U.S. patent application number 11/615978 was filed with the patent office on 2007-05-10 for shielded energy conditioner.
Invention is credited to Anthony Anthony, David Anthony, William Anthony.
Application Number | 20070103839 11/615978 |
Document ID | / |
Family ID | 32854295 |
Filed Date | 2007-05-10 |
United States Patent
Application |
20070103839 |
Kind Code |
A1 |
Anthony; David ; et
al. |
May 10, 2007 |
Shielded Energy Conditioner
Abstract
A structure comprising: a first electrode; a second electrode; a
shielding electrode provides improved energy conditioning when used
in electrical circuits. The structures may exist as discrete
components, as part of an interposer or a first level
interconnects, or a part of an integrated circuit.
Inventors: |
Anthony; David; (Erie,
PA) ; Anthony; Anthony; (Erie, PA) ; Anthony;
William; (Erie, PA) |
Correspondence
Address: |
NEIFELD IP LAW, PC
4813-B EISENHOWER AVENUE
ALEXANDRIA
VA
22304
US
|
Family ID: |
32854295 |
Appl. No.: |
11/615978 |
Filed: |
December 24, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10766000 |
Jan 29, 2004 |
7180718 |
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11615978 |
Dec 24, 2006 |
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60472113 |
May 21, 2003 |
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60445802 |
Feb 10, 2003 |
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60443855 |
Jan 31, 2003 |
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Current U.S.
Class: |
361/118 |
Current CPC
Class: |
H01G 4/35 20130101 |
Class at
Publication: |
361/118 |
International
Class: |
H02H 9/06 20060101
H02H009/06 |
Claims
1. A structure comprising: a first electrode; a second electrode; a
shielding electrode; wherein at least one plate of said shielding
electrode separates each plate of said first electrode from any
plate of said second electrode; at least two plates of said
shielding electrode sandwich between them all plates of said first
electrode and said second electrode; and wherein said first
electrode includes a first electrode plate having a first electrode
plate major surface and at least one first electrode plate energy
entry region, said second electrode includes a second electrode
plate having at least one second electrode plate energy entry
region; an energy pathway line segment is defined by a line segment
terminating in regions defined by a projection onto a plane
parallel to a plane defined by said first electrode plate major
surface of (1) said at least one first electrode plate energy entry
region and (2) said at least one second electrode plate energy
entry region; said energy pathway line segment having an energy
pathway line segment length; a maximal energy perpendicular line
segment corresponding to said energy pathway line segment, said
maximal energy perpendicular line segment having a maximal energy
perpendicular line segment length; wherein said maximal energy
perpendicular line segment length is greater than said energy
pathway line segment length.
2-63. (canceled)
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority to U.S. provisional
application Ser. No. 60/472,113, filed May 21, 2003, having
attorney docket number X2YA0013P-US, U.S. provisional application
Ser. No. 60/445,802, filed Feb. 10, 2003, having attorney docket
number X2YA0012P-US, and U.S. provisional application Ser. No.
60/443,855, filed Jan. 31, 2003, having attorney docket number
X2YA0011P-US, and the contents of these applications are
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] This invention relates to electrical technology. More
specifically, this invention relates to low inductance devices and
energy conditioning.
DISCUSSION OF THE BACKGROUND
[0003] The word "terminal" means electrically conductive material
at the point at which current enters or leaves an electrical
device.
[0004] The terms "X" capacitor and "line to line capacitor" both
mean a two terminal passive lumped circuit element having a
capacitance value across the two terminals wherein the two
terminals are connected in parallel configuration with a circuit
load device. X capacitors are primarily used to prevent electrical
droop across loads. That is, X capacitors are typically used to
provide storage of charge to be used as a source or sink of
electrical energy. An X capacitor can also be formed including a
conductive shield separating at least two electrodes.
[0005] The terms "Y" capacitor and "line to ground capacitor" both
mean a two terminal passive lumped circuit element having a
capacitance value across the two terminals wherein one of the two
terminals is connected to a line which is located in a circuit path
between a source and a load and the other terminal is connected to
an electrically conductive structure such as a metal layer on a PC
board that, in lumped circuit diagrams, is usually shown as a
ground. However, the voltage potential of the alleged ground may
vary depending upon the amount of charge it receives or
distributes. In applications, the alleged ground typically is one
of an earth ground, a floating ground, and a chassis ground, and
each one of these types of grounds could function as a circuit
voltage reference. Y capacitors are primarily used to filter noise
from signals.
[0006] The term "plate" is used throughout to refer to structure
typically formed by layering processes. Use of the term "plate"
herein means structures that are integrated during their formation.
The term plate as used herein means a structure with at least two
relatively large area major surfaces and one or more relatively
smaller area edge surfaces. Each major surface may but need not be
flat.
[0007] Energy conditioning means at least one of filtering,
decoupling, and transient suppression of electrical energy
propagating between a source and a load.
[0008] Filtering means modifying the frequency spectrum of a
signal.
[0009] Decoupling is a term typically applied to active circuitry.
In such circuitry, active devices change their properties, such as
trans-conductance, which affects voltage on coupled elements.
Decoupling means the minimization of the affects on the voltage of
coupled elements due to the changes in the active circuitry.
[0010] Transients include energy anomalies and energy spikes due to
external effects, such as static discharges and parasitics, such as
self induction induced in a circuit.
[0011] U.S. Pat. Nos. 6,018,448 and 6,373,673 disclose a variety of
devices that provide electrical energy conditioning. The teachings
of U.S. Pat. Nos. 6,018,448 and 6,373,673 are incorporated herein
by reference.
[0012] The novel inventions disclosed herein are structures that
have certain performance characteristics that significantly improve
at least the decoupling aspect of electrical energy conditioning
compared to the devices described above.
SUMMARY OF THE INVENTION
[0013] An object of the invention is to provide a novel structure,
a method of making the structure, and a method of using the
structure, wherein the structure has a certain capacitance and
provides energy conditioning that results in an ultra high
insertion loss and improved decoupling.
[0014] Another object of the invention is to provide a circuit
including a novel structure of the invention, a method of making
the circuit, and a method of using the circuit.
[0015] Additional objects of the invention are to provide devices,
circuits, and methods of using them that provide improved energy
conditioning over a wide frequency range.
[0016] These and other objects of the invention are provided by a
structure comprising a first electrode including a first electrode
plate, a second electrode including a second electrode plate, and
an electrically conductive shielding including a center shield
portion between the first electrode plate and the second electrode
plate and outer shield portions facing sides of the first electrode
plate and the second electrode plate opposite the sides facing the
center shield portion, wherein the elements of the structure have
certain geometric values, relative values, relative positions, and
shapes.
[0017] Generally speaking, plates of the first electrode receive
electrical energy only along a conductive path that connects to
only a portion of relatively long sides of the plate. Similarly,
generally speaking, the first electrode receive electrical energy
only along a path that connects to only a portion of relatively
long sides of the plate.
[0018] Preferably, substantially all plates of the first electrode
have substantially the same shape and are stacked vertically
aligned with one another. Preferably, substantially all plates of
the second electrode also have substantially the same shape and are
stacked substantially vertically aligned with one another. However,
plates of the first electrode and the second electrode may each
have an axis of symmetry or a plane of symmetry. If so, plates of
the second electrode may be oriented in the plane of the plates and
inverted about the axis of symmetry or plane of symmetry relative
to a plate of the first electrode.
[0019] These and other objects of the invention are provided by a
structure comprising:
[0020] a first electrode including (A) a first electrode first
plate, said first electrode first plate defining (1) a first
electrode first plate an inner surface, (2) a first electrode first
plate outer surface, and (3) a first electrode first plate edge
surface defined by perimeters of said first electrode first plate
inner surface and said first electrode first plate outer surface
and (B) a first electrode contact region having a first electrode
contact region surface for electrically contacting said first
electrode;
[0021] a second electrode including (A) a second electrode first
plate, said second electrode first plate defining (1) a second
electrode first plate an inner surface, (2) a second electrode
first plate outer surface, and (3) a second electrode first plate
edge surface defined by perimeters of said second electrode first
plate inner surface and said second electrode first plate outer
surface and (B) a second electrode contact region having a second
electrode contact region surface for electrically contacting said
second electrode;
[0022] a shielding electrode including (1) an inner shielding
plate, (2) a first outer shielding plate, (3) a second outer
shielding plate, and (4) a shielding electrode contact region
having a shielding electrode contact region surface for
electrically contacting said shielding electrode;
[0023] wherein said first electrode first plate inner surface faces
said second electrode first plate inner surface;
[0024] wherein (A) said inner shielding plate is between said a
first electrode first plate inner surface and said second electrode
first plate inner surface, (B) said first outer shielding plate is
faced by said first electrode first plate outer surface, and (C)
said second outer shielding plate is faced by said second electrode
first plate outer surface; and
[0025] wherein the elements of said structure have certain
geometric values, relative values, relative positions, and
shapes.
[0026] Hereinafter electrodes of the structures of the invention
other than the shielding electrode are sometimes referred to as
non-shielding electrodes in order to distinguish them from the
shielding electrode. A structure of the invention may include a
plurality of shielding electrodes. A structure of the invention may
include a plurality of non-shielding electrodes.
[0027] The structure may also include, in the stack of electrode
plates, additional first electrode plates of the first electrode,
second electrode plates of the second electrode, and shielding
electrode plates of the shielding electrode. The shield electrode
may include shield electrode terminals, which may be in the shape
of caps, and which include surfaces facing edges of plates of the
first and second electrodes and surfaces defining a portion of the
surface of the structure. The shield electrode terminals may also
include surfaces facing portions of outer surfaces of plates of the
first and second electrodes. The structure may have some of its
surface regions defined by electrically insulating material. Each
shielding electrode may be in the shape of a cap.
[0028] The structure preferably has an electrically insulating
material between the plates that thereby substantially prevents
electrons from moving from one electrode through the insulating
material to another electrode. The insulating material may be any
material that has a dielectric constant. Examples of the insulating
material are air, which has a dielectric constant of one,
ferro-magnetic material, ferrite material, diamond material, NPO
dielectric material, COF dielectric material, and X7R. X7R has a
dielectric constant of about 4600.
[0029] The certain geometric values, relative values, relative
positions, and shapes of structures of the invention include shapes
of each of the plates of at least the first and second electrodes
in the plane defined by the major surfaces of those plates, the
locations and relative extensions of the electrode contact regions
where electrical energy connects to those plates. In addition, the
shapes of the plates include the thickness of the plates. The
relative values include the spacings between the plates and the
alignment of plates relative to one another.
[0030] In one embodiment, plates of the invention have a
finger-like shape, and are configured to define combs.
[0031] The structures of the invention may include additional
internal structural elements, such as electrically conductive wire
lines, insulating portions and electrode edge interconnection
structures. The structures of the invention may also include
electrode terminals. The electrode terminals are conductive
structure designed for contact and electrical connection to other
circuit elements. The structures of the invention may also include
apertures which may be lined with either non-conductive or
conductive material, and which may be either partially or entirely
filled with either non-conductive or conductive material. These
apertures and their contents may serve the purpose of conducting
electrical energy from outside the structure to one or more plates
of electrodes inside the structure. Plates of the structure may
include interior surfaces defining apertures in the plates through
which electrically conductive wire lines extend. The material
inside the apertures themselves can be made conductive and can
serve in place of conductive wires. These types of apertures are
known as conductive vias. Various apertures can also have portions
that are either non-conductive and conductive areas that allow
electricity to propagate from and to predetermined areas of
electrodes to which these apertures pass thru. Electrically
conducting wire lines may electrically connect to plates of the
same electrode while extending through apertures in plates of other
electrodes and remaining insulated from those other electrodes. In
embodiments including an electrode terminal, the electrode terminal
may electrically interconnect plates of the same electrode to one
another, and physically and connect to edges of plates of the
electrode. The wire lines may be either formed and then inserted
into the apertures or formed in the apertures.
[0032] The plates of the shielding electrode are electrically
connected to one another. The plates of the shielding electrode
preferably substantially shield each plates of each non-shielding
electrode from one another. At least one plate of a non-shielding
electrode is substantially shielded by a shielding electrode from
every other plate of the non-shielding electrodes. The plates of
the shielding electrode and at least a conductive structure
electrically connects the plates of the shielding electrode to each
other in order to substantially shield the plates of the
non-shielding electrodes from one another.
[0033] A first level interconnect is a structure or device that
provides an initial circuit connection to an integrated circuit. In
use as intended, a first level interconnect has energy pathways
that connect to at least an energy source and/or to at least to an
energy return.
[0034] An interposer is a structure or device that provides a
circuit connection to an integrated circuit.
[0035] A structure of the invention may be formed as a discrete
component, such as a component suited for connection to a PC board.
Alternatively, a structure of the invention may be formed into and
form part of another structure, such as a PC board, a first level
interconnect, an interposer, or an integrated circuit, including
monolithic integrated circuits. In discrete component embodiments
of the invention, the first electrode contact region surface
defines a portion of a surface of the structure; the second
electrode contact region surface defines a portion of the surface
of the structure; and the shielding electrode contact region
surface defines a portion of the surface of the structure.
[0036] Discrete component and PC boards that incorporate the novel
structures of the invention may be formed by conventional
multiple-layering, screening, laminating and firing techniques.
[0037] In either discrete or non-discrete arrangements of the novel
structures employed for applications including, PC board and/or
integrated circuit embodiment, certain ones of the electrode
contact region surfaces that define a portion of the surface of the
structure do not exist, per se. This is because the regions where
those surfaces would otherwise define termination of a discrete
component are formed in contact with electrically conductive
material connecting to vias and/or extending from and/or through
some portion of the PC board, substrate, first level interconnect,
interposer and/or integrated circuit beyond the regions containing
the first electrode, the second electrode, and/or the shielding
electrode. Electrodes used could include arrangements with or
without holes (apertures) and any combination of such are fully
contemplated by the inventors.
[0038] Preferably, the inner shielding plate extends, in the plane
defined by its major surfaces, beyond the edges of adjacent plates
of the first and second electrodes such that, with the possible
exceptions noted below, any line passing through both of the
adjacent plates (i.e., a plate of the first electrode and a plate
of the second electrode) also passes through and/or contacts the
inner shielding plate. An exception exists wherein, in some
embodiments, relatively small regions of the plates of each of the
first and second electrodes extend beyond the extension of the
shield plates. The relatively small portions of the plates of the
first and second electrodes that extend beyond the extension of the
shield plates contact either an electrode edge interconnection
structure or an electrode terminal. The edge electrode
interconnection structure functions to electrically connect
substantially all plates of the first electrode to one another
and/or substantially all plates of the second electrode to one
another. In addition or alternatively, at least a portion of the
inner shielding plate generally extends a distance beyond the
extension of adjacent plates of the first and second electrodes by
at least one, preferably at least 5, more preferably at least 10,
and most preferably at least 20 times the distance separating the
inner shielding plate from an adjacent plate.
[0039] The electrode edge interconnection structure and/or the
electrode terminal are structures that electrically contact one or
more edges of all or substantially all of the plates of an
electrode thereby electrically connecting the plates that make up
one of the electrodes to one another. The electrode edge
interconnection structure and/or the electrode terminal of one
electrode does not contact the plates of any other electrode.
Electrode terminals typically exist in discrete components.
[0040] In PC board and integrated circuit embodiments of structures
of the invention, there may be no electrode edge interconnection
structure or electrode terminal. Instead, typically, there will be
structure electrically interconnecting all plates of the same
electrode which includes electrically conducting wire lines that
connect to plates of the same electrode. The electrically
conducting wire lines that connect to plates of one electrode do
not electrically connect to plates of other electrodes.
[0041] Preferably, the electrically conducting wire lines connected
to plates of one electrode pass through apertures in plates of
other electrodes such that those wire lines do not electrically
connect to the plates of the other electrodes. Other embodiments
include arrangements with and arrangements without electrically
conducting wire lines, and any combination of such are
contemplated.
[0042] In certain embodiments of structures of the invention, the
shield plates may be interconnected at their periphery by a
sufficient density of electrically conducting wire lines such that
the shielding electrode provides a Faraday cage effect to the first
electrode and the second electrode. Typically, the density of
electrically conducting wire lines can be made sufficient to
provide a Faraday cage effect to the first electrode and the second
electrode by spacing at least one electrically conducting wire line
at predetermined intervals or near the periphery of the shielding
electrode plates.
[0043] In some embodiments, it is preferable that the density of
electrically conducting wire lines that electrically connect to the
shielding electrode and surround the plates of the first electrode
and the second electrode is at least one per centimeter, preferably
at least one every two millimeters, and more preferably, at least
one every millimeter. In these same embodiments, there may also be
at least one and preferably several electrically conducting wire
lines electrically connecting to plates of the first electrode.
These electrically conducting wire lines pass through apertures and
do not electrical connect to plates of the other electrodes. In
these same embodiments, there may also be at least one and
preferably several electrically conducting wire lines electrically
connecting to plates of the second electrode and passing through
apertures and not electrically connecting to plates of the other
electrodes. Preferably, any electrically conducting wire line that
connects to one plate of an electrode connects to substantially all
of the remaining plates of that electrode.
[0044] Preferably, the electrically conducting wire lines are
oriented such that they extend in the direction substantially
non-parallel to the plane defined by at least one plate of one
electrode of the structure. For example, the electrically
conducting wire lines may be oriented substantially perpendicular
to a plane defined by a major surface at least one plate of one
electrode of the structure. Preferably, the electrically conductive
wire lines define either a generally circular cross-section, a
generally rectangular cross-section, or a strip shaped
cross-section.
[0045] Additional plates of the electrodes may exist in the
structure in a stacked formation such that major surfaces of plates
oppose one another. These additional plates of the electrodes
include the aforementioned three plates of the shielding electrode
interleaved between the first plate of the first electrode and the
second plate of the second electrode. The sequence of the
additional plates of the structure may include the following, in
repetitions: (1) a plate of the first electrode, followed by a
shield plate, followed by a plate of the second electrode, followed
by a shield plate; (2) a plate of the first electrode followed by
one, two, three, four, or five shield plates, a plate of the second
electrode followed by one, two, three, four, or five shield plates;
(3) a plate of either the first or second electrode followed by
one, two, three, four, or five shield plates, or more, another
plate of the first or second electrode followed by one, two, three,
four, or five shield plates, or more. Preferably, there are tens or
hundreds of the repetitions of plate sequences noted above, in each
structure. Preferably, the stack of shielding electrode plates in
each structure also terminates with at least one shield plate.
[0046] Alternatively, the foregoing sequences of plates may
entirely replace and be in lieu of three plates of the shielding
electrodes interleaved between the first plate of the first
electrode and the second plate of the second electrode.
[0047] Moreover, plates of any one electrode may be stacked such
that the respective perimeter of each plate of the same electrode
is substantially aligned or superposed with the other plates of the
same electrode, even for plates separated from one another within a
stack of plates. For example, plates of one electrode may have
their major surfaces all rectangular in shape and the same size,
and the rectangular plates may have the long axis of the rectangle
aligned with one another. Plates may alternatively be hexagonal,
circular, octagonal, pentagon, and a variety of other shapes that
can be positionally and rotationally aligned.
[0048] Furthermore, plates of one electrode may be aligned either
positionally or rotationally to plates of another electrode, for
example along axis of symmetry defined in the plane of the plates
by the shape of the plates. In addition, plates of one electrode
may be aligned offset laterally in position or rotationally skewed
relative to plates of another electrode.
[0049] Preferably, there is always at least one shield plate
between any two plates of the first electrode, the second electrode
or the first and second electrodes. Preferably, there is always at
least one shield plate exterior to all plates of the first and
second electrodes, i.e., outer shield plates. There may be two,
three, four, or five shield plates exterior to all plates of the
first and second electrodes on either or both ends of the stack of
plates.
[0050] Preferably, all plates of the first electrode have
substantially (within manufacturing tolerances) the same dimensions
and shape as one another, all plates of the second electrode have
substantially (within manufacturing tolerances) the same dimensions
and shape as one another, and generally all plates of the shielding
electrode have substantially (within manufacturing tolerances) the
same dimensions and shape as one another, with the exception of the
outer shield layers. The outer shield layers, which are those
layers exterior to all plates of the first electrode and the second
electrode, may extend further in the plane defined by the plate
surfaces than other plates of the shielding electrode. Preferably,
all of the plates are substantially planar, that is, have plate
surfaces that are flat, within manufacturing tolerances.
[0051] Additional embodiments of the invention include in
combination with any integral structure of the invention a
conductive area found beyond the structure such as on a first level
interconnect, such that the conductive area serves as a final
shielding plate for the shielding electrode of the structure of the
invention. All plates of the first electrode and all plates of the
second electrodes may also be of substantially the same dimensions
and shape as one another. All plates of the first electrode and all
plates of the second electrodes may also be positioned
complementary relative to one another and paired.
[0052] The plate thicknesses vary with the type of fabrication. For
discrete components fabricated by thick film technologies, such as
layering and subsequent firing, each layer is typically between 0.5
and 30 microns, more preferably between 1 and 10 microns. However,
the preferred layer thickness is a function of the conductivity of
the plate layers and the area of the planar surface of each plate
such that, the preferred thickness decreases as the planar
dimensions of the plates decrease or the conductivity of the
material forming the plates increases. Thus, smaller structures,
such as structures formed by semiconductor fabrication, including
lithographic processes, the preferred plate thicknesses may be as
small as a few tens or hundreds of angstroms.
[0053] The thickness of insulating layers between the conductive
plates of the first, second, and shielding electrodes are of the
same magnitude as the thickness of the conductive plates. However,
for structures designed for higher voltage circuits, the insulating
layers may be thicker than the thickness of the plates of the
conductive layers in order to avoid dielectric breakdown in the
insulating layers since thicker insulating layers reduce the
electric field strength for a given voltage. Structures designed
for higher voltage circuits may also incorporate higher dielectric
breakdown dielectric materials, such as Diamond. For structures
designed for use in lower voltage circuits, the thickness of the
insulating layers may be substantially less than the thickness of
the conductive plates. Particularly, for devices fabricated in
semiconductor layered structures, such as in integrated circuits,
the insulating layers may be less than one half, preferably less
than one fifth of the thickness of the conductive plate layers. In
digital semiconductor applications, wherein switching voltages are
typically less than 5 volts, insulating layer thicknesses are
preferably less than 20 microns, more preferably less than 5
microns, still more preferably less than 2 microns, and most
preferably less than 0.5 microns.
[0054] In discrete structures, the electrical energy typically
enters the structures at the electrical edge interconnection
structure. In non-discrete structures, the electrical energy enters
the structure along a first set of one or more conducting pathways
that are electrically connected to the first electrode, a second
set of one or more conductive pathways that are electrically
connected to the second electrode, and a third set of one or more
conductive pathways that are electrically connected to the
shielding electrode. Any one or more of the first, second, and
third sets of conductive pathways may include at least one
conductive pathway extending in substantially the same plane as a
plane defined by a major surface of a plate of one of the
electrodes of the structure. Any one or more of the first, second,
and third sets of conductive pathways may include at least one
conductive pathway extending in a direction that is substantially
non-parallel, such as substantially perpendicular, to the plane
defined by a major surface of a plate of one of the electrodes of
the structure. For example, the first, second, or third set of
conductive pathways may each include a lithographically defined
conductive line in a plane defined by a major surface of one of the
plates, or they may each include conductive material filling a via
that extends non-parallel, such as substantially perpendicular, to
the plane.
[0055] The regions of conductive pathways where electrical energy
enters the volume surrounded by the plates of the first, second,
and shielding electrodes are referred to herein below as the energy
entry regions of the first and second electrodes.
[0056] An important feature of structures of this invention are
relationships between the locations on the plates of the energy
entry regions and the shapes of the plates. One novel limitation
associated with certain structures of the invention relates to the
distance between the energy entry regions of the first and second
electrodes and the extension of the plates in a direction
perpendicular to a line connecting the projection of the energy
entry regions of the first and second electrodes onto a plane
parallel to the major surface of the plates.
[0057] More specifically, define a line segment, connecting the
projection onto a plane parallel to a major surface of a first
plate of the first electrode, of the energy entry regions of the
first and second electrodes of the structure, as an energy pathway
line segment.
[0058] Also, define the length of the energy pathway line segment
as the energy pathway line segment length.
[0059] Also, define the length of any line segment perpendicular to
the energy pathway line segment that terminates at an intersection
with the edge of one plate of the first or second electrode as an
energy perpendicular line segment.
[0060] Finally, define the longest of the energy perpendicular line
segments that intersects the energy pathway line segment as the
maximal energy perpendicular line segment, and define the length of
that segment as the maximal energy perpendicular line segment
length.
[0061] A novel limitation of certain structures of this invention
is that the maximal energy perpendicular line segment length is
equal to or greater than the energy pathway line segment
length.
[0062] Another novel limitation of certain structures of this
invention that have first and second electrodes including at least
one generally rectangular plate is that the energy entry region of
the electrode including the generally rectangular plate is closer
to a longer side of the generally rectangular plate than to either
of the short sides of the generally rectangular plate.
[0063] Another novel limitation of certain structures of this
invention that have first and second electrodes including at least
one generally rectangular plate is that the energy entry region of
the electrode including the generally rectangular plate is closer
to the center of a longer side of the generally rectangular plate
than to the ends of the longer side.
[0064] Another novel limitation of certain structures of this
invention that have first and second electrodes including at least
one generally rectangular plate is that the energy entry region of
the electrode including the generally rectangular plate extends
along a longer side of the generally rectangular plate by a
fraction of the length of the longer side of at least 1/20, more
preferably at least 1/10, more preferably at least about 1/5 and
preferably less then about 2/3.
[0065] Another novel limitation of certain structures of this
invention that have first and second electrodes including at least
one generally rectangular plate is that there are a plurality of
the energy entry regions of the electrode including the generally
rectangular plate, and the interval between at least two of those
energy entry regions extends in the direction defined by the longer
side of the generally rectangular plate by a fraction of the length
of the longer side of at least 1/20, more preferably, at least
1/10, more preferably at least about 1/5 and preferably equal to or
less then 1 and preferably less than about 2/3.
[0066] Another novel limitation of certain structures of this
invention that have first and second electrodes is that they are
shaped, they have four sides that make up a perimeter, with two
side portions of the perimeter longer than the other two side
portions of the perimeter.
[0067] One or more energy entry regions may be in a plane
substantially parallel to a plane defined by a major surface of a
plate of the first or second electrode, or in a plane perpendicular
to a plane defined by a major surface of a plate of the first or
second electrode.
[0068] The inventor recognizes that each energy entry region is not
a mathematical point and instead has a certain spatial extent.
Accordingly, and only to the extent necessary to determine whether
the novel geometric limitations disclosed herein above involving
the relative positions and locations of the energy entry regions
exist in a certain structure, associate with the one or more energy
entry regions of an electrode a mathematical point that minimizes
the mean root square distance to the loci of all points associated
with the or those energy entry region or regions. In common
language, associate one point most central to the energy entry
region or regions connecting to an electrode, and then use the
corresponding points defined for each of the electrodes (1) to
define the aforementioned line segments and (2) to determine if the
energy entry region is closer to a longer side of a generally
rectangular plate than to either of the shorter sides of the
generally rectangular plate.
[0069] For structures of the invention having electrode edge
interconnection structure or electrode terminals, the length of the
energy pathway line segment may be equal to or greater than the
length of a plate of the first or second electrode. In these
structures, a novel limitation of this invention is that a first
length defined as the length of a plate along the energy pathway
line segment is equal to or shorter than a second length defined as
the length of the plate in the direction perpendicular to the
energy pathway line segment. In these structures, another novel
limitation of this invention is that a first length defined as the
length between electrode edge interconnection structure or
electrode terminal of the first electrode and the second electrode
is equal to or shorter than a second length defined as the length
of the plate in the direction perpendicular to a plane defined by a
major surface of the edge interconnection structure or electrode
terminal and parallel to a plane defined by a major surface of a
plate of the first or the second electrode. Preferably, the ratio
of the second length to the first length is greater than one, more
preferably greater than 1.1, more preferably greater than 1.2, 1.3,
1.4, 1.5, 2, and most preferably greater than 3. Preferably, in
view of manufacturing limitations, this ratio is less than 100.
[0070] The foregoing lengths of the energy pathway line segment and
the energy perpendicular line segments are defined relative to a
single plate of the structure.
[0071] The ratio of the length of the maximal energy perpendicular
line segment to the length of the energy pathway line segment is
referred to herein as the energy pathway ratio. Preferably the
energy pathway ratio is greater than 1, preferably, greater than
1.1, more preferably greater than 1.2, 1.3, 1.4, 1.5, 2, and most
preferably greater than 3. Preferably, in view of manufacturing
limitations, this ratio is less than 100.
[0072] The shape of the plates of the first and second electrodes
vary from generally oval to generally rectangular. Preferably, the
shapes of the plates of the first and second electrodes are
generally rectangular having the edges of the plates rounded
thereby avoiding high radius of curvature corners. Preferably, edge
connection regions of the plates protrude in the plane of each
plate, relative to the rest of the same edge of the same plate,
along the direction of the energy pathway line segment. The edge
protrusion distance is sufficient to enable connection of that
plate to the edge interconnection structure or electrode
terminal.
[0073] The actual dimensions of each plate along the energy pathway
line segment and the energy perpendicular line segment depends upon
the actual embodiment which in turn depends upon intended usage
criteria including the desired DC capacitances of the structure.
For discrete components, the typical actual edge parallel dimension
and edge perpendicular dimensions range from about a tenth of a
millimeter to several centimeters. However, for large capacitance
high power applications, the inventors recognize that the actual
edge parallel dimension and edge perpendicular dimensions may
extend to tens of centimeters or meters. For example, very large
capacitance structures may be employed in power grids to reduce the
effect on line voltage of a rapid change in load.
[0074] The conductive material running non-parallel, for example,
perpendicular, to the plane defined by the large surfaces of the
plates without also contacting plates in the stack of plates that
form part of the other electrodes is referred to herein as an edge
protrusion connection.
[0075] Alternatively or in addition to including edge protrusion
regions, the plates of the same electrode may be electrically
connect to one another by an electrically conducting material
extending non-parallel, such as perpendicular, to the plane of the
plates that contacts the plates of the same electrode and passes
through apertures of plates of the other electrodes such that the
electrically conducting material extending non-parallel, such as
perpendicular, to the plane of the plates do not electrically
contact plates of the other electrodes.
[0076] The shape of the plates of the shielding electrode are
generally similar to the shape of the plates of the other
electrodes. However, preferably, the shielding plates generally
extend in the plane beyond the extension of the plates of the first
electrode and the second electrode. However, the shielding plates
may not extend beyond the extension of the edge protrusion regions
so that edge protrusion regions of each of the first electrode and
the second electrode may electrically connect the plates of each
electrode to one another without also electrically connecting to
the shielding electrode.
[0077] In one preferred embodiment, the edge protrusion connection
of each of the first electrode and the second electrode has a
surface that also defines a part of the surface of the structure.
That surface enables electrical connection of that electrode to a
circuit. In this preferred embodiment, the surface edge protrusion
connection that also defines a part of the surface of the structure
extends over three non-parallel, such as perpendicular, surfaces of
the structure such that two of those surfaces are parallel, to the
planar dimensions of the plates of the electrodes.
[0078] Preferably, the shield plates of the shielding electrode
generally extend in the plane of the plates beyond the extension of
the plates of the first electrode and the second electrode, with
exceptions for the edge protrusions of the first electrode and the
second electrode. Moreover, the shielding electrode preferably also
includes a shielding electrode edge connection that electrically
connects the plates of the shielding electrode to one another.
Preferably, the shielding electrode edge connection has a shielding
electrode edge connection electrode surface that forms part of the
surface of the structure. Preferably, the shielding electrode edge
connection electrode surface extends in a first plane non-parallel,
such as perpendicular, to the plane defined by the large area
surfaces of plates. Preferably, the shielding electrode edge
connection electrode surface also extends to part of both surfaces
of the structure that are non-perpendicular, such as parallel, to
the plane defined by the large area surfaces of the plates.
Preferably, the shielding electrode edge connection electrode
surface also extends to part of both surfaces of the structure that
are non-parallel, such as perpendicular, to the planes defined by
the large area surfaces of the plates and also non-parallel, such
as perpendicular, to the first plane perpendicular to the plane
defined by the large area surfaces of plates. Thus, in a preferred
embodiment, the shielding electrode forms a part of the surface of
the structure that covers one side of the structure. Preferably,
the shielding electrode also forms a part of the surface of the
structure that also covers the opposite side and/or complimentary
sides of the structure. In some embodiments, performance of the
structure may be improved by electrically connecting the shielding
electrode to conductive material having substantial surface area
outside of the shielding electrode. Preferably, the conductive
material having substantial surface area outside of the shielding
electrode has a surface area at least as large as the surface area
of a plate of the shield electrode, more preferably at least 2, 3,
4, 5, 10, or 100 times the surface area of a plate of the shield
electrode. Alternatively, electrically connecting the shielding
electrode to conductive material having substantial surface area,
the structure of the invention may be formed including the
conductive material having the substantial surface area. Most
preferably, the surface area of the conductive material external to
the shielding electrode and electrically connected to the shielding
electrode is large enough so that the conductive material acts as
fixed voltage for the shielding electrode.
[0079] For all embodiments of the invention, preferably there is at
least one shielding electrode plate between any plate of the first
electrode and any plate of the second electrode. For all
embodiments of the invention, preferably there is at least one
shielding plate above all plates of both non-shielding electrodes
and one shielding plate electrode below all plates of both the
first and second electrodes.
[0080] In one aspect, the invention provides a structure
comprising: a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; at least two plates of said shielding electrode
sandwich between them all plates of said first electrode and said
second electrode; and wherein said first electrode includes a first
electrode plate having a first electrode plate major surface and at
least one first electrode plate energy entry region, said second
electrode includes a second electrode plate having at least one
second electrode plate energy entry region; an energy pathway line
segment is defined by a line segment terminating in regions defined
by a projection onto a plane parallel to a plane defined by said
first electrode plate major surface of (1) said at least one first
electrode plate energy entry region and (2) said at least one
second electrode plate energy entry region; said energy pathway
line segment having an energy pathway line segment length; a
maximal energy perpendicular line segment corresponding to said
energy pathway line segment, said maximal energy perpendicular line
segment having a maximal energy perpendicular line segment length;
wherein said maximal energy perpendicular line segment length is
greater than said energy pathway line segment length.
[0081] Additional aspects of this invention include that the
structure provides an insertion loss at ten megahertz across said
first electrode and said second electrode of at least 80 dB; has a
length of each energy perpendicular line segment is greater than
said energy pathway line segment length; wherein said first
electrode plate has only one first electrode plate energy entry
region; wherein said first electrode plate has a plurality of first
electrode plate energy entry regions; wherein said at least one
first electrode plate comprises a first electrode plate necked
region that defines an energy entry region of said first electrode
plate; wherein said at least one first electrode plate intersects
at least one wire line at an energy entry region intersection, said
at least one wire line extends substantially perpendicular to said
first electrode plate major surface, and said energy entry region
intersection defines an energy entry region of said first electrode
plate; wherein said first electrode comprises a plurality of first
electrode plates and said at least one wire line intersects each
one of said plurality of first electrode plates; wherein said
energy entry region intersection does not contact a peripheral edge
of said first electrode plate; wherein said first electrode
comprises a first electrode plate having a thickness less than 50
microns; wherein said first electrode comprises a first electrode
plate having a thickness greater than a few tens of angstroms;
wherein said at least one first electrode plate comprises a first
electrode plate necked region that defines at least part of an
energy entry region of said first electrode; wherein said at least
one first electrode plate is generally rectangular and has a first
electrode plate longer side and two first electrode plate shorter
sides adjacent said first electrode plate longer side; wherein said
at least one first electrode plate has a first electrode plate
region forming at least part of an energy entry region of said
first electrode, and said first electrode plate region is closer to
said first electrode plate longer side than to either of said two
first electrode plate shorter sides; wherein said first electrode
plate longer side has a first electrode plate longer side length,
said at least one first electrode plate includes a first electrode
plate region forming at least part of an energy entry region of
said first electrode, and said first electrode plate region that
extends along said first electrode plate longer side for a length
of at least one twentieth of said first electrode plate longer side
length; wherein said first electrode plate longer side has a first
electrode plate longer side length, said at least one first
electrode plate includes a first electrode plate region forming at
least part of an energy entry region of said first electrode, and
said first electrode plate regions extends along said first
electrode plate longer side for a length of less than said first
electrode plate longer side length; wherein said first electrode
plate longer side has a first electrode plate longer side length,
said at least one first electrode plate includes a first electrode
plate region that forms at least part of an energy entry region of
said first electrode, and said first electrode plate region extends
along said first electrode plate longer side for a length of no
more than two thirds said first electrode plate longer side length;
wherein said at least one first electrode plate includes a first
electrode plate region that forms at least part of an energy entry
region of said first electrode, and said longer side has a longer
side center and two longer side ends, and said first electrode
plate region is closer to said longer side center than to either of
said two longer side ends; wherein said structure forms a discrete
component; wherein said structure forms part of an interposer or
first level interconnect to an integrated circuit; wherein said
structure forms part of an integrated circuit; wherein a ratio of
said maximal energy perpendicular line segment length to said
energy pathway line segment length is greater than 1.2; wherein
ratios of lengths of all energy perpendicular line segments to said
energy pathway line segment length are all greater than 1.5;
wherein a ratio of said energy perpendicular line segment length to
said energy pathway line segment length is greater than 2; wherein
a ratio of said energy perpendicular line segment length to said
energy pathway line segment length is less than 100; wherein said
first electrode plate major surface has a generally rectangular
shape; wherein said first electrode plate major surface has a
generally oval shape; wherein said first electrode plate major
surface has a neck that protrudes from the rest of said first
electrode plate in a direction parallel to said energy pathway line
segment; wherein the structure further comprises a first edge
interconnection structure and wherein said neck forms an edge
protrusion connection to said first edge interconnection structure;
wherein said first electrode comprises a plurality of first
electrode plates and said plurality of first electrode plates are
connected to one another by conductive material extending
perpendicular to said first electrode plate major surface; wherein
said shielding electrode comprises a plurality of shielding
electrode plates and said plurality of shielding electrode plates
are connected to one another by conductive material extending
perpendicular to said first electrode plate major surface; wherein
said shielding electrode further comprises at least one terminal;
wherein said at least two plates of said shielding electrode that
sandwich between them all plates of said first electrode and said
second electrode and said at least one terminal substantially
enclose said first electrode and said second electrode; wherein
said at least one terminal of said shielding electrode comprises at
least a first shielding electrode terminal and a second shielding
electrode terminal, and electrically conductive material extends
exterior to said first electrode and said second electrode to
connect said first shielding electrode terminal to said second
shielding electrode terminal; and wherein the structure further
comprises an electrically conductive element exterior to said first
electrode and said second electrode which is electrically connected
to said shielding electrode and which has a surface area of at
least the area defined by a plate of said shielding electrode.
[0082] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; at least two plates of said shielding electrode
sandwich between them all plates of said first electrode and said
second electrode; and a first edge electrode interconnection
structure electrically connecting plates of said first electrode to
one another; a second edge electrode interconnection structure
electrically connecting plates of said second electrode to one
another; wherein said first electrode includes a first electrode
plate having a first electrode plate major surface and at least one
first electrode plate energy entry region including a first contact
region in contact with said first edge electrode interconnection
structure; wherein said second electrode includes a second
electrode plate having a second electrode plate major surface and
at least one second electrode plate energy entry region including a
second contact region in contact with said second edge electrode
interconnection structure; an energy pathway line segment is
defined by a line segment terminating in regions defined by a
projection onto a plane parallel to a plane defined by said first
electrode plate major surface of (1) said first contact region and
(2) said second contact region; said energy pathway line segment
having an energy pathway line segment length; a maximal energy
perpendicular line segment corresponding to said energy pathway
line segment, said maximal energy perpendicular line segment having
a maximal energy perpendicular line segment length; wherein said
maximal energy perpendicular line segment length is greater than
said energy pathway line segment length.
[0083] Additional aspects of this invention include the structure
providing an insertion loss at ten megahertz across said first
electrode and said second electrode of at least 80 dB; wherein
length of each energy perpendicular line segment is greater than
said energy pathway line segment length; and wherein first
electrode plate has only one first electrode plate energy entry
region.
[0084] In another aspect, the invention provides a method of making
a structure comprising: forming a first electrode; forming a second
electrode; and forming a shielding electrode; wherein at least one
plate of said shielding electrode separates each plate of said
first electrode from any plate of said second electrode; at least
two plates of said shielding electrode sandwich between them all
plates of said first electrode and said second electrode; wherein
said first electrode includes a first electrode plate having a
first electrode plate major surface and at least one first
electrode plate energy entry region, said second electrode includes
a second electrode plate having at least one second electrode plate
energy entry region; an energy pathway line segment is defined by a
line segment terminating in regions defined by a projection onto a
plane parallel to a plane defined by said first electrode plate
major surface of (1) said at least one first electrode plate energy
entry region and (2) said at least one second electrode plate
energy entry region; said energy pathway line segment having an
energy pathway line segment length; a maximal energy perpendicular
line segment corresponding to said energy pathway line segment,
said maximal energy perpendicular line segment having a maximal
energy perpendicular line segment length; wherein said maximal
energy perpendicular line segment length is greater than said
energy pathway line segment length; wherein said forming steps
include depositing, layer by layer, material for plates of said
first electrode, said second electrode, and said shielding
electrode to form a deposited structure.
[0085] Additional aspects of this invention include comprises
depositing between layers of said first electrode, said second
electrode, and said shielding electrode, at least one of insulating
material and precursor for insulating material; the step of firing
said structure; wherein said depositing includes depositing
material in a vacuum; wherein said depositing includes depositing
material from a vapor; further comprising depositing a resist,
exposing a pattern in said resist, and removing resist
corresponding to said pattern; further comprising at least one of
depositing after removing said resist corresponding to said pattern
and etching corresponding to said pattern; further comprising
folding said deposited structure to form a folded structure; and
further comprising rolling said deposited structure to form a
generally cylindrically shaped rolled structure.
[0086] In another aspect, the invention provides a method of using
a structure, said structure comprising a first electrode; a second
electrode; and a shielding electrode; wherein at least one plate of
said shielding electrode separates each plate of said first
electrode from any plate of said second electrode; at least two
plates of said shielding electrode sandwich between them all plates
of said first electrode and said second electrode; and wherein said
first electrode includes a first electrode plate having a first
electrode plate major surface and at least one first electrode
plate energy entry region, said second electrode includes a second
electrode plate having at least one second electrode plate energy
entry region; an energy pathway line segment is defined by a line
segment terminating in regions defined by a projection onto a plane
parallel to a plane defined by said first electrode plate major
surface of (1) said at least one first electrode plate energy entry
region and (2) said at least one second electrode plate energy
entry region; said energy pathway line segment having an energy
pathway line segment length; a maximal energy perpendicular line
segment corresponding to said energy pathway line segment, said
maximal energy perpendicular line segment having a maximal energy
perpendicular line segment length; wherein said maximal energy
perpendicular line segment length is greater than said energy
pathway line segment length; said method comprising electrically
connecting said first electrode and said second electrode across a
source and a load; and applying power from said source to said
load.
[0087] Additional aspects of this method include connecting said
shielding electrode to a relatively large metallic structure which
is not electrically connected to either said first electrode or
said second electrode; wherein said relatively large metallic
structure is a chassis ground; wherein said relatively large
metallic structure is an earth ground.
[0088] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; and wherein at least one plate of said shielding
electrode separates each plate of said first electrode from any
plate of said second electrode; wherein at least two plates of said
shielding electrode sandwich between them all plates of said first
electrode and said second electrode; and wherein said first
electrode includes a generally rectangular plate having a longer
side and two shorter sides, and an energy entry region of said
first electrode is closer to a longer side of said generally
rectangular plate than to either of said two shorter sides.
[0089] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; wherein at least two plates of said shielding
electrode sandwich between them all plates of said first electrode
and said second electrode; wherein said first electrode includes a
generally rectangular plate, said generally rectangular plate
having a longer side and a shorter side, and said longer side is
longer than said shorter side, said longer side having a longer
side first end, a longer side second end, and a longer side center;
and wherein an energy entry region of said first electrode is
closer to said longer side center than to either one of said longer
side first end and longer side second end.
[0090] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; wherein at least two plates of said shielding
electrode sandwich between them all plates of said first electrode
and said second electrode; wherein said first electrode includes a
generally rectangular plate having a longer side and a shorter
side, and said longer sides is longer than said shorter side; and
wherein an energy entry region of said first electrode extends
along said longer side.
[0091] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; wherein at least two plates of said shielding
electrode sandwich between them all plates of said first electrode
and said second electrode; wherein said first electrode includes a
plate having a longer side and a shorter side, said longer side is
longer than said shorter side, and said longer side has a longer
side length; and wherein there are a plurality of the energy entry
regions for the first electrode, and the interval between at least
two of said plurality of energy entry regions extends in a
direction defined by the general extension of said longer side, and
said interval extends for less than about 2/3 of said longer side
length.
[0092] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; wherein at least two plates of said shielding
electrode sandwich between them all plates of said first electrode
and said second electrode; wherein said first electrode includes a
first electrode plate and edge interconnection structure; and
wherein a length of said first electrode plate along a direction of
an energy pathway line segment of said first electrode plate is
equal to or less than a length of said first electrode plate in a
direction non-parallel to said energy pathway line segment and
non-perpendicular to a plane defined by a major surface of said
first electrode plate.
[0093] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; wherein at least two plates of said shielding
electrode sandwich between them all plates of said first electrode
and said second electrode; wherein said first electrode includes a
first electrode plate and edge interconnection structure; and
wherein a length of said first electrode plate along a direction of
an energy pathway line segment of said first electrode plate is
equal to or less than a length of said first electrode plate in a
direction perpendicular to said energy pathway line segment and
perpendicular to a plane defined by a major surface of said first
electrode plate.
[0094] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; wherein at least two plates of said shielding
electrode sandwich between them all plates of said first electrode
and said second electrode; wherein said first electrode includes a
first electrode plate and a first electrode terminal; wherein said
second electrode includes a second electrode plate and a second
electrode terminal; and wherein a length of a first line segment
extending from said first electrode terminal to said second
electrode terminal in a plane defined by said first electrode plate
is equal to or shorter than a length of a second line segment
extending rom said first electrode plate in a direction in said
plane and perpendicular to said first line segment.
[0095] In another aspect, the invention provides a structure
comprising a first electrode; a second electrode; and a shielding
electrode; wherein at least one plate of said shielding electrode
separates each plate of said first electrode from any plate of said
second electrode; wherein at least two plates of said shielding
electrode sandwich between them all plates of said first electrode
and said second electrode; wherein said first electrode includes a
first electrode plate and a first electrode terminal; wherein said
second electrode includes a second electrode plate and a second
electrode terminal; and wherein a length of a first line segment
extending from said first electrode terminal to said second
electrode terminal in a plane defined by said first electrode plate
is equal to or shorter than a length of a second line segment
extending rom said first electrode plate in a direction in said
plane and non-parallel to said first line segment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0096] These and other aspects of the inventions are described with
reference to the following drawings wherein like reference numerals
refer to identical or corresponding elements.
[0097] FIG. 1 is a schematic of a test circuit used to test
insertion loss of devices;
[0098] FIG. 2 is a graph showing measurement of insertion loss in a
log sweep mode for two devices;
[0099] FIG. 3 is a perspective view of devices of the type tested
using the circuit of FIG. 1 and for which insertion loss is shown
in FIG. 2;
[0100] FIG. 4a is a perspective view of part of a first device
structure of the type tested using the circuit of FIG. 1 and for
which insertion loss is shown in FIG. 2 as curve 210, and wherein
edge interconnection structure and/or electrode terminal is removed
to show portions of electrode plates that electrically contact to
the edge interconnection structure and/or electrode terminal.
[0101] FIG. 4b is a perspective view of part of a second device
structure 400a of the type tested using the circuit of FIG. 1 and
for which insertion loss is shown in FIG. 2 as curve 220, and
wherein the edge interconnection structure and/or electrode
terminal is removed to show portions of electrode plates that
electrically contact to the edge interconnection structure and/or
electrode terminal. Structure 400a is a first embodiment of the
invention.
[0102] FIG. 5. is a perspective sectional view along the line X-X
in FIG. 4b showing arrangement of electrode plates 401b-405b,
[0103] FIG. 6 is a perspective sectional view along the line Y-Y in
FIG. 4b showing arrangement of electrode plates 401b-405b.
[0104] FIG. 7 is a top sectional view along the line Z1-Z1 in FIG.
4b, i.e., exposing on a top surface the lowest one of the three
shielding electrode plates 401b and surrounding material.
[0105] FIG. 8 is a top sectional view along the line Z2-Z2 in FIG.
4b, i.e., exposing a top surface of lower non-shielding electrode
plate 402b and surrounding material.
[0106] FIG. 9 is a top sectional view along the line Z4-Z4 in FIG.
4b, i.e., exposing a top surface of upper non-shielding electrode
plate 404b and surrounding material.
[0107] FIG. 10 is a perspective sectional view along the line X-X
in FIG. 4a showing arrangement of electrode plates 401a-405a.
[0108] FIG. 11 is a perspective sectional view along the line Y-Y
in FIG. 4a showing the arrangement of electrode plates
401a-405a.
[0109] FIG. 12 is a top sectional view along the line Z1-Z1 in FIG.
4a., i.e., exposing a top surface of the lower shielding electrode
layer 401a and surrounding material;
[0110] FIG. 13 is a top sectional view along the line Z2-Z2 in FIG.
4a., i.e., exposing a top surface of the lower non-shielding
electrode layer 402a and surrounding material;
[0111] FIG. 14 is a top sectional view along the line Z4-Z4 in FIG.
4a., i.e., exposing a top surface of the upper non-shielding
electrode layer 404a and surrounding material;
[0112] FIG. 15 is a perspective partial sectional view showing
portions of eleven shield plates of a shielding electrode, five
plates of a first electrode, and five plates of a second electrode,
and an electrode interconnection structure of a structure 1500 of a
second embodiment of the invention.
[0113] FIG. 16a is a partial section and schematic view at a plane
intersecting a conductive wire line electrically connecting plates
of a first electrode to one another and conductive wire line
electrically connecting plates of a second electrode to one another
of structure 1600 of third through fifth embodiments of the
invention.
[0114] FIG. 16b is a partial section and schematic view in a plane
intersecting conductive wire lines electrically connecting plates
of the shielding electrode to one another of structure 1600.
[0115] FIG. 16c is a plan view showing a surface of a plate of the
shielding electrode showing locations of intersection with the
conductive wire lines and optional apertures of structure 1600.
[0116] FIG. 16d is a plan view showing a surface of a plate of a
non-shielding electrode showing intersections with conductive wire
lines and optional apertures of structure 1600.
[0117] FIG. 17 is a plan view generally showing two electrodes
plates and examples of an energy pathway line segment and two
energy perpendicular line segments including the maximal energy
perpendicular line segment.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0118] FIG. 1 shows a schematic of test circuit 1 including source
10, device 20, meter 30, common points 40, 50, ground (or source or
sink of charge) 60, and device contacts or terminals a, b, and g.
Source 10 is a source capable of providing voltage, current, or
power with specified frequency components. Meter 30 is a device
capable of measuring transmission of the signal provided by source
10 across the a and b terminals of device 20.
[0119] Device 10 is a device which, in a lumped element theory,
would be considered a three terminal device. Lumped element theory
corresponds fixed values for inductance and/or capacitance with a
physical structure of an element. A lumped element theory may not
adequately describe the circuit properties of device 10.
[0120] Device 10 is a device which, in a distributed element
theory, would be considered as having at least three terminals.
Distributed element theory associates values for inductance and/or
capacitance to each conductive portion of a circuit, such as in
transmission line theory.
[0121] Device 10 may be a device which when energized, for example,
becomes a voltage divider. When the energy potential measured
across a source to meter line/load connection A from point 40 to a
line having a meter to source return connection B from point 50 has
a voltage V1, and the potential between these conductors and ground
60 is a voltage V2 being approximately half of the voltage V1, by
interposing the shielding electrode structure (not shown) between
non-shielding electrodes (also not shown), a phase balancing device
and a voltage divider is created. It should be noted that this
configuration can be easily and economically achieved using
substantially less dielectric material disposed between
non-shielding electrode plates relative to a shielding electrode
plate to accommodate the voltage V2 as desired. It is of course
recognized that the configuration or location and the numbers of
shielding electrode plates could be modified to reflect or cause a
change in the relative energized relationship between voltages V1
and V2.
[0122] Alternative novel structures of device 10 are described
herein below.
[0123] FIG. 2 is a graph 200 in which the x axis depicts frequency
from ten thousand hertz to ten gigahertz and the y axis depicts
transmission loss in dB from 0 to -120. Graph 200 shows curve 210
for a prior art device structure, device A, similar to structure
400a (see FIG. 4a) and curve 220 for a novel device structure,
device B, similar to structure 400b (see FIG. 4b). Curves 210, 220,
represent insertion loss data for a peak to peak voltage difference
of 50 Volts. Both device structures A and B have the same nominal
DC capacitance of 100 nano Farads as one another, include nominally
the same composition of dielectric material as one another, and
have nominally the same external dimensions of 3.2 by 1.6 by 1.1
millimeters as one another, with plates stacked along the 1.1
millimeter dimension.
[0124] Prior art device A has the same internal electrode layer
configuration as device structure 400a (see FIG. 4a) except that it
contains more electrode plate layers than device structure 400a.
Novel device B has the same internal electrode layer configuration
as device structure 400b (See FIG. 4b) except that it contains more
electrode plate layers than device structure 400b.
[0125] Summary data comparing insertion loss for curves 210 (for
prior art device A) and 220 (for novel device B) appears in the
following chart. The data values shown below are based upon FIG. 2
and have an uncertainty of about 2 dB. TABLE-US-00001 Insertion
loss Insertion loss data Frequency (Khz) Device A (dB) Device B
(dB) Difference 30 -42 -95 53 100 -50 -105 55 1000 -62 -110 48
10000 -63 -110 47 100000 -63 -90 27 200000 -75 -60 15 300000 -65
-56 11 400000 -60 -54 6 500000 -51 -51 0 1000000 -42 -45 -3
Curve 220 shows an insertion loss for device B from about 30 kilo
Hertz to about 100 mega Hertz that is at or below noise threshold
of meter 30 of about -110 db.
[0126] Curves 210 and 220 show that the insertion loss of device A
exceeds that of device B by at least about 64 dB over the range one
mega Hertz to 100 mega Hertz. Curve 220 shows an insertion loss
from one mega Hertz to 100 mega Hertz of no less than about -100
dB.
[0127] Curve 220 shows an insertion loss for novel device B that is
greater than the insertion loss of curve 210 for device A over the
frequency range 30 kilo Hertz to 500 mega Hertz. For frequencies
from 30 kilo Hertz to 100 kilo hertz, the insertion loss of device
A exceeds that of device B by at least 40 dB; for 30 kilo hertz to
10 mega Hertz by at least 30 dB; for 10 mega Hertz to 100 mega
Hertz by at least about 25 dB; and for 30 kilo Hertz to 200 mega
Hertz by at least about 10 dB.
[0128] Over the entire frequency range of 30 kilo Hertz to 100 mega
Hertz the insertion loss of device A is greater than -60 dB,
greater than -70 dB, greater than -80 dB, and greater than
approximately -90 dB.
[0129] FIG. 2 shows that structures like structure 400b have an
insertion loss that is substantially greater than the insertion
loss of structures like structure 400a, for frequencies from just
above zero to a few hundred mega Hertz.
[0130] This invention is directed to the differences in structures,
like the differences in structures 400a and 400b, that provide the
tremendously greater insertion loss of structures like novel device
structure 400b relative to device structure 400a.
[0131] FIG. 3 shows external structure of both prior art device
400a and novel device 400b.
[0132] FIGS. 4a and 10-14 illustrate internal structure of a prior
art device 400a.
[0133] FIGS. 4b and 5-9 illustrate the internal structure of novel
device structure 400b.
[0134] FIG. 3 shows a perspective view of structure 300. The
external structure of both devices 400a (see FIG. 4a) and 400b (see
FIG. 4b) are the same as the external structure 300.
[0135] Structure 300 has edge interconnection structure in the form
of side electrode terminals 301, 305, front electrode terminal 306,
back electrode terminal 310. Side electrode terminal 301 includes
side electrode terminal conductive portions 302, 303, 304, and a
side electrode terminal conductive portion on the hidden face
opposing side electrode portion 303. Front electrode terminal 306
includes front electrode terminal conductive portions 307, 308,
309. Side electrode terminal 305 and side electrode terminal 301
are mirror images of one another. Front electrode terminal 306 and
back electrode terminal 310 are mirror images of one another.
[0136] Structure 300 has electrically insulating top surface
portion 311, electrically insulating front surface portions 312a,
312b electrically insulating back surface portions 313a, 313b and
electrically insulating bottom surface portion 314.
[0137] FIG. 3 also shows back electrode terminal side to side width
320 delimited by opposing arrows, back electrode terminal front to
back width 321 delimited by opposing arrows, and side electrode
terminal conductive portion side to side width 322 delimited by
opposing arrows.
[0138] FIG. 3 also shows structure 300's side surfaces 324, 325,
front surface 326, and top surface 328, and it identifies structure
300's back surface 327 and bottom surface 329.
[0139] FIG. 3 also shows structure 300's side to side length L
delimited by opposing arrows, front to back width W delimited by
opposing arrows, and top to bottom height H delimited by opposing
arrows.
[0140] Electrode terminals 301, 305, 306, 310 may be formed from
any conductive material including elemental metals, alloys, and
conductive plastics and polymers. Preferably, electrode terminals
301, 305, 306, 310 are formed from indium, aluminum, copper,
nickel, cobalt, gold, platinum, paladium, iridium, ruthenium, or
alloys containing at least one of those elements.
[0141] The electrically insulating surface portions 311, 312a,
312b, 313, and 314 may be formed from any dielectric material
including for example inorganic oxides, nitrides, flourides,
various ceramics and glasses, insulating polymers and resins, and,
undoped insulating semiconductors such as silicon, carbon, silicon
carbide, boron nitride, III-V semiconductors, and II-VI
semiconductors.
[0142] FIG. 4a shows structure 400a which has the external
configuration of structure 300 of FIG. 3. However, edge
interconnection structure is not included in FIG. 4a such that
surfaces of FIG. 3 underneath edge interconnection structure form
the external surfaces of structure 400a. FIG. 4a and subsequent
figures show a side or side surface 324 corresponding to side
surface 324 of FIG. 3 in order to orient views relative to external
surfaces shown in FIG. 3, and sometimes show surfaces numbered
325-329 corresponding in orientation of structure to side surfaces
325-329 of FIG. 3.
[0143] FIG. 4a shows in stacking sequence of electrode plates. The
sequence is as follows: lower shielding electrode plate 401a, first
electrode plate 402a, central shield plate 403a, second electrode
plate 404a, and upper shielding electrode plate 405a. First
electrode plate 402a has an edge exposed on side 324 of structure
400a and on no other side. Second electrode plate 404a has an edge
exposed on the side 325 (corresponding to side surface 325 of
structure 300) opposite side 324 of structure 400a and on no other
side. Shielding electrode plates 401a, 403a, and 405a have edges
exposed on sides of structure 400a corresponding to front and back
surfaces 326, 327 of structure 300 and on no other side.
[0144] FIG. 4b shows structure 400b having a stacking sequence of
electrode plates. The sequence is the same as for structure 400a
shown in FIG. 4a, which is as follows: lower shielding electrode
plate 401b, first electrode plate 402b, central shield plate 403b,
second electrode plate 404b, and upper shielding electrode plate
405b.
[0145] FIG. 4 shows electrically insulating surface portion 312a
between the edges of shielding electrode plates 401b, 403b, 405b
and side face 324.
[0146] In contrast with structure 400a, first electrode plate 402b
of structure 400b has an edge exposed on front side 326 of
structure 400b and on no other side. Second electrode plate 404b
has an edge exposed on the back side 327 of structure 400b and on
no other side. Shielding electrode plates 401a, 403a, and 405a have
edges exposed on sides of structure 400b corresponding to side
surfaces 324, 325, and on no other side.
[0147] FIG. 5. shows structure 400b's electrodes' plate stack
sequence for electrode plates 401b-405b along the X-X cut in FIG.
4b. Shielding electrode plates 401b, 403b, and 405b extend an
entire length from side 324 to side 325. Shielding electrode plates
401b, 403b, and 504b include electrode shield plate edges 501b,
503b, 505b, respectively, in side surface 324, and corresponding
edges in opposite side surface 325. First and second electrode
plates 402b, 404b do not include plate edges in side surfaces 324,
325.
[0148] FIG. 6 shows structure 400b's electrodes' plate stack
sequence for electrode plates 401b-405b along the Y-Y cut in FIG.
4b. Shielding electrode plates 401b, 403b, 405b do not extend to
front surface 326 or back surface 329. First electrode plate 402b
has an edge 602b in front surface 326, and does not extend to back
surface 329 or side surfaces 324, 325. Second electrode plate 404b
has an edge (not shown) in back surface 329 and does not extend to
front surface 326 or side surfaces 324, 325. FIG. 6 shows distance
620 from an edge of shielding electrode plate 405b proximal front
side 326 to an edge of second electrode plate 404b proximal front
side 326. FIG. 6 shows a distance 630 between second electrode
plate 404b and shielding electrode plate 405b.
[0149] FIG. 7 shows lower shielding electrode plate 401b and
surrounding dielectric material 710. Lower shielding electrode
plate 401b has shielding electrode plate side edges 720, 730 in
side surfaces 324, 325. Lower shielding electrode plate 401b
defines generally rectangular top major surface 740. Lower
shielding electrode plate 401b does not extend to front surface 326
or back surface 327. Lower shielding electrode plate 401b has lower
shielding electrode plate front edge 770 recessed from front
surface 326 by lower shielding electrode front edge distance 771.
Lower shielding electrode plate 401b has lower shielding electrode
plate back edge 780 recessed from back surface 327 by lower
shielding electrode back edge distance 781. Surrounding dielectric
material 710 defines surface 750 forming part of front surface 326
and another surface 760 forming part of side back surface 327.
[0150] Shielding electrode plates 403b, 405b have the same general
structure as shielding electrode plate 401b.
[0151] FIG. 8 shows lower electrode plate 402b and surrounding
dielectric material 710. Lower first electrode plate 402b has lower
first electrode plate front edge 820, lower first electrode plate
front edges 830, 840, and lower first electrode plate edge
transition regions 850, 860. Front edge 820 does not extend to side
surfaces 324, 325. Lower first electrode plate front edges 820,
830, 840 intersect edge transition regions 850, 860. Edge
transition regions 850, 860, transition the front facing edges of
lower first electrode plate 402b from front edge 820 in the front
surface 326 into front edges 830, 840. Front edges 830, 840 are
recessed from the front surface 326 by front edge recess distance
870.
[0152] Lower first electrode plate 402b defines lower first
electrode plate side edges 880, 881, which are recessed from side
surfaces 324, 325 by lower first electrode plate side recess
distance 883. Lower first electrode plate back edge 884 is recessed
from back surface 327 by lower first electrode plate back recess
distance 885.
[0153] Lower first electrode plate 402b defines lower first
electrode plate corner edge recessed transitions 890a, 890b, 890c,
890d. Edge recess transitions 890a, 890b, 890c, 890d do not form 90
degree angles. Instead, they define a finite radius of curvature on
the order of a fraction of the length or width dimension of
structure 400b.
[0154] FIG. 9 shows upper second electrode plate 404b and
surrounding dielectric material 710. FIG. 9 also shows a center
line 910 halfway along side surfaces 324, 325. Upper plate 404b is
a mirror image about center line 910 of lower plate 402b. Upper
plate front edge 984 is recessed from front surface 327 by upper
plate front recess distance 985.
[0155] FIG. 10 shows structure 400a's electrodes' plate stack
sequence for electrode plates 401a-405a along the X-X cut in FIG.
4a. Shielding electrode plates 401a, 403a, and 405a do not extend
to side surfaces 324, 325. Shielding electrode plates 401a, 403a,
and 405a do extend a substantial fraction of the distance from side
surfaces 324 to side surface 325. Electrode plates 402a, 404b do
not include electrode plate edges in side surfaces 324, 325. At the
X-X plane, shielding electrode plates 401a, 403a, 405a are centered
between side surfaces 324, 325. Lower first electrode plate 402a
has an edge in side surface 324. Upper second electrode plate 404a
has an edge in the hidden side surface 325.
[0156] FIG. 11 shows structure 400a's electrodes' plate stack
sequence for electrode plates 401a-405a along the Y-Y cut in FIG.
4a. At the Y-Y plane, shielding plate electrodes 401a, 403a, 405a
extend to side front and back surfaces 326, 327 such that they each
have an edge in front surface 326 and back surface 327. First and
second electrode plates 402a, 404a do not extend to front or back
surfaces 326, 327.
[0157] FIG. 12 shows lower shielding electrode plate 401a and
surrounding dielectric material 710. Lower shielding electrode
plate 401a has lower shielding electrode plate front edge 1220,
lower shielding electrode plate front edges 1230, 1240, and lower
shielding electrode plate front edge transition regions 1250, 1260.
Front edge 1220 does not extend to side surfaces 324, 325. Lower
electrode plate front edges 1220, 1230, 1240 intersect front edge
transition regions 1250, 1260. Front edge transition regions 1250,
1260, transition the front facing edge of lower shielding electrode
plate 401a from front edge 1220 in the front surface 326 into front
edges 1230, 1240, respectively, which are recessed from the front
surface 326 by front edge recess distance 1270.
[0158] Lower shielding electrode plate 401b defines lower shielding
electrode plate side edges 1280, 1281, which are recessed from side
surfaces 324, 325 by lower electrode plate side recess distance
1283. Lower shielding electrode plate back edges 1284, 1286, are
recessed from back surface 327 by lower shielding electrode plate
back recess distance 1285.
[0159] Lower first electrode plate 401a defines lower first
electrode plate corner edge recessed transitions 1290a, 1290b,
1290c, 1290d. Edge recess transitions 1290a, 1290b, 1290c, 1290d do
not form right angles. Instead, they define a finite radius of
curvature on the order of a fraction of the length or width
dimension of structure 400a.
[0160] Shielding electrode plates 403a, 405a have the same general
shape as lower shielding electrode plate 401a.
[0161] FIG. 13 shows lower first electrode plate 402a and
surrounding dielectric material 710. Lower first electrode plate
402a defines lower first electrode plate side edge 1320 in side
surface 324. Lower first electrode plate 402a defines generally
rectangular top major surface 1340. However, lower first electrode
plate 402a defines lower first electrode plate side edges 1330a,
1330b, adjacent side surface 325 that are not right angles and that
have radii of curvature less than the length or width of structure
400a. Lower first electrode plate 402a does not extend to front
surface 326 or back surface 327. Surrounding dielectric material
710 defines surface 750 forming part of front surface 326 and
surface 760 forming part of side back surface 327. Lower first
electrode plate 402a defines lower first electrode plate front edge
1370 recessed from front surface 326 by lower first electrode plate
front edge recess distance 1371. Lower first electrode plate 402a
defines lower first electrode plate back edge 1380 recessed from
back surface 327 by lower first electrode plate back edge recess
distance 1381.
[0162] FIG. 14 shows upper second electrode plate 404a and
surrounding dielectric material 710. Upper second electrode plate
404a is generally a mirror image of lower first electrode plate
402a mirrored along an imaginary vertical line of symmetry passing
through the center of electrode 402a as shown in FIG. 13.
[0163] FIG. 4b and FIGS. 5-9 illustrate structures of layers and a
sequence of layers of one embodiment of the invention having the
external structure shown in FIG. 3. This embodiment shows only a
minimum sequence of plates of the shielding electrode, first
electrode, and second electrode including one plate of a first
electrode and one plate of a second electrode. The first and second
electrodes may each include multiple electrode plates. Preferably,
the first electrode has the same number of plates as the second
electrode. Preferably, the number of plates of the shielding
electrode that are spaced between a plate of the first electrode
and a plate of the second electrode (i.e., excluding the plates of
the shielding electrode external to the plates of the first and
second electrodes) is equal to or greater than the sum of the
number of electrode plates of the first electrode plus the number
of electrode plates of the second electrode, minus 1.
[0164] FIG. 15 illustrates a second embodiment of the invention
including more than one plate forming each one of the first
electrode and the second electrode.
[0165] FIG. 15 illustrates another novel device structure 1500
having the outer surface structure shown in FIG. 3. Structure 1500
includes shielding electrode bottom plate 1501; shielding electrode
middle plates 1503, 1505, 1507, 1509, 1511, 1513, 1515, 1517, 1519;
shielding electrode top plate 1521; first electrode lower plate
1502; first electrode middle plates 1506, 1510, 1514; first
electrode upper plate 1518; second electrode lower plate 1504;
second electrode plates 1504, 1508, 1512, 1516; and second
electrode upper plate 1518. Structure 1500 also includes edge
interconnection structure in the form of side electrode terminal
301 defining side electrode terminal conductive portion 1571 in top
surface 328 and side electrode terminal side portion 1522 in side
surface 324.
[0166] Structure 1500 includes 11 shield plates for the shielding
electrode and 5 plates for each of first and second electrodes.
Each plate of the first electrode is separated a plate of the
second electrode by a plate of the shielding electrode. In
addition, there is a plate of the shielding electrode external to
all plates of the first and second electrodes at the top of the
structure and another plate of the shielding electrode external to
all plates of the first and second electrodes at the bottom of
structure.
[0167] Structure 1500 shows an equal number of plates of the first
electrode and the second electrode, which is preferred, because it
provides improved signal conditioning. However, when structures
like structure 1500 include a large enough number of plates in the
first and second electrodes, a slight difference in number of
plates in the first and second electrodes will not significantly
impact signal conditioning ability.
[0168] Accordingly, preferably for all embodiments, the difference
between the number of plates of the first electrode and the number
of plates of the second is less than one percent of the number of
plates of either electrode.
[0169] FIGS. 16a-d relate to structures that incorporate
electrically conductive paths passing through apertures in plates
of one or more electrodes in order to electrically connect plates
of one electrode to one another and/or electrically conductive
paths not passing through apertures in plates of one or more
electrodes in order to electrically connect plates of a shielding
electrode to one another and define a cage including shielding
electrode plates and electrically conductive paths around all
plates of the first and second electrodes. Electrically conductive
paths passing through apertures in plates of one or more electrodes
can be incorporated in discrete, PC board, and IC embodiments of
this invention.
[0170] FIG. 16a shows a cross section of structure 1600 including
upper shielding electrode plate 1601; shielding electrode plates
1603, 1605, 1607; lower shielding electrode plate 1609; first
electrode plates 1602, 1606; second electrode plates 1604, 1608;
first electrode conductive wire line 1610, second electrode
conductive wire line 1611, first electrode plate extensions 1620,
1621; first electrode plate-wire line intersections 1630, 1631; and
first electrode wire line termination point 1640.
[0171] In structure 1600 each plate of the first electrode is
separated from a plate of the second electrode by a plate of the
shielding electrode, and the shielding electrode includes at least
one plate above all plates of the first and second electrodes and
one at least one plate below all plates of the first and second
electrodes.
[0172] Wire line 1610 electrically connects to plate 1602 at
plate-wire line intersection 1631, and electrically connects to
plate 1606 at plate-wire line intersection 1630. Wire line 1611
includes plate-wire interconnections that electrically connect
plates 1604 and 1608 to one another. First electrode plate 1602 may
include first electrode plate extension 1621.
[0173] A plate overlap region means a region in which major
surfaces of two plates overlap.
[0174] First electrode plate extension 1621 of plate 1602 extends
from a plate overlap region of plate 1602 with one other plate in
structure 1600 to a side of wire line 1610 opposite the side on
which the one other plate entirely resides. The one other plate
could be any one of plates 1601, and 1603-1609. First electrode
plate 1606 may include plate extension 1620. Each one of second
electrode plates 1604, 1608, may include a plate extension, as
shown but not numbered.
[0175] Wire line 1610's extension in the vertical direction as
shown in FIG. 16a terminates at termination point 1640. Termination
point 1640 may be connected to a signal line or a return line.
[0176] First electrode plate extension 1621, if it exists,
terminates in first electrode plate extension termination 1650.
Termination 1650 is shown as a point in a cross-section. In a plan
view of plate 1602, termination 1650 is defined by an edge of plate
1602. That edge may be generally straight, may have rounded edges
defining radii of curvature less than the width of plate 1602, or
may define a necked structure having the general shape shown for
the necked structure defined by transitions 850, 860 and edge 820
of the front side edge of plate 402b in FIG. 8.
[0177] In a fourth alternative embodiment indicated by dashed line
1670, at least one of and preferably all of the shield electrode
plates have a shield electrode plate extension, like shielding
electrode plate extension 1670 of shielding electrode plate 1601,
indicated by the dashed line in FIG. 16a, that extends away from
the region of overlapped plates and/or the region between wire
lines 1610, 1611 beyond wire line 1640, preferably also extends
beyond the extension of at least one of the extension regions 1620,
1621 of the plates of the first electrode, and preferably extends
beyond the extension of all of the extension regions of the first
and second electrodes. In this fourth embodiment, plate 1601
includes aperture 1680 in which a section of wire line 1610
resides. Aperture 1680 is large enough to prevents electrical
contact of wire line 1610 to shielding electrode plate 1601.
[0178] In another and fifth alternative embodiment relating to FIG.
16a, conductive wire line 1690, indicated by a dashed line in FIG.
16a, intersects with and electrically connects to shielding
electrode plate extension 1670. Preferably, conductive wire line
1690 also connects to all of the other plates of the shielding
electrode, which plates also have shielding electrode plate
extensions along the path of wire line 1690.
[0179] FIG. 16b shows a section of structure 1600 in a plane
showing wire lines connecting plates of the shielding electrodes.
This plate is generally non-parallel, such as generally
perpendicular, to the plane of the cut shown in FIG. 16a. Shielding
electrode wire lines 1610b, 1611b intersect with and electrically
connect shielding electrode plates 1601, 1603, 1605, 1607 to one
another. Wire line 1610b terminates at termination 1640b and
intersects shielding electrode plates at shielding plate-wire
intersections 1630b.
[0180] Wire lines 1610b, 1611b exist beyond the extension of plates
1602, 1604, 1606, 1608 for all electrodes other than the shielding
electrode.
[0181] FIG. 16c shows, in a plan view, a surface of plate 1603 of
the shielding electrode of structure 1600. Shielding plate-wire
intersections 1603b, which are represented by dots in FIG. 16c, are
locations where wire lines extending out of the page of FIG. 16c
and intersect with and electrically connect to plate 1603.
Shielding plate-wire intersections 1630b, are distributed along a
closed path near the periphery of plate 1603. Apertures 1680 are
distribute at opposite sides 324, 325, of plate 1603.
[0182] FIG. 16d shows, in plan view, electrode plate 1602. Other
plates of the non-shielding electrode have corresponding
structure.
[0183] In a six alternative embodiment, plate 1602 includes one or
more apertures 1691 away from the periphery of electrode plate
1602. In the sixth embodiment, non-peripheral wire lines extend
through apertures 1602 such that the non-peripheral wire lines do
not electrically connect to electrode plate 1602, and each such
non-peripheral wire does electrically connect to at least on other
plate in structure 1600. For example, non-peripheral wire lines may
connect all plates of one electrode to one another, may connect all
plates of each non-shielding electrode to one another, or may
connect all plates of the shielding electrode to one another.
[0184] FIG. 17 shows in plan view visible sections of a stack
consisting of first electrode plate 1701 and second electrode plate
1720 for purposes of illustrating examples of energy pathway line
segments and energy perpendicular line segments.
[0185] FIG. 17 shows plate stack 1700 including top plate 1701 and
bottom plate 1720. Top plate 1701 includes necked portion 1708.
Bottom plate 1720 includes necked portion 1721. Necked portions
1708, 1721 correspond to necked portions discussed herein above
which electrically connect plates of electrodes to edge inter
connection structure. Plate stack 1700 includes right side surface
1704, left side surface 1705, and left side portions 1706, 1707.
Points 1710, 1723 represent the location geometric center of necked
portions 1708, 1721.
[0186] Line segment 1750 extends between points 1723, 1710, and
line segment 1750. Line segment 1750 is the energy pathway line
segment.
[0187] Line segment 1751 extends from right side 1704 to region
1707 of left side 1705, and line segment 1751 is generally
perpendicular to line segment 1750. Line segment 1751 represents an
energy perpendicular line segment.
[0188] Line segment 1752 extends from right side 1704 to region
1707 of left side 1705, and it is perpendicular to line segment
1750. Line segment 1752 intersects dashed line segment 1750 at a
location resulting in the longest energy perpendicular line
segment, and it is the maximal energy perpendicular line segment.
Line segment 1752 is longer than line segment 1751 because left
side edge region 1707 is further than left side edge region 1706
from right side edge 1704.
Alternative Embodiments
[0189] FIG. 1 depicts a test circuit. Circuits including a
structure of the invention typically include a source of electrical
power providing current, voltage, or power, a load to which
electrical power from the source of electrical power is supplied,
and a structure of the invention like novel Device B in which (1) a
first electrode of the structure is electrically connected to the
source or to a conductive path electrically connected to the
source, a second electrode is electrically connected to the return
or to a conductive path electrically connected to the return, and a
shielding electrode is electrically connected to a ground (or
source or sink of charge). In some embodiments, the source or sink
of charge to which the shielding electrode is electrically
connected is a chassis ground. The conductive paths may be wires,
coaxial cables, strip line, coplanar, waveguide, or any other type
of conductive pathway used from zero to very high frequencies to
transmit electrical energy.
[0190] FIG. 2 shows that the insertion loss of Device B exceeds
that of Device A over a 100 megahertz range. The inventors
recognize that the frequency range over which insertion loss of a
structure of the invention exceeds a comparably dimensioned and
externally shaped structure of a prior art device, various
configurations of the invention may provide a different range in
which the insertion loss exceeds the insertion loss of a
corresponding prior art device, such as 1-1 mega Hertz, 0-10 mega
Hertz, 0-1000 mega Hertz, 0-10000 mega Hertz, and that the absolute
value of the insertion loss of these various devices of invention
may range from greater than -40 dB, -50 dB, -60 dB, -70 dB, -80 dB,
-90 dB, -100 dB, -110 dB, and -120 dB, depending upon frequency,
dimensions of the structure of the invention, circuit configuration
of the conductive structure electrically connected to the shielding
electrode, and composition of the materials forming the structure
of the invention.
[0191] FIG. 3 shows external dimensions of structure 300 and its
edge interconnection structure in which each portion of the side
electrode terminals 301, 305, front electrode terminal 306, back
electrode terminal 310 forming part of each side of structure 300
is rectangular. Alternatively, any of these portions of the side,
front, and back electrode terminals could have edges that are
irregularly shaped, concave, convex, tapered, rounded, or with
edges rounded. Moreover, the edge interconnection structure may be
formed from different conductive material than plates of wire lines
in the structure. For example, at least some of the edge
interconnection structure may be formed from higher cost higher
conductivity materials, such as substantially pure gold, platinum,
palladium, or iridium, and at least some of the conductive material
internal to the structure may be formed substantially from nickel
or copper.
[0192] The center of front electrode terminal 306 may reside closer
to side surface 324 than side surface 325 or vice versa. The center
of back electrode terminal 310 may reside closer to side surface
324 than side surface 325 or vice versa. Preferably, front
electrode terminal 306 covers front edge 820 of first electrode
plate 402b. Preferably, back electrode terminal 310 covers the back
edge of upper plate 404b that corresponds in shape to front edge
820. Thus, if the front electrode terminal of the back electrode
terminal is offset towards one side, preferably the corresponding
edges of the electrode plates of the non-shielding electrodes are
also offset towards that side so that they each remain covered by
an electrode terminal.
[0193] Side electrode terminals 301 and 305 may include
electrically conductive material extending between front electrode
terminal 306 and back electrode terminal 310 thereby electrically
connecting side electrode terminals 301, 305 to one another to form
a single external electrode terminal connecting to the plates of
the shielding electrode.
[0194] Dielectric material may cover some parts of electrode
terminals 301, 305, 306, 310.
[0195] Portions of side electrode terminal 301, side electrode 305,
or structure electrically connecting those two terminals to one
another, may overlap portions of one or both of front and back
electrodes 306, 310, and be electrically insulated therefrom by a
dielectric material.
[0196] Back electrode terminal side to side width 320 may be less
than 95 percent of the side to side width L, preferably less than
70 percent of side to side width L, and most preferably less than
30 percent of side to side width L. Side electrode terminal
conductive portion side to side width 322 may be zero, may be less
than 5 percent of side to side width L, may be less than 15 percent
of side to side width L, may be less than 40 percent of side to
side width L, and preferably is interconnected to conductive
portions of side electrode terminal 305 in a region between the
front and back electrodes 306, 310.
[0197] Structure 300 is shown as generally three dimensionally
rectangular. Alternatively, structure 300 may have arcuate major
surfaces with curvature either from side to side or front to
back.
[0198] Structure 300 may be curved to the extent as to form a
coiled generally cylindrical structure wherein one of side
electrode terminals 301, 305 is at the center of the cylinder and
aligned with the cylindrical axis and the other one of side
electrode terminals is at the periphery of the cylinder and aligned
with the cylindrical axis. In this alternative, front and back
electrodes 306, 310, are at ends of the cylinder and offset from
the center and periphery of the cylinder.
[0199] Structure 300 may be curved and modified to the extent as to
form a coiled generally cylindrical structure wherein side
electrode terminals 301, 305 are at opposite ends of the cylinder,
one of front and back electrodes 306, 310 is at the center of the
cylinder, and the other one of front and back electrodes has a
surface portion forming part of the cylindrical surface of
structure 300 at a middle of structure 300. In this alternative,
the one of the front and back electrodes 306, 310 at the center of
the cylinder is modified to include a conductive path extending
along the axis of the cylinder to one end of the cylinder, and the
side electrode terminal 306, 310 at that end of the cylinder is
modified such that there is an insulating region surrounding
portion of the conductive path connected to the centrally located
terminal that extends to the end of the cylinder.
[0200] Alternatively, structure 300 may contain a series of folds
in a zig zag configuration with fold axis along either the side to
side or front to back direction.
[0201] Preferably, the ground or source or sink of charge connected
to a shielding electrode of any embodiment of the invention has a
surface area of at least 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 50, or 100
times the surface area of any plate of the shielding electrode.
[0202] Alternatively, structure 300 may include a set of front
electrode terminals, similar in shape and dimension to front
electrode terminal 306, but distributed along front surface 326
(and portions in the top and bottom surfaces) and/or a set of back
electrode terminals distributed along back surface 327 (and
portions in the top and bottom surfaces). Alternatively, front
electrode terminal 306 or any one of multiple front and back
electrodes may not include portions on one or both of the top and
bottom surfaces of structure 300. Multiple front or back electrode
embodiments preferably also have electrical connected to each front
or back electrode at least one plate.
[0203] Multiple front electrode embodiments may have a different
set of plates electrically connected to each electrode of the front
plate. Similarly, multiple back electrode embodiments may have a
different set of plates electrically connected to each electrode of
the back plate. Sets of different electrode plates connected to
multiple front and back electrodes would provide a structure with
more than two non-shielding electrodes. Such a structure having
multiple terminals can be incorporated in a circuit architecture
having multiple loads or multiple sources wherein each pair of
paths between a load and its source electrically contacts a
terminal of the structure. Thus, one, two, three, or more sources
and/or one, two, three, or more loads may be connected across a
structure of the invention.
[0204] Multiple front electrode embodiments may have located in at
least one plate multiple plates each either electrically connected
to the same electrode or to different electrodes. In these
embodiments, preferably the multiple plates in the same plane are
plates of the electrodes other than the shielding electrode.
[0205] FIG. 4b shows in structure 400b portions of electrode plates
that electrically contact to the electrode edge interconnection
structure and/or electrode terminal shown in FIG. 3. FIGS. 5-8 show
aspects of structure 400b.
[0206] Alternatively, as previously indicated, structures of the
invention may include multiple plates in each electrode. At least
one or each plate of each of the first and second electrodes an
similar additional non-shielding electrodes may have a plurality of
edges that form part of a front or back surface 326, 327. The
necked portions of the type formed by lower first electrode plate
front edge 820 and transitions 850, 860, may form right angles, or
they may be very gradual having relatively large radii of
curvatures extending from the edge 820 all the way to the corner
edge recessed transitions 890a-d. In one alternative embodiment
transitions 850, 860 and corner edge recessed transitions 890a-d
merge to form a substantially circular major surface shaped plate,
with our without a substantial necked portion resulting in edge
820.
[0207] The recesses of the type shown by front edge recess distance
870 from the front or back edges 326, 327 may have a length ranging
from substantially zero to about 40 percent of front to back width
W, preferably at least 1 percent, more preferably at least 4
percent, and preferably at least 10 percent of front to back width
W.
[0208] Distance 630 may be less than, equal to, or greater than the
length of front edge recess distance 870. Distance 630 may be zero,
may be at least one, more preferably at least 2, 5, 10, or 20 times
plate separation distance 630. Preferably, non-shielding electrode
plates are recessed relative to adjacent shielding electrode plates
along their entire periphery, except for the necked regions where
they connect to electrode interconnection structure.
[0209] The setback distance of the shielding electrode plates, like
lower shielding electrode front edge distance 771, from front and
back surfaces 326, 327, is preferably less than the recess distance
870 of non-shielding electrode plates. Distance 771 along the front
side surface in a region overlapping a neck of a non-shielding
electrode plate such as edge 820 of plate 402b shown in FIG. 8,
must be sufficient to prevent electrical connection of the
shielding electrode plate to the non-shielding electrode's plate.
Typically, distance 771 in such a region is at least one micron,
preferably at least 5 microns, and may be 10, 20, 30, 40, 50, or
more microns.
[0210] FIG. 7 shows a rectangular shielding plate electrode major
surface for plate 401b. Alternatively, the width between front 326
and back 327 may vary. This width may be flared such that the width
between the front 326 and the back 327 is large at sides 324, 325.
The width of plate 401b at sides 324, 325 may equal the width from
front to back of plate surrounding material 710. Plate 401b may be
shaped to form in an inverse neck wherein the major surface of
plate 401b has width W at all portions except a portion adjacent
necked regions of the non-shielding electrodes like necked region
820, 850, 860 shown in FIG. 8.
[0211] FIGS. 8 and 9 shows lower and upper non-shielding electrode
terminals as mirror images about line 910 in FIG. 9. Alternatively,
each of these plates may include a set of more than one necked
regions for making a plurality of electrical contacts to edge
interconnection structure. Moreover, the necked regions may exist
at different locations along the side to side length between sides
325, 325. Moreover, necks may have different neck widths (i.e.,
like the width between 850, 860) or edge widths (i.e., like the
length of edge 82) from one another on the same plate or on
different plates. Further, the setback distance 870 may be
different between different necks on the same plate or on different
plates. For example, in embodiments including more than two
non-shielding electrode terminals, plates of one non-shielding
electrode may all have the same neck width and different setback
distance as one another, and either of both of those distance may
be different from at least one other or all other plates of any
other non-shielding electrode in the structure.
[0212] Structure 402b is shown with equal distances between plates
and represent plates as energy pathways. However, each plate of the
non-shielding electrodes and shielding electrode may have a
different thickness form one another, and the distances between the
top two and bottom two plates may be different from distances
between the center three plates.
[0213] FIG. 15 shows a multilayer structure 1500 of the invention
with equally spaced layers, and equally spaced recesses of layers
from surfaces (such as the surface on the right hand side of the
structure) and relative to the edges of the shielding layers.
Alternatively, the distance of the recesses of each layer from a
surface, the length of the recess of edges of plates of the
non-shielding electrodes from the edges of plates of the shielding
electrode, and the distances between adjacent plates may all be
different from one another. In some embodiments, distances between
several layers adjacent either or both of the top or the bottom are
spaced further apart from one another than layers further from the
top or bottom of the structure. Manufacturing requirements on a
specified thickness of a specified number of layers may require
adjusting thicknesses of the final layers to be either thicker or
thinner than initial layers in order to meed the specified
thickness. Manufacturing processing, such as heating, may result in
layers all of initially the same nominal thickness having different
thicknesses towards one or both of the top or bottom of the
structure.
[0214] Structures like multilayer structure 1500 may have the same
features and variations to their plates and overall shape as noted
above for structure 402b.
[0215] FIG. 16a shows one section view of structure 1600.
Alternatively, in the same section, there may be only one of
conductive wire lines 1610, 1611, or 2, 3, 4, 5, or more conductive
wire lines connecting plates of the same non-shielding electrode to
one another. Alternatively, of course, structure 1600 may include a
larger number of plates, such as the 11 shielding plates and 5
plates in each non-shielding electrode as in structure 1500, or
more layers, such as 50, 100, 150, 200, or more. In structure with
more layers, each wire line may not electrically connect to each
plate of the same non-shielding electrode, and there may be 2, 3,
4, 5, 10, 20, 50, or more conductive wire lines electrically
connecting to plates of the same non-shielding electrode. Further,
the variations in shapes of the plates and the limitations on their
relative setbacks and recesses discussed for structures 402b and
1500 are applicable to structures like structure 1600. Setback
distances and relative distances discussed for edges of plates of
non-shielding electrodes of structure 402b relative to edge
interconnection structure correspond to the distance, in the plane
of a plate, from edges of plates of non-shielding electrodes of
structure 1500 to shielding plate-wire intersections 1630b.
[0216] Structures of the invention may be formed by laying down
suitable precursor layers for dielectric and conductive material
and subsequent heating, by thin film deposition, masking, and
lithography techniques, by machining techniques including micro
machining. Many such techniques are well known in the art.
[0217] Circuits may be constructed by the foregoing techniques, and
also by soldering and mechanically and/or electrically connecting
components to one another and to supporting structure.
[0218] In one circuit embodiment, a ground (or source or sink of
charge), such as ground (or source or sink of charge) 60 in FIG. 2
is electrically connected to the shielding electrode
interconnection structure at both sides 324, 325. Such connections
were made in the circuit in which Device A and Device B were tested
by mechanical connection of the ground (or source or sink of
charge) 60 to each side corresponding to sides 324, 325 of
structure 300 for devices A and B.
[0219] The foregoing disclosure is illustrative of certain
embodiments of the invention. However, the inventor intends the
scope of protection based upon the following claims and obvious
equivalents thereof.
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