U.S. patent application number 11/702356 was filed with the patent office on 2007-06-14 for electrical and thermal contact for use in semiconductor devices and corresponding methods.
Invention is credited to Alan R. Reinberg.
Application Number | 20070134841 11/702356 |
Document ID | / |
Family ID | 22695922 |
Filed Date | 2007-06-14 |
United States Patent
Application |
20070134841 |
Kind Code |
A1 |
Reinberg; Alan R. |
June 14, 2007 |
Electrical and thermal contact for use in semiconductor devices and
corresponding methods
Abstract
A contact for use with a memory element of a semiconductor
device structure includes a conductive element and a thermal
insulator component. The conductive element establishes an
electrical path to the memory element, while the thermal insulator
component thermally insulates the memory element. The thermal
insulator component may reduce an amount of current required to
change a conductivity state of the memory element, particularly
when the memory element includes a so-called "phase change"
element. Methods for fabricating such contacts are also
disclosed.
Inventors: |
Reinberg; Alan R.;
(Westport, CT) |
Correspondence
Address: |
TRASK BRITT, P.C./ MICRON TECHNOLOGY
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
22695922 |
Appl. No.: |
11/702356 |
Filed: |
February 5, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09189098 |
Nov 9, 1998 |
7173317 |
|
|
11702356 |
Feb 5, 2007 |
|
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|
Current U.S.
Class: |
438/95 ;
257/E23.147; 257/E45.002 |
Current CPC
Class: |
H01L 45/06 20130101;
H01L 45/128 20130101; H01L 45/16 20130101; Y10S 438/90 20130101;
H01L 23/5252 20130101; H01L 45/1233 20130101; H01L 2924/0002
20130101; H01L 45/141 20130101; H01L 2924/0002 20130101; H01L
2924/00 20130101 |
Class at
Publication: |
438/095 |
International
Class: |
H01L 21/00 20060101
H01L021/00 |
Claims
1. A process for fabricating a contact on a semiconductor device,
comprising: forming a conductive portion of a contact in
communication with at least a portion of a memory element of the
semiconductor device; and forming a thermal insulator component of
the contact adjacent to the conductive portion at a location that
will at least partially thermally insulate at least the portion of
the memory element.
2. The process of claim 1, wherein forming the conductive portion
of the contact comprises configuration the conductive portion to
minimize heat dissipation from at least the portion of the memory
element of the semiconductor device.
3. The process of claim 1, wherein forming the conductive portion
comprises forming the conductive portion to include an exposed
region on the thermal insulator component.
4. The process of claim 3, wherein forming the conductive portion
comprises at least partially forming a contact region of the
conductive portion before at least partially forming the thermal
insulator component and at least partially forming the exposed
region after at least partially forming the thermal insulator
component.
5. The process of claim 1, wherein forming the thermal insulator
component comprises forming the thermal insulator component from a
material comprising at least one of a silicon oxide, a thermoset
resin, and a thermoplastic polymer.
6. The process of claim 1, wherein forming the conductive portion
comprises forming the conductive portion in communication with a
phase change element of the memory element.
7. The process of claim 6, wherein forming the thermal insulator
component comprises forming the thermal insulator component so as
to at least partially thermally insulate the phase change
element.
8. A method for thermally insulating a phase change component of a
semiconductor device structure, comprising: forming a conductive
portion of a contact in communication with the phase change
component; forming a thermal insulator component of the contact
adjacent to the conductive portion at a location that will at least
partially thermally insulate the phase change component.
9. The method of claim 8, wherein forming the conductive portion of
the contact comprises configuring the conductive portion to
minimize heat dissipation from the phase change component.
10. The process of claim 8, wherein forming the conductive portion
comprises forming the conductive portion to include an exposed
region on the thermal insulator component.
11. The process of claim 10, wherein forming the conductive portion
comprises at least partially forming a contact region of the
conductive portion before at least partially forming the thermal
insulator component and at least partially forming the exposed
region after at least partially forming the thermal insulator
component.
12. The process of claim 8, wherein forming the thermal insulator
component comprises forming the thermal insulator component from a
material comprising at least one of a silicon oxide, a thermoset
resin, and a thermoplastic polymer.
13. A contact of a semiconductor device, comprising: at least one
conductive element in communication with at least a portion of a
memory element of the semiconductor device, the at least one
conductive element being configured to minimize heat dissipation
from at least the portion of the memory element; and a thermal
insulator component positioned adjacent to the at least one
conductive element at a location that will at least partially
thermally insulate at least the portion of the memory element.
14. The contact of claim 13, wherein the thermal insulator
component is located between a contact portion of the at least one
conductive element and an exposed portion of the at least one
conductive element.
15. The contact of claim 14, wherein the contact portion and the
exposed portion substantially envelop the thermal insulator
component.
16. The contact of claim 14, wherein at least one of the said
contact portion and the exposed portion abuts a major surface of a
silicon-containing dielectric layer.
17. The contact of claim 13, wherein the thermal insulator
component comprises an insulator material including at least one of
undoped silicon dioxide, doped silicon dioxide, silicon nitride, a
thermoset polymer, and a thermoplastic polymer.
18. The contact of claim 13, configured for use with a memory
element comprising a phase change component, wherein a melting
temperature of the thermal insulator component is greater than a
temperature required to switch the phase change component between a
plurality of states.
19. A method for reducing the amount of current required to
generate a change in a conductivity state of a phase change
material of a phase change component of a memory element of a
semiconductor device, comprising providing a conductive contact
including a thermally insulative component at a location of the
semiconductor device that will at least partially thermally
insulate the phase change component.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of application Ser. No.
09/189,098, filed Nov. 9, 1998, pending. The disclosure of the
previously referenced U.S. patent application referenced is hereby
incorporated by reference in its entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an electrical and thermal
contact for use in semiconductor devices. Particularly, the present
invention relates to an electrical and thermal contact which
reduces the amount of energy input that is required in order to
switch a semiconductor device structure that is contacted thereto
between two or more states. More specifically, the electrical and
thermal contact of the present invention includes thin conductive
layers which envelop an insulator component. The electrical and
thermal contact is particularly useful for switching contacted
structures that include a phase change component between two or
more states of electrical conductivity.
[0004] 2. Background of Related Art
[0005] Electrically erasable programmable memory devices (EEPROMS)
typically include several memory elements that may be switched
between a first logic state and a second logic state. A first logic
state may be an inactive state, or an "off" state, wherein
electrical impulses do not travel across the memory element. Memory
elements may be said to be in a second logic state, such as an
"activated" state or an "on" state, when low voltage electrical
impulses (i.e., of the operational voltage of the EEPROM) will
readily travel thereacross.
[0006] Memory elements may comprise fuse elements or antifuse
elements. Fuse elements are programmed by "blowing" (i.e., breaking
the electrical connection across) the fuse thereof, which switches
the fuse elements from an active state to an inactive state.
Conversely, antifuse elements are programmed by forming a low
resistance electrical path across (i.e., activating) the antifuses
thereof. The programming of both fuse and antifuse elements
requires the application of a sufficient current and voltage to
such memory elements. Nevertheless, the application of too great a
current to memory elements, such as fuse and antifuse elements,
increases the potential that various other components of the EEPROM
of which they are a part, including without limitation the gate
oxide layer, transistors, and other structures on the surface
thereof, may be damaged.
[0007] FIG. 1 is a schematic representation of an exemplary
conventional antifuse element 1, which includes a metal contact 2,
first and second electrodes 4 and 8, respectively, and a dielectric
layer 6, which electrically insulates the first electrode 4 from
the second electrode 8. Metal contact 2 is typically a large
element relative to the remainder of antifuse element 1. As a
current is applied to metal contact 2, the resistance that is
generated thereby and by at least one of the electrodes 4, 8 that
are in contact therewith locally heats dielectric layer 6,
destroying at least a portion of the same and facilitating the
formation of an electrically conductive pathway between first
electrode 4 and second electrode 8. Thus, an electrical contact is
established between first and second electrodes 4 and 8,
respectively, thereby activating antifuse element 1.
[0008] As noted previously, programming pulses which comprise high
electrical voltages may damage various components of an EEPROM,
including, without limitation, the gate oxide layer, transistors
and other structures on the surface of the EEPROM. Consequently, in
order to reduce the potential for damaging EEPROMs during the
programming thereof, the programming pulses for EEPROMs are
ever-decreasing, as are the normal operating voltages thereof.
State of the art EEPROMs typically operate at either 5V or 3.3V.
U.S. Pat. No. 5,486,707, issued to Kevin T. Look et al. on Jan. 23,
1996, discloses an exemplary programmable memory that includes
antifuse elements that may be switched to an "on" state by a
programming voltage of about 7.5V to about 10V. While in the "off"
state, the electrical resistance of a typical EEPROM antifuse
element is on the order of about 1 gigaohm or greater. After an
antifuse of a typical state of the art EEPROM has been switched to
the "on" state by a programming pulse, the former has a low
electrical resistance, on the order of tens of ohms or less.
[0009] The memory elements of such state of the art EEPROMs
typically have lower programming voltage requirements than their
predecessors, due to the structure of the memory elements of the
former and the materials that are utilized in the memory elements.
While the programming voltage requirements of such EEPROMs are
ever-decreasing, due to the widespread use of conventional, low
thermal impedance metal contacts in connection with the antifuse
elements thereof, an extremely high current is typically required
in order to generate a sufficient temperature to activate such
antifuse elements. Further, due to the high rate at which many
conventional metal contacts dissipate heat, such contacts may
necessitate the input of even greater amounts of current in order
to adequately heat and activate an antifuse element. Moreover, the
typical use of conventional, relatively large metal contacts on
such EEPROMs is somewhat undesirable from the standpoint that such
contacts consume a great deal of surface area or "real estate" on
the surface of the semiconductor device. Thus, conventional metal
contacts limit the density of active device regions on the
semiconductor device.
[0010] The dissipation of heat away from the memory cell through
the metal contact is especially undesirable when the memory cell
includes a phase change component, such as a chalcogenide material
layer, such as the EEPROM devices disclosed in U.S. Pat. No.
5,789,758 (hereinafter "the '758 Patent"), which issued to Alan R.
Reinberg on Aug. 4, 1998. As is known in the art, chalcogenide
materials and some other phase change materials exhibit different
electrical characteristics, depending upon their state. For
example, chalcogenide materials have a lower electrical
conductivity in their amorphous state, or phase, than in their
crystalline state. Chalcogenide materials may be changed from an
amorphous state to a crystalline state by increasing their
temperature. The electrical conductivity of the material may vary
incrementally between the amorphous state and the crystalline
state.
[0011] Some EEPROMs include metal contacts that are offset from the
active device regions of the former. Such offset contacts are said
to reduce the dissipation of thermal energy from the active device
regions. Although the direct dissipation of heat from the active
device regions of such EEPROM structures may be reduced, thermal
energy is conducted to the offset metal contacts, which dissipate
heat at approximately the same rate as conventionally positioned
metal contacts.
[0012] Thus, an electrical and thermal contact is needed which
facilitates the input of reduced current and voltage into a
structure that is electrically contacted thereto (i.e., conserves
energy) and which has a low rate of thermal dissipation relative to
conventional metal contacts. A more compact electrical and/or
thermal contact structure is also needed.
SUMMARY OF THE INVENTION
[0013] The electrical and thermal contact of the present invention
addresses each of the foregoing needs. The electrical and thermal
contact of the present invention contacts a structure of a
semiconductor device, such as a phase change component of an active
device region thereof, as disclosed in the '758 Patent and in U.S.
Pat. No. 5,789,277 ("the '277 Patent"), which issued to Zahorik et
al. on Aug. 4, 1998, the disclosures of both of which are hereby
incorporated by reference in their entirety. The electrical and
thermal contact of the present invention includes an intermediate
conductive layer adjacent the contacted structure, a thermal
insulator component, which is also referred to as an insulator
component, that is adjacent the intermediate conductive layer, and
a contact layer that is adjacent the thermal insulator component
and which partially contacts the intermediate conductive layer.
Preferably, the contact layer and intermediate conductive layer are
in electrical and thermal communication with the contacted
structure. The thermal insulator component is preferably sandwiched
between the intermediate conductive layer and the contact layer,
such that the thermal insulator component is substantially
enveloped by the intermediate conductive and contact layers. An
exemplary active device region to which the electrical and thermal
contact of the present invention may be contacted is a memory cell,
or element, of an EEPROM device.
[0014] Fabricating the electrical and thermal contact includes
forming a dielectric layer around the lateral peripheral portions
of a semiconductor device structure to be contacted, patterning the
dielectric layer to expose at least a portion of the semiconductor
device structure to be contacted, such as an active device region
thereof, depositing a first thin conductive layer, depositing
another dielectric layer adjacent the first thin conductive layer,
patterning the dielectric layer to define a thermal insulator
component, depositing a second thin conductive layer adjacent the
thermal insulator component and in electrical communication with
the first thin conductive layer, and patterning the first and
second thin conductive layers to define the intermediate conductive
layer and the contact layer, respectively. The dielectric layer is
fabricated from an electrically and thermally conductive material.
Preferably, during patterning of the dielectric layer, the first
thin conductive layer is utilized as an etch stop. The processes
that may be employed to fabricate the electrical and thermal
contact facilitate the fabrication of a relatively small electrical
and thermal contact when compared with conventional metal
contacts.
[0015] Other advantages of the present invention will become
apparent to those of ordinary skill in the relevant art through a
consideration of the ensuing description, the accompanying
drawings, and the appended claims.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0016] FIG. 1 is a schematic representation of an exemplary
conventional antifuse element;
[0017] FIG. 2 is a cross-section of a contact according to the
present invention, depicting the association of the contact with a
contacted structure on the surface of a semiconductor device;
[0018] FIG. 3 is a cross-section of a variation of the
semiconductor device of FIG. 2, the contacted structure of which
includes a phase change component;
[0019] FIG. 4 is a cross-section of a semiconductor device,
depicting the formation of a first thin layer of electrically
conductive material over the phase change component of FIG. 3;
[0020] FIG. 5 is a cross-section of a semiconductor device,
depicting the formation of a dielectric layer over the first thin
layer of FIG. 4;
[0021] FIG. 6 is a cross-section of a semiconductor device,
depicting the patterning of the dielectric layer of FIG. 5;
[0022] FIG. 7 is a cross-section of a semiconductor device,
depicting the formation of a second thin layer of electrically
conductive material over the patterned dielectric layer and first
thin layer of FIG. 6;
[0023] FIG. 8 is a cross-section of a semiconductor device,
depicting the patterning of the first and second layers of FIG.
7;
[0024] FIG. 9 is a schematic cross-sectional representation of a
semiconductor device including a contact according to the present
invention which is in contact with a memory element; and
[0025] FIGS. 10 and 11 are schematic cross-sectional
representations of alternative embodiments of the electrical and
thermal contact of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0026] The present invention comprises an electrical and thermal
contact for a contacted structure of a semiconductor device. With
reference to FIGS. 2 and 3, in a preferred embodiment, the
electrical and thermal contact 10 is disposed on a surface 15 of a
semiconductor device 14. Electrical and thermal contact 10 may be
positioned adjacent a contacted structure 12, such as an antifuse
or other memory element, that is exposed through oxide layer 11,
such that it electrically and thermally contacts the contacted
structure 12. Preferably, electrical and thermal contact 10
contacts an electrically conductive phase change component 13 of
contacted structure 12 (FIG. 3), such as the memory element
disclosed in the '758 Patent. Preferably, contacted structure 12
includes a dielectric element 19 surrounding the lateral peripheral
portions of phase change component 13 to thermally and electrically
insulate the latter.
[0027] Electrical and thermal contact 10 includes a thin,
intermediate conductive layer 16, disposed adjacent contacted
structure 12, a thermal insulator component 20 positioned adjacent
intermediate conductive layer 16, and a thin, electrically
conductive contact layer 22 disposed adjacent thermal insulator
component 20. Preferably, thermal insulator component 20 is
sandwiched between intermediate conductive layer 16 and contact
layer 22, such that thermal insulator component 20 is substantially
enveloped by the intermediate and contact layers.
[0028] Phase change component 13 is preferably fabricated from an
electrically conductive phase change material, such as amorphous
silicon or a so-called "chalcogenide" alloy, which typically
includes at least one of germanium, antimony, selenium, and
tellurium. Such materials exhibit different electrical
characteristics, depending upon their state. For example, phase
change materials such as chalcogenides exhibit greater electrical
conductivity when in a crystalline phase than in an amorphous
phase.
[0029] Intermediate conductive layer 16 is positioned such that it
electrically contacts phase change component 13 and establishes
electrical communication between contact layer 22 and contacted
structure 12. Intermediate conductive layer 16 is fabricated from
an electrically conductive material and preferably has a thickness
of about 200 .ANG. or less. Preferably, in order to maintain the
structural integrity of intermediate conductive layer 16 during the
operation of semiconductor device 14, the material from which
intermediate conductive layer 16 is fabricated has a melting point
that is higher than both the ambient temperature at which
semiconductor device 14 operates and the phase change temperature
of phase change component 13. An exemplary material that may be
used to fabricate intermediate conductive layer 16 is titanium
nitride (TiN), which may be deposited in highly conformal layers of
about 200 .ANG. or less by techniques that are known in the art,
such as chemical vapor deposition processes. Other materials that
may be used to define intermediate conductive layer 16 include,
without limitation, tungsten, titanium, other refractory metals,
other refractory metal nitrides, metal alloys and other materials
which are useful as electrically conductive traces on semiconductor
devices.
[0030] Thermal insulator component 20 is disposed upon intermediate
conductive layer 16 and is preferably positioned over contacted
structure 12. Thermal insulator component 20 may be fabricated from
a thermally insulative material, such as a silicon oxide (e.g.,
SiO.sub.2), a doped silicon oxide (e.g., borophosphosilicate glass
(BPSG), phosphosilicate glass (PSG), borosilicate glass (BSG)),
silicon nitride, thermoset resins, thermoplastic polymers, and
other dielectric materials which exhibit good thermal insulative
properties.
[0031] Contact layer 22 is preferably disposed over the entire
surface of thermal insulator component 20 and over the exposed
portions of intermediate conductive layer 16 that are adjacent to
thermal insulator component 20. Contact layer 22 is fabricated from
an electrically conductive material that preferably has a thickness
of about 200 .ANG. or less. Preferably, in order to maintain the
structural integrity of contact layer 22 during the operation of
semiconductor device 14, the material from which the contact layer
22 is fabricated has a melting point that is higher than both the
ambient temperature at which semiconductor device 14 operates and
the phase change temperature of phase change component 13. An
exemplary material from which contact layer 22 may be fabricated is
titanium nitride (TiN), which may be deposited in highly conformal
layers of about 200 .ANG. or less by techniques that are known in
the art, such as chemical vapor deposition processes.
Alternatively, contact layer 22 may be manufactured from materials
including, without limitation, aluminum, tungsten, titanium, other
refractory metals, other refractory metal nitrides, metal alloys
and other materials that are useful as electrically conductive
traces in semiconductor device applications.
[0032] Turning now to FIGS. 4 through 8, a process for fabricating
electrical and thermal contact 10 is described and illustrated.
[0033] Referring now to FIG. 4, in order to form intermediate
conductive layer 16 (see FIGS. 2 and 3), a first thin layer 24 of
thermally and electrically conductive material is deposited on
surface 15 of semiconductor device 14, such that it contacts
portions of phase change component 13 that are exposed. First thin
layer 24 may be formed by techniques that are known in the art
which are capable of depositing an electrically conductive layer
formed of a desired material and having a desirable thickness and
conformity. Thin-film deposition techniques that are useful for
forming first thin layer 24 include, without limitation, chemical
vapor deposition (CVD) processes (e.g., atmospheric pressure CVD,
low pressure CVD, plasma-enhanced CVD) and sputtering, or physical
vapor deposition, processes. Such techniques typically
blanket-deposit a layer of the desired material over the entire
surface of a semiconductor device or larger substrate including a
multitude of such devices, including any exposed contacted
structures thereof.
[0034] FIG. 5 illustrates the deposition of a dielectric layer 26
adjacent first thin layer 24. Preferably, dielectric layer 26 is
deposited upon first thin layer 24. As described in greater detail
below, thermal insulator component 20 (see FIGS. 2 and 3) will be
defined from dielectric layer 26. Dielectric layer 26, which
comprises a thermally insulative material, such as those disclosed
previously in reference to FIGS. 2 and 3, may be deposited adjacent
first thin layer 24 across the contact by techniques that are known
to those in the art, such as chemical vapor deposition processes.
Dielectric layer 26 has a thickness that will provide the desired
amount of heat retention proximate phase change component 13 at a
desirable temperature to effect the desired phase change and
consequent change in the electrical conductivity of phase change
component 13.
[0035] With reference to FIG. 6, dielectric layer 26, which is
depicted by broken lines, is patterned to define one or more
distinct thermal insulator components 20 of desired dimensions
which are positioned in desired locations upon semiconductor device
14. Processes that are known in the art, such as masking and
etching, are employed to pattern dielectric layer 26 and define one
or more thermal insulator components 20 therefrom. Preferably,
first thin layer 24 is utilized as an etch stop while defining one
or more thermal insulator components 20 from dielectric layer
26.
[0036] Turning to FIG. 7, a second thin layer 28 of thermally and
electrically conductive material is then deposited adjacent thermal
insulator component 20. Second thin layer 28 is preferably
deposited conformally and in substantially uniform thickness over
surface 15 of semiconductor device 14 (or larger substrate as noted
above), including substantially over the exposed areas of the
thermal insulator component 20 and upon the exposed portions of
first thin layer 24. Second thin layer 28 may be formed by
techniques that are known in the art which are capable of
depositing an electrically conductive layer formed of a desired
material and having a desirable thickness and conformity. Thin-film
deposition techniques that are useful for forming second thin layer
28 include, without limitation, chemical vapor deposition (CVD)
processes and sputtering processes. Such techniques typically
blanket-deposit a layer of the desired material over the entire
surface 15 of semiconductor device 14.
[0037] Referring now to FIG. 8, first and second thin layers 24 and
28 are patterned to define intermediate conductive layer 16 and
contact layer 22 of each distinct electrical and thermal contact 10
on surface 15, as well as any electrical traces (not shown) that
are in electrical contact with the electrical and thermal contacts.
First and second thin layers 24 and 28 may be patterned by
techniques that are known in the art, such as masking and
etching.
[0038] The processes that may be employed to fabricate electrical
and thermal contact 10 facilitate the fabrication of a structure
that is relatively small when compared to the size of conventional
metal contacts. Similarly, electrical and thermal contact 10 may be
fabricated by processes that form and define structures of various
dimensions. The thermal and electrical conductivity of electrical
and thermal contact 10 is dependent upon several factors,
including, without limitation, the thickness of first and second
thin layers 24 and 28, the height and mass of the thermal insulator
component 20, and various characteristics of the materials from
which intermediate conductive layer 16, contact layer 22 and
thermal insulator component 20 are fabricated.
[0039] Referring again to FIG. 3, as noted previously, the
disposition of electrical and thermal contact 10 adjacent and in
direct contact with phase change component 13 of contacted
structure 12 facilitates a reduction in the overall amounts of
current and heat that are required to operate or activate contacted
structure 12 relative to the respective amount of current that is
typically required by many semiconductor devices which include
conventional heavy electrical contacts over contacted chalcogenide
memory elements. Many conventional electrical contacts dissipate
substantial amounts of thermal energy into the surrounding
environment and, thus, away from the structures in contact
therewith.
[0040] In contrast, the thin electrically conductive layers (i.e.,
intermediate conductive layer 16 and contact layer 22) and the
thermal insulator component 20 of electrical and thermal contact 10
effectively retain thermal energy in contacted structure 12. The
thin intermediate conductive layer 16 and contact layer 22 each
exhibit high impedances relative to conventional metal
contacts.
[0041] As current is conveyed through contact layer 22 and
intermediate conductive layer 16, thermal energy is created and
absorbed by phase change component 13. The long path lengths of
layers 16 and 22 provide a high thermal impedance and prevent the
heat generated in phase change component 13 from being conducted
away from phase change component 13. Thus, phase change component
13 heats to a desirable temperature (e.g., a temperature that will
switch phase change component 13 from a first conductivity state to
a second conductivity state) with a low voltage input relative to
that required by conventional metal contacts.
[0042] When phase change component 13 is heated to a sufficient
temperature, thermal insulator component 20, which is proximate to
phase change component 13, opposite intermediate conductive layer
16, prevents heat from escaping into the environment surrounding
electrical and thermal contact 10 and, therefore, prevents heat
from escaping phase change component 13.
[0043] Thus, electrical and thermal contact 10 effectively contains
thermal energy within phase change component 13 of contacted
structure 12. Moreover, due to its small surface area relative to
that of conventional metal contacts, electrical and thermal contact
10 does not dissipate heat as quickly as conventional metal
contacts. Thus, the amount of voltage that is required to effect a
thermally induced switching of contacted structure 12 from a first
state to a second state is also reduced.
[0044] FIG. 9 illustrates an exemplary use of electrical and
thermal contact 10 in an electrically erasable programmable memory
semiconductor device 30, which is also referred to as a
semiconductor device for simplicity, that includes a plurality of
memory elements 32 (although only a single memory element 32 is
illustrated in FIG. 9). Exemplary memory elements 32 with which the
electrical and thermal contact 10 of the present invention are
particularly useful include those disclosed in the '758 Patent.
Memory element 32 includes an upper contact electrode 36 and a
lower contact electrode 38, both of which may comprise a phase
change material. As illustrated, memory element 32 also includes
diffusion regions of p-doped isolation channels 39 adjacent lower
contact electrode 38 and an n-epitaxial structure 40 adjacent the
p-doped isolation channel 39. An n+channel 41, which addresses the
individual memory elements 32, is adjacent and in electrical
communication with n-epitaxial structure 40. Electrical and thermal
contact 10 preferably contacts upper contact electrode 36, which
may comprise phase change component 13. Although FIG. 9 illustrates
a vertically contacted memory element 32, the electrical and
thermal contact 10 of the present invention may also be employed in
association with other memory element designs or configurations, as
are known to those of skill in the art, as well as with other types
of memory devices and other structures that may be fabricated on
semiconductor devices and for which an infusion of thermal energy
with a reduced, or lower, level of current input may be
desired.
[0045] With continued reference to FIG. 9, as an example of the use
of electrical and thermal contact 10 in programming memory element
32, a programming impulse source 42 is placed into electrical
contact with contact layer 22. An electrical current generated by
programming impulse source 42 is then conducted through contact
layer 22 and intermediate conductive layer 16, and through the
phase change component 13 thereof, and causes phase change
component 13 to change phase, thereby altering the electrical
conductivity characteristics of phase change component 13. Thermal
insulator component 20 and low thermal conduction of upper contact
electrode 36 prevent the escape of heat from memory element 32.
Thus, self-heating of the phase change material of phase change
component 13, due in part to the resistivity thereof, heats memory
element 32 to a temperature that is sufficient to activate memory
element 32 and create a low resistance electrical pathway through
memory element 32, thereby switching memory element 32 from an
"off" state to an "on" state.
[0046] FIGS. 10 and 11 illustrate alternative embodiments of an
electrical and thermal contact 110, 110', respectively, which is
disposed on a surface 115, 115' of a semiconductor device 114, 114'
in electrical contact with a contacted structure, such as a memory
element 112, 112' of a type known in the art.
[0047] Electrical and thermal contact 110, 110' includes a thin,
electrically conductive base layer 116, 116' disposed on surface
115, 115' of semiconductor device 114, 114' and in electrical
contact with a first conductive element 130, 130' of memory element
112, 112'. A thermal insulator component 120, 120' of electrical
and thermal contact 110, 110' is disposed on base layer 116, 116'.
An electrically conductive contact layer 122, 122' is disposed
adjacent thermal insulator component 120, 120', and in electrical
contact with base layer 116, 116'. Each of the elements of
electrical and thermal contact 110, 110' may be fabricated from the
materials and by the processes that were discussed above.
[0048] Memory element 112, 112' includes a memory cell 132, 132' in
electrical contact with first conductive element 130, 130'. Memory
cell 132, 132' is fabricated as known in the art from materials
such as polysilicon that will undergo a phase change, "rupture," or
"fuse" to create a higher or lower electrical resistance pathway
upon the application of a minimum predetermined current thereto.
Memory element 112' may also include a second electrically
conductive element 134' that electrically contacts memory cell 132'
(see FIG. 11).
[0049] As an example of the use of electrical and thermal contact
110, 110' in programming a memory element 112, 112', a programming
impulse source 142, 142' is placed into contact with contact layer
122, 122'. An electrical current that is generated by programming
impulse source 142, 142' is then conducted through contact layer
122, 122' to memory element 112, 112'. Heat generated in memory
element 112, 112' causes it to switch states. The heat is prevented
from leaving the memory element 112, 112' by the low thermal
conductivity of electrical and thermal contact 110, 110'.
[0050] Although the foregoing description contains many specifics,
these should not be construed as limiting the scope of the present
invention, but merely as providing illustrations of some of the
presently preferred embodiments. Similarly, other embodiments of
the invention may be devised which do not depart from the spirit or
scope of the present invention. The scope of this invention is,
therefore, indicated and limited only by the appended claims and
their legal equivalents, rather than by the foregoing description.
All additions, deletions and modifications to the invention as
disclosed herein which fall within the meaning and scope of the
claims are to be embraced thereby.
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