U.S. patent application number 11/341465 was filed with the patent office on 2007-08-02 for loop heat exchange apparatus.
This patent application is currently assigned to JAFFE LIMITED. Invention is credited to Jia-Hao Li.
Application Number | 20070175614 11/341465 |
Document ID | / |
Family ID | 38320878 |
Filed Date | 2007-08-02 |
United States Patent
Application |
20070175614 |
Kind Code |
A1 |
Li; Jia-Hao |
August 2, 2007 |
Loop heat exchange apparatus
Abstract
A loop heat exchange apparatus for dissipating heat generated
from a plurality of heat sources includes at least a first heat
pipe having a heat reception portion, a plurality of second heat
pipes each having a condensation portion, a plurality of
evaporators disposed on the first heat pipe for contacting the heat
source, and a connection mechanism. One end of the second heat
pipes is inserted in the evaporator, while the other end of the
second heat pipes is inserted to the connection mechanism of the
first heat pipe. The evaporator and the connection mechanism are
drilled, cleaned, filled with working fluid, evacuated and sealed.
In this manner, the first heat pipe and the second heat pipes can
form a tightly sealed loop heat exchange apparatus, which can
perform heat exchange simultaneously with a plurality of heat
sources.
Inventors: |
Li; Jia-Hao; (Sindian City,
TW) |
Correspondence
Address: |
HDSL
4331 STEVENS BATTLE LANE
FAIRFAX
VA
22033
US
|
Assignee: |
JAFFE LIMITED
|
Family ID: |
38320878 |
Appl. No.: |
11/341465 |
Filed: |
January 30, 2006 |
Current U.S.
Class: |
165/104.26 ;
165/104.21; 257/E23.088 |
Current CPC
Class: |
F28D 15/043 20130101;
H01L 2924/0002 20130101; F28D 15/0266 20130101; H01L 2924/0002
20130101; H01L 23/427 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.26 ;
165/104.21 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. A loop heat exchange apparatus for dissipating heat generated
from a plurality of heat sources, the apparatus comprising: at
least a first heat pipe having a plurality of heat reception
portions; a plurality of evaporators, each being disposed to a heat
reception portion of the first heat pipe, and being correspondingly
adhered to each heat source; a connection mechanism disposed to one
end of the first heat pipe; and a plurality of second heat pipes,
each having a condensation portion, wherein one end of each second
heat pipe is inserted to one evaporator, and the other end of each
second heat pipe is inserted in the connection mechanism.
2. The apparatus as recited in claim 1, wherein a liquid seal
region is formed on the first heat pipe adjacent the heat reception
portion.
3. The apparatus as recited in claim 2, wherein the liquid seal
region is formed by flattening a portion of the first heat
pipe.
4. The apparatus as recited in claim 2, wherein the liquid seal
region is formed by filling in the first heat pipe a capillary
structure.
5. The apparatus as recited in claim 1, wherein the evaporator is
made of a heat conductive material such as copper or aluminum.
6. The apparatus as recited in claim 1, wherein the evaporator
includes a connection body, one side of the connection body having
a first through hole and a second through hole formed thereon for
inserting therein the first heat pipe and the second heat pipe,
wherein a communicable hole is drilled from one side of the first
heat pipe and the second heat pipe perpendicular to the connection
body to the other side of the first heat pipe and the second heat
pipe, thereby communicably connection the heat pipes.
7. The apparatus as recited in claim 6, wherein the first through
hole is a penetrating hole providing a sealed pipe opening of the
first heat pipe to protrude therethrough, while the second through
hole is a blind hole.
8. The apparatus as recited in claim 1, wherein the connection
mechanism includes a connection body, a first through hole and a
plurality of second holes being formed on one side of the
connection body for the first heat pipe and the second heat pipe to
insert therein, a communicable hole being drilled from one side of
the first heat pipe and the second heat pipes perpendicular to the
connection body to the other side of the first heat pipe and the
second heat pipes, thereby communicably connecting the heat
pipes.
9. The apparatus as recited in claim 8, wherein the evaporators
correspond to the first heat pipe, while a plurality of the first
through holes is correspondingly formed on the connection body, a
communicable hole being drilled between the first and the second
heat pipes, thereby communicably connecting the heat pipes.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates generally to a loop heat
exchange apparatus, and more particularly to a loop heat exchange
apparatus that can perform heat exchange with a plurality of heat
sources.
[0002] Modern computers have gained more and more computing power,
and faster and faster operation speed. The computer industry has
also revolutionized the way computers are made and designed. The
new generation central processing unit provided the enhanced
computing power. However, it also generates a huge amount of heat,
which should be properly dissipated. It is important to use an
efficient cooling system, such that the central processing unit can
operate under a normal working temperature. Currently, a heat pipe
that is highly thermal conductive, that can rapidly dissipate heat
without consuming electricity, and that is light in weight, is used
to satisfy the demand in electronic products.
[0003] Normally speaking, when the opening of a heat pipe is
sealed, a circular disc on a processing machine is used. A
plurality of clamps is disposed on the circular disc. The clamps
are provided for holding and fastening the heat pipes. In addition,
a plurality of work stations is disposed surrounding the edge of
the circular disc. Each work station includes a sealing mechanism.
The sealing mechanism includes a welding torch. The heat pipes are
intermittently carried to the sealing mechanism by the rotation of
the disc, which allows the torch to seal the heat pipe
sequentially.
[0004] However, since the heat pipe does not rotate when one is
sealing its opening, the welding bath will drain down due to
gravity before solidification, which renders it difficult to seal
the upper portion of the heat pipe, thereby inducing defects, such
as being ripped or thinned. Thus, the opening of the heat pipe is
not properly sealed. Particularly, the heat pipe fabricated for
dissipating heat from a plurality of heat sources is even harder to
manufacture.
[0005] Accordingly, the inventor of the present invention realized
the drawbacks in the conventional art, and developed the present
invention that can overcome the drawbacks described above.
BRIEF SUMMARY OF THE INVENTION
[0006] The present invention is to provide a loop heat exchange
apparatus that can easily and quickly assemble a first heat pipe
having a heat reception portion, a plurality of second heat pipes
each having a condensation portion, such that the two heat pipes
are communicably connected. The loop heat exchange apparatus of the
present invention can perform heat exchange simultaneously with a
plurality of heat sources.
[0007] One particular feature of the present invention is in that
the loop heat exchange apparatus includes at least a first heat
pipe having a heat reception portion, a plurality of second heat
pipes each having a condensation portion, a plurality of
evaporators disposed on the first heat pipe for contacting the heat
source, and a connection mechanism. One end of the second heat
pipes is inserted in the evaporator, while the other end of the
second heat pipes is inserted to the connection mechanism of the
first heat pipe. The evaporator and the connection mechanism are
drilled, cleaned, filled with working fluid, evacuated and sealed.
In this manner, the first heat pipe and the second heat pipes can
form a tightly sealed loop heat exchange apparatus, which can
perform heat exchange simultaneously with a plurality of heat
sources.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 illustrates a loop heat exchange apparatus of the
present invention.
[0009] FIG. 2 is a sectional view illustrating two heat conductive
pipes being disposed to an evaporator of the present invention.
[0010] FIG. 3 is a sectional view illustrating two heat conductive
pipes being disposed to an evaporator of the present invention in
another viewing angle.
[0011] FIG. 4 is a sectional view illustrating two heat conductive
pipes being disposed to an connection mechanism of the present
invention.
[0012] FIG. 5 is a sectional view illustrating two heat conductive
pipes being disposed to a connection mechanism of the present
invention in another viewing angle.
[0013] FIG. 6 illustrates a loop heat exchange system in accordance
with another embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0014] In order to better understanding the features and technical
contents of the present invention, the present invention is
hereinafter described in detail by incorporating with the
accompanying drawings. However, the accompanying drawings are only
for the convenience of illustration and description, no limitation
is intended thereto.
[0015] Referring to FIG. 1, a loop heat exchange apparatus of the
present invention is illustrated. As shown, the loop heat exchange
apparatus 10 can simultaneously dissipate heat generated from a
plurality of heat sources 20. The loop heat exchange apparatus 10
includes at least a first heat pipe 1 having a heat accepting
portion, a plurality of second heat pipes 2 each having a
condensation portion, a plurality of evaporators 3 being disposed
to the first heat pipe 1 corresponding to the heat sources 20, and
a connection mechanism 4.
[0016] The first heat pipe 1 includes a working fluid or a
capillary structure 11. The heat reception portion is disposed
corresponding to the heat source 20, e.g. CPU, thereby allowing the
heat generated from the operation of heat source 20 to transfer to
the first heat pipe 1. The temperature of the working fluid will
increase after the heat exchange is performed on the working fluid
or the capillary structure 11. Then, the working fluid is transfer
to the condensation portion of the second heat pipe 2 for further
heat exchange. The condensation portion of the second heat pipe is
composed of a plurality of cooling fins 21. The hot working fluid
is condensed back to liquid phase by performing heat exchange with
the cooling fins 21 and transported to the first heat pipe 1.
[0017] Referring again to FIG. 1, in this particular embodiment,
the loop heat exchange apparatus of the present invention will
dissipate heat on three heat sources 20. Therefore, a horizontally
disposed first heat pipe 1 is provided. One pipe end of the first
heat pipe 1 is not sealed. In addition, an evaporator 3 is disposed
to the first heat pipe 1 corresponding to the heat sources 20. The
unsealed pipe opening 12 is inserted into a connection mechanism
4.
[0018] Referring also to FIG. 2 and FIG. 3, the evaporator is made
of a heat conductive material, such as copper. The evaporator 3
includes a connection body 31. One side of the connection body 31
includes a first through hole 32 and a second through hole 33 for
inserting therein a first heat pipe 1 and a second heat pipe 2. In
this particular embodiment, the first through hole is a penetrating
hole for a sealed pipe opening 13 of the first heat pipe 2 to
penetrate therethrough. The second through hole 33 is a blind hole.
In addition, a communicable hole 34 is drilled from one side of the
connection body 31 perpendicular to the first heat pipe 1 and the
second heat pipe 2 to the other side of the first heat pipe 1 and
the second heat pipe 2, thereby communicably connecting the heat
pipes 1, 2.
[0019] Referring to FIG. 4 and FIG. 5, the structures of the
connection mechanism 4 and the evaporator 3 are substantially the
same, which also includes a connection body 41. One side surface of
the connection body 41 includes a first through hole 42 and a
plurality of second through holes 43 for the firs heat pipe 1 and
the second heat pipes 2 to dispose therein. The first through hole
42 is a penetrating hole for the unsealed pipe opening 12 of the
first heat pipe 1 to penetrated therethrough. The second through
holes are blind holes, which do not necessarily penetrate the
connection body 41. In addition, a communicable hole 44 is drilled
from one side of the connection body 41 perpendicular to the first
heat pipe 1 and the second heat pipes 2 to the other side of the
first heat pipe 1 and the second heat pipes 2, thereby communicably
connecting the heat pipes 1, 2.
[0020] In order to clean the inner part of the heat pipe, one needs
to access the unsealed pipe opening 12 of the first heat pipe 1. A
working fluid and a capillary structure 11 are disposed therein
after the heat pipe 1 is cleaned. Then, the heat pipe 1 is
evacuated. Next, the unsealed pipe opening 12, the evaporator 3,
and the communicable holes 34, 44 on one side of the connection
body 31, 41 of the connection mechanism 4 are sealed. In this
particular embodiment, the unsealed pipe opening 12 of the first
heat pipe 1 can be sealed by a soldering procedure. Sealing
portions 35, 45 can be used to tightly seal the communicable holes
34, 44 on one side surface of the evaporator 3 and the connection
structure 4. The sealing portion 35, 45 can be a plug. In this
manner, a tightly sealed loop heat exchange apparatus 10 is
obtained.
[0021] In addition, in this particular embodiment, the first pipe
body 20 includes a flattened liquid seal region 14 adjacent the
heat reception portion. The liquid seal region 14 allows the
condensed working fluid to fill therein, thereby forming a liquid
seal so as to form an evaporating region of largest possible area.
Consequently, the heat pipe will have smaller thermal resistance,
higher heat transfer rate, and better thermal conductivity.
[0022] In the present invention, the heat generated from the
operation of the heat sources 20 is conducted to the first heat
pipe 1 via the heat conductive evaporator 3. A heat exchange is
performed with the working fluid and the capillary structure 11 of
the first heat pipe 1. After the heat exchange, the working fluid
of higher temperature is transferred to the condensation portion
via the second heat pipe 2 of the evaporator 3 for further heat
exchange. The working fluid is then condensed and flowed back to
the other end of the second heat pipe, which is returned to the
heat reception portion of the first heat pipe 1, thereby
continuously performing the heat exchange process.
[0023] Moreover, referring to FIG. 6, the evaporators 3 can also be
disposed corresponding the first heat pipe 1. A plurality of the
first through holes 42 is formed on the connection body 41, such
that the pipe opening 12 of the first heat pipe 1 protrudes the
connection body 41. The communicable hole 44 is drilled to the side
surface of each of the first and the second heat pipes 1, 2,
thereby communicably connecting with each other. In addition, the
liquid seal region 14 in this particular embodiment is formed by
filling the capillary structure in the first heat pipe 20 adjacent
the heat reception portion.
[0024] According to the descriptions given above, the loop heat
exchange apparatus 10 of the present invention can easily and
quickly connect the first heat pipe 1 having a heat reception
portion and a plurality of second heat pipes 2 having a
condensation portion, and can dissipate heat generated from a
plurality of heat sources 20. The assembly and the usage of the
loop heat exchange apparatus of the present invention become easier
and more convenient.
[0025] In summary, the loop heat exchange apparatus of the present
invention indeed satisfies the patentability requirements of the
patent law, a grant of letters patent therefor is thus respectfully
requested.
[0026] Since, any person having ordinary skill in the art may
readily find various equivalent alterations or modifications in
light of the features as disclosed above, it is appreciated that
the scope of the present invention is defined in the following
claims. Therefore, all such equivalent alterations or modifications
without departing from the subject matter as set forth in the
following claims is considered within the spirit and scope of the
present invention.
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