U.S. patent application number 11/225076 was filed with the patent office on 2007-03-15 for package structure for an optical sensor.
Invention is credited to Mao-Jung Chen, Po-Hung Chen, Chung-Chi Hsiao.
Application Number | 20070057169 11/225076 |
Document ID | / |
Family ID | 37854136 |
Filed Date | 2007-03-15 |
United States Patent
Application |
20070057169 |
Kind Code |
A1 |
Hsiao; Chung-Chi ; et
al. |
March 15, 2007 |
Package structure for an optical sensor
Abstract
The present invention relates to a package structure for an
optical sensor having a base set with the plurality of
metallization traces on its upper and under surface and several
conductors passing through the base electrically connects to the
plurality of metallization traces on the surface; at least one
optical sensor and its peripheral frame are set upon the base in
which the conductors can be located within the frame area or the
area between the optical sensor and the frame; and a light-pervious
lid encapsulates the frame and completes the package structure. In
addition, an enclosing base having a containing capacity can be
adopted to replace the base and the frame. The present invention
can efficiently raise the reliability of elements and yield and
quality by said package structure.
Inventors: |
Hsiao; Chung-Chi; (Shin-Chu,
TW) ; Chen; Po-Hung; (Shin-Chu, TW) ; Chen;
Mao-Jung; (Shin-Chu, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
37854136 |
Appl. No.: |
11/225076 |
Filed: |
September 14, 2005 |
Current U.S.
Class: |
250/239 |
Current CPC
Class: |
H01L 2224/48227
20130101; H01L 2924/00014 20130101; H01L 2924/00 20130101; H01L
2224/32225 20130101; H01L 2224/73265 20130101; H01L 2224/32225
20130101; H01L 2224/48091 20130101; H01L 2224/73265 20130101; H01L
2224/48091 20130101; H01L 2224/48227 20130101; H01L 27/14618
20130101 |
Class at
Publication: |
250/239 |
International
Class: |
H01J 40/14 20060101
H01J040/14 |
Claims
1. A package structure for an optical sensor, comprising: a base
set with the plurality of metallization traces on its upper and
under surface and electrically connects to the upper and the under
plurality of metallization traces by several conductors passing
through the base; at least one optical sensor having an optical
sensing area set on the base and electrically connects to the
plurality of metallization traces; a frame formed on the base and
around the optical sensor making the conductors locate in the base
under the frame or between the frame and the optical sensor; and a
light-pervious lid covering the frame.
2. The package structure for an optical sensor of claim 1, wherein
the base can be printed circuit board or molding base.
3. The package structure for an optical sensor of claim 2, wherein
the frame and the ceramic base or molding base are
form-in-place.
4. The package structure for an optical sensor of claim 1, wherein
the base has a convex and the frame has a concave at a relative
position enabling the tight combination of the base and the
frame.
5. The package structure for an optical sensor of claim 1, wherein
the base has a concave and the frame has a convex at a relative
position enabling the tight combination of the base and the
frame.
6. The package structure for an optical sensor of claim 1, wherein
the conductors are plated-through via holes.
7. The package structure for an optical sensor of claim 1, further
comprising an adhesive layer adheres the optical sensor to the
base, said adhesive layer could be silver paste or adhesive
tape.
8. The package structure for an optical sensor of claim 1, further
comprising a metallic layer between the base and the optical
sensor.
9. The package structure for an optical sensor of claim 1, further
comprising a protective adhesive layer covers on the upper or under
surface of the base for sealing the apertures caused by the
conductors and the adhesive layer can be solder mask, UV glue or
heat-cured adhesive.
10. The package structure for an optical sensor of claim 1, wherein
the light-pervious lid can filter certain light wavelengths such as
infrared ray.
11. A package structure for an optical sensor, comprising: an
enclosing base having a frame for forming a containing capacity and
the enclosing base is set with the plurality of metallization
traces on its upper and under surface and electrically connects to
the upper and the under plurality of metallization traces by
several conductors passing through the base; at least one optical
sensor having an optical sensing area set on the base in the
containing capacity and electrically connects to the plurality of
metallization traces; and a light-pervious lid covering on the
frame of the enclosing base.
12. The package structure for an optical sensor of claim 1 1,
wherein the conductors are plated-through via holes.
13. The package structure for an optical sensor of claim 11,
wherein the plurality of metallization traces can further extend to
the external part of the enclosing base.
14. The package structure for an optical sensor of claim 11,
further comprising an adhesive layer adheres the optical sensor to
the enclosing base, said adhesive layer could be silver paste or
adhesive tape.
15. The package structure for an optical sensor of claim 11,
further comprising a metallic layer between the base and the
optical sensor.
16. The package structure for an optical sensor of claim 11,
further comprising a protective adhesive layer covers on the upper
or under surface of the base for sealing the apertures caused by
the conductors and the adhesive layer can be solder mask, UV glue
or heat-cured adhesive.
17. The package structure for an optical sensor of claim 1 1,
wherein the light-pervious lid can filter certain light wavelengths
such as infrared ray.
18. A package structure for an optical sensor, comprising: a base
set with the plurality of metallization traces on its upper and
under surface and electrically connects to the upper and the under
plurality of metallization traces by several conductors passing
through the base; at least one optical sensor having an optical
sensing area set on the base and electrically connects to the
plurality of metallization traces; a frame formed on the base and
around the optical sensor; a light-pervious lid set on the frame;
and at least one protective adhesive layer set on the surface of
the base for sealing the apertures caused by the conductors.
19. The package structure for an optical sensor of claim 18,
wherein the protective adhesive layer could be solder mask, UV glue
or heat-cured adhesive.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a package structure of
semiconductor elements, more particularly, to a package structure
for an optical sensor being able to raise the reliability of
elements and yield.
[0003] 2. Description of related art
[0004] Please refer to FIG. 1, which shows a common package
structure of a CMOS optical sensor. The package structure has a
base 10 with the plurality of metallization traces 12 formed on it
which laterally extends to the under surface and serves as a
contact; a frame 16 is adhered to the surface of the base 10 by
using a first adhesive layer 14 and an optical sensor chip 18
having a optical sensing area 20 is set on the base 10 by
application of an adhesive glue 28; the optical sensor chip 18
electrically connects to the plurality of metallization traces 12
of the base 10 by the connection of metallic wire 22 between the
optical sensor 18 and the base 10; a second adhesive layer 24 is
applied to adhere a light pervious glass 26 onto the frame 16 for
encapsulating the optical sensor chip 18. The package is to isolate
exterior contaminants and enables the CMOS optical sensor to sense
the exterior environment truly.
[0005] However, there are still many problems in the package
structure aforementioned. The main defect is that when reliability
test is conducted, exterior mist would permeate into the optical
sensor 18 through the first adhesive layer 14 due to the restricted
adhesion between the frame 16 and the base 10 caused by the
existence of the plurality of metallization traces 12 and causes
quality problems. Besides, during the cleansing process of the
packaging procedure, residue glue of the first adhesive layer 14
would contaminate the surface of the optical sensor chip 18 and
result in impurities difficult to remove and lowers down the yield.
Furthermore, because the electrical connection of the plated
metallic layer of known package structure is achieved by the
plurality of metallization traces 12 of the upper and under surface
through the aperture around the edge, the aperture structure makes
the first adhesive layer 14 leak from it when forming the adhesion
between the frame 16 and the base 10 and results in a serious glue
contamination on the package structure.
[0006] Accordingly, the present invention proposes a package
structure for an optical sensor overcoming the drawbacks of the
known art.
SUMMARY OF THE INVENTION
[0007] The primary object of the present invention is to provide a
package structure for an optical sensor with improved yield and
quality by overcoming the problem of impurities like residue glue
generated during the manufacturing process.
[0008] Another object of the present invention is to provide a
package structure for an optical sensor which is capable of raising
the reliability of the package structure and avoiding the problem
of permeation of mist into the optical sensor when the reliability
test is conducted.
[0009] According to the above-mentioned objects, the present
invention provides a package structure for an optical sensor
comprising a base set with the plurality of metallization traces on
its upper and under surface and several conductors passing through
the base electrically connects to the plurality of metallization
traces of the surface, at least one optical sensor set on the base
which electrically connects to the plurality of metallization
traces, a frame formed upon the base and around the optical sensor
enabling those conductors to be located within the frame area or
the area between the optical sensor and the frame, and a
light-pervious lid covers the frame for encapsulating the optical
sensor.
[0010] Besides, aforementioned base and frame could also be a
form-in-place enclosing base which the plurality of metallization
traces thereof achieves electrical connection by conductors. The
enclosing room of the enclosing base is set with at least one
optical sensor electrically connecting to the plurality of
metallization traces and a light-pervious lid is set on the
enclosing base.
[0011] These and other objects, features, advantages and the
efficacy of the present invention will become more apparent from
the following description taken in connection with the accompanying
drawings in which preferred embodiment of the present invention are
show by way of illustrative example.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a cross-sectional view of a conventional package
structure for an optical sensor.
[0013] FIG. 2 is a cross-sectional view of a package structure for
an optical sensor according to the present invention.
[0014] FIG. 3 is a cross-sectional view of one embodiment of a
package structure for an optical sensor according to the present
invention.
[0015] FIG. 4 is a cross-sectional view of another embodiment of a
package structure for an optical sensor according to the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0016] The present invention provides a package structure of an
optical sensor with higher reliability which efficiently avoids
serious impurities on the surface of optical sensor caused by glue
during the manufacturing process and therefore raises the
yield.
[0017] FIG. 2 shows the package structure of the present invention.
The package structure for an optical sensor comprises a base 30
which can be printed circuit board, ceramic base, or molding base.
An upper metallization 32 and the under plurality of metallization
traces 34 are set on the upper and under surface of the base
respectively and several conductors 36, usually plated through via
holes, pass through the base and electrically connect the upper
plurality of metallization traces 32 and the under plurality of
metallization traces 34. An optical sensor 38, which is adhered on
the base 30 through a first adhesive layer 40 which could be silver
paste or adhesive tape, has an optical sensing area. The electrical
connection between the optical sensor 38 and the base 30 is through
a connection of metallic wire. A frame 46, which could be a molding
frame, is formed on the base 30 and around the optical sensor 38. A
second adhesive layer 48 is then applied to cover a light-pervious
lid 50 on the frame 46 and encapsulates the optical sensor 38.
[0018] Because said package structure uses plated through via holes
36 to connect the upper plurality of metallization traces 32 and
the under plurality of metallization traces 34 of the upper and
under surface of the base 30 and the plated through via holes 36
are in the base 30 under the frame 46, the frame 46 and the base 30
can be combined tightly without being affected by the plurality of
metallization traces 32.
[0019] To improve the adhesion between the base 30 and the frame
46, a convex (not shown in the figure) can be set on the base 30
and a concave (not shown in the figure) can be set on the relative
position of the frame 46 to tightly combine the base 30 and the
frame 46 by the conjunction of the convex and concave.
Alternatively, a concave can be set on the base 30 and a convex can
be set on the relative position on of the frame 46 to make the base
30 and the frame 46 combine tightly. In addition, a metallic layer
(not shown in the figure) can be set between the base 30 and the
optical sensor 38 to increase the convenience of combination and
the heat dissipation. Moreover, the light-pervious lid can further
have the property of filtering certain wavelengths of light like
infrared ray.
[0020] Besides being set in the frame area 46, the conductors 36
can also be located in other places. As shown in FIG. 3, the upper
plurality of metallization traces 32 and the under plurality of
metallization traces 34 are set on the upper and under surface of
the base respectively and connect by the conductors 36 of
plated-through via holes which are in the area between the frame 46
and the optical sensor 38. After finishing the electrical
connection through wiring, a protective adhesive layer 52 will be
coated between the frame 46 and the optical sensor 38 and then
cured for sealing the apertures caused by the conductors 36 and
preventing the permeation of mist from the bottom of the base 30
through the apertures. The adhesive layer 52 can be solder mask, UV
glue or heat-cured adhesive. The rest of the structure is the same
as shown in FIG. 2 and therefore won't be described again here.
[0021] While above-mentioned embodiments all adhere the frame 46 on
the base 30, the present invention can also adopt a form-in-place
base and frame. Please refer to FIG. 4 which is the package
structure for an optical sensor comprising a form-in-place
enclosing base 54 which already has a frame to form a containing
capacity. The enclosing base 54 can be a form-in-place ceramic base
or molding base. The upper plurality of metallization traces 32 and
the under plurality of metallization traces 34 are set on the upper
and under surface of the form-in-place 54 respectively and several
conductors 36 passing through the enclosing base are used to
connect them. A optical sensor 38 is set in the containing capacity
of the enclosing base 54 through a first adhesive layer 40 and
electrically connects to the plurality of metallization traces 32.
A second adhesive layer 48 is used to cover the frame of the
enclosing base 54 with a light-pervious lid 50 and surely the under
plurality of metallization traces 34 can extend to the external
part of the enclosing base 54.
[0022] By adopting said package structure, one can avoid the
impurities like residue glue caused during the manufacturing
process and improve the yield and quality thereof efficiently. The
present invention can further increase the reliability of package
structure and avoid the problem caused by the permeation of mist
into the optical sensor through the first adhesive layer.
[0023] While the present invention has been described with
reference to the illustrative embodiment, this description is not
intended to be construed in a limited sense. Various modifications
of the illustrative embodiment of the invention will be apparent to
those skilled in the art and fall within the scope of the
invention.
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