U.S. patent application number 11/686824 was filed with the patent office on 2007-09-27 for organic light-emitting device, and method for manufacturing organic light-emitting device.
This patent application is currently assigned to CANON KABUSHIKI KAISHA. Invention is credited to ISSEI YONEMOTO.
Application Number | 20070222384 11/686824 |
Document ID | / |
Family ID | 38532661 |
Filed Date | 2007-09-27 |
United States Patent
Application |
20070222384 |
Kind Code |
A1 |
YONEMOTO; ISSEI |
September 27, 2007 |
ORGANIC LIGHT-EMITTING DEVICE, AND METHOD FOR MANUFACTURING ORGANIC
LIGHT-EMITTING DEVICE
Abstract
The present invention provides an organic light-emitting device
which can prevent a covering member from being damaged or peeled
off, and which can be manufactured with excellent productivity and
cost performance; and a method for manufacturing the organic
light-emitting device. The covering member has a chamfer formed on
the side of a face of the covering member on a reverse side to the
side of an organic light-emitting element.
Inventors: |
YONEMOTO; ISSEI;
(YAMATO-SHI, JP) |
Correspondence
Address: |
FITZPATRICK CELLA HARPER & SCINTO
30 ROCKEFELLER PLAZA
NEW YORK
NY
10112
US
|
Assignee: |
CANON KABUSHIKI KAISHA
TOKYO
JP
|
Family ID: |
38532661 |
Appl. No.: |
11/686824 |
Filed: |
March 15, 2007 |
Current U.S.
Class: |
313/512 ;
313/506; 445/25 |
Current CPC
Class: |
H01L 51/5246 20130101;
H01L 51/524 20130101 |
Class at
Publication: |
313/512 ; 445/25;
313/506 |
International
Class: |
H05B 33/04 20060101
H05B033/04; H01L 51/50 20060101 H01L051/50; H01L 51/56 20060101
H01L051/56 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 23, 2006 |
JP |
2006-080627 |
Mar 7, 2007 |
JP |
2007-056761 |
Claims
1. A method of manufacturing an organic light-emitting device which
includes a substrate; an organic light-emitting element arranged on
the substrate and including a pair of electrodes and an organic
compound layer formed between the pair of the electrodes; a
covering member arranged on the organic light-emitting element, for
covering the organic light-emitting element; and an adhesive member
for adhering an end of the covering member and an end of the
substrate, the method comprising: a step of arranging, on the
organic light-emitting element, the covering member having a
chamfer formed on a side of one face thereof so that a face of the
covering member on a reverse side to the one face faces to a side
of the organic light-emitting element; and a step of adhering a
side part of the covering member and a face of the substrate on a
side of the covering member by dripping the adhesive member to the
chamfer from above of the one face.
2. The method for manufacturing the organic light-emitting device
according to claim 1, wherein the adhering step is a step of
dripping the adhesive member on the chamfer formed on each of four
sides of a perimeter of the covering member to adhere the covering
member and the substrate.
3. An organic light-emitting device comprising: a substrate; an
organic light-emitting element formed on the substrate, and
including a pair of electrodes and an organic compound layer formed
between the pair of the electrodes; a covering member arranged on
the organic light-emitting element, for covering the organic
light-emitting element, the covering member having a chamfer formed
on a side of a face thereof on a reverse side to the organic
light-emitting element; and an adhesive member for adhering the
substrate and the covering member by adhering a side part of the
covering member and a face of the substrate on a side of the
covering member.
4. The organic light-emitting device according to claim 3, wherein
the chamfer has a chamfered length of 0.2 mm or more.
5. The organic light-emitting device according to claim 3, wherein
the covering member is a flat glass plate.
6. The organic light-emitting device according to claim 3, wherein
the covering member is a glass plate having an etched face on the
side of the organic light-emitting element.
7. The organic light-emitting device according to claim 3, wherein
the covering member is a circular polarizing plate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to an organic light-emitting
device having an organic light-emitting element covered with a
covering member, and a method for manufacturing the organic
light-emitting device.
[0003] 2. Description of the Related Art
[0004] In a normal organic light-emitting device, an organic
light-emitting element (organic electroluminescence element) is
covered with a covering member such as glass, a metal, a resin and
a polarizing plate, in order to prevent the organic light-emitting
element from deteriorating affected by water or oxygen.
[0005] In the case of an organic electroluminescence element having
a gel layer as an intermediate layer in the upper part, a
technology is known which dampproofs the organic
electroluminescence element, by placing an adhesive on a perimeter
of a flat covering glass plate after bringing the flat covering
glass plate as a covering member into closely contact with and on
the intermediate layer (U.S. Pat. No. 5,194,027).
[0006] Another technology is known which double-dampproofs an
organic electroluminescence element with the use of a hollow
structure obtained by etching a glass sealing plate, applying an
adhesive onto the back face, bonding the above described glass
sealing plate as a covering member to a substrate to seal the inner
part, and then placing an adhesive again at the joined perimeter of
the glass sealing plate (Japanese Patent Application Laid-Open No.
2000-208251). Further, an organic electroluminescence panel is
known in which a notch with a chamfered corner is formed on a
sealing glass plate for sealing the organic electroluminescence
element so as not to damage a flexible wiring board to be placed
thereon (Japanese Patent Application Laid-Open No.
2004-234938).
[0007] Organic electroluminescence display devices according to
U.S. Pat. No. 5,194,027 and Japanese Patent Application Laid-Open
No. 2000-208251 have a problem that a perimeter of the covering
member is damaged or partially peeled off from a periphery thereof
by a large external peeling force acted on a corner of the covering
member, which is caused by a water pressure in a cleaning step or a
physical impact force after an organic electroluminescence element
is covered with the covering member.
[0008] Furthermore, in a step of placing an adhesive on a perimeter
of a covering member, an appropriate very small amount of the
adhesive must be placed at a correct position to bond and fix the
covering member to the substrate. For example, the organic
electroluminescence display devices also have a problem that the
step of applying a large amount of the adhesive to the perimeter of
the covering member and then removing an excessive adhesive with a
squeegee leads to a high material cost and a high apparatus
cost.
[0009] When applying an adhesive to a perimeter of a covering
member with a high accuracy by using a dispenser, it is necessary,
for instance, to set a dispenser needle diagonally to the perimeter
so that the dispenser needle may not contact with the covering
member. Consequently the organic electroluminescence display
devices further have a problem that a robot-moving mechanism
becomes complicated in order to adjust an angle of the dispenser
needle and rotate the dispenser needle, whereby an apparatus cost
increases.
SUMMARY OF THE INVENTION
[0010] The present invention provides an organic light-emitting
device which can prevent damage, peeling-off, and the like of a
covering member, and which can be manufactured with excellent
productivity and cost performance; and a method of manufacturing
the organic light-emitting device.
[0011] In order to solve the above-described problems of the prior
art, the present invention provides a method of manufacturing an
organic light-emitting device which includes a substrate; an
organic light-emitting element arranged on the substrate and
including a pair of electrodes and an organic compound layer formed
between the pair of the electrodes; a covering member arranged on
the organic light-emitting element, for covering the organic
light-emitting element; and an adhesive member for adhering an end
of the covering member and an end of the substrate, the method
including: a step of arranging, on the organic light-emitting
element, the covering member having a chamfer formed on a side of
one face thereof so that a face of the covering member on a reverse
side to the one face faces to a side of the organic light-emitting
element; and a step of adhering a side part of the covering member
and a face of the substrate on a side of the covering member by
dripping the adhesive member to the chamfer from above of the one
face.
[0012] An organic light-emitting device according the present
invention includes: a substrate; an organic light-emitting element
formed on the substrate, and including a pair of electrodes and an
organic compound layer formed between the pair of the electrodes; a
covering member arranged on the organic light-emitting element, for
covering the organic light-emitting element, the covering member
having a chamfer formed on a side of a face thereof on a reverse
side to the organic light-emitting element; and an adhesive member
for adhering the substrate and the covering member by adhering a
side part of the covering member and a face of the substrate on a
side of the covering member.
[0013] In a method of manufacturing an organic light-emitting
device according to the present invention, the chamfer is formed on
the end of the top face of a covering member. Therefore, the
manufactured organic light-emitting device can prevent damage,
peeling-off, and the like of the covering member because even when
the covering member receives a water pressure in a cleaning step
and a physical impact force after an organic light-emitting element
has been covered with the covering member, the water pressure and
the physical impact force do not act on the covering member as an
external peeling force.
[0014] In addition, the covering member can be placed on an
intended position because the adhesive member attached to the
chamfer naturally flows down toward the substrate only by covering
the organic light-emitting element with the covering member and
dripping the adhesive member on the chamfer formed on the side of a
face of the covering member on a reverse side to the organic
light-emitting element. Accordingly, the manufacturing method shows
excellent productivity and cost performance because the method
enables the organic light-emitting element to be easily and
reliably covered with the covering member without using a
high-precision dispenser device for an operation of covering the
organic light-emitting element and without removing an excessive
adhesive member by a squeegee.
[0015] Further features of the present invention will become
apparent from the following description of exemplary embodiments
with reference to the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1A is a schematic cross-sectional view illustrating an
organic light-emitting device and a method of manufacturing the
organic light-emitting device, in Embodiment 1 (Example 1)
according to the present invention.
[0017] FIG. 1B is an enlarged view of a chamfer.
[0018] FIG. 1C is a plan view of FIG. 1A.
[0019] FIG. 2 is a schematic cross-sectional view illustrating an
organic light-emitting device and a method for manufacturing the
organic light-emitting device, in Embodiment 2 (Example 2)
according to the present invention.
[0020] FIG. 3 is a schematic cross-sectional view illustrating an
organic light-emitting device and a method for manufacturing the
organic light-emitting device, in Embodiment 3 (Example 3)
according to the present invention.
[0021] FIG. 4 is a schematic cross-sectional view illustrating an
organic light-emitting device and a method for manufacturing the
organic light-emitting device, in Embodiment 4 (Example 4)
according to the present invention.
[0022] FIG. 5 is a schematic cross-sectional view illustrating a
conventional organic light-emitting device and a conventional
method for manufacturing the organic light-emitting device.
[0023] FIG. 6 is a schematic cross-sectional view illustrating a
conventional organic light-emitting device and a conventional
method for manufacturing the organic light-emitting device.
[0024] FIG. 7 is a schematic cross-sectional view illustrating a
conventional organic light-emitting device and a conventional
method for manufacturing the organic light-emitting device.
DESCRIPTION OF THE EMBODIMENTS
[0025] The best mode of an organic light-emitting device and a
method for manufacturing the organic light-emitting device
according to the present invention will be now described with
reference to the accompanying drawings.
Embodiment 1
[0026] FIG. 1A is a schematic cross-sectional view illustrating an
organic light-emitting device and a method of manufacturing the
organic light-emitting device, in Embodiment 1 according to the
present invention. FIG. 1B is an enlarged view of a chamfer. FIG.
1C is a plan view of FIG. 1A.
[0027] An organic light-emitting device shown in FIGS. 1A to 1C has
an organic light-emitting element (organic electroluminescence
element) 2, an intermediate layer 3 which is formed so as to cover
the organic light-emitting element 2, and a covering member (flat
glass plate) 4 which is formed on the upper face of the
intermediate layer 3 as a so-called sealing plate, sequentially
aligned and fixed on the upper face of a substrate 1 such as a
glass plate. Incidentally, the organic light-emitting element 2 has
a structure having a first electrode (not shown), an organic
compound layer (not shown) and a second electrode (not shown). The
organic light-emitting device has an insulation layer 5 and a
drawing wiring 6 as shown in FIG. 1C, in other words, has a
structure fundamentally similar to a conventional organic
light-emitting device.
[0028] The covering member 4 is made from glass, a resin, a metal
or the like, and has a chamfer 7 formed on a side of a face (end of
upper face) of the covering member 4 on a reverse side to the
organic light-emitting element (cf. FIG. 1B). The covering member 4
receives a water pressure at the time of shower cleaning or jet
cleaning in a cleaning step after covering the organic
light-emitting element 2 with the covering member, and normally the
water pressure acts on the corner of the covering member as an
external peeling force for peeling the covering member 4. However,
the covering member 4 according to the present invention does not
receive the external peeling force because of the shape effect of a
chamfer 7 formed on an end of the upper face, and can prevent
itself from being damaged and peeled off.
[0029] When a covering member 4 is made of glass, a chamfer 7 is
formed by using a total mold grind stone in the step of cutting the
covering member 4 into a predetermined shape, or by polishing an
end thereof after having cut a glass plate (not shown). When the
covering member 4 is made of a resin, it is easily formed into a
mold shape by using a molding technique (not shown). The chamfer 7
can have a chamfered angle .theta. in a range of 30 to 60 degrees.
Alternatively, when the chamfer 7 has a round shape, an effect in
the present invention can be expected in particular. However, the
chamfer 7 can have the shape with the angle .theta. of 45 degrees
because the shape can be economically formed, and the effect of the
present invention is obtained.
[0030] A normal dispenser device (not shown) has an XYZ shaft robot
(not shown) for controlling a position of a dispenser needle 8, and
the position accuracy is about .+-.0.2 mm. Accordingly, when a
chamfered length (L) of a chamfer 7 on a covering member 4, which
indicates the horizontal length of a chamfered portion of the cover
member as shown in FIG. 1B, is set to 0.2 mm or more, an adhesive
member 9 as a sealing agent ejected from the vertically
downward-directing dispenser needle 8 can be dripped on a chamfer 7
even when the center position of ejection of the dispenser is
deviated from the intended position. In other words, the dispenser
device can reliably drop the adhesive member 9 onto the chamfer 7
of the covering member 4 within an accuracy of the XYZ shaft robot
itself. Incidentally, the dispenser device goes around a perimeter
of the covering member 4 on a substrate 1 while the position is
controlled by the XYZ shaft robot, and the ejecting step of the
dispenser needle 8 is completed.
[0031] An adhesive member 9 dropped on a chamfer 7 flows down along
the slope of the chamfer 7, is placed at an intended position
(namely perimeters of intermediate layer 3 and covering member 4),
covers the upper face of a substrate 1 and the border between the
intermediate layer 3 and the covering member 4, and simultaneously
adheres the covering member 4 and the substrate 1. As a result, an
organic light-emitting element 2 is sealed at the perimeters by the
covering member 4 and the adhesive member 9 so as not cause leakage
(cf. FIG. 1C). Here, the adhesive member 9 can be such a material
as to easily flow down on the chamfer 7 of the covering member 4
and be quickly hardened without giving damage to the organic
light-emitting element 2 after having been placed at the intended
position. The adhesive member 9 can be an epoxy resin having a
viscosity, for instance, of 40,000.+-.10,000 (mPas).
[0032] As described above, an adhesive member 9 can be placed at an
intended position merely by covering an organic light-emitting
element 2 with a covering member, and applying the adhesive member
9 onto the chamfer 7 which has been formed on a side of a face (end
of a upper face) of the covering member 4 on a reverse side to the
organic light-emitting element side. Accordingly, the
above-described method shows excellent productivity and cost
performance, because the method enables the organic light-emitting
element 2 to be easily and reliably covered with the covering
member, without using a high-precision dispenser device for an
operation of covering the organic light-emitting element 2 or
without removing an excessive adhesive member by a squeegee.
Embodiment 2
[0033] FIG. 2 is a schematic cross-sectional view illustrating an
organic light-emitting device and the method of manufacturing the
organic light-emitting device, in Embodiment 2 according to the
present invention.
[0034] An organic light-emitting device shown in FIG. 2 has an
organic light-emitting element 2 which is covered with a covering
member 10 made of an etched covering glass plate. The lower face
side of the glass plate is etched except the outer edge. On the
other hand, a chamfer 7 is formed on an end of the upper face
reverse to the etched face. Accordingly, the covering member 10
does not receive a peeling force by the shape effect, and can
prevent itself from being damaged and peeled off.
[0035] In addition, an adhesive member 9 as a sealing agent can be
placed at an intended position by dripping on the chamfer 7 the
adhesive member ejected from a vertically downward-directing
dispenser needle 8, and allowing the adhesive member 9 dripped on
the chamfer 7 to flow down along a slope of the chamfer 7, even
when the center position of ejection of the dispenser is deviated
from the intended position. Accordingly, the organic light-emitting
device can be manufactured with excellent productivity and cost
performance, because the organic light-emitting element 2 can be
easily and reliably covered with a covering member, without using a
high-precision dispenser device for an operation of covering the
organic light-emitting element 2 or without removing an excessive
adhesive member by a squeegee.
Embodiment 3
[0036] FIG. 3 is a schematic cross-sectional view illustrating an
organic light-emitting device and the method of manufacturing the
organic light-emitting device, in Embodiment 3 according to the
present invention.
[0037] An organic light-emitting device shown in FIG. 3 has an
organic light-emitting element 2 covered with a covering member 11
formed of a polarizing plate made of a PVA resin, and a chamfer 7
is formed on an end of the upper face of the covering member 11.
Therefore, the covering member 11 also does not receive an external
peeling force by the shape effect, and can prevent itself from
being damaged and peeled off.
[0038] In addition, an adhesive member 9 as a sealing agent can be
placed at an intended position by dripping the adhesive member
ejected from a vertically downward-directing dispenser needle 8 on
the chamfer 7, and allowing the adhesive member 9 dripped on the
chamfer 7 to flow down along a slope of the chamfer 7 even when the
center position of ejection of the dispenser is deviated from the
intended position. Accordingly, the organic light-emitting device
can be manufactured with excellent productivity and cost
performance, because the organic light-emitting element 2 can be
easily and reliably covered with a covering member, without using a
high-precision dispenser device in an operation of covering the
organic light-emitting element 2 or without removing an excessive
adhesive member by a squeegee.
Embodiment 4
[0039] FIG. 4 is a schematic cross-sectional view illustrating an
organic light-emitting device and the method of manufacturing the
organic light-emitting device, in Embodiment 4 according to the
present invention.
[0040] An organic light-emitting device shown in FIG. 4 has an
organic light-emitting element 2 covered with a covering member 12
formed of a flat covering glass plate, and a rounded chamfer 7 is
formed on an end of the upper face of the covering member 12.
Therefore, the covering member 12 also does not receive an external
peeling force by the shape effect, and can prevent itself from
being damaged and peeled off.
[0041] In addition, an adhesive member 9 as a sealing agent can be
placed at an intended position by dripping the adhesive member
ejected from a vertically downward-directing dispenser needle 8 on
the chamfer 7, and allowing the adhesive member 9 dripped on the
chamfer 7 to flow down along a slope of the chamfer 7 even when the
center position of ejection of the dispenser is deviated from the
intended position. Accordingly, the organic light-emitting device
can be manufactured with excellent productivity and cost
performance, because the organic light-emitting element 2 can be
easily and reliably covered with a covering member, without using a
high-precision dispenser device in an operation of covering the
organic light-emitting element 2 or without removing an excessive
adhesive member by a squeegee.
[0042] Incidentally, the above-described embodiments show one mode
of the present invention and the present invention is not limited
thereto. Specifically, a covering member 4 is expressed as a
protective member in other words, and the material also can be
widely selected. It is possible to employ a form in which a
polarizing plate having a chamfer is further adhered as the
covering member onto the upper face of a covering glass plate
provided with the chamfer (not shown), and furthermore, an adhesive
member may not be applied to the periphery of the polarizing plate
having the chamfer (not shown).
[0043] In the above-described embodiments, an adhesive member 9 is
continuously placed on all perimeters, namely, on four peripheral
sides of the covering member as a so-called sealing agent, but the
adhesive member 9 may also be partially placed at the perimeter of
the covering member only for the purpose of adhering the covering
member to a substrate.
EXAMPLE 1
[0044] A covering member 4 employed in the present example was
formed of a flat covering glass plate with a size of 35 mm.times.40
mm and a thickness of 0.6 mm, and had a chamfer 7 with a chamfered
length of 0.6 mm and a chamfered angle of 45 degrees formed on an
end of the top face of the covering member 4 (cf. FIG. 1).
[0045] A step of covering an organic light-emitting element will be
now described below. The organic light-emitting element 2, an
intermediate layer 3 and a covering member 4 were sequentially
aligned and fixed on a substrate 1 with a size of 40 mm.times.50 mm
and a thickness of 0.6 mm. Subsequently, the adhesive member 9 was
ejected to all the perimeters of the above-described covering
member 4 by a dispenser needle 8. The adhesive member 9 which had
been dripped on a chamfer 7 of the covering member 4 flowed
downward and was placed at the perimeters of the intermediate layer
3 and the covering member 4 with high accuracy.
EXAMPLE 2
[0046] A covering member 10 employed in the present example was
formed of an etched covering glass plate with a size of 35
mm.times.40 mm and a thickness of 1.0 mm (cf. FIG. 2). A bottom
side of the covering member 10 was etched in a depth of 0.4 mm
except for a frame (base to be adhered) with the width of 1 mm
prepared in the perimeter. On the other hand, a chamfer 7 with a
chamfered angle of 45 degrees was formed on an end of the upper
face reverse to the etched face.
[0047] A step of covering an organic light-emitting element will be
now described below. The organic light-emitting element 2 was
formed on a substrate 1 with a size of 40 mm.times.50 mm and a
thickness of 0.6 mm. Subsequently, a sealing material 13 was
ejected to a position on which a base to be adhered of a covering
member 10 was placed on the substrate 1, by a normal dispenser
device (not shown) having a position accuracy of .+-.0.2 mm. The
covering member 10 was then aligned on the above-described
substrate 1, closely contacted with it, and adhered to the
substrate 1 by the sandwiched sealing material 13. Subsequently, an
adhesive member 9 was ejected to all the perimeters of the covering
member 10 on the substrate 1 by a dispenser needle 8, similarly to
the case of Example 1. The adhesive member 9 which had been dripped
on a chamfer 7 of the covering member 10 flowed downward, and was
placed at a perimeter of the covering member 10 with high accuracy.
At the same time, a sealed space 14 was formed.
EXAMPLE 3
[0048] A covering member 11 employed in the present example was
formed of a polarizing plate made from a PVA resin with a size of
35 mm.times.40 mm and a thickness of 0.3 mm, and had a chamfer 7
with a chamfered angle of 45 degrees formed on an end of the upper
face (cf. FIG. 3).
[0049] A step of covering an organic light-emitting element will be
now described below. The organic light-emitting element 2, an
intermediate layer 3 and a covering member 11 were sequentially
aligned and fixed on a substrate 1 with a size of 40 mm.times.50 mm
and a thickness of 0.6 mm. Subsequently, an adhesive member 9 was
ejected to all the perimeters of the above-described covering
member 11 by a dispenser needle 8, similarly to the case of Example
1. The adhesive member 9 which had been dripped on a chamfer 7 of
the covering member 11 flowed downward and was placed at the
perimeters of the intermediate layer 3 and the covering member 11
with high accuracy.
EXAMPLE 4
[0050] A covering member 12 employed in the present example was
formed of a flat covering glass plate with a size of 35 mm.times.40
mm and a thickness of 0.6 mm, and had roundness (chamfer) 7 with a
curvature of R1 made by a chamfering operation formed on the upper
part (cf. FIG. 4).
[0051] A step of covering an organic light-emitting element will be
now described below. The organic light-emitting element 2, an
intermediate layer 3 and a covering member 12 were sequentially
aligned and fixed on a substrate 1 with a size of 40 mm.times.50 mm
and thickness of 0.6 mm. Subsequently, an adhesive member 9 was
ejected to all the perimeters of the above-described covering
member 12 by a dispenser needle 8, similarly to the case of Example
1. The adhesive member 9 which had been dripped on a chamfer 7 of
the covering member 12 flowed downward and was placed at the
perimeters of the intermediate layer 3 and the covering member 12
with high accuracy.
COMPARATIVE EXAMPLE 1
[0052] A covering member 15 employed in the present comparative
example was formed of a flat covering glass plate having a size of
35 mm.times.40 mm and a thickness of 0.6 mm and having no chamfer
thereon (cf. FIG. 5).
[0053] A step of covering an organic light-emitting element will be
now described below. The organic light-emitting element 2, an
intermediate layer 3 and a covering member 15 were sequentially
aligned and fixed on a substrate 1 with a size of 40 mm.times.50 mm
and a thickness of 0.6 mm. Subsequently, an adhesive member 9 was
ejected to all perimeters of the covering member 15 by a dispenser
needle 8, similarly to the case of Example 1. The adhesive member 9
was placed at a position outwardly greatly deviated from an
intended position because the center position of the adhesive
member 9 applied by the dispenser needle 8 was outwardly deviated
from the intended position by 0.2 mm. Accordingly, the organic
light-emitting element 2 could not be sealed by the adhesive member
9 and the covering member 15, and besides, the covering member 15
could not be adhered to the substrate 1.
COMPARATIVE EXAMPLE 2
[0054] A covering member 16 employed in the present comparative
example was also formed of a flat covering glass plate having a
size of 35 mm.times.40 mm and a thickness of 0.6 mm thick and
having no chamfer thereon (cf. FIG. 6).
[0055] A step of covering an organic light-emitting element will be
now described below. The organic light-emitting element 2, an
intermediate layer 3 and a covering member 16 were sequentially
aligned and fixed on a substrate 1 with a size of 40 mm.times.50 mm
and a thickness of 0.6 mm. Subsequently, an adhesive member 9 was
ejected to all the perimeters of the covering member 16 by a
dispenser needle 8, similarly to the case of Example 1. The
adhesive member 9 was placed on the upper face of the covering
member 16, which is inwardly greatly deviated from an intended
position, and showed an inadequate shape, because the center
position of the adhesive member 9 applied by the dispenser needle 8
was inwardly deviated from the intended position by 0.2 mm.
COMPARATIVE EXAMPLE 3
[0056] A covering member 17 employed in the present comparative
example was also formed of a flat covering glass plate having a
size of 35 mm.times.40 mm and a thickness of 0.6 mm and having no
chamfer thereon (cf. FIG. 7).
[0057] A step of covering an organic light-emitting element will be
now described below. The organic light-emitting element 2, an
intermediate layer 3 and a covering member 17 were sequentially
aligned and fixed on a substrate 1 with a size of 40 mm.times.50 mm
and a thickness of 0.6 mm. Subsequently, a dispenser needle 8 was
set so as to form an angle of 45 degrees with respect to the
perimeter of the covering member 17, and an adhesive member 9 was
ejected to all the perimeters by the dispenser needle 8. In
addition, a position of a dispenser device was controlled by a
high-function robot provided with XYZ shafts and even a rotatable
shaft (not shown), and the adhesive member 9 was ejected to all the
perimeter of the covering member 17 on a substrate 1 by a dispenser
needle 8 while the formed angle of the dispenser needle 8 was kept
at 45 degrees. The organic light-emitting element 2 could be sealed
by the covering member 17 and the adhesive member 9 so as not to
cause leakage, and furthermore, the covering member 17 could be
adhered to the substrate 1 so that the adhesive member 9 might not
mount on the upper face of the covering member 17. However, this
step needed the expensive high-function robot for controlling such
a dispenser device as described above and caused increase in a
cost.
[0058] While the present invention has been described with
reference to exemplary embodiments, it is to be understood that the
invention is not limited to the disclosed exemplary embodiments.
The scope of the following claims is to be accorded the broadest
interpretation so as to encompass all such modifications and
equivalent structures and functions.
[0059] This application claims the benefit of Japanese Patent
Laid-Open No. 2006-080627, filed Mar. 23, 2006, and 2007-056761,
filed Mar. 7, 2007 which are hereby incorporated by reference
herein in their entirety.
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