U.S. patent application number 11/738522 was filed with the patent office on 2007-08-16 for light emitting diode illumination apparatus and heat dissipating method therefor.
This patent application is currently assigned to ADVANCED THERMAL DEVICE INC.. Invention is credited to Bin-Juine Huang, Yi-Hai Lian, Fu-Sheng Sun.
Application Number | 20070189012 11/738522 |
Document ID | / |
Family ID | 34546319 |
Filed Date | 2007-08-16 |
United States Patent
Application |
20070189012 |
Kind Code |
A1 |
Huang; Bin-Juine ; et
al. |
August 16, 2007 |
LIGHT EMITTING DIODE ILLUMINATION APPARATUS AND HEAT DISSIPATING
METHOD THEREFOR
Abstract
A light emitting diode (LED) illumination apparatus including an
illumination module, a heat dissipating unit and a loop heat pipe
(LHP) device is provided. The illumination module includes a base
and many LEDs. The LEDs are disposed on the base. The LHP device
contains working fluid and includes an evaporator, a condenser, a
first transmitting pipe and a second transmitting pipe. The
evaporator is associated with the base and has an outlet, an inlet
and a chamber. The condenser is conformably associated with the
heat dissipating unit. The condenser has an inlet and an outlet,
wherein at least one part of the condenser stretches in a curved
pipe shape along a surface of the heat dissipating unit. The first
transmitting pipe communicates the evaporator outlet to the
condenser inlet. The second transmitting pipe communicates the
condenser outlet to the evaporator inlet.
Inventors: |
Huang; Bin-Juine; (Taipei
City, TW) ; Lian; Yi-Hai; (Taichung City, TW)
; Sun; Fu-Sheng; (Taipei County, TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100
ROOSEVELT ROAD, SECTION 2
TAIPEI
100
TW
|
Assignee: |
ADVANCED THERMAL DEVICE
INC.
B2F, No.3, Wanning St., Wunshan District,
Taipei City
TW
116
|
Family ID: |
34546319 |
Appl. No.: |
11/738522 |
Filed: |
April 23, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10948151 |
Sep 24, 2004 |
7210832 |
|
|
11738522 |
Apr 23, 2007 |
|
|
|
Current U.S.
Class: |
362/294 |
Current CPC
Class: |
F28D 15/043 20130101;
F21V 29/56 20150115; F21V 29/77 20150115; F21Y 2115/10 20160801;
F21V 29/51 20150115 |
Class at
Publication: |
362/294 |
International
Class: |
F21V 29/00 20060101
F21V029/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 26, 2003 |
TW |
92126707 |
Claims
1. A heat dissipating method for a light emitting diode (LED)
illumination apparatus, comprising: using a loop heat pipe (LHP)
device to associate an illumination module of said LED illumination
apparatus with a heat dissipating unit of said LED illumination
apparatus, wherein said LHP device contains working fluid therein
and has a condenser and an evaporator, said condenser communicates
with said evaporator, said illumination module has a base with a
plurality of LEDs thereon, said evaporator is associated with said
base, said condenser is conformably associated with said heat
dissipating unit, and at least one part of said condenser stretches
in a curved pipe shape along a surface of said heat dissipating
unit in order to utilize said surface of heat dissipating unit for
dissipating heat; and transmitting the heat generated from said
LEDs to said heat dissipating unit via said LHP device.
2. The heat dissipating method according to claim 1, wherein the
state of said working fluid in said evaporator is converted from
the liquid state into the vapor state by means of absorbing said
heat generated from said LEDs, said working fluid at the vapor
state in said evaporator is transmitted to said condenser, the heat
of said working fluid at the vapor state in said condenser is
dissipated via said heat dissipating unit to convert the state of
said working fluid from the vapor state into the liquid state, and
said working fluid at the liquid state in said condenser is then
transmitted back to said evaporator.
3. The heat dissipating method according to claim 2, wherein
transmitting said working fluid from said evaporator to said
condenser and transmitting said working fluid from said condenser
back to said evaporator are accomplished by the capillarity effect
of a porous member mounted in said evaporator.
4. The heat dissipating method according to claim 1, wherein said
heat generated from said LEDs is conducted to said evaporator via
said base.
5. The heat dissipating method according to claim 4, wherein said
base is also associated with said heat dissipating unit, and said
heat generated from said LEDs is also conducted from said base to
said heat dissipating unit directly.
6. The heat dissipating method according to claim 1, further
comprising using an electric fan disposed beside said condenser
and/or said heat dissipating unit to help dissipate said heat
away.
7. The heat dissipating method according to claim 1, wherein the
step of associating said LHP device with said illumination module
comprises adhering at least one part of said condenser to a surface
of said heat dissipating unit with an adhesive or welding at least
one part of said condenser on a surface of said heat dissipating
unit.
8. The heat dissipating method according to claim 1, wherein the
step of associating said LHP device with said illumination module
comprises using a connector to connect at least one part of said
condenser and a surface of said heat dissipating unit, said
connector has a recess, and said part of said condenser is pressed
into said recess.
9. An LED illumination apparatus, comprising: an illumination
module, comprising: a base; and a plurality of LEDs, disposed on
said base; a heat dissipating unit; and an LHP device, containing
working fluid therein, said LHP device comprising: an evaporator,
associated with said base, said evaporator having an outlet, an
inlet, a chamber and a porous member disposed in said chamber; a
condenser, conformably associated with said heat dissipating unit,
said condenser having an inlet and an outlet, wherein at least one
part of said condenser stretches in a curved pipe shape along a
surface of said heat dissipating unit in order to utilize said
surface of heat dissipating unit for dissipating heat; a first
transmitting pipe, wherein one terminal of said first transmitting
pipe communicates with said outlet of said evaporator, and the
other terminal of said first transmitting pipe communicates with
said inlet of said condenser; and a second transmitting pipe,
wherein one terminal of said second transmitting pipe communicates
with said outlet of said condenser, and the other terminal of said
second transmitting pipe communicates with said inlet of said
evaporator.
10. The LED illumination apparatus according to claim 9, wherein
said heat dissipating unit is a housing of said illumination
module.
11. The LED illumination apparatus according to claim 10, wherein
at least parts of said condenser stretch in a curved pipe shape
along the interior surface and/or the exterior surface of said
housing.
12. The LED illumination apparatus according to claim 11, wherein
at least parts of said condenser stretch in a zigzag shape along
said interior surface and/or said exterior surface of said
housing.
13. The LED illumination apparatus according to claim 9, wherein
said heat dissipating unit is a cooling plate or a lampshade.
14. The LED illumination apparatus according to claim 9, wherein
said base is also associated with said heat dissipating unit.
15. The LED illumination apparatus according to claim 9, wherein
said porous member has a hollow space therein, said working fluid
at the liquid state is enveloped in said hollow space by said
porous member, and said porous member is suitable for being
permeated with said working fluid.
16. The LED illumination apparatus according to claim 9, wherein
said working fluid is selected from a group consisting of water,
acetone, ammonia and refrigerant.
17. The LED illumination apparatus according to claim 9, wherein
said condenser comprises at least one capillary pipe.
18. The LED illumination apparatus according to claim 9, wherein
said condenser is integrated with said heat dissipating unit for
forming a unity member.
19. The LED illumination apparatus according to claim 9, wherein
said base comprises: a circuit board, wherein said LEDs are
disposed on said circuit board; and a conducting unit, associated
between said circuit board and said evaporator.
20. The LED illumination apparatus according to claim 19, wherein
said conducting unit is a flat heat pipe or made of ceramic
material, polymeric material or metal.
21. The LED illumination apparatus according to claim 9, wherein
said base has a containing room in which said evaporator is
wedged.
22. The LED illumination apparatus according to claim 9, wherein
said base comprises: a circuit board, wherein said LEDs are
disposed on said circuit board; a clamping block, clamping said
evaporator; and a conducting unit, associated between said circuit
board and said clamping block.
23. The LED illumination apparatus according to claim 22, wherein
said clamping block has a containing room in which said evaporator
is wedged or a recess in which said evaporator is wedged.
24. The LED illumination apparatus according to claim 9, wherein
said base is a circuit board.
25. The LED illumination apparatus according to claim 9, wherein at
least one part of said condenser is adhered to a surface of said
heat dissipating unit with an adhesive or welded on the surface of
said heat dissipating unit.
26. The LED illumination apparatus according to claim 9, further
comprising at least one connector connected between at least one
part of said condenser and a surface of said heat dissipating unit,
wherein said connector has a recess, and said part of said
condenser is disposed in said recess.
27. The LED illumination apparatus according to claim 9, further
comprising an electric fan disposed beside said heat dissipating
unit and/or said condenser.
28. The LED illumination apparatus according to claim 9, wherein
the inside diameters of said condenser, said first transmitting
pipe and said second transmitting pipe are all less than 4 mm, and
the total length of said condenser, said first transmitting pipe
and said second transmitting pipe is longer than 600 mm.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation-in-part of a prior
application Ser. No. 10/948,151, filed on Sep. 24, 2004. The prior
application Ser. No. 10/948,151 claims the priority benefit of
Taiwan application serial no. 92126707, filed on Sep. 26, 2003.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an illumination apparatus
and a heat dissipating method therefor. More particularly, the
present invention relates to a light emitting diode (LED)
illumination apparatus and a heat dissipating method therefor.
[0004] 2. Description of Related Art
[0005] Light emitting diode (LED) has many advantages, such as
small volume, higher illumination efficiency, energy saving and so
on. Especially, the photo-electrical power conversion efficiency of
the light emitting diode has been rapidly improved during the last
twenty years, thus the light emitting diode is regarded as the main
illumination source in the future. For energy conservation, the
light emitting diode will certainly and gradually being substituted
for a lot kinds of today's illumination sources, such as light
bulbs.
[0006] Today, the light emitting diodes are applied popularly and
commonly used in traffic signal lights, electric broads, flash
lights, and so on. Although improving the high-power illuminating
technology or quality of the light emitting diodes is the future
trend and demanded urgently, such as demanded in the application of
reading light or protruding light, etc., that still exists some
technical bottlenecks to overcome. The main bottleneck for the
high-power illuminating technology is the insufficient heat
dissipation ability of the traditional illumination apparatus of
light emitting diodes often leads to the light emitting diodes in a
high operational temperature to decrease theirs service life,
further, even to cause them to burn down.
[0007] As a high-power or high-brightness LED illumination
apparatus concerned, such as above 30.about.100 W (watt), it is
hard to design an effective heat dissipation means for the LED
illumination apparatus without fans. A traditional method of
solving the heat dissipation problem is adapting a plurality of
cooling fins attached on a base of the illumination apparatus and
the heat generated from the light emitting diodes is conducted to
the cooling fins via the base, then using an electric fan to blow
the heat away, and thereby the heat is dissipated away. As the
above-mentioned descriptions, the traditional method of heat
dissipation usually requires a large space for setting up the
plurality of cooling fins near the illumination apparatus and
further needs to install an electric fan, that causes noise and
reliability problems when it was used outdoors.
[0008] Another method of heat dissipation is adapting a
conventional heat pipe device, however, the heat dissipation
ability is limited due to the rigidity of the conventional heat
pipe device and the limited length of conventional heat pipe
device, usually can not be longer than 30 cm. The heat dissipation
ability of a conventional heat pipe device is thus mostly less than
30 W. Therefore, the other traditional method also can not solve
the heat dissipation problem of the high-power LED illumination
apparatus effectively.
SUMMARY OF THE INVENTION
[0009] The present invention is directed to a heat dissipating
method for an LED illumination apparatus. The heat dissipating
method dissipates the heat generated by the LED illumination
apparatus away efficiently.
[0010] The present invention is further directed to an LED
illumination apparatus with better heat dissipating
characteristics.
[0011] A heat dissipating method for an LED illumination apparatus
is provided. The heat dissipating method comprises following steps:
using a loop heat pipe (LHP) device to associate an illumination
module of the LED illumination apparatus and a heat dissipating
unit of the LED illumination apparatus, and transmitting the heat
generated from the LEDs to the heat dissipating unit via the LHP
device. The LHP device contains working fluid therein and has a
condenser and an evaporator. The condenser communicates with the
evaporator. The illumination module has a base with a plurality of
LEDs thereon. The evaporator is associated with the base. The
condenser is comformably associated with the heat dissipating unit.
At least one part of the condenser stretches in a curved pipe shape
along a surface of the heat dissipating unit in order to utilize
said surface of heat dissipating unit for dissipating heat.
[0012] According to an embodiment of the present invention, the
state of the working fluid in the evaporator may be converted from
the liquid state into the vapor state by means of absorbing the
heat generated from the LEDs. The working fluid at the vapor state
in the evaporator may be transmitted to the condenser. The heat of
the vapor in the condenser may be dissipated via the heat
dissipating unit to convert the state of the working fluid from the
vapor state into the liquid state. The working fluid at the liquid
state in the condenser may be then transmitted back to the
evaporator. In addition, transmitting the working fluid from the
evaporator to the condenser and transmitting the working fluid from
the condenser back to the evaporator are accomplished by the
capillarity effect of a porous member mounted in the
evaporator.
[0013] According to an embodiment of the present invention, the
heat generated from the LEDs may be conducted to the evaporator via
the base. In addition, the base may be also associated with the
heat dissipating unit, and the heat generated from the LEDs may be
also conducted from the base to the heat dissipating unit
directly.
[0014] According to an embodiment of the present invention, the
heat dissipating method may further comprise using an electric fan
disposed beside the condenser and/or the heat dissipating unit to
help dissipate the heat away.
[0015] According to an embodiment of the present invention, the
step of associating the LHP device with the illumination module may
comprise adhering at least one part of the condenser to a surface
of the heat dissipating unit with an adhesive or welding at least
one part of the condenser on a surface of the heat dissipating
unit.
[0016] According to an embodiment of the present invention, the
step of associating the LHP device with the illumination module may
comprise using a connector to connect at least one part of the
condenser and a surface of the heat dissipating unit. The connector
has a recess, and the part of the condenser is pressed into the
recess.
[0017] An LED illumination apparatus is also provided. The LED
illumination apparatus comprises an illumination module, a heat
dissipating unit and an LHP device. The illumination module
comprises a base and a plurality of LEDs. The LEDs are disposed on
the base. The LHP device contains working fluid therein and
comprises an evaporator, a condenser, a first transmitting pipe and
a second transmitting pipe. The evaporator is associated with the
base and has an outlet, an inlet, a chamber and a porous member
disposed in the chamber. The chamber may contain the working fluid
at the liquid state therein. The condenser is conformably
associated with the heat dissipating unit. The condenser has an
inlet and an outlet. At least one part of the condenser stretches
in a curved pipe shape along a surface of the heat dissipating unit
in order to utilize said surface of heat dissipating unit for
dissipating heat. One terminal of the first transmitting pipe
communicates with the outlet of the evaporator, and the other
terminal of the first transmitting pipe communicates with the inlet
of the condenser. One terminal of the second transmitting pipe
communicates with the outlet of the condenser, and the other
terminal of the second transmitting pipe communicates with the
inlet of the evaporator.
[0018] According to an embodiment of the present invention, the
heat dissipating unit may be a housing of the illumination module.
In addition, at least parts of the condenser may stretch in a
curved pipe shape along the interior surface and/or the exterior
surface of the housing. Besides, at least parts of the condenser
may stretch in a zigzag shape along the interior surface and/or the
exterior surface of the housing.
[0019] According to an embodiment of the present invention, the
heat dissipating unit may be a cooling plate or a lampshade.
[0020] According to an embodiment of the present invention, the
base may also be associated with the heat dissipating unit.
[0021] According to an embodiment of the present invention, the
porous member has a hollow space therein. The working fluid at the
liquid state is enveloped in the hollow space by the porous member,
and the porous member is suitable for being permeated with the
working fluid.
[0022] According to an embodiment of the present invention, the
working fluid may be selected from a group consisting of water,
acetone, ammonia and refrigerant.
[0023] According to an embodiment of the present invention, the
condenser may comprise at least one capillary pipe.
[0024] According to an embodiment of the present invention, the
condenser may be integrated with the heat dissipating unit for
forming a unity member.
[0025] According to an embodiment of the present invention, the
base may comprise a circuit board and a conducting unit. The LEDs
are disposed on the circuit board. The conducting unit is
associated between the circuit board and the evaporator. In
addition, the conducting unit may be a flat heat pipe or made of
ceramic material, polymeric material or metal.
[0026] According to an embodiment of the present invention, the
base may have a containing room in which the evaporator is
wedged.
[0027] According to an embodiment of the present invention, the
base may comprise a circuit board, a clamping block and a
conducting unit. The LEDs are disposed on said circuit board. The
clamping block clamps the evaporator. The conducting unit is
associated between the circuit board and the clamping block. In
addition, the clamping block has a containing room in which the
evaporator is wedged or a recess in which said evaporator is
wedged.
[0028] According to an embodiment of the present invention, the
base is a circuit board, for example.
[0029] According to an embodiment of the present invention, at
least one part of the condenser may be adhered to a surface of the
heat dissipating unit with an adhesive or welded on the surface of
the heat dissipating unit.
[0030] According to an embodiment of the present invention, the LED
illumination apparatus may further comprise at least one connector
connected between at least one part of the condenser and a surface
of the heat dissipating unit. The connector has a recess, and the
part of the condenser is disposed in the recess.
[0031] According to an embodiment of the present invention, the LED
illumination apparatus may further comprise an electric fan
disposed beside the heat dissipating unit and/or the condenser.
[0032] According to an embodiment of the present invention, the
inside diameters of the condenser, the first transmitting pipe and
the second transmitting pipe may be all less than 4 mm, and the
total length of the condenser, the first transmitting pipe and the
second transmitting pipe may be longer than 600 mm.
[0033] According to the present invention, the heat generated from
the LEDs can be conducted to the heat dissipating unit via the base
and the LHP device. The LHP device has good heat transmitting
properties by using the working fluid filled therein to carry the
heat generated from the LEDs, such that the LED illumination
apparatus in the invention has better heat dissipating
characteristics. In addition, by means of using the LHP device to
associate the illumination module with the heat dissipating unit of
the LED illumination apparatus, the heat dissipating method in the
invention dissipates the heat generated from the LEDs
efficiently.
[0034] The above-mentioned contents of the present invention and
the following description of the embodiments are only for example,
not intended to limit the scope of the invention. Thus, many equal
variations and modifications of the following embodiments could be
made without departing form the spirit of the present invention and
should be covered by the following claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0035] The objectives, features of the present invention as well as
the advantages thereof can be best understood through the following
embodiments and the accompanying drawings, wherein:
[0036] FIG. 1A is a cross-sectional drawing of an LED illumination
apparatus according to an embodiment of the present invention.
[0037] FIG. 1B is a three-dimensional schematic drawing of parts of
the LED illumination in FIG. 1A.
[0038] FIG. 1C is a schematic drawing of the LHP device in FIG.
1A.
[0039] FIG. 1D is a schematic drawing of the cross-section A-A of
the evaporator shown in FIG. 1C.
[0040] FIG. 2A illustrates an LHP device and a clamping block of an
LED illumination apparatus according to another embodiment of the
present invention.
[0041] FIG. 2B is a schematic cross-sectional drawing of the
evaporator in FIG. 2A.
[0042] FIG. 2C illustrates an LHP device and a clamping block of an
LED illumination apparatus according to yet another embodiment of
the present invention.
[0043] FIG. 3 is the schematic drawing of a LED illumination
apparatus according to yet another embodiment of the present
invention.
[0044] FIG. 4 illustrates a base wedged with an evaporator
according to still another embodiment of the present invention.
[0045] FIG. 5A is a schematic drawing of an LED illumination
apparatus according to yet still another embodiment of the present
invention.
[0046] FIG. 5B is a three-dimensional schematic drawing of the
connector in FIG. 5A.
DESCRIPTION OF THE EMBODIMENTS
[0047] The invention will be explained in detail in accordance with
the accompanying drawings. It is necessary to illustrate that the
drawings in the below could be in simplified forms and not drawn in
proportion to the real cases. Further, the dimensions of the
drawings are enlarged for explaining and understanding more
clearly.
[0048] An LHP device has many kinds of characteristics or
advantages, for example, the high heat transmitting rate, the far
distance heat-transmitting property, the flexibility property, the
non-directional property (not influenced by the gravity) and the
unidirectional heat-transferring property. Besides, the diameter of
the connecting pipe of the LHP device may be less than 4 mm.
Therefore, it is very appropriate to use the LHP device to solve
the heat dissipation problem for a LED illumination apparatus with
high power or high brightness.
[0049] In an LED illumination apparatus according to an embodiment
of the present invention, an evaporator of the LHP device is
associated with the LEDs through a base, and a condenser of the LHP
device is associated with a heat dissipating unit. Therefore, the
heat generated from the LEDs can be transmitted to the heat
dissipating unit via the LHP device, and then dissipated away from
the surface of the heat dissipating unit to make the LED
illumination apparatus have better heat dissipating
characteristics, such that the lifetime of the illumination
apparatus of the present invention is increased.
[0050] FIG. 1A is a cross-sectional drawing of an LED illumination
apparatus according to an embodiment of the present invention. FIG.
1B is a three-dimensional schematic drawing of parts of the LED
illumination in FIG. 1A. FIG. 1C is a schematic drawing of the LHP
device in FIG. 1A. FIG. 1D is a schematic drawing of the
cross-section A-A of the evaporator shown in FIG. 1C. Referring to
FIGS. 1A to 1D, the LED illumination apparatus 100 comprises an
illumination module 110, a heat dissipating unit 120 and an LHP
device 130. The illumination module 110 comprises a base 114 and a
plurality of LEDs 112. The LEDs 112 are disposed on the base 114.
The LHP device 130 contains working fluid 135 therein. The working
fluid 135 may be selected from a group consisting of water,
acetone, ammonia and other refrigerants. The LHP device 130
comprises an evaporator 132, a condenser 134, a first transmitting
pipe 136 and a second transmitting pipe 138. The evaporator 132 is
associated with the base 114 and has an outlet 132a, an inlet 132b
and a chamber 132c. The chamber 132c may contain the working fluid
135' at the liquid state therein. The condenser 134 is conformably
associated with the heat dissipating unit 120. The condenser 134
has an inlet 134a and an outlet 134b. At least one part of the
condenser 134, as shown in FIG. 1B, stretches in a curved pipe
shape along a surface of the heat dissipating unit 120 in order to
utilize the surface of heat dissipating unit 120 for dissipating
heat. One terminal of the first transmitting pipe 136 communicates
with the outlet 132a of the evaporator 132, and the other terminal
of the first transmitting pipe 136 communicates with the inlet 134a
of the condenser 134. One terminal of the second transmitting pipe
138 communicates with the outlet 134b of the condenser 134, and the
other terminal of the second transmitting pipe 138 communicates
with the inlet 132b of the evaporator 132. The heat generated from
the LEDs 112 can be transmitted to the heat dissipating unit 120
via the base 114 and the LHP device 130.
[0051] In this embodiment, the evaporator 132 may comprise a porous
member 132d in the chamber 132c. The porous member 132d has a
hollow space 132e therein. The working fluid 135' at the liquid
state is enveloped in the hollow space 132e by the porous member
132d, and the porous member 132d is suitable for being permeated
with the working fluid 135. More specifically, the body of the
evaporator 132 may be a hollow metal cylinder shell 102 with a
chamber 132c therein, and a plurality of radial protruding members
104 may extend from the metal cylinder shell 102 to the inner of
the metal cylinder shell 102. The porous member 132d with the
hollow space 132e may be attached within the metal cylinder shell
102 to form a plurality of vapor channels 105 between the metal
cylinder shell 102 and the porous member 132d. The hollow space
132e may be a hollow cylinder chamber filled with the working fluid
135' at the liquid state. Due to the capillary effect, the work
fluid 135 can permeate through the porous member 132d into the
vapor channels 105.
[0052] In this embodiment, the heat dissipating unit 120 may be a
housing of the illumination module 110. In addition, at least parts
of the condenser 134 may stretch in a curved pipe shape along the
interior surface 122 of the heat dissipating unit 120. More
specifically, at least parts of the condenser 134 may stretch in a
zigzag shape along the interior surface 122 of the heat dissipating
unit 120. Because the housing has surfaces with large area, the
heat can be dissipated from the housing away quickly.
[0053] However, it is not confined in the present invention that
the condenser 134 stretches along the interior surface 122 of the
heat dissipating unit 120. In other embodiments, the condenser 134
may stretch along the exterior surface of the heat dissipating unit
120 or both the exterior and interior surfaces. Moreover, in other
embodiments, the condenser 134 may also pass through the heat
dissipating unit 120. Besides, the heat dissipating unit 120 may be
a cooling plate, a lampshade disposed around the LEDs 112 to
reflect the light emitted from the LED 112 or other objects with
large surface and better heat conductivity, wherein at least parts
of the condenser 134 may stretch in a curved pipe shape along the
exterior surface and/or the interior surface of the lampshade.
Moreover, at least parts of the condenser 134 may also stretch in a
zigzag shape along the exterior surface and/or the interior surface
of the lampshade.
[0054] In this embodiment, the condenser 134 may comprise at least
one capillary pipe. Besides, at least one part of the condenser 134
may be adhered to the surface of the heat dissipating unit 120 with
an adhesive or welded on the surface of the heat dissipating unit
120. In other embodiments, the condenser 134 may also be integrated
with the heat dissipating unit for forming a unity member.
[0055] In this embodiment, the base 114 may comprise a circuit
board 114a and a conducting unit 114b. The LEDs 112 are disposed on
the circuit board 114a. The conducting unit 114b is associated
between the circuit board 114a and the evaporator 132. The
conducting unit 114b may be a flat heat pipe, a metal board or
other objects with better heat conductivity for example. The
material of conducting unit 114b may comprise ceramic material,
polymeric material or metal. The base 114 may also be associated
with the heat dissipating unit 120, such that the heat generated
from the LED 112 may also be conducted from the base 114 to the
heat dissipating unit 120 directly. However, in other embodiments,
the base 114 and the heat dissipating unit 120 may also be disposed
separately.
[0056] A heat dissipating method according to an embodiment of the
present invention is suitable for being applied to the LED
illumination apparatus 100 as shown in FIG. 1A. The heat
dissipating method comprises the steps of: using the LHP device 130
to associate the illumination module 110 and the heat dissipating
unit 120, and transmitting the heat generated from the LEDs 112 to
the heat dissipating unit 120 via the LHP device 130.
[0057] When the LHP device 130 is transmitting heat, the phenomena
occur as mentioned below. In this embodiment, the heat generated
from the LEDs 112 may be conducted to the evaporator 132 via the
base 114. In addition, the state of the working fluid 135 in the
evaporator 132 may be converted from the liquid state into the
vapor state by means of absorbing the heat generated from the LEDs
112. More specifically, the heat may be conducted to the metal
cylinder shell 102 of the evaporator 132 and then conducted to the
porous member 132d via the radial protruding members 104.
Subsequently, the heat is conducted from the porous member 132 to
the working fluid 135' at the liquid state and absorbed thereby.
The working fluid 135'' at the vapor state may then permeate
through the porous member 132 by the capillarity effect and be
transmitted from the evaporator 132 to the condenser 134 by the
first transmitting pipe 136. The heat of the working fluid 135'' at
the vapor state in the condenser 134 may be dissipated to the
environment via the heat dissipating unit 120 to convert the state
of the working fluid 135 from the vapor state into the liquid
state. The working fluid 135' at the liquid state in the condenser
134 may be then transmitted back to the evaporator 132 by the
second transmitting pipe 138. It should be noted that transmitting
the working fluid 135'' at the vapor state from the evaporator 132
to the condenser 134 and transmitting the working fluid 135' at the
liquid state from the condenser 134 back to the evaporator 132 may
be accomplished by the capillarity effect of the porous member 132d
mounted in the evaporator 132.
[0058] In the LED illumination apparatus 100 and the heat
dissipating method according to the above embodiments of the
present invention, because the LHP device 130 has good heat
transmitting properties as mentioned above to carry the heat
generated from the LEDs 112 efficiently, the LED illumination
apparatus 100 in the embodiment has higher heat dissipating
efficiency, and the heat dissipating method dissipates the heat
from the LED illumination apparatus 100 efficiently. Therefore, the
lifetime of the LEDs in the LED illumination apparatus 100 is
increased. In addition, because of the characteristics and
advantages of the LHP device as mentioned above, the LED
illumination apparatus 100 also has the advantages that the
illumination module 110 can be disposed far away from the heat
dissipating unit 120 to improve the design flexibility of the LED
illumination apparatus 100, and the LED illumination apparatus 100
can be rotated to any orientation without being affected by the
gravity. Besides, an electric fan may not be necessary for the LED
illumination apparatus 100 because of the high heat transmitting
efficiency of the LHP device 130, such that the size of the LED
illumination 100 can be reduced.
[0059] In the LED illumination 100 according to this embodiment, an
electric fan may be disposed beside the heat dissipating unit 120,
such that the heat can be dissipated from the heat dissipating unit
120 more rapidly. In other embodiments, the electric fan may also
be disposed beside the condenser 134. In this embodiment, the
inside diameters of the condenser 134, the first transmitting pipe
136 and the second transmitting pipe 138 may be all less than 4 mm,
and the total length of the condenser 134, the first transmitting
pipe 136 and the second transmitting pipe 138 may be longer than
600 mm, demonstrating the high design flexibility for the LHP
device 130 in the LED illumination apparatus 100.
[0060] FIG. 2A illustrates an LHP device of a LED illumination
apparatus according to another embodiment of the present invention,
and FIG. 2B is a schematic cross-sectional drawing of the
evaporator in FIG. 2A. Referring to FIGS. 2A and 2B, an LHP device
130' is similar to the LHP device 130 as shown in FIG. 1A, and the
difference between the two is mentioned below. Compared with the
structure in FIG. 1D, an evaporator 132' has no radial protruding
members 104 as shown in FIG. 1D. Instead, in the evaporator 132', a
porous member 132d' is attached to a shell 102' directly. Besides,
the porous member 132d' has a plurality of recesses 132f in its
exterior surface to form vapor channels 105. In this embodiment,
the heat will be conducted to the shell 102' of the evaporator 132'
and then conducted to the porous member 132d' without passing
through the radial protruding members 104 as shown in FIG. 1D. In
addition, the evaporator 132' may be clamped by a clamping block
114c, and the clamping block is associated with the conducting
unit. In this embodiment, the clamping block 114c may have a
containing room 114c' in which the evaporator 132' is wedged. The
clamping block 114c may also be applied in the structure of the LED
illumination apparatus 100 as shown in FIG. 1A to associate the
conducting unit 114b with the evaporator 132. Referring to FIG. 2C,
in yet another embodiment, a clamping block 114d may have a recess
114d' to replace the containing room 114c', and the evaporator 132'
is wedged in the recess 114d'.
[0061] FIG. 3 is the schematic drawing of a LED illumination
apparatus according to yet another embodiment of the present
invention. Referring to FIG. 3, an LED illumination apparatus 100'
in this embodiment is similar to the LED illumination apparatus 100
as shown in FIG. 1A, and the difference between the two is
mentioned below. In this embodiment, a base 114' is a circuit board
associated with the evaporator directly. In other embodiments, the
base may be made of metal or other materials with better heat
conductivity.
[0062] FIG. 4 illustrates a base wedged with an evaporator
according to still another embodiment of the present invention.
Referring to FIG. 4, a base 114'' in this embodiment is different
from the base 114' as shown in FIG. 3. In this embodiment, the base
114'' may have a containing room 114c in which the evaporator 132
is wedged. Besides, it is not confined in the present invention
that the LED 112 is disposed on only one surface of the base. In
this embodiment, the LED 112 may be disposed on multiple surfaces
of the base 114''. In other embodiments, a conducting unit may have
a containing room or a recess in which the evaporator is
wedged.
[0063] FIG. 5A is a schematic drawing of a LED illumination
apparatus according to another embodiment of the present invention,
and FIG. 5B is a three-dimensional schematic drawing of the
connector in FIG. 5A. Referring to FIGS. 5A and 5B, an LED
illumination apparatus 100'' in this embodiment is similar to the
LED illumination apparatus 100 as shown in FIG. 1A, and the
difference between the two is mentioned below. In this embodiment,
the LED illumination apparatus 100'' further comprises at least one
connector 140 connected between at least one part of the condenser
134 and a surface of the heat dissipating unit 120. The connector
140 has a recess 142, and the part of the condenser 134 is disposed
in the recess 142. A heat dissipating method according another
embodiment of the present invention may also comprise the step of
using the connector 140 to connect the part of the condenser 134
and the surface of the heat dissipating unit 120, wherein the
condenser 134 is pressed into the recess 140 to fit the shape of
the recess 140. Because the connector 140 can contact the condenser
134 and the heat dissipating unit 120 tightly, the heat
transmitting efficiency from the condenser 134 to the heat
dissipating unit 120 can be improved.
[0064] It should be noted that the heat dissipating method
according to FIG. 1A can also be applied to the LED illumination
apparatuses according to the other embodiments mentioned above.
[0065] In view of the foregoing, because the LHP device has high
heat transmitting rate, the LED illumination apparatus in the
invention has better heat dissipating efficiency, and the heat
dissipating method dissipates the heat from the LED illumination
apparatus efficiently. Therefore, the lifetime of the LEDs in the
LED illumination apparatus is increased. In addition, because of
the characteristics and advantages of the LHP device such as the
far distance heat-transmitting property, the flexibility property,
the non-directional property and the unidirectional
heat-transferring property, the LED illumination apparatus in the
invention also has the advantages that the illumination module can
be disposed far away from the heat dissipating unit to improve the
design flexibility of the LED illumination apparatus, and the LED
illumination apparatus can be rotated to any orientation without
being affected by the gravity. Besides, an electric fan may not be
necessary for the LED illumination apparatus because of the high
heat transmitting efficiency of the LHP device, such that the size
of the LED illumination can be reduced.
[0066] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *