U.S. patent application number 11/401488 was filed with the patent office on 2007-10-11 for heat radiator having a thermo-electric cooler and multiple heat radiation modules and the method of the same.
Invention is credited to Chung-Yang Chang, Ying-Hung Kan, Tsung-Chu Lee.
Application Number | 20070234741 11/401488 |
Document ID | / |
Family ID | 38573661 |
Filed Date | 2007-10-11 |
United States Patent
Application |
20070234741 |
Kind Code |
A1 |
Lee; Tsung-Chu ; et
al. |
October 11, 2007 |
Heat radiator having a thermo-electric cooler and multiple heat
radiation modules and the method of the same
Abstract
A heat radiator has a thermo-electric cooler and multiple heat
radiation modules and the method of the same is capable of applying
forced heat conduction on a hot spot on a computer circuit through
a plurality of conduction paths. The heat radiator comprises a
first heat radiation module with a heat sink simultaneously
attached to the hot spot and the thermo-electric cooler and a
second radiation module with a heat sink attached on the
thermo-electric cooler only, whereby the heat generated in a heat
source, such as a central processing unit (CPU) and an accelerated
graphic chip, and delivered from the heat absorption terminal to
the heat release terminal of the cooler can be dissipated
efficiently. The first heat radiation module and the second
radiation module further respectively include a first and a second
radiating fin sets.
Inventors: |
Lee; Tsung-Chu; (Taoyuan
Hsien, TW) ; Chang; Chung-Yang; (Taoyuan Hsien,
TW) ; Kan; Ying-Hung; (Taoyuan Hsien, TW) |
Correspondence
Address: |
TSUNG-CHU LEE
235 Chung-Ho
Box 8-24
Taipei
TW
|
Family ID: |
38573661 |
Appl. No.: |
11/401488 |
Filed: |
April 11, 2006 |
Current U.S.
Class: |
62/3.2 ;
257/E23.082; 257/E23.084; 257/E23.088; 257/E23.099; 62/259.2;
62/3.7 |
Current CPC
Class: |
H01L 23/427 20130101;
F25B 21/02 20130101; H01L 2924/0002 20130101; H01L 23/4006
20130101; H01L 23/38 20130101; H01L 23/467 20130101; G06F 1/20
20130101; F25B 2321/0251 20130101; H01L 2924/0002 20130101; H01L
2924/00 20130101 |
Class at
Publication: |
062/003.2 ;
062/003.7; 062/259.2 |
International
Class: |
F25B 21/02 20060101
F25B021/02; F25D 23/12 20060101 F25D023/12 |
Claims
1. A heat radiator having a thermo-electric cooler and multiple
heat radiation modules, comprising: a first heat radiation module
having a first heat radiating fin set and a first heat conducting
pipe connected to each fin of said first heat radiating fin set,
said first heat conducting pipe having one end extended close to a
heat source; a thermo-electric cooler attached to said heat source
for delivering heat from a contact surface with said heat source to
an opposite upper surface; and a second heat radiation module
having a second heat radiating fin set and a second heat conducting
pipe connected to each fin of said second heat radiating fin set,
said second heat conducting pipe having one end extended close to
said thermo-electric cooler.
2. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein a first end of said first
heat conducting pipe is embedded in a base that is in turn
connected with said heat source.
3. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein a second end of said
first heat conducting pipe is extended to a place of good
ventilation.
4. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein a first end of said
second heat conducting pipe is extended close to said upper surface
of said thermo-electric cooler wherein heat is released.
5. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein a second end of said
second heat conducting pipe is extended to a place of good
ventilation.
6. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein said thermo-electric
cooler is enclosed within a heat conducting component for absorbing
heat from said thermo-electric cooler; said second heat conducting
pipe delivering heat from said thermo-electric cooler to said
second heat radiating fin set.
7. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein a fan is installed on a
lateral side of any of said first and second heat radiating fin
sets.
8. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein said first heat radiation
module is provided with at least an extra heat conducting pipe with
one end attached to one face of said thermo-electric cooler and
another end going through said first heat radiating fin set for
enhancing heat dissipation.
9. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 1 wherein said second heat
radiation module is provided with at least an extra heat conducting
pipe with one end attached to one face of said thermo-electric
cooler and another end going through said second heat radiating fin
set for enhancing heat dissipation.
10. A heat radiation method using said heat radiator of claim 1,
comprising the steps of: (1) said thermo-electric cooler attached
to said heat source delivering heat from a contact surface with
said heat source up to an opposite upper surface thereon; (2) said
first heat conducting pipe conducting heat from said
thermo-electric cooler and said heat source to said first heat
radiating fin set; (3) said second heat conducting pipe conducting
heat from said thermo-electric cooler to said second heat radiating
fin set; and (4) producing a cold airflow onward said first heat
radiating fin set and second heat radiating fin set to achieve heat
dissipation through heat exchange.
11. The heat radiation method of claim 10 wherein a space
accommodating said heat radiation modules further includes a wind
exit, enhancing air convection.
12. The heat radiation method of claim 10 further including the
step of using at least a fan located aside a heat radiating fin set
to facilitate a cold airflow passing through said fins.
13. The heat radiation method of claim 12 further including the
step of using second fan to work with a first fan so as to produce
an effect of airflow convection.
14. The heat radiation method of claim 10 wherein said heat source
is an electronic circuit element.
15. The heat radiation method of claim 14 wherein said electronic
circuit element is a central processing unit.
16. A heat radiator having a thermo-electric cooler and multiple
heat radiation modules, comprising: a first heat radiation module
having a first heat radiating fin set and a heat sink connected to
said first heat radiating fin set, said heat sink having one end
extended close to a heat source; a thermo-electric cooler attached
to said heat source for delivering heat from a contact surface with
said heat source to an opposite upper surface; and a second heat
radiation module having a second heat radiating fin set and a heat
sink connected to said second heat radiating fin set, said heat
sink having one end connected to said said upper surface of said
thermo-electric cooler.
17. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 16 further including a fan
installed on a lateral side of any of said first and second heat
radiating fin sets.
18. The heat radiator having a thermo-electric cooler and multiple
heat radiation modules of claim 16 wherein said first heat
radiation module, said heat sink of said second heat radiation
module and said heat radiating sets are directly connected.
19. A heat radiation method using said heat radiator of claim 16,
comprising the steps of: (1) said thermo-electric cooler attached
to said heat source delivering heat from a contact surface with
said heat source up to an opposite upper surface thereon; (2) said
first heat sink conducting heat from said thermo-electric cooler
and said heat source to said first heat radiating fin set; and (3)
said second heat sink conducting heat from said thermo-electric
cooler to said second heat radiating fin set.
20. The heat radiation method of claim 19 further including the
step of driving a cold airflow onward said first heat radiating fin
set and second heat radiating fin set to achieve heat dissipation
through heat exchange.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to heat radiators including a
thermo-electric cooler, more particularly to a heat radiator having
a thermo-electric cooler and multiple heat radiation modules and
the method of the same to assist more efficient heat
dissipation.
BACKGROUND OF THE INVENTION
[0002] Given the faster and faster computer processors, technology
of electronic heat disspasition has become a critical consideration
in developing powerful computing. The main purpose of a cooler is
to deliver the heat generated in a central processing unit (CPU) or
a graphics processing unit (GPU) confined within a computer chassis
from a heat sink through a heat conducting pipe and fin set out of
the computer, by means of thermal conduction, convention and
radiation. Thereby, not only the powerful computing components can
operated continuously, but also the electronic elements in a
computer can be reliable and durable, under the condition that the
operation temperature of a computer system can be limited.
Therefore, to assure the effectiveness and security of a computer
system, the structure design of the thermal paths distributed in
the system is important and needs innovations.
[0003] Thermo-electric coolers (TEC) are heat radiation components
utilizing Peltier effect in a semiconductor, whereby heat can be
delivered from a spatial point A to another spatial point B;
namely, the heat at point A will be transported to point B so that
the temperature at A will decrease and that at B will increase.
Briefly speaking, heat is absorbed at A and released at B. A
typical thermo-electric cooler is composed of a train of pairs of P
type and N type semiconductor crystal granules; each of the
semiconductor pairs has a metallic (copper or aluminum) conductor
disposed between the P type and N type semiconductors to form a
circuit loop. The bulk of semiconductor pairs is enclosed by two
ceramic plates respectively on both sides of the cooler. When the
cooler is charged, the N-type semiconductors will release heat, and
the P-type semiconductors will absorb heat. Therefore, a cooler,
made of train of N/P pairs, has a heat-absorbing terminal and a
heat-releasing terminal, whereby the cooler will achieve heat
dissipation by directional heat transport.
[0004] Thermo-electric coolers are often used in the heat
dissipation of a central processing unit or any other
heat-generating chips in a computer system. As shown in FIGS. 10
and 11, a thermo-electric cooler 5 has a heat-absorbing terminal 51
attached on a heat source and a heat-releasing terminal 52 on a
heat dissipation structure 90 including a heat sink and a fin set.
Two interfaces of the terminals 51, 52 are applied with thermal
grease for lowing the contact thermal resistance. Eventually, a fan
61 will blow wind onto the surfaces of the fins, so that forced
convection within the heat dissipation structure 90 can be induced.
In such an arrangement, the order of heat transportation is: heat
source.fwdarw.thermo-electric cooler.fwdarw.heat
sink/fins.fwdarw.system chassis.fwdarw.outer environment.
[0005] Practically, the necessary heat dissipation capacity a
thermo-electric cooler needs to provide must much exceed the rated
heat generating capacity of the cooler since it is electrically
powered. The electric power of the cooler is usually at least 30%
of a central processing unit it is assigned to. According to the
first law of thermodynamics, namely the conservation of energy, the
rate of heat release of a cooler is equal to the sum of the
absorbing rate at the heat-absorbing terminal, the input electric
power, and the rate of increase of internal energy. Therefore, a
heat radiator equipped with a thermo-electric cooler will take away
not only the heat generated by the CPU or chip it is assigned to
but also the electric power sent into the cooler. Briefly speaking,
the role played by a thermo-electric cooler in a heat radiator is
not only a heat removing device but also a significant heat source.
Obviously, a heat radiator equipped with a thermo-electric cooler
requires fins having a larger total surface area or a more powerful
fan.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is an exploded perspective view of the first set of
preferred embodiments of the present invention.
[0007] FIG. 1A is a perspective view of the first set of preferred
embodiments in FIG. 1.
[0008] FIG. 2 is a perspective view of a preferred embodiment of
the first set installed in a computer chassis.
[0009] FIG. 3 is a side view of the first set of preferred
embodiments in FIG. 1.
[0010] FIG. 3A is a local side view of a thermo-electric
cooler.
[0011] FIG. 4 is a perspective view of a preferred embodiment in
the first set with a different fan location.
[0012] FIG. 5 is a front view of the preferred embodiment in FIG.
4.
[0013] FIG. 6 is a top view of a preferred embodiment of the first
set installed in a computer chassis with a different module
arrangement.
[0014] FIG. 7 indicates the heat transfer paths of the second set
of preferred embodiments.
[0015] FIG. 8 is a perspective view of a typical preferred
embodiment in the second set.
[0016] FIG. 9 is an exploded perspective view of a typical
preferred embodiment in the second set.
[0017] FIG. 10 is an exploded perspective view of a conventional
heat radiator for a computer chip.
[0018] FIG. 11 is a perspective view of a conventional heat
radiator for a computer chip.
SUMMARY OF THE INVENTION
[0019] The primary objective of the present invention is to provide
a heat radiator having a thermo-electric cooler and multiple heat
radiation modules capable of carrying out heat radiation of heat
sources such as a central processing unit (CPU) and an accelerated
graphic chip through not only a first heat radiation module but
also a second heat radiation module applied at the heat release
terminal of a thermo-electric cooler. Thereby, heat can be
exhausted through two paths (as shown in FIG. 7):
[0020] Heat conduction path 1: heat source.fwdarw.first heat
radiation module.fwdarw.computer system outer shell,
thermo-electric cooler, the second heat radiation module, exterior
surrounding;
[0021] Heat conduction path 1: thermo-electric cooler, first heat
radiation module.fwdarw.the second heat radiation
module.fwdarw.computer system outer shell.fwdarw.exterior
surrounding.
[0022] The first heat radiation module comprises a first heat
radiating fin set and a heat sink on which the heat radiating fin
set is mounted. There is a heat conducting tube going through the
radiating fin set and the sink. The sink is simultaneously attached
to the hot spot and the thermo-electric cooler. Further, the
radiating fin set can be made by punching, welding, squeezing and
casting.
[0023] The second heat radiation module comprises a second heat
radiating fin set and a heat sink on which the heat radiating fin
set is mounted. There is a heat conducting tube going through the
radiating fin set and the sink. The sink is attached to the
thermo-electric cooler only. Further, the radiating fin set can be
made by punching, welding, squeezing and casting.
[0024] The secondary objective of the present invention is to
provide a multiple heat radiation method capable of supporting
multiple paths of heat radiation, whereby the thermo-electric
cooler will be effectively operating and the operation of a heat
generating circuit element is secured.
[0025] The various objects and advantages of the present invention
will be more readily understood from the following detailed
description when read in conjunction with the appended
drawings.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0026] Referring to FIGS. 1 and 1A, the first preferred embodiment
of the present invention as a heat radiator comprises a heat pipe
going through a heat radiating fin set. The heat radiation module 1
in FIG. 1 is extended with a lower connection member 10 for
mounting its base 4 on an electronic component. The heat radiation
module 1 is secured on the circuit board 2 by a set of locking
members 12. Aside the heat radiation module 1, there is a fan 6 for
blowing an air flow onto the heat radiating fin set 14 of the heat
radiation module 1, whereby the flow will take away the heat
accumulated on the surfaces of the fins and the heat absorbed by
the lower base 4 will continuously propagated through the path of
the base 4, the heat radiating fin set 14 and the air flow. FIG. 2
shows a mounting configuration of the present invention with in a
computer 3, wherein a fan 6 produced an air flow blown onto the
heat radiating fin set 14, and the heated flow passing the heat
radiating fin set 14 continues to go through a wind exit 31
corresponding to the leeward side opposite to the fan 6. Thereby,
the heat generated in the computer 3 will be exhausted by forced
convection.
[0027] Referring to FIG. 3, a thermo-electric cooler 5 is attached
onto the base 4 right above a central processing unit at a high
temperature due to the computation undergoing therein. As before,
the base 4 is secured on a circuit board 2 by a set of locking
members 12. The thermo-electric cooler 5 is powered by wires 50 so
that the heat generated in the central processing unit can be
absorbed by a heat-absorbing terminal 51 on the lower side of the
thermo-electric cooler 5 to a heat-releasing terminal 52, thereby
reducing the temperature of the central processing unit, as shown
in FIG. 3A. The thermo-electric cooler 5 further includes a
surrounding heat conducting component 7, whereby a heat dissipation
space 7a will form between the thermo-electric cooler 5 and the
heat conducting component 7. A heat conducting pipe 11b is inserted
into the heat dissipation space 7a for conducting away the heat
absorbed by the thermo-electric cooler 5 and delivering the heat to
a heat radiating fin set 14b by thermal conduction. A heat radiator
having multiple heat radiation modules of the present invention
comprises a first heat radiating fin set 14a having a first heat
conducting pipe 11a whose lower end 111a is connected to a heat
source and a second heat radiating fin set 14b having a second heat
conducting pipe 11b whose lower end 111b is attached on the
heat-releasing terminal of a thermo-electric cooler 5. The first
heat radiation module 1a further includes a first heat radiating
fin set 14a connected to the first heat conducting pipe 11a. The
second heat radiation module 1b further includes a second heat
radiating fin set 14b connected to the second heat conducting pipe
11b. A fan 6 is installed on one side of the heat radiation module
1 for driving an airflow onto the first heat radiating fin set 14a
and the second heat radiating fin set 14b, whereby the heat on the
surfaces those fins will be carried away. Another fan coupled with
the fan 6 (not shown in the figure) for inducing air convention can
also be introduced. The lower end 111a of the first heat conducting
pipe 11a is located between the base 4 and a central processing
unit. Further, the number of heat pipes associated with the first
heat radiation module 1a and the second heat radiation module 1b is
not limited to two; it can be increased in accordance with the
necessity of heat dissipation. The contact surfaces on the base 4,
the thermo-electric cooler 5 and the heat conducting component 7
can be applied with heat-dissipation glue to enhance the efficiency
of heat conduction.
[0028] The multiple heat radiation method according to the present
invention can assist heat dissipation of a central processing unit,
whereby its operation temperature can be limited below a
predetermined temperature, thereby assuring stable operation of the
CPU. As shown in FIG. 3, the lower end 111a of the first heat
conducting pipe 11a of the first heat radiation module 1a is
embedded between the base 4 and the central processing unit. The
first heat conducting pipe 11a extended from the CPU pierces
through the fins of the first heat radiating fin set 14a, whereby
the heat from the CPU can be uniformly conducted to each of the
fins and blown away by an air current produced by the fan 6
installed aside the heat radiation module 1, achieving the effect
of fast heat dissipation.
[0029] At the same time, the thermo-electric cooler 5 is attached
to the upper face of the base 4, whereby the heat at point A can be
delivered to point B by Peltier effect. Therefore, the temperature
at A can be reduced, whereas the temperature at B increased. The
heat propagated to the contact surface (i.e., the heat-absorbing
end 51) between the thermo-electric cooler 5 and the base 4 will be
delivered to the opposite surface (i.e., the heat-releasing end 52)
of the thermo-electric cooler 5. The lower end 111b of the second
heat conducting pipe 11b of the second heat radiation module 1b is
embedded in the heat dissipation space 7a between the
thermo-electric cooler 5 and the enclosed heat conducting component
7. The second heat conducting pipe 11b extended from the heat
dissipation space 7a pierces through the fins of the second heat
radiating fin set 14b, whereby the heat from the thermo-electric
cooler 5 can be uniformly conducted to each of the fins and blown
away by an air current produced by the fan 6 installed aside the
heat radiation module 1, achieving the effect of fast heat
dissipation.
[0030] As shown in FIG. 3, the fan 6 is installed on a lateral side
of the first heat radiation module 1a. Since the heat generating
rate of the CPU is higher than that of the thermo-electric cooler
5, the cold airflow will firstly blow the first heat radiating fin
set 14a connected to the first heat conducting pipe 11a. However,
the location of the fan 6 in FIGS. 4 and 5 is on the lateral side
jointing the first heat radiating fin set 14a of the first heat
radiation module 1a and the second heat radiating fin set 14b of
the second heat radiation module 1b, whereby the airflow produced
by the fan 6 will cool the heat radiating fin set first heat
radiating fin set 14a and the second heat radiating fin set 14b at
the simultaneously. Therefore, the cold airflow will exchange heat
with the surfaces of the fins in 14a and 14b at the same time,
whereby the heat conducted through the first heat conducting pipe
11a and the second heat conducting pipe 11b will be guided away,
achieving the heat dissipation of the CPU and the thermo-electric
cooler 5.
[0031] If allowed by the inner space of a computer chassis, the
first heat radiation module 1a and the second heat radiation module
1b can be independently located, with their respective heat pipes
extended from the same heat source and with respective fans, so as
to dissipate heat from the heat source. For instance, the lower end
111a of the first heat conducting pipe 11a of the first heat
radiation module 1a may be extended away from the CPU to the first
heat radiating fin set 14a, on which heat is uniformly spread and
carried away by the airflow blown by a fan hidden underneath the
circuit board. Meanwhile, the lower end 111b of the second heat
conducting pipe 11b of the second heat radiation module 1b may be
extended away from the thermo-electric cooler 5 on the CPU to the
second heat radiating fin set 14b and carried away by the airflow
sucked away by a fan installed on the rear wall of the computer
chassis.
[0032] Referring to FIGS. 7 to 9, the second preferred embodiment
of the present invention may take another configuration.
[0033] Referring to FIGS. 7 to 9, a first heat conduction module
1a' has a structure composed of a heat sink and a fin set, made of
punching, welding, squeezing and casting. The first heat radiating
fin set 14a' is connected to the heat sink 15a by punching or
welding. Regardless of the actual manufacturing method, the heat
sink 15a of the first heat conduction module 1a' is attached to
both of a heat source 4' (such as a CPU) and a thermo-electric
cooler 5'. This preferred embodiment further includes a second heat
conduction module 1b' also having a heat sink and a fin set made of
punching, welding, squeezing and casting. The second heat radiating
fin set 14b' is connected to the heat sink 15b by punching or
welding. The heat sink 15b of the second heat conduction module 1b'
is attached to the thermo-electric cooler 5' only. Therefore, the
structure of this preferred embodiment, from the bottom to the top,
is: heat source 4' (such as a CPU), the first heat radiation module
1a', the thermo-electric cooler 5' and the second heat radiating
module 1b'.
[0034] The heat generated in the heat source 4', such as a CPU or
another chipset, is guided from the heat sink 15a to the first heat
radiating fin set 14a' along the first heat conduction module 1a'.
Meanwhile, the thermo-electric cooler 5' attached on the upper face
of the heat sink 15a will deliver heat from a lower heat-absorbing
terminal 51' to an upper heat-releasing terminal 52' by Peltier
effect. Since the heat-releasing terminal 52' is attached to the
heat sink 15b of the second heat conduction module 1b', the second
heat conduction module 1b' provides another path to dissipated heat
from the source 4. Further, a fan 6' is placed adjacent to the fin
sets, whereby a cold airflow will be blown by the fins and lower
the temperature of the source 4'. This preferred embodiment takes
away not only the heat of the source but also the heat of the
cooler.
[0035] The present invention is thus described, and it will be
obvious that the same may be varied in many ways. Such variations
are not to be regarded as a departure from the spirit and scope of
the present invention, and all such modifications as would be
obvious to one skilled in the art are intended to be included
within the scope of the following claims.
* * * * *