U.S. patent application number 11/366117 was filed with the patent office on 2007-09-06 for method of manufacturing thin-film antenna.
This patent application is currently assigned to Air Wave Co., Ltd.. Invention is credited to Han-Lun Lin, Hsin-Chun Lu, Kun-Ta Lu.
Application Number | 20070207262 11/366117 |
Document ID | / |
Family ID | 38433109 |
Filed Date | 2007-09-06 |
United States Patent
Application |
20070207262 |
Kind Code |
A1 |
Lu; Kun-Ta ; et al. |
September 6, 2007 |
METHOD OF MANUFACTURING THIN-FILM ANTENNA
Abstract
A method of manufacturing a thin-film antenna is disclosed. A
substrate is provided and coated with an organic material layer.
After both of the substrate and organic material layer have been
dried, a conductive layer is formed on both the substrate and the
organic material layer. The organic material layer and the layer
thereon are then removed so that the remaining conductive layer
forms a thin-film antenna.
Inventors: |
Lu; Kun-Ta; (Taoyuan,
TW) ; Lu; Hsin-Chun; (Taoyuan, TW) ; Lin;
Han-Lun; (Taoyuan, TW) |
Correspondence
Address: |
APEX JURIS, PLLC;TRACY M HEIMS
LAKE CITY CENTER, SUITE 410
12360 LAKE CITY WAY NORTHEAST
SEATTLE
WA
98125
US
|
Assignee: |
Air Wave Co., Ltd.
Lu-Chu Hsian
TW
|
Family ID: |
38433109 |
Appl. No.: |
11/366117 |
Filed: |
March 2, 2006 |
Current U.S.
Class: |
427/58 ;
204/192.15; 427/256; 427/372.2; 427/421.1; 427/532 |
Current CPC
Class: |
H05K 3/048 20130101;
H01Q 1/2283 20130101; H05K 3/16 20130101 |
Class at
Publication: |
427/058 ;
427/421.1; 427/256; 427/532; 427/372.2; 204/192.15 |
International
Class: |
B05D 5/12 20060101
B05D005/12; B05D 5/00 20060101 B05D005/00; B05D 3/00 20060101
B05D003/00; B05D 7/00 20060101 B05D007/00; C23C 14/00 20060101
C23C014/00 |
Claims
1. A method of manufacturing a film antenna, comprising the steps
of: providing a substrate; patterning an organic material layer on
said substrate; drying said substrate and said organic material
layer; forming a conductive layer on said substrate and said
organic material layer; and removing said organic material layer
and said layer thereon.
2. The method as claimed in claim 1, wherein said substrate is the
material selected from the group consisting of polyimide,
polyethylene terephthalate, polycarbonate, polymethyl methacrylate,
glass, and acrylic resin.
3. The method as claimed in claim 1, wherein said organic material
layer is patterned by a screen printing technique.
4. The method as claimed in claim 1, wherein said organic material
layer is patterned by a spray coating technique.
5. The method as claimed in claim 1, wherein said organic material
layer is the material selected from the group consisting of
heat-dry ink, water soluble resin, water soluble lactoprene, and
water soluble polyvinyl alcohol.
6. The method as claimed in claim 1, wherein said substrate and
said organic material layer are dried by heating.
7. The method as claimed in claim 1, wherein said substrate and
said organic material layer are dried by ultraviolet radiation.
8. The method as claimed in claim 1, wherein said conductive layer
is formed by an evaporation coating technique.
9. The method as claimed in claim 1, wherein said conductive layer
is formed by a sputtering technique.
10. The method as claimed in claim 1, wherein said conductive layer
is the material selected from the group consisting of copper,
nickel copper alloy, and silver.
11. The method as claimed in claim 1, wherein said conductive layer
has a thickness in the range between 2000-5000 .ANG..
12. The method as claimed in claim 1, wherein said organic material
layer and said conductive layer thereon are removed by the liquid
selected from the group consisting of water and acid solution.
13. A method of manufacturing a film antenna, comprising the steps
of: providing a substrate; patterning an organic material layer on
said substrate; drying said substrate and said organic material
layer; forming a conductive layer on said substrate and said
organic material layer; and forming a protective layer on said
conductive layer; and removing said organic material layer and said
layers thereon.
14. The method as claimed in claim 13, wherein said substrate is
the material selected from the group consisting of polyimide,
polyethylene terephthalate, polycarbonate, polymethyl methacrylate,
glass, and acrylic resin.
15. The method as claimed in claim 13, wherein said organic
material layer is patterned by a screen printing technique.
16. The method as claimed in claim 13, wherein said organic
material layer is patterned by a spray coating technique.
17. The method as claimed in claim 13, wherein said organic
material layer is the material selected from the group consisting
of heat-dry ink, water soluble resin, water soluble lactoprene, and
water soluble polyvinyl alcohol.
18. The method as claimed in claim 13, wherein said substrate and
said organic material layer are dried by heating.
19. The method as claimed in claim 13, wherein said substrate and
said organic material layer are dried by ultraviolet radiation.
20. The method as claimed in claim 13, wherein said conductive
layer is formed by an evaporation coating technique.
21. The method as claimed in claim 13, wherein said conductive
layer is the material selected from the group consisting of copper
alloy, and silver.
22. The method as claimed in claim 13, wherein said conductive
layer has a thickness in the range between 2000-5000 .ANG..
23. The method as claimed in claim 13, wherein said conductive
layer and said protective layer are formed by a sputtering
technique.
24. The method as claimed in claim 13, wherein said organic
material layer and said layers thereon are removed by the liquid
selected from the group consisting of water and acid solution.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of Invention
[0002] The present invention relates to a method of manufacturing
antenna, and more particularly, to a method of manufacturing
thin-film antenna.
[0003] 2. Description of Related Art
[0004] An antenna is an electronic component designed to transmit
or receive radio waves. Prior types of antennas include wired
antenna, etched antenna, and printed antenna. The wired antenna,
which is a metallic or conductive wire looped around a core to form
a coil, is normally used for low-frequency electromagnetic wave
transmission. Etched antenna is manufactured by using acid solution
to etch metallic material such as copper or aluminum so that the
etched metallic material forms the patterned antenna. The
manufacture cost and the use of acid solution, however, are the
main concerns that need to be considered. As the printing technique
has been improving, a substrate may be printed with conductive
material on its surface to form a printed antenna. Precise
positioning of the conductive material on the substrate during
printing is most important but yet still difficult to achieve
satisfactorily.
SUMMARY OF THE INVENTION
[0005] An object of the invention is to provide an applicable,
cost-effective, and environmental friendly thin-film antenna.
[0006] Another object of the invention is to provide a thin-film
antenna widely incorporated in wireless communication devices.
[0007] To achieve the above objects, the invention provides a
method of manufacturing thin-film antenna comprising the steps of:
providing a substrate, patterning an organic material layer on the
substrate, drying the substrate and the organic material layer,
forming a conductive layer on both the substrate and the organic
material layer, and removing the organic material layer and the
conductive layer thereon.
[0008] To achieve the above objects, the invention provides another
method of manufacturing a thin-film antenna, comprising the steps
of: providing a substrate, patterning an organic material layer on
the substrate, drying the substrate and the organic material layer,
forming a conductive layer on both the substrate and the organic
material layer, forming a protective layer on the conductive layer,
and removing the organic material layer and the layers thereon.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1A is a diagrammatic cross sectional view of a
substrate of the first embodiment.
[0010] FIG. 1B is a diagrammatic cross-sectional view of an organic
material layer coated on the substrate according to the first
embodiment.
[0011] FIG. 1C is a diagrammatic cross-sectional view of the
substrate and the organic material layer being dried by ultraviolet
radiation according to the first embodiment.
[0012] FIG. 1D is a diagrammatic cross-sectional view of a
conductive layer formed on the organic material layer and the
substrate according to the first embodiment.
[0013] FIG. 1E is a diagrammatic cross-sectional view of the
conductive layer after the organic material layer and the
conductive layer thereon have been removed according to the first
embodiment.
[0014] FIG. 1F is a diagrammatic cross-sectional view of a
thin-film antenna of the first embodiment.
[0015] FIG. 2A is a diagrammatic cross-sectional view of a
substrate of the second embodiment.
[0016] FIG. 2B is a diagrammatic cross-sectional view of an organic
material layer coated on the substrate according to the second
embodiment.
[0017] FIG. 2C is a diagrammatic cross-sectional view of the
substrate and the organic material layer being dried by the
ultraviolet radiation according to the second embodiment.
[0018] FIG. 2D is a diagrammatic cross-sectional view of a
conductive layer formed on the organic material layer and the
substrate according to the second embodiment.
[0019] FIG. 2E is a diagrammatic cross-sectional view of a
protective layer coated on the conductive layer according to the
second embodiment.
[0020] FIG. 2F is a diagrammatic cross-sectional view of the
protective layer and the conductive layer after removing the
organic material layer and the layers thereon according to the
second embodiment.
[0021] FIG. 2G is a diagrammatic cross-sectional view of a
thin-film antenna of the second embodiment.
DETAILED DESCRIPTION
[0022] Referring to FIGS. 1A-1F, a thin-film antenna of the first
embodiment is disclosed.
[0023] Referring to FIG. 1A, a substrate 10 is provided. The
materials of the substrate may include polyimide, polyethylene
terephthalate (PET), polycarbonate (PC), polymethyl methacrylate
(PMMA), glass, acrylic resin or other materials with similar
properties.
[0024] Referring to FIG. 1B, by screen printing technique, the
substrate 10 is coated with a patterned organic material layer 20
on its surface. The organic materials may include heat-dry ink,
water soluble resin, water soluble lactoprene, water soluble
polyvinyl alcohol (PVA) or other materials having similar organic
properties. In one embodiment, the formation of the organic
material layer 20 may also include spray coating technique, in
which the organic material layer 20 is sprayed on the substrate
10.
[0025] Referring to FIG. 1C, the ultraviolet (UV) radiation is used
to dry both the surfaces of substrate 10 and organic material layer
20. In one embodiment, they may be heated for drying of the
surfaces.
[0026] Referring to FIG. 1D, with sputtering technique, a
conductive layer 30 is deposited on both the substrate 10 and the
organic material layer 20. The conductive layer 30 may have the
thickness in the range between 2000-5000 .ANG.. In the preferred
embodiment, the conductive layer may have the thickness of 3000
.ANG.. The conductive layer is a metallic material such as copper
(Cu), nickel copper (NiCu) alloy or silver (Ag). In addition to the
sputtering technique, the conductive layer may be formed by
evaporation coating technique.
[0027] Referring to FIGS. 1E-1F, both the organic material layer 20
and the conductive layer 30 thereon are removed by water so that
the remaining conductive layer forms a thin-film antenna 50. In one
embodiment, acid solution may be used for removal purpose.
[0028] Referring to FIGS. 2A-2F, a thin-film antenna of the second
embodiment is disclosed.
[0029] Referring to FIG. 2A, a substrate 10 is provided. The
materials of the substrate may include polyimide, polyethylene
terephthalate (PET), polycarbonate (PC), polymethyl methacrylate
(PMMA), glass, acrylic resin or other materials with similar
properties.
[0030] Referring to FIG. 2B, by screen printing technique, the
substrate 10 is coated with a patterned organic material layer 20
on its surface The organic materials may include heat-dry ink,
water soluble resin, water soluble lactoprene, water soluble
polyvinyl alcohol (PVA) or other materials having similar organic
properties. In one embodiment, the formation of the organic
material layer 20 may also include spray coating technique, in
which the organic material layer 20 is sprayed on the substrate
10.
[0031] Referring to FIG. 2C, the ultraviolet (UV) radiation is used
to dry both the surfaces of substrate 10 and organic material layer
20. In one embodiment, they may be heated for drying of the
surfaces.
[0032] Referring to FIG. 2D, with sputtering technique, a
conductive layer 30 is deposited on both the substrate 10 and the
organic material layer 20. The conductive layer 30 may have the
thickness in the range between 2000-5000 .ANG.. In the preferred
embodiment, the conductive layer may have the thickness of 3000
.ANG.. The conductive layer is a metallic material such as copper
(Cu), nickel copper (NiCu) alloy or silver (Ag). In addition to the
sputtering technique, the conductive layer may be formed by
evaporation coating technique.
[0033] Referring to FIG. 2E, an anti-oxidation material is coated
on the conductive layer 30 to form a protective layer 40. Metallic
material, for example nickel, with the technique such as
evaporation coating or sputtering may be used to form the
protective layer.
[0034] Referring to FIGS. 2F-2G, the organic material layer 20 and
the layers 30, 40 thereon are removed by water so that the
remaining portion of the layer 30, 40 forms a thin-film antenna 50.
In one embodiment, acid solution may be used for removal
purpose.
[0035] The method of manufacturing a thin-film antenna of the
invention comprises providing a substrate, patterning an organic
material layer on the substrate, drying the organic material layer
and the substrate, forming a conductive layer on both the substrate
and the organic material layer, and removing the organic material
layer and the conductive layer thereon, thereby the thin-film
antenna is formed. The thin-film antenna of the invention is
applicable and cost-effective. Using water to remove undesirable
layers is environmental friendly.
[0036] The thin-film antenna of the invention may incorporate in
wireless communication devices such as cellular phone, wireless
access point (AP), wireless router, wireless gateway, radio
frequency identification (RFID) devices, and laptop computer for
transmitting and receiving radio waves.
[0037] Although the invention has been described in terms of
exemplary embodiments, it is not limited thereto. Rather, the
appended claims should be considered broadly, to include other
variants and embodiments of the invention, which may be made by
those skilled in the art without departing from the scope and range
of equivalents of the invention.
* * * * *