U.S. patent application number 11/331422 was filed with the patent office on 2007-07-12 for methods of making controlled segregated phase domain structures.
Invention is credited to Billy J. Stanbery.
Application Number | 20070160763 11/331422 |
Document ID | / |
Family ID | 38233025 |
Filed Date | 2007-07-12 |
United States Patent
Application |
20070160763 |
Kind Code |
A1 |
Stanbery; Billy J. |
July 12, 2007 |
Methods of making controlled segregated phase domain structures
Abstract
A method includes providing a first precursor on a first
substrate; providing a second precursor on a second substrate;
contacting the first precursor and the second precursor; reacting
the first precursor and the second precursor to form a chemical
reaction product; and moving the first substrate and the second
substrate relative to one another to separate the chemical reaction
product from at least one member selected from the group consisting
of the first substrate and the second substrate, characterized in
that, to control formation of a segregated phase domain structure
within the chemical reaction product, a constituent of at least one
member selected from the group consisting of the first precursor
and the second precursor is provided in a quantity that
substantially regularly periodically varies from a mean quantity
with regard to basal spatial location.
Inventors: |
Stanbery; Billy J.; (Austin,
TX) |
Correspondence
Address: |
JOHN BRUCKNER, P.C.
P.O. BOX 490
FLAGSTAFF
AZ
86002
US
|
Family ID: |
38233025 |
Appl. No.: |
11/331422 |
Filed: |
January 12, 2006 |
Current U.S.
Class: |
427/301 ;
427/333; 427/337 |
Current CPC
Class: |
H01L 31/0322 20130101;
Y02P 70/521 20151101; Y02P 70/50 20151101; H01L 31/1896 20130101;
Y02E 10/541 20130101; H01L 31/0749 20130101 |
Class at
Publication: |
427/301 ;
427/333; 427/337 |
International
Class: |
B05D 3/10 20060101
B05D003/10 |
Claims
1. A method, comprising: providing a first precursor on a first
substrate; providing a second precursor on a second substrate;
contacting the first precursor and the second precursor; reacting
the first precursor and the second precursor to form a chemical
reaction product; and moving the first substrate and the second
substrate relative to one another to separate the chemical reaction
product from at least one member selected from the group consisting
of the first substrate and the second substrate, characterized in
that, to control formation of a segregated phase domain structure
within the chemical reaction product, a constituent of at least one
member selected from the group consisting of the first precursor
and the second precursor is provided in a quantity that
substantially regularly periodically varies from a mean quantity
with regard to basal spatial location.
2. The method of claim 1, wherein the segregated phase domain
structure includes a segregated phase domain array.
3. The method of claim 1, wherein the quantity of the constituent
is substantially regularly periodically increased by planar coating
a substantially regularly periodically relieved surface with a
material that includes an excess of the constituent relative to the
mean quantity.
4. The method of claim 1, wherein the quantity of the constituent
is substantially regularly periodically increased by depositing a
plurality of constituent sources that include an excess of the
constituent relative to the mean quantity.
5. The method of claim 1, wherein the quantity in which the
constituent is provided periodically varies from the mean quantity
with respect to basal spatial location on a sub-micron scale.
6. The method of claim 1, wherein the quantity in which the
constituent is provided periodically varies from the mean quantity
with respect to basal spatial location on a scale that is
substantially a multiple of approximately five nanometers.
7. The method of claim 1, further comprising generating an electric
field between the first substrate and the second substrate
8. A method, comprising: providing a first precursor on a first
substrate; providing a second precursor on a second substrate;
contacting the first precursor and the second precursor; reacting
the first precursor and the second precursor to form a chemical
reaction product; and moving the first substrate and the second
substrate relative to one another to separate the chemical reaction
product from at least one member selected from the group consisting
of the first substrate and the second substrate, characterized in
that, to control formation of a segregated phase domain structure
within the chemical reaction product, a constituent of at least one
member selected from the group consisting of the first precursor
and the second precursor is provided in a quantity that
substantially regularly periodically varies from a mean quantity
with regard to basal spatial location, wherein the segregated phase
domain structure includes a segregated phase domain array, wherein
the quantity of the constituent is substantially regularly
periodically increased by planar coating a substantially regularly
periodically relieved surface with a material that includes an
excess of the constituent relative to the mean quantity, and
wherein the quantity in which the constituent is provided
periodically varies from the mean quantity with respect to basal
spatial location on a sub-micron scale.
9. The method of claim 8, wherein the quantity in which the
constituent is provided periodically varies from the mean quantity
with respect to basal spatial location on a scale that is
substantially a multiple of approximately five nanometers.
10. The method of claim 8, further comprising generating an
electric field between the first substrate and the second
substrate
11. A method, comprising: providing a first precursor on a first
substrate; providing a second precursor on a second substrate;
contacting the first precursor and the second precursor; reacting
the first precursor and the second precursor to form a chemical
reaction product; and moving the first substrate and the second
substrate relative to one another to separate the chemical reaction
product from at least one member selected from the group consisting
of the first substrate and the second substrate, characterized in
that, to control formation of a segregated phase domain structure
within the chemical reaction product, a constituent of at least one
member selected from the group consisting of the first precursor
and the second precursor is provided in a quantity that
substantially regularly periodically varies from a mean quantity
with regard to basal spatial location, wherein the segregated phase
domain structure includes a segregated phase domain array, wherein
the quantity of the constituent is substantially regularly
periodically increased by depositing a plurality of constituent
sources that include an excess of the constituent relative to the
mean quantity, and wherein the quantity in which the constituent is
provided periodically varies from the mean quantity with respect to
basal spatial location on a sub-micron scale.
12. The method of claim 11, wherein the quantity in which the
constituent is provided periodically varies from the mean quantity
with respect to basal spatial location on a scale that is
substantially a multiple of approximately five nanometers.
13. The method of claim 11, further comprising generating an
electric field between the first substrate and the second substrate
Description
BACKGROUND INFORMATION
[0001] 1. Field of the Invention
[0002] Embodiments of the invention relate generally to the field
of materials. More particularly, embodiments of the invention
relate to methods of controlling formation of a segregated phase
domain structure within a chemical reaction product, compositions
of matter including such a segregated phase domain structure, and
machinery having a complex tool relief for making such
compositions.
[0003] 2. Discussion of the Related Art
[0004] Prior art copper indium selenide based photovoltaics,
sometimes called CIS based PV, are known to those skilled in the
art of solar cells. CuInSe is the most reliable and best-performing
thin film material for generating electricity from sunlight. A
concern with this technology is that raw material supply
constraints are going to arise in the future as the production of
CIS PV increases. For instance, indium does not occur naturally in
high concentration ores. Typically, indium is obtained from the
discarded tailings of zinc ores. As the production of CIS PV
approaches the large scale range of from approximately 10
gigawatts/year to approximately 100 gigawatts/year, indium supply
constraints will become manifest. These supply constraints will
lead to increased costs. Further, as the production of CIS PV
increases, other raw material supply constraints will also emerge.
What is required is a solution that reduces the amount of raw
materials needed per watt of generating capacity in CIS PV thin
films.
[0005] One approach to reducing the amount of raw materials needed
is to reduce the thickness of the CIS PV thin film material. The
inherent absorption coefficient of CIS is very high (i.e.,
approximately 10.sup.5 cm.sup.-1). This means that most of the
incident light energy can be absorbed with a very thin film of CIS.
The use of a back surface reflector can further reduce the
thickness necessary to absorb most of the incident light energy.
While prior art CIS PV products are typically at least about 2
microns thick, it is important to appreciate that 0.25 microns is
theoretically sufficient for a CIS PV thin film located on a back
surface reflector to absorb most the incident light energy. What is
also required is a solution that produces thinner CIS PV thin
films.
[0006] Meanwhile, field assisted simultaneous synthesis and
transfer technology has been developed that is directly applicable
to the manufacture of thinner CIS PV films. Various aspects of this
field assisted simultaneous synthesis and transfer technology
(which aspects may or may not be used together in combination) are
described in U.S. Pat. Nos. 6,736,986; 6,881,647; 6,787,012;
6,559,372; 6,500,733; 6,797,874; 6,720,239; and 6,593,213.
[0007] An advantage of field assisted simultaneous synthesis and
transfer technology is that it works better as the precursor stack
becomes thinner. For instance, the vapor pressure of selenium in a
CIS based reaction product layer is a function of temperature. The
pressure needed to contain the selenium is a function of the
temperature required for the process reaction. It is important to
appreciate that the voltage, if utilized, to achieve a desired
pressure goes down as the thickness goes down. As the required
voltage is reduced, the physical demands on the system (e.g.,
stress on the dielectric) go down. Therefore, as the precursor
stack is made thinner, the voltage needed to generate a given
pressure goes down; which reduces stress on the dielectric (for
instance a release layer), thereby expanding the scope of materials
that can be utilized as a dielectric.
[0008] Another advantage of field assisted simultaneous synthesis
and transfer technology is that it enables a lower thermal budget.
The lower thermal budget is a result of higher speed of the field
assisted simultaneous synthesis and transfer technology compared to
alternative approaches such as (physical or chemical) vapor
deposition. In addition to the time and energy savings provided by
the field assisted simultaneous synthesis and transfer technology,
the quality of the resulting products can also be improved. For
instance, in the case of manufacturing CIS based PV, the lower
thermal budget enabled by the use of field assisted simultaneous
synthesis and transfer technology leads to the reduction of
undesirable reactions, such as between selenium and molybdenum at
the interface between the CIS absorber and the back side metal
contact. The reduction of this undesirable reaction results in
reduced tarnishing which in-turn results in higher back surface
reflectivity.
[0009] Recently, it has been demonstrated that CIS thin films made
by conventional techniques contain domains resulting from
fluctuations in chemical composition.sup.(1-2, 5). Undesirable
recombination of charge carriers takes place at the boundaries
between the nanodomains within such a CIS based PV absorber.
Therefore, what is also required is a solution to controlling, and
ideally optimizing, the boundaries between, these nanodomains with
varying chemical compositions.
[0010] Heretofore, the requirements of reduced raw materials
requirements, reduced thickness and controlled boundaries between
nanodomains referred to above have not been fully met. What is,
therefore, needed is a solution that simultaneously solves all of
these problems.
SUMMARY OF THE INVENTION
[0011] There is a need for the following embodiments of the
invention. Of course, the invention is not limited to these
embodiments.
[0012] According to an embodiment of the invention, a process
comprises: providing a first precursor on a first substrate;
providing a second precursor on a second substrate; contacting the
first precursor and the second precursor; reacting the first
precursor and the second precursor to form a chemical reaction
product; and moving the first substrate and the second substrate
relative to one another to separate the chemical reaction product
from at least one member selected from the group consisting of the
first substrate and the second substrate, characterized in that, to
control formation of a segregated phase domain structure within the
chemical reaction product, a constituent of at least one member
selected from the group consisting of the first precursor and the
second precursor is provided in a quantity that substantially
regularly periodically varies from a mean quantity with regard to
basal spatial location.
[0013] According to another embodiment of the invention, a machine
comprises: a first substrate; and a second substrate coupled to the
first substrate, characterized in that, to control formation of a
segregated phase domain structure within a chemical reaction
product by controlling an amount of a constituent of a precursor
that is present per unit surface area, at least one member selected
from the group consisting of the first substrate and the second
substrate defines a substantially regularly periodically varying
relief with respect to basal spatial location.
[0014] According to another embodiment of the invention, a
composition of matter comprises: a chemical reaction product
defining a first surface and a second surface, characterized in
that the chemical reaction product includes a segregated phase
domain structure including a plurality of domain structures,
wherein at least one of the plurality of domain structures includes
at least one domain that extends from a first surface of the
chemical reaction product to a second surface of the chemical
reaction product.
[0015] These, and other, embodiments of the invention will be
better appreciated and understood when considered in conjunction
with the following description and the accompanying drawings.
[0016] It should be understood, however, that the following
description, while indicating various embodiments of the invention
and numerous specific details thereof, is given by way of
illustration and not of limitation. Many substitutions,
modifications, additions and/or rearrangements may be made within
the scope of an embodiment of the invention without departing from
the spirit thereof, and embodiments of the invention include all
such substitutions, modifications, additions and/or
rearrangements.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The drawings accompanying and forming part of this
specification are included to depict certain embodiments of the
invention. A clearer conception of embodiments of the invention,
and of the components combinable with, and operation of systems
provided with, embodiments of the invention, will become more
readily apparent by referring to the exemplary, and therefore
nonlimiting, embodiments illustrated in the drawings, wherein
identical reference numerals (if they occur in more than one view)
designate the same elements. Embodiments of the invention may be
better understood by reference to one or more of these drawings in
combination with the description presented herein. It should be
noted that the features illustrated in the drawings are not
necessarily drawn to scale.
[0018] FIGS. 1A-1C are elevational views of pairs of substrates
where at least one of each pair defines a substantially regularly
periodically varying relief with respect to basal spatial location,
representing an embodiment of the invention.
[0019] FIGS. 2A-2C are elevational views of pairs of substrates
where at least one of each pair carriers a constituent of a
precursor in a quantity that substantially regularly periodically
varies from a mean quantity with regard to basal spatial
location.
[0020] FIGS. 3A-3D are plan views of segregated phase domain
structures including a segregated phase domain hexagonal array,
representing an embodiment of the invention.
[0021] FIGS. 3E-3H are plan views of segregated phase domain
structures including a segregated phase domain orthogonal array,
representing an embodiment of the invention.
[0022] FIGS. 4A-4C are schematic elevational views of a process of
controlling formation of a segregated phase domain structure using
a back surface contact that defines a substantially regularly
periodically varying relief (and electric field strength) with
respect to basal spatial location, representing an embodiment of
the invention.
[0023] FIGS. 5A-5C are schematic elevational views of a process of
controlling formation of a segregated phase domain structure using
a tool that defines a substantially regularly periodically varying
electric field strength with respect to basal spatial location,
representing an embodiment of the invention.
[0024] FIGS. 6A-6C are schematic elevational views of a process of
controlling formation of a segregated phase domain structure using
a tool and a back surface contact both of which define a
substantially regularly periodically varying relief with respect to
basal spatial location, representing an embodiment of the
invention.
[0025] FIGS. 6D-6F are schematic elevational views of a process of
controlling formation of a segregated phase domain structure using
a back surface contact which defines a substantially regularly
periodically varying relief with respect to basal spatial location,
representing an embodiment of the invention.
[0026] FIGS. 7A-7C are schematic views of a hexagonal domain
structure, representing an embodiment of the invention.
DESCRIPTION OF PREFERRED EMBODIMENTS
[0027] Embodiments of the invention and the various features and
advantageous details thereof are explained more fully with
reference to the nonlimiting embodiments that are illustrated in
the accompanying drawings and detailed in the following
description. Descriptions of well known starting materials,
processing techniques, components and equipment are omitted so as
not to unnecessarily obscure the embodiments of the invention in
detail. It should be understood, however, that the detailed
description and the specific examples, while indicating preferred
embodiments of the invention, are given by way of illustration only
and not by way of limitation. Various substitutions, modifications,
additions and/or rearrangements within the spirit and/or scope of
the underlying inventive concept will become apparent to those
skilled in the art from this disclosure.
[0028] Within this application several publications are referenced
by Arabic numerals, or principal author's name followed by year of
publication, within parentheses or brackets. Full citations for
these, and other, publications may be found at the end of the
specification immediately preceding the claims after the section
heading References. The disclosures of all these publications in
their entireties are hereby expressly incorporated by reference
herein for the purpose of indicating the background of embodiments
of the invention and illustrating the state of the art.
[0029] The instant application contains disclosure that is also
contained in copending U.S. application Ser. No. 11/ ___,___
(attorney docket number HELE1180-1) filed Jan. 12, 2006; and U.S.
application Ser. No. 11/ ___,___ (attorney docket number
HELE1180-2) filed Jan. 12, 2006, the entire contents of both of
which are hereby expressly incorporated by reference for all
purposes. The below-referenced U.S. Patents disclose embodiments
that are useful for the purposes for which they are intended. The
entire contents of U.S. Pat. Nos. 6,736,986; 6,881,647; 6,787,012;
6,559,372; 6,500,733; 6,797,874; 6,720,239; 6,593,213; and
6,313,479 are hereby expressly incorporated by reference herein for
all purposes.
[0030] The context of the invention can include controlling
formation of a segregated phase domain structure within a chemical
reaction product. The context of the invention can include
machinery to control formation of a segregated phase domain
structure by controlling an amount of a constituent of a precursor
that is present per unit surface area. The context of the invention
can include a chemical reaction product that includes a segregated
phase domain structure including a plurality of domain
structures.
[0031] The segregated phase domain structure includes a plurality
of domain structures. The invention can include domain structures
that define percolation networks. The invention can include domain
structures that minimize path length required for charge carrier
collection (e.g., columnar domains). At least one of the plurality
of domain structures can include at least one domain that extends
from a first surface of the chemical reaction product to a second
surface of the chemical reaction product. The invention can include
domain structures that minimize boundary surface area (e.g.,
circular columnar domains) and/or minimize boundary surface along
preferred path directions (e.g., fluted circular columnar domains).
The invention can include the use of sodium to make boundaries
between domain structures less fuzzy (i.e., more discrete).
[0032] The invention can include a characteristic length scale for
the (intradomain) size of the domains (e.g., "r" for internal
radius). The invention can include a characteristic length scale
for the (interdomain) size of the separation(s) between domains
(e.g., "d" for center-to-center distance). By varying the ratio of
the characteristic domain size to characteristic domain separation,
the invention enables control of a relative volume of two (or more)
domains. By varying the absolute characteristic values, the
invention enables control of the ratio of junction volume to the
bulk field free volume in two (or more) phase domains. The
invention can include controlling the spacing of the domains to
control a ratio of domains and/or phases with regard to volume or
other parameter.
[0033] The invention can include a characteristic size distribution
of the domains. Embodiments of the invention can be characterized
by a narrow size distribution of "r" (i.e., monomodal). For
instance, embodiments of the invention can be characterized by a
size distribution in which 80% of the instances of a domain are
characterized by a size that is within 20% (plus or minus) of a
scalar value r. It can be advantageous if 90% of the instances of a
domain are characterized by a size that is within 10% (plus or
minus) of a scalar value "r." Alternatively, embodiments of the
invention can be characterized by a plurality of narrow size
distributions of "r" (i.e., multimodal). Preferred embodiments of
the invention avoid random size distributions (e.g., of "r").
[0034] The invention can include domain structures of a size that
are from approximately 1 nm to approximately 1 um, preferably from
approximately 5 nm to approximately 100 nm. The invention can
include domain structures that repeat on multiples of a
crystallographic unit cell lattice parameter of from approximately
1 nm to approximately 200 nm, preferably from approximately 5 nm to
approximately 50 nm. Nevertheless, it is important to appreciate
that the exact size (magnitude) of the domains is not
important.
[0035] The invention can include a characteristic size distribution
of the domain separations. Embodiments of the invention can be
characterized by a narrow size distribution of "d" (i.e.,
monomodal). For instance, embodiments of the invention can be
characterized by a separation distribution in which 80% of the
instances of a domain are characterized by a separation that is
within 20% (plus or minus) of an integer multiple of a scalar value
d. It can be advantageous if 90% of the instances of a domain are
characterized by a separation that is within 10% (plus or minus) of
an integer multiple of a scalar value "d." Alternatively,
embodiments of the invention can be characterized by a plurality of
narrow separation distributions of "r" (i.e., multimodal).
Preferred embodiments of the invention avoid random separation
distributions (e.g., of "d").
[0036] The invention can include domain structures that repeat (are
spaced) on a period of from approximately 1 nm to approximately 1
um, preferably from approximately 5 nm to approximately 100 nm. The
invention can include domain structures that repeat on multiples of
a period of from approximately 1 nm to approximately 200 nm,
preferably from approximately 5 nm to approximately 50 nm.
Nevertheless, it is important to appreciate that the exact size
(magnitude) of the domain separation(s) is not important.
[0037] The invention can include domain structures that define 6
fold, 4 fold or other symmetry, in two or three dimensions.
However, it is important to appreciate that the exact symmetry is
not important. The invention can include domain structures that
define short range order. The invention can include domain
structures that define long range order.
[0038] Referring to FIGS. 7A-7C, optimization of a hexagonal domain
structure with regard to minimizing total recombination R will not
be described. FIGS. 7A-7B relate to a first order approximation for
minimizing total recombination R for a hexagonal domain structure
array having circular columns, assuming the interabsorber junction
region is narrow compared to the scalar dimensions r and d.
Referring to FIGS. 7A-7B, a chemical reaction product 710 defining
a first surface 712 and a second surface 714 is coupled to a back
contact 720. The chemical reaction product 710 includes a
segregated phase domain structure including a cylindrical domain
structure 701 and a matrix domain structure 702. In this case, the
matrix domain structure extends from the first surface 712 of the
chemical reaction product 710 to the second surface 714 of the
chemical reaction product 710.
[0039] The total volume of each hexagonal cell of height
.tau..sub.0 is given by ((3).sup.1/2d.sup.2.tau..sub.0)/2 where d
is the hexagonal cell-to-cell spacing. The total recombination R
(per cell) equals the recombination in cylindrical domain region
one R.sub.1 plus the recombination in hexagonal matrix domain
region two R.sub.2 plus the recombination at the interface of
regions one and region two R.sub.i. R=R.sub.1+R.sub.2+R.sub.i
[0040] The recombination in cylindrical domain region one is given
by
R.sub.1=.rho..sub.1(volume1)=.rho..sub.1((.tau..sub.0-.tau..sub.1).pi.r.s-
up.2) where .rho..sub.1 is the bulk recombination rate in
cylindrical domain region one.
[0041] The recombination in hexagonal matrix domain region two is
given by
R.sub.2=.rho..sub.2(((3).sup.1/2d.sup.2.tau..sub.0)/2-(.tau..sub.0-.ta-
u..sub.1).pi.r.sup.2) where .rho..sub.2 is the bulk recombination
rate in hexagonal matrix domain region two.
[0042] The recombination at the interface between the cylindrical
region one and the matrix domain region two is given by
R.sub.i=.sigma..sub.i(2.pi.r(.tau..sub.0-.tau..sub.1)+.pi.r.sup.2)
where .sigma..sub.i is the interface (junction) surface
recombination velocity. The recombination rates .rho..sub.1 and
.rho..sub.2, and the recombination velocity .sigma..sub.i are
materials properties that depend on compositions and processing
histories.
[0043] FIG. 7C relates to a second order approximation for
minimizing total recombination R for a hexagonal domain structure
array having circular columns, where the junction width is not
small compared to r and/or d. Referring to FIG. 7C, the total
junction width is equal to the cylindrical domain junction width
plus the matrix domain junction width w.sub.j=r.sub.j+d.sub.j
[0044] The total recombination R (per cell) equals the
recombination in the cylindrical field-free domain region one
R.sub.1 plus the recombination in the hexagonal matrix field-free
domain region two R.sub.2 plus the recombination in the annular
space charge recombination region one R.sub.1j plus the
recombination in the annular space charge recombination region two
R.sub.2j. R=R.sub.1+R.sub.2+R.sub.1j+R.sub.2j
[0045] The following four equations for the terms R.sub.1, R.sub.2,
R.sub.1j and R.sub.2j are valid when .tau..sub.1.gtoreq.d.sub.j. If
.tau..sub.1<d.sub.j, then set .tau..sub.1=0. The recombination
in cylindrical field-free domain region one is given by
R.sub.1=.rho..sub.1((.tau..sub.0-.tau..sub.1-.tau..sub.j).pi.(r-r.sub.j).-
sup.2) where .rho..sub.1, is the bulk recombination rate in
cylindrical field-free domain region one.
[0046] The recombination in hexagonal matrix field-free domain
region two is given by
R.sub.2=.rho..sub.2(((3).sup.1/2d.sup.2.tau..sub.0)/2-(.tau..sub.0-.tau..-
sub.1+d.sub.j).pi.(r+d.sub.j).sup.2) where .rho..sub.2 is the bulk
recombination rate in hexagonal matrix field-free domain region
two.
[0047] The recombination in the annular space charge recombination
region one is given by
ti
R.sub.1j=.rho..sub.1j((.tau..sub.0-.tau..sub.1).pi.r.sup.2-(.tau..sub-
.0-.tau..sub.1-r.sub.j).pi.(r-r).sup.2)
where .rho..sub.1j is the bulk recombination rate in the annular
space charge recombination region one.
[0048] The recombination in the annular space charge recombination
region one is given by
R.sub.2j=.rho..sub.2j((.tau..sub.0-.tau..sub.1+d.sub.j).pi.(r+d.sub.j).su-
p.2-(.tau..sub.0-.tau..sub.1).pi.r.sup.2) where .rho..sub.2j is the
bulk recombination rate in the annular space charge recombination
region two.
[0049] The recombination rates .rho..sub.1, .rho..sub.2,
.rho..sub.1j and .rho..sub.2j are materials properties that depend
on compositions and processing histories.
[0050] Referring to FIGS. 1A-1C, the invention can include
substantially regularly periodically increasing an amount of a
precursor by planar coating a substantially regularly periodically
relieved surface. Referring to FIG. 1A, a first substrate 102
includes a substantially regularly periodically relieved surface
104. A first precursor 106 is coupled to the substantially
regularly periodically relieved surface 104. It can be appreciated
that there is relatively more of the first precursor 106
corresponding to a basal spatial location centered at a relief cell
center position 108 compared to a relief cell edge position 110. A
second precursor 114 is coupled to a second substrate 112. The
first substrate 102 and the second substrate 112 are movable
relative to one another. When the first precursor 106 and the
second precursor 114 are contacted and heated (optionally under the
influence of an electric field) the resulting reaction product can
be compositionally rich in the constituents of the first precursor
at a location corresponding to the relief cell center position 108,
especially if the basal diffusion rate is much lower than the
perpendicular diffusion rate.
[0051] Referring to FIG. 1B, a first precursor 126 is coupled to a
first substrate 122. A second substrate 132 includes a
substantially regularly periodically relieved surface 124. A second
precursor 134 is coupled to the substantially regularly
periodically relieved surface 124. It can be appreciated that there
is relatively more of the second precursor 134 at a relief cell
center position 138 compared to a relief cell edge position 130.
The first substrate 122 and the second substrate 132 are movable
relative to one another. When the first precursor 126 and the
second precursor 134 are contacted and heated (optionally under the
influence of an electric field) the resulting reaction product will
be compositionally rich in the constituents of the second precursor
at a location corresponding to the relief cell center position
138.
[0052] Referring to FIG. 1C, a first substrate 142 includes a
substantially regularly periodically relieved surface 144. A first
precursor 146 is coupled to the substantially regularly
periodically relieved surface 144. It can be appreciated that there
is relatively more of the first precursor 146 at a relief cell
center position 158 compared to a relief cell edge position 150. A
second substrate 152 includes a substantially regularly
periodically relieved surface 145. A second precursor 154 is
coupled to the substantially regularly periodically relieved
surface 145. It can be appreciated that there is relatively more of
the second precursor 154 at a relief cell center position 159
compared to a relief cell edge position 151. The first substrate
142 and the second substrate 152 are movable relative to one
another. When the first precursor 146 and the second precursor 154
are contacted and heated (optionally under the influence of an
electric field) the resulting reaction product will be
compositionally rich in the constituents of the first precursor at
a location corresponding to the relief cell center position 158 and
will be compositionally rich in the constituents of the second
precursor at a location corresponding to the relief cell center
position 159.
[0053] Referring to FIGS. 2A-2C, the invention can include
substantially regularly periodically increasing an amount of a
precursor by previously depositing a plurality of constituent
sources that include an excess of the constituent relative to a
mean quantity. Referring to FIG. 2A, a first substrate 202 includes
a plurality of substantially regularly periodically located
constituent sources 204. A first precursor 206 is coupled to the
sources 204. It can be appreciated that there is relatively more of
the first precursor 206 in positions 208 without the sources 204
compared to positions 210 with the sources 204. A second precursor
214 is coupled to a second substrate 212. The first substrate 202
and the second substrate 212 are movable relative to one another.
When the first precursor 206 and the second precursor 214 are
contacted and heated (optionally under the influence of an electric
field) the resulting reaction product will be compositionally rich
in the constituents of the first precursor at locations
corresponding to the relief cell center position 208.
[0054] Referring to FIG. 2B, a first precursor 226 is coupled to a
first substrate 222. A second substrate 232 includes a plurality of
substantially regularly periodically located constituent sources
224. A second precursor 234 is coupled to the sources 224. It can
be appreciated that there is relatively more of the second
precursor 234 at a center position 238 compared to edge positions
230. The first substrate 222 and the second substrate 232 are
movable relative to one another. When the first precursor 226 and
the second precursor 234 are contacted and heated (optionally under
the influence of an electric field) the resulting reaction product
will be compositionally rich in the constituents of the second
precursor at a location corresponding to the relief cell center
position 238.
[0055] Referring to FIG. 2C, a first substrate 242 includes a
plurality of substantially regularly periodically located
constituent sources 244. A first precursor 246 is coupled to the
plurality of substantially regularly periodically located sources
244. It can be appreciated that there is relatively more of the
first precursor 246 at a center position 258 compared to an edge
position 250. A second substrate 252 includes a plurality of
substantially regularly periodically located sources 245. A second
precursor 254 is coupled to the plurality of substantially
regularly periodically located sources 245. It can be appreciated
that there is relatively more of the second precursor 254 at center
position 259 compared to an edge position 251. The first substrate
242 and the second substrate 252 are movable relative to one
another. When the first precursor 246 and the second precursor 254
are contacted and heated (optionally under the influence of an
electric field) the resulting reaction product will be
compositionally rich in the constituents of the first precursor at
a location corresponding to the center position 258 and will be
compositionally rich in the constituents of the second precursor at
a location corresponding to the center position 259.
[0056] Referring to FIGS. 3A-3H, the relieved surface and/or the
constituent sources can be located across a surface to define a
hexagonal symmetry, an orthogonal symmetry, or other symmetry
and/or space group. Referring to FIG. 3A, the surface relief or
sources can define a hexagonal grid 310. Referring to FIG. 3B,
reaction products 320 whose location correspond to the grid 310 can
be columnar (to facilitate charge carrier transport) with a
circular circumference. Referring to FIG. 3C, the ratio of matrix
domain area to columnar domain area can be controlled by locating
the reaction product columns 330 closer to one another (e.g., so
that the columns are just touching). Referring to FIG. 3D, the
ratio of matrix domain to columnar domain can lowered still further
by locating the reaction product columns 340 so that they overlap.
Referring to FIG. 3E, the surface relief or sources can define an
orthogonal grid 350. Referring to FIG. 3F, reaction products 360
whose location correspond to the grid 350 can be columnar (to
facilitate charge carrier transport) with a circular circumference.
Referring to FIG. 3G, the ratio of matrix domain to columnar domain
can be controlled by locating the reaction product columns 370
closer to one another (e.g., so that the columns are just
touching). Referring to FIG. 3H, the ratio of matrix domain to
columnar domain can lowered still further by locating the reaction
product columns 380 so that they overlap.
EXAMPLES
[0057] Specific embodiments of the invention will now be further
described by the following, nonlimiting examples which will serve
to illustrate in some detail various features. The following
examples are included to facilitate an understanding of ways in
which an embodiment of the invention may be practiced. It should be
appreciated that the examples which follow represent embodiments
discovered to function well in the practice of the invention, and
thus can be considered to constitute preferred mode(s) for the
practice of the embodiments of the invention. However, it should be
appreciated that many changes can be made in the exemplary
embodiments which are disclosed while still obtaining like or
similar result without departing from the spirit and scope of an
embodiment of the invention. Accordingly, the examples should not
be construed as limiting the scope of the invention.
Example 1
[0058] Referring to FIGS. 4A-4C, this example relates to an
embodiment of the invention including planar coating of a first
precursor 410 on a surface of a tool 416 where a first precursor
constituent is substantially regularly periodically increased by
previously depositing a plurality of constituent sources 412 that
include an excess of the constituent relative to a mean quantity.
This embodiment also includes the use of a switchable (e.g.,
on-off), modulatable (e.g., field strength), reversible (e.g.,
polarity), electric field.
[0059] Referring to FIG. 4A, a first precursor 410 includes sources
412. A second precursor 420 is provided on a back contact 422.
Referring to FIG. 4B, the first precursor 410 and the second
precursor 420 are contacted and heated, and an electric field is
applied. With the bias of the field applied as depicted in FIG. 4B,
the electric field tends to drive at least some of the copper ions
away from the tool. The field as depicted exerts a force on the
copper that is opposite the direction of chemical drive on the
copper, and can be termed reverse bias (inapposite to forward
bias). Of course, the direction of the field can selected, the
magnitude of the field can be controlled and the field can be
switched on and/or off. Meanwhile, the sources 412 form
indium-gallium rich beta domains. Referring to FIG. 4C, after the
electric field is removed, the tool is separated and the domains
remain intact.
Example 2
[0060] Referring to FIGS. 5A-5C, this example relates to an
embodiment of the invention including planar coating of a first
precursor on a surface of a tool where a first precursor
constituent is substantially regularly periodically increased by
previously depositing a plurality of constituent sources that
include an excess of the constituent relative to a mean quantity.
This embodiment of the invention also includes a back surface
contact that is planar coated with a second precursor. This
embodiment includes the use of a switchable (e.g., on-off),
modulatable (e.g., field strength), reversible (e.g., polarity),
substantially regularly periodically varying electric field
strength with respect to basal spatial location.
[0061] Referring to FIG. 5A, a first precursor 510 includes
(In/Ga).sub.y(Se).sub.1-y and In/Ga sources 512. The first
precursor 510 is coupled to a planarized release layer 514 that is
coupled to a substantially regularly periodically relieved surface
of a tool 516. The sources 512 can be self assembled at locations
corresponding to the relieved surface by photo-ionizing In/Ga
particles and applying a negative bias to the tool, or flood gun
ionizing the In/Ga particles and applying a positive bias to the
tool. The use of photoionization and/or floodgun ionization to
enable positioning of quantum dots is described by U.S. Pat. No.
6,313,476. Of course, other methods of self-assembly and/or
deposition can be used to locate the sources 512, such as self
organized epitaxy (e.g., on GaAs) and/or molecular pick-and-place
techniques. A second precursor 520 includes Cu.sub.xSe.sub.1-x.
[0062] Referring to FIG. 5B, the first precursor 510 and the second
precursor 520 are contacted and heated, and an electric field is
applied. The depicted electric field tends to drive some of the
copper ions away from the projections of the relieved tool, thereby
forming copper rich alpha domains. Driving the copper away from the
tool helps avoid welding the reaction product to the tool.
Meanwhile, the sources 512 form indium-gallium rich beta domains.
Referring to FIG. 5C, after the electric field is removed, the tool
is separated and the domains remain intact.
Example 3
[0063] Referring to FIGS. 6A-6C, this example relates to an
embodiment of the invention that includes a tool 610 where the
quantity of a first precursor 612 is substantially regularly
periodically increased by planar coating a substantially regularly
periodically relieved surface. This embodiment of the invention
also includes a back surface contact 614 where a second precursor
616 is substantially planarized.
[0064] Referring to FIG. 6A, locations of additional first
precursor can be seen. Referring to FIG. 6B, the resulting domains
are columnar and extend from a first surface 620 of the reaction
product to a second surface 622. Referring to FIG. 6C, an emitter
649 is coupled to the reaction product.
Example 4
[0065] Referring to FIGS. 6D-6F, this example relates to an
embodiment of the invention that includes a tool 660 that is planar
coated with a first precursor 662. This embodiment of the invention
also includes a back surface contact 664 where the quantity of a
second precursor 668 is substantially regularly periodically
increased by planar coating a substantially regularly periodically
relieved surface.
[0066] Referring to FIG. 6D, locations of additional second
precursor correspond to locations where second precursor rich
domains will be located adjacent the second substrate. Referring to
FIG. 6E, only one of the resulting domains extends from a first
surface 670 of the reaction product to a second surface 672.
Referring to FIG. 6F, an emitter 699 is coupled to the reaction
product.
Example 5
[0067] Referring to FIGS. 8A-8C, this example relates to an
embodiment of the invention including planar coating of a first
precursor on a surface of a tool where a first precursor
constituent is substantially regularly periodically increased with
regard to a basal plane by utilizing a relieved substrate. The
result is an excess of the constituent relative to a mean quantity
at locations that correspond to the individual recesses of the
relieved surface of the tool. This embodiment also includes the use
of a switchable (e.g., on-off), modulatable (e.g., field strength),
reversible (e.g., polarity), substantially regularly spatially
periodically varying electric field strength with respect to basal
spatial location.
[0068] Referring to FIG. 8A, a first precursor 810 is provided on a
tool surface 815. A second precursor 820 is provided on a back
contact 822. Referring to FIG. 5B, the first precursor 810 and the
second precursor 820 are contacted and heated, and an electric
field is applied. With the bias of the field applied as depicted in
FIG. 8B, the electric field tends to drive at least some of the
copper ions away from the tool. It is important to appreciate that
the strength of the field is higher at those locations of the tool
surface that are not relieved. Thus, the electrostatic driving
force is also substantially regularly periodically increased with
regard to a basal plane. The field as depicted exerts a force on
the copper that is opposite the direction of chemical drive on the
copper, and can be termed reverse bias (inapposite to forward
bias). Of course, the direction of the field can selected, the
magnitude of the field can be controlled and the field can be
switched on and/or off. Meanwhile, indium-gallium rich beta domains
tend to form at locations that correspond to the individual
recesses of the relieved surface of the tool. Referring to FIG. 8C,
after the electric field is removed, the tool is separated and the
domains remain intact.
Example 6
[0069] Referring to FIGS. 9A-9C, this example relates to an
embodiment of the invention including a first precursor on a
surface of a tool where a first precursor constituent is
substantially regularly periodically increased with regard to a
basal plane by utilizing a relieved substrate in combination with a
liquid coating containing the first precursor constituent. The
liquid coating is dried and then a remainder of the first precursor
is deposited. The result is an excess of the constituent relative
to a mean quantity at locations that correspond to the individual
recesses of the relieved surface of the tool. This embodiment again
includes the.use of a switchable (e.g., on-off), modulatable (e.g.,
field strength), reversible (e.g., polarity), substantially
regularly spatially periodically varying electric field strength
with respect to basal spatial location.
[0070] Referring to FIG. 9A, the liquid coating 905 containing the
first precursor constituent is applied to a tool surface 515.
Referring to FIG. 9B, the liquid coating 905 is dried and capillary
forces cause the first precursor constituent to collect at the
deepest portions of the individual recesses.
[0071] Referring to FIG. 9C, the remainder 910 of the first
precursor is planar deposited. A second precursor 920 is provided
on a back contact 522. Referring to FIG. 9D, the first precursor
910 and the second precursor 920 are contacted and heated, and an
electric field is applied. With the bias of the field applied as
depicted in FIG. 9D, the electric field tends to drive at least
some of the copper ions away from the relieved substrate. It is
important to appreciate that the strength of the field is higher at
those locations of the tool surface that are not recessed. In this
way, the electrostatic driving force is also substantially
regularly periodically increased with regard to a basal plane.
Again, the direction of the field can selected, the magnitude of
the field can be controlled and the field can be switched on and/or
off. Referring to FIG. 9E, indium-gallium rich beta domains tend to
form at locations that correspond to the individual recesses of the
relieved surface of the tool. After the electric field is removed,
the tool is separated and the domains remain intact.
Example 7
[0072] Referring to FIGS. 10A-10D, this example relates to an
embodiment of the invention including a second precursor 1000 on a
surface of a back contact 1020 where a second precursor constituent
is substantially regularly periodically increased by previously
depositing a plurality of constituent sources 1010 that include an
excess of the constituent relative to a mean quantity. Again, this
embodiment includes the use of a switchable (e.g., on-off),
modulatable (e.g., field strength), reversible (e.g., polarity),
electric field.
[0073] Referring to FIG. 10A, sources 1010 are formed on the back
contact 1020 by epitaxy. Referring to FIG. 10B, a first precursor
1030 is provided on the surface of a tool. The first precursor 1030
and the second precursor 1000 are contacted and heated, and the
electric field is applied. With the bias of the field applied as
depicted in FIG. 10C, the electric field tends to drive at least
some of the copper ions away from the surface of the tool. The
field as depicted exerts a force on the copper that is opposite the
direction of chemical drive on the copper, and can be termed
reverse bias. As in the previous examples, the direction of the
field can selected, the magnitude of the field can be controlled
and the field can be switched on and/or off. Meanwhile, the sources
1010 form copper rich alpha domains. Referring to FIG. 10D, after
the electric field is removed, the tool is separated and the
domains remain intact.
Practical Applications
[0074] A practical application of the invention that has value
within the technological arts is the manufacture of photovoltaic
devices such as absorber films or electroluminescent phosphors.
Further, the invention is useful in conjunction with the
fabrication of semiconductors (such as are used for the purpose of
transistors), or in conjunction with the fabrication of
superconductors (such as are used for the purpose magnets or
detectors), or the like. There are virtually innumerable uses for
an embodiment of the invention, all of which need not be detailed
here.
Advantages
[0075] Embodiments of the invention can be cost effective and
advantageous for at least the following reasons. Embodiments of the
invention can improve the control of formation of a segregated
phase domain structure within a chemical reaction product.
Embodiments of the invention can improve the boundary properties of
a plurality of domain structures within the segregated phase domain
structure. Embodiments of the invention can improve the performance
of chemical reaction products that include a segregated phase
domain structure. Embodiments of the invention improve quality
and/or reduce costs compared to previous approaches.
Definitions
[0076] The term layer is generically intended to mean films,
coatings and thicker structures. The term coating is subgenerically
intended to mean thin films, thick films and thicker structures.
The term composition is generically intended to mean inorganic and
organic substances such as, but not limited to, chemical reaction
products and/or physical reaction products. The term selenide is
intended to mean a material that includes the element selenium and
does not include enough oxygen to precipitate a separate selenate
base; oxygen may be present in selenide. The term tool is intended
to mean a substrate intended for re-use or multiple use.
[0077] The term program and/or the phrase computer program are
intended to mean a sequence of instructions designed for execution
on a computer system (e.g., a program and/or computer program, may
include a subroutine, a function, a procedure, an object method, an
object implementation, an executable application, an applet, a
servlet, a source code, an object code, a shared library/dynamic
load library and/or other sequence of instructions designed for
execution on a computer or computer system). The phrase radio
frequency is intended to mean frequencies less than or equal to
approximately 300 GHz as well as the infrared spectrum. Group
numbers corresponding to columns within the periodic table of the
elements use the "New Notation" convention as seen in the CRC
Handbook of Chemistry and Physics, 81.sup.st Edition (2000).
[0078] The term substantially is intended to mean largely but not
necessarily wholly that which is specified. The term approximately
is intended to mean at least close to a given value (e.g., within
10% of). The term generally is intended to mean at least
approaching a given state. The term coupled is intended to mean
connected, although not necessarily directly, and not necessarily
mechanically. The term proximate, as used herein, is intended to
mean close, near adjacent and/or coincident; and includes spatial
situations where specified functions and/or results (if any) can be
carried out and/or achieved. The term deploying is intended to mean
designing, building, shipping, installing and/or operating.
[0079] The terms first or one, and the phrases at least a first or
at least one, are intended to mean the singular or the plural
unless it is clear from the intrinsic text of this document that it
is meant otherwise. The terms second or another, and the phrases at
least a second or at least another, are intended to mean the
singular or the plural unless it is clear from the intrinsic text
of this document that it is meant otherwise. Unless expressly
stated to the contrary in the intrinsic text of this document, the
term or is intended to mean an inclusive or and not an exclusive
or.
[0080] Specifically, a condition A or B is satisfied by any one of
the following: A is true (or present) and B is false (or not
present), A is false (or not present) and B is true (or present),
and both A and B are true (or present). The terms a or an are
employed for grammatical style and merely for convenience.
[0081] The term plurality is intended to mean two or more than two.
The term any is intended to mean all applicable members of a set or
at least a subset of all applicable members of the set. The phrase
any integer derivable therein is intended to mean an integer
between the corresponding numbers recited in the specification. The
phrase any range derivable therein is intended to mean any range
within such corresponding numbers. The term means, when followed by
the term "for" is intended to mean hardware, firmware and/or
software for achieving a result. The term step, when followed by
the term "for" is intended to mean a (sub)method, (sub)process
and/or (sub)routine for achieving the recited result.
[0082] The terms "comprises," "comprising," "includes,"
"including," "has," "having" or any other variation thereof, are
intended to cover a non-exclusive inclusion. For example, a
process, method, article, or apparatus that comprises a list of
elements is not necessarily limited to only those elements but may
include other elements not expressly listed or inherent to such
process, method, article, or apparatus. The terms "consisting"
(consists, consisted) and/or "composing" (composes, composed) are
intended to mean closed language that does not leave the recited
method, apparatus or composition to the inclusion of procedures,
structure(s) and/or ingredient(s) other than those recited except
for ancillaries, adjuncts and/or impurities ordinarily associated
therewith. The recital of the term "essentially" along with the
term "consisting" (consists, consisted) and/or "composing"
(composes, composed), is intended to mean modified close language
that leaves the recited method, apparatus and/or composition open
only for the inclusion of unspecified procedure(s), structure(s)
and/or ingredient(s) which do not materially affect the basic novel
characteristics of the recited method, apparatus and/or
composition.
[0083] Unless otherwise defined, all technical and scientific terms
used herein have the same meaning as commonly understood by one of
ordinary skill in the art to which this invention belongs. In case
of conflict, the present specification, including definitions, will
control.
Conclusion
[0084] The described embodiments and examples are illustrative only
and not intended to be limiting. Although embodiments of the
invention can be implemented separately, embodiments of the
invention may be integrated into the system(s) with which they are
associated. All the embodiments of the invention disclosed herein
can be made and used without undue experimentation in light of the
disclosure. Although the best mode of the invention contemplated by
the inventor(s) is disclosed, embodiments of the invention are not
limited thereto. Embodiments of the invention are not limited by
theoretical statements (if any) recited herein. The individual
steps of embodiments of the invention need not be performed in the
disclosed manner, or combined in the disclosed sequences, but may
be performed in any and all manner and/or combined in any and all
sequences. The individual components of embodiments of the
invention need not be formed in the disclosed shapes, or combined
in the disclosed configurations, but could be provided in any and
all shapes, and/or combined in any and all configurations. The
individual components need not be fabricated from the disclosed
materials, but could be fabricated from any and all suitable
materials. Homologous replacements may be substituted for the
substances described herein.
[0085] It can be appreciated by those of ordinary skill in the art
to which embodiments of the invention pertain that various
substitutions, modifications, additions and/or rearrangements of
the features of embodiments of the invention may be made without
deviating from the spirit and/or scope of the underlying inventive
concept. All the disclosed elements and features of each disclosed
embodiment can be combined with, or substituted for, the disclosed
elements and features of every other disclosed embodiment except
where such elements or features are mutually exclusive. The spirit
and/or scope of the underlying inventive concept as defined by the
appended claims and their equivalents cover all such substitutions,
modifications, additions and/or rearrangements.
[0086] The appended claims are not to be interpreted as including
means-plus-function limitations, unless such a limitation is
explicitly recited in a given claim using the phrase(s) "means for"
and/or "step for." Subgeneric embodiments of the invention are
delineated by the appended independent claims and their
equivalents. Specific embodiments of the invention are
differentiated by the appended dependent claims and their
equivalents.
REFERENCES
[0087] (1) B. J. Stanbery, "The intra-absorber junction (IAJ) model
for the device physics of copper indium selenide-based
photovoltaics," 0-7803-8707-4/05 IEEE, presented Jan. 5, 2005,
pages 355-358. [0088] (2) Y. Yan, R. Noufi, K. M. Jones, K.
Ramanathan, M. M. Al-Jassim and B. J. Stanbery, "Chemical
fluctuation-induced nanodomains in Cu(In,Ga)Se.sub.2 films,"
Applied Physics Letters 87, 121904 American Institute of Physics,
Sept. 12, 2005. [0089] (3) Billy J. Stanbery, "Copper indium
selenides and related materials for photovoltaic devices,"
1040-8436/02 CRC Press, Inc., 2002, pages 73-117. [0090] (4) B. J.
Stanbery, S. Kincal, L. Kim, T. J. Anderson, O. D. Crisalle, S. P.
Ahrenkiel and G. Lippold "Role of Sodium in the Control of Defect
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[0091] (5) 20th European Photovoltaic Solar Energy Conference, 6-10
Jun. 2005, Barcelona, Spain, pages 1744-1747.
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