.
[0298] On the front surface of the circuit board 40 for inspection,
a plurality of circular inspection electrodes 41 are arranged in
accordance with a pattern corresponding to a pattern of electrodes
2 to be inspected of a circuit device 1 that is an object of
inspection, and a plurality of ring-like grounding electrodes 42
are arranged in accordance with a pattern corresponding to a
pattern of the conductive parts 26 for high-frequency shielding in
the anisotropically conductive connector 10. Specifically, each of
the grounding electrodes 42 is arranged by being located
concentrically with one inspection electrode 41 so as to surround
the inspection electrode 41. The inspection electrodes 41 are
electrically connected to a tester (not illustrated), while the
grounding electrodes 42 are connected to a ground. Guide pins 43
each extending upward from the front surface of the circuit board
40 for inspection are formed at positions of 4 corners on the front
surface of the circuit board 40 for inspection.
[0299] The guide pins 43 of the circuit board 40 for inspection are
inserted into the positioning holes 13 in the frame plate 11 in the
anisotropically conductive connector 10, whereby the
anisotropically conductive connector 10 is arranged on and fixed to
the front surface of the circuit board 40 for inspection in a state
that the conductive parts 22 for connection in the elastic
anisotropically conductive film 20 have been located on the
inspection electrodes 41, and the conductive parts 26 for
high-frequency shielding have been located on the grounding
electrodes 42.
[0300] In such an electrical inspection apparatus for circuit
devices, the circuit device 1 is arranged on the anisotropically
conductive connector 10 in such a manner that the electrodes 2 to
be inspected are located on the conductive parts 22 for connection.
In this state, for example, the circuit device 1 is pressed
downward, whereby each of the conductive parts 22 for connection in
the anisotropically conductive connector 10 is held and pressurized
by the electrode 2 to be inspected and the inspection electrode 41,
thereby forming a conductive path in the conductive part 22 for
connection in a thickness-wise direction thereof. As a result,
electrical connection between each of the electrodes 2 to be
inspected of the circuit device 1 and each of the inspection
electrodes 41 of the circuit board 40 for inspection is achieved.
In this state, necessary electrical inspection for the circuit
device 1 is performed.
[0301] Examples of the circuit device 1 that is the object of
inspection include semiconductor integrated circuit devices such as
packaged IC and MCM, wafers, on which integrated circuits have been
formed, printed circuit boards for making up the semiconductor
integrated circuit devices, and printed circuit boards for mounting
the semiconductor integrated circuit devices.
[0302] According to such an electrical inspection apparatus for
circuit devices, the anisotropically conductive connector according
to the first embodiment is provided, and each of the conductive
parts 26 for high-frequency shielding in the anisotropically
conductive connector 10 is connected to a ground through the
grounding electrode 42 in the circuit board 40 for inspection, so
that both external noises to high-frequency signals and noises from
adjoining conductive parts 22 for connection can be controlled in
each of the conductive parts 22 for connection of the
anisotropically conductive connector 10. Accordingly, expected
electrical inspection as to the circuit device 1, which is the
object of inspection, can be performed without being influenced by
the noises even when the clock frequency of the circuit device 1
is, for example, at least 1 GHz.
[0303] FIG. 31 illustrates the construction of an electrical
inspection apparatus according to a second embodiment of the
present invention for circuit devices. This electrical inspection
apparatus for circuit devices has a rectangular circuit board 40
for inspection and the anisotropically conductive connector 10
according to the sixth embodiment, which is arranged on a front
surface of the circuit board 40 for inspection.
[0304] On the front surface of the circuit board 40 for inspection,
a plurality of circular inspection electrodes 41 are arranged in
accordance with a pattern corresponding to a pattern of electrodes
2 to be inspected of a circuit device 1 that is an object of
inspection. These inspection electrodes 41 are electrically
connected to a tester (not illustrated). Guide pins 43 each
extending upward from the front surface of the circuit board 40 for
inspection are formed at positions of 4 corners on the front
surface of the circuit board 40 for inspection. The guide pins 43
of the circuit board 40 for inspection are inserted into the
positioning holes 13 in the frame plate 11 in the anisotropically
conductive connector 10, whereby the anisotropically conductive
connector 10 is arranged on and fixed to the front surface of the
circuit board 40 for inspection in a state that the conductive
parts 22 for connection in the elastic anisotropically conductive
film 20 have been located on the inspection electrodes 41.
[0305] The frame plate 11 in the anisotropically conductive
connector 10 is connected to a ground.
[0306] In such an electrical inspection apparatus for circuit
devices, the circuit device 1 is arranged on the anisotropically
conductive connector 10 in such a manner that the electrodes 2 to
be inspected are located on the conductive parts 22 for connection.
In this state, for example, the circuit device 1 is pressed
downward, whereby each of the conductive parts 22 for connection in
the anisotropically conductive connector 10 is held and pressurized
by the electrode 2 to be inspected and the inspection electrode 41,
thereby forming a conductive path in the conductive part 22 for
connection in a thickness-wise direction thereof. As a result,
electrical connection between each of the electrodes 2 to be
inspected of the circuit device 1 and each of the inspection
electrodes 41 of the circuit board 40 for inspection is achieved.
In this state, necessary electrical inspection for the circuit
device 1 is performed. In this embodiment, the circuit device 1
that is the object of inspection is the same as in the electrical
inspection apparatus illustrated in FIG. 30 for circuit
devices.
[0307] According to such an electrical inspection apparatus for
circuit devices, the anisotropically conductive connector 10
according to the sixth embodiment is provided, and each of the
conductive parts 26 for high-frequency shielding in the
anisotropically conductive connector 10 is connected to a ground
through the frame plate 11, so that both external noises to
high-frequency signals and noises from adjoining conductive parts
22 for connection can be controlled in each of the conductive parts
22 for connection of the anisotropically conductive connector 10.
Accordingly, expected electrical inspection as to the circuit
device 1, which is the object of inspection, can be performed
without being influenced by the noises even when the clock
frequency of the circuit device 1 is, for example, at least 1
GHz.
[0308] The electrical inspection apparatus according to the present
invention for circuit devices are not limited to the
above-described embodiments, and various changes or modifications
may be added thereto.
[0309] For example, in the electrical inspection apparatus
illustrated in FIG. 30 for circuit devices, any one of the
anisotropically conductive connectors according to the second to
fifth embodiments and the anisotropically conductive connectors
illustrated in FIG. 26 to FIG. 29 may be used in place of the
anisotropically conductive connector 10 according to the first
embodiment. In this case, it is only necessary to arrange the
grounding electrodes 42 in the circuit board 40 for inspection in
accordance with a pattern corresponding to a pattern of the
conductive parts for high-frequency shielding formed in the
functional part of the elastic anisotropically conductive film in
the anisotropically conductive connector used. In the case where
the anisotropically conductive connector illustrated in FIG. 27 is
used, the frame plate 11 is preferably connected to a ground.
[0310] In addition, in the electrical inspection apparatus
illustrated in FIG. 31 for circuit devices, any one of the
anisotropically conductive connectors according to the seventh to
eleventh embodiments may be used in place of the anisotropically
conductive connector 10 according to the sixth embodiment.
[0311] In the electrical inspection apparatus illustrated in FIG.
30 for circuit devices, the anisotropically conductive connector 10
according to the sixth embodiment may be used in place of the
anisotropically conductive connector 10 according to the first
embodiment. In such construction, only the grounding electrodes 42
in the circuit board 40 for inspection may be connected to a ground
as illustrated in FIG. 32. However, it is preferable that both
grounding electrodes 42 and frame plate 11 be electrically
connected to a ground.
[0312] The present invention will hereinafter be described
specifically by the following Examples. However, the present
invention is not limited to the following Examples.
EXAMPLE 1
[0313] An anisotropically conductive connector (10) according to
the present invention was produced under the following conditions
in accordance with the construction illustrated in FIG. 14 and FIG.
15.
[0314] [Frame Plate (11)]
[0315] A frame plate of the following specification was
produced.
[0316] Material: Stainless steel (JIS Standard Code: SUS304),
dimensions: 10 mm.times.10 mm.times.0.1 mm, diameter of opening
(12): 500 .mu.m, the number of openings (12): 16 (4.times.4),
arrangement pitch of openings (12): 1 mm. [Mold for Molding Elastic
Anisotropically Conductive Film]
[0317] A mold for molding an elastic anisotropically conductive
film composed of a top force (30) and a bottom force (35) of the
following specification was produced in accordance with the
construction illustrated in FIG. 3.
[0318] Ferromagnetic base plates (31, 36):
[0319] Material: steel material (JIS Standard Code: SS400),
[0320] Thickness: 6 mm.
[0321] Ferromagnetic substance layers (32, 37):
[0322] Material: nickel,
[0323] Diameter: 300 .mu.m,
[0324] Thickness: 50 .mu.m,
[0325] Number: 16 (4.times.4),
[0326] Arrangement pitch: 1 mm.
[0327] Ferromagnetic substance layers (33, 38):
[0328] Material: nickel,
[0329] Inner diameter: 600 .mu.m,
[0330] Outer diameter: 800 .mu.m,
[0331] Thickness: 50 .mu.m,
[0332] Number: 16 (4.times.4),
[0333] Arrangement pitch: 1 mm.
[0334] Non-magnetic substance layers (34, 39):
[0335] Material: cured product of dry film resist,
[0336] Thickness: 100 .mu.m.
[0337] [Spacers (15, 16)]
[0338] Two spacers (15, 16) each composed of stainless steel (JIS
Standard Code: SUS304) and having a thickness of 100 .mu.m and an
opening of 7.5 mm.times.7.5 mm were produced.
[0339] [Formation of Elastic Anisotropically Conductive Film]
[0340] Eighty parts by weight of conductive particles having an
average particle diameter of 30 .mu.m were added to and mixed with
100 parts by weight of addition type liquid silicon rubber.
Thereafter, the resultant mixture was subjected to a defoaming
treatment by pressure reduction, thereby preparing a molding
material for molding an elastic anisotropically conductive film. In
the above-described process, those (average coating amount: 8% of
the weight of core particles) obtained by plating core particles
composed of nickel with gold were used as the conductive
particles.
[0341] The molding material prepared was applied to the respective
molding surfaces of the top force (30) and bottom force (35) in the
mold described above by screen printing, and the frame plate (11)
was arranged in alignment on the coating layer of the molding
material formed on the molding surface of the bottom force (35)
through the spacer (16). Further, the top force (30), on which the
coating layer of the molding material had been formed, was arranged
in alignment on the frame plate (11) through the spacer (15),
thereby forming a molding material layer in a molding cavity
between the top force (30) and the bottom force (35).
[0342] Electromagnets were arranged on an upper surface of the
ferromagnetic base plate (31) of the top force (30) and a lower
surface of the ferromagnetic base plate (36) of the bottom force
(35), and the electromagnets are operated, whereby a magnetic field
of 1.3 T was applied to the molding material layer in a
thickness-wise direction thereof at portions located between the
ferromagnetic substance layers (32, 33) of the top force (30) and
the ferromagnetic substance layers (37, 38) of the bottom force
(35). In this state, the molding material layer was subjected to a
curing treatment under conditions of 100.degree. C. for 1 hour,
thereby forming an elastic anisotropically conductive film (20) in
the frame plate (11) to produce an anisotropically conductive
connector (10) according to the present invention.
[0343] In the elastic anisotropically conductive film (20) in the
anisotropically conductive connector (10) thus obtained, 16
(4.times.4) conductive parts (22) for connection are formed, and a
center distance (pitch) between adjacent conductive parts (22) for
connection is 1 mm. Each of the conductive parts (22) for
connection is such that the diameter is 300 .mu.m, the thickness is
400 .mu.m, and the projected heights from both surfaces of the
insulating part (23) are each 50 .mu.m. Each of the conductive
parts (26) for high-frequency shielding is such that the inner
diameter is 600 .mu.m, the outer diameter is 800 .mu.m, the
thickness is 150 .mu.m, and the projected heights from both
surfaces of the insulating part (23) are each 50 .mu.m. The
thickness of the insulating part (23) is 300 .mu.m.
[0344] The proportion of the conductive particles in the conductive
parts (22) for connection was 25% in terms of a volume fraction,
while the proportion of the conductive particles in the conductive
parts (26) for high-frequency shielding was 25% in terms of a
volume fraction.
[0345] [Circuit Board for Inspection]
[0346] A circuit board (40) for inspection of the following
specification was produced in accordance with the construction
illustrated in FIG. 32.
[0347] Inspection electrodes (41) each have a diameter of 300
.mu.m, the number thereof is 16 (4.times.4), and the arrangement
pitch thereof is 1 mm. Grounding electrodes (42) each have an inner
diameter of 600 .mu.m and an outer diameter of 800 .mu.m, the
number thereof is 16 (4.times.4), and the arrangement pitch thereof
is 1 mm. This circuit board (40) for inspection has an external
leading terminal (not illustrated) electrically connected to the
inspection electrodes, and impedances Z of each circuit formed
between the inspection electrodes (41) and the external leading
terminal, and a probe cable for measurement connected to the
external leading terminal are each designed to be 50 OMEGA.
[0348] [Evaluation of Anisotropically Conductive Connector]
[0349] The circuit board for inspection described above was used to
evaluate the anisotropically conductive connector described above
in the following manner.
[0350] A pulse generator was electrically connected to the leading
terminal of the circuit board for inspection through a probe cable
for measurement, and a terminal for measurement of an oscilloscope
was brought into contact under pressure with an inspection
electrode of the circuit board for inspection. In this state, an
electric signal having a preset voltage of 2 V and a frequency
shown in the following Table 1 was supplied to the external leading
terminal of the circuit board for inspection by the pulse generator
to detect an electric signal output from the inspection electrode
of the circuit board for inspection by the oscilloscope. In the
waveform of the electric signal detected, a time required until the
voltage reached a value of 90% (1.8 V) of the preset voltage from a
value of 10% (0.2 V) of the preset voltage was measured. This time
is referred to as "T.sub.0".
[0351] On the other hand, the anisotropically conductive connector
was arranged in alignment on the circuit board for inspection, the
pulse generator was electrically connected to the leading terminal
of the circuit board for inspection through the probe cable for
measurement, and the terminal for measurement of the oscilloscope
was brought into contact under pressure with a conductive part for
connection of the anisotropically conductive connector in such a
manner that the distortion factor of the conductive part was 20%.
In this state, an electric signal having a preset voltage of 2 V
and a frequency shown in the following Table 1 was supplied to the
external leading terminal of the circuit board for inspection by
the pulse generator to detect an electric signal output from the
conductive part for connection of the anisotropically conductive
connector by the oscilloscope. In the waveform of the electric
signal detected, a time required until the voltage reached a value
of 90% (1.8 V) of the preset voltage from a value of 10% (0.2 V) of
the preset voltage was measured. This time is referred to as
"T.sub.1".
[0352] A value of (T.sub.1-T.sub.0)/T.sub.0 was then calculated out
to rank the anisotropically conductive connector as A where this
value was smaller than 0.05, B where this value was from 0.05 to
0.2, or C where this value exceeded 0.2.
[0353] In this test, when the value of (T.sub.1-T.sub.0)/To exceeds
0.2, a transmission loss is great, so that it is difficult in fact
to conduct a test for high-frequency properties.
[0354] The determination of the value of (T.sub.1-T.sub.0)/T.sub.0
was conducted under the following Condition 1 to Condition 3.
[0355] Condition 1:
[0356] The frame plate of the anisotropically conductive connector
is connected to a ground, and the grounding electrode of the
circuit board for inspection is not connected to a ground.
[0357] Condition 2:
[0358] The frame plate of the anisotropically conductive connector
is not connected to a ground, but the grounding electrode of the
circuit board for inspection is connected to a ground.
[0359] Condition 3:
[0360] Both frame plate of the anisotropically conductive connector
and grounding electrode of the circuit board for inspection are
connected to a ground.
[0361] The results are shown in the following Table 1.
COMPARATIVE EXAMPLE 1
[0362] A comparative anisotropically conductive connector (50) was
produced under the following conditions in accordance with the
construction illustrated in FIG. 34 and FIG. 35.
[0363] [Frame Plate (51)]
[0364] A frame plate (51) of the following specification was
produced.
[0365] Material: Stainless steel (JIS Standard Code: SUS304),
dimensions: 10 mm.times.10 mm.times.0.1 mm, dimensions of opening
(52): 5.5 mm.times.5.5 mm.
[0366] [Mold for Molding Elastic Anisotropically Conductive
Film]
[0367] A mold for molding an elastic anisotropically conductive
film composed of a top force (60) and a bottom force (65) of the
following specification was produced in accordance with the
construction illustrated in FIG. 36.
[0368] Ferromagnetic base plates (61, 66):
[0369] Material: steel material (JIS Standard Code: SS400),
[0370] Thickness: 6 mm.
[0371] Ferromagnetic substance layers (62, 67):
[0372] Material: nickel,
[0373] Diameter: 300 .mu.m,
[0374] Thickness: 50 .mu.m,
[0375] Number: 16 (4.times.4),
[0376] Arrangement pitch: 1 mm.
[0377] Non-magnetic substance layers (63, 68):
[0378] Material: cured product of dry film resist,
[0379] Thickness: 100 .mu.m.
[0380] [Spacers (70, 71)]
[0381] Two spacers (70, 71) each composed of stainless steel (JIS
Standard Code: SUS304) and having a thickness of 100 .mu.m and an
opening of 7.5 mm.times.7.5 mm were produced.
[0382] [Formation of Elastic Anisotropically Conductive Film]
[0383] Fifty three parts by weight of conductive particles having
an average particle diameter of 30 .mu.m were added to and mixed
with 100 parts by weight of addition type liquid silicon rubber.
Thereafter, the resultant mixture was subjected to a defoaming
treatment by pressure reduction, thereby preparing a molding
material for molding an elastic anisotropically conductive film. In
the above-described process, those (average coating amount: 10% of
the weight of core particles) obtained by plating core particles
composed of nickel with gold were used as the conductive
particles.
[0384] The molding material prepared was applied to the respective
molding surfaces of the top force (60) and bottom force (65) in the
mold described above by screen printing, and the frame plate (51)
was arranged in alignment on the coating layer of the molding
material formed on the molding surface of the bottom force (65)
through the spacer (71). Further, the top force (60), on which the
coating layer of the molding material had been formed, was arranged
in alignment on the frame plate (51) through the spacer (70),
thereby forming a molding material layer in a molding cavity
between the top force (60) and the bottom force (65).
[0385] Electromagnets were arranged on an upper surface of the
ferromagnetic base plate (61) of the top force (60) and a lower
surface of the ferromagnetic base plate (66) of the bottom force
(65), and the electromagnets are operated, whereby a magnetic field
of 1.3 T was applied to the molding material layer in a
thickness-wise direction thereof at portions located between the
ferromagnetic substance layers (62) of the top force (60) and the
ferromagnetic substance layers (67) of the bottom force (65). In
this state, the molding material layer was subjected to a curing
treatment under conditions of 100.degree. C. for 1 hour, thereby
forming an elastic anisotropically conductive film in the frame
plate (51) to produce a comparative anisotropically conductive
connector (50).
[0386] In a functional part (56) of the elastic anisotropically
conductive film (55) in the anisotropically conductive connector
(50) thus obtained, 16 (4.times.4) conductive parts (57) for
connection are formed, and a center distance (pitch) between
adjacent conductive parts (57) for connection is 1 mm. Each of the
conductive parts (57) for connection is such that the diameter is
300 .mu.m, the thickness is 400 .mu.m, and the projected heights
from both surfaces of the insulating part (58) are each 50 .mu.m.
The thickness of the insulating part (58) is 300 .mu.m.
[0387] The proportion of the conductive particles in the conductive
parts (57) for connection was 25% in terms of a volume
fraction.
[0388] [Evaluation of Anisotropically Conductive Connector]
[0389] The circuit board for inspection produced in Example 1 was
used to evaluate the anisotropically conductive connector described
above in the same manner as in Example 1 except that the conditions
were changed to conditions that neither the frame plate of the
anisotropically conductive connector nor the grounding electrode of
the circuit board for inspection was connected to a ground. The
results are shown in the following Table 1. TABLE-US-00001 Test
Frequency (GHz) 0.1 0.2 0.5 1 2 5 10 20 Example 1 Condition 1 A A A
A A B C C Condition 2 A A A A A A A B Condition 3 A A A A A A A A
Comparative Example 1 A A A B C C C C
* * * * *