U.S. patent application number 11/561684 was filed with the patent office on 2007-04-26 for variable latch.
This patent application is currently assigned to Intel Corporation. Invention is credited to Jason M. Brand.
Application Number | 20070093103 11/561684 |
Document ID | / |
Family ID | 32987788 |
Filed Date | 2007-04-26 |
United States Patent
Application |
20070093103 |
Kind Code |
A1 |
Brand; Jason M. |
April 26, 2007 |
VARIABLE LATCH
Abstract
Numerous embodiments of variable latch and a method of formation
are disclosed. One or more embodiments of the claimed subject
matter may comprise a latch with a plurality of contact points
formed thereon, and method of fabrication. The plurality of contact
points may allow adequate socketing of microelectronic packages of
varying sizes in a socket assembly, without the need to modify the
latch when the microelectronic package size varies.
Inventors: |
Brand; Jason M.;
(Placerville, CA) |
Correspondence
Address: |
SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH, P.A.
P.O. BOX 2938
MINNEAPOLIS
MN
55402
US
|
Assignee: |
Intel Corporation
|
Family ID: |
32987788 |
Appl. No.: |
11/561684 |
Filed: |
November 20, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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10391893 |
Mar 18, 2003 |
7160127 |
|
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11561684 |
Nov 20, 2006 |
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Current U.S.
Class: |
439/172 |
Current CPC
Class: |
G01R 1/07314
20130101 |
Class at
Publication: |
439/172 |
International
Class: |
H01R 29/00 20060101
H01R029/00 |
Claims
1. A socketing assembly, comprising: at least one latch, wherein
said at least one latch has a plurality of contact points formed
thereon; and a socket coupled to the at least one latch, wherein
said socket is configured to, in operation, receive one or more
sizes of microelectronic package.
2. The socketing assembly of claim 1, wherein at least one of said
at least one latch has two contact points formed thereon.
3. The socketing assembly of claim 1, wherein at least one of said
at least one latch is formed from glass-filled plastic.
4. The socketing assembly of claim 1, wherein the socket comprises
a universal socket.
5. The socketing assembly of claim 1, wherein the socket comprises
a self-captivating socket.
6. The socketing assembly of claim 1, further comprising two
latches, wherein said two latches each have two contact points
formed thereon.
7. The socketing assembly of claim 1, further including one or more
springs coupled to said at least one latch, an actuating arm
coupled to said at least one latch, and a lid coupled to said
actuating arm.
8. The socketing assembly of claim 1, wherein said socket comprises
a burn-in socket.
9. A method of forming a latch, comprising: forming a body; forming
a tab on the body; forming a lever arm on the body, wherein the
lever arm is formed substantially opposite said tab; forming a
fixed pivot point on the body; and forming a plurality of contact
points on the lever arm, wherein at least one of said plurality of
contact points is configured to contact one or more microelectronic
devices.
10. The method of claim 9, wherein forming of the latch comprises
one or more injection molding processes.
11. The method of claim 9, said method further comprising
substantially forming said latch from glass-filled plastic.
12. The method of claim 9, said method further comprising forming
said latch to provide socketing force to a microelectronic
package.
13. The method of claim 9, said method further comprising forming
said latch to have two contact points.
14. The method of claim 9, said method further comprising forming
said contact points to socket microelectronic devices of different
physical dimensions.
15. The method of claim 9, said method further comprising forming
said latch to further include one or more springs coupled to said
at least one latch, a actuating arm coupled to at least one latch,
and a lid coupled to said actuating arm.
16. The method of claim 9, said method further comprising forming
said latch comprise one component of a burn-in socket.
17. The socketing assembly of claim 1, wherein said latch is formed
from one or more of plastic, vinyl, polyethylene styrene, and
polyetherimide.
18. The socketing assembly of claim 1, wherein said latch is
approximately 10 millimeters in length.
19. The socketing assembly of claim 1, wherein said latch is
coupled to receive a first force and to apply a substantially
vertical second force to a microelectronic package to hold the
microelectronic package on the socket with electrical continuity
between the microelectronic package and the socket.
20. A socketing assembly, comprising: a latch arm having a
plurality of contact points formed thereon; and a socket coupled to
the latch arm, wherein said socket is configured to, in operation,
receive one or more sizes of microelectronic package.
21. The socketing assembly of claim 20, wherein of said latch arm
has two contact points formed thereon.
22. The socketing assembly of claim 20, wherein of said latch arm
is formed from glass-filled plastic.
23. The socketing assembly of claim 20, wherein the socket
comprises a universal socket.
24. The socketing assembly of claim 20, wherein the socket
comprises a self-captivating socket.
25. The socketing assembly of claim 20, further comprising two
latch arms, wherein each of said two latch arms has two contact
points formed thereon.
26. The socketing assembly of claim 20, further comprising one or
more springs coupled to said latch arm, an actuating arm coupled to
said latch arm, and a lid coupled to said actuating arm.
27. The socketing assembly of claim 20, wherein said socket
comprises a burn-in socket.
28. The socketing assembly of claim 20, wherein said latch arm is
formed from one or more of plastic, vinyl, polyethylene styrene,
and polyetherimide.
29. The socketing assembly of claim 20, wherein said latch arm is
approximately 10 millimeters in length.
30. The socketing assembly of claim 20, wherein said latch arm is
coupled to receive a first force and to apply a substantially
vertical second force to a microelectronic package to hold the
microelectronic package on the socket with electrical continuity
between the microelectronic package and the socket.
Description
RELATED APPLICATION(S)
[0001] This application is a Divisional of U.S. application Ser.
No. 10/391,893 filed Mar. 18, 2003, which is incorporated herein by
reference.
BACKGROUND
[0002] As part of the design and development of microelectronic
devices, a screening and testing operation may be performed in
order to detect and remove defective microelectronic devices. In
one particular operation, a burn-in stress test may be performed,
where devices may be operated in elevated voltage and/or
temperature states. Operations such as this may be performed on
several devices in parallel, and all or part of the operation may
be automated, such as the socket insertion and removal process for
a particular device. When a device is inserted in a socket, one or
more latches, or packet retaining devices, may automatically latch
on the device, and hold the device with sufficient force to ensure
contact with the socket. When the operation is complete, the latch
may be configured to release the device so that it may be removed
by one or more additional automated mechanisms such as a pick and
place mechanism. This particular type of socket that allows for
automated insertion and/or removal of a package may be referred to
in some contexts as a self-captivating socket.
[0003] FIG. 3 illustrates an assembly 200 comprising a
microelectronic device, illustrated as microelectronic package 218.
Package 218 is shown in contact with a socket 220, which may be
part of a testing environment such as a burn in environment. As
shown in FIG. 3, when latch 202 is engaged, or latched, to the
device 218, the latch contact point 206 may contact the package. A
spring such as spring 222 may cause latch 202 to exert a
substantially vertical force on the package 218, which may be
referred to as socketing force. Adequate socketing force may result
in electrical contact being made between device 218 and socket 220.
Latch 202 may comprise a lever arm 204, a contact point 206 located
on the lever arm, and a fixed pivot point 214, which may also be
referred to as a fulcrum. Pivot point 214 may be configured such
that latch 202 is capable of rotating about an axis at least
partially defined by the pivot point. A notched tab 212 may be
located opposite pivot point 214 from the lever arm 204. Notched
tab may have an actuating arm 210 attached, and a cover 208
attached to the actuating arm 210. Cover 208, which may also be
referred to as an open top lid, may be coupled to one or more
springs 222 that exert force on the cover.
[0004] In operation, a package may be inserted into socket 220 in
the following manner: Cover 208 may be forced downwards by an
insertion tool (not shown), which, due to the configuration of the
actuating arm and the notched tab, will cause latch 202 to rotate
about the axis defined by pivot point 214. A package, such as
package 218, may be inserted into socket 220. Force may be removed
from cover 208, and this will result in latch 202 rotating to make
contact with and apply force to package 218 on contact point 206,
due at least in part to the force exerted by one or more springs
222 on cover 208. The force applied by latch 202 may be a
substantially vertical force, and may provide electrical contact
between package 218 and socket 220. However, depending on the
dimensions of the microelectronic package 218, latch 202 may not
provide adequate force to ensure contact between the socket and the
package. Additionally, while sockets used in a testing environment
may be configured to receive packages of varying sizes, a latch
such as latch 202 may not be sufficient for use in testing devices
of varying sizes, and when testing devices of varying sizes,
latches may have to be changed between tests.
[0005] Therefore, it would be advantageous to develop a latch that
may be used in environments such as testing environment, that are
capable of providing adequate socketing force and sufficient
contact points for socketing of packages with varying sizes,
thereby reducing or eliminating the need to alter or modify a latch
when the package size varies.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The subject matter regarded as embodiments of the claimed
subject matter is particularly pointed out and distinctly claimed
in the concluding portion of the specification. Embodiments of the
claimed subject matter, however, both as to organization and method
of operation, together with objects, features, and advantages
thereof, may best be understood by reference to the following
detailed description when read with the accompanying drawings in
which:
[0007] FIG. 1 is an oblique view of a first embodiment of a latch
and microelectronic package, according to the present
invention;
[0008] FIG. 2 is a side cross-sectional view of a first embodiment
of a latch and socketing assembly, according to the present
invention; and
[0009] FIG. 3 is a side cross-sectional view of a latch and
socketing assembly, as known in the art.
DETAILED DESCRIPTION
[0010] Embodiments of the claimed subject matter may comprise a
variable latch and a method of fabrication. One particular
embodiment of the claimed subject matter may comprise a latch with
a plurality of contact points formed thereon. The plurality of
contact points may allow adequate socketing of microelectronic
packages of varying sizes in a socket assembly, without the need to
modify the latch.
[0011] It is worthy to note that any reference in the specification
to "one embodiment" or "an embodiment" means that a particular
feature, structure, or characteristic described in connection with
the embodiment is included in at least one embodiment of the
claimed subject matter. The appearances of the phrase "in one
embodiment" in various places in the specification are not
necessarily all referring to the same embodiment.
[0012] Numerous specific details may be set forth herein to provide
a thorough understanding of the embodiments of the claimed subject
matter. It will be understood by those skilled in the art, however,
that the embodiments of the claimed subject matter may be practiced
without these specific details. In other instances, well-known
methods, procedures and components have not been described in
detail so as not to obscure the embodiments of the claimed subject
matter. It can be appreciated that the specific structural and
functional details disclosed herein may be representative and do
not necessarily limit the scope of the claimed subject matter.
[0013] Referring now in detail to the drawings wherein like parts
are designated by like reference numerals throughout, there is
illustrated in FIG. 1 an oblique view of a first embodiment of a
latch in accordance with one embodiment of the claimed subject
matter. Illustrated in FIG. 1 is a latch 100. Latch 100 may be
comprised of a latch arm 108, a notched tab 112, pivot point 110,
and contact points 106 and 104, but it is important to note that
latch 100 is not limited to just this particular configuration, but
may comprise any latch with a plurality of contact points, for
example. The latch shown in FIG. 1 may be formed of a plastic or
vinyl composition, or may be formed from a heat resistant
composition including carbon based glass-filled plastics such as
PES (Polyethylene Styrene) or PEI (Polyetherimide) for example, but
the claimed subject matter is not so limited. A latch such as latch
100 may be formed from one or more injection molding processes, or
one or more machining processes, but it is important to note that
the claimed subject matter is not limited in this respect, and any
fabrication process that results in the fabrication of a latch with
a plurality of contact points is in accordance with the claimed
subject matter. Additionally, dimensions of the latch may depend on
the particular application the latch will be utilized in, such as
part of a burn in socket assembly for flash memory devices, but it
is envisioned that one possible embodiment would utilize a latch
approximately 10 millimeters in length.
[0014] Shown in FIGS. 2a and 2b are two possible applications of a
latch as illustrated in FIG. 1. Shown in FIGS. 2a and 2b are two
latches utilized in socketing assemblies, which may be part of a
testing environment such as a burn in environment, for example. In
one embodiment, the socket assemblies illustrated may be referred
to as self-captivating sockets, but those of skill in the art will
understand that the claimed subject matter is not limited to any
particular type or category of socket or socketing assembly, but
any type of device that is configured to provide a contact
interface between two or more electronic devices is in accordance
with at least one embodiment of a socket or socketing assembly.
FIG. 2a illustrates a latch 100 comprising part of assembly 101,
but in alternative configurations, multiple latches may be used in
a socketing assembly, and the depiction of a single latch is shown
here for the purpose of illustration. Latch 100 comprises a latch
arm 108, a notched tab 112, pivot point 110, and contact points 106
and 104. In this particular configuration, latch contact point 106
in shown as being in contact with package 118. In this
configuration, latch 100 may be providing socketing force, which
may comprise a substantially vertical force, for package 118. Force
may be provided by use of one or more springs (not shown), which
may be coupled to the latch, and may provide a substantially
vertical downward force on the latch resulting in socketing force
being applied to package 118. In a socketing assembly such as
assembly 101, the amount of mechanical force applied by the latch
to the package may depend on the contact point in contact with a
device, since this will result in a particular moment arm length.
Additionally, latch timing may be affected by the contact point in
contact with a device. Latch timing, in this embodiment, is the
time duration required for a latch to remove force from a device
relative to the motion of one or more other components of a
socketing assembly such as a cover (not shown).
[0015] Typically, socketing force applied by a latch may vary
depending on the particular device and/or socket configuration, but
the claimed subject matter is not limited in this respect. In this
embodiment, the application of socketing force by latch 100 on
device 118 may result in electrical continuity being provided
between package 118 and socket 120. Illustrated in this embodiment
is a microelectronic package 118, which may comprise, for example,
a microprocessor package, but it is important to note that package
118 is not so limited. Package 118 may comprise any sort of
microelectronic device including an ASIC, flash memory, or any chip
scale package such as a folded stack chip scale package, for
example.
[0016] A notched tab 112 may be formed on the body of latch 100,
and may be formed opposite the pivot point from lever arm 108. This
particular configuration may allow rotation of the latch 100 about
pivot point 110 when force is applied to notched tab 112. An
actuating arm (not shown) may be coupled to notched tab 112, and
the actuating arm may be coupled to a lid (not shown) when
installed in a testing apparatus. However, the claimed subject
matter is not limited to use of a notched tab, or use of an
opposing lever configuration to allow rotation about pivot point
110. For example, force could be applied upwards on lever arm 108
to remove the latch from contact with a package, and in this
configuration no notched tab may be required. Additionally, force
may be applied to the latch in the vicinity of top surface 114 in
order to provide the necessary force to rotate the latch about
pivot point 110, although, again, the claimed subject matter is not
so limited.
[0017] FIG. 2b illustrates a second socketing assembly that may
incorporate a latch such as latch 100. As shown in FIG. 2b, latch
100 is being utilized in a socketing assembly where a larger
package than that illustrated in FIG. 2a is being socketed. In this
embodiment, latch 100 comprises a latch arm 108, a notched tab 112,
pivot point 110, and contact points 106 and 104. In this particular
configuration, latch 100 is shown as having the contact point 106
in contact with a package 124. In this configuration, latch 100 may
be providing socketing force for package 124 by use of one or more
springs (not shown). This may result in electrical continuity being
provided between package 124 and socket 120. Illustrated in this
embodiment is a microelectronic package 124, which may comprise,
for example, a microprocessor package, but, again, it is important
to note that package 124, similarly to package 118, is not so
limited, and may include, for example, any chip scale package such
as a folded stack chip scale package.
[0018] Shown in FIGS. 2a and 2b are two uses of latch 100 in
socketing assemblies. These configurations demonstrate that a latch
such as latch 100 may be used to socket microelectronic devices of
a variety of sizes. It is important to note, however, that while
latch 100 is shown as having two contact points 104 and 106, the
claimed subject matter is not so limited, but may comprise a latch
with multiple contact points. Those of skill in the art will
appreciate that the amount of contact points and configuration of a
latch such as latch 100 may depend at least in part on the chosen
application. For example, a latch with three contact points may be
capable of latching devices of a greater variety than a latch with
two contact points. Additionally, differing devices may require
differing socketing forces, depending on the configuration of the
device. Differing configurations of a latch such as latch 100 may
be determined based at least in part on the socketing force
required by devices that will be socketed by a latch in accordance
with one or more embodiments disclosed herein.
[0019] It can be appreciated that the embodiments may be applicable
to latches or anywhere a variable latch may be desirable. Certain
features of the embodiments of the claimed subject matter have been
illustrated as described herein, however, many modifications,
substitutions, changes and equivalents will now occur to those
skilled in the art. Additionally, while several functional blocks
and relations between them have been described in detail, it is
contemplated by those of skill in the art that several of the
operations may be performed without the use of the others, or
additional functions or relationships between functions may be
established and still be in accordance with the claimed subject
matter. It is, therefore, to be understood that the appended claims
are intended to cover all such modifications and changes as fall
within the true spirit of the embodiments of the claimed subject
matter.
* * * * *