U.S. patent application number 11/398137 was filed with the patent office on 2007-03-29 for liquid cooling system.
This patent application is currently assigned to HON HAI Precision Industry CO., LTD.. Invention is credited to Hsin-Ho Lee.
Application Number | 20070068172 11/398137 |
Document ID | / |
Family ID | 37892197 |
Filed Date | 2007-03-29 |
United States Patent
Application |
20070068172 |
Kind Code |
A1 |
Lee; Hsin-Ho |
March 29, 2007 |
Liquid cooling system
Abstract
A liquid cooling system includes a heat-absorbing unit, a
heat-dissipating unit, at least one pipe, a coolant and a magnetic
field generator for generating a magnetic field. The pipe
interconnects the heat-absorbing unit and the heat-dissipating
unit, thereby the heat-absorbing unit, the heat-dissipating unit
and the pipe cooperatively form a circulatory channel. The coolant
is received in the circulatory channel, the coolant comprises a
liquid and a plurality of magnetic particles dispersed in the
liquid. At least one of the heat-absorbing unit and the
heat-dissipating unit is located in the magnetic field. The liquid
cooling system increases the thermal conductivity of the coolant by
making the coolant flow turbulently. The efficiency of the liquid
cooling system resultantly being increased.
Inventors: |
Lee; Hsin-Ho; (Tu-Cheng,
TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. CHENG-JU CHIANG JEFFREY T. KNAPP
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
HON HAI Precision Industry CO.,
LTD.
Tu-Cheng City
TW
|
Family ID: |
37892197 |
Appl. No.: |
11/398137 |
Filed: |
April 4, 2006 |
Current U.S.
Class: |
62/3.1 |
Current CPC
Class: |
Y02B 30/00 20130101;
F25B 2321/0021 20130101; Y02B 30/66 20130101; F25B 21/00
20130101 |
Class at
Publication: |
062/003.1 |
International
Class: |
F25B 21/00 20060101
F25B021/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 23, 2005 |
CN |
200510037495.6 |
Claims
1. A liquid cooling system comprising: a heat-absorbing unit; a
heat-dissipating unit; at least one pipe interconnecting the
heat-absorbing unit and the heat-dissipating unit, thereby the
heat-absorbing unit, the heat-dissipating unit and the pipe
cooperatively forming a circulatory channel; a coolant received in
the circulatory channel, the coolant comprising a liquid and a
plurality of magnetic particles dispersed in the liquid; and a
magnetic field generator for generating a magnetic field where at
least one of the heat-absorbing unit and the heat-dissipating unit
is located.
2. The liquid cooling system as claimed in claim 1, wherein the
magnetic field generator is configured for providing a variable
magnetic field.
3. The liquid cooling system as claimed in claim 1, wherein the
magnetic field generator is selected from the group consisting of a
permanent magnet and an electromagnet.
4. The liquid cooling system as claimed in claim 1, wherein the
magnetic field generator is arranged at opposite sides of the
heat-absorbing unit.
5. The liquid cooling system as claimed in claim 1, wherein the
magnetic field generator is arranged at opposite sides of the
heat-dissipating unit.
6. The liquid cooling system as claimed in claim 1, wherein the
circulatory channel has a channel segment spatially corresponding
to the heat-absorbing unit, the channel segment has a concertinaed
configuration.
7. The liquid cooling system as claimed in claim 1, wherein the
heat-dissipating unit is a heat exchanger.
8. The liquid cooling system as claimed in claim 1, wherein the
liquid is selected from the group consisting of water, alcohol,
ketone, and any combination thereof.
9. The liquid cooling system as claimed in claim 1, wherein the
magnetic particles are comprised of a material selected from the
group consisting of iron, cobalt, nickel, and any combination alloy
thereof.
10. The liquid cooling system as claimed in claim 1, wherein the
magnetic particles are nano-sized particles.
11. The liquid cooling system as claimed in claim 9, wherein a
diameter of each nano-sized particle is in the range from 1 to 100
nanometers.
12. The liquid cooling system as claimed in claim 1, wherein the
magnetic particles constitute a percentage of the mass of the total
coolant in the range from 0.1 percent to 3 percent.
13. The liquid cooling system as claimed in claim 1, wherein the
coolant further comprises a plurality of thermally conductive
particles.
14. The liquid cooling system as claimed in claim 13, wherein the
thermally conductive particles are comprised of a material selected
from the group consisting of copper, aluminum, gold, silver, zinc
oxide, copper oxide, aluminum oxide, aluminum nitride, boron
nitride, and any combination thereof.
15. The liquid cooling system as claimed in claim 13, wherein the
thermally conductive particles are nano-sized particles.
16. The liquid cooling system as claimed in claim 14, wherein the
coolant further comprises a dispersant for preventing aggregation
of the thermally conductive particles and the magnetic particles.
Description
1. TECHNICAL FIELD
[0001] The present invention relates generally to heat dissipating
devices, and more particularly to a liquid cooling system.
2. BACKGROUND
[0002] Electronic components such as semiconductor chips are
becoming progressively smaller, while at the same time heat
dissipation requirements thereof are increasing. For most
contemporary applications, a liquid cooling system is the most
efficient system which can be used to dissipate heat.
[0003] A conventional liquid cooling system generally includes a
heat-absorbing unit, a heat-dissipating unit, at least one pipe and
coolant circulating between the heat-absorbing unit, the
heat-dissipating unit and the pipes. In order to ensure the
effective operation of the liquid cooling system, the coolant of
liquid cooling system must have high thermal conductivity. Using
coolants with high thermal conductivity, the liquid cooling system
can decrease the thermal resistance between the coolant and the
heat-absorbing unit and also the thermal resistance between the
coolant and the heat-dissipating unit.
[0004] Conventional liquid cooling systems generally adopt pure
liquids to act as the coolants. However, for many applications, the
thermal conductivity of these coolants are too low and the rate of
heat transfer is too slow, and thus the operating efficiency of the
liquid cooling system is unsatisfactory.
[0005] What is needed, therefore, is a liquid cooling system with
better operating efficiency.
SUMMARY
[0006] In accordance with an embodiment, a liquid cooling system
includes a heat-absorbing unit, a heat-dissipating unit, at least
one pipe, a coolant and a magnetic field generator for generating a
magnetic field. The pipe interconnects the heat-absorbing unit and
the heat-dissipating unit, thereby the heat-absorbing unit, the
heat-dissipating unit and the pipe cooperatively form a circulatory
channel. The coolant is received in the circulatory channel, the
coolant comprises a liquid and a plurality of magnetic particles
dispersed in the liquid. The coolant includes a liquid and a
plurality of magnetic particles dispersed in the liquid. At least
one of the heat-absorbing unit and the heat-dissipating unit is
located in the magnetic field.
[0007] Other advantages and novel features will become more
apparent from the following detailed description of present liquid
cooling system, when taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Many aspects of the present liquid cooling system can be
better understood with reference to the following drawings. The
components in the drawings are not necessarily to scale, the
emphasis instead being placed upon clearly illustrating the
principles of the present liquid cooling system. Moreover, in the
drawings, like reference numerals designate corresponding parts
throughout the several views.
[0009] FIG. 1 is a schematic, plan view of a liquid cooling system
according to a first embodiment;
[0010] FIG. 2 is a schematic, isometric view of the heat-absorbing
unit of FIG. 1; and
[0011] FIG. 3 is a schematic, plan view of a liquid cooling system
according to a second embodiment.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0012] Embodiments of the present liquid cooling system will now be
described in detail below and with reference to the drawings.
[0013] Referring to FIG. 1, a liquid cooling system 10 according to
a first embodiment includes a heat-absorbing unit 20, a
heat-dissipating unit 30, at least one pipe 40 interconnecting the
heat-absorbing unit 20 to the heat-dissipating unit 30, and a
coolant 50. The heat-absorbing unit 20, the heat-dissipating unit
30 and the pipe 40 cooperatively form a circulatory channel. The
coolant 50 is received in the circulatory channel.
[0014] The coolant 50 is generally a suspension, and includes a
liquid and a plurality of magnetic particles dispersed in the
liquid. The liquid can be selected from the group consisting of
water, alcohol, ketone, and any combination thereof. The magnetic
particles are comprised of a material selected from the group
consisting of iron, cobalt, nickel, and any combination alloy
thereof. Preferably, the magnetic particles are nano-sized
particles. A diameter of each nano-sized particle is in the range
from 1 to 100 nanometers. A percent by mass of the magnetic
particles to the coolant is in the range from 0.1 percent to 3
percent.
[0015] The coolant 50 further includes a plurality of thermally
conductive particles. The thermally conductive particles are
comprised of a material selected from the group consisting of
copper, aluminum, gold, silver, zinc oxide, copper oxide, aluminum
oxide, aluminum nitride, boron nitride, and any combination
thereof. Preferably, the thermally conductive particles are
nano-sized particles. The coolant 50 further includes a dispersant
for preventing aggregation of the thermally conductive particles
and the magnetic particles.
[0016] The heat-absorbing unit 20 is thermally coupled to a
heat-generating component 60. In operation, the heat-generating
component 60 generates heat. The coolant 50 flows through the pipe
40 to cool the heat-absorbing unit 20 and then discharges heat in
the heat-dissipating unit 30, and the cycle repeats. The
heat-generating component 60 can be an electronic component such as
a CPU (central processing unit) or an IC (integrated chip) package.
The heat-dissipating unit 30 can be a heat exchanger.
[0017] Referring to FIG. 2, the heat-absorbing unit 20 includes an
inlet 21, an outlet 22. The circulatory channel has a channel
segment 23 spatially corresponding to the heat-absorbing unit 20.
The channel segment 23 has a concertinaed configuration. A pair of
electromagnets 24, 24' are respectively secured to two outward
facing surfaces 25, 25' of the heat-absorbing unit 20. The
electromagnets 24, 24' are each coupled to an electrical power
source. A cavity can be defined in the heat-absorbing unit 20
instead of the channel segment 23 to perform a similar function.
Preferably, the channel segment 23 is defined in the heat-absorbing
unit 20. Using the channel segment 23, heat-exchanger area between
the heat-absorbing unit 20 and coolant 50 can be increased.
Accordingly, the efficiency of the liquid cooling system 10 can be
increased.
[0018] The electromagnets 24, 24' can provide a magnetic field
surrounding the heat-absorbing unit 20. The magnetic particles of
the coolant 50 in the heat-absorbing unit 20 are moved along the
direction of the magnetic field by a magnetic force. The movement
of the magnetic particles also causes the coolant 50 to move.
Thereby, the coolant 50 flows turbulently and thus improves
conductivity in the coolant 50 by improving the probability of
collision between the molecules. The thermal conductivity of the
coolant 50 is thus improved and the thermal resistance between the
coolant 50 and the heat-absorbing unit 20 is thus decreased.
Accordingly, the efficiency of the liquid cooling system 10 is
increased.
[0019] The electromagnets 24, 24' are configured for generating a
magnetic field, they also can be arranged at opposite sides of the
heat-dissipating unit 30. The electromagnets 24, 24' can be
replaced by other magnetic field generator, such as a permanent
magnet or a device which can generate a varying electrical field.
The number of the magnetic field generators can be one or more. The
position of the electromagnets 24, 24' is not limited, they only
need to generate a magnetic field surrounding the heat-absorbing
unit 20. Preferably, the magnetic field generator is configured for
providing a variable magnetic field.
[0020] Referring to FIG. 3, a liquid cooling system 100 according
to a second embodiment includes a heat-absorbing unit 200, a
heat-dissipating unit 300, at least one pipe 400 interconnecting
the heat-absorbing unit 200 to the heat-dissipating unit 300, and a
coolant 500. The heat-absorbing unit 200, the heat-dissipating unit
300 and the pipe 400 cooperatively form a circulatory channel. The
coolant 500 is received in the circulatory channel.
[0021] The liquid cooling system 100 is similar to the liquid
cooling system 10. The difference is that two electromagnets 310,
310' are secured to two opposite surfaces 320, 320' of the
heat-dissipating unit 300 respectively instead of the
electromagnets 24, 24' as in the first embodiment.
[0022] The electromagnets 310, 310' can provide a magnetic field
surrounding the heat-dissipating unit 300. The magnetic particles
of the coolant 500 in the heat-dissipating unit 300 are moved along
the direction of the magnetic field by magnetic force. The liquid
molecules contiguous with the magnetic particles move together with
the magnetic particles, thus setting up a flow cycle. The coolant
500 flows turbulently, thus improving the probability of collision
between molecules. The thermal conductivity of the coolant 500 can
be improved and the thermal resistance between the coolant 500 and
the heat-absorbing unit 200 can be decreased. Accordingly, the
efficiency of the liquid cooling system 100 can be increased.
[0023] In another embodiment, the heat-absorbing unit and the heat
dissipating unit can be disposed in the magnetic fields and such
configuration should be considered to be within the scope of the
present invention.
[0024] It is understood that the above-described embodiments are
intended to illustrate rather than limit the invention. Variations
may be made to the embodiments and methods without departing from
the spirit of the invention. Accordingly, it is appropriate that
the appended claims be construed broadly and in a manner consistent
with the scope of the invention.
* * * * *