U.S. patent application number 11/539293 was filed with the patent office on 2007-11-01 for heat-dissipation structure.
This patent application is currently assigned to COOLER MASTER CO., LTD.. Invention is credited to Chun Po Chang, Ying Lin Hsu, Kun Feng Tu.
Application Number | 20070254584 11/539293 |
Document ID | / |
Family ID | 37429013 |
Filed Date | 2007-11-01 |
United States Patent
Application |
20070254584 |
Kind Code |
A1 |
Chang; Chun Po ; et
al. |
November 1, 2007 |
HEAT-DISSIPATION STRUCTURE
Abstract
A heat dissipation structure including a wind cover, a heat sink
and a wind-shielding plate is provided. The wind cover has an
outlet and a fan connection portion corresponding to the outlet and
having an inlet. In addition, the heat sink includes a base,
multiple fins disposed in the wind cover, and at least a heat pipe
passing through the fins and being fixed on the base. The
wind-shielding plate is connected to a lowest one of the fins for
leading an air flow to move around a heat source. Accordingly, the
waste heat near the heat source can be taken away.
Inventors: |
Chang; Chun Po; (Taipei
Hsien, TW) ; Hsu; Ying Lin; (Taipei Hsien, TW)
; Tu; Kun Feng; (Taipei Hsien, TW) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Assignee: |
COOLER MASTER CO., LTD.
Taipei Hsien
TW
|
Family ID: |
37429013 |
Appl. No.: |
11/539293 |
Filed: |
October 6, 2006 |
Current U.S.
Class: |
454/233 ;
257/E23.088; 257/E23.098; 257/E23.103 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 2924/00 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; H01L 23/3672 20130101; H01L 23/473 20130101 |
Class at
Publication: |
454/233 |
International
Class: |
F24F 1/00 20060101
F24F001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 14, 2005 |
TW |
94217787 |
Claims
1. A heat-dissipation structure, comprising: a wind cover, having
an outlet and a fan connection portion corresponding to the outlet,
the fan connection portion having an inlet; a heat sink, comprising
a base, a plurality of fins disposed in the wind cover, and at
least a heat pipe passing through said plurality of fins and being
fixed on the base; and a wind-shielding plate, connected to a
lowest one of said plurality of fins.
2. The heat-dissipation structure of claim 1, wherein at least one
vertical side plate with at least one ventilator is disposed at a
bottom of the wind cover.
3. The heat-dissipation structure of claim 1, wherein at least one
side plate is disposed at the bottom of the wind cover, the side
plate having a bent edge being in a tilting angle and having at
least one ventilator.
4. The heat-dissipation structure of claim 1, wherein the heat sink
further comprises a fixing plate connected to the heat pipe and the
base respectively.
5. The heat-dissipation structure of claim 4, wherein the fixing
plate is connected to the heat pipe and the base by welding.
6. The heat-dissipation structure of claim 1, wherein the
wind-shielding plate is connected to the lowest one of said
plurality of fins by welding.
7. The heat-dissipation structure of claim 1, wherein the
wind-shielding plate is a vertically bent portion of the lowest one
of said plurality of fins.
8. The heat-dissipation structure of claim 1, further comprising a
fan disposed on the fan connection portion.
9. A heat-dissipation structure, comprising: a wind cover, having
an outlet and a fan connection portion corresponding to the outlet
and having an inlet; a heat sink, comprising a base, a plurality of
fins disposed in the wind cover, and at least a heat pipe passing
through said plurality of fins and being fixed on the base; and a
wind-shielding plate, connected to both sides of the wind
cover.
10. The heat-dissipation structure of claim 9, wherein at least one
vertical side plate with at least one ventilator is disposed at a
bottom of the wind cover.
11. The heat-dissipation structure of claim 9, wherein at least one
side plate is disposed at the bottom of the wind cover, the side
plate having a bent edge being in a tilting angle and having at
least one ventilator.
12. The heat-dissipation structure of claim 9, wherein the heat
sink further comprises a fixing plate connected to the heat pipe
and the base respectively.
13. The heat-dissipation structure of claim 12, wherein the fixing
plate is connected to the heat pipe and the base by welding.
14. The heat-dissipation structure of claim 9, wherein the
wind-shielding plate is connected to both sides of the wind cover
by welding.
15. The heat-dissipation structure of claim 9, wherein the
wind-shielding plate and the wind cover are integrally formed.
16. The heat-dissipation structure of claim 9, further comprising a
fan disposed on the fan connection portion.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 94217787, filed on Oct. 14, 2005. All
disclosure of the Taiwan application is incorporated herein by
reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a heat-dissipation
structure, and more particularly to a heat-dissipation structure
capable of dissipating heat in various directions.
[0004] 2. Description of Related Art
[0005] In recent years, computer technology has been greatly and
fast improved. With the operation speed of the computer advancing
continuously, the power of electronic devices in the computer
constantly increases. In order to prevent overheating of the
electronic devices in the computer, which causes the temporary or
permanent malfunction of the electronic devices, it is important to
provide a sufficient heat-dissipation function to the electronic
devices in the computer. Being as an example, the temperature of a
central processing unit (CPU) may exceed a normal operation
temperature and cause the error of computation or the temporary
malfunction when being operated in high speed, which leads to the
crash of the computer. Further, when the temperature of the CPU
excessively oversteps the regular range, the transistors in the CPU
may be damaged, which leads to a permanent malfunction of the
CPU.
[0006] Referring to FIG. 1, it is a schematic view of a
conventional heat-dissipation structure. The conventional
heat-dissipation structure 100 comprises a wind cover 110, a fan
120 and a heat sink 130. The wind cover 1 1 0 has an outlet 112 and
an inlet 114 corresponding thereto. The fan 120 is fixed on the
wind cover 110 and is suitable for providing an air flow A flowing
from the inlet 114 to the outlet 112. In addition, the heat sink
130 includes multiple fins 132 and a base 134. The fins 132 are
disposed in the wind cover 110 and arranged in the same direction
on the base 134 for increasing the heat-dissipation area of the
heat sink 130.
[0007] However, the conventional heat-dissipation structure 100 is
used only for the heat-dissipation of CPU and fails to provide
extra heat-dissipation function for other electronic devices around
the CPU. Therefore, the phenomenon of overheating of the electronic
devices around the CPU can not be effectively diminished when the
computer is operating, which may lead to the malfunction of the
computer. According to the above description, the conventional
heat-dissipation structure 100 needs to be improved.
SUMMARY OF THE INVENTION
[0008] The present invention is directed to a heat-dissipation
structure for dissipating heat in various directions and improving
the heat-dissipation effect.
[0009] The present invention provides a heat-dissipation structure,
which comprises a wind cover, a heat sink, and a wind-shielding
plate. The wind cover has an outlet and a fan connection portion
corresponding to the outlet and having an inlet. In addition, the
heat sink includes a base, multiple fins disposed in the wind
cover, and at least a heat pipe passing through the fins and being
fixed on the base. Furthermore, the wind-shielding plate is
connected to a lowest one of the fins.
[0010] According to an embodiment of the present invention, at
least one vertical side plate with at least one ventilator is
disposed at the bottom of the wind cover.
[0011] According to an embodiment of the present invention, at
least one side plate is disposed at the bottom of the wind cover,
wherein the side plate has a bent edge being in a tilting angle and
having at least one ventilator.
[0012] According to an embodiment of the present invention, the
heat sink further comprises a fixing plate connected to the heat
pipe and the base respectively. The fixing plate may be connected
to the heat pipe and the base by welding.
[0013] According to an embodiment of the present invention, the
wind-shielding plate may be connected to the lowest one of the fins
by welding or be a vertically bent portion of the lowest one of the
fins.
[0014] According to an embodiment of the present invention, the
heat-dissipation structure further comprises a fan disposed on the
fan connection portion.
[0015] The present invention provides a heat-dissipation structure,
which comprises a wind cover, a heat sink, and a wind-shielding
plate. The wind cover has an outlet and a fan connection portion
corresponding to the outlet and having an inlet. In addition, the
heat sink includes a base, multiple fins disposed in the wind
cover, and at least a heat pipe passing through the fins and being
fixed on the base. The wind-shielding plate is connected to both
sides of the wind cover. According to an embodiment of the present
invention, at least one vertical side plate with at least one
ventilator is disposed at the bottom of the wind cover.
[0016] According to an embodiment of the present invention, at
least one side plate is disposed at the bottom of the wind cover,
wherein the side plate has a bent edge being in a tilting angle and
having at least one ventilator.
[0017] According to an embodiment of the present invention, the
heat sink further comprises a fixing plate connected to the heat
pipe and the base respectively. The fixing plate may be connected
to the heat pipe and the base by welding.
[0018] According to an embodiment of the present invention, the
wind-shielding plate is connected to both sides of the wind cover
or is integrally formed with the wind cover.
[0019] According to an embodiment of the present invention, the
heat-dissipation structure further comprises a fan disposed on the
fan connection portion.
[0020] In view of the above, the wind-shielding plate of the
present invention leads part of a first air flow to the ventilator
to form a second air flow, so as to transmit the heat generated by
the electronic devices around the CPU to the surroundings by the
convection of the second air flow. Accordingly, the
heat-dissipation structure of the present invention has the
advantages of multi-directional heat dissipation and superior
heat-dissipation effect.
[0021] Reference will now be made in detail to the present
preferred embodiments of the invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is a schematic view of a conventional
heat-dissipation structure.
[0023] FIG. 2 is an exploded view of a heat-dissipation structure
according to an embodiment of the present invention.
[0024] FIG. 3 is a three-dimensional assembly view of the
heat-dissipation structure in FIG. 2.
[0025] FIG. 4 is a front assembly view of the heat-dissipation
structure in FIG. 2.
[0026] FIG. 5 is a three-dimensional assembly view of a
heat-dissipation structure according to another embodiment of the
present invention.
[0027] FIG. 6 is a three-dimensional view of a wind cover according
to further another embodiment of the present invention.
DESCRIPTION OF EMBODIMENTS
[0028] Referring to FIG. 2 to FIG. 4, the heat-dissipation
structure 200 is suitable for being disposed on a heat source F,
such as a central processing unit (CPU). The heat-dissipation
structure 200 comprises a wind cover 210, a fan 220 and a heat sink
240.
[0029] The wind cover 210 is in a U-like shape and has two opposite
openings, wherein one of the openings is taken as an outlet 212,
and the edge of the wind cover 210 at the other opening extends to
form a rectangular fan connection portion C. An inlet 214 with
large area is formed at and passes through the center of the fan
connection portion C. Side plates 218 are disposed in vertical to
the bottom of the wind cover 210. Each side plate 218 has at least
one ventilator 216 (FIG. 2 shows eight ventilators 216).
[0030] The fan 220 may be fixed onto the fan connection portion C
by screws to provide cooling air flow.
[0031] The heat sink 240 comprises a fixing plate 248, a base 244,
multiple fins 242 stacked in sequence, and at least one heat pipe
246 (here shows plural heat pipes 246). The base 244 contacts the
heat source F. The fins 242 are disposed in the wind cover 210. The
heat pipes 246 pass through the fins 242 in parallel, and are fixed
on the base 244 between the fins 242 and the heat source F by, for
example, welding. In addition, the attachment of the heat pipes 246
can be enhanced by disposing the fixing plate 248 above the curved
portion of the heat pipes 246 and attaching the fixing plate 248 to
the heat pipes 246 and the base 244 by welding. The base 244 has a
contact surface 244a suitable for contacting with the heat source
F. The lowest fin 242a stretches out vertically to form a
wind-shielding plate 230. In other case, the lowest fin 242a may be
connected to the wind-shielding plate 230 by other manners, such as
welding.
[0032] The heat pipes 246 may take in U-shape, cylindrical shape,
and so on.
[0033] The operating process of the heat-dissipation structure of
the embodiment is illustrated in the following. Referring to FIG.
3, as to the direction of air flow, the fan 220 provides a first
air flow A1 flowing from the inlet 214 to the outlet 212. In
addition, part of the first air flow A1 is blocked by the
wind-shielding plate 230 and led to the ventilators 216 to form a
second air flow A2, wherein the first air flow A1 is substantially
perpendicular to the second air flow A2.
[0034] As to the heat-dissipation function, the contact surface
244a of the base 244 transmits the heat generated by the heat
source F to the heat pipes 246 through conduction. Portions of the
heat pipes 246 near the base 244 are filled with liquid substance,
such as water or other volatile matters with high specific heat.
After absorbing the heat, the liquid substance is transformed into
gaseous state and then rises in the heat pipes 246 so as to
transmit the heat to the surrounding fins 242. In the meantime, the
fan 220 provides the first air flow A1 and by the first air flow A1
the heat absorbed by the heat pipes 246 and fins 242 is transmitted
to the outlet 212.
[0035] In addition, part of the first air flow A1 is led to the
ventilators 216 by the wind-shielding plate 230 and forms the air
flow A2. The heat generated by the electronic devices (not shown)
around the heat source F can be transmitted to the surroundings by
the convection of the second air flow A2. Therefore, the
heat-dissipation structure 200 can achieve the heat dissipation in
various directions.
[0036] Referring FIG. 5, it is a three-dimensional assembly view of
a heat-dissipation structure according to another embodiment of the
present invention. The main different between the present
embodiment and the former is that the wind-shielding plate 330 of
the present embodiment is not extended from the fins 242a. Instead,
the wind-shielding plate 330 is extended from the wind cover 210 or
fixed onto the wind cover 210 by screws. The function of the
wind-shielding plate 330 is, as mentioned in the above, to lead
part of the air flow to the ventilators 216. The illustration of
other relative components will not be described in detail
hereinafter.
[0037] Referring to FIG. 6, it is a schematic view of a wind cover
according to further another embodiment of the present invention.
Each side plate 219 has a bent edge 219a near the wind cover 210
and the ventilators 216 are located thereon. Since the bent edge
219a is configured to have a tilt included angle .theta., thus the
second air flow A2 passing through the ventilators is led towards
the electronic devices (not shown) around the heat source F.
[0038] In summary, the wind-shielding plate of the heat-dissipation
structure of the present invention leads part of the first air flow
to the ventilators to form the second air flow, so as to transmit
heat generated by electronic devices around the CPU to the
surroundings by the convection of the second air flow. Thus, the
temperature of the electronic devices around the heat source can be
control in a normal range to prevent the failure of the electronic
devices. Accordingly, the heat-dissipation structure of the present
invention has the advantages of multi-directional heat dissipation
and superior heat-dissipation effect.
[0039] The above description provides a full and complete
description of the preferred embodiments of the present invention.
Various modifications, alternate construction, and equivalent may
be made by those skilled in the art without changing the scope or
spirit of the invention. Accordingly, the above description and
illustrations should not be construed as limiting the scope of the
invention which is defined by the following claims.
* * * * *