U.S. patent application number 11/269658 was filed with the patent office on 2007-05-10 for assembly device for a sidelight light source module and liquid crystal panel.
Invention is credited to Tzu-Chi Cheng, Kun-Chui Lee.
Application Number | 20070103931 11/269658 |
Document ID | / |
Family ID | 38003557 |
Filed Date | 2007-05-10 |
United States Patent
Application |
20070103931 |
Kind Code |
A1 |
Lee; Kun-Chui ; et
al. |
May 10, 2007 |
Assembly device for a sidelight light source module and liquid
crystal panel
Abstract
An assembly device for a sidelight light source module and
liquid crystal panel, comprising: a liquid crystal panel; a light
guide panel; a light reflecting plate; a light source module
installed at a side of the light guide panel; wherein the light
source module comprises: a circuit board, on top of is soldered
blue light chips and red light chips; a luminescence fluorescent
layer positioned on top of the blue light chips and the red light
chips. Mixed light consisting of the excited light, the blue light
and the red light is transmitted out the fluorescent layer and
forms a white light that passes through the light guide panel, the
light reflecting plate, and is finally transmitted out the liquid
crystal panel.
Inventors: |
Lee; Kun-Chui; (Taipei City,
TW) ; Cheng; Tzu-Chi; (Baoshan Township, TW) |
Correspondence
Address: |
LOWE HAUPTMAN BERNER, LLP
1700 DIAGONAL ROAD
SUITE 300
ALEXANDRIA
VA
22314
US
|
Family ID: |
38003557 |
Appl. No.: |
11/269658 |
Filed: |
November 9, 2005 |
Current U.S.
Class: |
362/561 |
Current CPC
Class: |
G02B 6/0023 20130101;
G02B 6/0068 20130101; G02B 6/005 20130101 |
Class at
Publication: |
362/561 |
International
Class: |
A47F 3/00 20060101
A47F003/00 |
Claims
1. An assembly device for a sidelight light source module and
liquid crystal panel, comprising: a liquid crystal panel; a light
guide panel positioned below the liquid crystal panel; a light
reflecting plate positioned below the light guide panel; a light
source module installed at a side of the light guide panel; wherein
the light source module comprises: a circuit board, on top of which
is soldered at least more than one blue light chip that serves as a
blue light light-emitting source and at least more than one red
light chip that serves as a red light light-emitting source,
wherein the blue light chips and the red light chips are
reciprocally adjacent; a luminescence fluorescent layer positioned
on top of the blue light chips and the red light chips, wherein
blue light primarily excites the fluorescent layer and emits
excited light having wavelength between 500 and 570 mm; mixed light
consisting of the excited light, the blue light and the red light
is transmitted out the fluorescent layer and forms a white light
light source that is guided by the light guide panel into the light
reflecting plate, where it undergoes refraction and then
transmitted out the liquid crystal panel.
2. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein the fluorescent layer
encapsulates the adjacent blue light chips and red light chips.
3. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein a light diffuser
plate is disposed on top of the light guide panel, and the
fluorescent layer is uniformly coated on a surface of the light
diffuser plate; the blue light chips and the red light chips
soldered on the circuit board are covered with a transparent rubber
layer.
4. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein the blue light chips
and the red light chips are independently respectively disposed in
grooves of light reflecting covers, and electrode leads of the two
light reflecting covers are respectively soldered to a circuit
board; a separation distance between the two reflecting covers is
controlled to be within 1 mm; the grooves of the two light
reflecting covers are filled with the transparent rubber layer and
a surface of the circuit board is coated with the transparent
rubber layer.
5. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein fluorescent powder of
the fluorescent layer is composed of substances including yttrium
aluminum garnet or silicates (SmOn.sup.4-) or borates
(BxOy.sup.3-).
6. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein the blue light chip
and the red light chip are connected in the groove of the same
light reflecting cover, the groove is filled with the fluorescent
layer, and the two electrode leads are soldered to the circuit
board.
7. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein the substances
constituting the fluorescent powder is compounded from one or two
or three of the following compounds: cerium activator containing Y
and Al yttrium aluminum garnet (YAG:Ce.sup.3+); europium activated
garnet (YAG:Eu.sup.2+/3+); terbium activated garnet
(YAG:Tb.sup.3+).
8. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein a transparent light
intensifying film or a light intensifying prism plate is
additionally disposed between the liquid crystal panel and the
light diffuser plate.
9. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein a plurality of the
paired blue light chips and the red light chips are arranged to
form at least one row on the circuit board, and are soldered on the
circuit board using a one-dimensional straight line array
arrangement.
10. The side light source type module and liquid crystal panel
assembly device according to claim 1, wherein a bottom surface of
the light diffuser plate is formed with a prism surface consisting
of adjoining ridges and valleys having included angle smaller than
90.degree..
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the Invention
[0002] The present invention relates to an assembly device for a
sidelight light source module and liquid crystal panel, which
particularly provides a white light backlight source having
superior color rendering for a liquid crystal panel.
[0003] (b) Description of the Prior Art
[0004] Conventional structures for assembly of a liquid crystal
panel and backlight source module include Taiwan Utility Model Reg.
No. M245448, entitled "Light source module for a liquid crystal
display", which uses a light source structured from an ultraviolet
(UV) LED and red, blue and green (R, B, G) fluorescent substances.
However, a shortcoming of such a structure is that the ultraviolet
light damages current, extensively used epoxy resin structures,
causing a problem of final white light attenuation, thereby
resulting in a relatively dull white light. More particularly, a
covering layer used in the above cited patent is compounded from
red, green and blue color fluorescent substances, which causes
another shortcoming in that the ratio of the three colors and the
manufacturing process are difficult to control.
[0005] Furthermore, claim 5 of the above cited patent discloses
that the light-emitting diode is a blue light LED, and that the
fluorescent powders are red and green fluorescent substances.
However, ratio of the red fluorescent powder and the green
fluorescent powder and the manufacturing process are difficult to
control, thereby making uniformity of the mixed light (that is,
white light) also difficult to control, thereby finally producing
poor color rendering of the white light displayed by the liquid
crystal panel.
[0006] Taiwan Utility Model Reg. No. M251143, entitled "Light
source device for a liquid crystal screen", uses a light source
that is blue light or UV light of wavelength between 202 mm and 500
mm, which serves as a single light source. However, the light
source lacks a red light spectrum portion, which results in poor
color rendering and uniformity of the mixed white light (that is,
mixed light) emitted by the fluorescent screen, and is seen by the
human eye as impure white light.
[0007] Taiwan patent publication No. I228837, entitled
"Light-emitting Device", issued to the inventor of the present
invention, is a white light light-emitting diode that uses blue
light light-emitting chips and red light light-emitting chips as
two light sources, and a fluorescent layer veneers the blue light
light-emitting chips and the red light emitting-emitting chips. The
blue light source excites the fluorescent layer to emit a green
light, which is then mixed with blue and red light to form white
light. The above cited patent effectively overcomes the problem
produced by the difficult control of the ratio and manufacturing
process of mixing different color fluorescent powders of the
aforementioned patent by replacing the conventional red fluorescent
powder with a red light-emitting diode, which further enables the
induced luminescent fluorescent layer material to be a single color
material.
[0008] Such a design resolves the problem of difficult control of
the ratio and manufacturing process of mixing different colors, and
can further control an induced luminescent single excited light
wavelength (that is, green light wavelength). Furthermore, the
above patent uses a mixture of three colored lights including red
light, excited light emitted by the red light-emitting diode and
blue light, thereby obtaining white light having better color
rendering. However, embodiments of the cited patent are limited to
new designs of white light light-emitting diodes, and with regard
to application in devices assembled with a liquid crystal panel and
backlight module, the cited patent has no extended assembled
embodiments.
SUMMARY OF THE INVENTION
[0009] A primary objective of the present invention is to provide
an assembly device for a sidelight light source module and liquid
crystal panel that enables easy control of and achieves superior
color rendering and uniformity of a transmitted backlight white
light.
[0010] Another objective of the present invention is to provide the
assembly device for a sidelight light source module and liquid
crystal panel with a fluorescent layer used by a backlight source
module that is fabricated from induced luminescent material, which
enables easy control of the excited light wavelengths, thereby
achieving easy control of the color rendering and uniformity of the
backlight white light source.
[0011] Yet another objective of the present invention is to provide
the assembly device for a sidelight light source module and liquid
crystal panel with an easily replaceable light diffuser plate
coated with the fluorescent layer, thereby providing renewable
functionality.
[0012] To enable a further understanding of said objectives and the
technological methods of the invention herein, brief description of
the drawings is provided below followed by detailed description of
the preferred embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] FIG. 1 shows a cross-sectional schematic view according to
the present invention.
[0014] FIG. 2 shows a cross-sectional schematic view of another
embodiment according to the present invention.
[0015] FIG. 3 shows a cross-sectional schematic view of another
embodiment according to the present invention.
[0016] FIG. 4 shows a cross-sectional schematic view of another
embodiment according to the present invention.
[0017] FIG. 5 shows a cross-sectional schematic view of another
embodiment according to the present invention.
[0018] FIG. 6 shows a cross-sectional schematic view of another
embodiment according to the present invention.
[0019] FIG. 7 shows a partial cross-sectional view of a light
source module according to the present invention.
[0020] FIG. 8 shows a partial cross-sectional view of an embodiment
of a light source module according to the present invention.
[0021] FIG. 9 shows a partial cross-sectional view of an embodiment
of a light source module according to the present invention.
[0022] FIG. 10 shows a partial cross-sectional view of an
embodiment of a light source module according to the present
invention.
[0023] FIG. 11 shows a partial cross-sectional view of an
embodiment of a light source module according to the present
invention.
[0024] FIG. 12 shows an elevational view of the light source module
according to the present invention.
[0025] FIG. 13 shows an elevational view of another embodiment of
the light source module according to the present invention.
[0026] FIG. 14 shows an elevational view of another embodiment of
the light source module according to the present invention.
[0027] FIG. 15 shows a cross-sectional view of an embodiment of a
light diffuser plate according to the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0028] Referring to FIGS. 1 and 9, the assembly device for a
sidelight light source module and liquid crystal panel of the
present invention comprises:
[0029] a liquid crystal panel 10;
[0030] a light guide panel 20 positioned below the liquid crystal
panel 10;
[0031] a light reflecting plate 30 positioned below the light guide
panel 20;
[0032] a light source module 40 installed at a side of the light
guide panel 20; wherein the light source module comprises:
[0033] a circuit board 42, on top of which is soldered at least
more than one blue light chip 55 that serves as a blue light B
light-emitting source and at least more than one red light chip 65
that serves as a red light R light-emitting source, wherein the
blue light chips 55 and the red light chips 65 are reciprocally
adjacent;
[0034] a luminescence fluorescent layer 70 is positioned on top of
the blue light chip 55 and the red light chip 65, wherein the blue
light B is primarily used to excite the fluorescent layer 70 and
emit excited light G having wavelength between 500 and 570 mm;
mixed light consisting of the excited light G, the blue light B and
the red light R is transmitted out the fluorescent layer 70 and
forms a white light W light source that is guided by the light
guide panel 20 into the light reflecting plate 30, where it
undergoes refraction and then transmitted out the liquid crystal
panel 10.
[0035] Referring again to FIGS. 1 and 9, the fluorescent layer 70
encapsulates the adjacent blue light chip 55 and red light chip
65.
[0036] Referring to FIGS. 2 and 8, wherein a light diffuser plate
15 is disposed on a top portion of the light guide panel 20. A
uniform coating of the fluorescent layer 70 is coated on a surface
of the light diffuser plate 15. The blue light chips 55 and the red
light chips 65 soldered to the circuit board 42 are covered with
transparent rubber layers 75.
[0037] Referring again to FIG. 8, wherein the blue light chips 55
and the red light chips 65 are independently disposed in grooves
61, (61) of light reflecting covers 60, (60) respectively.
Electrode leads 62, 64 of the two light reflecting covers 60, (60)
are respectively soldered to the circuit board 42. A separation
distance L between the two reflecting covers 60, (60) is controlled
to be within 1 mm. The grooves 61, (61) of the two light reflecting
covers 60, (60) are respectively filled with the transparent rubber
layer 75 and a surface of the circuit board 42 is coated with the
transparent rubber layer 75.
[0038] Referring to FIGS. 1, 2, 3, 4, 5, 7 and 9, fluorescent
powder of the fluorescent layer 70 can be composed of substances
including yttrium aluminum garnet or silicates (SmOn.sup.4-) or
borates (BxOy.sup.3-).
[0039] Referring again to FIG. 9, wherein the blue light chip 55
and the red light chip 65 are connected in the groove 61 of the
same light reflecting cover 60. The groove 61 can be filled with
the fluorescent layer 70, and the two electrode leads 62, 64 are
soldered to the circuit board 42.
[0040] Referring again to FIGS. 1, 2, 3, 4, 5, 7 and 9, wherein the
substances constituting the fluorescent powder 70 can be compounded
from one or two or three of the following compounds: [0041] cerium
activator containing Y and Al yttrium aluminum garnet
(YAG:Ce.sup.3+); [0042] europium activated garnet
(YAG:Eu.sup.2+/3+); [0043] terbium activated garnet
(YAG:Tb.sup.3+).
[0044] Referring to FIG. 6, wherein a transparent light
intensifying film 125 or a light intensifying prism plate is
additionally disposed between the liquid crystal panel 10 and the
light diffuser plate 15.
[0045] Referring to FIGS. 12 and 13, wherein a plurality of the
paired blue light chips 55 and the red light chips 65 are arranged
to form at least one row on the circuit board 42, and are soldered
on the circuit board 42 using a one-dimensional straight line array
arrangement.
[0046] Referring to FIG. 15, wherein a bottom surface of the light
diffuser plate 15 is formed with a prism surface 156 consisting of
adjoining ridges and valleys having included angle .theta. smaller
than 90.degree..
[0047] Referring to FIG. 12, which shows a liquid crystal panel 10,
a light diffuser plate 15 and a light source module 40 having
rectangular shapes of relatively small area that are applicable for
use in small-scale liquid crystal screens. Referring to FIG. 13,
which shows the liquid crystal panel 10, the light diffuser plate
15 and the light source module 40 having rectangular square shapes
of relatively large area that are applicable for use in liquid
crystal screens of relatively large dimensions.
[0048] Referring to FIGS. 1 and 9, which shows a blue light chip 55
and a red light chip 65 encapsulated on a light source module 40
with a fluorescent layer 70. Moreover, the blue light chip 55 and
the red light chip 65 are arranged in pairs, each of which are
soldered in a groove 61 of a light reflecting cover 60. When
electricity is supplied to electrode leads 62, 64, the blue light
chips 55 and the red light chips 65 are actuated and simultaneously
emit blue light B and red light R respectively. The blue light B
primarily excites the fluorescent layer 70, thereby causing the
fluorescent layer 70 to emit excited light G having wavelength
between 500 and 570 mm, which is defined to be green light. Hence,
the mixed light of blue light B, red light R and excited light G
defined as white light W is guided by a light guide panel 20 to a
light reflecting plate 30, as depicted in FIG. 1, where it
undergoes reflection and is transmitted through a light diffuser
plate 15 and out the liquid crystal panel 10, thereby forming a
backlight source for the liquid crystal panel 10. This embodiment
primarily describes a configuration whereby the fluorescent layer
70 directly covers the blue light chip 55 and the red light chip
65.
[0049] Referring to FIGS. 2 and 12, which shows an embodiment that
primarily depicts a configuration whereby the fluorescent layer 70
is attached to different positions, and is not limited to being
attached on top of the blue and red light chips 55, 65. The
fluorescent layer 70 is coated on a top surface of the light
diffuser plate 15, and the blue and red light chips 55, 65 on the
light source module 40 are not covered by the fluorescent layer 70.
The blue and red light chips 55, 65 are actuated by a circuit of
the circuit board 42 and simultaneously emit the blue light B and
the red light R respectively, which are guided by the light guide
panel 20 into the light reflecting plate 30, where the blue light B
and the red light R are reflected toward the light diffuser plate
15 and undergo uniform diffusion thereat, whereafter the blue light
B excites the fluorescent layer 70, which emits excited light G
that is then mixed with the blue light B and the red light R to
form the white light W that is transmitted out the liquid crystal
panel 10.
[0050] Referring to FIG. 3, which shows the fluorescent layer 70
coated on a bottom surface of the light diffuser plate 15, and the
blue and red light chips 55, 65 within the light source module 40
are similarly not covered by the fluorescent layer 70. The blue
light B excites the fluorescent layer 70 to produce the excited
light G, which is transmitted through the light diffuser plate 15,
and the white light W formed from mixing the blue light B and the
red light R and the excited light G is transmitted out the liquid
crystal panel 10.
[0051] Referring to FIG. 4, which shows the fluorescent layer 70
coated on both the top surface and the bottom surface of the light
diffuser plate 15, which is a preferred practicable embodiment of
the present invention.
[0052] Referring to FIG. 5, fluorescent powder is uniformly mixed
into material of the light diffuser plate 15, thereby enabling the
light diffuser plate 15 to simultaneously serve as the luminescence
fluorescent layer 70. With such a configuration, the light source
module 40 is not covered by the fluorescent layer 70, thus, the
light source module 40 transmits the blue light B and the red light
R, which the light guide panel 20 guides into the light reflecting
plate 30, where they are reflected towards the light diffuser plate
15. The light diffuser plate 15 serves as the fluorescent layer 70
and is excited by the blue light B and emits the excited light G,
and the white light W formed from mixing the blue light B and the
red light R and the excited light G is transmitted out the liquid
crystal panel 10.
[0053] Referring to FIG. 6, which shows a light intensifying film
125 or a prism plate attached to the top surface of the light
diffuser plate 15, thereby achieving the objective of intensifying
the light. Such an embodiment has the fluorescent layer 70
fabricated into the light source module 40
[0054] Referring to FIG. 7, wherein the blue light chip 55 is
installed in the groove 61 of the independent light reflecting
cover 60, and the red light chip 65 is installed in the groove 61
of the other independent light reflecting cover 60. A distance L
between the two reflecting covers 60 is best controlled to be
between 1 and 2 mm. The groove 61 with the blue light chip 55
disposed therein can be further filled with the fluorescent layer
70, and the groove 61 with the red light chip 65 disposed therein
is filled with a transparent rubber layer 75, and the light
diffuser plate 15 is not coated with the fluorescent layer 70, as
depicted in FIG. 1. Hence, the mixed light (that is, the white
light W) emitted, consisting of the blue, red and excited lights
(B, R and G respectively), is transmitted out the liquid crystal
panel 10.
[0055] Referring to FIG. 8, which shows the blue light chip 55 and
the red light chip 65 installed into the grooves 61, (61) of the
two independent light reflecting covers 60, (60) respectively. The
two grooves 61, (61) are respectively filled with the transparent
rubber layer 75, (75). This embodiment describes a configuration
whereby the light source module 40 is not coated by the fluorescent
layer 70, and the fluorescent layer 70 is coated onto the surface
of the light diffuser plate 15, as depicted in FIGS. 2, 3, 4 and 5.
Hence, the light source modules 40 emits the blue light B and the
red light R, wherein the blue light B excites the fluorescent layer
70 coated on the surface of the light diffuser plates 15, as
depicted in FIGS. 2, 3, 4 and 5, and the excited light G excited
therefrom enables the white light W to be transmitted out the
liquid crystal panel 10.
[0056] Referring to FIG. 9, which shows the blue light chip 55 and
the red light chip 65 installed in the same groove 61 of the light
reflecting cover 60. The fluorescent layer 70 is filled in the
groove 61 and covers the blue light chip 55 and the red light chip
65. The light diffuser plate 15 is not coated with the fluorescent
layer 70, as depicted in FIG. 1, thus, the mixed white light W,
consisting of the blue, red and excited lights (B, R and G
respectively), emitted by the light source module 40 forms a
backlight source for the liquid crystal panel 10.
[0057] Referring to FIG. 10, which shows the blue and red light
chips 55, 65 directly soldered to the circuit board 42. The
fluorescent layer 70 directly encapsulates the blue and red light
chips 55, 65, or the transparent rubber layer 75 can encapsulate
the blue and red light chips 55,65. When the blue and red light
chips 55, 65 have been encapsulated by the fluorescent layer 70,
then the light diffuser plate 15 does not have a coating of the
fluorescent layer 70, as depicted in FIG. 1. However, when the blue
and red light chips 55, 65 have been encapsulated by the
transparent rubber layer 75, then the light diffuser plate 15 is
coated with the fluorescent layer 70 (as depicted in FIGS. 2, 3, 4
and 5).
[0058] Referring to FIG. 11, which shows the blue light chip 55 and
the red light chip 65 installed in the groove 61 of the light
reflecting cover 60, and the transparent rubber layer 75
encapsulates the groove 61. The light source module 40 is not
covered by the fluorescent layer 70; instead, the fluorescent layer
70 is disposed on the surface of the light diffuser plate 15 (as
depicted in FIGS. 2, 3, 4 and 5).
[0059] Referring to FIG. 15, the light diffuser plate 15 is formed
with a concavo-convex prism surface 156 consisting of adjoining
ridges and valleys that achieve the objective of intensifying
light.
[0060] The present invention is characterized in that the light
source module 40 uses light-emitting diodes including the blue
light chips 55 and the red light chips 65, which function in
coordination with the fluorescent layers 70 coated at different
locations, thereby producing a mixed light consisting of the blue
light B, the red light R and the excited light G having superior
uniformity and color rendering. The fluorescent layer 70 is
fabricated as a single luminescence colored material, eliminating
the need for mixing with other different colored fluorescent
substances, and further eliminates the concern arising from the
problem of ratio control of different fluorescent powders.
Moreover, the manufacturing process is easy to control, and more
particularly the red light chips 65 in the light source are
light-emitting diodes, enabling easy control of wavelength and
intensity of the red light R emitted therefrom.
[0061] In conclusion, the sidelight light source of the present
invention used in the field of liquid crystal panels achieves a
backlight light source--white light W having superior color
rendering and uniformity. Moreover, considerable originality and
advancement and commercial utility value of the present invention
clearly comply with essential elements as required for a new patent
application. Accordingly, a new patent application is proposed
herein.
[0062] It is of course to be understood that the embodiments
described herein are merely illustrative of the principles of the
invention and that a wide variety of modifications thereto may be
effected by persons skilled in the art without departing from the
spirit and scope of the invention as set forth in the following
claims.
* * * * *