U.S. patent application number 11/243808 was filed with the patent office on 2007-04-05 for carrier tape and heat shrinking cover tape for integrated circuit devices.
Invention is credited to David A. Carey, Andrew N. Contes, Travis S. Nice, Nima Shahidi.
Application Number | 20070074996 11/243808 |
Document ID | / |
Family ID | 37900869 |
Filed Date | 2007-04-05 |
United States Patent
Application |
20070074996 |
Kind Code |
A1 |
Nice; Travis S. ; et
al. |
April 5, 2007 |
Carrier tape and heat shrinking cover tape for integrated circuit
devices
Abstract
Disclosed are embodiments of a carrier medium for integrated
circuit die (or other components). The carrier medium may include a
carrier tape and a heat shrinkable cover tape, the carrier tape
including a number of spaced-apart die retaining areas along the
length of this tape. Other embodiments are described and
claimed.
Inventors: |
Nice; Travis S.; (Chandler,
AZ) ; Shahidi; Nima; (Chandler, AZ) ; Contes;
Andrew N.; (Phoenix, AZ) ; Carey; David A.;
(Phoenix, AZ) |
Correspondence
Address: |
INTEL CORPORATION;C/O INTELLEVATE, LLC
P.O. BOX 52050
MINNEAPOLIS
MN
55402
US
|
Family ID: |
37900869 |
Appl. No.: |
11/243808 |
Filed: |
October 5, 2005 |
Current U.S.
Class: |
206/714 |
Current CPC
Class: |
H05K 13/0084
20130101 |
Class at
Publication: |
206/714 |
International
Class: |
B65D 85/00 20060101
B65D085/00 |
Claims
1. A carrier medium, comprising: a carrier tape, the carrier tape
including a number of retaining areas, each retaining area sized to
receive a component; and a cover tape overlying the retaining areas
and secured to the cover tape, wherein the cover tape comprises a
heat shrinkable material; wherein the cover tape has been shrunk by
application of heat after application of the cover tape to the
carrier tape.
2. The carrier medium of claim 1, wherein each of the retaining
areas comprises a pocket formed in the carrier tape.
3. The carrier medium of claim 2, wherein each of the retaining
areas further comprises a raised feature disposed on the carrier
tape proximate a periphery of the pocket.
4. The carrier medium of claim 1, wherein each of the retaining
areas comprises a raised feature disposed on the carrier tape, the
raised feature defining at least a portion of a periphery of the
retaining area.
5. The carrier medium of claim 1, wherein the component comprises
an integrated circuit die.
6. The carrier medium of claim 1, wherein the cover tape comprises
a heat shrinkable polymer material.
7. A carrier tape comprising; a base, the base having an upper
surface; a number of pockets formed in the base, each pocket
extending downward below the upper surface; and a number of raised
features disposed on the base, each raised feature extending
upwards from the upper surface and located proximate a periphery of
one of the pockets.
8. The carrier tape of claim 7, wherein each of the raised features
extends about a portion of the periphery of the one pocket.
9. The carrier tape of claim 7, wherein each of the raised features
extends fully around the periphery of the one pocket.
10. The carrier tape of claim 7, wherein each of the pockets is
capable of receiving an integrated circuit die.
11. The carrier tape of claim 7, wherein the base comprises a
material selected from a group consisting of polycarbonate and
highly carbon black reinforced polystyrene.
12. A carrier tape comprising: a base, the base having an upper
surface; and a number of raised features disposed on the base and
extending upwards from the upper surface; wherein a number of
retaining areas are provided on the base, each of the retaining
areas defined by at least one of the raised features.
13. The carrier tape of claim 12, wherein each of the raised
features extends about a portion of a periphery of one of the
retaining areas.
14. The carrier tape of claim 12, wherein each of the raised
features extends fully around a periphery of one of the retaining
areas.
15. The carrier tape of claim 12, wherein each of the retaining
areas is capable of receiving an integrated circuit die.
16. The carrier tape of claim 12, wherein the base comprises a
material selected from a group consisting of polycarbonate and
highly carbon black reinforced polystyrene.
17. A method comprising: placing a die in a retaining area of a
carrier tape; applying a cover tape to the carrier tape, the cover
tape overlying the retaining area, wherein the cover tape comprises
of a heat shrinkable material; and applying heat to the cover tape
to shrink the cover tape.
18. The method of claim 17, further comprising securing the cover
tape to the carrier tape using an adhesive.
19. The method of claim 17, wherein the cover tape is secured to
carrier tape by shrinkage of the cover tape.
20. A system comprising: a pick-and-place mechanism to place a die
in a pocket of the carrier tape; an applicator to apply a cover
tape to the carrier tape, wherein the cover tape comprises a heat
shrinkable material; and a heat source to apply heat to the cover
tape and shrink the cover tape.
21. The system of claim 20, wherein the heat source comprises a
device selected from a group consisting of a hot air blower, a heat
lamp, an infrared heater, and an electric resistive element.
22. The system of claim 20, further comprising a take-up reel to
receive the carrier tape with the applied cover tape.
Description
FIELD OF THE INVENTION
[0001] The disclosed embodiments relate generally to the
manufacture of integrated circuit devices and, more particularly,
to a carrier tape and a heat shrinkable cover tape for handling
integrated circuit devices.
BACKGROUND OF THE INVENTION
[0002] A carrier tape capable of holding a number of integrated
circuit (IC) die may be utilized to facilitate automation and
handling of these components. A typical carrier tape comprises a
flexible tape having a row (or multiple rows) of evenly spaced
pockets distributed along its length. Each pocket is configured to
receive an individual die (or die assembly or packaged die), and a
cover tape is adhered to an upper surface of the carrier tape to
cover each pocket and retain the die on the carrier. The carrier
tape can be wound onto a tape reel, and a row of small indexing
holes may be distributed along the length of the carrier tape
adjacent an edge of the tape, these indexing holes enabling
movement of the carrier tape and/or tape reel by automated handing
equipment.
[0003] The typical carrier tape described above may work well for
thick integrated circuit die (e.g., die having a thickness greater
than about 200 .mu.m). However, in order to facilitate smaller form
factors and die stacking architectures, IC device manufacturers may
be producing die having thicknesses less than 200 .mu.m, and
perhaps having thicknesses less than about 50 .mu.m. At these
relatively small thicknesses (e.g., thicknesses less than about 200
.mu.m), migration of die between the pockets of a carrier tape may
occur, as the die may be capable of sliding through any gap that
exists between the cover tape and carrier tape.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIGS. 1A-1D are schematic diagrams illustrating embodiments
of a carrier medium including a carrier tape and a heat shrinkable
cover tape.
[0005] FIGS. 2A-2F are schematic diagrams illustrating other
embodiments of a carrier medium including a carrier tape and a heat
shrinkable cover tape.
[0006] FIGS. 3A-3F are schematic diagrams illustrating further
embodiments of a carrier medium including a carrier tape and a heat
shrinkable cover tape.
[0007] FIG. 4 is a block diagram illustrating an embodiment of a
method for securing die in a carrier medium using a heat shrinkable
cover tape.
[0008] FIG. 5 is a schematic diagram illustrating an embodiment of
a system for securing die in a carrier medium having a heat
shrinkable cover tape.
DETAILED DESCRIPTION OF THE INVENTION
[0009] Referring to FIGS. 1A through 1D, illustrated are
embodiments of a carrier tape 100 and a cover tape 150. A top plan
view of the carrier and cover tapes is provided in FIG. 1A, whereas
a side elevation view of the carrier and cover tapes is shown in
FIG. 1B. Cross-sectional views, as taken along line X-X of FIGS. 1A
and 1B, of various embodiments of the carrier and cover tapes are
provided in each of FIGS. 1C and 1D. In FIGS. 1A-1D, the carrier
tape 100 and cover tape 150 are shown after application of the
cover tape to the carrier tape. Together, the carrier tape 100 and
cover tape 150 provide a carrier medium for a number of integrated
circuit die 5 (or other components).
[0010] With reference to FIGS. 1A-1C, in one embodiment, the
carrier tape 100 comprises a base 110 having an upper side 111 and
an opposing lower side 112. Disposed on the base 110 is a row of
spaced-apart pockets 120 (or other retaining areas or features).
Each of the pockets 120 provides a recess accessible from the upper
side 111, and this recess can receive an integrated circuit die 5
(or, alternatively, a packaged die, die assembly, or other
component). An aperture 122 at the bottom of each pocket 120 may
allow for insertion of a pin (from lower side 112) to assist in
extraction of any component placed in a pocket 120. Although a
single row of pockets 120 is shown in the figures, in other
embodiments, multiple rows of pockets may be distributed along the
length of the carrier tape 100.
[0011] Disposed along the edges (or, perhaps, one of the edges) of
the base 110 is a row of indexing holes 115. A drive gear having
teeth adapted to engage the indexing holes 115, or other mechanism
capable of engaging the indexing holes, can be used to advance the
carrier tape 100 (either alone or in combination with motion of a
take-up reel). The carrier tape 100 may be constructed from any
suitable flexible material, including plastic materials such as
polycarbonate or highly carbon black reinforced polystyrene, as
well as other materials.
[0012] The carrier medium depicted in FIGS. 1A-1C (and 1D) also
includes a cover tape 150. As illustrated in these figures, the
cover tape 150 has been applied to the carrier tape 100. The cover
tape 150 retains the die 5 (or other components) placed into the
pockets 120 and also protects these die. Cover tape 150 comprises a
flexible heat shrinkable material, such as a heat shrinkable
polymer (e.g., a heat shrinkable polyester or polyolefin). After
application of the cover tape 150 to the carrier tape 100, heat is
applied to shrink the cover tape. Shrinkage of the cover tape 150
can minimize sagging of the cover tape, thereby eliminating or
substantially reducing any gaps that may have existed between the
cover tape 150 and carrier tape 100. Eliminating or reducing such
gaps can help to prevent the migration of die between the pockets
120 of the carrier tape.
[0013] The cover tape 150 may be secured to the carrier tape 100
using any suitable technique. According to one embodiment, as shown
in FIGS. 1A-1C, the cover tape 150 is secured to the carrier tape
100 using layers of adhesive 190 (e.g., a pressure sensitive
adhesive). After the cover tape 150 is adhered to the carrier tape
100, heat can be applied to shrink the cover tape and reduce sag
between the adhesive strips 190. In an alternative embodiment, as
shown in FIG. 1D, the cover tape 150 is adhered to the carrier tape
100 though shrinkage of the cover tape itself. As shown in FIG. 1D,
the cover tape 150 has a width that is greater than a width of the
carrier tape 100. Upon application of heat and shrinkage of the
cover tape 150, the outer edges of the cover tape 150 wrap around
the outer edges of the carrier tape 100, thereby securing the cover
tape to the carrier tape and also reducing sag in the cover
tape.
[0014] Referring next to FIGS. 2A through 2F, illustrated are
further embodiments of a carrier tape 200 and a cover tape 250. A
top plan view of the carrier and cover tapes is provided in FIG.
2A, whereas a side elevation view of the carrier and cover tapes is
shown in FIG. 2B. Cross-sectional views, as taken along line Y-Y of
FIGS. 2A and 2B, of various other embodiments of the carrier and
cover tapes are provided in each of FIGS. 2C and 2D. Also, each of
FIGS. 2E and 2F illustrates further embodiments (in plan view) of
the carrier tape 200. In FIGS. 2A-2D, the carrier tape 200 and
cover tape 250 are shown after application of the cover tape to the
carrier tape. Together, the carrier tape 200 and cover tape 250
provide a carrier medium for a number of integrated circuit die 5
(or other components).
[0015] Turning to FIGS. 2A-2C, in one embodiment, the carrier tape
200 comprises a base 210 having an upper side 211 and an opposing
lower side 212. Disposed on the base 210 is a row of spaced-apart
die retaining areas 205. According to one embodiment, each die
retaining area 205 comprises a pocket 220 formed in the base 210
and one or more raised features 230 extending upwards for the upper
surface 211 of base 210. Each of the pockets 220 provides a recess
accessible from the upper side 211, and this recess can receive an
integrated circuit die 5 (or, alternatively, a packaged die, die
assembly, or other component). The raised features 230, in
conjunction with cover tape 250, function to minimize gaps between
the cover tape and carrier tape 200 that could allow die to migrate
between retaining areas. An aperture 222 at the bottom of each
pocket 220 may allow for insertion of a pin (from lower side 212)
to assist in extraction of any component placed in a pocket 220.
Although a single row of retaining areas 205 is shown in the
figures, in other embodiments, multiple rows of retaining areas may
be distributed along the length of the carrier tape 200.
[0016] Disposed along the edges (or, perhaps, one of the edges) of
the base 210 is a row of indexing holes 215. A drive gear having
teeth adapted to engage the indexing holes 215, or other mechanism
capable of engaging the indexing holes, can be used to advance the
carrier tape 200 (either alone or in combination with motion of a
take-up reel). The carrier tape 200 may be constructed from any
suitable flexible material, including plastic materials such as
polycarbonate or highly carbon black reinforced polystyrene, as
well as other materials.
[0017] The carrier medium depicted in FIGS. 2A-2C (and 2D) also
includes a cover tape 250. As illustrated in these figures, the
cover tape 250 has been applied to the carrier tape 200. The cover
tape 250 retains the die 5 (or other components) placed into the
pockets 220 and also protects these die. In one embodiment, cover
tape 250 comprises a flexible heat shrinkable material, such as a
heat shrinkable polymer (e.g., a heat shrinkable polyester or
polyolefin). After application of the cover tape 250 to the carrier
tape 100, heat is applied to shrink the cover tape. Shrinkage of
the cover tape 250 can minimize sagging of the cover tape over the
pockets 220, and this reduction in sagging in conjunction with the
raised features 230 can serve to eliminate or substantially reduce
gaps between the cover tape 250 and carrier tape 200. Eliminating
or reducing such gaps can help to prevent the migration of die
between the retaining areas 205 of the carrier tape 200.
[0018] The cover tape 250 may be secured to the carrier tape 200
using any suitable technique. According to one embodiment, as shown
in FIGS. 2A-2C, the cover tape 250 is secured to the carrier tape
200 using layers of adhesive 290 (e.g., a pressure sensitive
adhesive). After the cover tape 250 is adhered to the carrier tape
200, heat can be applied to shrink the cover tape and reduce sag
between the adhesive strips 290. In an alternative embodiment, as
shown in FIG. 2D, the cover tape 250 is adhered to the carrier tape
200 though shrinkage of the cover tape itself. As shown in FIG. 2D,
the cover tape 250 has a width that is greater than a width of the
carrier tape 200. Upon application of heat and shrinkage of the
cover tape 250, the outer edges of the cover tape 250 wrap around
the outer edges of the carrier tape 200, thereby securing the cover
tape to the carrier tape and also reducing sag in the cover
tape.
[0019] In FIGS. 2A through 2D, each of the retaining areas 205
includes four raised features 230 surrounding the periphery of a
generally rectangular-shaped pocket 220. Each of the raised
features 230 extends along a portion of one side of the
rectangular-shaped pocket 220. It should be understood, however,
that FIGS. 2A-2D present just one embodiment of the configuration
of a retaining area 205 and, further, that a retaining
area--including raised features 230-- may have any suitable
configuration. By way of example, with reference to FIG. 2E, a
retaining area 205 may include a single raised feature 230 that
extends fully around the periphery of a generally rectangular
shaped pocket 220. Referring to FIG. 2F, by way of further example,
a retaining area 205 may include four raised features 230, each of
the raised features located at one corner of the pocket 220 and
extending about a portion of the pocket's periphery. Also, as the
reader will appreciate, the pockets 220 are not limited to the
generally rectangular-shaped pockets shown in the figures, and the
pockets may have any other suitable shape or configuration,
depending upon the shape and size of the components that are to be
placed on the carrier tape 200 (e.g., generally circular, oval,
etc.).
[0020] Turning now to FIGS. 3A through 3F, illustrated are
additional embodiments of a carrier tape 300 and a cover tape 350.
A top plan view of the carrier and cover tapes is provided in FIG.
3A, whereas a side elevation view of the carrier and cover tapes is
shown in FIG. 3B. Cross-sectional views, as taken along line Z-Z of
FIGS. 3A and 3B, of various other embodiments of the carrier and
cover tapes are provided in each of FIGS. 3C and 3D. Also, each of
FIGS. 3E and 3F illustrates further embodiments (in plan view) of
the carrier tape 300. In FIGS. 3A-3D, the carrier tape 300 and
cover tape 350 are shown after application of the cover tape to the
carrier tape. Together, the carrier tape 300 and cover tape 350
provide a carrier medium for a number of integrated circuit die 5
(or other components).
[0021] Referring to FIGS. 3A-3C, in one embodiment, the carrier
tape 300 comprises a base 310 having an upper side 311 and an
opposing lower side 312. Disposed on the base 310 is a row of
spaced-apart die retaining areas 305. According to one embodiment,
each die retaining area 305 comprises one or more raised features
330 extending upwards for the upper surface 311 of base 310. The
raised features 330 of each retaining area define a slot capable of
receiving an integrated circuit die 5 (or other component) and,
upon application of the cover tape 350, any die placed in this slot
will be retained and prevented from migrating to other areas of the
carrier tape 200. An aperture 322 in each retaining area 305 may
allow for insertion of a pin (from lower side 312) to assist in
extraction of any component placed in the slot defined by the
raised features 330. Also, although a single row of retaining areas
305 is shown in the figures, in other embodiments, multiple rows of
retaining areas may be distributed along the length of the carrier
tape 300.
[0022] Disposed along the edges (or, perhaps, one of the edges) of
the base 310 is a row of indexing holes 315. A drive gear having
teeth adapted to engage the indexing holes 315, or other mechanism
capable of engaging the indexing holes, can be used to advance the
carrier tape 300 (either alone or in combination with motion of a
take-up reel). The carrier tape 300 may be constructed from any
suitable flexible material, including plastic materials such as
polycarbonate or highly carbon black reinforced polystyrene, as
well as other materials.
[0023] The carrier medium depicted in FIGS. 3A-3C (and 3D) also
includes a cover tape 350. As illustrated in these figures, the
cover tape 350 has been applied to the carrier tape 300. The cover
tape 350 retains the die 5 (or other components) placed into the
retaining areas 305 and also protects these die. In one embodiment,
cover tape 350 comprises a flexible heat shrinkable material, such
as a heat shrinkable polymer (e.g., a heat shrinkable polyester or
polyolefin). After application of the cover tape 350 to the carrier
tape 300, heat is applied to shrink the cover tape. Shrinkage of
the cover tape 350 can minimize sagging of the cover tape between
the raised features 330, and this reduction in sagging can help to
retain components in the retaining areas 305.
[0024] The cover tape 350 may be secured to the carrier tape 300
using any suitable technique. According to one embodiment, as shown
in FIGS. 3A-3C, the cover tape 350 is secured to the carrier tape
300 using layers of adhesive 390 (e.g., a pressure sensitive
adhesive). After the cover tape 350 is adhered to the carrier tape
300, heat can be applied to shrink the cover tape and reduce sag
between the adhesive strips 390. In an alternative embodiment, as
shown in FIG. 3D, the cover tape 350 is adhered to the carrier tape
300 though shrinkage of the cover tape itself. As shown in FIG. 3D,
the cover tape 350 has a width that is greater than a width of the
carrier tape 300. Upon application of heat and shrinkage of the
cover tape 350, the outer edges of the cover tape 350 wrap around
the outer edges of the carrier tape 300, thereby securing the cover
tape to the carrier tape and also reducing sag in the cover
tape.
[0025] In FIGS. 3A through 3D, each of the retaining areas 305
includes four raised features 330 that define, at least in part,
the periphery of a slot capable of receiving an IC die 5 or other
component, as described above. It should be understood, however,
that FIGS. 3A-3D present just one embodiment of the configuration
of a retaining area 305 and, further, that a retaining area--
including raised features 330--may have any suitable configuration.
By way of example, with reference to FIG. 3E, a retaining area 305
may include a single raised feature 330 that fully defines the
periphery of a generally rectangular shaped slot capable of
receiving an IC die 5 or other component (this slot, in essence,
being similar to the pocket 220 described above, but extending
above the upper surface 311 of base 310 rather than below this
surface). Referring to FIG. 3F, by way of further example, a
retaining area 305 may include four raised features 330, wherein
the raised features define, in part, the periphery of a slot--in
particular, the corners of such a slot-- that is capable of
receiving an IC die or other component. Also, as the reader will
appreciate, a slot defined by raised features 330 is not limited to
the generally rectangular-shaped slots shown in the figures, and
these slots may have any other suitable shape or configuration,
depending upon the shape and size of the components that are to be
placed on the carrier tape 300 (e.g., generally circular, oval,
etc.).
[0026] In the embodiments described above in FIGS. 2A-2F and in
FIGS. 3A-3F, the carrier medium included a heat shrinkable cover
tape. However, the disclosed embodiments are not limited to use of
a heat shrinkable cover tape. Thus, it should be understood that,
in other embodiments, the cover tape 250, 350 may comprise a
material that does not shrink (or that does not substantially
shrink) upon application of heat and/or that is not otherwise
subjected to heat after being adhered to the carrier tape.
[0027] Referring now to FIG. 4, illustrated is an embodiment of a
method 400 for securing die in a carrier medium using a heat
shrinkable cover tape. As set forth in block 410, a die is placed
in a retaining area of a carrier tape. A cover tape is then applied
to the carrier tape, as shown at block 420, this cover tape
comprising a heat-shrinkable material. Referring to block 430, heat
is applied to the cover tape to shrink the cover tape. In one
embodiment, shrinkage of the cover tape itself secures the cover
tape to the carrier tape. According to another embodiment, as set
forth in block 440, the cover tape is secured to the carrier tape
using an adhesive (e.g., a pressure sensitive adhesive). As the
reader will appreciate, in many applications, the method 400
described above will take place in a continuous manner, wherein die
are consecutively placed in successive retaining areas of the
carrier tape, the cover tape is secured to the carrier tape, and
the carrier medium with die is wound onto a take-up reel.
[0028] Referring to FIG. 5, illustrated is an embodiment of a
system 500 for securing die in a carrier medium having a heat
shrinkable cover tape. System 500 includes a carrier tape mechanism
510, which comprises a source tape reel 512, a take-up reel 514,
and an actuator 516 coupled with the take-up reel 514 (and/or
source reel 512). Wound on the source tape reel 512 is a length of
carrier tape 100, 200, 300 having a number of retaining areas 205,
305 (or simply pockets 120), each retaining area for receiving a
die 5. The carrier tape is advanced by motion of the take-up reel
514 (and/or source reel 512) initiated by actuator 516, and the
carrier tape (with die 5 and a cover tape) is wound onto the
take-up reel 514. Alternatively, movement of the carrier tape may
be initiated by a mechanism that engages a series of indexing holes
on the carrier tape (either alone or in combination with motion of
the take-up reel 514 produced by actuator 516).
[0029] The system 500 further includes a cover tape applicator 520.
Cover tape applicator 520 comprises any suitable mechanism capable
of disposing a cover tape 150, 250, 350 onto the carrier tape in a
continuous manner. The system 500 may also include a heat source
530. Heat source 530 may comprise any suitable heat source capable
of heating the cover tape in order to shrink this tape. For
example, the heat source 530 may comprise a hot air blower, a heat
lamp, an infrared heater, or an electric resistive element.
Embodiments of the cover tape 150, 250, 350 and carrier tape 100,
200, 300, as well as the application of this cover tape to the
carrier tape to create a carrier medium for integrated circuit die
(or other components), are described above.
[0030] The system 500 also includes a pick-and-place mechanism 540.
Pick-and-place mechanism 540 includes a pick-and-place head 545
that "picks" individual die 5 from a wafer 2 that has been diced or
singulated into a number of die. Wafer 2 may be held by a wafer
holding device 550 (e.g., a wafer chuck, an adhesive tape disposed
on a substrate, etc.). System 500 may also include a controller 560
communicatively coupled with the heat source 530, the
pick-and-place mechanism 540, and the actuator 516 of carrier tape
mechanism 510, and each of these devices may send signals to
controller and receive signals from the controller (and perform
actions in response to signals received from the controller). The
controller 560 may comprise any suitable computing device.
[0031] The foregoing detailed description and accompanying drawings
are only illustrative and not restrictive. They have been provided
primarily for a clear and comprehensive understanding of the
disclosed embodiments and no unnecessary limitations are to be
understood therefrom. Numerous additions, deletions, and
modifications to the embodiments described herein, as well as
alternative arrangements, may be devised by those skilled in the
art without departing from the spirit of the disclosed embodiments
and the scope of the appended claims.
* * * * *