U.S. patent application number 11/323624 was filed with the patent office on 2007-07-05 for external cover for controlling the temperature of an internal thermal zone of a hard disk drive.
Invention is credited to Michael Sullivan, George Tyndall.
Application Number | 20070153414 11/323624 |
Document ID | / |
Family ID | 38223302 |
Filed Date | 2007-07-05 |
United States Patent
Application |
20070153414 |
Kind Code |
A1 |
Sullivan; Michael ; et
al. |
July 5, 2007 |
External cover for controlling the temperature of an internal
thermal zone of a hard disk drive
Abstract
External cover for hard disk drive with internal thermal zone,
including transfer interface to internal thermal zone. Disk cover
and/or disk base serving as external cover. Thermoelectric device
providing heat transfers across transfer interface to exterior, to
warm and cool internal thermal zone. Thermal controller providing
driving signal to thermoelectric device. Fan motor powering fan
moving air across thermal transfer element exterior to hard disk
drive. Manufacture of external cover, and product of that process.
Operation of external cover. Temperature measure for internal
thermal zone. Driving signal pulse-width-modulation. Hard disk
drive containing external cover. Systems using the hard disk drive
with thermal conduit. These systems include, but are not limited
to, a Redundant Arrays of Inexpensive Disks (RAID), a server
computer, a desktop computer, and a notebook computer.
Manufacturing hard disk drive and product of the process.
Inventors: |
Sullivan; Michael; (Fremont,
CA) ; Tyndall; George; (San Jose, CA) |
Correspondence
Address: |
GREGORY SMITH & ASSOCIATES
3900 NEWPARK MALL ROAD, 3RD FLOOR
NEWARK
CA
94560
US
|
Family ID: |
38223302 |
Appl. No.: |
11/323624 |
Filed: |
December 30, 2005 |
Current U.S.
Class: |
360/99.18 ;
360/245; G9B/33.041 |
Current CPC
Class: |
G06F 1/206 20130101;
G11B 25/043 20130101; G11B 33/144 20130101; G06F 1/20 20130101 |
Class at
Publication: |
360/097.01 ;
360/245 |
International
Class: |
G11B 17/00 20060101
G11B017/00; G11B 5/012 20060101 G11B005/012 |
Claims
1. An external cover for a hard disk drive, comprising: a transfer
interface thermal-coupling an internal thermal zone of said hard
disk drive to a thermoelectric device.
2. The external cover of claim 1, wherein a disk cover serves as
said external cover for said hard disk drive.
3. The external cover of claim 1, wherein a disk base serves as
said external cover to said hard disk drive.
4. The external cover of claim 1, wherein said transfer interface
provides a nearly planar surface to said thermoelectric device.
5. The external cover of claim 4, wherein said planar surface has a
surface area of at least one square inch.
6. The external cover of claim 4, wherein said planar surface has
said surface area of at most four square inches.
7. The external cover of claim 1, further comprising: said
thermoelectric device providing an exterior heat transfer interface
external thermal-coupling to said exterior of said hard disk
drive.
8. The external cover of claim 7, wherein said exterior heat
transfer interface external thermal-coupling to air in said
exterior of said hard disk drive.
9. The external cover of claim 7, wherein said thermoelectric
device, comprising: an electrical contact pair, providing enabling
power for a first heat transfer from said transfer interface to
said exterior heat transfer interface, and a second heat transfer
from said exterior heat transfer interface to said transfer
interface.
10. The external cover of claim 9, wherein a first potential
difference applied between said electrical contact pair enables
said first heat transfer; and wherein a second potential difference
applied between said electrical contact pair enables said second
heat transfer.
11. The external cover of claim 10, wherein the sign of said first
potential difference is opposite the sign of said second potential
difference.
12. The external cover of claim 11, further comprising a thermal
controller receiving a temperature measure of said internal thermal
zone and providing a driving signal to said first electrical
contact pair.
13. The external cover of claim 12, wherein said thermal controller
providing a driving signal to said first electrical contact pair,
further comprises: said thermal controller forces said driving
signal toward said first potential difference, when said
temperature measure is greater than a top operating temperature;
and said thermal controller forces said driving signal toward said
second potential difference applied, when said temperature measure
is less than a lower operating temperature.
14. The external cover of claim 11, further comprises: a second
electrical contact pair driving a fan motor powering a fan to move
said air across a thermal transfer element exterior to said hard
disk drive.
15. The external cover of claim 14, wherein said thermal controller
further provides a fan driving signal between said second
electrical contact pair to operate said fan motor.
16. The external cover of claim 15, wherein said thermal controller
provides said fan driving signal with at least one fan potential
difference distinct from zero volts, when said temperature measure
is one of the group consisting of: said temperature measure is
greater than said top operating temperature, and said temperature
measure is less than said bottom operating temperature.
17. The external cover of claim 15, wherein said fan driving signal
is at least temporarily a Direct Current (DC) signal.
18. The external cover of claim 15, wherein said fan driving signal
is at least temporarily an Alternating Current (AC) signal.
19. The external cover of claim 12, wherein said thermal
controller, further comprises at least one of: a finite state
machine generating a digital version of said driving signal based
upon said temperature measure; a computer accessibly coupled to a
memory containing a program system including at least one program
step generating a second digital version of said driving signal
based upon said temperature measure; and a neural network
responding to said temperature measure to generate a third digital
version of said driving signal.
20. The external cover of claim 19, wherein said thermal
controller, further comprises exactly one of: said finite state
machine; said computer; and said neural network.
21. The external cover of claim 19, wherein said program system,
comprises the program step: implementing said neural network
responding to said temperature measure to generate said third
digital version of said driving signal.
22. The external cover of claim 19, wherein said thermal
controller, further comprises: an analog circuit generating said
driving signal based upon at least one of: said temperature
measure, said digital version of said driving signal, said second
digital version of said driving signal, and said third digital
version of said driving signal.
23. The external cover of claim 22, wherein said analog circuit
generating said driving signal based upon exactly one of: said
temperature measure, said digital version of said driving signal,
said second digital version of said driving signal, and said third
digital version of said driving signal.
24. The external cover of claim 1, wherein said thermoelectric
device includes at least one semiconductor device acting as a heat
pump using said transfer interface to thermally-affect said
internal thermal zone.
25. A method of manufacturing said external cover of claim 1,
comprising at least one of the steps of: die-stamping a sheet of
metal to at least partly create said external cover including said
transfer interface; and molding molten metal to at least partly
create said external cover including said transfer interface.
26. The method of claim 25, wherein said sheet of said metal
includes a form of sheet stainless steel; and wherein said molten
metal includes a form of molten aluminum.
27. The external cover as a product of the process of claim 25.
28. A method of operating said external cover of claim 1,
comprising the steps: said thermoelectric device enabling a first
heat transfer from said internal thermal zone via said transfer
interface to an exterior of said hard disk drive; and said
thermoelectric device enabling a second heat transfer from said
exterior of said hard disk drive via said transfer interface to
said internal thermal zone.
29. The method of claim 28, further comprising the step: providing
a driving signal to an electrical contact pair coupling to said
thermoelectric device to enable one of the group consisting of:
said first heat transfer, said second heat transfer, and
essentially no-heat transfer.
30. The method of claim 29, wherein the step providing said driving
signal, further comprises the steps: forcing said driving signal
toward a first potential difference to enable said first heat
transfer; and forcing said driving signal toward a second potential
difference to enable said second heat transfer.
31. The method of claim 30, further comprising the steps:
determining a temperature measure of said internal thermal zone;
forcing said driving signal toward said first potential difference,
when said temperature measure is above a top operating temperature;
and forcing said driving signal toward said second potential
difference, when said temperature measure is below a bottom
operating temperature.
32. The method of claim 31, wherein the step forcing said driving
signal toward said first potential difference, further comprises
the step: pulse-wave-modulating said driving signal between said
first potential difference and zero volts based upon said
temperature measure; and wherein the step forcing said driving
signal toward said second potential difference, further comprises
the step: pulse-wave-modulating said driving signal between said
second potential difference and zero volts based upon said
temperature measure.
33. The hard disk drive of claim 1, comprising: said external cover
providing said transfer interface thermal-coupling to said internal
thermal zone.
34. The hard disk drive of claim 33, further comprising: said
thermoelectric device thermal-coupling to said transfer interface
and to an exterior heat transfer interface for heat transfers with
an exterior of said hard disk drive.
35. A system, comprising: said hard disk drive of claim 34.
36. The system of claim 35, further comprising: a thermal conduit
for said heat transfers with said exterior of said hard disk
drive.
37. The system of claim 35, wherein said system implements a
Redundant Array of Inexpensive Disks (RAID).
38. The system of claim 35, wherein said system implements a
server.
39. The system of claim 35, wherein said system implements a
desktop computer.
40. The system of claim 35, wherein said system implements a
notebook computer.
41. A method of making said system of claim 35, comprising the
step: providing said thermal conduit to said exterior of said hard
disk drive.
42. The method of claim 41, wherein said system includes at least
two of said hard disk drives; wherein said method, further
comprises the step: providing at least one of said thermal conduits
to said exterior of said hard disk drive, for each of said hard
disk drives.
43. The system as a product of the process of claim 41.
44. The method of making said hard disk drive of claim 33,
comprising at least one of the steps: using a disk cover as said
external cover to create said hard disk drive; and using a disk
base as said external cover to create said hard disk drive.
45. The method of claim 44, further comprising: both of said steps
of claim 44.
46. The hard disk drive, as a product of the process of claim 44.
Description
TECHNICAL FIELD
[0001] This invention relates to hard disk drive components, in
particular, to mechanisms to regulate and control the internal
ambient temperature inside a hard disk drive.
BACKGROUND OF THE INVENTION
[0002] Contemporary hard disk drives are faced with severe
challenges. They must operate wherever their users decide to
operate them, in environments where the hard disk drive must
operate outside of room temperature.
[0003] When a hard disk drive is too hot, many operating problems
develop. Heat tends to decay the material of the rotating disk
surfaces on which the data is stored. The mechanical component
tolerances degrade due to differences in their coefficients of
thermal expansion. The pressure at the air bearing surface will
change due to the high temperature. The breakdown of lubricants
used in the hard disk drive is accelerated. The sensitivities due
to thermal asperities during read operations is increased. The
effects of thermal pole tip protrusion are maximized.
[0004] When the hard disk drive is too cold, other operating
problems develop. The thermal coercivity of the disk media is
lowered, degrading the ability to write data to tracks on the disk
surfaces. The pressure at the air bearing surface will change due
to the low temperature. It takes longer to start up the hard disk
drive when it is cold, due to the viscosity of the lubricant in the
spindle motor. The effects of thermal pole tip protrusion are
minimized.
[0005] Today, many hard disk drives include some device measuring
the internal temperature, and in some situations, the operating
parameters of the hard disk drive are altered based upon the
measured internal temperature. In many hard disk drives, at least
part of the exterior face of the disk base is configured as a
primitive thermal transfer element. However, no hard disk drives
are known to be able to adjust their internal temperature. What is
needed is a hard disk drive able to adjust its internal temperature
toward its optimal operating temperature range.
SUMMARY OF THE INVENTION
[0006] Definitions: Heat transfer interface as used herein means
any passageway for heat transfer. Thermal-couple as used herein
refers to a layer of material between adjacent transfer interfaces
which assists the transfer of heat between the transfer interfaces;
typically but not necessarily an adhesive material.
Thermal-coupling as used herein describes the action of providing a
passageway for heat transfer.
[0007] The invention includes an external cover for a hard disk
drive containing an internal thermal zone. The external cover
includes an internal heat transfer interface which is capable of
transferring heat to a thermoelectric device in thermal contact
therewith. In some embodiments there is a thermal-coupling between
the interior heat transfer interface and the thermoelectric device.
In some embodiments the interior heat transfer interface is adhered
to the thermoelectric device using an adhesive thermal-coupling. A
disk cover and/or a disk base may serve as the external cover for
the hard disk drive. The thermoelectric device may preferably
provide heat transfers across the internal transfer interface, into
the internal thermal zone to warm it, and out of the internal
thermal zone to cool it.
[0008] The internal thermal zone may preferably include at least
one disk surface, and may preferably further include all the disk
surfaces and sliders moving near the disk surfaces.
[0009] In some embodiments, the internal heat transfer interface
may provide a nearly planar surface to the thermoelectric device.
In some preferred embodiments, the planar surface may have a
surface area of at least one square inch, and at most four square
inches.
[0010] The external cover may further include the thermoelectric
device providing an exterior heat transfer interface external
thermal-coupling to the exterior of the hard disk drive. The
thermoelectric device may include an intermediate heat transfer
interface thermal-coupling to the disk drive transfer interface.
The external thermal-coupling may further preferably be to air
exterior to the hard disk drive.
[0011] The thermoelectric device may preferably include an
electrical contact pair providing enabling power for a first heat
transfer from the interior transfer interface to the exterior heat
transfer interface to cool the disk drive, and a second heat
transfer from the exterior heat transfer interface to the interior
heat transfer interface. Preferably, applying a first potential
difference between the electrical contact pair enables the first
heat transfer, and applying a second potential difference between
the electrical contact pair enables the second heat transfer.
Preferably, the sign of the first potential difference is opposite
the sign of the second potential difference.
[0012] The external cover may further include a thermal controller
receiving a temperature measure of the internal thermal zone and
providing a driving signal to the first electrical contact pair.
Preferably, the thermal controller forces the driving signal toward
the first potential difference when the temperature measure is
greater than a top operating temperature. Preferably, the thermal
controller forces the driving signal toward the second potential
difference, when the temperature measure is less than a lower
operating temperature. The controller may also receive a signal
from the drive firmware to enable or disable.
[0013] The thermal controller may include at least one of the
following. A finite state machine generating a digital version of
the driving signal based upon the temperature measure. A computer
accessibly coupled to a memory containing a program system
including at least one program step generating a second digital
version of the driving signal based upon the temperature measure. A
neural network responding to the temperature measure to generate a
third digital version of the driving signal. The thermal controller
may further include exactly one of the finite state machine, the
computer and the neural network.
[0014] The program system may include a program step implementing
the neural network responding to the temperature measure to
generate the third digital version of the driving signal.
[0015] The thermal controller may include an analog circuit
generating the driving signal based upon at least one of the
temperature measure, the digital version of the driving signal, the
second digital version of the driving signal, and the third digital
version of the driving signal. The analog circuit may further
generate the driving signal based upon exactly one of these.
[0016] The external cover may further include a second electrical
contact pair driving a fan motor powering a fan to move air across
a thermal transfer element exterior to the hard disk drive. The
thermal controller may further provide a fan driving signal to the
second electrical contact pair. The thermal controller may
preferably provide the fan driving signal with at least one fan
potential difference distinct from zero volts, when the temperature
measure is either greater than the top operating temperature or
less than the bottom operating temperature. The fan driving signal
may be at least temporarily a Direct Current (DC) signal and/or an
Alternating Current (AC) signal.
[0017] The thermoelectric device includes at least one
semiconductor device acting as a heat pump and using the internal
heat transfer interface to thermally-affect the internal thermal
zone. The thermoelectric device may use the internal heat transfer
interface to move heat out of the internal thermal zone, which will
tend to thermally-affect the internal thermal zone by lowering its
temperature. Also, the thermoelectric device may use the internal
heat transfer interface to move heat into the internal thermal
zone, tending to thermally-affect the internal thermal zone by
raising its temperature.
[0018] Manufacture of the external cover may include at least one
of the following. Die-stamping a sheet of metal to at least partly
create the external cover including the interior heat transfer
interface. Molding molten metal to at least partly create the
external cover including the interior heat transfer interface. The
sheet of metal may preferably include a form of sheet stainless
steel. The molten metal may include a form of molten aluminum. The
invention includes the external cover as a product of this
process.
[0019] The external cover operates as follows. The thermoelectric
device enables a first heat transfer from the internal thermal zone
via the internal heat transfer interface to the exterior of the
hard disk drive, and enables a second heat transfer from the
exterior of the hard disk drive via the internal heat transfer
interface to the internal thermal zone. A driving signal may
preferably be provided to the electrical contact pair coupling to
the thermoelectric device to enable the first heat transfer, the
second heat transfer, or essentially no-heat transfer. The driving
signal may act as a direct current (DC) signal.
[0020] A temperature measure may preferably be determined for the
internal thermal zone. Forcing the driving signal toward the first
potential difference may preferably occur when the temperature
measure is greater than a top operating temperature. Forcing the
driving signal toward the second potential difference may
preferably occur when the temperature measure is less than the
bottom operating temperature.
[0021] Pulse-width-modulation may be employed. Forcing the driving
signal toward the first potential difference may preferably include
pulse-width-modulating the driving signal between the first
potential difference and zero volts, preferably based upon the
temperature measure. Forcing the driving signal toward the second
potential difference may preferably include pulse-width-modulating
the driving signal between the second potential difference and zero
volts, preferably based upon the temperature measure.
[0022] The invention includes the hard disk drive, containing the
external cover providing the internal heat transfer interface. The
hard disk drive may further include the thermoelectric device
thermal-coupled to the internal heat transfer interface and to an
exterior heat transfer interface for heat transfers with an
exterior of the hard disk drive.
[0023] The invention includes systems using at least one of the
hard disk drives, which include a thermal conduit to the hard disk
drive. These systems include, but are not limited to, a Redundant
Arrays of Inexpensive Disks (RAID), a server computer, a desktop
computer, and a notebook computer.
[0024] The invention includes manufacturing the hard disk drive,
which includes at least one of the following. Using a disk cover as
the external cover to create the hard disk drive. Using a disk base
as the external cover to create the hard disk drive. The
manufacturing may include using both the disk cover and the disk
base as external covers for the hard disk drive.
[0025] The invention includes the hard disk drive as a product of
the manufacturing process. The hard disk drive with both its disk
base and disk cover as external covers, each possessing heat
transfer interfaces may be preferred in systems supporting multiple
hard disk drives, such as a RAID, because adjacent pairs of hard
disk drives may share a thermal conduit.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] FIGS. 1 to 3 shows the invention moving heat into and out of
an internal thermal zone of the hard disk drive;
[0027] FIG. 4 shows some of the various aspects of the internal
thermal zone of FIGS. 1 to 3;
[0028] FIGS. 5 to 8C show various aspects of the external cover
with the transfer interface of FIGS. 1 to 3 with regards to the
hard disk drive;
[0029] FIGS. 9A and 11A show details of the external cover of the
previous Figures including a thermal controller;
[0030] FIGS. 9B to 10A show various aspects of the thermal
controller of FIG. 9A;
[0031] FIGS. 10B, 10C, 11B to 12F show flowcharts discussing some
of the operational aspects of the external cover; and
[0032] FIGS. 13A to 13G show various aspects of systems using the
hard disk drives of the invention.
DETAILED DESCRIPTION
[0033] This invention relates to hard disk drive components, in
particular, to mechanisms to regulate and control the internal
ambient temperature inside a hard disk drive.
[0034] The invention includes an external cover 100 for a hard disk
drive 10 containing an internal thermal zone 20. The external cover
includes an internal heat transfer interface 110 thermal-coupling
to the internal thermal zone and to a thermoelectric device 200 as
shown in FIGS. 1 to 3 through thermal-couple 112. A disk cover 16
and/or a disk base 14 may serve as the external cover for the hard
disk drive as shown in FIGS. 5 to 7C.
[0035] The thermoelectric device 200 may preferably provide two
heat transfers across the internal heat transfer interface 110 to
the exterior 300 of the hard disk drive 10, into the internal
thermal zone 20 to warm it, and out of the internal thermal zone to
cool it, as shown in FIG. 1. The thermoelectric device 200 may
preferably provide a first heat transfer 120 across the transfer
interface from the internal thermal zone to the exterior of the
hard disk drive to cool it as shown in FIG. 3. The thermoelectric
device also provides a second heat transfer 122 from the exterior
to the internal thermal zone to warm the internal thermal zone as
shown in FIG. 2.
[0036] The internal thermal zone 20 may preferably include at least
one disk surface 12-1, and may preferably further include each disk
12, each disk surface 12-1 and each slider 90 moving near the disk
surfaces as shown in FIG. 4. The internal thermal zone may further
include the head gimbal assembly 60 including the slider. The
internal thermal zone may further include the actuator arm 52
including the head gimbal assembly, likewise the actuator assembly
50 and the voice coil motor 30. The internal thermal zone may also
include the spindle 82 and/or the spindle motor 80 as shown in
FIGS. 7A, 7B, 8A, and 8B.
[0037] The internal heat transfer interface 110 may provide a
nearly planar surface to the thermoelectric device 200, as shown in
FIGS. 1 to 3, and 5 to 7B. The planar surface may have a surface
area of at least one square inch. The surface area may further be
at most four square inches.
[0038] The external cover 100 may further include the
thermoelectric device 200 providing an exterior heat transfer
interface 132 thermal-coupling to the exterior 300 of the hard disk
drive 10 through thermal-couple 134. The thermoelectric device may
include a intermediate heat transfer interface 130 in the thermal
contact through thermal-coupling 112 to the intermediate transfer
interface 110. The external thermal-coupling may further preferably
be to air 150 exterior 300 to the hard disk drive 10.
[0039] The thermoelectric device 200 may preferably include an
electrical contact pair 210 providing enabling power for a first
heat transfer 120 from the internal heat transfer interface 110 to
the exterior heat transfer interface 132, and a second heat
transfer 132 from the exterior heat transfer interface to the
transfer interface. Preferably, applying a first potential
difference V1 between the electrical contact pair 210 enables the
first heat transfer as shown in FIG. 2, and applying a second
potential difference V2 between the electrical contact pair enables
the second heat transfer as in FIG. 3. Preferably, the sign of the
first potential difference is opposite the sign of the second
potential difference.
[0040] The thermoelectric device 200 includes at least one
semiconductor device acting as a heat pump and using the internal
heat transfer interface 110 to thermally-affect the internal
thermal zone 20, as shown in FIGS. 1 to 3. The thermoelectric
device may use the transfer interface to move heat out of the
internal thermal zone, which will tend to thermally-affect the
internal thermal zone by lowering its temperature, as shown in FIG.
2. Also, the thermoelectric device may use the transfer interface
to move heat into the internal thermal zone, tending to
thermally-affect the internal thermal zone by raising its
temperature, as shown in FIG. 3.
[0041] A thermoelectric device 200 refers herein to a solid-state
heat pump that may preferably operate on the Peltier effect. The
thermoelectric device contains an array of p- and n-type
semiconductor elements heavily doped with electrical carriers. This
array is often electrically connected in series and thermally
connected in parallel and then affixed to two ceramic substrates,
the intermediate heat transfer interface 130 and the exterior heat
transfer interface 132, one on each side of the elements, as in
FIGS. 1 to 3.
[0042] Consider how the heat transfer occurs as electrons flow
through one pair of n- and p-type elements, which is referred to
herein as a couple within the thermoelectric device. Electrons can
travel freely in the conductors, which are often made of copper,
but not so freely in the semiconductor. These conductors are
labeled Cu in FIGS. 1 to 3. This discussion will now focus on FIG.
3, however, the discussion of FIG. 2 basically reverses the sign of
the voltage of the driving signal 160, reversing the flowing of
holes and electrons, as well as the direction of heat transfer,
[0043] As the electrons leave the conductor Cu, they enter the hot
side of the P-Type and must fill a hole in order to move through
the P-Type. When an electron fills a hole, it drops to a lower
energy level, releasing heat. The holes in the P-Type move from the
cold side to the hot side. As an electron moves from the P-Type
into the conductor Cu on the cold side, the electron moves to a
higher energy level through absorbing heat. The electron moves
freely through the conductor CU until reaching the cold side of the
N-Type semiconductor. When the electron moves into the N-Type, it
bumps up an energy level in order to move through the
semiconductor, absorbing heat. As the electron leaves the hot-side
of the N-Type, it moves freely in the conductor Cu. It drops to a
lower energy level releasing heat.
[0044] Heat is always absorbed at the cold side of the n- and
p-type elements. The electrical charge carriers (holes in the
P-Type; electrons in the N-Type) always travel from the cold side
to the hot side, and heat is always released at the hot side of a
thermoelectric element. The heat pumping capacity of a
thermoelectric device is proportional to the current and dependent
on the element geometry, number of couples, and material
properties.
[0045] As used herein, the Peltier effect is the phenomenon whereby
the passage of an electrical current through a junction consisting
of two dissimilar metals results in a cooling effect. When the
direction of current flow is reversed heating will occur.
[0046] A thermal transfer element 230 refers herein a device that
is typically attached to a heat transfer interface of a
thermoelectric device 200, usually the exterior heat transfer
interface 132, for heat transfers with the exterior 300 of the hard
disk drive 10. It is used to facilitate the transfer of heat
between the thermoelectric device and the exterior of the hard disk
drive. The most common thermal transfer element is an aluminum
plate that has fins attached to it, as shown in FIGS. 1 to 3, 7C
and 8C. A fan 222 is used to move ambient air 150 through the
thermal transfer element to transfer heat. Another style of thermal
transfer element uses a plate with tubing embedded in it. A liquid
is sent through the tubing to pick up heat from the thermoelectric
device.
[0047] The external cover 100 may further include a thermal
controller 500 receiving a temperature measure 510 of the internal
thermal zone 20 and providing a driving signal 160 to the
electrical contact pair 210, as shown in FIG. 9A. Preferably, the
thermal controller forces the driving signal toward the first
potential difference V1 when the temperature measure 510 is greater
than a top operating temperature 512. Preferably, the thermal
controller forces the driving signal toward the second potential
difference V2, when the temperature measure is less than a lower
operating temperature 514.
[0048] The thermal controller 500 may include at least one of the
following. A finite state machine 502 generating a digital version
of the driving signal 504 based upon the temperature measure 510 as
in FIG. 9B. A computer 520 accessibly coupled 522 to a memory 524
containing a program system 600 including at least one program step
generating a second digital version of the driving signal 526 based
upon the temperature measure as in FIG. 9C. A neural network 530
responding 532 to the temperature measure to generate a third
digital version of the driving signal 534, as in FIG. 9D. The
thermal controller may further include exactly one of the finite
state machine, the computer and the neural network, or a
combination of these elements, such as a finite state machine and a
computer, two finite state machines, and so on.
[0049] As used herein, the computer 520 will include at least one
instruction processor and at least one data processor. Each data
processor will be directed by at least one instruction processor.
The computer may be implemented in, or as, a Field Programmable
Gate Array, gate array, an application specific integrated circuit,
a digital signal processor, and/or a general-purpose
microprocessor.
[0050] The memory 524 may include memory components that are
non-volatile memories and/or volatile memories. Non-volatile
memories tend to retain their memory contents without the
application of external power, whereas volatile memories tend to
lose their memory contents without the application of external
power. The memory may and often does contain both non-volatile
memory components and volatile memory components.
[0051] The finite state machine 502 may be implemented by any
combination of: a logic circuit, a programmable logic device,
and/or a Field Programmable Gate Array. The logic circuit may be
implemented in a gate array and/or an application specific
integrated circuit.
[0052] The neural network 530 may be implemented similarly to the
finite state machine 502, and include neurons, each with a neural
state and coupling through weighted paths to other neurons. Upon
the stimulus of the temperature measure 510, the neural network
responds by calculating the path couplings, possibly changing the
state of at least some of the neurons, and taking the weighted path
response to generate the third digital version of the driving
signal 534.
[0053] The following figures include flowcharts of at least one
method of the invention possessing arrows with reference numbers.
These arrows will signify of flow of control and sometimes data,
supporting implementations including at least one program step or
program thread executing upon a computer, inferential links in an
inferential engine, state transitions in a finite state machine,
and learned responses within a neural network.
[0054] The step of starting a flowchart refers to at least one of
the following and is denoted by an oval with the text "Start" in
it. Entering a subroutine in a macro instruction sequence in a
computer. Entering into a deeper node of an inferential graph.
Directing a state transition in a finite state machine, possibly
while pushing a return state. And triggering at least one neuron in
a neural network.
[0055] The step of termination in a flowchart refers to at least
one of the following and is denoted by an oval with the text "Exit"
in it. The completion of those steps, which may result in a
subroutine return, traversal of a higher node in an inferential
graph, popping of a previously stored state in a finite state
machine, return to dormancy of the firing neurons of the neural
network.
[0056] A step in a flowchart refers to at least one of the
following. The instruction processor responds to the step as a
program step to control the data execution unit in at least partly
implementing the step. The inferential engine responds to the step
as nodes and transitions within an inferential graph based upon and
modifying a inference database in at least partly implementing the
step. The neural network responds to the step as stimulus in at
least partly implementing the step. The finite state machine
responds to the step as at least one member of a finite state
collection comprising a state and a state transition, implementing
at least part of the step.
[0057] Several flowcharts include multiple steps. In certain
aspects, any one of the steps may be found in an embodiment of the
invention. In other aspects, multiple steps are needed in an
embodiment of the invention. When multiple steps are needed, these
steps may be performed concurrently, sequentially and/or in a
combination of concurrent and sequential operations. The shapes of
the arrows in multiple step flowcharts may differ from one
flowchart to another, and are not to be construed as having
intrinsic meaning in interpreting the concurrency of the steps.
[0058] The program system 600 of FIG. 9C may implement a fuzzy
logic controller generating the second digital version of the
driving signal 526 based upon the temperature measure 510, as shown
in operation 602 of FIG. 10B. Typically, a fuzzy logic controller
includes a list of at least two fuzzy inferences.
[0059] The program system 600 may include a program step
implementing the neural network 530 responding 532 to the
temperature measure 510 to generate the third digital version of
the driving signal 534, as shown by operation 604 of FIG. 10C.
[0060] The thermal controller 500 may include an analog circuit 560
generating the driving signal 160 based upon at least one of the
temperature measure 510, the digital version of the driving signal
504, the second digital version of the driving signal 526, and the
third digital version of the driving signal 534 as shown in FIG.
10A. The analog circuit may further generate the driving signal
based upon exactly one of these.
[0061] The external cover 100 may further include a second
electrical contact pair 212 driving a fan motor 220 powering a fan
222, as shown in FIG. 11A. When powered, the fan moves air 150
across a thermal transfer element 230 exterior 300 to the hard disk
drive 10, as in FIG. 7A to 8C. The thermal controller 500 may
further provide a fan driving signal 224 to the second electrical
contact pair. The thermal controller may preferably provide the fan
driving signal with at least one fan potential difference distinct
from zero volts, when the temperature measure is either greater
than the top operating temperature 512 or less than the bottom
operating temperature 514. The fan driving signal may be at least
temporarily a Direct Current (DC) signal and/or an Alternating
Current (AC) signal.
[0062] Manufacture of the external cover 100 may include at least
one of the following. Die-stamping 700 a sheet of metal 702 to at
least partly create the external cover including the transfer
interface 110. Molding 710 molten metal 712 to at least partly
create the external cover including the transfer interface. The
sheet of metal may preferably include a form of sheet stainless
steel. The molten metal may include a form of molten aluminum. The
invention includes the external cover as a product of this
process.
[0063] The manufacture of the external cover 100 may further
include thermal-coupling a thermoelectric device 200 via the
internal heat transfer interface 110 to its intermediate heat
transfer interface 130. Such external covers are shown in FIGS. 1
to 3, and may be preferred for use in a system employing shared
fans and fan motors. Further, a thermal transfer element 230 may be
thermally-coupled to the exterior heat transfer interface 132. A
fan motor 220 and fan 222 may further be positioned near the
thermal transfer element 230, as shown in FIGS. 7A to 8C.
[0064] The external cover 100 operates as follows. While these
operations may be implemented in a variety of fashions, to simplify
their discussion, they will be discussed as implemented through
operations performed by the program system 600.
[0065] The thermoelectric device 200 enables a first heat transfer
120 from the internal thermal zone 20 via the internal heat
transfer interface 110 to the exterior 300 of the hard disk drive
10 as shown in FIG. 2, and enables a second heat transfer 122 from
the exterior of the hard disk drive via the transfer interface to
the internal thermal zone, as shown in FIG. 3. Operation 610 of
FIG. 11B supports enabling the first heat transfer and operation
612 supports enabling the second heat transfer.
[0066] A driving signal 160 may preferably be provided to the
electrical contact pair 210 coupling to the thermoelectric device
200 to enable the first heat transfer 130 as in operation 620 of
FIG. 11C, the second heat transfer 132 as in operation 620 of FIG.
11C, or essentially no-heat transfer as shown in operation 614 of
FIG. 11B. Essentially no-heat transfer refers herein to the thermal
transfer condition when no power is being expended through the
electrical contact pair.
[0067] Providing the driving signal 160 may preferably include
forcing the driving signal toward the first potential difference V1
to enable the first heat transfer 120 as in operation 630 of FIG.
12A, and forcing the driving signal toward the second potential
difference V2 to enable the second heat transfer 122 as in
operation 632 in operation 12B.
[0068] A temperature measure 510 may preferably be determined for
the internal thermal zone 20. Forcing the driving signal 160 toward
the first potential difference V1 may preferably occur when the
temperature measure is greater than a top operating temperature 512
as in operation 640 of FIG. 12C. Forcing the driving signal toward
the second potential difference V2 may preferably occur when the
temperature measure is less than the bottom operating temperature
514 as in operation 642 of FIG. 12D. In certain embodiments, the
test for when may include equality, so that forcing the driving
signal toward the first potential difference may occur when the
temperature measure is greater than or equal to the top operating
temperature.
[0069] Pulse-width-modulation may be employed. Forcing the driving
signal 160 toward the first potential difference V1 may preferably
include pulse-width-modulating the driving signal between the first
potential difference and zero volts, preferably based upon the
temperature measure 510, as in operation 650 of FIG. 12E. Forcing
the driving signal toward the second potential difference V2 may
preferably include pulse-width-modulating the driving signal
between the second potential difference and zero volts, preferably
based upon the temperature measure, as in operation 652 of FIG.
12F.
[0070] The invention includes the hard disk drive 10, containing
the external cover 100 providing the internal heat transfer
interface 110 thermal-coupling to the internal thermal zone 20. The
hard disk drive may further include the thermoelectric device 200
thermal-coupling to the transfer interface and to an exterior heat
transfer interface 132 for heat transfers with an exterior 300 of
the hard disk drive.
[0071] The invention includes a system 790 using at least one of
the hard disk drive 10 as shown in FIG. 13A. The system may include
a thermal conduit 310 thermal-coupling to the exterior 300 of the
hard disk drives shown in FIG. 13B. These systems include, but are
not limited to, a Redundant Arrays of Inexpensive Disks 800 (RAID)
as in FIG. 13C, a server computer 810 as in FIG. 13D, a desktop
computer 820 as in FIG. 13E, and a notebook computer 830 as in FIG.
13F.
[0072] The invention includes manufacturing the hard disk drive 10,
which includes at least one of the following. Using a disk cover 16
as the external cover 100 as shown in FIGS. 6 to 7C to create the
hard disk drive. Using a disk base 14 as the external cover, as
shown in FIGS. 5 and 8A to 8C, to create the hard disk drive. The
manufacturing may include using both the disk cover and the disk
base as external covers for the hard disk drive.
[0073] The invention includes the hard disk drive 10 as a product
of the manufacturing process. The hard disk drive with both its
disk base 14 and disk cover 16, each as an external cover 100, each
possessing a transfer interface 10, may be preferred in a system
790 supporting multiple hard disk drives, such as a RAID 800,
because adjacent pairs of hard disk drives may share a thermal
conduit 310, as shown in FIG. 13G.
[0074] The preceding embodiments provide examples of the invention
and are not meant to constrain the scope of the following
claims.
* * * * *