U.S. patent application number 11/383719 was filed with the patent office on 2007-11-22 for juxtaposing structure for heated ends of heat pipes.
Invention is credited to Kuo-Len Lin, Wen-Jung Liu.
Application Number | 20070267177 11/383719 |
Document ID | / |
Family ID | 38710959 |
Filed Date | 2007-11-22 |
United States Patent
Application |
20070267177 |
Kind Code |
A1 |
Lin; Kuo-Len ; et
al. |
November 22, 2007 |
Juxtaposing Structure For Heated Ends Of Heat Pipes
Abstract
A juxtaposing structure for the heated ends of a plurality of
heat pipes includes a plurality of heat pipes. Each heat pipe has a
heated end. The surface of the heated end of each heat pipe has an
upper plane and a lower plane facing to each other and side curved
surfaces formed between both sides of the two planes. Side curved
surfaces of any two adjacent heat pipes adjoin and abut against
each other. A heat-conducting medium is filled between any two
adjacent side curved surfaces to bind these two surfaces. A
connecting surface is formed on the heat-conducting medium to be
flush with the planes adjacent to both sides thereof. With the
combination of each lower plane and the adjacent connecting
surfaces, a heated surface having a larger area can be formed.
Inventors: |
Lin; Kuo-Len; (Wugu
Township, TW) ; Liu; Wen-Jung; (Wugu Township,
TW) |
Correspondence
Address: |
HDSL
4331 STEVENS BATTLE LANE
FAIRFAX
VA
22033
US
|
Family ID: |
38710959 |
Appl. No.: |
11/383719 |
Filed: |
May 16, 2006 |
Current U.S.
Class: |
165/104.21 |
Current CPC
Class: |
F28F 1/32 20130101; F28D
15/0275 20130101; F28F 2013/006 20130101; F28F 2275/02 20130101;
F28D 15/0266 20130101; F28F 2275/06 20130101 |
Class at
Publication: |
165/104.21 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Claims
1. A juxtaposing structure for heated ends of heat pipes,
comprising a plurality of heat pipes, each heat pipe having a
heated end, a surface of the heated end of each heat pipe having an
upper and a lower planes facing to each other and side curved
surfaces formed between both sides of two planes, wherein the side
curved surfaces of any two adjacent heat pipes adjoin and abut
against each other, a heat-conducting medium is filled between any
two adjacent side curved surfaces to bind the two surfaces, a
connecting surface is formed on the heat-conducting medium to be
flush with planes adjacent to both sides thereof, thereby to form a
heated surface having a larger area with a combination of each
lower plane and adjacent connecting surfaces.
2. The juxtaposing structure according to claim 1, wherein each
heat pipe is formed into a straight pipe.
3. The juxtaposing structure according to claim 1, wherein each
heat pipe is formed into an upright U-lettered shape, and the
heated end of each heat pipe is located at the bottom of the
U-lettered shape.
4. The juxtaposing structure according to claim 1, wherein each
heat pipe is formed into a side-lay U-lettered shape, and the
heated end of each heat pipe is located at an extending end of the
U-lettered shape.
5. The juxtaposing structure according to claim 1, wherein the
heat-conducting medium is solders.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a juxtaposing structure for
the heated ends of a plurality of heat pipes, and in particular to
a portion of the heat pipe for thermally connecting to a
heat-generating electronic element (i.e., the heated end). A heated
surface having a larger area can be formed by means of juxtaposing
a plurality of heat pipes.
[0003] 2. Description of Prior Art
[0004] Generally, a heat pipe can be applied to the
heat-dissipating device of electronic products. One end of the heat
pipe is thermally connected to the heat-generating electronic
element, and the other end thereof penetrates through a plurality
of heat-dissipating fins. With the excellent heat conductivity of
the heat pipe, the heat generated by the heat-generating electronic
element can be transmitted to each heat-dissipating fin via the
heat pipe to gradually dissipate the heat and lower the
temperature. Further, the heat accumulated among each
heat-dissipating fin can be rapidly dissipated via a
heat-dissipating fan, thereby to achieve an excellent
heat-dissipating effect.
[0005] The cross section of the heat pipe is formed into a circular
pipe and the surface area is not large enough after being pressed
flat. Therefore, in conventional art, the heat pipe is connected to
a heat-conducting plate and then the heat-conducting plate adheres
to the surface of the heat-generating electronic element. However,
such method causes the heat pipe unable to directly contact with
the heat-generating electronic element and thus it is difficult to
exhibit the optimal performance. Further, the heat-conducting plate
is usually made of copper, which is heavy and expensive. If the
aluminum is used, the heat-conducting performance will be affected
due to the bad heat conductivity of aluminum. Therefore, a method
is proposed, in which the heat pipe is pressed to form the heated
end of the heat pipe into a flat surface so as to facilitate the
adhesion to the upper surface of the heat-generating electronic
element, as disclosed in Taiwan Patent Publication No. M248231
entitled "Heat-Dissipating Device For Heat Pipe".
[0006] However, in the above-mentioned method, if the surface area
after pressing is not large enough, the heated end of the heat pipe
may be unable to completely cover the upper surface of the
heat-generating electronic element. On the other hand, if a larger
area is to be pressed out, the heat pipe may be broken during the
pressing operation because of the insufficient thickness of the
pipe.
[0007] In view of the above, the inventor proposes the present
invention to overcome the above problems based on his expert
experiences and deliberate researches.
SUMMARY OF THE INVENTION
[0008] The present invention is to provide a juxtaposing structure
for the heated ends of a plurality of heat pipes, in which the
heated end of the heat pipe can directly contact with the
heat-generating electronic element and the heated end has a larger
area for completely covering and adhering to the upper surface of
the heat-generating electronic element.
[0009] The present invention provides a juxtaposing structure for
the heated ends of a plurality of heat pipes, which comprises a
plurality of heat pipes. Each heat pipe has a heated end. The
surface of the heated end of each heat pipe has an upper plane and
a lower plane facing to each other and side curved surfaces formed
between both sides of the two planes. Side curved surfaces of any
two adjacent heat pipes adjoin and abut against each other. A
heat-conducting medium is filled between any two adjacent side
curved surfaces to bind these two surfaces. A connecting surface is
formed on the heat-conducting medium to be flush with the planes
adjacent to both sides thereof. With the combination of each lower
plane and the adjacent connecting surfaces, a heated surface having
a larger area can be formed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The features of the invention believed to be novel are set
forth with particularity in the appended claims. The invention
itself however may be best understood by reference to the following
detailed description of the invention, which describes certain
exemplary embodiments of the invention, taken in conjunction with
the accompanying drawings in which:
[0011] FIG. 1 is a partially exploded perspective n view of the
present invention;
[0012] FIG. 2 is a partially assembled perspective n view of the
present invention;
[0013] FIG. 3 is a cross-sectional perspective view of the line 3-3
in FIG. 2;
[0014] FIG. 4 is a schematic plan view of the first embodiment of
the present invention;
[0015] FIG. 5 is a schematic plan view of the second embodiment of
the present invention;
[0016] FIG. 6 is a cross-sectional perspective view of the line 6-6
in FIG. 5; and
[0017] FIG. 7 is a schematic plan view of the third embodiment of
the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0018] In order to make the Examiner better understand the
characteristics and the technical contents of the present
invention, a detailed description relating to the present invention
will be made with reference to the accompanying drawings. However,
it should be understood that the drawings are illustrative but not
used to limit the scope of the present invention.
[0019] FIG. 1 is a partially exploded perspective n view of the
present invention. FIG. 2 is a partially assembled perspective n
view of the present invention. FIG. 3 is a cross-sectional
perspective view of the line 3-3 in FIG. 2. The present invention
provides a juxtaposing structure for the heated ends of a plurality
of heat pipes. After the heated ends 10 of a plurality of heat
pipes 1 are juxtaposed, the heated end 10 of each heat pipe 1
together forms a heated surface having a larger area, so that the
heated surface can adhere to the heat-generating electronic element
4 such as a central processing unit (CPU), as shown in FIG. 4. The
heated area of the heated surface formed by the heated end 10 of
each heat pipe 1 is substantially identical to the area of the
upper surface of the heat-generating electronic element 4 to be
adhered, thereby to completely cover and adhere thereto.
[0020] According to the above, each heat pipe 1 can be formed into
a straight pipe, a slightly curved pipe in the middle part (as
shown in FIG. 4), an upright U-lettered shape (as shown in FIG. 5)
or a side-lay U-lettered shape (as shown in FIG. 7). Further, each
heat pipe has a heated end 10 and at least one condensed end 11.
The heated end 10 is not necessarily to be either end of the heat
pipe but can be the middle part of the heat pipe 1. A
heat-conducting section 12 is connected between the heated end 10
and the condensed end 11 of each heat pipe 1, thereby to constitute
the heat pipe 1.
[0021] With reference to FIGS. 1 to 3, in the present invention,
the heated end 10 of each heat pipe 1 is slightly pressed flat, so
that the surface of the heated end 10 of each heat pipe 1 has an
upper and a lower planes 100 facing to each other and side curved
surfaces 101 between both sides of the two planes 100. The heated
ends 10 of those heat pipes 1 are juxtaposed and the side curved
surfaces 101 of any two adjacent heat pipes 1 adjoin and abut
against each other. A heat-conducting medium 2 is filled between
any two adjacent side curved surfaces 101. The heat-conducting
medium 2 can be solders such as tin for integrally binding heat
pipes 1 together. Further, a connecting surface 20 is formed on the
heat-conducting medium 2 to be flush with the adjacent planes 100
on both sides. With the combination of each lower plane 100 and the
adjacent connecting surfaces 20, a heated surface having a larger
area can be formed for thermally contacting with and adhering to
the heat-generating electronic element 4.
[0022] As show in FIG. 4, it is a schematic plan view of the first
embodiment of the present invention. In this embodiment, each heat
pipe 1 is formed into a straight pipe or the heat-conducting
section 12 is slightly curved. The condensed end 11 of each heat
pipe 1 commonly penetrates through a plurality of heat-dissipating
fins 3. According to the figure, it is apparent that each heat pipe
1 is juxtaposed and bound together by the heat-conducting medium 2,
and further each heat pipe 1 can directly adhere to the upper
surface of the heat-generating electronic element 4. With this
arrangement, each heat pipe 1 can directly conduct and dissipate
the heat generated by the heat-generating electronic element 4.
[0023] FIG. 5 is a schematic plan view of the second embodiment of
the present invention, and FIG. 6 is a cross-sectional perspective
view of the line 6-6 in FIG. 5. In this embodiment, each heat pipe
1 is formed into an upright U-lettered shape. The heated end 10 of
each heat pipe 1 is located at the bottom of the U-lettered shape,
and both ends of the U-lettered shape extending upwardly are used
as the condensed ends 11. Both condensed ends 11 also penetrate
through a plurality of heat-dissipating fins 3. According to the
present embodiment, the heated end 10 of the heat pipe 1 is not
necessary to be either end portion of the pipe. Depending on the
curved construction and different applications of the heat pipe 1,
the heated end 10 can be also located in the middle part of the
pipe. The present embodiment can also achieve the same object as
that in the first embodiment.
[0024] As show in FIG. 7, it is a schematic plan view of the third
embodiment of the present invention. In this embodiment, each heat
pipe 1 is formed into a side-lay U-lettered shape. The heated end
10 of each heat pipe 1 is located at one extending end of the
U-lettered shape, and the condensed end 11 is located at the other
extending end of the U-lettered shape. Similarly, the condensed end
11 penetrates through a plurality of heat-dissipating fins 3.
[0025] Therefore, with the above construction, the juxtaposing
structure for the heated ends of a plurality of heat pipes in
accordance with the present invention can be obtained.
[0026] According to the above, the present invention indeed
achieves the desired effects and overcomes the drawbacks of prior
art by employing the above structures. Therefore, the present
invention involves the novelty and inventive steps, and conforms to
the requirements for a utility model patent.
[0027] Although the present invention has been described with
reference to the foregoing preferred embodiments, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
be occurred to those skilled in this art in view of the teachings
of the present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
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