U.S. patent application number 11/470578 was filed with the patent office on 2007-05-10 for cooling device for electronic components.
This patent application is currently assigned to COOLIT SYSTEMS INC.. Invention is credited to ALEXANDER R. W. SCOTT.
Application Number | 20070102146 11/470578 |
Document ID | / |
Family ID | 37871998 |
Filed Date | 2007-05-10 |
United States Patent
Application |
20070102146 |
Kind Code |
A1 |
SCOTT; ALEXANDER R. W. |
May 10, 2007 |
COOLING DEVICE FOR ELECTRONIC COMPONENTS
Abstract
A fluid heat exchanger includes: a base, a heat pipe including
an evaporator portion thermally coupled to the base and a condenser
portion; a coolant block portion thermally coupled to the condenser
portion of the heat pipe, the coolant block portion including a
liquid tight passage extending from a passage inlet to a passage
outlet.
Inventors: |
SCOTT; ALEXANDER R. W.;
(Calgary, AB) |
Correspondence
Address: |
BENNETT JONES;C/O MS ROSEANN CALDWELL
4500 BANKERS HALL EAST
855 - 2ND STREET, SW
CALGARY
AB
T2P 4K7
CA
|
Assignee: |
COOLIT SYSTEMS INC.
#513A, 3208 - 8th Avenue N.E.
Calgary
CA
|
Family ID: |
37871998 |
Appl. No.: |
11/470578 |
Filed: |
September 6, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60596187 |
Sep 7, 2005 |
|
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|
Current U.S.
Class: |
165/177 ;
257/E23.088; 257/E23.098 |
Current CPC
Class: |
H01L 2924/0002 20130101;
F28D 15/0266 20130101; H01L 23/427 20130101; H01L 23/473 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/177 |
International
Class: |
F28F 1/00 20060101
F28F001/00 |
Claims
1. A fluid heat exchanger comprising: a base, a heat pipe including
an evaporator portion thermally coupled to the base and a condenser
portion; a coolant block portion thermally coupled to the condenser
portion of the heat pipe, the coolant block portion including a
liquid tight passage extending from a passage inlet to a passage
outlet.
2. The fluid heat exchanger of claim 1 wherein the passage inlet is
formed as a barb.
3. The fluid heat exchanger of claim 1 wherein the passage outlet
is formed as a barb.
4. The fluid heat exchanger of claim 1 further comprising internal
dividers defining the liquid tight passage.
5. The fluid heat exchanger of claim 1 wherein the heat pipe
includes an elongate return thermally coupled to the coolant
block.
6. The fluid heat exchanger of claim 1 wherein the coolant block
portion includes an upper portion and a clamping portion and the
condenser portion of the heat pipe is clamped between the upper
portion and the clamping portion.
7. A cooling system for a heat-generating component, the cooling
system comprising: a fluid heat exchanger including a base, a heat
pipe including an evaporator portion thermally coupled to the base
and a condenser portion; a coolant block portion thermally coupled
to the condenser portion of the heat pipe, the coolant block
portion including a liquid tight passage extending from a passage
inlet to a passage outlet.
8. The cooling system of claim 7 further comprising a liquid
coolant inlet tube connectable at the passage inlet.
9. The cooling system of claim 7 further comprising a liquid
coolant outlet tube connectable at the passage outlet.
10. The cooling system of claim 7 further comprising a liquid
coolant circuit in which the fluid heat exchanger is connected.
11. The cooling system of claim 10 wherein the liquid coolant
circuit includes a liquid coolant inlet tube connected at the
passage inlet, a liquid coolant outlet tube connected at the
passage outlet and a heat sink connected between the liquid coolant
outlet tube and the liquid coolant outlet tube.
12. The cooling system of claim 7 wherein the passage inlet is
formed as a barb.
13. The cooling system of claim 7 wherein the passage outlet is
formed as a barb.
14. The cooling system of claim 7 further comprising internal
dividers defining the liquid tight passage.
15. The cooling system of claim 7 wherein the heat pipe includes an
elongate return thermally coupled to the coolant block.
16. The cooling system of claim 7 wherein the coolant block portion
includes an upper portion and a clamping portion and the condenser
portion of the heat pipe is clamped between the upper portion and
the clamping portion.
Description
FIELD
[0001] The present invention relates to a cooling device for
electrical and electronic components and, in particular, a liquid
heat exchanger.
BACKGROUND
[0002] Heat generating electrical or electrical components include
for example memory chips, CPUs, voltage regulators, drivers, etc.
and generate heat that is deleterious to their operation and the
operation of other system components.
[0003] Fluid heat exchangers are used to conduct heat away from
heat generating electrical or electrical components and into a
passing fluid such as air. A fluid heat exchanger generally may
include a thermal plate and a heat-dissipating portion. The thermal
plate is installed in thermal communication with a heat source such
as directly or indirectly on a heat generating electrical or
electronic component. The heat-dissipating portion is thermally
coupled to the thermal plate to conduct heat energy therefrom.
Coolant fluid passes through the heat-dissipating portion to accept
heat energy therefrom. Where liquid coolant fluid is used, for
example, the liquid is pumped through a block, sometimes called a
"water block", forming at least part of the heat dissipating
portion where the liquid accepts the heat energy and then the
heated liquid is pumped to a heat sink located at some distance
from the block. It will be appreciated that various liquid coolants
are known such as freon, water, alcohols, glycols, etc.
[0004] General information concerning fluid heat exchangers, is
contained in applicant's corresponding published application WO
03/007372, dated Jan. 23, 2003 and is incorporated herein by
reference.
SUMMARY
[0005] In accordance with another broad aspect of the present
invention, there is provided a fluid heat exchanger comprising: a
base, a heat pipe including an evaporator portion thermally coupled
to the base and a condenser portion; a coolant block portion
thermally coupled to the condenser portion of the heat pipe, the
coolant block portion including a liquid tight passage extending
from a passage inlet to a passage outlet.
[0006] In accordance with another broad aspect of the present
invention, there is provided a cooling system for a heat-generating
component, the cooling system comprising: a fluid heat exchanger
including a base, a heat pipe including an evaporator portion
thermally coupled to the base and a condenser portion; a coolant
block portion thermally coupled to the condenser portion of the
heat pipe, the coolant block portion including a liquid tight
passage extending from a passage inlet to a passage outlet.
[0007] It is to be understood that other aspects of the present
invention will become readily apparent to those skilled in the art
from the following detailed description, wherein various
embodiments of the invention are shown and described by way of
illustration. As will be realized, the invention is capable for
other and different embodiments and its several details are capable
of modification in various other respects, all without departing
from the spirit and scope of the present invention. Accordingly the
drawings and detailed description are to be regarded as
illustrative in nature and not as restrictive.
DESCRIPTION OF THE DRAWINGS
[0008] Referring to the drawings wherein like reference numerals
indicate similar parts throughout the several views, several
aspects of the present invention are illustrated by way of example,
and not by way of limitation, in detail in the figures,
wherein:
[0009] FIG. 1 is a side elevation of an assembled fluid heat
exchanger.
[0010] FIG. 2 is an end elevation of the fluid heat exchanger of
FIG. 1.
[0011] FIG. 3 is a bottom plan view of the fluid heat exchanger of
FIG. 1.
[0012] FIG. 4 is a top plan view of a fluid heat exchanger base and
heat pipes with the coolant block portion removed.
[0013] FIG. 5 is a side elevation of the assembly of FIG. 4.
[0014] FIG. 6 is a schematic view of a cooling system for a
heat-generating component.
DESCRIPTION OF THE VARIOUS EMBODIMENTS
[0015] The detailed description set forth below in connection with
the appended drawings is intended as a description of various
embodiments of the present invention and is not intended to
represent the only embodiments contemplated by the inventor. The
detailed description includes specific details for the purpose of
providing a comprehensive understanding of the present invention.
However, it will be apparent to those skilled in the art that the
present invention may be practiced without these specific
details.
[0016] Referring to FIGS. 1 to 5, a fluid heat exchanger 10 is
shown that includes a base 12, a coolant block portion 14 and one
or more heat pipes 16, each heat pipe including an evaporator
portion 18 and a condenser portion 20. The evaporator portion of
each heat pipe is attached and thermally coupled to the base and
the condenser portion of each heat pipe is attached and thermally
coupled to coolant block portion 14.
[0017] It is to be understood that fluid heat exchanger 10 may be
used to conduct heat away from a heat-generating component such as,
for example, a component of a computer or other electric or
electronic device. In operation, base 12 is mounted in thermal
communication with the heat generating component and heat is
conveyed through base 12 to the heat pipes 16 and then to coolant
block portion 14 where the heat is dissipated to a liquid coolant
medium for further conveyance out of the fluid heat exchanger.
[0018] Base 12 may be formed in various ways and of various
materials to permit mounting to accept heat energy from the heat
generating component, to conduct thermal energy and to accept,
support and be in thermal communication with heat pipes 16. The
heat pipes may be thermally coupled to and/or arranged relative to
base 12 in various ways. In the illustrated embodiment, base 12 is
formed about a portion of each heat pipe 16, which portion thereby
becomes the evaporator portion 18 of each heat pipe. To enhance
operation of the heat exchanger, base 12 and heat pipe evaporator
portions 18 may be formed and/or arranged such that elongate
portions of the heat pipes pass through the base. For example base
12 may include an elongate dimension along which the heat pipes
extend and are thermally coupled.
[0019] It will be appreciated that a heat pipe operates by phase
change of a heat transfer, working medium between the heat pipe's
evaporator portion 18 and condenser portion 20. Heat pipes
generally include a closed envelope in which heat transfer working
medium is contained. The heat transfer is achieved by vaporization
of the working medium at the evaporator portion by action of
received heat energy and condensation of the gaseous working medium
at condenser portion 20, which is cooler due to its thermally
conductive contact with portion 14 that permits dissipation of the
heat energy. A circuit is set up within a heat pipe wherein working
medium moves from the condenser portion to the evaporator portion
by gravity flow or wicking action.
[0020] In the presently illustrated embodiment, the heat pipes are
formed as hollow tubes. Heat pipes may take various forms. For
example, heat pipes may be relatively straight or curved. In one
embodiment, for example, one or more of the heat pipes may be
L-shaped or U-shaped including an evaporator portion and an arm,
defining the condenser portion, extending at an angle from the
evaporator portion at one or both ends of the evaporator portion.
The illustrated embodiment, for example, includes a heat pipe
formed such that it has a first end 16' and an opposite end 16''
and the first and opposite ends define condenser portions 20, while
the heat pipe's evaporator portion 20 is positioned along the
length of the pipe between its ends.
[0021] While other numbers and configurations of heat pipes may be
used as desired, in the illustrated embodiment of FIGS. 4 and 5
there are three heat pipes 16a, 16b, 16c and each heat pipe
includes an elongate evaporator portion (inside base 12) positioned
between ends formed as heat pipe condenser portions 20a, 20b, 20c.
In this way, evaporated working medium within the heat pipe may
migrate to either end of the heat pipe to convey heat energy from
the base to the coolant block portion. This may reduce the
occurrence of heat pipe dry outs which sometimes occur in
environments where the heat exchanger must operation under
significant heat load. Ends 16' 16'' may be straight upstanding or
curved. For example, in the illustrated embodiment, both ends are
curved to each include a return portion extending substantially
parallel to the evaporator portion. The curved end returns are
positioned in side by side relation with one end 16' running in
direction opposite to the other end 16'' such that the heat
exchanger forms a compact arrangement. In the illustrated
embodiment, the plurality of heat pipes define a plurality of
returned ends that may be curved and positioned in side by side,
spaced apart relation and coolant block portion 14 may be thermally
coupled to the arranged ends 16' 16''. The ends may be arranged
substantially in a plane to facilitate connection to block portion
14. In one embodiment, the planar configuration of ends 16', 16'',
portion 14 and base 12 may be substantially in parallel to provide
a compact arrangement.
[0022] The heat pipes may be attached to and/or arranged relative
to coolant block portion 14 in various ways. In one embodiment, a
plurality of coolant blocks may be used into each of which at least
some of the heat sink pipe condenser portions are connected and
thermally coupled. Alternately, a single coolant block portion may
be used. Where both ends of an elongate heat pipe are formed as
condenser portions, the ends may be configured, as by curving, to
each be mounted in a single coolant block portion 14, which may
reduce the overall size of the fluid heat exchanger. To facilitate
operation of the heat exchanger, the heat pipe condenser portions
may be formed such that elongate portions thereof are thermally
coupled to the coolant block portion.
[0023] Coolant block portion 14, in addition to its connection to
heat pipes 16, includes a body with one or more liquid tight
passages extending therethrough. The passages provide for
conduction of liquid coolant, such as one or more of water, a
glycol, a freon, etc., from a passage inlet through the body of
portion 14 to a passage outlet. Passages may be formed in various
ways and configurations through coolant block portion 14 to permit
flow of liquid coolant therethrough and heat-dissipating contact
between the body of the coolant block portion and liquid coolant
passing through the passages. Generally, a passage that provides
expansive contact with body is desirable. In the illustrated
embodiment, coolant block portion includes a passage 22 extending
between barbs 24. Passage 22 is formed to contain the liquid
coolant in a liquid tight manner and channel it between the barbs.
In the illustrated embodiment, passage 22 is formed as an open area
below an upper body cap 14a and includes internal dividers 23 to
define the passage and channel and direct the flow of coolant
through the body.
[0024] Thermal coupling between the parts may be provided by
casting, welding, soldering, press fitting, thermally conductive
adhesives or fillers, and many other ways as will be apparent to a
skilled person. In the illustrated embodiment, portion 14 is formed
of two parts: an upper part 26 including passage 22 extending
therethrough and a clamping part 28 that can be clamped against
upper part 26 with the heat pipe condenser portions 20 secured
therebetween, as by use of screws 30. Corresponding grooves 32 may
be formed in interfacing surfaces of upper part 26 and clamping
part 28 to form channels into which the heat pipes may be secured.
Thermally conductive fillers can be used between heat pipes 16 and
upper part 26. Of course, other modes of assembly and thermal
coupling can be used, as desired.
[0025] Referring to FIG. 6, a computer cooling system 100 is shown
for a heat-generating component 102 of the computer. The cooling
system includes a fluid heat exchanger 110 including a base 112, a
coolant block portion 114 and a heat pipe 116, each heat pipe
including an evaporator portion 118 and a condenser portion 120.
The evaporator portion of each heat pipe is attached and thermally
coupled to the base and the condenser portion of each heat pipe is
attached and thermally coupled to coolant block portion 114.
Coolant block portion 114 includes a passage 122 to channel liquid
coolant in a liquid tight manner between an inlet 124a and an
outlet 124b.
[0026] Fluid heat exchanger 110 is included in the system to
conduct heat away from heat generating component 102. To do so,
base 112 is mounted in thermal communication with heat generating
component 102 and heat is conveyed through base 112 to the heat
pipes 116 and then to coolant block portion 114 where the heat is
dissipated to a liquid coolant medium passing through passage 122
for further conveyance out of the fluid heat exchanger.
[0027] In the system, an inlet tube 140 may be connectable to inlet
124a and an outlet tube 142 may be connectable to outlet 124b to
conduct the liquid coolant in a circuit between a heat sink 144 and
coolant block portion 114. The respective connections between inlet
tube 140 and inlet 124a and between outlet tube 142 and outlet 124b
may be liquid tight to avoid leakage of liquid coolant at these
connection points.
[0028] The previous description of the disclosed embodiments is
provided to enable any person skilled in the art to make or use the
present invention. Various modifications to those embodiments will
be readily apparent to those skilled in the art, and the generic
principles defined herein may be applied to other embodiments
without departing from the spirit or scope of the invention. Thus,
the present invention is not intended to be limited to the
embodiments shown herein, but is to be accorded the full scope
consistent with the claims, wherein reference to an element in the
singular, such as by use of the article "a" or "an" is not intended
to mean "one and only one" unless specifically so stated, but
rather "one or more". All structural and functional equivalents to
the elements of the various embodiments described throughout the
disclosure that are know or later come to be known to those of
ordinary skill in the art are intended to be encompassed by the
elements of the claims. Moreover, nothing disclosed herein is
intended to be dedicated to the public regardless of whether such
disclosure is explicitly recited in the claims. No claim element is
to be construed under the provisions of 35 USC 112, sixth
paragraph, unless the element is expressly recited using the phrase
"means for" or "step for".
* * * * *