U.S. patent application number 11/631686 was filed with the patent office on 2007-10-25 for heat conveyance system.
Invention is credited to Tadafumi Nishimura, Takahiro Yamaguchi.
Application Number | 20070246555 11/631686 |
Document ID | / |
Family ID | 35783858 |
Filed Date | 2007-10-25 |
United States Patent
Application |
20070246555 |
Kind Code |
A1 |
Nishimura; Tadafumi ; et
al. |
October 25, 2007 |
Heat Conveyance System
Abstract
A heating medium circuit (90) is provided with a plurality of
circulation pipelines (40, 49) along each of which a heat source
side appliance (11), a utilization side appliance (13, 45), and a
pump (41, 42) are arranged to be capable of operation to cause a
heating medium to circulate between the heat source side appliance
(11) and the utilization side appliance (13, 45). A high
temperature side communication pipe (91) establishes fluid
communication between a part between the outflow side of the heat
source side appliance (11) and the inflow side of the utilization
side appliance (13, 45) in the circulation pipeline (40) and a part
between the outflow side of the heat source side appliance (11) and
the inflow side of the utilization side appliance (13, 45) in the
circulation pipeline (49). In addition, a low temperature side
communication pipe (92) establishes fluid communication between a
part between the outflow side of the utilization side appliance
(13, 45) and the inflow side of the heat source side appliance (11)
in the circulation pipeline (40) and a part between the outflow
side of the utilization side appliance (13, 45) and the inflow side
of the heat source side appliance (11) in the circulation pipeline
(49).
Inventors: |
Nishimura; Tadafumi; (Osaka,
JP) ; Yamaguchi; Takahiro; (Osaka, JP) |
Correspondence
Address: |
BIRCH STEWART KOLASCH & BIRCH
PO BOX 747
FALLS CHURCH
VA
22040-0747
US
|
Family ID: |
35783858 |
Appl. No.: |
11/631686 |
Filed: |
July 8, 2005 |
PCT Filed: |
July 8, 2005 |
PCT NO: |
PCT/JP05/12648 |
371 Date: |
January 5, 2007 |
Current U.S.
Class: |
237/2B |
Current CPC
Class: |
F24D 2200/123 20130101;
F25B 2400/06 20130101; F24D 2200/32 20130101; F24D 11/0214
20130101; F25B 29/003 20130101; Y02B 30/00 20130101; Y02B 30/14
20130101; F24D 2220/08 20130101; F24D 12/02 20130101; F25B 2339/047
20130101; F24D 3/12 20130101; Y02B 30/24 20130101; F24D 3/08
20130101; F25B 25/005 20130101; F24D 17/02 20130101 |
Class at
Publication: |
237/002.00B |
International
Class: |
F25B 29/00 20060101
F25B029/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 9, 2004 |
JP |
2004-203169 |
Claims
1. A heat conveyance system comprising a heating medium circuit
(90) through which a heating medium flows and configured to convey
heat to a utilization side appliance (13, 45) from a heat source
side appliance (11) by the heating medium in the heating medium
circuit (90), the heating medium circuit (90) comprising: (a) a
plurality of circulation pipelines (40, 49) along each of which a
heat source side appliance (11), a utilization side appliance (13,
45), and a pump (41, 42) are provided and each capable of operation
to cause the heating medium to circulate between the heat source
side appliance (11) and the utilization side appliance (13, 45);
(b) a high temperature side communication pipe (91) for
establishing fluid communication between parts between the outflow
sides of the heat source side appliances (11) and the inflow sides
of the utilization side appliances (13, 45) in the plurality of
circulation pipelines (40, 49); and (c) a low temperature side
communication pipe (92) for establishing fluid communication
between parts between the outflow sides of the utilization side
appliances (13, 45) and the inflow sides of the heat source side
appliances (11) in the plurality of circulation pipelines (40,
49).
2. The heat conveyance system of claim 1 wherein: (i) the pump (41,
42) of the circulation pipeline (40, 49) is disposed between the
junction of the circulation pipeline (40, 49) with the high
temperature side communication pipe (91) and the inflow side of the
utilization side appliance (13, 45); and (ii) a valve (43) is
disposed between the junction of the circulation pipeline (40, 49)
with the high temperature side communication pipe (91) and the
outflow side of the heat source side appliance (11).
3. The heat conveyance system of claim 1 wherein the high
temperature side communication pipe (91) and the low temperature
side communication pipe (92) are provided with a tank (97) and a
tank (98), respectively.
4. The heat conveyance system of claim 1 wherein at least either
the high temperature side communication pipe (91) or the low
temperature side communication pipe (92) is formed in a loop shape
and includes a circulation pump (93, 94) for circulating the
heating medium.
5. The heat conveyance system of claim 1 wherein: (i) the high
temperature side communication pipe (91) and the low temperature
side communication pipe (92) are directly connected together by a
bypass pipe (96) including a bypass pump (95) for forcing the
heating medium in the high temperature side communication pipe (91)
to flow into the low temperature side communication pipe (92); and
(ii) the bypass pipe (96) is openable and closable.
6. The heat conveyance system of claim 1 wherein: (i) the heating
medium circuit (90) is provided in plural number; and (ii) the high
temperature side communication pipes (91) of the plural heating
medium circuits (90) are connected to each other and the low
temperature side communication pipes (92) of the plural heating
medium circuits (90) are connected to each other.
7. The heat conveyance system of claim 4 wherein: (i) the heating
medium circuit (90) is provided in plural number; (ii) in each of
the plural heating medium circuits (90) both the high temperature
side communication pipe (91) and the low temperature side
communication pipe (92) are formed in a loop shape; and (iii) the
high temperature side communication pipes (91) of the plural
heating medium circuits (90) are connected to each other to form a
single loop-shaped pipeline (191) and the low temperature side
communication pipes (92) of the plural heating medium circuits (90)
are connected to each other to form a single loop-shaped pipeline
(192).
8. The heat conveyance system of claim 7 wherein (a) the high
temperature side communication pipes (91) of the plural heating
medium circuits (90) are connected to each other by a switch
mechanism (101) which enables switching between a first
distribution mode in which the heating medium is allowed to flow
only within each of the high temperature side communication pipes
(91) and a second distribution mode in which the heating medium is
shared by establishing fluid communication with the high
temperature side communication pipe (91) of the other heating
medium circuit (90) and (b) the low temperature side communication
pipes (92) of the plural heating medium circuits (90) are connected
to each other by a switch mechanism (102) which enables switching
between a first distribution mode in which the heating medium is
allowed to flow only within each of the low temperature side
communication pipes (92) and a second distribution mode in which
the heating medium is shared by establishing fluid communication
with the low temperature side communication pipe (92) of the other
heating medium circuit (90).
Description
TECHNICAL FIELD
[0001] The present invention relates to a heat conveyance system
including a heating medium circuit through which a heating medium
flows and configured to convey heat to an appliance on the
utilization side from a device on the heat source side by the
heating medium flowing through the heating medium circuit.
BACKGROUND ART
[0002] Various types of heat conveyance systems, such as
refrigeration apparatuses and air conditioning apparatuses, are
known in the conventional technology. There is a so-called "pair
unit type" heat conveyance system having, as a pair unit, a heat
source side appliance and a utilization side appliance. In
addition, there is a so-called "multi unit type" heat conveyance
system having a plurality of utilization side appliances for a
single heat source side appliance. Such heat conveyance systems
employ, for example, a refrigerant circuit configured to perform a
vapor compression refrigeration cycle.
[0003] The pair unit type is generally installed in the home or in
small stores. In the pair unit type, a single utilization side
appliance effects heating and cooling by a single heat source side
appliance. On the other hand, the multi unit type includes a
plurality of utilization side appliances sharing a single heat
source side appliance, and these utilization side appliances are
installed in different locations in the building (see, for example,
the following patent documents I and II). In the multi unit type,
the single heat source side appliance enables the plural
utilization side appliances to effect heating and cooling. [0004]
Patent Document I: JP H8-121902A [0005] Patent Document II: JP
H7-217933A
DISCLOSURE OF THE INVENTION
Problems that the Invention Intends to Solve
[0006] However, a conventional heat conveyance system of the pair
unit type is, even when there is another heat conveyance system in
the vicinity, operated independently of the neighbor heat
conveyance system. In other words, the problem with the pair unit
type heat conveyance system is that it is impossible to unify
different heat conveyance systems even when a plurality of
consumers exist adjacently to each other, and the total operating
efficient cannot be improved.
[0007] In addition, for the case of the conventional multi unit
type heat conveyance system, it is necessary to install a heat
source side appliance having a large capacity corresponding to the
total output of all utilization side appliances connected to the
heat source unit. Furthermore, thermal energy is distributed from
the single heat source side appliance to the plural utilization
side appliances, which means that in the event of the failure of
the heat source side appliance this produces the problem that all
the utilization side appliances become unable to use heat.
[0008] With the above in mind, the present invention was made.
Accordingly, an object of the present invention is to provide an
improved heat conveyance system having a plurality of heat source
side appliances with a view to utilizing the ability of each of the
heat source side appliances to the maximum extent possible.
Means for Solving the Problems
[0009] In order to achieve the above object, pipelines (40, 49)
capable of operation to cause a heating medium to circulate between
a heat source side appliance (11) and a utilization side unit (13,
45) are arranged in parallel in the present invention.
[0010] More specifically, the present invention provides, as a
first aspect, a heat conveyance system comprising a heating medium
circuit (90) through which a heating medium flows and configured to
convey heat to a utilization side appliance (13, 45) from a heat
source side appliance (11) by the heating medium in the heating
medium circuit (90).
[0011] The heating medium circuit (90) comprises: (a) a plurality
of circulation pipelines (40, 49) along each of which a heat source
side appliance (11), a utilization side appliance (13, 45), and a
pump (41, 42) are provided and each capable of operation to cause
the heating medium to circulate between the heat source side
appliance (11) and the utilization side appliance (13, 45); (b) a
high temperature side communication pipe (91) for establishing
fluid communication between parts between the outflow sides of the
heat source side appliances (11) and the inflow sides of the
utilization side appliances (13, 45) in the plurality of
circulation pipelines (40, 49); and (c) a low temperature side
communication pipe (92) for establishing fluid communication
between parts between the outflow sides of the utilization side
appliances (13, 45) and the inflow sides of the heat source side
appliances (11) in the plurality of circulation pipelines (40,
49).
[0012] According to the above configuration, when the utilization
side appliance (13, 45) of any one of the circulation pipelines
(40, 49) is placed in operation, the heating medium circulates only
through the one of the circulation pipelines (40, 49) under normal
conditions. In other words, the pump (41, 42) of the one of the
circulation pipelines (40, 49) is activated, whereby the heating
medium heated up to high temperature by the heat source side
appliance (11) is supplied to the utilization side appliance (13,
45). After its thermal energy is consumed in the utilization side
appliance (13, 45), the heating medium, which is now at low
temperature, again flows into the inflow side of the heat source
side appliance (11).
[0013] If only the operation of the heat source side appliance (11)
in the one of the circulation pipelines (40, 49) results in a
deficiency in thermal energy, the heat source side appliance (11)
of the other of the circulation pipelines (40, 49) provides a
supply of thermal energy. That is to say, when the pump (41, 42) is
activated in the one of the circulation pipelines (40, 49) that
includes the utilization side appliance (13, 45) in operation, the
heat source side appliance (11) of the other of the circulation
pipelines (40, 49) is also activated, whereby the heating medium
flows into the inflow side of that heat source side appliance (11)
from the low temperature side communication pipe (92) and the
heating medium heated is supplied to the high temperature side
communication pipe (91). In the one of the circulation pipelines
(40, 49) whose utilization side appliance (13, 45) is being in
operation, the heating medium in the high temperature side
communication pipe (91) flows into the inflow side of the
utilization side appliance (13, 45) in addition to the heating
medium heated up to high temperature by the heat source side
appliance (11) of the one of the circulation pipelines (40, 49).
Then, after the thermal energy of the heating medium is consumed in
the utilization side appliance (13, 45), part of the heating
medium, which is now at low temperature, is discharged to the low
temperature side communication pipe (92).
[0014] In the way as described above, the heat source side
appliance (11) of the other of the circulation pipelines (40, 49)
that provides a supply of thermal energy is constantly able to heat
the heating medium at low temperature from the low temperature side
communication pipe (92) and then convey it to the high temperature
side communication pipe (91), whereby the difference in temperature
between the heating medium before heating and the heating medium
after heating is secured.
[0015] The present invention provides, as a second aspect, a heat
conveyance system which is configured such that (i) the pump (41,
42) of the circulation pipeline (40, 49) is disposed between the
junction of the circulation pipeline (40, 49) with the high
temperature side communication pipe (91) and the inflow side of the
utilization side appliance (13, 45); and (ii) a valve (43) is
disposed between the junction of the circulation pipeline (40, 49)
with the high temperature side communication pipe (91) and the
outflow side of the heat source side appliance (11).
[0016] According to the above configuration, when the pump (41, 42)
of the circulation pipeline (40, 49) is activated, the heating
medium in the high temperature side communication pipe (91) is,
together with the heating medium heated in the heat source side
appliance (11) of the circulation pipeline (40, 49), drawn into the
pump (41, 42) and then discharged to the inflow side of the
utilization side appliance (13, 45) where their thermal energy is
consumed. On the other hand, when the pump (41, 42) is stopped in
one of the circulation pipelines (40, 49), the valve (43) is closed
so that the heating medium will not flow back towards the high
temperature side communication pipe (91) from the low temperature
side communication pipe (92) via the heat source side appliance
(11) brought to a stop, even when the pump (41, 42) of the other of
the circulation pipelines (40, 49) is activated.
[0017] The present invention provides, as a third aspect, a heat
conveyance system which is configured such that the high
temperature side communication pipe (91) and the low temperature
side communication pipe (92) are provided with a tank (97) and a
tank (98), respectively.
[0018] According to the above configuration, the heating medium
heated in the heat source side appliance (11) of each circulation
pipeline (40, 49) is stored in the tank (97) of the high
temperature side communication pipe (91) while on the other hand
the heating medium whose thermal energy has been consumed in the
utilization side appliance (13, 45) of each circulation pipeline
(40, 49) is stored in the tank (98) of the low temperature side
communication pipe (92). When the utilization side appliance (13,
45) is operated therefore resulting in a deficiency in thermal
energy, the high temperature heating medium stored in the tank (97)
of the high temperature side communication pipe (91) flows into the
inflow side of the utilization side appliance (13, 45) thereof
while simultaneously the low temperature heating medium stored in
the tank (98) of the low temperature side communication pipe (92)
flows into the inflow side of the heat source side appliance
(11).
[0019] The present invention provides, as a fourth aspect, a heat
conveyance system which is configured such that at least either the
high temperature side communication pipe (91) or the low
temperature side communication pipe (92) is formed in a loop shape
and includes a circulation pump (93, 94) for circulating the
heating medium.
[0020] According to the above configuration, the heating medium in
the high temperature side communication pipe (91) is circulated by
the circulation pump (93), whereby the temperature thereof is
maintained uniformly throughout the high temperature side
communication pipe (91). And, when the utilization side appliance
(13, 45) of each circulation pipeline (40, 49) is placed in
operation, the high temperature heating medium accumulated in the
high temperature side communication pipe (91) is supplied to the
inflow side of the utilization side appliance (13, 45).
[0021] Likewise, in the case where the low temperature side
communication pipe (92) is also formed in a loop shape, the heating
medium in the low temperature side communication pipe (92) is
circulated by the circulation pump (94), whereby the temperature
thereof is maintained uniformly throughout the low temperature side
communication pipe (92). When the utilization side appliance (13,
45) of each circulation pipeline (40, 49) is placed in operation,
the low temperature heating medium accumulated in the low
temperature side communication pipe (92) flows into the inflow side
of the heat source side appliance (11).
[0022] The present invention provides, as a fifth aspect, a heat
conveyance system which is configured such that (i) the high
temperature side communication pipe (91) and the low temperature
side communication pipe (92) are directly connected together by a
bypass pipe (96) including a bypass pump (95) for forcing the
heating medium in the high temperature side communication pipe (91)
to flow into the low temperature side communication pipe (92); and
(ii) the bypass pipe (96) is openable and closable.
[0023] In the case where each utilization side appliance (13, 45)
has been left unused for long periods, the temperature of the
heating medium in the high temperature side communication pipe (91)
will fall. In such a case, in order to maintain the heating medium
in the high temperature side communication pipe (91) at high
temperature, either the heat source side appliance (11) of the
circulation pipeline (40) or the heat source side appliance (11) of
the circulation pipeline (49) is activated to thereby provide a
supply of thermal energy. In this case, according to the
configuration of the fifth aspect, by driving the bypass pump (95)
of the bypass pipe (96), the low temperature heating medium in the
high temperature side communication pipe (91) is discharged
directly through the bypass pipe (96) to the low temperature side
communication pipe (92) without flowing through any circulation
pipeline, and the heating medium heated in the heat source side
appliance (11) is supplied into the high temperature side
communication pipe (91).
[0024] The present invention provides, as a sixth aspect, a heat
conveyance system which is configured such that (i) the heating
medium circuit (90) is provided in plural number; and (ii) the high
temperature side communication pipes (91) of the plural heating
medium circuits (90) are connected to each other and the low
temperature side communication pipes (92) of the plural heating
medium circuits (90) are connected to each other.
[0025] According to the above configuration, the plural heating
medium circuits (90) are connected in parallel with each other,
thereby allowing the heating medium to intercommunicate between the
high temperature side communication pipes (91) of the heating
medium circuits (90) and allowing the heating medium to
intercommunicate between the low temperature side communication
pipes (92) of the heating medium circuits (90). Therefore, the
heating medium is shared between the plural heating medium circuits
(90).
[0026] The present invention provides, as a seventh aspect, a heat
conveyance system which is configured such that (i) the heating
medium circuit (90) is provided in plural number; (ii) in each of
the plural heating medium circuits (90) both the high temperature
side communication pipe (91) and the low temperature side
communication pipe (92) are formed in a loop shape; and (iii) the
high temperature side communication pipes (91) of the plural
heating medium circuits (90) are connected to each other to form a
single loop-shaped pipeline (191) and the low temperature side
communication pipes (92) of the plural heating medium circuits (90)
are connected to each other to form a single loop-shaped pipeline
(192).
[0027] According to the above configuration, in the high
temperature side loop-shaped pipeline (191) and the low temperature
side loop-shaped pipeline (192), their respective heating mediums
are circulated and shared between the heating medium circuits
(90).
[0028] The present invention provides, as an eighth aspect, a heat
conveyance system which is configured such that (a) the high
temperature side communication pipes (91) of the plural heating
medium circuits (90) are connected to each other by a switch
mechanism (101) which enables switching between a first
distribution mode in which the heating medium is allowed to flow
only within each of the high temperature side communication pipes
(91) and a second distribution mode in which the heating medium is
shared by establishing fluid communication with the high
temperature side communication pipe (91) of the other heating
medium circuit (90) and (b) the low temperature side communication
pipes (92) of the plural heating medium circuits (90) are connected
to each other by a switch mechanism (102) which enables switching
between a first distribution mode in which the heating medium is
allowed to flow only within each of the low temperature side
communication pipes (92) and a second distribution mode in which
the heating medium is shared by establishing fluid communication
with the low temperature side communication pipe (92) of the other
heating medium circuit (90).
[0029] According to the above configuration, when the switch
mechanism (101) enters the first distribution mode, the high
temperature side communication pipe (91) of each heating medium
circuit (90) utilizes only the heating medium therein, while on the
other hand when the switch mechanism (101) enters the second
distribution mode the high temperature side communication pipe (91)
of each heating medium circuit (90) is allowed to share the heating
medium in the high temperature side communication pipe (91) of the
other heating medium circuit (90). Likewise, when the switch
mechanism (102) enters the first distribution mode, the low
temperature side communication pipe (92) of each heating medium
circuit (90) utilizes only the heating medium therein, while on the
other hand when the switch mechanism (102) enters the second
distribution mode the low temperature side communication pipe (92)
of each heating medium circuit (90) is allowed to share the heating
medium in the low temperature side communication pipe (92) of the
other heating medium circuit (90). In the way as described above,
each heating medium circuit (90) is switchable between the first
mode in which the heating medium is transferred only therewithin
and the second mode in which the heating medium in the other
heating medium circuit (90) is also utilized.
ADVANTAGEOUS EFFECTS OF THE INVENTION
[0030] As described above, in the first aspect of the present
invention, the heating medium circuit (90) is provided with the
plural circulation pipelines (40, 49) capable of operation to cause
the heating medium to circulate between the heat source side
appliance (11) and the utilization side appliance (13, 45); the
part between the outflow side of the heat source side appliance
(11) and the inflow side of the utilization side appliance (13, 45)
in the circulation pipeline (40) and the part between the outflow
side of the heat source side appliance (11) and the inflow side of
the utilization side appliance (13, 45) in the circulation pipeline
(49) are connected together by the high temperature side
communication pipe (91); and the part between the outflow side of
the utilization side appliance (13, 45) and the inflow side of the
heat source side appliance (11) in the circulation pipeline (40)
and the part between the outflow side of the utilization side
appliance (13, 45) and the inflow side of the heat source side
appliance (11) in the circulation pipeline (49) are connected
together by the low temperature side communication pipe (92).
Therefore, if one of the circulation pipelines (40, 49) becomes
deficient in thermal energy, the low temperature heating medium
flowing in from the low temperature side communication pipe (92) is
heated in the heat source side appliance (11) of the other of the
circulation pipelines (40, 49) and then conveyed to the high
temperature side communication pipe (91) to fill up a deficiency in
thermal energy in the one of the circulation pipelines (40, 49).
This makes it possible to fully utilize the ability of the heat
source side appliance (11) of each circulation pipeline (40,
49).
[0031] According to the second aspect of the present invention,
during driving of the pump (41, 41) in the circulation pipeline
(40, 49), the heating medium in the high temperature side
communication pipe (91) flows, together with the heating medium
heated in the heat source side appliance (11) of the circulation
pipeline (40, 49), into the inflow side of the utilization side
appliance (13, 45), while at the time when the pump (41, 41) in the
circulation pipeline (40, 49) is stopped the valve (43) is closed
so that the heating medium is prevented from flowing back towards
the high temperature side communication pipe (91) from the low
temperature side communication pipe (92). Consequently, the high
temperature heating medium in the high temperature side
communication pipe (91) will not flow out towards the low
temperature side communication pipe (92), thereby making it
possible to provide a high efficiency heat conveyance system.
[0032] According to the third aspect of the present invention, the
tank (97) of the high temperature side communication pipe (91)
stores heating medium at high temperature while the tank (98) of
the low temperature side communication pipe (92) stores heating
medium at low temperature. Consequently, the high temperature
heating medium stored in the tank (97) of the high temperature side
communication pipe (91) can be stably supplied to the inflow side
of the utilization side appliance (13, 45) and, in addition, the
low temperature heating medium stored in the tank (98) of the low
temperature side communication pipe (92) can be stably supplied to
the inflow side of the heat source side appliance (11).
[0033] In the fourth aspect of the present invention, at least
either the high temperature side communication pipe (91) or the low
temperature side communication pipe (92) is formed in a loop shape
and the heating medium is circulated by means of the circulation
pump (93, 94). Consequently, the heating medium whose temperature
is maintained uniformly throughout the loop-shaped pipe is supplied
to each circulation pipeline (40, 49), thereby making it possible
to provide a still higher efficiency heat conveyance system.
[0034] In the fifth aspect of the present invention, the high
temperature side communication pipe (91) and the low temperature
side communication pipe (92) are directly connected together by the
bypass pipe (96) and the heating medium in the high temperature
side communication pipe (91) is made to flow into the low
temperature side communication pipe (92) by the bypass pump (95)
where appropriate. Consequently, the heating medium having fallen
to a low temperature in the high temperature side communication
(91) can be discharged to the low temperature side communication
pipe (92) and the heating medium heated in the heat source side
appliance (11) can be made to flow into the high temperature side
communication pipe (91), thereby making it possible to efficiently
provide a supply of thermal energy to the high temperature side
communication pipe (91).
[0035] In the sixth aspect of the present invention, the plural
heating medium circuits (90) are connected to each other by their
high temperature side communication pipes (91) as well as by their
low temperature side communication pipes (92). Consequently, the
heating medium can be shared among the plural heating medium
circuits (90), thereby making it possible to fully utilize the
ability of the heat source side appliance (11) in each heating
medium circuit (90).
[0036] In the seventh aspect of the present invention, the high
temperature side communication pipes (91) of the plural heating
medium circuits (90) are connected together to form the single
loop-shaped pipeline (191) and the low temperature side
communication pipes (92) of the plural heating medium circuits (90)
are connected together to form the single loop-shaped pipeline
(192). Consequently, the heating medium circulating in each
loop-shaped pipeline (191, 192) can be shared between the heating
medium circuits (90), thereby making it possible to fully utilize
the ability of the heat source side appliance (11) in each heating
medium circuit (90).
[0037] In the eighth aspect of the present invention, the high
temperature side communication pipes (91) of the heating medium
circuits (90) are connected to each other by the switch mechanism
(101) and the low temperature side communication pipes (92) of the
heating medium circuits (90) are connected to each other by the
switch mechanism (102). Consequently, each heating medium circuit
(90) becomes switchable between a narrow-region conveyance mode in
which the heating medium is conveyed only therewithin and a
wide-region conveyance mode in which the heating medium in the
other heating medium circuit (90) is also utilized. This therefore
makes it possible to further fully utilize the ability of the heat
source side appliance (11) in each heating medium circuit (90).
BRIEF DESCRIPTION OF THE DRAWINGS
[0038] FIG. 1 is a piping schematic diagram of a heat conveyance
system according to a first embodiment of the present
invention;
[0039] FIG. 2 is a piping schematic diagram of a heat conveyance
system according to a second variation of the first embodiment;
[0040] FIG. 3 is a piping schematic diagram of a heat conveyance
system according to a third variation of the first embodiment;
[0041] FIG. 4 is a piping schematic diagram of a heat conveyance
system according to a second embodiment of the present invention;
and
[0042] FIG. 5 is a piping schematic diagram of a heat conveyance
system according to a variation of the second embodiment.
REFERENCE NUMERALS IN THE DRAWINGS
[0043] 10: heat conveyance system [0044] 11: heat source unit (heat
source side appliance) [0045] 13: high temperature hot water supply
unit (utilization side appliance) [0046] 40: first circulation
pipeline [0047] 41: floor heating side pump [0048] 42: hot water
supply side pump [0049] 43: flow rate control valve (valve) [0050]
45: floor heating radiator (utilization side appliance) [0051] 49:
second circulation pipeline [0052] 90: heating medium circuit
[0053] 91: high temperature side communication pipe [0054] 92: low
temperature side communication pipe [0055] 93, 94: circulation pump
[0056] 95: bypass pump [0057] 96: bypass pipe [0058] 97, 98: tank
[0059] 101, 102: switch mechanism [0060] 191, 192: loop-shaped
pipeline
BEST EMBODIMENT MODE FOR CARRYING OUT THE INVENTION
[0061] Hereinafter, preferred embodiments of the present invention
are described with reference to the drawings. It should be noted,
however, that the following embodiments are essentially preferable
examples which are not meant to limit the present invention, its
application, or its range of application.
First Embodiment
[0062] Referring to FIG. 1, there is shown a heat conveyance system
(10) according to a first embodiment of the present invention. The
heat conveyance system (10) of the first embodiment is for sharing
of a heat source between a plurality of dwelling units (14, 15) in
a multiple unit complex (16) (for the sake of simplicity of
description, two dwelling units in the first embodiment), and
includes a heating medium circuit (90) through which a heating
medium (heat transfer water) flows. This heating medium circuit
(90) is provided with a first circulation pipeline (40) and a
second circulation pipeline (49).
[0063] The first circulation pipeline (40) is arranged in the first
dwelling unit (14) and extended through a heat source unit (11) as
a heat source side appliance, a high temperature hot water supply
unit (13) as a utilization side appliance, and a floor heating
radiator (45) as a utilization side appliance. The first
circulation pipeline (40) includes a first heat exchanger (30), two
pumps (41, 42) respectively for the high temperature hot water
supply unit (13) and the floor heating radiator (45), a flow rate
control valve (43), and a second heat exchanger (50). The first
circulation pipeline (40) is configured such that it is capable of
operation to cause heat transfer water to circulate between the
heat source unit (11), the high temperature hot water supply unit
(13), and the floor heating radiator (45).
[0064] The heat source unit (11) has a first refrigerant circuit
(20). The first refrigerant circuit (20) includes a first
compressor (21), a first outdoor heat exchanger (23), a first
expansion valve (22), and a first heat exchanger (30). The first
refrigerant circuit (20) is charged with a first refrigerant. As
the first refrigerant, hydrocarbon (HC) refrigerants such as
methane, propane et cetera may be used in addition to the so-called
fluorocarbon refrigerant including R407C, R410A et cetera. The
outdoor heat exchanger (23) is a fin and tube heat exchanger of the
cross fin type. The outdoor heat exchanger (23) causes the first
refrigerant to exchange heat with outdoor air. The first heat
exchanger (30) is implemented by a so-called plate heat exchanger.
The first heat exchanger (30) is provided with a plurality of first
flow paths (31) and a plurality of second flow paths (32) which are
partitioned from each other. In the first refrigerant circuit (20),
the first compressor (21) is connected, at its discharge and
suction sides, to the first heat exchanger (30) and to the outdoor
heat exchanger (23), respectively. One end of the first expansion
valve (22) is connected to the outdoor heat exchanger (23) and the
other end thereof is connected to the first heat exchanger
(30).
[0065] In the first circulation pipeline (40), one end of the flow
rate control valve (43) is connected to the second flow path (32)
while the other end thereof is connected to the suction side of the
floor heating side pump (41). One end of the floor heating radiator
(45) is connected to the discharge side of the floor heating side
pump (41) while the other end thereof is connected to the second
flow path (32) of the first heat exchanger (30).
[0066] One end of the first flow path (51) of the second heat
exchanger (50) is connected to the discharge side of the hot water
supply side pump (42) while the other end thereof is connected to a
line by which the second flow path (32) of the first heat exchanger
(30) and the other end of the floor heating radiator (45) are
connected together.
[0067] The high temperature hot water supply unit (13) accommodates
a second refrigerant circuit (60). Disposed along the second
refrigerant circuit (60) are a second compressor (61), a third heat
exchanger (70), a second expansion valve (62), and the second heat
exchanger (50). In addition, the second refrigerant circuit (60) is
charged with a second refrigerant. As the second refrigerant,
carbon dioxide (CO.sub.2) is used.
[0068] The third heat exchanger (70) is implemented by a so-called
double pipe heat exchanger and has a first flow path (71) and a
second flow path (72) which are partitioned from each other.
[0069] In the second refrigerant circuit (60), the discharge side
of the second compressor (61) is connected to one end of the first
flow path (71) of the third heat exchanger (70). The other end of
the first flow path (71) of the third heat exchanger (70) is
connected, through the second expansion valve (62), to one end of
the second flow path (52) of the second heat exchanger (50). The
other end of the second flow path (52) of the second heat exchanger
(50) is connected to the suction side of the second compressor
(61).
[0070] The high temperature hot water supply unit (13) is provided
with a high temperature water circuit (80). Disposed along the high
temperature water circuit (80) are a hot water storage tank (81), a
water supply pump (82), the third heat exchanger (70), and a mixing
valve (83).
[0071] The mixing valve (83) has three ports and controls the rate
at which a fluid flowing into the first port and a fluid flowing
into the second port are mixed, and the mixture is delivered out of
the third port. The hot water storage tank (81) is shaped like a
longitudinally elongated, cylinder-shaped, hermetically-sealed
container.
[0072] In the high temperature water circuit (80), the discharge
side of the water supply pump (82) is connected to one end of the
second flow path (72) of the third heat exchanger (70). The second
flow path (72) of the third heat exchanger (70) is connected, at
the other end thereof, to the first port of the mixing valve (83).
The second port of the mixing valve (83) is connected to the
suction side of the water supply pump (82). Connected to the third
port of the mixing valve (83) is a hot water supply pipe (85) which
extends towards the utilization side such a kitchen, a washstand, a
bathroom et cetera. The hot water storage tank (81) is connected,
at its bottom and top, to a line which establishes connection
between the mixing valve (83) and the water supply pump (82) and to
a line which establishes connection between the second flow path
(72) of the third heat exchanger (70) and the mixing valve (83),
respectively. A supply of water is provided to the high temperature
water circuit (80) from the outside and then introduced to the
bottom of the hot water storage tank (81).
[0073] On the other hand, the second circulation pipeline (49) is
arranged in the second dwelling unit (15). The second circulation
pipeline (49) is similar in configuration to the first circulation
pipeline (40), except for the omission of the floor heating
radiator (45), the floor heating side pump (41), and the line for
connecting them. Consequently, the same reference numerals refer to
the same parts as the first circulation pipeline (40) and their
detailed description is omitted.
[0074] The heat conveyance system (10) is provided with a high
temperature side communication pipe (91) and a low temperature side
communication pipe (92) which extend between the first dwelling
unit (14) and the second dwelling unit (15). The high temperature
side communication pipe (91) is formed in a loop shape and has a
high temperature side circulation pump (93) for circulation of the
heat transfer water. Likewise, the low temperature side
communication pipe (92) is also formed in a loop shape and has a
low temperature side circulation pump (94) for circulation of the
heat transfer water.
[0075] The high temperature side communication pipe (91)
establishes fluid communication between the first circulation
pipeline (40) and the second circulation pipeline (49). The first
circulation pipeline (40) is connected, at its part situated
between the one end of the flow rate control valve (43) and the
suction side of the floor heating side pump (41) (i.e., between the
outflow side of the first heat exchanger (30) and the inflow side
of the floor heating radiator (45)), to the high temperature side
communication pipe (91). On the other hand, the second circulation
pipeline (49) is connected, at its part situated between the one
end of the flow rate control valve (43) and the suction side of the
hot water supply side pump (42) (i.e., between the outflow side of
the first heat exchanger (30) and the inflow side of the second
heat exchanger (50)), to the high temperature side communication
pipe (91).
[0076] The low temperature side communication pipe (92) establishes
fluid communication between the first circulation pipeline (40) and
the second circulation pipeline (49). The first circulation
pipeline (40) is connected, at its part situated between the
outflow side of the floor heating radiator (45) and the inflow side
of the first heat exchanger (30), to the low temperature side
communication pipe (92). The second circulation pipeline (49) is
connected, at its part situated between the outflow side of the
second heat exchanger (50) and the inflow side of the first heat
exchanger (30), to the low temperature side communication pipe
(92).
[0077] In addition, the high temperature side communication pipe
(91) and the low temperature side communication pipe (92) are
directly connected together by a bypass pipe (96) having a bypass
pump (95) for causing the heat transfer water in the high
temperature side communication pipe (91) to flow into the low
temperature side communication pipe (92). The provision of the
bypass pipe (96) makes it possible to allow the heat transfer water
to directly flow into the low temperature side communication pipe
(92) where appropriate.
[0078] The heating medium which is charged in the first circulation
pipeline (40) is not limited to water. For example, brine such as
ethylene glycol aqueous solution et cetera may be used as a heating
medium. In addition, the utilization side appliance to which the
first circulation pipeline (40) is connected is not limited to the
floor heating radiator (45). For example, appliances, such as a hot
water heating device, a bathroom drying device et cetera which are
configured to heat air with heat transfer water, may be connected,
as a utilization side appliance, to the first circulation pipeline
(40).
Running Operation
[0079] The running operation of the heat conveyance system (10) of
the first embodiment is described.
[0080] In the first place, the operation of the first refrigerant
circuit (20) in the first circulation pipeline (40) is
described.
[0081] Upon operation of the first compressor (21), the first
refrigerant is circulated in the first refrigerant circuit (20) to
thereby perform a refrigeration cycle. During the refrigeration
cycle, in the first refrigerant circuit (20) the first heat
exchanger (30) operates as a condenser while the outdoor heat
exchanger (23) operates as an evaporator. More specifically, the
first refrigerant discharged out of the first compressor (21) flows
into the first flow path (31) of the first heat exchanger (30). The
first refrigerant having flowed into the first flow path (31) of
the first heat exchanger (30) dissipates heat to the heat transfer
water in the first circulation pipeline (40) and condenses.
Thereafter, the first refrigerant is decompressed during passage
through the first expansion valve (22) and then flows into the
outdoor heat exchanger (23). In the outdoor heat exchanger (23),
the first refrigerant having flowed thereinto absorbs heat from
outdoor air and evaporates. As a result, the outdoor air is cooled.
The first refrigerant evaporated in the outdoor heat exchanger (23)
is drawn into the first compressor (21) where it is compressed.
[0082] Next, the operation of each of the first circulation
pipeline (40), the second refrigerant circuit (60), and the high
temperature water circuit (80) is described.
[0083] Upon operation of the hot water supply side pump (42) of the
first circulation pipeline (40), the heat transfer water is
circulated in the first circulation pipeline (40). The heat
transfer water having flowed into the second flow path (32) of the
first heat exchanger (30) is heated by the first refrigerant
flowing in the first flow path (31) of the first heat exchanger
(30). The heat transfer water, heated up to an intermediate
temperature of about 30-60 degrees Centigrade during passage
through the second flow path (32), flows into the flow rate control
valve (43). The flow rate control valve (43) is set such that it
allows passage of an appropriate amount of heat transfer water
during the operation of the hot water supply side pump (42). In
addition, when the floor heating side pump (41) of the first
circulation pipeline (40) is placed in operation, a portion of the
intermediate temperature heat transfer water flows into the floor
heating radiator (45) while the other heat transfer water flows
into the first flow path (51) of the second heat exchanger (50).
The heat transfer water having dissipated heat to indoor air in the
floor heating radiator (45) flows into the second flow path (32) of
the first heat exchanger (30) where it is heated. Likewise, the
heat transfer water having dissipated heat to the second
refrigerant in the second flow path (52) of the second heat
exchanger (50) flows into the second flow path (32) of the first
heat exchanger (30) where it is heated.
[0084] It is possible to change the ratio between the flow rate of
heat transfer water flowing towards the floor heating radiator (45)
and the flow rate of heat transfer water flowing towards the second
heat exchanger (50) by controlling the hot water supply side pump
(42) and the floor heating side pump (41).
[0085] In addition, if the hot water supply side pump (42) is set
to stop while the floor heating side pump (41) is set to operate,
this setting causes the heat transfer water heated in the first
heat exchanger (30) to be supplied only to the floor heating
radiator (45). On the other hand, if the hot water supply side pump
(42) is set to operate while the floor heating side pump (41) is
set to stop, this setting causes the heat transfer water heated in
the first heat exchanger (30) to be supplied only to the second
heat exchanger (50).
[0086] If the supply of thermal energy from the heat source unit
(11) of the first circulation pipeline (40) alone is insufficient,
thermal energy is supplied also from the second circulation
pipeline (49). In other words, the heat source unit (11) of the
second circulation pipeline (49) is activated, whereby the heat
transfer water is heated and then supplied, by way of the flow rate
control valve (43), to the high temperature side communication pipe
(91). And, the heat transfer water supplied to the first
circulation pipeline (40) from the high temperature side
communication pipe (91) is, together with the heat transfer water
heated in the heat source unit (11) of the first circulation
pipeline (40), supplied either to the first flow path (51) of the
second heat exchanger (50) by way of the hot water supply side pump
(42), or to the floor heating radiator (45) by way of the floor
heating side pump (41). At the same time, the low temperature heat
transfer water is supplied to the second flow path (32) of the
first heat exchanger (30) in the second circulation pipeline (49)
from the low temperature side communication pipe (92).
[0087] In addition, also in the event of the failure of the heat
source unit (11) of the first circulation pipeline (40), the second
circulation pipeline (49) provides a supply of thermal energy. In
other words, the heat source unit (11) of the second circulation
pipeline (49) is activated, whereby the heat transfer water is
heated and then supplied, by way of the flow rate control valve
(43), to the high temperature side communication pipe (91). And,
the heat transfer water circulated by the high temperature side
circulation pump (93) is supplied from the high temperature side
communication pipe (91) to the first flow path (51) of the second
heat exchanger (50) by way of the hot water supply side pup (42),
or to the floor heating radiator (45) by way of the floor heating
side pump (41). At the same time, the low temperature heat transfer
water is supplied to the second flow path (32) of the first heat
exchanger (30) in the heat source unit (11) of the second
circulation pipeline (49) from the low temperature side
communication pipe (92).
[0088] Upon operation of the second compressor (61) of the second
refrigerant circuit (60), the second refrigerant is circulated in
the second refrigerant circuit (60) to thereby perform a
refrigeration cycle. During the refrigeration cycle, in the second
refrigerant circuit (60) the third heat exchanger (70) operates as
a condenser and the second heat exchanger (50) operates as an
evaporator. In addition, in the second refrigerant circuit (60),
the high pressure of the refrigeration cycle is set above the
critical pressure of the second refrigerant. Stated another way, a
so-called supercritical cycle is performed in the second
refrigerant circuit (60).
[0089] More specifically, the second refrigerant discharged out of
the second compressor (61) flows into the first flow path (71) of
the third heat exchanger (70), dissipates heat to water for use in
hot water supply flowing through the second flow path (72) of the
third heat exchanger (70) and condenses. The second refrigerant
condensed in the third heat exchanger (70) is decompressed during
passage through the second expansion valve (62) and then flows into
the second flow path (52) of the second heat exchanger (50). The
second refrigerant having flowed into the second flow path (52) of
the second heat exchanger (50) absorbs heat from the heat transfer
water flowing through the first flow path (51) of the second heat
exchanger (50) and evaporates. The refrigerant evaporated in the
second heat exchanger (50) is drawn into the second compressor (61)
where it is compressed.
[0090] Upon operation of the water supply pump (82) of the high
temperature water circuit (80), water for use in hot water supply
is distributed in the high temperature water circuit (80). The
supply water discharged out of the water supply pump (82) flows
into the second flow path (72) of the third heat exchanger (70) and
is heated by the second refrigerant flowing through the first flow
path (71) of the third heat exchanger (70). The supply water,
heated up to a high temperature of about 60-90 degrees Centigrade
in the third heat exchanger (70), is either supplied through the
hot water supply pipe (85) to the utilization side or stored in the
hot water storage tank (81).
[0091] If not only the high temperature hot water supply unit (13)
but also the floor heating radiator (45) has been left unused for
long periods, the temperature of the heat transfer water in the
high temperature side communication pipe (91) will fall. In such a
case, in order to maintain the temperature of the heat transfer
water in the high temperature side communication pipe (91) at high
temperature, the heat source unit (11) of either the first
circulation pipeline (40) or the second circulation pipeline (49)
is activated to thereby provide a supply of thermal energy. At this
time, by activating the bypass pump (95) of the bypass pipe (96),
the low temperature heating medium in the high temperature side
communication pipe (91) is discharged directly through the bypass
pipe (96) to the low temperature side communication pipe (92)
without flowing through any circulation pipeline, and the heating
medium heated in the heat source unit (11) is supplied into the
high temperature side communication pipe (91).
Advantageous Effects of the First Embodiment
[0092] In the heat conveyance system (10) of the first embodiment,
the heating medium circuit (90) is provided with the plural
circulation pipelines (40, 49) capable of operation to cause the
heating medium to circulate between the heat source unit (11) and
the high temperature hot water supply unit (13) as well as between
the heat source unit (11) and the floor heating radiator (45); the
part between the outflow side of the heat source unit (11) and the
inflow side of either the high temperature hot water supply unit
(13) or the floor heating radiator (45) in the first circulation
pipeline (40) and the part between the outflow side of the heat
source unit (11) and the inflow side of either the high temperature
hot water supply unit (13) or the floor heating radiator (45) in
the second circulation pipeline (49) are connected together by the
high temperature side communication pipe (91); and the part between
the outflow side of either the high temperature hot water supply
unit (13) or the floor heating radiator (45) and the inflow side of
the heat source unit (11) in the first circulation pipeline (40)
and the part between the outflow side of either the high
temperature hot water supply unit (13) or the floor heating
radiator (45) and the inflow side of the heat source unit (11) in
the second circulation pipeline (49) are connected together by the
low temperature side communication pipe (92). Consequently, even
when there is a lack of thermal energy in either one of the
circulation pipelines (40, 49), the heat transfer water at low
temperature drawn in from the low temperature side communication
pipe (92) can be heated by the heat source unit (11) of the other
of the circulation pipelines (40, 49), conveyed to the high
temperature side communication pipe (91), and supplied to the one
of the circulation pipelines (40, 49) that is lacking thermal
energy, thereby making it possible to fully utilize the ability of
the heat source unit (11) of each circulation pipeline (40,
49).
[0093] In addition, during driving of the pump (41, 42) in the
circulation pipeline (40, 49), the heat transfer water in the high
temperature side communication pipe (91) flows, along with the heat
transfer water heated in the heat source unit (11) of the
circulation pipeline (40, 49), into the inflow side of the high
temperature hot water supply unit (13) as well as into the inflow
side of the floor heating radiator (45) while on the other hand
when the pump (41, 42) in the circulation pipeline (40, 49) is
stopped the flow rate control valve (43) is placed in the closed
position so as to prevent the heat transfer water from flowing back
from the low temperature side communication pipe (92) towards the
high temperature side communication pipe (91). This therefore
prevents the heating medium in the high temperature side
communication pipe (91) from flowing out towards the low
temperature side communication pipe (92), thereby making it
possible to provide a high efficiency heat conveyance system.
[0094] In addition, the high temperature side communication pipe
(91) and the low temperature side communication pipe (92) are each
formed in a loop shape and the heat transfer water is circulated by
the circulation pumps (93, 94). As a result of such arrangement,
the heat transfer water, the temperature of which is maintained
constant throughout the loop-shaped pipe, is supplied to each
circulation pipeline (40, 49), thereby making it possible to
provide a still higher efficiency heat conveyance system.
[0095] In addition, the high temperature side communication pipe
(91) and the low temperature side communication pipe (92) are
directly connected together by the bypass pipe (96), whereby the
heat transfer water in the high temperature side communication pipe
(91) is made to flow into the low temperature side communication
pipe (92) by the bypass pump (95) where appropriate. This therefore
makes it possible to discharge the heat transfer water at low
temperature in the high temperature side communication pipe (91) to
the low temperature side communication pipe (92) as well to cause
the heat transfer water heated by any one of the heat source units
(11) to flow into the high temperature side communication pipe
(91), whereby a supply of thermal energy can be efficiently
provided to the high temperature side communication pipe (91).
First Variation of the First Embodiment
[0096] In the first embodiment, the high temperature side
communication pipe (91) and the low temperature side communication
pipe (92) are each formed in a loop shape and, in addition, the
circulation pumps (93, 94) are provided. Alternatively, it may be
arranged such that either the high temperature side communication
pipe (91) or the low temperature side communication pipe (92) is
formed in a loop shape and the circulation pumps (93, 94) are
provided. And, the provision of the bypass pipe (96) is not
inevitable.
Second Variation of the First Embodiment
[0097] As shown in FIG. 2, it may be arranged such that neither the
high temperature side communication pipe (91) nor the low
temperature side communication pipe (92) is formed in a loop shape.
In this case, the high temperature side communication pipe (91) and
the low temperature side communication pipe (92) are arranged such
that they are connected together by a single pipe. Since the high
temperature side communication pipe (91) and the low temperature
side communication pipe (92) each have a certain length enough to
allow the heat transfer water in each pipe to store thermal energy
therein.
Third Variation of the First Embodiment
[0098] As shown in FIG. 3, the high temperature side communication
pipe (91) and the low temperature side communication pipe (92) may
be provided with a heat transfer water storage tank (97) and a heat
transfer water storage tank (98), respectively. The high
temperature side tank (97) of the high temperature side
communication pipe (91) is used for the storage of heat transfer
water heated in the heat source unit (11) of each circulation
pipeline (40, 49) while one the other hand the low temperature side
tank (98) of the low temperature side communication pipe (92) is
used for the storage of heat transfer water after thermal energy
consumption in either the high temperature hot water supply unit
(13) or the floor heating radiator (45) of each circulation
pipeline (40, 49). When either the high temperature hot water
supply unit (13) or the floor heating radiator (45) of one of the
circulation pipelines (40, 49) is placed in operation, the heat
transfer water at high temperature stored in the high temperature
side tank (97) is supplied to the inflow side of either the high
temperature hot water supply unit (13) or the floor heating
radiator (45), whichever is being operated, while simultaneously
the heat transfer water at low temperature stored in the low
temperature side tank (98) is supplied to the inflow side of the
heat source unit (11) of the other of the circulation pipelines
(40, 49).
[0099] Owing to the above, the heat transfer water at high
temperature stored in the high temperature side tank (97) can be
stably supplied to the inflow side of the high temperature hot
water supply unit (13) as well as to the inflow side of the floor
heating radiator (45) and, in addition, the heat transfer water at
low temperature stored in the low temperature side tank (98) can be
stably supplied to the inflow side of the heat source unit
(11).
Second Embodiment
[0100] Referring to FIG. 4, there is shown a heat conveyance system
(10) according to a second embodiment of the present invention. The
second embodiment differs from the first embodiment in that the
heating medium circuit (90) is provided in plural number. The same
reference numerals refer to the same parts as FIG. 1 and their
detailed description is omitted.
[0101] For the case of the heat conveyance system (10) of the
second embodiment, a plurality of heating medium circuits (90)
according to the first embodiment are arranged in the multiple unit
complex (16) (for the sake of simplicity of description, two
heating medium circuits (90) in the second embodiment). The high
temperature side communication pipes (91) of the heating medium
circuits (90) are connected to each other by first and second
connection pipes (103, 104), thereby forming a single high
temperature side loop-shaped pipeline (191). In addition, the low
temperature side communication pipes (92) of the heating medium
circuits (90) are connected to each other by third and fourth
connection pipes (105, 106), thereby forming a single low
temperature side loop-shaped pipeline (192).
[0102] The second connection pipe (104) and the high temperature
side communication pipe (91) of each heating medium circuit (90)
are connected to each other by a high temperature side three way
control valve (101) as a switch mechanism. The fourth connection
pipe (106) and the low temperature side communication pipe (92) of
each heating medium circuit (90) are connected to each other by a
low temperature side three way control valve (102) as a switch
mechanism.
[0103] The three way control valves (101, 102) each have three
ports and are switchable between a first operation in which the
inflow of fluid into the first port is delivered to the third port
(first distribution mode) and a second operation in which the
inflow of fluid into the first port is delivered to the second port
(second distribution mode).
[0104] More specifically, by virtue of the high temperature side
three way control valve (101), the high temperature side
communication pipe (91) of each heating medium circuit (90) is made
switchable between the first distribution mode in which the heating
medium is made to flow only through its high temperature side
communication pipe (91) and the second distribution mode in which
the heating medium is shared by establishing fluid communication
with the high temperature side communication pipe (91) of the other
heating medium circuit (90).
[0105] In addition, by virtue of the low temperature side three way
control valve (102), the low temperature side communication pipe
(92) of each heating medium circuit (90) is made switchable between
the first distribution mode in which the heating medium is made to
flow only through its low temperature side communication pipe (92)
and the second distribution mode in which the heating medium is
shared by establishing fluid communication with the low temperature
side communication pipe (92) of the other heating medium circuit
(90).
Running Operation
[0106] The running operation of the heat conveyance system (10) of
the second embodiment is described.
[0107] During the first operation of the three way control valve
(101, 102), each heating medium circuit (90) performs its running
operation independently of the other heating medium circuit (90).
This running operation is the same as the running operation in the
first embodiment and its detailed description is omitted here. Each
heating medium circuit (90) utilizes only the heat transfer water
in its high temperature side communication pipe (91) and utilizes
only the heat transfer water in its low temperature side
communication pipe (92).
[0108] On the other hand, during the second operation of the three
way control valve (101, 102), the sharing of heat transfer water
takes place between the heating medium circuits (90). In other
words, since the plural heating medium circuits (90) are connected
in parallel, this makes it possible to convey the heat transfer
water from the high temperature side communication pipe (91) of one
heating medium circuit (90) which is being surplus in thermal
energy to the high temperature side communication pipe (91) of
another heating medium circuit (90) which is being deficient in
thermal energy. At the same time, in order to achieve a balance
between the income of heat transfer water and the outgo of heat
transfer water, the heat transfer water is conveyed from the low
temperature side communication pipe (92) of the heating medium
circuit (90) which is being deficient in thermal energy to the low
temperature side communication pipe (92) of the heating medium
circuit (90) which is being surplus in thermal energy. Because of
this, the heat transfer water is shared between the heating medium
circuits (90).
[0109] The operating mode of the three way control valves (101,
102) is switched in the way as described above, thereby making it
possible to establish switching between the operating mode in which
each heating medium circuit (90) conveys the heat transfer water
only within itself and the operating mode in which each heating
medium circuit (90) is allowed to utilize the heat transfer water
in the other heating medium circuit (90).
Advantageous Effects of the Second Embodiment
[0110] In the second embodiment, the plural heating medium circuits
(90) are connected to each other by their respective high
temperature side communication pipes (91) and by their respective
low temperature side communication pipes (92). This makes it
possible to provide sharing of the heat transfer water among the
plural heating medium circuits (90), whereby the ability of the
heat source unit (11) in each heating medium circuit (90) can be
fully utilized.
[0111] In addition, the high temperature side communication pipes
(91) of the heating medium circuits (90) are connected to each
other by the high temperature side switch mechanism (101) while on
the other hand the low temperature side communication pipes (92) of
the heating medium circuits (90) are connected to each other by the
low temperature side switch mechanism (102). This therefore enables
each heating medium circuit (90) to make a switch between the
narrow region conveyance mode in which the heat transfer water is
conveyed within itself and the broad region conveyance mode in
which the heat transfer water in the other heating medium circuit
(90) is also utilized. Accordingly, the ability of the heat source
unit (11) in each heating medium circuit (90) can be fully
utilized.
Variation of the Second Embodiment
[0112] As shown in FIG. 5, a plurality of heating medium circuits
(90) of the third variation of the first embodiment (shown in FIG.
3) may be connected. Stated another way, it may be arranged such
that the high temperature side tanks (97) of the plural heating
medium circuits (90) are connected together by a high temperature
side connection line (107) while the low temperature side tanks
(98) of the plural heating medium circuits (90) are connected
together by a low temperature side connection line (108).
INDUSTRIAL APPLICABILITY
[0113] As has been described above, the present invention is useful
for heat conveyance systems when the heat source is shared between
a plurality of rooms or dwelling units in a multiple unit
complex.
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