Liquid cooling system

Lee; Hsin-Ho

Patent Application Summary

U.S. patent application number 11/398137 was filed with the patent office on 2007-03-29 for liquid cooling system. This patent application is currently assigned to HON HAI Precision Industry CO., LTD.. Invention is credited to Hsin-Ho Lee.

Application Number20070068172 11/398137
Document ID /
Family ID37892197
Filed Date2007-03-29

United States Patent Application 20070068172
Kind Code A1
Lee; Hsin-Ho March 29, 2007

Liquid cooling system

Abstract

A liquid cooling system includes a heat-absorbing unit, a heat-dissipating unit, at least one pipe, a coolant and a magnetic field generator for generating a magnetic field. The pipe interconnects the heat-absorbing unit and the heat-dissipating unit, thereby the heat-absorbing unit, the heat-dissipating unit and the pipe cooperatively form a circulatory channel. The coolant is received in the circulatory channel, the coolant comprises a liquid and a plurality of magnetic particles dispersed in the liquid. At least one of the heat-absorbing unit and the heat-dissipating unit is located in the magnetic field. The liquid cooling system increases the thermal conductivity of the coolant by making the coolant flow turbulently. The efficiency of the liquid cooling system resultantly being increased.


Inventors: Lee; Hsin-Ho; (Tu-Cheng, TW)
Correspondence Address:
    PCE INDUSTRY, INC.;ATT. CHENG-JU CHIANG JEFFREY T. KNAPP
    458 E. LAMBERT ROAD
    FULLERTON
    CA
    92835
    US
Assignee: HON HAI Precision Industry CO., LTD.
Tu-Cheng City
TW

Family ID: 37892197
Appl. No.: 11/398137
Filed: April 4, 2006

Current U.S. Class: 62/3.1
Current CPC Class: Y02B 30/00 20130101; F25B 2321/0021 20130101; Y02B 30/66 20130101; F25B 21/00 20130101
Class at Publication: 062/003.1
International Class: F25B 21/00 20060101 F25B021/00

Foreign Application Data

Date Code Application Number
Sep 23, 2005 CN 200510037495.6

Claims



1. A liquid cooling system comprising: a heat-absorbing unit; a heat-dissipating unit; at least one pipe interconnecting the heat-absorbing unit and the heat-dissipating unit, thereby the heat-absorbing unit, the heat-dissipating unit and the pipe cooperatively forming a circulatory channel; a coolant received in the circulatory channel, the coolant comprising a liquid and a plurality of magnetic particles dispersed in the liquid; and a magnetic field generator for generating a magnetic field where at least one of the heat-absorbing unit and the heat-dissipating unit is located.

2. The liquid cooling system as claimed in claim 1, wherein the magnetic field generator is configured for providing a variable magnetic field.

3. The liquid cooling system as claimed in claim 1, wherein the magnetic field generator is selected from the group consisting of a permanent magnet and an electromagnet.

4. The liquid cooling system as claimed in claim 1, wherein the magnetic field generator is arranged at opposite sides of the heat-absorbing unit.

5. The liquid cooling system as claimed in claim 1, wherein the magnetic field generator is arranged at opposite sides of the heat-dissipating unit.

6. The liquid cooling system as claimed in claim 1, wherein the circulatory channel has a channel segment spatially corresponding to the heat-absorbing unit, the channel segment has a concertinaed configuration.

7. The liquid cooling system as claimed in claim 1, wherein the heat-dissipating unit is a heat exchanger.

8. The liquid cooling system as claimed in claim 1, wherein the liquid is selected from the group consisting of water, alcohol, ketone, and any combination thereof.

9. The liquid cooling system as claimed in claim 1, wherein the magnetic particles are comprised of a material selected from the group consisting of iron, cobalt, nickel, and any combination alloy thereof.

10. The liquid cooling system as claimed in claim 1, wherein the magnetic particles are nano-sized particles.

11. The liquid cooling system as claimed in claim 9, wherein a diameter of each nano-sized particle is in the range from 1 to 100 nanometers.

12. The liquid cooling system as claimed in claim 1, wherein the magnetic particles constitute a percentage of the mass of the total coolant in the range from 0.1 percent to 3 percent.

13. The liquid cooling system as claimed in claim 1, wherein the coolant further comprises a plurality of thermally conductive particles.

14. The liquid cooling system as claimed in claim 13, wherein the thermally conductive particles are comprised of a material selected from the group consisting of copper, aluminum, gold, silver, zinc oxide, copper oxide, aluminum oxide, aluminum nitride, boron nitride, and any combination thereof.

15. The liquid cooling system as claimed in claim 13, wherein the thermally conductive particles are nano-sized particles.

16. The liquid cooling system as claimed in claim 14, wherein the coolant further comprises a dispersant for preventing aggregation of the thermally conductive particles and the magnetic particles.
Description



1. TECHNICAL FIELD

[0001] The present invention relates generally to heat dissipating devices, and more particularly to a liquid cooling system.

2. BACKGROUND

[0002] Electronic components such as semiconductor chips are becoming progressively smaller, while at the same time heat dissipation requirements thereof are increasing. For most contemporary applications, a liquid cooling system is the most efficient system which can be used to dissipate heat.

[0003] A conventional liquid cooling system generally includes a heat-absorbing unit, a heat-dissipating unit, at least one pipe and coolant circulating between the heat-absorbing unit, the heat-dissipating unit and the pipes. In order to ensure the effective operation of the liquid cooling system, the coolant of liquid cooling system must have high thermal conductivity. Using coolants with high thermal conductivity, the liquid cooling system can decrease the thermal resistance between the coolant and the heat-absorbing unit and also the thermal resistance between the coolant and the heat-dissipating unit.

[0004] Conventional liquid cooling systems generally adopt pure liquids to act as the coolants. However, for many applications, the thermal conductivity of these coolants are too low and the rate of heat transfer is too slow, and thus the operating efficiency of the liquid cooling system is unsatisfactory.

[0005] What is needed, therefore, is a liquid cooling system with better operating efficiency.

SUMMARY

[0006] In accordance with an embodiment, a liquid cooling system includes a heat-absorbing unit, a heat-dissipating unit, at least one pipe, a coolant and a magnetic field generator for generating a magnetic field. The pipe interconnects the heat-absorbing unit and the heat-dissipating unit, thereby the heat-absorbing unit, the heat-dissipating unit and the pipe cooperatively form a circulatory channel. The coolant is received in the circulatory channel, the coolant comprises a liquid and a plurality of magnetic particles dispersed in the liquid. The coolant includes a liquid and a plurality of magnetic particles dispersed in the liquid. At least one of the heat-absorbing unit and the heat-dissipating unit is located in the magnetic field.

[0007] Other advantages and novel features will become more apparent from the following detailed description of present liquid cooling system, when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Many aspects of the present liquid cooling system can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present liquid cooling system. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0009] FIG. 1 is a schematic, plan view of a liquid cooling system according to a first embodiment;

[0010] FIG. 2 is a schematic, isometric view of the heat-absorbing unit of FIG. 1; and

[0011] FIG. 3 is a schematic, plan view of a liquid cooling system according to a second embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0012] Embodiments of the present liquid cooling system will now be described in detail below and with reference to the drawings.

[0013] Referring to FIG. 1, a liquid cooling system 10 according to a first embodiment includes a heat-absorbing unit 20, a heat-dissipating unit 30, at least one pipe 40 interconnecting the heat-absorbing unit 20 to the heat-dissipating unit 30, and a coolant 50. The heat-absorbing unit 20, the heat-dissipating unit 30 and the pipe 40 cooperatively form a circulatory channel. The coolant 50 is received in the circulatory channel.

[0014] The coolant 50 is generally a suspension, and includes a liquid and a plurality of magnetic particles dispersed in the liquid. The liquid can be selected from the group consisting of water, alcohol, ketone, and any combination thereof. The magnetic particles are comprised of a material selected from the group consisting of iron, cobalt, nickel, and any combination alloy thereof. Preferably, the magnetic particles are nano-sized particles. A diameter of each nano-sized particle is in the range from 1 to 100 nanometers. A percent by mass of the magnetic particles to the coolant is in the range from 0.1 percent to 3 percent.

[0015] The coolant 50 further includes a plurality of thermally conductive particles. The thermally conductive particles are comprised of a material selected from the group consisting of copper, aluminum, gold, silver, zinc oxide, copper oxide, aluminum oxide, aluminum nitride, boron nitride, and any combination thereof. Preferably, the thermally conductive particles are nano-sized particles. The coolant 50 further includes a dispersant for preventing aggregation of the thermally conductive particles and the magnetic particles.

[0016] The heat-absorbing unit 20 is thermally coupled to a heat-generating component 60. In operation, the heat-generating component 60 generates heat. The coolant 50 flows through the pipe 40 to cool the heat-absorbing unit 20 and then discharges heat in the heat-dissipating unit 30, and the cycle repeats. The heat-generating component 60 can be an electronic component such as a CPU (central processing unit) or an IC (integrated chip) package. The heat-dissipating unit 30 can be a heat exchanger.

[0017] Referring to FIG. 2, the heat-absorbing unit 20 includes an inlet 21, an outlet 22. The circulatory channel has a channel segment 23 spatially corresponding to the heat-absorbing unit 20. The channel segment 23 has a concertinaed configuration. A pair of electromagnets 24, 24' are respectively secured to two outward facing surfaces 25, 25' of the heat-absorbing unit 20. The electromagnets 24, 24' are each coupled to an electrical power source. A cavity can be defined in the heat-absorbing unit 20 instead of the channel segment 23 to perform a similar function. Preferably, the channel segment 23 is defined in the heat-absorbing unit 20. Using the channel segment 23, heat-exchanger area between the heat-absorbing unit 20 and coolant 50 can be increased. Accordingly, the efficiency of the liquid cooling system 10 can be increased.

[0018] The electromagnets 24, 24' can provide a magnetic field surrounding the heat-absorbing unit 20. The magnetic particles of the coolant 50 in the heat-absorbing unit 20 are moved along the direction of the magnetic field by a magnetic force. The movement of the magnetic particles also causes the coolant 50 to move. Thereby, the coolant 50 flows turbulently and thus improves conductivity in the coolant 50 by improving the probability of collision between the molecules. The thermal conductivity of the coolant 50 is thus improved and the thermal resistance between the coolant 50 and the heat-absorbing unit 20 is thus decreased. Accordingly, the efficiency of the liquid cooling system 10 is increased.

[0019] The electromagnets 24, 24' are configured for generating a magnetic field, they also can be arranged at opposite sides of the heat-dissipating unit 30. The electromagnets 24, 24' can be replaced by other magnetic field generator, such as a permanent magnet or a device which can generate a varying electrical field. The number of the magnetic field generators can be one or more. The position of the electromagnets 24, 24' is not limited, they only need to generate a magnetic field surrounding the heat-absorbing unit 20. Preferably, the magnetic field generator is configured for providing a variable magnetic field.

[0020] Referring to FIG. 3, a liquid cooling system 100 according to a second embodiment includes a heat-absorbing unit 200, a heat-dissipating unit 300, at least one pipe 400 interconnecting the heat-absorbing unit 200 to the heat-dissipating unit 300, and a coolant 500. The heat-absorbing unit 200, the heat-dissipating unit 300 and the pipe 400 cooperatively form a circulatory channel. The coolant 500 is received in the circulatory channel.

[0021] The liquid cooling system 100 is similar to the liquid cooling system 10. The difference is that two electromagnets 310, 310' are secured to two opposite surfaces 320, 320' of the heat-dissipating unit 300 respectively instead of the electromagnets 24, 24' as in the first embodiment.

[0022] The electromagnets 310, 310' can provide a magnetic field surrounding the heat-dissipating unit 300. The magnetic particles of the coolant 500 in the heat-dissipating unit 300 are moved along the direction of the magnetic field by magnetic force. The liquid molecules contiguous with the magnetic particles move together with the magnetic particles, thus setting up a flow cycle. The coolant 500 flows turbulently, thus improving the probability of collision between molecules. The thermal conductivity of the coolant 500 can be improved and the thermal resistance between the coolant 500 and the heat-absorbing unit 200 can be decreased. Accordingly, the efficiency of the liquid cooling system 100 can be increased.

[0023] In another embodiment, the heat-absorbing unit and the heat dissipating unit can be disposed in the magnetic fields and such configuration should be considered to be within the scope of the present invention.

[0024] It is understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments and methods without departing from the spirit of the invention. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.

* * * * *


uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed