U.S. patent application number 11/464636 was filed with the patent office on 2007-03-15 for apparatus for and method of processing substrate subjected to exposure process.
Invention is credited to Tetsuya HAMADA.
Application Number | 20070058147 11/464636 |
Document ID | / |
Family ID | 37854709 |
Filed Date | 2007-03-15 |
United States Patent
Application |
20070058147 |
Kind Code |
A1 |
HAMADA; Tetsuya |
March 15, 2007 |
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE SUBJECTED TO
EXPOSURE PROCESS
Abstract
A substrate subjected to an exposure process by an exposure unit
is transported into a cleaning processing unit in a substrate
processing apparatus. An adjustment is made to the presence time
(more specifically, the waiting time or the cleaning time) of the
exposed substrate in the cleaning processing unit to adjust the
instant of the end of a cleaning process so as to provide a
constant time interval between the instant of the completion of the
exposure process and the instant of the end of the cleaning
process. Such adjustments provide a constant time interval between
the instant of the completion of the exposure process and the
instant of the start of a post-exposure bake process, and also
provide a constant time interval between the, instant of the
completion of the cleaning process and the instant of the start of
the post-exposure bake process. This achieves further improvements
in the line width uniformity of a pattern formed when a chemically
amplified resist is used.
Inventors: |
HAMADA; Tetsuya; (Kyoto,
JP) |
Correspondence
Address: |
OSTROLENK FABER GERB & SOFFEN
1180 AVENUE OF THE AMERICAS
NEW YORK
NY
100368403
US
|
Family ID: |
37854709 |
Appl. No.: |
11/464636 |
Filed: |
August 15, 2006 |
Current U.S.
Class: |
355/53 ;
430/30 |
Current CPC
Class: |
G03F 7/38 20130101; G03F
7/70991 20130101 |
Class at
Publication: |
355/053 ;
430/030 |
International
Class: |
G03B 27/42 20060101
G03B027/42; G03C 5/00 20060101 G03C005/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 14, 2005 |
JP |
JP2005-266888 |
Claims
1. A substrate processing apparatus disposed adjacent to an
exposure apparatus, said substrate processing apparatus comprising:
a cleaning processing part for performing at least a cleaning
process on a substrate subjected to an exposure process by said
exposure apparatus; a heating processing part for performing a
heating process on a substrate subjected to said cleaning process;
a transport mechanism for receiving a substrate from said exposure
apparatus to transport the substrate through said cleaning
processing part to said heating processing part; and a controller
for providing an approximately constant first interprocess time
interval between the instant at which said exposure apparatus
completes the exposure process of a substrate and the instant at
which said heating processing part starts the heating process of
the substrate, and for providing an approximately constant second
interprocess time interval between the instant at which said
cleaning processing part completes the cleaning process of the
substrate and the instant at which said heating processing part
starts the heating process of the substrate.
2. The substrate processing apparatus according to claim 1, wherein
said controller adjusts the instant at which said cleaning
processing part completes the cleaning process to thereby provide
the approximately constant first interprocess time interval and the
approximately constant second interprocess time interval.
3. The substrate processing apparatus according to claim 2, wherein
said controller adjusts a presence time for which the substrate
subjected to the exposure process is present in the cleaning
processing part to thereby adjust said instant at which said
cleaning processing part completes the cleaning process.
4. The substrate processing apparatus according to claim 3, wherein
said controller adjusts a waiting time for which the substrate
subjected to the exposure process and transported to said cleaning
processing part waits until said cleaning process to thereby adjust
said presence time.
5. The substrate processing apparatus according to claim 3, wherein
said controller adjusts a cleaning processing time for which the
substrate subjected to the exposure process is subjected to the
cleaning process by said cleaning processing part to thereby adjust
said presence time.
6. The substrate processing apparatus according to claim 1, wherein
said exposure apparatus performs an immersion exposure process on a
substrate.
7. A method of processing a substrate subjected to an exposure
process, said method comprising the steps of: transporting a
substrate subjected to the exposure process to a cleaning
processing part; performing a cleaning process in said cleaning
processing part on said substrate subjected to the exposure
process; transporting said substrate subjected to the cleaning
process from said cleaning processing part to a heating processing
part; and performing a heating process in said heating processing
part on said substrate subjected to the cleaning process, wherein a
first interprocess time interval between the instant at which the
exposure process of a substrate is completed and the instant at
which the heating process of the substrate is started is made
approximately constant, and a second interprocess time interval
between the instant at which the cleaning process of the substrate
is completed and the instant at which the heating process of the
substrate is started is made approximately constant.
8. The method according to claim 7, wherein said first interprocess
time interval and said second interprocess time interval are made
approximately constant by adjusting the instant at which said
cleaning processing part completes the cleaning process.
9. The method according to claim 8, wherein said instant at which
said cleaning processing part completes the cleaning process is
adjusted by adjusting a presence time for which the substrate
subjected to the exposure process is present in said cleaning
processing part.
10. The method according to claim 9, wherein said presence time is
adjusted by adjusting a waiting time for which the substrate
subjected to the exposure process and transported to said cleaning
processing part waits until said cleaning process.
11. The method according to claim 9, wherein said presence time is
adjusted by adjusting a cleaning processing time for which the
substrate subjected to the exposure process is subjected to the
cleaning process by said cleaning processing part.
12. The method according to claim 7, wherein said exposure process
is an immersion exposure process.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a method of processing a
substrate such as a semiconductor substrate subjected to an
exposure process, a glass substrate for a liquid crystal display
device, a glass substrate for a photomask, a substrate for an
optical disk and the like, and a substrate processing apparatus for
executing the method.
[0003] 2. Description of the Background Art
[0004] As is well known, semiconductor and liquid crystal display
products and the like are fabricated by performing a series of
processes including cleaning, resist coating, exposure,
development, etching, interlayer insulation film formation, heat
treatment, dicing and the like on the above-mentioned substrate. An
apparatus which performs a resist coating process on a substrate to
transfer the substrate to an exposure unit and which receives an
exposed substrate from the exposure unit to perform a development
process on the exposed substrate, among the above-mentioned
processes, is widely used as a so-called coater-and-developer.
[0005] The exposure unit (also known as a stepper) for performing
an exposure process is typically connected to and provided in
juxtaposition with the above-mentioned coater-and-developer, and
prints a circuit pattern on a substrate formed with a resist film.
With recent decrease in width of lines exposed to light, a lamp for
use in printing of a pattern in such an exposure unit is shifting
from a conventional ultraviolet light source toward a KrF excimer
laser light source and also toward an ArF excimer laser light
source. A chemically amplified resist is used when a pattern is
printed using a KrF light source and an ArF light source. The
chemically amplified resist is a photoresist of the type such that
an acid formed by a photochemical reaction during the exposure
process acts as a catalyst for resist reactions such as
crosslinking, polymerization and the like in the subsequent heat
treatment step to change the solubility of the resist in a
developing solution, whereby pattern printing is completed.
[0006] When the chemically amplified resist is used, a slight
variation in processing conditions exerts a large influence upon
line width uniformity because an extremely small amount of acid
catalyst is formed during the exposure process. In particular, it
is known that the time interval between the instant of the end of
the exposure process and the instant of the start of a
post-exposure bake process exerts the greatest influence on the
line width uniformity. Thus, a technique for controlling the time
interval between the end of the exposure process and the start of
the post-exposure bake process to be constant is proposed, for
example, in Japanese Patent Application Laid-Open No. 2002-43208
and Japanese Patent Application Laid-Open No. 2004-342654. Such a
technique can improve the line width uniformity when the chemically
amplified resist is used.
[0007] Unfortunately, some variations in line width still occur
even if the time interval between the end of the exposure process
and the start of the post-exposure bake process is made constant.
In particular, a substrate subjected to an immersion exposure
process is subjected to a deionized water cleaning process in the
coater-and-developer. In such a case, it is contemplated that the
time interval between the instant at which the deionized water
cleaning process is completed and the instant at which the
post-exposure bake process is executed is also important. However,
no particular consideration has conventionally been given to
controlling this time interval.
SUMMARY OF THE INVENTION
[0008] The present invention is intended for a substrate processing
apparatus disposed adjacent to an exposure apparatus.
[0009] According to the present invention, the substrate processing
apparatus comprises: a cleaning processing part for performing at
least a cleaning process on a substrate subjected to an exposure
process by the exposure apparatus; a heating processing part for
performing a heating process on a substrate subjected to the
cleaning process; a transport mechanism for receiving a substrate
from the exposure apparatus to transport the substrate through the
cleaning processing part to the heating processing part; and a
controller for providing an approximately constant first
interprocess time interval between the instant at which the
exposure apparatus completes the exposure process of a substrate
and the instant at which the heating processing part starts the
heating process of the substrate, and for providing an
approximately constant second interprocess time interval between
the instant at which the cleaning processing part completes the
cleaning process of the substrate and the instant at which the
heating processing part starts the heating process of the
substrate.
[0010] This provides a uniform processing history for the
substrates, thereby further improving the line width uniformity of
a pattern.
[0011] Preferably, the controller adjusts the instant at which the
cleaning processing part completes the cleaning process to thereby
provide the approximately constant first interprocess time interval
and the approximately constant second interprocess time
interval.
[0012] This provides a uniform processing history for the
substrates easily with reliability.
[0013] The present invention is also intended for a method of
processing a substrate subjected to an exposure process.
[0014] It is therefore an object of the present invention to
provide an apparatus for and a method of processing a substrate
which are capable of further improving the line width uniformity of
a pattern.
[0015] These and other objects, features, aspects and advantages of
the present invention will become more apparent from the following
detailed description of the present invention when taken in
conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is a plan view of a substrate processing apparatus
according to the present invention;
[0017] FIG. 2 is a front view of a liquid processing part;
[0018] FIG. 3 is a front view of a thermal processing part;
[0019] FIG. 4 is a view showing a construction around substrate
rest parts;
[0020] FIG. 5A is a plan view of a transport robot;
[0021] FIG. 5B is a front view of the transport robot;
[0022] FIG. 6 is a view for illustrating a construction of a
cleaning processing unit;
[0023] FIG. 7A is a side sectional view of a heating part with a
temporary substrate rest part;
[0024] FIG. 7B is a plan view of the heating part with the
temporary substrate rest part;
[0025] FIG. 8 is a side view of an interface block;
[0026] FIG. 9 is a block diagram schematically showing a control
mechanism;
[0027] FIG. 10 is a flow chart showing a processing procedure from
the end of exposure in an exposure unit to the start of a
post-exposure bake process in a heating part; and
[0028] FIG. 11 is a timing chart for processing from the end of the
exposure to the post-exposure bake process.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0029] A preferred embodiment according to the present invention
will now be described in detail with reference to the drawings.
[0030] FIG. 1 is a plan view of a substrate processing apparatus
according to the present invention. FIG. 2 is a front view of a
liquid processing part in the substrate processing apparatus. FIG.
3 is a front view of a thermal processing part in the substrate
processing apparatus. FIG. 4 is a view showing a construction
around substrate rest parts. An XYZ rectangular coordinate system
in which an XY plane is defined as the horizontal plane and a Z
axis is defined to extend in the vertical direction is additionally
shown in FIG. 1 and the subsequent figures for purposes of
clarifying the directional relationship therebetween.
[0031] The substrate processing apparatus according to the
preferred embodiment is an apparatus (a so-called
coater-and-developer) for forming an anti-reflective film and a
photoresist film on substrates such as semiconductor wafers by
coating and for performing a development process on substrates
subjected to a pattern exposure process. The substrates to be
processed by the substrate processing apparatus according to the
present invention are not limited to semiconductor wafers, but may
include glass substrates for a liquid crystal display device, and
the like.
[0032] The substrate processing apparatus according to the
preferred embodiment includes an indexer block 1, a BARC (Bottom
Anti-Reflective Coating) block 2, a resist coating block 3, a
development processing block 4, and an interface block 5. In the
substrate processing apparatus, the five processing blocks 1 to 5
are arranged in side-by-side relation. An exposure unit (or
stepper) EXP which is an external apparatus separate from the
substrate processing apparatus according to the present invention
is provided and connected to the interface block 5. That is, the
substrate processing apparatus according to the preferred
embodiment is disposed adjacent to the exposure unit EXP. The
substrate processing apparatus according to the preferred
embodiment and the exposure unit EXP are connected via LAN lines
(not shown) to a host computer 100.
[0033] The indexer block 1 is a processing block for transferring
unprocessed substrates received from the outside of the substrate
processing apparatus outwardly to the BARC block 2 and the resist
coating block 3, and for transporting processed substrates received
from the development processing block 4 to the outside of the
substrate processing apparatus. The indexer block 1 includes a
table 11 for placing thereon a plurality of (in this preferred
embodiment, four) cassettes (or carriers) C in juxtaposition, and a
substrate transfer mechanism 12 for taking an unprocessed substrate
W out of each of the cassettes C and for storing a processed
substrate W into each of the cassettes C. The substrate transfer
mechanism 12 includes a movable base 12a movable horizontally (in
the Y direction) along the table 11, and a holding arm 12b mounted
on the movable base 12a and for holding a substrate W in a
horizontal position. The holding arm 12b is capable of moving
upwardly and downwardly (in the Z direction) over the movable base
12a, pivoting within a horizontal plane and moving back and forth
in the direction of the pivot radius. Thus, the substrate transfer
mechanism 12 can cause the holding arm 12b to gain access to each
of the cassettes C, thereby taking an unprocessed substrate W out
of each cassette C and storing a processed substrate W into each
cassette C. The cassettes C may be of the following types: an SMIF
(standard mechanical interface) pod, and an OC (open cassette)
which exposes stored substrates W to the atmosphere, in addition to
a FOUP (front opening unified pod) which stores substrates W in an
enclosed or sealed space.
[0034] The BARC block 2 is provided in adjacent relation to the
indexer block 1. A partition 13 for closing off the communication
of atmosphere is provided between the indexer block 1 and the BARC
block 2. The partition 13 is provided with a pair of vertically
arranged substrate rest parts PASS1 and PASS2 each for placing a
substrate W thereon for the transfer of the substrate W between the
indexer block 1 and the BARC block 2.
[0035] The upper substrate rest part PASS1 is used for the
transport of a substrate W from the indexer block 1 to the BARC
block 2. The substrate rest part PASS1 includes three support pins.
The substrate transfer mechanism 12 of the indexer block 1 places
an unprocessed substrate W taken out of one of the cassettes C onto
the three support pins of the substrate rest part PASS1. A
transport robot TR1 of the BARC block 2 to be described later
receives the substrate W placed on the substrate rest part PASS1.
The lower substrate rest part PASS2, on the other hand, is used for
the transport of a substrate W from the BARC block 2 to the indexer
block 1. The substrate rest part PASS2 also includes three support
pins. The transport robot TR1 of the BARC block 2 places a
processed substrate W onto the three support pins of the substrate
rest part PASS2. The substrate transfer mechanism 12 receives the
substrate W placed on the substrate rest part PASS2 and stores the
substrate W into one of the cassettes C. Pairs of substrate rest
parts PASS3 to PASS10 to be described later are similar in
construction to the pair of substrate rest parts PASS1 and
PASS2.
[0036] The substrate rest parts PASS1 and PASS2 extend through the
partition 13. Each of the substrate rest parts PASS1 and PASS2
includes an optical sensor (not shown) for detecting the presence
or absence of a substrate W thereon. Based on a detection signal
from each of the sensors, a judgment is made as to whether or not
the substrate transfer mechanism 12 and the transport robot TR1 of
the BARC block 2 stand ready to transfer and receive a substrate W
to and from the substrate rest parts PASS1 and PASS2.
[0037] Next, the BARC block 2 will be described. The BARC block 2
is a processing block for forming an anti-reflective film by
coating at the bottom of a photoresist film (i.e., as an
undercoating film for the photoresist film) to reduce standing
waves or halation occurring during exposure. The BARC block 2
includes a bottom coating processor BRC for coating the surface of
a substrate W with the anti-reflective film, a pair of thermal
processing towers 21 for performing a thermal process which
accompanies the formation of the anti-reflective film by coating,
and the transport robot TR1 for transferring and receiving a
substrate W to and from the bottom coating processor BRC and the
pair of thermal processing towers 21.
[0038] In the BARC block 2, the bottom coating processor BRC and
the pair of thermal processing towers 21 are arranged on opposite
sides of the transport robot TR1. Specifically, the bottom coating
processor BRC is on the front side of the substrate processing
apparatus, and the pair of thermal processing towers 21 are on the
rear side thereof. Additionally, a thermal barrier not shown is
provided on the front side of the pair of thermal processing towers
21. Thus, the thermal effect of the pair of thermal processing
towers 21 upon the bottom coating processor BRC is avoided by
spacing the bottom coating processor BRC apart from the pair of
thermal processing towers 21 and by providing the thermal
barrier.
[0039] As shown in FIG. 2, the bottom coating processor BRC
includes three coating processing units BRC1, BRC2 and BRC3 similar
in construction to each other and arranged in stacked relation in
bottom-to-top order. The three coating processing units BRC1, BRC2
and BRC3 are collectively referred to as the bottom coating
processor BRC, unless otherwise identified. Each of the coating
processing units BRC1, BRC2 and BRC3 includes a spin chuck 22 for
rotating a substrate W in a substantially horizontal plane while
holding the substrate W in a substantially horizontal position
under suction, a coating nozzle 23 for applying a coating solution
for the anti-reflective film onto the substrate W held on the spin
chuck 22, a spin motor (not shown) for rotatably driving the spin
chuck 22, a cup (not shown) surrounding the substrate W held on the
spin chuck 22, and the like.
[0040] As shown in FIG. 3, one of the thermal processing towers 21
which is closer to the indexer block 1 includes six hot plates HP1
to HP6 for heating a substrate W up to a predetermined temperature,
and cool plates CP1 to CP3 for cooling a heated substrate W down to
a predetermined temperature and maintaining the substrate W at the
predetermined temperature. The cool plates CP1 to CP3 and the hot
plates HP1 to HP6 are arranged in stacked relation in bottom-to-top
order in this thermal processing tower 21. The other of the thermal
processing towers 21 which is farther from the indexer block 1
includes three adhesion promotion processing parts AHL1 to AHL3
arranged in stacked relation in bottom-to-top order for thermally
processing a substrate W in a vapor atmosphere of HMDS (hexamethyl
disilazane) to promote the adhesion of the resist film to the
substrate W. The locations indicated by the cross marks (x) in FIG.
3 are occupied by a piping and wiring section or reserved as empty
space for future addition of processing units.
[0041] Thus, stacking the coating processing units BRC1 to BRC3 and
the thermal processing units (the hot plates HP1 to HP6, the cool
plates CP1 to CP3, and the adhesion promotion processing parts AHL1
to AHL3 in the BARC block 2) in tiers provides smaller space
occupied by the substrate processing apparatus to reduce the
footprint thereof. The side-by-side arrangement of the pair of
thermal processing towers 21 is advantageous in facilitating the
maintenance of the thermal processing units and in eliminating the
need for extension of ducting and power supply equipment necessary
for the thermal processing units to a much higher position.
[0042] FIGS. 5A and 5B are views for illustrating the transport
robot TR1 provided in the BARC block 2. FIG. 5A is a plan view of
the transport robot TR1, and FIG. 5B is a front view of the
transport robot TR1. The transport robot TR1 includes a pair of
(upper and lower) holding arms 6a and 6b in proximity to each other
for holding a substrate W in a substantially horizontal position.
Each of the holding arms 6a and 6b includes a distal end portion of
a substantially C-shaped plan configuration, and a plurality of
pins 7 projecting inwardly from the inside of the substantially
C-shaped distal end portion for supporting the peripheral edge of a
substrate W from below.
[0043] The transport robot TR1 further includes a base 8 fixedly
mounted on an apparatus base (or an apparatus frame). A guide shaft
9c is mounted upright on the base 8, and a threaded shaft 9a is
rotatably mounted and supported upright on the base 8. A motor 9b
for rotatably driving the threaded shaft 9a is fixedly mounted to
the base 8. A lift 10a is in threaded engagement with the threaded
shaft 9a, and is freely slidable relative to the guide shaft 9c.
With such an arrangement, the motor 9b rotatably drives the
threaded shaft 9a, whereby the lift 10a is guided by the guide
shaft 9c to move up and down in a vertical direction (in the Z
direction).
[0044] An arm base 10b is mounted on the lift 10a pivotably about a
vertical axis. The lift 10a contains a motor 10c for pivotably
driving the arm base 10b. The pair of (upper and lower) holding
arms 6a and 6b described above are provided on the arm base 10b.
Each of the holding arms 6a and 6b is independently movable back
and forth in a horizontal direction (in the direction of the pivot
radius of the arm base 10b) by a sliding drive mechanism (not
shown) mounted to the arm base 10b.
[0045] With such an arrangement, the transport robot TR1 is capable
of causing each of the pair of holding arms 6a and 6b to
independently gain access to the substrate rest parts PASS1 and
PASS2, the thermal processing units provided in the thermal
processing towers 21, the coating processing units provided in the
bottom coating processor BRC, and the substrate rest parts PASS3
and PASS4 to be described later, thereby transferring and receiving
substrates W to and from the above-mentioned parts and units, as
shown in FIG. 5A.
[0046] Next, the resist coating block 3 will be described. The
resist coating block 3 is provided so as to be sandwiched between
the BARC block 2 and the development processing block 4. A
partition 25 for closing off the communication of atmosphere is
also provided between the resist coating block 3 and the BARC block
2. The partition 25 is provided with the pair of vertically
arranged substrate rest parts PASS3 and PASS4 each for placing a
substrate W thereon for the transfer of the substrate W between the
BARC block 2 and the resist coating block 3. The substrate rest
parts PASS3 and PASS4 are similar in construction to the
above-mentioned substrate rest parts PASS1 and PASS2.
[0047] The upper substrate rest part PASS3 is used for the
transport of a substrate W from the BARC block 2 to the resist
coating block 3. Specifically, a transport robot TR2 of the resist
coating block 3 receives the substrate W placed on the substrate
rest part PASS3 by the transport robot TR1 of the BARC block 2. The
lower substrate rest part PASS4, on the other hand, is used for the
transport of a substrate W from the resist coating block 3 to the
BARC block 2. Specifically, the transport robot TR1 of the BARC
block 2 receives the substrate W placed on the substrate rest part
PASS4 by the transport robot TR2 of the resist coating block 3.
[0048] The substrate rest parts PASS3 and PASS4 extend through the
partition 25. Each of the substrate rest parts PASS3 and PASS4
includes an optical sensor (not shown) for detecting the presence
or absence of a substrate W thereon. Based on a detection signal
from each of the sensors, a judgment is made as to whether or not
the transport robots TR1 and TR2 stand ready to transfer and
receive a substrate W to and from the substrate rest parts PASS3
and PASS4. A pair of (upper and lower) cool plates WCP of a
water-cooled type for roughly cooling a substrate W are provided
under the substrate rest parts PASS3 and PASS4, and extend through
the partition 25 (See FIG. 4).
[0049] The resist coating block 3 is a processing block for
applying a resist onto a substrate W coated with the
anti-reflective film by the BARC block 2 to form a resist film. In
this preferred embodiment, a chemically amplified resist is used as
the photoresist. The resist coating block 3 includes a resist
coating processor SC for forming the resist film by coating on the
anti-reflective film serving as the undercoating film, a pair of
thermal processing towers 31 for performing a thermal process which
accompanies the resist coating process, and the transport robot TR2
for transferring and receiving a substrate W to and from the resist
coating processor SC and the pair of thermal processing towers
31.
[0050] In the resist coating block 3, the resist coating processor
SC and the pair of thermal processing towers 31 are arranged on
opposite sides of the transport robot TR2. Specifically, the resist
coating processor SC is on the front side of the substrate
processing apparatus, and the pair of thermal processing towers 31
are on the rear side thereof. Additionally, a thermal barrier not
shown is provided on the front side of the pair of thermal
processing towers 31. Thus, the thermal effect of the pair of
thermal processing towers 31 upon the resist coating processor SC
is avoided by spacing the resist coating processor SC apart from
the pair of thermal processing towers 31 and by providing the
thermal barrier.
[0051] As shown in FIG. 2, the resist coating processor SC includes
three coating processing units SC1, SC2 and SC3 similar in
construction to each other and arranged in stacked relation in
bottom-to-top order. The three coating processing units SC1, SC2
and SC3 are collectively referred to as the resist coating
processor SC, unless otherwise identified. Each of the coating
processing units SC1, SC2 and SC3 includes a spin chuck 32 for
rotating a substrate W in a substantially horizontal plane while
holding the substrate W in a substantially horizontal position
under suction, a coating nozzle 33 for applying a resist solution
onto the substrate W held on the spin chuck 32, a spin motor (not
shown) for rotatably driving the spin chuck 32, a cup (not shown)
surrounding the substrate W held on the spin chuck 32, and the
like.
[0052] As shown in FIG. 3, one of the thermal processing towers 31
which is closer to the indexer block 1 includes six heating parts
PHP1 to PHP6 arranged in stacked relation in bottom-to-top order
for heating a substrate W up to a predetermined temperature. The
other of the thermal processing towers 31 which is farther from the
indexer block 1 includes cool plates CP4 to CP9 arranged in stacked
relation in bottom-to-top order for cooling a heated substrate W
down to a predetermined temperature and maintaining the substrate W
at the predetermined temperature.
[0053] Each of the heating parts PHP1 to PHP6 is a thermal
processing unit including, in addition to an ordinary hot plate for
heating a substrate W placed thereon, a temporary substrate rest
part for placing a substrate W in an upper position spaced apart
from the hot plate, and a local transport mechanism 34 (See FIG. 1)
for transporting a substrate W between the hot plate and the
temporary substrate rest part. The local transport mechanism 34 is
capable of moving up and down and moving back and forth, and
includes a mechanism for cooling down a substrate W being
transported by circulating cooling water therein.
[0054] The local transport mechanism 34 is provided on the opposite
side of the above-mentioned hot plate and the temporary substrate
rest part from the transport robot TR2, that is, on the rear side
of the substrate processing apparatus. The temporary substrate rest
part has both an open side facing the transport robot TR2 and an
open side facing the local transport mechanism 34. The hot plate,
on the other hand, has only an open side facing the local transport
mechanism 34, and a closed side facing the transport robot TR2.
Thus, both of the transport robot TR2 and the local transport
mechanism 34 can gain access to the temporary substrate rest part,
but only the local transport mechanism 34 can gain access to the
hot plate. The heating parts PHP1 to PHP6 are generally similar in
construction (FIGS. 7A and 7B) to heating parts PHP7 to PHP12 in
the development processing block 4 to be described later.
[0055] A substrate W is transported into each of the
above-mentioned heating parts PHP1 to PHP6 having such a
construction in a manner to be described below. First, the
transport robot TR2 places a substrate W onto the temporary
substrate rest part. Subsequently, the local transport mechanism 34
receives the substrate W from the temporary substrate rest part to
transport the substrate W to the hot plate. The hot plate performs
a heating process on the substrate W. The local transport mechanism
34 takes out the substrate W subjected to the heating process by
the hot plate, and transports the substrate W to the temporary
substrate rest part. During the transport, the substrate W is
cooled down by the cooling function of the local transport
mechanism 34. Thereafter, the transport robot TR2 takes out the
substrate W subjected to the heating process and transported to the
temporary substrate rest part.
[0056] In this manner, the transport robot TR2 transfers and
receives the substrate W to and from only the temporary substrate
rest part held at room temperature in each of the heating parts
PHP1 to PHP6, but does not transfer and receive the substrate W
directly to and from the hot plate. This avoids the temperature
rise of the transport robot TR2. The hot plate having only the open
side facing the local transport mechanism 34 prevents the heat
atmosphere leaking out of the hot plate from affecting the
transport robot TR2 and the resist coating processor SC. The
transport robot TR2 transfers and receives a substrate W directly
to and from the cool plates CP4 to CP9.
[0057] The transport robot TR2 is precisely identical in
construction with the transport robot TR1. Thus, the transport
robot TR2 is capable of causing each of a pair of holding arms
thereof to independently gain access to the substrate rest parts
PASS3 and PASS4, the thermal processing units provided in the
thermal processing towers 31, the coating processing units provided
in the resist coating processor SC, and the substrate rest parts
PASS5 and PASS6 to be described later, thereby transferring and
receiving substrates W to and from the above-mentioned parts and
units.
[0058] Next, the development processing block 4 will be described.
The development processing block 4 is provided so as to be
sandwiched between the resist coating block 3 and the interface
block 5. A partition 35 for closing off the communication of
atmosphere is also provided between the resist coating block 3 and
the development processing block 4. The partition 35 is provided
with the pair of vertically arranged substrate rest parts PASS5 and
PASS6 each for placing a substrate W thereon for the transfer of
the substrate W between the resist coating block 3 and the
development processing block 4. The substrate rest parts PASS5 and
PASS6 are similar in construction to the above-mentioned substrate
rest parts PASS1 and PASS2.
[0059] The upper substrate rest part PASS5 is used for the
transport of a substrate W from the resist coating block 3 to the
development processing block 4. Specifically, a transport robot TR3
of the development processing block 4 receives the substrate W
placed on the substrate rest part PASS5 by the transport robot TR2
of the resist coating block 3. The lower substrate rest part PASS6,
on the other hand, is used for the transport of a substrate W from
the development processing block 4 to the resist coating block 3.
Specifically, the transport robot TR2 of the resist coating block 3
receives the substrate W placed on the substrate rest part PASS6 by
the transport robot TR3 of the development processing block 4.
[0060] The substrate rest parts PASS5 and PASS6 extend through the
partition 35. Each of the substrate rest parts PASS5 and PASS6
includes an optical sensor (not shown) for detecting the presence
or absence of a substrate W thereon. Based on a detection signal
from each of the sensors, a judgment is made as to whether or not
the transport robots TR2 and TR3 stand ready to transfer and
receive a substrate W to and from the substrate rest parts PASS5
and PASS6. A pair of (upper and lower) cool plates WCP of a
water-cooled type for roughly cooling a substrate W are provided
under the substrate rest parts PASS5 and PASS6, and extend through
the partition 35 (See FIG. 4).
[0061] The development processing block 4 is a processing block for
performing a development process on a substrate W subjected to an
exposure process. The development processing block 4 is also
capable of cleaning and drying a substrate W subjected to an
immersion exposure process. The development processing block 4
includes a development processor SD for applying a developing
solution onto a substrate W exposed in a pattern to perform the
development process, a cleaning processor SOAK for performing a
cleaning process and a drying process on a substrate W subjected to
the immersion exposure process, a pair of thermal processing towers
41 and 42 for performing a thermal process which accompanies the
development process, and the transport robot TR3 for transferring
and receiving a substrate W to and from the development processor
SD, the cleaning processor SOAK and the pair of thermal processing
towers 41 and 42. The transport robot TR3 is precisely identical in
construction with the above-mentioned transport robots TR1 and
TR2.
[0062] As shown in FIG. 2, the development processor SD includes
four development processing units SD1, SD2, SD3 and SD4 similar in
construction to each other and arranged in stacked relation in
bottom-to-top order. The four development processing units SD1 to
SD4 are collectively referred to as the development processor SD,
unless otherwise identified. Each of the development processing
units SD1 to SD4 includes a spin chuck 43 for rotating a substrate
W in a substantially horizontal plane while holding the substrate W
in a substantially horizontal position under suction, a nozzle 44
for applying the developing solution onto the substrate W held on
the spin chuck 43, a spin motor (not shown) for rotatably driving
the spin chuck 43, a cup (not shown) surrounding the substrate W
held on the spin chuck 43, and the like.
[0063] The cleaning processor SOAK includes a single cleaning
processing unit SOAK1. As shown in FIG. 2, the cleaning processing
unit SOAK1 is disposed under the development processing unit SD1.
FIG. 6 is a view for illustrating the construction of the cleaning
processing unit SOAK1. The cleaning processing unit SOAK1 includes
a spin chuck 421 for rotating a substrate W about a vertical
rotation axis passing through the center of the substrate W while
holding the substrate W in a horizontal position.
[0064] The spin chuck 421 is fixed on the upper end of a rotary
shaft 425 rotated by an electric motor not shown. The spin chuck
421 is formed with a suction passage (not shown). With the
substrate W placed on the spin chuck 421, exhausting air from the
suction passage allows the lower surface of the substrate W to be
vacuum-held on the spin chuck 421, whereby the substrate W is held
in a horizontal position.
[0065] A first pivoting motor 460 is provided on one side of the
spin chuck 421. A first pivoting shaft 461 is connected to the
first pivoting motor 460. A first arm 462 is coupled to the first
pivoting shaft 461 so as to extend in a horizontal direction, and a
cleaning processing nozzle 450 is provided on a distal end of the
first arm 462. The first pivoting motor 460 drives the first
pivoting shaft 461 to rotate, and drives the first arm 462 to
pivot, whereby the cleaning processing nozzle 450 moves to over the
substrate W held by the spin chuck 421.
[0066] A tip of a cleaning supply pipe 463 is connected in
communication with the cleaning processing nozzle 450. The cleaning
supply pipe 463 is connected in communication with a cleaning
liquid supply source R1 and a rinsing liquid supply source R2
through a valve Va and a valve Vb, respectively. Controlling the
opening and closing of the valves Va and Vb allows the selection of
a processing liquid to be supplied to the cleaning supply pipe 463
and the adjustment of the amount of supply thereof. Specifically, a
cleaning liquid is supplied to the cleaning supply pipe 463 by
opening the valve Va, and a rinsing liquid is supplied to the
cleaning supply pipe 463 by opening the valve Vb.
[0067] The cleaning liquid supplied from the cleaning liquid supply
source R1 or the rinsing liquid supplied from the rinsing liquid
supply source R2 is fed through the cleaning supply pipe 463 to the
cleaning processing nozzle 450. This provides the cleaning liquid
or the rinsing liquid from the cleaning processing nozzle 450 to
the surface of the substrate W. Examples of the cleaning liquid
used herein include deionized water, a solution of a complex
(ionized) in deionized water, and a fluorine-based chemical
solution. Examples of the rinsing liquid used herein include
deionized water, carbonated water, hydrogen-dissolved water,
electrolytic ionized water, and HFE (hydrofluoroether). A two-fluid
nozzle which mixes droplets into a gas to eject the mixture may be
used as the cleaning processing nozzle 450.
[0068] A second pivoting motor 470 is provided on a different side
of the spin chuck 421 than the above-mentioned side. A second
pivoting shaft 471 is connected to the second pivoting motor 470. A
second arm 472 is coupled to the second pivoting shaft 471 so as to
extend in a horizontal direction, and a drying processing nozzle
451 is provided on a distal end of the second arm 472. The second
pivoting motor 470 drives the second pivoting shaft 471 to rotate,
and drives the second arm 472 to pivot, whereby the drying
processing nozzle 451 moves to over the substrate W held by the
spin chuck 421.
[0069] A tip of a drying supply pipe 473 is connected in
communication with the drying processing nozzle 451. The drying
supply pipe 473 is connected in communication with an inert gas
supply source R3 through a valve Vc. Controlling the opening and
closing of the valve Vc allows the adjustment of the amount of
inert gas to be supplied to the drying supply pipe 473.
[0070] The inert gas supplied from the inert gas supply source R3
is fed through the drying supply pipe 473 to the drying processing
nozzle 451. This provides the inert gas from the drying processing
nozzle 451 to the surface of the substrate W. Examples of the inert
gas used herein include nitrogen gas (N.sub.2) and argon gas
(Ar).
[0071] When supplying the cleaning liquid or the rinsing liquid to
the surface of the substrate W, the cleaning processing nozzle 450
is positioned over the substrate W held by the spin chuck 421
whereas the drying processing nozzle 451 is retracted to a
predetermined position. When supplying the inert gas to the surface
of the substrate W, on the other hand, the drying processing nozzle
451 is positioned over the substrate W held by the spin chuck 421
whereas the cleaning processing nozzle 450 is retracted to a
predetermined position, as shown in FIG. 6.
[0072] The substrate W held by the spin chuck 421 is surrounded by
a processing cup 423. A cylindrical partition wall 433 is provided
inside the processing cup 423. A drainage space 431 for draining
the processing liquid (the cleaning liquid or the rinsing liquid)
used for the processing of the substrate W is formed inside the
partition wall 433 so as to surround the spin chuck 421. A
collected liquid space 432 for collecting the processing liquid
used for the processing of the substrate W is formed between the
outer wall of the processing cup 423 and the partition wall 433 so
as to surround the drainage space 431.
[0073] A drainage pipe 434 for introducing the processing liquid to
a drainage processing apparatus (not shown) is connected to the
drainage space 431, and a collection pipe 435 for introducing the
processing liquid to a collection processing apparatus (not shown)
is connected to the collected liquid space 432.
[0074] A splash guard 424 for preventing the processing liquid from
the substrate W from splashing outwardly is provided over the
processing cup 423. The splash guard 424 has a configuration
rotationally symmetric with respect to the rotary shaft 425. A
drainage guide groove 441 of a dog-legged sectional configuration
is formed annularly in the inner surface of an upper end portion of
the splash guard 424. A collected liquid guide portion 442 defined
by an outwardly downwardly inclined surface is formed in the inner
surface of a lower end portion of the splash guard 424. A partition
wall receiving groove 443 for receiving the partition wall 433 in
the processing cup 423 is formed near the upper end of the
collected liquid guide portion 442.
[0075] The splash guard 424 is driven to move upwardly and
downwardly in a vertical direction by a guard driving mechanism
(not shown) including a ball screw mechanism and the like. The
guard driving mechanism moves the splash guard 424 upwardly and
downwardly between a collection position in which the collected
liquid guide portion 442 surrounds the edge portion of the
substrate W held by the spin chuck 421 and a drainage position in
which the drainage guide groove 441 surrounds the edge portion of
the substrate W held by the spin chuck 421. When the splash guard
424 is in the collection position (or the position shown in FIG.
6), the processing liquid splashed from the edge portion of the
substrate W is guided by the collected liquid guide portion 442
into the collected liquid space 432, and is then collected through
the collection pipe 435. When the splash guard 424 is in the
drainage position, on the other hand, the processing liquid
splashed from the edge portion of the substrate W is guided by the
drainage guide groove 441 into the drainage space 431, and is then
drained through the drainage pipe 434. In this manner, the drainage
and collection of the processing liquid can be selectively carried
out.
[0076] Referring again to FIG. 3, the thermal processing tower 41
which is closer to the indexer block 1 includes five hot plates HP7
to HP11 for heating a substrate W up to a predetermined
temperature, and cool plates CP10 to CP13 for cooling a heated
substrate W down to a predetermined temperature and for maintaining
the substrate W at the predetermined temperature. The cool plates
CP10 to CP13 and the hot plates HP7 to HP11 are arranged in stacked
relation in bottom-to-top order in this thermal processing tower
41.
[0077] The thermal processing tower 42 which is farther from the
indexer block 1, on the other hand, includes the six heating parts
PHP7 to PHP12 and a cool plate CP14 which are arranged in stacked
relation. Like the above-mentioned heating parts PHP1 to PHP6, each
of the heating parts PHP7 to PHP12 is a thermal processing unit
including a temporary substrate rest part and a local transport
mechanism.
[0078] FIGS. 7A and 7B schematically show the construction of the
heating part PHP7 with the temporary substrate rest part. FIG. 7A
is a side sectional view of the heating part PHP7, and FIG. 7B is a
plan view of the heating part PHP7. Although the heating part PHP7
is shown in FIGS. 7A and 7B, the heating parts PHP8 to PHP12 are
precisely identical in construction with the heating part PHP7. The
heating part PHP7 includes a heating plate 710 for performing a
heating process on a substrate W placed thereon, a temporary
substrate rest part 719 for placing a substrate W in an upper or
lower position (in this preferred embodiment, an upper position)
spaced apart from the heating plate 710, and a local transport
mechanism 720 specific to a thermal processing part for
transporting a substrate W between the heating plate 710 and the
temporary substrate rest part 719. The heating plate 710 is
provided with a plurality of movable support pins 721 extendable
out of and retractable into the plate surface. A vertically movable
top cover 722 for covering a substrate W during the heating process
is provided over the heating plate 710. The temporary substrate
rest part 719 is provided with a plurality of fixed support pins
723 for supporting a substrate W.
[0079] The local transport mechanism 720 includes a holding plate
724 for holding a substrate W in a substantially horizontal
position. The holding plate 724 is moved upwardly and downwardly by
a screw feed drive mechanism 725, and is moved back and forth by a
belt drive mechanism 726. The holding plate 724 is provided with a
plurality of slits 724a so as not to interfere with the movable
support pins 721 and the fixed support pins 723 when the holding
plate 724 moves to over the heating plate 710 and moves into the
temporary substrate rest part 719.
[0080] The local transport mechanism 720 further includes a cooling
element for cooling a substrate W in the course of the transport of
the substrate W from the heating plate 710 to the temporary
substrate rest part 719. As illustrated in FIG. 7B, the cooling
element may be constructed so that a cooling water passage 724b
through which a cooling water flows is provided inside the holding
plate 724. The cooling element may be constructed so that, for
example, a Peltier device or the like is provided inside the
holding plate 724.
[0081] The above-mentioned local transport mechanism 720 is
provided at the rear of (i.e., on the (+Y) side relative to) the
heating plate 710 and the temporary substrate rest part 719 in the
apparatus. A transport robot TR4 of the interface block 5 is
disposed on the (+X) side relative to the heating plate 710 and the
temporary substrate rest part 719, and the transport robot TR3 of
the development processing block 4 is disposed on the (-Y) side
relative to the heating plate 710 and the temporary substrate rest
part 719. In an upper portion of an enclosure 727 covering the
heating plate 710 and the temporary substrate rest part 719, i.e.,
a portion of the enclosure 727 which covers the temporary substrate
rest part 719, an opening 719a for allowing the transport robot TR4
to enter the temporary substrate rest part 719 is provided on the
(+X) side thereof, and an opening 719b for allowing the local
transport mechanism 720 to enter the temporary substrate rest part
719 is provided on the (+Y) side thereof. In a lower portion of the
enclosure 727, i.e., a portion of the enclosure 727 which covers
the heating plate 710, the (+X) and (-Y) sides thereof (i.e., the
surfaces of the enclosure 727 opposed to the transport robot TR3
and the transport robot TR4) are provided with no openings, and an
opening 719c for allowing the local transport mechanism 720 to
enter the heating plate 710 is provided on the (+Y) side
thereof.
[0082] A substrate W is carried into and out of the above-mentioned
heating part PHP7 in a manner to be described below. First, the
transport robot TR4 of the interface block 5 holds an exposed
substrate W, and places the substrate W onto the fixed support pins
723 of the temporary substrate rest part 719. Subsequently, the
holding plate 724 of the local transport mechanism 720 moves to
under the substrate W, and then moves slightly upwardly to receive
the substrate W from the fixed support pins 723. The holding plate
724 which holds the substrate W moves backwardly out of the
enclosure 727, and moves downwardly to a position opposed to the
heating plate 710. At this time, the movable support pins 721 of
the heating plate 710 are in a lowered position, and the top cover
722 is in a raised position. The holding plate 724 which holds the
substrate W moves to over the heating plate 710. After the movable
support pins 721 move upwardly and receive the substrate W in a
receiving position, the holding plate 724 moves backwardly out of
the enclosure 727. Subsequently, the movable support pins 721 move
downwardly to place the substrate W onto the heating plate 710, and
the top cover 722 moves downwardly to cover the substrate W. In
this state, the substrate W is subjected to the heating process.
After the heating process, the top cover 722 moves upwardly, and
the movable support pins 721 move upwardly to lift the substrate W.
Next, after the holding plate 724 moves to under the substrate W,
the movable support pins 721 move downwardly to transfer the
substrate W to the holding plate 724. The holding plate 724 which
holds the substrate W moves backwardly out of the enclosure 727,
and then moves upwardly to transport the substrate W to the
temporary substrate rest part 719. In the course of the transport,
the substrate W supported by the holding plate 724 is cooled by the
cooling element of the holding plate 724. The holding plate 724
brings the substrate W cooled (to approximately room temperature)
onto the fixed support pins 723 of the temporary substrate rest
part 719. The transport robot TR4 takes out and transports the
substrate W.
[0083] The transport robot TR4 transfers and receives the substrate
W to and from only the temporary substrate rest part 719, but does
not transfer and receive the substrate W to and from the heating
plate 710. This avoids the temperature rise of the transport robot
TR4. Additionally, the opening 719c through which the substrate W
is placed onto and removed from the heating plate 710 is formed
only on the side of the local transport mechanism 720. This
prevents the heat atmosphere leaking out through the opening 719c
from raising the temperatures of the transport robot TR3 and the
transport robot TR4 and also from affecting the development
processor SD and the cleaning processor SOAK.
[0084] As described above, the transport robot TR4 of the interface
block 5 can gain access to the heating parts PHP7 to PHP12 and the
cool plate CP14, but the transport robot TR3 of the development
processing block 4 cannot gain access thereto. The transport robot
TR3 of the development processing block 4 gains access to the
thermal processing units incorporated in the thermal processing
tower 41.
[0085] The pair of vertically arranged substrate rest parts PASS7
and PASS8 in proximity to each other for the transfer of a
substrate W between the development processing block 4 and the
interface block 5 adjacent thereto are incorporated in the topmost
tier of the thermal processing tower 42. The upper substrate rest
part PASS7 is used for the transport of a substrate W from the
development processing block 4 to the interface block 5.
Specifically, the transport robot TR4 of the interface block 5
receives the substrate W placed on the substrate rest part PASS7 by
the transport robot TR3 of the development processing block 4. The
lower substrate rest part PASS8, on the other hand, is used for the
transport of a substrate W from the interface block 5 to the
development processing block 4. Specifically, the transport robot
TR3 of the development processing block 4 receives the substrate W
placed on the substrate rest part PASS8 by the transport robot TR4
of the interface block 5. Each of the substrate rest parts PASS7
and PASS8 includes both an open side facing the transport robot TR3
of the development processing block 4 and an open side facing the
transport robot TR4 of the interface block 5.
[0086] Next, the interface block 5 will be described. The interface
block 5 is a block provided adjacent to the development processing
block 4. The interface block 5 receives a substrate W with the
resist film formed thereon by the resist coating process from the
resist coating block 3 to transfer the substrate W to the exposure
unit EXP which is an external apparatus separate from the substrate
processing apparatus according to the present invention. Also, the
interface block 5 receives an exposed substrate W from the exposure
unit EXP to transfer the exposed substrate W to the development
processing block 4. The interface block 5 in this preferred
embodiment includes a transport mechanism 55 for transferring and
receiving a substrate W to and from the exposure unit EXP, a pair
of edge exposure units EEW1 and EEW2 for exposing the periphery of
a substrate W formed with the resist film, and the transport robot
TR4 for transferring and receiving a substrate W to and from the
heating parts PHP7 to PHP12 and cool plate CP14 provided in the
development processing block 4 and the edge exposure units EEW1 and
EEW2.
[0087] As shown in FIG. 2, each of the edge exposure units EEW1 and
EEW2 (collectively referred to as an edge exposure part EEW, unless
otherwise identified) includes a spin chuck 56 for rotating a
substrate W in a substantially horizontal plane while holding the
substrate W in a substantially horizontal position under suction, a
light irradiator 57 for exposing the periphery of the substrate W
held on the spin chuck 56 to light, and the like. The pair of edge
exposure units EEW1 and EEW2 are arranged in vertically stacked
relation in the center of the interface block 5. The transport
robot TR4 provided adjacent to the edge exposure part EEW and the
thermal processing tower 42 of the development processing block 4
is similar in construction to the above-mentioned transport robots
TR1 to TR3.
[0088] With reference to FIGS. 2 and 8, description will be further
continued. FIG. 8 is a side view of the interface block 5 as seen
from the (+X) side. A return buffer RBF for the return of
substrates W is provided under the pair of edge exposure units EEW1
and EEW2, and the pair of vertically arranged substrate rest parts
PASS9 and PASS10 are provided under the return buffer RBF. The
return buffer RBF is provided to temporarily store a substrate W
subjected to a post-exposure bake process in the heating parts PHP7
to PHP12 of the development processing block 4 if the development
processing block 4 is unable to perform the development process on
the substrate W because of some sort of malfunction and the like.
The return buffer RBF includes a cabinet capable of storing a
plurality of substrates W in tiers. The upper substrate rest part
PASS9 is used for the transfer of a substrate W from the transport
robot TR4 to the transport mechanism 55. The lower substrate rest
part PASS10 is used for the transfer of a substrate W from the
transport mechanism 55 to the transport robot TR4. The transport
robot TR4 gains access to the return buffer RBF.
[0089] As shown in FIG. 8, the transport mechanism 55 includes a
movable base 55a in threaded engagement with a threaded shaft 522.
The threaded shaft 522 is rotatably supported by a pair of support
bases 523 so that the rotation axis thereof extends along the Y
axis. The threaded shaft 522 has one end coupled to a motor M1. The
motor M1 drives the threaded shaft 522 to rotate, thereby moving
the movable base 55a horizontally along the Y axis.
[0090] A pair of holding arms 59a and 59b for holding a substrate W
is mounted on the movable base 55a so as to be arranged vertically.
The pair of holding arms 59a and 59b are movable upwardly and
downwardly, pivotable, and movable back and forth in the direction
of the pivot radius independently of each other by a drive
mechanism incorporated in the movable base 55a. With such an
arrangement, the transport mechanism 55 transfers and receives a
substrate W to and from the exposure unit EXP, transfers and
receives a substrate W to and from the substrate rest parts PASS9
and PASS10, and stores and takes a substrate W into and out of a
send buffer SBF for the sending of substrates W. The send buffer
SBF is provided to temporarily store a substrate W prior to the
exposure process if the exposure unit EXP is unable to accept the
substrate W, and includes a cabinet capable of storing a plurality
of substrates W in tiers.
[0091] As shown in FIGS. 2 and 8, the cleaning processing unit
SOAK1 has an opening 58 on the (+X) side. Thus, the transport
mechanism 55 can transfer and receive a substrate W to and from the
cleaning processing unit SOAK1 through the opening 58.
[0092] A downflow of clean air is always supplied into the indexer
block 1, the BARC block 2, the resist coating block 3, the
development processing block 4, and the interface block 5 described
above to thereby avoid the adverse effects of raised particles and
gas flows upon the processes in the respective blocks 1 to 5.
Additionally, a slightly positive pressure relative to the external
environment of the substrate processing apparatus is maintained in
each of the blocks 1 to 5 to prevent the entry of particles and
contaminants from the external environment into the blocks 1 to
5.
[0093] The indexer block 1, the BARC block 2, the resist coating
block 3, the development processing block 4 and the interface block
5 as described above are units into which the substrate processing
apparatus of this preferred embodiment is divided in mechanical
terms. The blocks 1 to 5 are assembled to individual block frames,
respectively, which are in turn connected together to construct the
substrate processing apparatus.
[0094] On the other hand, this preferred embodiment employs another
type of units, that is, transport control units regarding the
transport of substrates, aside from the blocks which are units
based on the above-mentioned mechanical division. The transport
control units regarding the transport of substrates are referred to
herein as "cells." Each of the cells includes a transport robot
responsible for the transport of substrates, and a transport
destination part to which the transport robot transports a
substrate. Each of the substrate rest parts described above
functions as an entrance substrate rest part for the receipt of a
substrate W into a cell or as an exit substrate rest part for the
transfer of a substrate W out of a cell. The transfer of substrates
W between the cells is also carried out through the substrate rest
parts. The transport robots constituting the cells include the
substrate transfer mechanism 12 of the indexer block 1 and the
transport mechanism 55 of the interface block 5.
[0095] The substrate processing apparatus in this preferred
embodiment includes six cells: an indexer cell, a BARC cell, a
resist coating cell, a development processing cell, a post-exposure
bake cell, and an interface cell. The indexer cell includes the
table 11 and the substrate transfer mechanism 12, and is
consequently similar in construction to the indexer block 1 which
is one of the units based on the mechanical division. The BARC cell
includes the bottom coating processor BRC, the pair of thermal
processing towers 21 and the transport robot TR1. The BARC cell is
also consequently similar in construction to the BARC block 2 which
is one of the units based on the mechanical division. The resist
coating cell includes the resist coating processor SC, the pair of
thermal processing towers 31, and the transport robot TR2. The
resist coating cell is also consequently similar in construction to
the resist coating block 3 which is one of the units based on the
mechanical division.
[0096] The development processing cell includes the development
processor SD, the thermal processing tower 41, and the transport
robot TR3. Because the transport robot TR3 cannot gain access to
the heating parts PHP7 to PHP12 and the cool plate CP14 of the
thermal processing tower 42 as discussed above, the development
processing cell does not include the thermal processing tower 42.
Because the transport mechanism 55 of the interface block 5 gains
access to the cleaning processing unit SOAK1 of the cleaning
processor SOAK, the cleaning processor SOAK is also not included in
the development processing cell. In these respects, the development
processing cell differs from the development processing block 4
which is one of the units based on the mechanical division.
[0097] The post-exposure bake cell includes the thermal processing
tower 42 positioned in the development processing block 4, the edge
exposure part EEW positioned in the interface block 5, and the
transport robot TR4 positioned in the interface block 5. That is,
the post-exposure bake cell extends over the development processing
block 4 and the interface block 5 which are units based on the
mechanical division. In this manner, constituting one cell
including the heating parts PHP7 to PHP12 for performing the
post-exposure bake process and the transport robot TR4 allows the
rapid transport of exposed substrates W into the heating parts PHP7
to PHP12 for the execution of the thermal process. Such an
arrangement is preferred for the use of a chemically amplified
resist which is required to be subjected to a heating process as
soon as possible after the exposure of a substrate W in a
pattern.
[0098] The substrate rest parts PASS7 and PASS8 included in the
thermal processing tower 42 are provided for the transfer of a
substrate W between the transport robot TR3 of the development
processing cell and the transport robot TR4 of the post-exposure
bake cell.
[0099] The interface cell includes the transport mechanism 55 for
transferring and receiving a substrate W to and from the exposure
unit EXP which is an external apparatus, and the cleaning processor
SOAK. The interface cell has a construction different from that of
the interface block 5 which is one of the units based on the
mechanical division in that the interface cell includes the
cleaning processor SOAK positioned in the development processing
block 4 and does not include the transport robot TR4 and the edge
exposure part EEW. The substrate rest parts PASS9 and PASS10 under
the edge exposure part EEW are provided for the transfer of a
substrate W between the transport robot TR4 of the post-exposure
bake cell and the transport mechanism 55 of the interface cell.
[0100] Next, a control mechanism in the substrate processing
apparatus of this preferred embodiment will be described. FIG. 9 is
a schematic block diagram of the control mechanism. As shown in
FIG. 9, the substrate processing apparatus of this preferred
embodiment has a three-level control hierarchy composed of a main
controller MC, cell controllers CC, and unit controllers. The main
controller MC, the cell controllers CC and the unit controllers are
similar in hardware construction to typical computers.
Specifically, each of the controllers includes a CPU for performing
various computation processes, a ROM or read-only memory for
storing a basic program therein, a RAM or readable/writable memory
for storing various pieces of information therein, a magnetic disk
for storing control applications and data therein, and the
like.
[0101] The single main controller MC at the first level is provided
for the entire substrate processing apparatus, and is principally
responsible for the management of the entire substrate processing
apparatus, the management of a main panel MP, and the management of
the cell controllers CC. The main panel MP functions as a display
for the main controller MC. Various commands and parameters may be
entered into the main controller MC from a keyboard KB. The main
panel MP may be in the form of a touch panel so that a user
performs an input process into the main controller MC from the main
panel MP.
[0102] The cell controllers CC at the second level are individually
provided in corresponding relation to the six cells (the indexer
cell, the BARC cell, the resist coating cell, the development
processing cell, the post-exposure bake cell, and the interface
cell). Each of the cell controllers CC is principally responsible
for the control of the transport of substrates and the management
of the units in a corresponding cell. Specifically, the cell
controllers CC for the respective cells send and receive
information in such a manner that a first cell controller CC for a
first cell sends information indicating that a substrate W is
placed on a predetermined substrate rest part to a second cell
controller CC for a second cell adjacent to the first cell, and the
second cell controller CC for the second cell having received the
substrate W sends information indicating that the substrate W is
received from the predetermined substrate rest part back to the
first cell controller CC. Such sending and receipt of information
are carried out through the main controller MC. Each of the cell
controllers CC provides the information indicating that a substrate
W is transported into a corresponding cell to a transport robot
controller TC, which in turn controls a corresponding transport
robot to circulatingly transport the substrate W in the
corresponding cell in accordance with a predetermined procedure.
The transport robot controller TC is a controller implemented by
the operation of a predetermined application in the corresponding
cell controller CC.
[0103] Examples of the unit controllers at the third level include
a spin controller and a bake controller. The spin controller
directly controls the spin units (the coating processing units, the
development processing units and the cleaning processing unit)
provided in a corresponding cell in accordance with an instruction
given from a corresponding cell controller CC. Specifically, the
spin controller controls, for example, a spin motor for a spin unit
to adjust the number of revolutions of a substrate W. The bake
controller directly controls the thermal processing units (the hot
plates, the cool plates, the heating parts, and the like) provided
in a corresponding cell in accordance with an instruction given
from a corresponding cell controller CC. Specifically, the bake
controller controls, for example, a heater incorporated in a hot
plate to adjust a plate temperature and the like.
[0104] The host computer 100 connected via the LAN lines to the
substrate processing apparatus ranks as a higher level control
mechanism than the three-level control hierarchy provided in the
substrate processing apparatus (See FIG. 1). The host computer 100
includes a CPU for performing various computation processes, a ROM
or read-only memory for storing a basic program therein, a RAM or
readable/writable memory for storing various pieces of information
therein, a magnetic disk for storing control applications and data
therein, and the like. The host computer 100 is similar in
construction to a typical computer. Typically, a plurality of
substrate processing apparatuses according to this preferred
embodiment are connected to the host computer 100. The host
computer 100 provides a recipe containing descriptions about a
processing procedure and processing conditions to each of the
substrate processing apparatuses connected thereto. The recipe
provided from the host computer 100 is stored in a storage part
(e.g., a memory) of the main controller MC of each of the substrate
processing apparatuses.
[0105] The exposure unit EXP is provided with a separate controller
independent of the above-mentioned control mechanism of the
substrate processing apparatus. In other words, the exposure unit
EXP does not operate under the control of the main controller MC of
the substrate processing apparatus, but controls its own operation
alone. Such an exposure unit EXP also controls its own operation in
accordance with a recipe received from the host computer 100.
[0106] Next, the operation of the substrate processing apparatus of
this preferred embodiment will be described. First, description
will be given on a general procedure for the circulating transport
of substrates W in the substrate processing apparatus. The
processing procedure to be described below is in accordance with
the descriptions of the recipe received from the host computer
100.
[0107] First, unprocessed substrates W stored in a cassette C are
transported from the outside of the substrate processing apparatus
into the indexer block 1 by an AGV (automatic guided vehicle) and
the like. Subsequently, the unprocessed substrates W are
transferred outwardly from the indexer block 1. Specifically, the
substrate transfer mechanism 12 in the indexer cell (or the indexer
block 1) takes an unprocessed substrate W out of a predetermined
cassette C, and places the unprocessed substrate W onto the
substrate rest part PASS1. After the unprocessed substrate W is
placed on the substrate rest part PASS 1, the transport robot TR1
of the BARC cell uses one of the holding arms 6a and 6b to receive
the unprocessed substrate W. The transport robot TR1 transports the
received unprocessed substrate W to one of the coating processing
units BRC1 to BRC3. In the coating processing units BRC1 to BRC3,
the substrate W is spin-coated with the coating solution for the
anti-reflective film.
[0108] After the completion of the coating process, the transport
robot TR1 transports the substrate W to one of the hot plates HP1
to HP6. Heating the substrate W in the hot plate dries the coating
solution to form the anti-reflective film serving as the undercoat
on the substrate W. Thereafter, the transport robot TR1 takes the
substrate W from the hot plate, and transports the substrate W to
one of the cool plates CP1 to CP3, which in turn cools down the
substrate W. In this step, one of the cool plates WCP may be used
to cool down the substrate W. The transport robot TR1 places the
cooled substrate W onto the substrate rest part PASS3.
[0109] Alternatively, the transport robot TR1 may be adapted to
transport the unprocessed substrate W placed on the substrate rest
part PASS1 to one of the adhesion promotion processing parts AHL1
to AHL3. In the adhesion promotion processing parts AHL1 to AHL3,
the substrate W is thermally processed in a vapor atmosphere of
HMDS, whereby the adhesion of the resist film to the substrate W is
promoted. The transport robot TR1 takes out the substrate W
subjected to the adhesion promotion process, and transports the
substrate W to one of the cool plates CP1 to CP3, which in turn
cools down the substrate W. Because no anti-reflective film is to
be formed on the substrate W subjected to the adhesion promotion
process, the cooled substrate W is directly placed onto the
substrate rest part PASS3 by the transport robot TR1.
[0110] A dehydration process may be performed prior to the
application of the coating solution for the anti-reflective film.
In this case, the transport robot TR1 transports the unprocessed
substrate W placed on the substrate rest part PASS1 first to one of
the adhesion promotion processing parts AHL1 to AHL3. In the
adhesion promotion processing parts AHL1 to AHL3, a heating process
(dehydration bake) merely for dehydration is performed on the
substrate W without supplying the vapor atmosphere of HMDS. The
transport robot TR1 takes out the substrate W subjected to the
heating process for dehydration, and transports the substrate W to
one of the cool plates CP1 to CP3, which in turn cools down the
substrate W. The transport robot TR1 transports the cooled
substrate W to one of the coating processing units BRC1 to BRC3. In
the coating processing units BRC1 to BRC3, the substrate W is
spin-coated with the coating solution for the anti-reflective film.
Thereafter, the transport robot TR1 transports the substrate W to
one of the hot plates HP1 to HP6. Heating the substrate W in the
hot plate forms the anti-reflective film serving as the undercoat
on the substrate W. Thereafter, the transport robot TR1 takes the
substrate W from the hot plate, and transports the substrate W to
one of the cool plates CP1 to CP3, which in turn cools down the
substrate W. Then, the transport robot TR1 places the cooled
substrate W onto the substrate rest part PASS3.
[0111] After the substrate W is placed on the substrate rest part
PASS3, the transport robot TR2 in the resist coating cell receives
the substrate W, and transports the substrate W to one of the
coating processing units SC1 to SC3. In the coating processing
units SC1 to SC3, the substrate W is spin-coated with the resist.
Because the resist coating process requires precise substrate
temperature control, the substrate W may be transported to one of
the cool plates CP4 to CP9 immediately before being transported to
the coating processing units SC1 to SC3.
[0112] After the completion of the resist coating process, the
transport robot TR2 transports the substrate W to one of the
heating parts PHP1 to PHP6. In the heating parts PHP1 to PHP6,
heating the substrate W removes a solvent component from the resist
to form a resist film on the substrate W. Thereafter, the transport
robot TR2 takes the substrate W from the one of the heating parts
PHP1 to PHP6, and transports the substrate W to one of the cool
plates CP4 to CP9, which in turn cools down the substrate W. Then,
the transport robot TR2 places the cooled substrate W onto the
substrate rest part PASS5.
[0113] After the substrate W with the resist film formed thereon by
the resist coating process is placed on the substrate rest part
PASS5, the transport robot TR3 in the development processing cell
receives the substrate W, and places the substrate W onto the
substrate rest part PASS7 without any processing of the substrate
W. Then, the transport robot TR4 in the post-exposure bake cell
receives the substrate W placed on the substrate rest part PASS7,
and transports the substrate W to one of the edge exposure units
EEW1 and EEW2. In the edge exposure units EEW1 and EEW2, a
peripheral edge portion of the substrate W is exposed to light. The
transport robot TR4 places the substrate W subjected to the edge
exposure process onto the substrate rest part PASS9. The transport
mechanism 55 in the interface cell receives the substrate W placed
on the substrate rest part PASS9, and transports the substrate W
into the exposure unit EXP. The substrate W transported into the
exposure unit EXP is subjected to the pattern exposure process. In
this step, the transport mechanism 55 uses the holding arm 59a to
transport the substrate W from the substrate rest part PASS9 to the
exposure unit EXP.
[0114] Because the chemically amplified resist is used in this
preferred embodiment, an acid is formed by a photochemical reaction
in the exposed portion of the resist film formed on the substrate
W. In the exposure unit EXP, the substrate W is subjected to an
immersion exposure process. The immersion exposure process refers
to a technique for immersing a substrate W in a liquid with a high
refractive index (e.g., deionized water with a refractive index of
1.44) to expose the substrate W in a pattern, and can achieve a
high resolution with virtually no change of the conventional light
source and exposure process. The substrate W subjected to the edge
exposure process may be transported to the cool plate CP14 for the
cooling process by the transport robot TR4 before being transported
to the exposure unit EXP.
[0115] The exposed substrate W subjected to the pattern exposure
process is transported from the exposure unit EXP back to the
interface cell again. The transport mechanism 55 transports the
exposed substrate W into the cleaning processing unit SOAK1. In
this step, the transport mechanism 55 uses the holding arm 59b to
transport the substrate W from the exposure unit EXP to the
cleaning processing unit SOAK1. There are cases where a liquid
adheres to the substrate W subjected to the immersion exposure
process. However, the holding arm 59a is used for the transport of
the substrate W prior to the exposure and the holding arm 59b is
exclusively used for the transport of the substrate W after the
exposure. This avoids the adhesion of the liquid to at least the
holding arm 59a, to prevent the transfer of the liquid to the
substrate W prior to the exposure.
[0116] A processing operation in the cleaning processing unit SOAK1
will be described. First, when a substrate W is transported into
the cleaning processing unit SOAK1, the splash guard 424 is moved
downwardly, and the transport mechanism 55 places the substrate W
onto the spin chuck 421. The substrate W placed on the spin chuck
421 is held in a horizontal position under suction by the spin
chuck 421.
[0117] Next, the splash guard 424 moves to the above-mentioned
drainage position, and the cleaning processing nozzle 450 moves to
over the center of the substrate W. Thereafter, the rotary shaft
425 starts rotating. As the rotary shaft 425 rotates, the substrate
W held by the spin chuck 421 is rotated. Thereafter, the valve Va
is opened to apply the cleaning liquid from the cleaning processing
nozzle 450 onto the upper surface of the substrate W. In this
preferred embodiment, deionized water is applied as the cleaning
liquid onto the substrate W. Thus, the cleaning process of the
substrate W proceeds to wash away the liquid for immersion exposure
from the substrate W. The liquid splashed from the rotating
substrate W by centrifugal force is guided by the drainage guide
groove 441 into the drainage space 431, and is drained through the
drainage pipe 434. In this preferred embodiment, because the
deionized water is used as the cleaning liquid, an additional
rinsing liquid is not supplied. In place of the valve Va, the valve
Vb may be opened to discharge deionized water as the rinsing liquid
from the cleaning processing nozzle 450.
[0118] After a lapse of a predetermined time period, the speed of
rotation of the rotary shaft 425 decreases. This decreases the
amount of deionized water serving as the cleaning liquid spattered
by the rotation of the substrate W to form a film of water on the
entire surface of the substrate W in such a manner that a puddle of
water remains on the substrate W. Alternatively, a film of water
may be formed on the entire surface of the substrate W by stopping
the rotation of the rotary shaft 425.
[0119] Next, the supply of the cleaning liquid is stopped. The
cleaning processing nozzle 450 is retracted to a predetermined
position, and the drying processing nozzle 451 moves to over the
center of the substrate W. Thereafter, the valve Vc is opened to
apply an inert gas (in this preferred embodiment, nitrogen gas)
from the drying processing nozzle 451 to near the center of the
upper surface of the substrate W. Thus, the water or moisture in
the center of the substrate W is forced toward the peripheral edge
portion of the substrate W. As a result, the film of water remains
only in the peripheral edge portion of the substrate W.
[0120] Next, the speed of rotation of the rotary shaft 425
increases again, and the drying processing nozzle 451 gradually
moves from over the center of the substrate W toward over the
peripheral edge portion of the substrate W. Thus, a great
centrifugal force is exerted on the film of water remaining on the
substrate W, and the inert gas can impinge on the entire surface of
the substrate W, whereby the film of water on the substrate W is
reliably removed. As a result, the substrate W is dried with
reliability.
[0121] Next, the supply of the inert gas is stopped. The drying
processing nozzle 451 is retracted to a predetermined position, and
the rotation of the rotary shaft 425 is stopped. Thereafter, the
splash guard 424 is moved downwardly, and the transport mechanism
55 transports the substrate W out of the cleaning processing unit
SOAK1. This completes the processing operation in the cleaning
processing unit SOAK1. The position of the splash guard 424 during
the cleaning and drying processes is preferably appropriately
changed depending on the need for the collection and drainage of
the processing liquid.
[0122] The substrate W subjected to the cleaning and drying
processes in the cleaning processing unit SOAK1 is placed on the
substrate rest part PASS10 by the transport mechanism 55. In this
step, the transport mechanism 55 uses the holding arm 59a to
transport the substrate W from the cleaning processing unit SOAK1
to the substrate rest part PASS10. After the exposed substrate W is
placed on the substrate rest part PASS10, the transport robot TR4
in the post-exposure bake cell receives the substrate W, and
transports the substrate W to one of the heating parts PHP7 to
PHP12. The processing operation in the heating parts PHP7 to PHP12
is as described above. In the heating parts PHP7 to PHP12, the
heating process (or the post-exposure bake process) is performed
which causes a reaction such as crosslinking, polymerization and
the like of the resist resin to proceed by using a product formed
by the photochemical reaction during the exposure process as an
acid catalyst, thereby locally changing the solubility of only an
exposed portion of the resist resin in the developing solution. The
local transport mechanism 720 having the cooling mechanism
transports the substrate W subjected to the post-exposure bake
process to thereby cool down the substrate W, whereby the
above-mentioned chemical reaction stops. Subsequently, the
transport robot TR4 takes the substrate W from the one of the
heating parts PHP7 to PHP12, and places the substrate W onto the
substrate rest part PASS8. The procedure from the end of exposure
in the exposure unit EXP to the start of the post-exposure bake
process in the heating parts PHP7 to PHP12 will be described
later.
[0123] After the substrate W is placed on the substrate rest part
PASS8, the transport robot TR3 in the development processing cell
receives the substrate W, and transports the substrate W to one of
the cool plates CP10 to CP13. In the cool plates CP10 to CP13, the
substrate W subjected to the post-exposure bake process is further
cooled down and precisely controlled at a predetermined
temperature. Thereafter, the transport robot TR3 takes the
substrate W from the one of the cool plates CP10 to CP13, and
transports the substrate W to one of the development processing
units SD1 to SD4. In the development processing units SD1 to SD4,
the developing solution is applied onto the substrate W to cause
the development process to proceed. After the completion of the
development process, the transport robot TR3 transports the
substrate W to one of the hot plates HP7 to HP11, and then
transports the substrate W to one of the cool plates CP10 to
CP13.
[0124] Thereafter, the transport robot TR3 places the substrate W
onto the substrate rest part PASS6. The transport robot TR2 in the
resist coating cell places the substrate W from the substrate rest
part PASS6 onto the substrate rest part PASS4 without any
processing of the substrate W. Next, the transport robot TR1 in the
BARC cell places the substrate W from the substrate rest part PASS4
onto the substrate rest part PASS2 without any processing of the
substrate W, whereby the substrate W is stored in the indexer block
1. Then, the substrate transfer mechanism 12 in the indexer cell
stores the processed substrate W held on the substrate rest part
PASS2 into a predetermined cassette C. Thereafter, the cassette C
in which a predetermined number of processed substrates W are
stored is transported to the outside of the substrate processing
apparatus. Thus, a series of photolithography processes are
completed.
[0125] In the substrate processing apparatus according to this
preferred embodiment, the chemically amplified resist is applied as
the photoresist to the substrate W. When the chemically amplified
resist is used, a slight variation in processing conditions exerts
a large influence upon line width uniformity, as described above.
For this reason, processing conditions are made as constant as
possible for all of the substrates W to be processed. In
particular, the substrate processing apparatus according to this
preferred embodiment is managed so as to provide a constant time
interval between the instant of the completion of the exposure
process in the exposure unit EXP and the instant of the start of
the post-exposure bake process in the heating parts PHP7 to PHP12,
because this time interval exerts the greatest influence on the
line width uniformity.
[0126] Additionally, the substrate processing apparatus according
to this preferred embodiment is adapted to provide a constant time
interval between the instant of the completion of the cleaning
process of substrates W in the cleaning processing unit SOAK1 and
the instant of the start of the post-exposure bake process of the
substrates W in the heating parts PHP7 to PHP12. This preferred
embodiment adopts a technique to be described below to provide the
constant time interval between the instant of the completion of the
exposure process in the exposure unit EXP and the instant of the
start of the post-exposure bake process in the heating parts PHP7
to PHP12 and to provide the constant time interval between the
instant of the completion of the cleaning process in the cleaning
processing unit SOAK1 and the instant of the start of the
post-exposure bake process in the heating parts PHP7 to PHP12.
[0127] FIG. 10 is a flow chart showing a processing procedure from
the end of the exposure in the exposure unit EXP to the start of
the post-exposure bake process in the heating parts PHP7 to PHP12.
FIG. 11 is a timing chart for processing from the end of the
exposure to the post-exposure bake process. First, the exposure
process of a substrate W in the exposure unit EXP is completed at
time t1 (in Step S1). At this point, the exposure unit EXP sends an
exposure completion signal, and the substrate processing apparatus
receives the exposure completion signal through the host computer
100. As a result, the main controller MC of the substrate
processing apparatus recognizes the completion of the exposure
process of the substrate W in the exposure unit EXP at the time t1
to store the time t1 as an exposure completion time in a storage
portion thereof.
[0128] Subsequently, the substrate W subjected to the exposure
process is returned from the exposure unit EXP to the interface
cell (in Step S2), and is transported into the cleaning processing
unit SOAK1 by the transport mechanism 55 (in Step S3). The
procedure of the processes in Step S3 and its subsequent steps is
executed by the cell controllers CC for the interface cell and the
post-exposure bake cell controlling the mechanical parts in
accordance with an instruction from the main controller MC. A basic
flow of the cleaning and drying processes of a substrate W in the
cleaning processing unit SOAK1 is as discussed above.
[0129] In a pattern labeled (a) in FIG. 11, it takes a relatively
long time to transport a substrate W from the exposure unit EXP to
the cleaning processing unit SOAK1, and the substrate W subjected
to the exposure process is transported into the cleaning processing
unit SOAK1 at time t3. The relatively long time required for the
substrate W subjected to the exposure process to be transported
into the cleaning processing unit SOAK1 can result from a factor
such that the transport mechanism 55 is performing a wafer feed
operation (or the operation of transferring an unexposed substrate
W to the exposure unit EXP) at the time of the transfer of the
substrate W subjected to the exposure process from the exposure
unit EXP to the transport mechanism 55.
[0130] After the substrate W is transported into the cleaning
processing unit SOAK1 at the time t3, the substrate W waits until
time t4 in the cleaning processing unit SOAK1 (in Step S4).
Specifically, the substrate W waits while being held by the spin
chuck 421 under suction without the application of the cleaning
liquid thereto from the cleaning processing nozzle 450. At the time
t4, the application of the cleaning liquid from the cleaning
processing nozzle 450 starts while the substrate W is rotated.
Thus, the cleaning process of the substrate W is executed (in Step
S5). Next, the application of the inert gas to near the center of
the upper surface of the substrate W from the drying processing
nozzle 451 starts at time t5. The cleaning process of the substrate
W in the cleaning processing unit SOAK1 is completed at the time
t5. After the time t5, the drying process of the substrate W is
executed (in Step S6). Thereafter, the supply of the inert gas from
the drying processing nozzle 451 is stopped at time t6, and the
drying process of the substrate W is completed. Thereafter, the
substrate W transported out of the cleaning processing unit SOAK1
by the transport mechanism 55 is transported into one of the
heating parts PHP7 to PHP12 by the transport mechanism 55 and the
transport robot TR4 (in Step S7). The post-exposure bake process of
the substrate W in the one of the heating parts PHP7 to PHP12 (in
Step S8) starts at time t7.
[0131] In a pattern labeled (b) in FIG. 11, it takes a relatively
short time to transport a substrate W from the exposure unit EXP to
the cleaning processing unit SOAK1, and the substrate W subjected
to the exposure process is transported into the cleaning processing
unit SOAK1 at time t2. If the transport mechanism 55 is able to
receive the exposed substrate W immediately after the substrate W
is fed out of the exposure unit EXP, the substrate W is transported
to the cleaning processing unit SOAK1 for such a short time.
[0132] After the substrate W is transported into the cleaning
processing unit SOAK1 at the time t2, the substrate W waits until
the time t4 in the cleaning processing unit SOAK1. Subsequently,
the application of the cleaning liquid from the cleaning processing
nozzle 450 starts while the substrate W is rotated at the time t4,
and the application of the inert gas to near the center of the
upper surface of the substrate W from the drying processing nozzle
451 starts at the time t5, in a manner similar to that in the
above-mentioned pattern labeled (a). The supply of the inert gas
from the drying processing nozzle 451 is stopped at the time t6.
The substrate W is transported from the cleaning processing unit
SOAK1 to one of the heating parts PHP7 to PHP12. The post-exposure
bake process of the substrate W starts at the time t7.
[0133] As discussed above, the substrate processing apparatus and
the exposure unit EXP have the individual control mechanisms,
respectively, and the operations thereof are not completely
synchronized. Thus, there are cases where the transport mechanism
55 is unable to receive a substrate W subjected to the exposure
process at the time of the feed of the substrate W from the
exposure unit EXP, and variations sometimes arise in a transport
time interval between the completion of the exposure process and
the transport of the substrate W into the cleaning processing unit
SOAK1 (See (a) and (b) in FIG. 11). If the subsequent cleaning and
drying processes are executed and the post-exposure bake process is
started in the presence of such variations, uneven time intervals
occur between the instant of the completion of the exposure process
and the instant of the start of the post-exposure bake process.
Even if an adjustment is made to the time at which the
post-exposure bake process starts to provide a constant time
interval between the instant of the completion of the exposure
process and the instant of the start of the post-exposure bake
process, uneven time intervals result between the instant of the
completion of the cleaning process in the cleaning processing unit
SOAK1 and the instant of the start of the post-exposure bake
process.
[0134] Thus, the main controller MC adjusts the waiting time of the
exposed substrate W transported into the cleaning processing unit
SOAK1 so as to provide a constant time interval between the
exposure process completion time t1 and the time t5 at which the
cleaning process is completed, thereby to provide the constant time
interval between the instant (the time t1) of the completion of the
exposure process in the exposure unit EXP and the instant (the time
t7) of the start of the post-exposure bake process in the heating
parts PHP7 to PHP12 and to provide the constant time interval
between the instant (the time t5) of the completion of the cleaning
process in the cleaning processing unit SOAK1 and the instant (the
time t7) of the start of the post-exposure bake process in the
heating parts PHP7 to PHP12. The cleaning and drying processes in
the cleaning processing unit SOAK1 and the subsequent substrate
transport are executed in accordance with a previously set
predetermined sequence, and are each carried out for a constant
time period. Therefore, the adjustment made to the waiting time of
the exposed substrate W in the cleaning processing unit SOAK1 to
provide a constant time interval between the exposure process
completion time t1 and the cleaning process start time t4 achieves
the constant time interval between the exposure process completion
time and the post-exposure bake process start time and the constant
time interval between the cleaning process completion time and the
post-exposure bake process start time.
[0135] In place of the adjustment made to the waiting time of the
exposed substrate W in the cleaning processing unit SOAK1, an
adjustment may be made to the cleaning processing time to provide
the constant time interval between the exposure process completion
time t1 and the cleaning process completion time t5. In a pattern
labeled (c) in FIG. 11, it takes a relatively short time to
transport a substrate W from the exposure unit EXP to the cleaning
processing unit SOAK1, and the substrate W subjected to the
exposure process is transported into the cleaning processing unit
SOAK1 at the time t2 in a manner similar to that in the pattern
labeled (b). Subsequently, the application of the cleaning liquid
from the cleaning processing nozzle 450 starts while the substrate
W is rotated at the time t2 without any particular waiting step,
and the application of the inert gas to near the center of the
upper surface of the substrate W from the drying processing nozzle
451 starts at the time t5. Thereafter, in a manner similar to those
in the patterns labeled (a) and (b), the supply of the inert gas
from the drying processing nozzle 451 is stopped at the time t6,
and the substrate W is transported from the cleaning processing
unit SOAK1 to one of the heating parts PHP7 to PHP12. Also, the
post-exposure bake process of the substrate W starts at the time
t7.
[0136] In this manner, the main controller MC may adjust the
cleaning time of the exposed substrate W transported into the
cleaning processing unit SOAK1 so as to provide the constant time
interval between the exposure process completion time t1 and the
cleaning process completion time t5. This also provides the
constant time interval between the instant (the time t1) of the
completion of the exposure process in the exposure unit EXP and the
instant (the time t7) of the start of the post-exposure bake
process in the heating parts PHP7 to PHP12, and provides the
constant time interval between the instant (the time t5) of the
completion of the cleaning process in the cleaning processing unit
SOAK1 and the instant (the time t7) of the start of the
post-exposure bake process in the heating parts PHP7 to PHP12.
[0137] A summary of the details of the patterns labeled (a) to (c)
in FIG. 11 is as follows. The cell controller CC of the interface
cell controls the mechanical parts in accordance with an
instruction from the main controller MC to adjust the length of
time (referred to hereinafter as a "presence time") that the
exposed substrate W is present in the cleaning processing unit
SOAK1, thereby adjusting the instant of the end of the cleaning
process so as to provide the constant time interval between the
instant of the completion of the exposure process and the instant
of the end of the cleaning process. This provides the constant time
interval between the instant of the completion of the exposure
process and the instant of the start of the post-exposure bake
process, and provides the constant time interval between the
instant of the completion of the cleaning process and the instant
of the start of the post-exposure bake process. The constant time
interval between the instant of the completion of the exposure
process and the instant of the start of the post-exposure bake
process and the constant time interval between the instant of the
completion of the cleaning process and the instant of the start of
the post-exposure bake process achieve further improvements in the
line width uniformity of a pattern formed when the chemically
amplified resist is used. The adjustment made to the presence time
of the exposed substrate W in the cleaning processing unit SOAK1
avoids the influence of heat upon the exposed substrate W more
reliably than the adjustment made to the waiting time of the
substrate W in the heating parts PHP7 to PHP12. In the pattern
labeled (c) in FIG. 11, the exposed substrate W is in contact with
the water for a relatively long time. However, whether this
cleaning time is long or short is considered to have little effect
on the line width uniformity of a pattern.
[0138] While the preferred embodiment according to the present
invention is described hereinabove, the present invention is not
limited to the above-mentioned specific embodiment. For example,
the above-mentioned preferred embodiment is based on the premise
that each of the cleaning and drying processes in the cleaning
processing unit SOAK1 and the subsequent substrate transport
requires an approximately constant time. If variations arise in the
time required for these processes, a modification may be made to
cause the substrate W to further wait in the heating parts PHP7 to
PHP12, thereby providing the constant time interval between the
instant of the completion of the exposure process and the instant
of the start of the post-exposure bake process and the constant
time interval between the instant of the completion of the cleaning
process and the instant of the start of the post-exposure bake
process. For example, if variations arise in the time required for
the substrate transport from the cleaning processing unit SOAK1 to
the heating parts PHP7 to PHP12, such a modification is made to
cause the substrate W to wait in the temporary substrate rest part
719 of the heating parts PHP7 to PHP12, thereby adjusting the time
interval between the instant of the completion of the cleaning
process and the instant of the start of the post-exposure bake
process to be constant. In other words, when the instant of the end
of the cleaning process is adjusted so that the time interval
between the instant of the completion of the exposure process and
the instant of the end of the cleaning process is constant,
subsequently adjusting the time interval between the instant of the
completion of the cleaning process and the instant of the start of
the post-exposure bake process in the heating parts PHP7 to PHP12
to be constant leads to adjusting the time interval between the
instant of the completion of the exposure process and the instant
of the start of the post-exposure bake process to be constant.
[0139] The drying process as a step subsequent to the cleaning
process in the cleaning processing unit SOAK1 is not essential.
[0140] The construction of the substrate processing apparatus
according to the present invention is not limited to the
configuration shown in FIGS. 1 to 4. However, various modifications
may be made to the construction of the substrate processing
apparatus if a transport robot circulatingly transports a substrate
W to a plurality of processing parts whereby predetermined
processes are performed on the substrate W.
[0141] While the invention has been described in detail, the
foregoing description is in all aspects illustrative and not
restrictive. It is understood that numerous other modifications and
variations can be devised without departing from the scope of the
invention.
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