U.S. patent application number 11/437508 was filed with the patent office on 2007-11-22 for method of partially electroplating radiator.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to Jing-De Gu, Hsin-Cheng Lin, Jiang-Yan Liu.
Application Number | 20070267300 11/437508 |
Document ID | / |
Family ID | 38711025 |
Filed Date | 2007-11-22 |
United States Patent
Application |
20070267300 |
Kind Code |
A1 |
Gu; Jing-De ; et
al. |
November 22, 2007 |
Method of partially electroplating radiator
Abstract
A method of electroplating a radiator is provided. A container
is disposed on a predetermined plating area of the radiator and an
electrolyte containing the plating material is added into the
container such that the electrolyte directly contacts the
predetermined plating area to form a plating layer thereon.
Inventors: |
Gu; Jing-De; (Hsin-Chuang,
TW) ; Liu; Jiang-Yan; (Hsin-Chuang, TW) ; Lin;
Hsin-Cheng; (Hsin-Chuang, TW) |
Correspondence
Address: |
Asia Vital Components Co., Ltd.
P.O. BOX 1-195
YUNG HO
omitted
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
HSIN-CHUANG
TW
|
Family ID: |
38711025 |
Appl. No.: |
11/437508 |
Filed: |
May 22, 2006 |
Current U.S.
Class: |
205/305 |
Current CPC
Class: |
C25D 5/02 20130101; C25D
5/34 20130101 |
Class at
Publication: |
205/305 |
International
Class: |
C25D 3/22 20060101
C25D003/22 |
Claims
1. A method of electroplating a radiator, comprising providing a
container corresponding to a plating area of a radiator for holding
an electrolyte such that the electrolyte directly contacts the
plating area to form a plating layer thereon.
2. The method of electroplating a radiator according to claim 1,
wherein the electrolyte is held still in the container so that the
electrolyte constantly contacts the plating area.
3. The method of electroplating a radiator according to claim 1,
wherein said container surrounds the plating area and the
electrolyte flows through the container continuously and has a
constant contact with the plating area.
4. The method of electroplating a radiator according to claim 1,
wherein the electrolyte comprises a nickel solution.
5. The method of electroplating a radiator according to claim 1,
further comprising the steps of: performing a cleaning process to
clean a surface of the plating area; and performing a reduction
process on the cleaned surface of the plating area before
contacting the electrolyte with the plating area.
6. The method of electroplating a radiator according to claim 5,
wherein reduction process includes treating the plating area with a
zinc solution to remove an oxide layer thereon.
7. The method of electroplating a radiator according to claim 6,
wherein the plating area is treated twice with zinc solution with a
step of cleaning the plating area using aqueous nitric acid between
the two treatments followed by a cleaning step using water.
8. The method of electroplating a radiator according to claim 6,
wherein the zinc solution held inside the container to contact the
plating area.
9. The method of electroplating a radiator according to claim 1,
wherein the plating area of the radiator comprises a groove.
10. The method of electroplating a radiator according to claim 1,
wherein the plating area of the radiator comprises a flat
surface.
11. The method of electroplating a radiator according to claim 1,
wherein the container only corresponds to the plating area of the
radiator.
12. The method of electroplating a radiator according to claim 1,
wherein the container has a smaller dimension compared to that of
the plating area of the radiator
13. A method of electroplating a radiator, comprising: cleaning a
surface of a predetermined plating area of a radiator; performing a
first treatment process to treat the surface of the predetermined
plating area with a zinc solution by constantly contacting the zinc
solution with the surface of the predetermined plating area to
reduce the surface of the predetermined plating area and
transferring the zinc solution to recycle; treating the surface of
the plating area with aqueous nitric acid; performing a second
treatment process to treat the surface of the predetermined plating
area with zinc solution to reduce the surface of the predetermined
plating area and transferring the zinc solution to recycle;
cleaning the surface of the predetermined plating area with water;
heating the radiator to dry the radiator; contacting zinc solution
to constantly contact the surface of the predetermined plating area
to form a zinc layer thereon; and cleaning the zinc layer using
water.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a electroplating method,
and more particularly to a method of partially electroplating a
radiator.
[0003] 2. Description of Related Art
[0004] Conventional copper radiator comprises two structures
comprised of different metallic materials, for example, an aluminum
structure and a copper base assembled together with a nickel plated
layer formed at a conjunction portion between the aluminum
structure and the copper base. Furthermore, an adhesive layer, for
example, a tin paste is coated thereon.
[0005] The method of electroplating a nickel layer includes first
submerging the whole radiator structure into a tank containing a
zinc solution for electroplating a zinc layer, and then submerging
the radiator into a tank containing a nickel solution for
electroplating the nickel layer thereon. The nickel layer is thus
electroplated on the surface of the zinc layer.
[0006] However, only the conjunction portion between aluminum
structure and the copper base are required to be plated with nickel
layer. Since conventional electroplating method includes submerging
the whole radiator into the nickel solution, and therefore not only
more material and process time are required, which substantially
increase the cost, but also the heat dissipation of the radiator is
adversely affected due to the poor heat conduction property of the
nickel. The appearance of the nickel is not as good as that of
copper.
[0007] Thus, it is highly desirable to further improve the heat
dissipation effect of the copper radiator.
SUMMARY OF THE INVENTION
[0008] Accordingly, in the view of the foregoing, the present
invention provides a method of partially electroplating a radiator
for improving both the heat dissipation effect as well as the
appearance thereof.
[0009] According to an aspect of the present invention, the
electroplating method not only reduces the process time and the
production cost but also allows recycling of the electrolyte.
[0010] In accordance with above objectives and other objectives,
the present invention provides a method of electroplating a
radiator including providing a container capable of plating a layer
on a predetermined plating area or section of the radiator by
contacting the electrolyte to the predetermined plating area or
section of the radiator.
BRIEF DESCRIPTION OF THE DRAWING
[0011] For a more complete understanding of the present invention,
reference will now be made to the following detailed description of
preferred embodiments taken in conjunction with the following
accompanying drawings.
[0012] FIG. 1 is a flowchart illustrating a method of
electroplating a radiator according to an embodiment of the present
invention.
[0013] FIG. 2 is an exploded view of a container and a radiator
according to an embodiment of the present invention.
[0014] FIG. 3 is an exploded view of a container for plating a
layer on a predetermined area or section of the radiator according
to an embodiment of the present invention.
[0015] FIG. 4 is a sectional side view showing while the zinc
solution and an electrolyte pass through the container to contact
the predetermined area or section of the radiator.
[0016] FIG. 5 is view showing a method of electroplating a radiator
according to another preferred embodiment of the present
invention.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0017] Referring to FIG. 1, a flowchart illustrating a method of
electroplating on a predetermined plating area of a radiator is
described as follows. First, the surface of the predetermined
plating area of the radiator is cleaned. Next, the zinc solution is
allowed to constantly contact the plating area to reduce the
predetermined plating area, and then the zinc solution is
transferred for recycling. Next, the predetermined plating area is
cleaned with the nitric acid and water. Next, the predetermined
electroplating area is once again treated with the zinc solution to
reduce the predetermined plating area, and then the zinc solution
is transferred for recycling. Next, the predetermined plating area
is cleaned with water. Next, the radiator is heated and dried, and
then the predetermined plating area is treated with the zinc layer.
Next, the zinc layer is cleaned with water.
[0018] Hereinafter, the method of electroplating the predetermined
plating area of the radiator using the electrolyte containing the
zinc solution and the electroplating material is described with
reference to FIGS. 2, 3 and 4. A container 12 corresponding to the
predetermined plating area of the radiator 11 is mounted on the
predetermined plating area 111, and then an electrolyte containing
zinc solution and plating material is added into the container 12
such that electrolyte directly contacts the predetermined plating
area 111 to form a plating layer thereon.
[0019] The plating material according to the above preferred
embodiment comprises liquefied nickel for forming a nickel layer on
the predetermined plating area 111.
[0020] According to an embodiment of the present invention, the
above acidic water cleaning process includes flowing the aqueous
nitric acid through the container 12 to clean the surface of the
predetermined plating area 111, or adding the aqueous nitric acid
into the container 12 to directly clean the predetermined plating
area 111.
[0021] According to an embodiment of the present invention, the
above thermal drying process includes placing the radiator 11 in a
furnace at a temperature, for example 90.degree. C., until the
fluid on the surface of the radiator 11 evaporates and dries.
However, it should be noted that the above temperature in the
preferred embodiment is not intended for limiting the scope of the
present invention, the temperature may vary according to the size
of the radiator 11 and or the temperature and humidity of the
surrounding environment.
[0022] The shape of the container 12 can be of any shape and is not
limited to that shown in the Figures. It should be noted that the
purpose of the container 12 is merely intended to surround the
predetermined plating area 111 for holding the electrolyte
containing zinc solution and the plating material directly in
contact with the predetermined plating area 111 of the radiator 11.
Even though the Figures show the radiator 11 has a groove formed at
an end thereof, but this is not intended to limit the scope of the
present invention. The predetermined plating area 111 may also have
a flat surface.
[0023] Referring to FIG. 5, the container 12 corresponds to the
predetermined plating area 111 of the radiator 11 such that the
electrolyte held therein comes in direct contact with the
predetermined plating area, wherein the diameter or dimension of
the container 12 is smaller than that of the predetermined plating
area 111. At least a through hole 112 is formed in the radiator 11
passing through the plating area 111. The electrolyte containing
zinc solution and the plating material may be added into the
container 12, where the electrolyte may be held or allowed to flow
into the container 12 and out of the through hole 112 continuously
contacting the predetermined plating area 111. Because the through
hole 112 is substantially smaller than the diameter of the
container, and therefore the volume of the electrolyte flowing into
the predetermined plating area is more than that flowing out of the
through hole 112. Thus, the electrolyte continuously contacts the
predetermined plating area 111. After the completion of
electroplating process, the electrolyte containing the zinc
solution and the plating material can be completely discharged from
the container 12 through the through hole 112.
[0024] Accordingly, as described above, only the plating area of
the radiator may be selectively plated with nickel by contacting
the electrolyte, and the remaining portions of the radiator that
need not be plated with nickel is contacted with the electrolyte.
Thus, not only the used electrolyte can be recycled and the process
time can be reduced to reduce the manufacturing cost but also the
appearance and the heat dissipation effect of the radiator can be
effectively promoted.
[0025] While the invention has been described in conjunction with a
specific best mode, it is to be understood that many alternatives,
modifications, and variations will be apparent to those skilled in
the art in light of the foregoing description. Accordingly, it is
intended to embrace all such alternatives, modifications, and
variations in which fall within the spirit and scope of the
included claims. All matters set forth herein or shown in the
accompanying drawings are to be interpreted in an illustrative and
non-limiting sense.
* * * * *