U.S. patent application number 11/613608 was filed with the patent office on 2007-04-26 for semiconductor light-emitting device and method of manufacturing the same.
Invention is credited to Tomonori Hino, Tadahiko Kawasaki, Takayuki Kawasumi, Noriko Kobayashi, Michiko Komine, Yuichi Kuromizu, Jugo Mitomo, Tsuyoshi Nagatake, Hironobu Narui, Masaki Shiozaki.
Application Number | 20070091966 11/613608 |
Document ID | / |
Family ID | 34689538 |
Filed Date | 2007-04-26 |
United States Patent
Application |
20070091966 |
Kind Code |
A1 |
Hino; Tomonori ; et
al. |
April 26, 2007 |
SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE
SAME
Abstract
A semiconductor light-emitting device capable of improving
device characteristics such as life and reliability is provided. A
current confinement layer includes a non-oxidized region made of
AlAs or the like corresponding to a current injection region in an
active layer, and an oxidized region made of aluminum oxide
corresponding to a non-current injection region. The oxidized
region is formed by forming a non-oxidized layer made of AlAs or
the like and then oxidizing part of the non-oxidized layer at a
temperature from 240.degree. C. to less than 375.degree. C. The
thickness of the oxidized region is preferably from 10 nm to 1000
nm. The width of the one side of the oxidized region is one time or
more of the width of the non-oxidized region or seven times or less
thereof. The distance between current confinement layer and the
active layer is preferably 50 nm or more, or 500 nm or less, and
more preferably 180 nm or more.
Inventors: |
Hino; Tomonori; (Kanagawa,
JP) ; Narui; Hironobu; (Kanagawa, JP) ;
Kawasumi; Takayuki; (Kanagawa, JP) ; Nagatake;
Tsuyoshi; (Kanagawa, JP) ; Kuromizu; Yuichi;
(Kanagawa, JP) ; Kawasaki; Tadahiko; (Tokyo,
JP) ; Kobayashi; Noriko; (Kanagawa, JP) ;
Shiozaki; Masaki; (Kanagawa, JP) ; Mitomo; Jugo;
(Kanagawa, JP) ; Komine; Michiko; (Tokyo,
JP) |
Correspondence
Address: |
David R. Metzger;SONNENSCHEIN NATH & ROSENTHAL LLP
Sears Tower, Wacker Drive Station
P.O. Box 061080
Chicago
IL
60606-1080
US
|
Family ID: |
34689538 |
Appl. No.: |
11/613608 |
Filed: |
December 20, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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10983927 |
Nov 8, 2004 |
|
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11613608 |
Dec 20, 2006 |
|
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Current U.S.
Class: |
372/50.124 |
Current CPC
Class: |
H01L 33/145 20130101;
B82Y 20/00 20130101; H01S 5/2215 20130101; H01S 2301/18 20130101;
H01S 5/34326 20130101; H01S 5/2231 20130101; H01S 5/22 20130101;
H01S 2301/14 20130101; H01S 5/0021 20130101 |
Class at
Publication: |
372/050.124 |
International
Class: |
H01S 5/00 20060101
H01S005/00 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 10, 2003 |
JP |
P2003-379496 |
Claims
1-13. (canceled)
14. A VCSEL comprising: an active layer comprising a current
injection region; and a current confinement layer comprising (a) a
non-oxidized region, said non oxidized region comprising a
semiconductor corresponding to the current injection region in the
active layer, and (b) an oxidized region contiguous to said
unoxidized region having lower conductivity than the non-oxidized
region and corresponding to a region other than the current
injection region in the active layer, wherein, (i) the current
confinement layer restricts the current injection region in the
active layer; (ii) the oxidized region of the current confinement
layer is the product of a process comprising: forming a
non-oxidized layer of the semiconductor; and oxidizing a part of
the non-oxidized layer at a temperature of at least 240.degree. C.
and at most 375.degree. C.; and (iii) the width of the of the
oxidized region on one side of the non-oxidized region is one time
or more the width of the non-oxidized region.
15. A VCSEL according to claim 14, wherein light generated in the
active layer is emitted in a direction perpendicular to a laminated
direction of the active layer and the current confinement
layer.
16. A VCSEL according to claim 14, wherein a thickness of the
oxidized region in the laminated direction of the active layer and
the current confinement layer is from 10 nm to 1000 nm.
17. A VCSEL according to claim 14, wherein a thickness of the
oxidized region in the laminated direction of the active layer and
the current confinement layer is from 30 nm to 60 nm.
18. A VCSEL according to claim 14, wherein the width of the
oxidized region on one side of the non-oxidized region is one time
or more the width of the non-oxidized region.
19. A VCSEL according to claim 14, wherein the width of the
oxidized region on one side of the non-oxidized region is seven
times or less of the width of the non-oxidized region.
20. A VCSEL according to claim 14, wherein the active layer
comprises Group III-V compound semiconductor which comprises at
least one element selected from the group consisting of aluminum
(Al), gallium (Ga) and indium (In) and at least one element
selected from the group consisting of nitride nitrogen (N),
phosphorus (P) and arsenic (As).
21. A VCSEL according to claim 14, wherein the non-oxidized region
comprises a Group III-V compound semiconductor which comprises
aluminum (Al) and arsenic (As), and the oxidized region comprises
an insulating oxide which comprises aluminum (Al).
22. A VCSEL according to claim 14, wherein a distance between the
current confinement layer and the active layer is 50 nm or
more.
23. A VCSEL according to claim 14, wherein a distance between the
current confinement layer and the active layer is 180 nm or
more.
24. A VCSEL according to claim 14, wherein a distance between the
current confinement layer and the active layer is 500 nm or
less.
25. A VCSEL according to claim 14, further comprising three mesas,
wherein the width of the middle mesa is at least 3 .mu.m to at most
50 .mu.m.
26. A VCSEL according to claim 14, further comprising: (a) a middle
layer, and (b) a cladding layer, wherein, the middle layer is
between the current confinement layer and the cladding layer.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a semiconductor
light-emitting device including a current confinement layer formed
by oxidation and a method of manufacturing the same, and
particularly to a semiconductor light-emitting device suitable for
a red laser having a wavelength of about 600 nm to 700 nm and a
method of manufacturing thereof.
[0003] 2. Description of the Related Art
[0004] A laser diode using AlGaInP as a base material can obtain
red emission having a wavelength of 600 nm to 700 nm and is widely
used as a light source for a high-density recording by DVD (Digital
Versatile Disc) or the like.
[0005] The red laser using AlGaInP is generally formed with a
strip-shaped ridge by removing part of a p-type semiconductor layer
by etching for current confinement. Upon directly forming an
electrode on the ridge, leakage current is generated. Therefore, in
order to prevent the leakage current, a buried layer including an
n-type GaAs layer or a laminated structure of an n-type AlInP layer
and an n-type GaAs layer, or an insulating layer made of silicon
dioxide (SiO.sub.2), silicon nitride (SiN) or the like is formed on
a side surface of the ridge.
[0006] However, the current confinement by the ridge of the related
art has a several problems as mentioned below. For example, n-type
GaAs used for a material of the buried layer has a bandgap width of
1.42 eV (873 nm). Therefore, n-type GaAs absorbs the light of a
wavelength of 600 nm to 700 nm and absorption loss of the light
generated in an active layer becomes large. In addition, a
dielectric material such as silicon dioxide has a large difference
in a lattice constant with the semiconductor, so the insulating
layer formed near the active layer largely distorts the active
layer. The absorption loss of the light or the distortion of the
active layer increases the amount of oscillation current and
largely decreases reliability of the device.
[0007] In order to reduce the amount of the oscillation current, a
current injection region in the active layer is narrowed by
reducing the width of the base of the ridge to reduce the volume of
the emission part. However, generally, the ridge is formed by
chemical etching, so it is necessary to make the width of the top
of the ridge smaller than the width of the base of the ridge. For
example, when the width of the base of the ridge is about 2 .mu.m
to 3 .mu.m, the width of the top of the ridge is 1.0 .mu.m or less.
This results in an increase in operation voltage, thereby power
consumption is increased. The increased power consumption largely
affects on the device life and this will be a serious problem for a
practical application.
[0008] To solve these problems, a method that part of a Group III-V
compound semiconductor layer containing aluminum (Al) is oxidized
by water vapor at a temperature of 375.degree. C. or higher to form
the current confinement layer has been proposed (referred to U.S.
Pat. Nos. 5,262,360 and 5,373,522; Japanese Patent No. 3,097,863;
and J. M. Dallesasse et al., "Native-oxide stripe-geometry
Al.sub.xGa.sub.1-xAs--GaAs quantum well heterostructure lasers",
Applied Physics Letters, American Institute of Physics, Jan. 28,
1991, vol. 58, No. 4, pp. 394-396).
[0009] However, the volume of the current confinement layer formed
by oxidation shrinks and generates distortion in the semiconductor
layers including the active layer formed above and below the
current confinement layer. The distortion adversely affects on the
device characteristics and reliability, in particular, the device
life is significantly deteriorates. Therefore, when using the
current confinement layer formed by oxidation, there is still room
for an improvement in conditions such as the device structure and
the oxidation temperature.
SUMMARY OF THE INVENTION
[0010] In view of the foregoing, it is an object of the invention
to provide a semiconductor light-emitting device capable of
improving the device characteristics such as life and reliability
by use of the current confinement layer formed by oxidation, and a
method of manufacturing the same.
[0011] A semiconductor light-emitting device of the invention
comprises: an active layer; and a current confinement layer
restricting a current injection region in the active layer and
being provided on a side of the active layer. The current
confinement layer includes: a non-oxidized region made of a
semiconductor corresponding to the current injection region in the
active layer; and an oxidized region having lower conductivity than
the non-oxidized region corresponding to a region other than the
current injection region in the active layer. After forming a
non-oxidized layer made of the semiconductor, the oxidized region
is formed by oxidizing part of the non-oxidized layer at a
temperature from 240.degree. C. to less than 375.degree. C.
[0012] A method of manufacturing a semiconductor light-emitting
device of the invention comprises the steps of: forming a plurality
of semiconductor layers including an active layer and a layer to be
a current confinement layer on a substrate; and forming a current
confinement layer having a non-oxidized region made of a
semiconductor and an oxidized region with a lower conductivity than
the non-oxidized region by oxidizing part of a layer to be the
current confinement layer at a temperature from 240.degree. C. to
less than 375.degree. C.
[0013] According to the semiconductor light-emitting device or the
method of manufacturing the semiconductor light-emitting device of
the invention, the oxidized region in the current confinement layer
is formed at an optimal temperature from 240.degree. C. to less
than 375.degree. C. Therefore, the device life is improved, thereby
improving the device characteristics and reliability.
[0014] Other and further objects, features and advantages of the
invention will appear more fully from the following
description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a perspective view illustrating a structure of a
laser diode according to an embodiment of the invention;
[0016] FIG. 2 is a front elevation of the laser diode illustrated
in FIG. 1 viewed from an emitting side of laser beam;
[0017] FIGS. 3A and 3B are cross sectional views illustrating a
method of manufacturing the laser diode shown in FIG. 1 in order of
process;
[0018] FIGS. 4A and 4B are cross sectional views illustrating steps
following the step shown in FIG. 3B;
[0019] FIG. 5 illustrates a relation between an oxidation
temperature and oxidation rate;
[0020] FIGS. 6A and 6B are cross sectional views illustrating steps
following the step shown in FIG. 4B;
[0021] FIGS. 7A and 7B are cross sectional views illustrating steps
following the step shown in FIG. 6B;
[0022] FIG. 8 illustrates results of the example of the invention;
and
[0023] FIG. 9 illustrates results of the example of the
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0024] Preferred embodiments of the invention will be described in
more detail below referring to the accompanying drawings.
[0025] FIG. 1 illustrates a structure of a laser diode according to
an embodiment of the invention. The laser diode has a structure
laminating a buffer layer 12, an n-type cladding layer 13, an
n-type guide layer 14, an active layer 15, a p-type guide layer 16,
a first p-type cladding layer 17, a current confinement layer 18, a
second p-type cladding layer 19 and a p-side contact layer 20 in
this order on one surface of a substrate 11, for example. The laser
diode is a red laser using a Group III-V compound semiconductor
containing, for example, a Group 3B element and a Group 5B element
in a short-period periodic table as a material of the active layer
15. At least one from the Group consisting of aluminum (Al),
gallium (Ga) and indium (In) is cited as a Group 3B element and at
least one from the Group consisting of nitride (N), phosphorous (P)
and arsenic (As) is cited as a Group 5B element.
[0026] The laminated structure is etched downward at least to the
n-type cladding layer 13 so as to form two parallel grooves,
thereby forming three strip-shaped mesas. The middle mesa functions
as a laser diode. The width Wst of the middle mesa is preferably
from 3 .mu.m to 50 .mu.m and more preferably from 5 .mu.m to 10
.mu.m, for example. This is because the contact area between the
p-side contact layer 20 and a p-side electrode 22, which will be
described later, can be increased to reduce the contact resistance.
This enables to reduce the drive voltage.
[0027] The substrate 11 has a thickness of 430 .mu.m in a laminated
direction A (hereinafter referred to thickness) and made of n-type
GaAs doped with an n-type impurity such as silicon (Si) and
selenium (Se). The buffer layer 12 has a thickness of 0.05 .mu.m
and made of an n-type GaInP mixed crystal doped with an n-type
impurity such as silicon and selenium. The n-type cladding layer 13
has a thickness of 1.4 .mu.m and made of an n-type
(Al.sub.0.7Ga.sub.0.3).sub.0.5In.sub.0.5P mixed crystal doped with
an n-type impurity such as silicon and selenium. The n-type guide
layer 14 has a thickness of 0.1 .mu.m and made of an n-type
(Al.sub.0.47Ga.sub.0.53).sub.0.5In.sub.0.5P mixed crystal not doped
with an impurity, or an n-type
(Al.sub.0.47Ga.sub.0.53).sub.0.5In.sub.0.5P mixed crystal doped
with an n-type impurity such as silicon and selenium.
[0028] The active layer 15 has a thickness of 30 nm and a multiple
quantum well structure alternately laminating a GaInP mixed crystal
layer and an AlGaInP mixed crystal layer. The active layer 15
includes a current injection region 15A in which current is
injected and a non-current injection region 15B in addition to the
current injection region 15A. The current injection region 15A
functions as a light-emitting region.
[0029] The p-type guide layer 16 has a thickness of 0.1 .mu.m and
made of an (Al.sub.0.47Ga.sub.0.53).sub.0.5In.sub.0.5P mixed
crystal not doped with an impurity, or a p-type
(Al.sub.0.47Ga.sub.0.53).sub.0.5In.sub.0.5P mixed crystal doped
with a p-type impurity such as zinc (Zn) and magnesium (Mg). The
first p-type cladding layer 17 is made of a p-type
(Al.sub.0.7Ga.sub.0.3).sub.0.5In.sub.0.5P mixed crystal doped with
a p-type impurity such as zinc and magnesium. The thickness of the
first p-type cladding layer 17 is from 0.05 .mu.m to 0.5 .mu.m
according to a distance between the current confinement layer 18,
which will be described below, and the active layer 15.
[0030] The current confinement layer 18 is for restricting the
current injection region 15A in the active layer 15 and has a
non-oxidized region 18A made of a semiconductor corresponding to
the current injection region 15A and an oxidized region 18B having
a lower conductivity than the non-oxidized region 18A corresponding
to the non-current injection region 15B. The non-oxidized region
18A and the current injection region 15A are formed in a strip
shape and the oxidized region 18B is formed in a strip shape on
both sides of the non-oxidized region 18A.
[0031] The non-oxidized region 18A is made of a Group III-V
compound semiconductor containing a Group 3B element and a Group 5B
element in a short-period periodic table. As a Group 3B element, at
least aluminum (Al), and as a Group 5B element, at least arsenic
(As) are contained. Specifically, the non-oxidized region 18A is
made of AlAs or AlGaAs and the oxidized region 18B is made of an
insulative oxide containing aluminum, for example, aluminum oxide
(AlO.sub.x). As will be described below, the oxidized region 18B is
formed as follows. A non-oxidized layer made of the above Group
III-V compound semiconductor such as AlAs and AlGaAs is formed and
then part of the non-oxidized layer is oxidized at a temperature
from 240.degree. C. or more to less than 375.degree. C.
[0032] The second p-type cladding layer 19 has a thickness of, for
example 1.1 .mu.m and made of a p-type
(Al.sub.0.7Ga.sub.0.3).sub.0.5In.sub.0.5P mixed crystal doped with
a p-type impurity such as zinc and magnesium. The p-side contact
layer 20 has a thickness of 0.3 .mu.m and made of a p-type GaAs
doped with a p-type impurity such as zinc and magnesium.
[0033] An insulating layer 21 made of, for example silicon dioxide
(SiO.sub.2) or silicon nitride (SiN) is formed on a surface of the
p-side contact layer 20. An aperture 21A is formed on the top of
the middle mesa in the insulating layer 21.
[0034] The p-side electrode 22 is formed on a surface of the
insulating layer 21. The p-side electrode 22 has a laminated
structure in which titanium (Ti), platinum (Pt) and gold (Au) are
sequentially formed, and electrically connected to the p-side
contact layer 20 through the aperture 21A in the insulating layer
21. In this embodiment, the width Wst of the middle mesa is wide
and the current confinement is performed by the oxidized region 18B
of the current confinement layer 18, so that the contact area of
the p-side contact layer 20 and the p-side electrode 22 can be
widened. It is preferable to increase the contact area thereof as
large as possible. This is because the contact resistance and the
drive voltage can be reduced.
[0035] An n-side electrode 23 is formed on the other side of the
substrate 11. The n-side electrode 23 has a structure in which
AuGe:Ni and gold are sequentially deposited and the deposition is
alloyed by heat treatment and is in electrically contact with the
substrate 11.
[0036] Further, in the laser diode, a pair of side surfaces facing
in the resonator direction are resonator end faces and a pair of
reflective mirror film (not illustrated) are respectively formed on
the resonator end faces. One of the reflective mirror films is
adjusted to have a low reflectance and the other is adjusted to
have a high reflectance. Therefore, the light generated in the
active layer 15 is amplified by traveling between the reflective
mirror films and emitted from the reflective mirror film having a
low reflectance as laser beam LB in a direction perpendicular to
the laminated direction A.
[0037] FIG. 2 is a front elevation illustrating a structure of the
laser diode illustrating FIG. 1 viewed from the emitting side of
the laser beam LB. The thickness T of the oxidized portion 18B in
the laminated direction A is preferably from 10 nm to 1000 nm. The
thickness T smaller than 10 nm deteriorates the current blocking
function of the oxidized region 18B. On the other hand, the
thickness T larger than 1000 nm may deteriorate the withstand
voltage characteristics. More preferably, the thickness T is from
30 nm to 60 nm. The thickness of the non-oxidized region 18A is
substantially the same as that of the oxidized region 18B.
[0038] The width WA of the non-oxidized region 18A is preferably
about 2 .mu.m. The width WB of the oxidized region 18B on one side
of the non-oxidized region 18A is one time or more of the width WA
of the non-oxidized region 18A. Since NFP (Near Field Pattern) of
the laser beam LB is widened about three times of the width WA of
the non-oxidized region 18A, that is, the width of the current
injection region 15A, one time or more of the width WB of the
oxidized region 18B on one side of the non-oxidized region 18A can
prevent the absorption loss of the laser beam LB caused by NFP
reaching a wiring portion on a side of the mesa.
[0039] The width WB of the oxidized region 18B is preferably seven
times or less of the width WA of the non-oxidized region 18A. The
width WB larger than seven times of the width WA is largely
affected by distortion of the oxidized region 18B. This accelerates
the degradation of device characteristics.
[0040] The distance D between the current confinement layer 18 and
the active layer 15 is preferably 50 nm or more. If the distance D
is smaller than 50 nm, the manufacturing yield may be lowered. More
preferably, the distance D is 180 nm or more. This is because the
absorption coefficient is lowered, thereby the absorption loss of
the laser beam LB can be suppressed.
[0041] The distance D is preferably 500 nm or less. If the distance
D is larger than 500 nm, leakage current is increased. This results
in an increase in the amount of the oscillation current.
[0042] The laser diode can be manufactured as follows.
[0043] FIGS. 3A and 3B through FIGS. 7A and 7B illustrate a method
of manufacturing the laser diode according to the embodiment in
order of steps. First, as illustrated in FIG. 3A, the substrate 11
having the above-described thickness and made of the
above-described material is prepared. The buffer layer 12, the
n-type cladding layer 13, n-type guide layer 14, the active layer
15, the p-type guide layer 16 and the first p-type cladding layer
17 are sequentially grown on one side of the substrate 11 by MOCVD
(Metal Organic Chemical Vapor Deposition).
[0044] Then, as illustrate in FIG. 3A, a non-oxidized layer 18C
made of the above Group III-V compound semiconductor is formed on
the first p-type cladding layer 17. On the non-oxidized layer 18C,
the second p-type cladding layer 19 and the p-side contact layer 20
are sequentially grown.
[0045] As illustrated in FIG. 3B, a mask layer 31 and a photoresist
layer 32 made of silicon dioxide are formed on the p-side contact
layer 20. After that, using the photoresist layer 32, the mask
layer 31 is selectively removed by photolithography technique to
expose the p-side contact layer 20.
[0046] As illustrated in FIG. 4A, parts of the p-side contact layer
20, the second p-type cladding layer 19, the non-oxidized layer
18C, the first p-type cladding layer 17, the p-type guide layer 16,
the active layer 15, the n-type guide layer 14 and the n-type
cladding layer 13 are selectively removed by reactive ion etching
or the like through an aperture in the mask layer 31 to form three
strip-shaped mesas. The depth of the grooves is preferably the
depth capable to expose the non-oxidized layer 18C on the side
surface of the middle mesa. The width Wst of the middle mesa is
preferably from 3 .mu.m to 50 .mu.m, and more preferably from 5
.mu.m to 10 .mu.m as described above. With this range, the contact
area of the p-side contact layer 20 and the p-side electrode 22 can
be increased to lower the contact resistance, thereby lowering the
drive voltage. After that, the photoresist layer 32 is removed.
[0047] After removing the photoresist layer 32, as illustrated in
FIG. 4B, part of the non-oxidized layer 18C is oxidized by heating
in an atmosphere of steam to form the current confinement layer 18
having the non-oxidized region 18A and the oxidized region 18B. The
oxidation temperature is from 240.degree. C. or more to less than
375.degree. C., for example. The temperature of 375.degree. C. or
higher deteriorates aging properties extremely; therefore
reliability such as life significantly deteriorates as will be
described in the examples. The temperature of less than 240.degree.
C. slows the oxidation rate to less than about 0.1 nm/sec. In the
result, it requires long time for forming the oxidized region
18B.
[0048] In other words, in case where the oxidation rate is 0.1
nm/sec, the time required for forming the oxidized region 18B with
the width WB of 1 .mu.m is about 2.7 hours. For forming the
oxidized region 18B with the width WB of 50 .mu.m, it takes about
138 hours. From the results, it is difficult and unrealistic to
perform oxidation at an oxidation rate less than 0.1 nm/sec. When
examine the temperature at an oxidation rate of about 0.1 nm/sec,
the oxidation rate is about 0.1 nm/sec at 240.degree. C. as shown
in FIG. 5. Therefore it was found that the lower limit of the
oxidation temperature is about 240.degree. C.
[0049] Further, the oxidation temperature is preferably from
300.degree. C. to 370.degree. C., and more preferably from
320.degree. C. to 365.degree. C.
[0050] The width WB of the oxidized region 18B can be controlled by
stopping oxidation after the required time calculated in advance
has passed or after obtaining an appropriate width WB by observing
the progression of oxidation with monitor or the like.
[0051] After forming the current confinement layer 18 having the
non-oxidized region 18A and the oxidized region 18B, as illustrated
in FIG. 6A, the mask layer 31 is removed and as illustrated in FIG.
6B, the insulating layer 21 made of the above materials is formed
on the whole surface of the substrate 11 by deposition.
[0052] After forming the insulating layer 21, as illustrate in FIG.
7A, a photoresist layer (not shown) is formed on the insulating
layer 21 and patterned by, for example, photolithography. Then, the
insulating layer 21 is selectively removed by etching or dry
etching with chemical etchant using the photoresist layer as a mask
to form an aperture on the top of the middle mesa. After that, the
photoresist layer is removed.
[0053] After forming the aperture in the insulating layer 21, as
illustrated in FIG. 7B, the p-side electrode 22 is formed on the
whole top surface of the substrate 11 by sequentially depositing
titanium, platinum and gold by vacuum deposition, and alloying.
After forming the p-side electrode 22, the substrate 11 is grinded
to have a predetermined thickness and as illustrated in FIG. 7B,
like the p-side electrode 22, the n-side electrode 23 is formed on
the whole surface of the substrate 11 opposite to the p-side
electrode 22 by sequentially depositing gold, AuGe and gold by
vacuum deposition, and alloying.
[0054] After forming the n-side electrode 23 and the p-side
electrode 22, the substrate 11 is adjusted to a predetermined size
and the reflective mirror films (not shown) are formed on end faces
of the pair of resonators facing in the resonator length direction.
Thereby, the laser diode illustrated in FIG. 1 is completed.
[0055] In the laser diode, when a certain voltage is applied
between the n-side electrode 23 and the p-side electrode 22, the
current confinement is performed by the oxidized region 18B of the
current confinement layer 18 and current is injected in the current
injection region 15A of the active layer 15. Thereby, the emission
is generated by the electron-hole recombination. The light is
reflected by a pair of reflective mirror films, travels
therebetween to generate laser oscillation, and is emitted outside
as the laser beam LB. Since the oxidized region 18B of the current
confinement layer 18 is formed with an appropriate temperature
condition, that is from 240.degree. C. or more to less than
375.degree. C., the device has a long life.
[0056] As described, in the embodiment, since the oxidized region
18B of the current confinement layer 18 is formed with an
appropriate temperature condition, the device has a long life, and
the device characteristics and reliability can be improved.
[0057] In addition, in the embodiment, the current confinement
layer 18 formed by oxidation is used. As a result, the width Wst of
the middle mesa can be widened. Therefore, the contact area between
the p-side contact layer 20 and the p-side electrode 22 is
increased, the contact resistance is lowered, and the amount of the
oscillation current can be reduced. Further, it is unnecessary to
provide a buried layer, which is conventionally provided.
Therefore, the crystal growth process is simplified and a reduction
in the manufacturing cost can be expected. Further, in the
embodiment, an etching stop layer, which is conventionally required
for forming the ridge, is unnecessary. As a result, the light
confinement efficiency is increased and the amount of the
oscillation current can be lowered. Furthermore, in the embodiment,
with the current confinement layer 18 formed by oxidation, compared
to the conventional structure using the current confinement formed
by the ridge, TE/TM (Transverse electric/Transverse magnetic)
polarization ratio can be increased and the S/N (Signal to Noise)
ratio can be improved.
[0058] In the embodiment, the thickness T of the oxidized region
18B in the laminated direction A is from 10 nm to 1000 nm. As a
result, the current blocking function of the oxidized region 18B
and the withstand voltage are enhanced.
[0059] Further in the embodiment, the width WB of the oxidized
region 18B on one side of the non-oxidized region 18A is one time
or more of the width WA of the non-oxidized region 18A. As a
result, the absorption loss of the laser beam LB is prevented and
therefore, the amount of the oscillation current is reduced.
[0060] In addition, in the embodiment, the width WB of the oxidized
region 18B on one side of the non-oxidized region 18A is seven
times or less of the width WA of the non-oxidized region 18A.
Therefore, the influence of the distortion of the oxidized region
18B can be reduced and the device characteristics can be
improved.
[0061] Furthermore, in the embodiment, the distance D between the
current confinement layer 18 and the active layer 15 is 50 nm or
more. This enables to enhance the manufacturing yield. If the
distance D is 180 nm or more, the absorption coefficient is reduced
and therefore, the absorption loss of the laser beam LB is
prevented and the amount of the oscillation current is reduced.
[0062] Additionally, in the embodiment, the distance D is 500 nm or
less. As a result, the leakage current is prevented and the amount
of the oscillation current is reduced.
EXAMPLE
[0063] Concrete examples of the invention will be described
hereinafter.
Example 1
[0064] Similar to the above embodiment, a laser diode was
fabricated. The oxidation temperature for forming the oxidized
region 18B was 360.degree. C. Accelerated aging test was conducted
on the obtained laser diode. The current was not passed from the
start (0 h) to 0.5 h after and the temperature was kept at
25.degree. C. The current was not passed from 0.5 h after the start
to 2.5 h after and the temperature was raised from 25.degree. C. to
70.degree. C. The current was passed 2.5 h after the start at
70.degree. C. The results are shown in FIG. 8.
Comparative Example 1
[0065] A laser diode was fabricated as in the case of Example 1,
except that the oxidation temperature was set at 375.degree. C. The
accelerated aging test was conducted like Example 1 on the obtained
laser diode. The results are shown in FIG. 8 as well. In
Comparative Example 1, the accelerated aging test was conducted
twice with the same condition and the same results were
obtained.
[0066] As can be seen from FIG. 8, a raise in drive current after
starting power distribution was slow in Example 1. However, in
Comparative Example 1, the drive current was raised sharply at the
start of power distribution and it was impossible to drive. In
other words, it was found that when the oxidized region 18B of the
current confinement layer 18 was oxidized at 360.degree. C. or
lower, the aging characteristics were significantly improved and
the device characteristics such as life and reliability were
improved. Example 1 was conducted at 360.degree. C., but if it was
conducted at less than 375.degree. C., the aging characteristics
would be improved compare to Comparative Example 1. It is
preferable that the lower limit of the oxidation temperature is
240.degree. C. or more considering the oxidation rate and the
requiring time.
Examples 2 to 4
[0067] Like the embodiment, laser diodes were fabricated. The
distance D between the active layer 15 and the current confinement
layer 18 was 120 nm in Example 2, 210 nm in Example 3 and 220 nm in
Example 4. Absorption coefficient was examined on the laser diodes
of Example 2 to 4. The results are shown in FIG. 9 together with a
curve representing the correlation relation of distance D and the
absorption coefficient on the basis of the results of Examples 2 to
4. The absorption coefficient in the laser diode using the current
confinement by conventional ridge is 8 cm.sup.-1 or less. This is
also shown in FIG. 9.
[0068] As can be seen from FIG. 9, the absorption coefficients of
Example 3 having the distance D between the active layer 15 and the
current confinement layer 18 of 210 nm and Example 4 having the
distance D of 220 nm were lower compared to that of the
conventional structure. On the other hand, the absorption
coefficient of Example 2 having the distance D of 120 nm was higher
than that of the conventional structure. The distance D having the
same absorption coefficient as the conventional structure, which is
8 cm.sup.-1, was about 180 nm. In other words, it was found that
when the distance D between the active layer 15 and the current
confinement layer 18 was 180 nm or more, the absorption coefficient
could be lowered compared to the conventional structure.
[0069] The present invention is described referring to the
embodiments and the examples, but the invention is not limited to
the embodiments and the examples, and is variously modified. For
example, in the embodiments and examples, the current confinement
layer 18 is provided between the first p-type cladding layer 17 and
the second p-type cladding layer 19. However, the current
confinement layer 18 can be provided in the n-type cladding layer
13, for example. It is desirable that the current confinement layer
18 is provided in the p-type semiconductor layer because the p-type
semiconductor layer has a larger specific resistance.
[0070] In the embodiments and examples, the first p-type cladding
layer 17, the current confinement layer 18 and the second p-type
cladding layer 19 are directly laminated. However, a middle layer
made of AlGaAs mixed crystal or the like can be provided between
the first p-type cladding layer 17 and the current confinement
layer 18, or between the current confinement layer 18 and the
second p-type cladding layer 19. Such a middle layer is preferable
because it can reduce a difference in lattice constant between the
current confinement layer 18 and the first cladding layer 17 or the
second p-type cladding layer 19.
[0071] Further, materials, thicknesses, deposition methods and
deposition conditions of each layer described in the embodiments
and examples are not limited to the above and other materials,
thicknesses, deposition methods and deposition conditions can be
applied. For example, the material of the active layer 15 can be
AlInP.
[0072] Furthermore, in the embodiments and examples, the structure
of the laser diode is concretely described. However, it is not
necessary to include all the layers and other layers can be further
included.
[0073] The present invention is applicable not only to an
edge-emitting laser diode as illustrated in FIG. 1 but also to a
VCSEL (Vertical-Cavity Surface Emitting Laser).
[0074] The semiconductor light-emitting device of the invention is
applicable to, for example, a light source for optical fiber
communications or optical wirings, a light source for laser
printers and optical discs.
[0075] Obviously many modifications and variations of the present
invention are possible in the light of the above teachings. It is
therefore to be understood that within the scope of the appended
claims the invention may be practiced otherwise than as
specifically described.
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